JP2004010877A5 - - Google Patents

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Publication number
JP2004010877A5
JP2004010877A5 JP2002170779A JP2002170779A JP2004010877A5 JP 2004010877 A5 JP2004010877 A5 JP 2004010877A5 JP 2002170779 A JP2002170779 A JP 2002170779A JP 2002170779 A JP2002170779 A JP 2002170779A JP 2004010877 A5 JP2004010877 A5 JP 2004010877A5
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JP
Japan
Prior art keywords
compound
compound represented
mol
alcohol
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002170779A
Other languages
English (en)
Japanese (ja)
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JP2004010877A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002170779A priority Critical patent/JP2004010877A/ja
Priority claimed from JP2002170779A external-priority patent/JP2004010877A/ja
Publication of JP2004010877A publication Critical patent/JP2004010877A/ja
Publication of JP2004010877A5 publication Critical patent/JP2004010877A5/ja
Pending legal-status Critical Current

Links

JP2002170779A 2002-06-12 2002-06-12 結晶性エポキシ樹脂、及びその製法 Pending JP2004010877A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002170779A JP2004010877A (ja) 2002-06-12 2002-06-12 結晶性エポキシ樹脂、及びその製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002170779A JP2004010877A (ja) 2002-06-12 2002-06-12 結晶性エポキシ樹脂、及びその製法

Publications (2)

Publication Number Publication Date
JP2004010877A JP2004010877A (ja) 2004-01-15
JP2004010877A5 true JP2004010877A5 (cg-RX-API-DMAC10.html) 2005-10-13

Family

ID=30436911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002170779A Pending JP2004010877A (ja) 2002-06-12 2002-06-12 結晶性エポキシ樹脂、及びその製法

Country Status (1)

Country Link
JP (1) JP2004010877A (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI346111B (en) * 2004-02-09 2011-08-01 Nippon Kayaku Kk Photosensitive resin composition and products of cured product thereof
JP2005298614A (ja) * 2004-04-09 2005-10-27 Nippon Kayaku Co Ltd 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2005330475A (ja) * 2004-04-20 2005-12-02 Nippon Kayaku Co Ltd 結晶性エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
CA2570409A1 (en) * 2004-06-25 2006-01-05 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy resin composition and cured product thereof
JP2006213823A (ja) * 2005-02-03 2006-08-17 Nippon Kayaku Co Ltd 耐熱性エポキシ樹脂組成物
JP4915895B2 (ja) * 2005-07-07 2012-04-11 日本化薬株式会社 エポキシ樹脂の製造法
JP4915896B2 (ja) * 2005-07-07 2012-04-11 日本化薬株式会社 エポキシ樹脂の製造法
JP7653672B2 (ja) * 2020-12-07 2025-03-31 パナソニックＩｐマネジメント株式会社 チップ抵抗器

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