WO2001080315A3 - Ressorts faconnes et leurs procedes de fabrication et d'utilisation - Google Patents

Ressorts faconnes et leurs procedes de fabrication et d'utilisation Download PDF

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Publication number
WO2001080315A3
WO2001080315A3 PCT/US2001/009994 US0109994W WO0180315A3 WO 2001080315 A3 WO2001080315 A3 WO 2001080315A3 US 0109994 W US0109994 W US 0109994W WO 0180315 A3 WO0180315 A3 WO 0180315A3
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WO
WIPO (PCT)
Prior art keywords
shaped springs
fabricating
methods
volume
interconnection
Prior art date
Application number
PCT/US2001/009994
Other languages
English (en)
Other versions
WO2001080315A2 (fr
Inventor
Gaetan L Mathieu
Benjamin N Eldridge
Stuart W Wenzel
Original Assignee
Formfactor Inc
Gaetan L Mathieu
Benjamin N Eldridge
Stuart W Wenzel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/547,560 external-priority patent/US6640432B1/en
Priority claimed from US09/547,561 external-priority patent/US7458816B1/en
Application filed by Formfactor Inc, Gaetan L Mathieu, Benjamin N Eldridge, Stuart W Wenzel filed Critical Formfactor Inc
Priority to EP01922806A priority Critical patent/EP1275150A2/fr
Priority to JP2001577609A priority patent/JP2003531495A/ja
Priority to AU2001249567A priority patent/AU2001249567A1/en
Publication of WO2001080315A2 publication Critical patent/WO2001080315A2/fr
Publication of WO2001080315A3 publication Critical patent/WO2001080315A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • G—PHYSICS
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    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
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    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
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    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connecting Device With Holders (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

L'invention concerne un élément d'interconnexion ainsi qu'un procédé de fabrication et d'utilisation d'un élément d'interconnexion comprenant un premier matériau destiné à être couplé à un substrat et un deuxième matériau constitué d'un matériau à propriété transformable, de sorte que lors de la transformation, la forme de l'interconnexion soit modifiée. Par exemple, on peut utiliser un matériau transformable, de manière que le volume des premier et/ou deuxième matériaux puisse subir une transformation thermique et change (par exemple, diminue).
PCT/US2001/009994 2000-04-12 2001-03-28 Ressorts faconnes et leurs procedes de fabrication et d'utilisation WO2001080315A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01922806A EP1275150A2 (fr) 2000-04-12 2001-03-28 Ressorts faconnes et leurs procedes de fabrication et d'utilisation
JP2001577609A JP2003531495A (ja) 2000-04-12 2001-03-28 成形バネ及びその製造及び使用方法
AU2001249567A AU2001249567A1 (en) 2000-04-12 2001-03-28 Shaped springs and methods of fabricating and using shaped springs

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/547,560 2000-04-12
US09/547,560 US6640432B1 (en) 2000-04-12 2000-04-12 Method of fabricating shaped springs
US09/547,561 2000-04-12
US09/547,561 US7458816B1 (en) 2000-04-12 2000-04-12 Shaped spring

Publications (2)

Publication Number Publication Date
WO2001080315A2 WO2001080315A2 (fr) 2001-10-25
WO2001080315A3 true WO2001080315A3 (fr) 2002-03-28

Family

ID=27068579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/009994 WO2001080315A2 (fr) 2000-04-12 2001-03-28 Ressorts faconnes et leurs procedes de fabrication et d'utilisation

Country Status (7)

Country Link
EP (1) EP1275150A2 (fr)
JP (1) JP2003531495A (fr)
KR (2) KR100835027B1 (fr)
CN (1) CN100339985C (fr)
AU (1) AU2001249567A1 (fr)
TW (1) TW546803B (fr)
WO (1) WO2001080315A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020026585A (ko) * 2000-06-20 2002-04-10 나노넥서스, 인코포레이티드 집적회로를 테스트하고 패키지하기 위한 시스템
KR100941360B1 (ko) * 2006-07-21 2010-02-11 가부시키가이샤후지쿠라 집적 회로 소켓, 집적 회로 소켓 조립체, 및 집적 회로 소켓의 제조 방법
ATE503037T1 (de) * 2008-10-17 2011-04-15 Atotech Deutschland Gmbh Spannungsreduzierte ni-p/pd-stapel für waferoberfläche
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
TWI449280B (zh) * 2011-01-17 2014-08-11 Hon Hai Prec Ind Co Ltd 測試連接器
KR101738421B1 (ko) 2015-11-10 2017-05-23 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102042052B1 (ko) * 2017-03-23 2019-11-08 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102114210B1 (ko) * 2018-12-17 2020-05-25 주식회사 코리아 인스트루먼트 프로브 빔 및 프로브 모듈
CN114108041A (zh) * 2021-12-20 2022-03-01 太仓市惠得利弹簧有限公司 一种弹簧表面抗氧化处理工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3604021A1 (de) * 1985-02-15 1986-08-21 Uchiya Thermostat Co., Misato, Saitama Thermostat
US5307311A (en) * 1990-11-02 1994-04-26 Sliwa Jr John W Microvibratory memory device
JPH09213183A (ja) * 1996-02-05 1997-08-15 Eiko Takahashi 小型サーモスタット
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EP1275150A2 (fr) 2003-01-15
AU2001249567A1 (en) 2001-10-30
JP2003531495A (ja) 2003-10-21
KR20020090234A (ko) 2002-11-30
TW546803B (en) 2003-08-11
KR20070093456A (ko) 2007-09-18
WO2001080315A2 (fr) 2001-10-25
CN1451179A (zh) 2003-10-22
KR100835027B1 (ko) 2008-06-03
KR100801353B1 (ko) 2008-02-05

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