JP2004031885A5 - - Google Patents
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- Publication number
- JP2004031885A5 JP2004031885A5 JP2002292580A JP2002292580A JP2004031885A5 JP 2004031885 A5 JP2004031885 A5 JP 2004031885A5 JP 2002292580 A JP2002292580 A JP 2002292580A JP 2002292580 A JP2002292580 A JP 2002292580A JP 2004031885 A5 JP2004031885 A5 JP 2004031885A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mounting member
- resin
- heating
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 30
- 239000000758 substrate Substances 0.000 claims 30
- 239000011347 resin Substances 0.000 claims 26
- 229920005989 resin Polymers 0.000 claims 26
- 238000001816 cooling Methods 0.000 claims 17
- 238000000034 method Methods 0.000 claims 11
- 239000011521 glass Substances 0.000 claims 9
- 238000007664 blowing Methods 0.000 claims 2
- 239000000498 cooling water Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002292580A JP4014481B2 (ja) | 2002-04-30 | 2002-10-04 | ボンディング方法およびその装置 |
CNB038098040A CN100375256C (zh) | 2002-04-30 | 2003-04-28 | 粘附方法及其装置 |
KR1020047016361A KR100978697B1 (ko) | 2002-04-30 | 2003-04-28 | 본딩방법 및 그 장치 |
PCT/JP2003/005491 WO2003094222A1 (fr) | 2002-04-30 | 2003-04-28 | Procede de collage et dispositif de collage |
TW92110035A TWI237335B (en) | 2002-04-30 | 2003-04-29 | Bonding method and apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002128468 | 2002-04-30 | ||
JP2002292580A JP4014481B2 (ja) | 2002-04-30 | 2002-10-04 | ボンディング方法およびその装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004031885A JP2004031885A (ja) | 2004-01-29 |
JP2004031885A5 true JP2004031885A5 (zh) | 2005-06-02 |
JP4014481B2 JP4014481B2 (ja) | 2007-11-28 |
Family
ID=29405300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002292580A Expired - Fee Related JP4014481B2 (ja) | 2002-04-30 | 2002-10-04 | ボンディング方法およびその装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4014481B2 (zh) |
KR (1) | KR100978697B1 (zh) |
CN (1) | CN100375256C (zh) |
TW (1) | TWI237335B (zh) |
WO (1) | WO2003094222A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347303A (ja) * | 2004-05-31 | 2005-12-15 | Canon Inc | 熱圧着装置 |
JP4687273B2 (ja) * | 2005-06-23 | 2011-05-25 | 住友電気工業株式会社 | 電子部品の実装方法 |
JP4628234B2 (ja) * | 2005-09-30 | 2011-02-09 | オプトレックス株式会社 | 圧着装置および圧着方法 |
KR100825799B1 (ko) * | 2007-01-03 | 2008-04-29 | 삼성전자주식회사 | 다이 접착 공정의 보이드 형성을 억제하는 반도체 칩 및이를 포함하는 반도체 패키지 |
JP4340703B2 (ja) * | 2007-11-01 | 2009-10-07 | シャープ株式会社 | 半導体実装装置および半導体実装方法 |
KR20090066593A (ko) * | 2007-12-20 | 2009-06-24 | 삼성전자주식회사 | 플립칩 본딩장치 및 플립칩 본딩방법 |
KR101119541B1 (ko) * | 2009-11-30 | 2012-02-22 | (주)멜파스 | Acf본딩을 위한 압착 장치 및 상기 압착 장치의 동작 방법 |
JP5496141B2 (ja) * | 2011-03-30 | 2014-05-21 | 富士フイルム株式会社 | 電子部品の製造方法 |
KR101331590B1 (ko) * | 2011-04-06 | 2013-11-20 | 주식회사 휴템 | 전자기파 가열을 이용한 웨이퍼 본더 |
CN102520221B (zh) * | 2011-12-21 | 2014-02-19 | 中微光电子(潍坊)有限公司 | 一种电致发光测试电极的制作方法 |
TWI501828B (zh) * | 2012-03-13 | 2015-10-01 | 晶片壓合裝置及方法 | |
CH707480B1 (de) * | 2013-01-21 | 2016-08-31 | Besi Switzerland Ag | Bondkopf mit einem heiz- und kühlbaren Saugorgan. |
US9093549B2 (en) * | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
US9659902B2 (en) * | 2014-02-28 | 2017-05-23 | Kulicke And Soffa Industries, Inc. | Thermocompression bonding systems and methods of operating the same |
KR102158822B1 (ko) * | 2014-06-10 | 2020-09-22 | 세메스 주식회사 | 본딩 헤드 및 이를 포함하는 다이 본딩 장치 |
KR102295986B1 (ko) | 2014-12-01 | 2021-08-31 | 삼성디스플레이 주식회사 | 칩 본딩 장치 및 칩 본딩 방법 |
WO2016125763A1 (ja) * | 2015-02-03 | 2016-08-11 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
KR102497661B1 (ko) * | 2015-02-03 | 2023-02-07 | 토레이 엔지니어링 컴퍼니, 리미티드 | 실장 장치 및 실장 방법 |
EP3382744A1 (de) | 2016-02-16 | 2018-10-03 | EV Group E. Thallner GmbH | Vorrichtung zum bonden von substraten |
TWI607884B (zh) * | 2016-06-04 | 2017-12-11 | Usun Technology Co Ltd | Pressing method of thin film display and flexible circuit board and pressing device thereof |
KR102439617B1 (ko) * | 2017-06-27 | 2022-09-05 | 주식회사 미코세라믹스 | 본딩 헤드 및 이를 갖는 본딩 장치 |
CN109429438B (zh) * | 2017-08-25 | 2020-08-14 | 阳程科技股份有限公司 | 薄膜显示器与软性电路板的压合方法及其压合装置 |
CN108822749B (zh) * | 2018-08-20 | 2023-10-20 | 江苏省特种设备安全监督检验研究院 | 一种环氧树脂加热加压装置 |
KR101959215B1 (ko) * | 2018-11-16 | 2019-03-19 | (주)제이스텍 | 디스플레이 패널 또는 터치패널의 저추력 본딩장치 |
CN110491802B (zh) * | 2019-07-16 | 2022-03-01 | 盐城瑾诚科技有限公司 | 用于集成电路封装过程中的散热设备 |
KR102604789B1 (ko) * | 2020-11-30 | 2023-11-21 | 세메스 주식회사 | 히터 조립체 및 이를 포함하는 본딩 헤드 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1187429A (ja) * | 1997-05-09 | 1999-03-30 | Citizen Watch Co Ltd | 半導体チップの実装方法 |
US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
JPH11186300A (ja) * | 1997-12-19 | 1999-07-09 | Sony Corp | 半導体装置の封止方法 |
JP3937270B2 (ja) * | 1998-08-31 | 2007-06-27 | 日立化成工業株式会社 | 半導体装置の製造方法 |
JP3376968B2 (ja) * | 1999-08-30 | 2003-02-17 | ソニーケミカル株式会社 | 実装方法 |
JP3815149B2 (ja) * | 1999-11-04 | 2006-08-30 | セイコーエプソン株式会社 | 部品実装方法および電気光学装置の製造方法 |
JP2002057186A (ja) * | 2000-05-31 | 2002-02-22 | Nippon Avionics Co Ltd | フリップチップ実装方法およびプリント配線板 |
JP3646056B2 (ja) * | 2000-11-06 | 2005-05-11 | 日本アビオニクス株式会社 | フリップチップ実装方法 |
JP4626839B2 (ja) * | 2001-05-21 | 2011-02-09 | 日本電気株式会社 | 半導体装置の実装方法 |
-
2002
- 2002-10-04 JP JP2002292580A patent/JP4014481B2/ja not_active Expired - Fee Related
-
2003
- 2003-04-28 WO PCT/JP2003/005491 patent/WO2003094222A1/ja active Application Filing
- 2003-04-28 CN CNB038098040A patent/CN100375256C/zh not_active Expired - Fee Related
- 2003-04-28 KR KR1020047016361A patent/KR100978697B1/ko not_active IP Right Cessation
- 2003-04-29 TW TW92110035A patent/TWI237335B/zh not_active IP Right Cessation
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