JP2003531495A - 成形バネ及びその製造及び使用方法 - Google Patents

成形バネ及びその製造及び使用方法

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Publication number
JP2003531495A
JP2003531495A JP2001577609A JP2001577609A JP2003531495A JP 2003531495 A JP2003531495 A JP 2003531495A JP 2001577609 A JP2001577609 A JP 2001577609A JP 2001577609 A JP2001577609 A JP 2001577609A JP 2003531495 A JP2003531495 A JP 2003531495A
Authority
JP
Japan
Prior art keywords
substrate
element material
interconnection
contact
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001577609A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003531495A5 (fr
Inventor
マシュー，ガエタン，エル．
エルドリッジ，ベンジャミン，エヌ．
ウェンゼル，スチュアート，ダブリュ．
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/547,560 external-priority patent/US6640432B1/en
Priority claimed from US09/547,561 external-priority patent/US7458816B1/en
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2003531495A publication Critical patent/JP2003531495A/ja
Publication of JP2003531495A5 publication Critical patent/JP2003531495A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
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    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
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    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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    • H01L2924/156—Material
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connecting Device With Holders (AREA)
  • Battery Mounting, Suspending (AREA)
JP2001577609A 2000-04-12 2001-03-28 成形バネ及びその製造及び使用方法 Pending JP2003531495A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/547,560 2000-04-12
US09/547,560 US6640432B1 (en) 2000-04-12 2000-04-12 Method of fabricating shaped springs
US09/547,561 2000-04-12
US09/547,561 US7458816B1 (en) 2000-04-12 2000-04-12 Shaped spring
PCT/US2001/009994 WO2001080315A2 (fr) 2000-04-12 2001-03-28 Ressorts faconnes et leurs procedes de fabrication et d'utilisation

Publications (2)

Publication Number Publication Date
JP2003531495A true JP2003531495A (ja) 2003-10-21
JP2003531495A5 JP2003531495A5 (fr) 2008-05-22

Family

ID=27068579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001577609A Pending JP2003531495A (ja) 2000-04-12 2001-03-28 成形バネ及びその製造及び使用方法

Country Status (7)

Country Link
EP (1) EP1275150A2 (fr)
JP (1) JP2003531495A (fr)
KR (2) KR100835027B1 (fr)
CN (1) CN100339985C (fr)
AU (1) AU2001249567A1 (fr)
TW (1) TW546803B (fr)
WO (1) WO2001080315A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012505964A (ja) * 2008-10-17 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 接合可能なウェハ表面のための応力が低減されたＮｉ−Ｐ／Ｐｄ積層
JP2012069952A (ja) * 2010-09-22 2012-04-05 Palo Alto Research Center Inc マイクロスプリング接点を有するインターポーザ、ならびにインターポーザを製作する方法および使用する方法
KR102114210B1 (ko) * 2018-12-17 2020-05-25 주식회사 코리아 인스트루먼트 프로브 빔 및 프로브 모듈

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Publication number Priority date Publication date Assignee Title
KR20020026585A (ko) * 2000-06-20 2002-04-10 나노넥서스, 인코포레이티드 집적회로를 테스트하고 패키지하기 위한 시스템
KR100941360B1 (ko) * 2006-07-21 2010-02-11 가부시키가이샤후지쿠라 집적 회로 소켓, 집적 회로 소켓 조립체, 및 집적 회로 소켓의 제조 방법
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
TWI449280B (zh) * 2011-01-17 2014-08-11 Hon Hai Prec Ind Co Ltd 測試連接器
KR101738421B1 (ko) 2015-11-10 2017-05-23 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102042052B1 (ko) * 2017-03-23 2019-11-08 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
CN114108041A (zh) * 2021-12-20 2022-03-01 太仓市惠得利弹簧有限公司 一种弹簧表面抗氧化处理工艺

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Publication number Priority date Publication date Assignee Title
JPS61136437U (fr) * 1985-02-15 1986-08-25
JPH06181301A (ja) * 1992-12-14 1994-06-28 Fujitsu Ltd 固体撮像素子
JPH09213183A (ja) * 1996-02-05 1997-08-15 Eiko Takahashi 小型サーモスタット

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EP1275150A2 (fr) 2003-01-15
AU2001249567A1 (en) 2001-10-30
KR20020090234A (ko) 2002-11-30
TW546803B (en) 2003-08-11
KR20070093456A (ko) 2007-09-18
WO2001080315A2 (fr) 2001-10-25
CN1451179A (zh) 2003-10-22
KR100835027B1 (ko) 2008-06-03
KR100801353B1 (ko) 2008-02-05
WO2001080315A3 (fr) 2002-03-28

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