JP2004047955A - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP2004047955A
JP2004047955A JP2003118752A JP2003118752A JP2004047955A JP 2004047955 A JP2004047955 A JP 2004047955A JP 2003118752 A JP2003118752 A JP 2003118752A JP 2003118752 A JP2003118752 A JP 2003118752A JP 2004047955 A JP2004047955 A JP 2004047955A
Authority
JP
Japan
Prior art keywords
chip
die pad
semiconductor device
electronic component
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003118752A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004047955A5 (enExample
Inventor
Takashi Kunimatsu
崇 國松
Minoru Fukui
穣 福井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2003118752A priority Critical patent/JP2004047955A/ja
Publication of JP2004047955A publication Critical patent/JP2004047955A/ja
Publication of JP2004047955A5 publication Critical patent/JP2004047955A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2003118752A 2002-05-22 2003-04-23 半導体装置 Withdrawn JP2004047955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003118752A JP2004047955A (ja) 2002-05-22 2003-04-23 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002147416 2002-05-22
JP2003118752A JP2004047955A (ja) 2002-05-22 2003-04-23 半導体装置

Publications (2)

Publication Number Publication Date
JP2004047955A true JP2004047955A (ja) 2004-02-12
JP2004047955A5 JP2004047955A5 (enExample) 2006-06-08

Family

ID=31719621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003118752A Withdrawn JP2004047955A (ja) 2002-05-22 2003-04-23 半導体装置

Country Status (1)

Country Link
JP (1) JP2004047955A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111154A (ja) * 2007-10-30 2009-05-21 Mitsubishi Electric Corp 電力半導体モジュール
JP2010258289A (ja) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2012248736A (ja) * 2011-05-30 2012-12-13 Sanken Electric Co Ltd 半導体装置
KR20190024840A (ko) * 2017-08-31 2019-03-08 익시스, 엘엘씨 Pfc에의 적용을 위한 패키징된 고속 역 다이오드 성분
JP2022143166A (ja) * 2021-03-17 2022-10-03 ローム株式会社 半導体装置
WO2023176332A1 (ja) * 2022-03-17 2023-09-21 ローム株式会社 電子装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111154A (ja) * 2007-10-30 2009-05-21 Mitsubishi Electric Corp 電力半導体モジュール
JP2010258289A (ja) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2012248736A (ja) * 2011-05-30 2012-12-13 Sanken Electric Co Ltd 半導体装置
KR20190024840A (ko) * 2017-08-31 2019-03-08 익시스, 엘엘씨 Pfc에의 적용을 위한 패키징된 고속 역 다이오드 성분
JP2019075548A (ja) * 2017-08-31 2019-05-16 イクシス・リミテッド・ライアビリティ・カンパニーＩｘｙｓ， Ｌｌｃ Ｐｆｃ用途のためのパッケージされたファストインバースダイオード部品
KR102512166B1 (ko) * 2017-08-31 2023-03-21 익시스, 엘엘씨 Pfc에의 적용을 위한 패키징된 고속 역 다이오드 성분
JP2022143166A (ja) * 2021-03-17 2022-10-03 ローム株式会社 半導体装置
WO2023176332A1 (ja) * 2022-03-17 2023-09-21 ローム株式会社 電子装置

Similar Documents

Publication Publication Date Title
US6650006B2 (en) Semiconductor package with stacked chips
US6472743B2 (en) Semiconductor package with heat dissipating structure
USRE42653E1 (en) Semiconductor package with heat dissipating structure
JP3526788B2 (ja) 半導体装置の製造方法
KR20020062820A (ko) 적층된 다수개의 칩모듈 구조를 가진 반도체장치
JP2001210743A (ja) 半導体装置及びその製造方法
CN101073152A (zh) 具有下置引脚的电子封装和方法
JP2005064479A (ja) 回路モジュール
US20060113679A1 (en) Semiconductor device
US7173341B2 (en) High performance thermally enhanced package and method of fabricating the same
US7145223B2 (en) Semiconductor device
JP2004047955A (ja) 半導体装置
US6876067B2 (en) Semiconductor device
JP2801810B2 (ja) 樹脂封止型半導体装置
JP3183064B2 (ja) 半導体装置
JP4207791B2 (ja) 半導体装置
JPH09330994A (ja) 半導体装置
JP2008085002A (ja) 半導体装置およびその製造方法
KR100260996B1 (ko) 리드프레임을 이용한 어레이형 반도체패키지 및 그 제조 방법
JP3670636B2 (ja) 電子部品を実装した電子装置
KR100226106B1 (ko) 리드프레임을 이용한 볼그리드어레이반도체패키지 및 그 제조방법
JPH09107047A (ja) 半導体装置およびその製造方法ならびに電子装置
KR19990056764A (ko) 볼 그리드 어레이 패키지
JPH08181168A (ja) 半導体装置
JP3221072B2 (ja) 樹脂封止型半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060419

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060419

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061002

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20061025