JP2003506833A - コンプライアンスを制御したファインピッチ配線 - Google Patents
コンプライアンスを制御したファインピッチ配線Info
- Publication number
- JP2003506833A JP2003506833A JP2001514505A JP2001514505A JP2003506833A JP 2003506833 A JP2003506833 A JP 2003506833A JP 2001514505 A JP2001514505 A JP 2001514505A JP 2001514505 A JP2001514505 A JP 2001514505A JP 2003506833 A JP2003506833 A JP 2003506833A
- Authority
- JP
- Japan
- Prior art keywords
- electrical
- flexible circuit
- circuit member
- electrical contact
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14682599P | 1999-08-02 | 1999-08-02 | |
| US60/146,825 | 1999-08-02 | ||
| PCT/US2000/020748 WO2001009980A2 (en) | 1999-08-02 | 2000-07-31 | Controlled compliance fine pitch interconnect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003506833A true JP2003506833A (ja) | 2003-02-18 |
| JP2003506833A5 JP2003506833A5 (https=) | 2007-06-14 |
Family
ID=22519150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001514505A Pending JP2003506833A (ja) | 1999-08-02 | 2000-07-31 | コンプライアンスを制御したファインピッチ配線 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1204988A2 (https=) |
| JP (1) | JP2003506833A (https=) |
| AU (1) | AU6750900A (https=) |
| WO (1) | WO2001009980A2 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032667A (ja) * | 2006-08-01 | 2008-02-14 | Nidec-Read Corp | 基板検査用治具及び基板検査用治具の電極部構造 |
| JP2010145381A (ja) * | 2008-12-22 | 2010-07-01 | Nippon Mektron Ltd | 基板検査装置及び検査治具の製造方法 |
| JP2013002976A (ja) * | 2011-06-17 | 2013-01-07 | Hioki Ee Corp | プローブユニット、回路基板検査装置およびプローブユニット製造方法 |
| JP2014038091A (ja) * | 2012-08-10 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | 電気検査用治具の製造方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
| WO2000046885A1 (en) | 1999-02-02 | 2000-08-10 | Gryphics, Inc. | Low or zero insertion force connector for printed circuit boards and electrical devices |
| US6830460B1 (en) | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
| US6957963B2 (en) | 2000-01-20 | 2005-10-25 | Gryphics, Inc. | Compliant interconnect assembly |
| US6939143B2 (en) | 2000-01-20 | 2005-09-06 | Gryphics, Inc. | Flexible compliant interconnect assembly |
| JP2003315361A (ja) * | 2002-04-26 | 2003-11-06 | Japan Electronic Materials Corp | プローブの製造方法、このプローブの製造用マスク及びプローブ |
| EP1642364A1 (en) | 2003-07-07 | 2006-04-05 | Gryphics, Inc. | Normally closed zero insertion force connector |
| DE102004027886A1 (de) * | 2004-05-28 | 2005-12-22 | Feinmetall Gmbh | Prüfeinrichtung zur elektrischen Prüfung eines Prüflings sowie Verfahren zur Herstellung einer Prüfeinrichtung |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4118090A (en) * | 1977-05-23 | 1978-10-03 | Luigi Giovanni Del Mei | Electrical contact devices |
| JPS61118977A (ja) * | 1984-11-13 | 1986-06-06 | シチズン時計株式会社 | 多電極コネクタ−構造 |
| JPH07161400A (ja) * | 1993-11-10 | 1995-06-23 | Whitaker Corp:The | 異方性導電膜、その製造方法及びそれを使用するコネ クタ |
| JPH07169542A (ja) * | 1993-12-17 | 1995-07-04 | Yamaichi Electron Co Ltd | Icソケット |
| JPH0973934A (ja) * | 1995-09-01 | 1997-03-18 | Whitaker Corp:The | コネクタ |
| JPH09115577A (ja) * | 1995-10-06 | 1997-05-02 | Whitaker Corp:The | コネクタ及びコネクタ製造方法 |
| JP2000311731A (ja) * | 1999-04-28 | 2000-11-07 | Shin Etsu Polymer Co Ltd | 電気コネクタ |
| JP2001503512A (ja) * | 1996-09-26 | 2001-03-13 | デラウェア キャピタル フォーメーション,インコーポレイティド | グリッドアレイパッケージ試験接触機 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4859189A (en) * | 1987-09-25 | 1989-08-22 | Minnesota Mining And Manufacturing Company | Multipurpose socket |
| KR100196195B1 (ko) * | 1991-11-18 | 1999-06-15 | 이노우에 쥰이치 | 프로우브 카드 |
| US5252916A (en) * | 1992-01-27 | 1993-10-12 | Everett Charles Technologies, Inc. | Pneumatic test fixture with springless test probes |
| US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
| JP2532331B2 (ja) * | 1992-11-09 | 1996-09-11 | 日本発条株式会社 | 導電性接触子 |
| US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
| JP2710544B2 (ja) * | 1993-09-30 | 1998-02-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | プローブ構造、プローブ構造の形成方法 |
| US5637539A (en) * | 1996-01-16 | 1997-06-10 | Cornell Research Foundation, Inc. | Vacuum microelectronic devices with multiple planar electrodes |
-
2000
- 2000-07-31 EP EP00955283A patent/EP1204988A2/en not_active Withdrawn
- 2000-07-31 WO PCT/US2000/020748 patent/WO2001009980A2/en not_active Ceased
- 2000-07-31 AU AU67509/00A patent/AU6750900A/en not_active Abandoned
- 2000-07-31 JP JP2001514505A patent/JP2003506833A/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4118090A (en) * | 1977-05-23 | 1978-10-03 | Luigi Giovanni Del Mei | Electrical contact devices |
| JPS61118977A (ja) * | 1984-11-13 | 1986-06-06 | シチズン時計株式会社 | 多電極コネクタ−構造 |
| JPH07161400A (ja) * | 1993-11-10 | 1995-06-23 | Whitaker Corp:The | 異方性導電膜、その製造方法及びそれを使用するコネ クタ |
| JPH07169542A (ja) * | 1993-12-17 | 1995-07-04 | Yamaichi Electron Co Ltd | Icソケット |
| JPH0973934A (ja) * | 1995-09-01 | 1997-03-18 | Whitaker Corp:The | コネクタ |
| JPH09115577A (ja) * | 1995-10-06 | 1997-05-02 | Whitaker Corp:The | コネクタ及びコネクタ製造方法 |
| JP2001503512A (ja) * | 1996-09-26 | 2001-03-13 | デラウェア キャピタル フォーメーション,インコーポレイティド | グリッドアレイパッケージ試験接触機 |
| JP2000311731A (ja) * | 1999-04-28 | 2000-11-07 | Shin Etsu Polymer Co Ltd | 電気コネクタ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032667A (ja) * | 2006-08-01 | 2008-02-14 | Nidec-Read Corp | 基板検査用治具及び基板検査用治具の電極部構造 |
| JP2010145381A (ja) * | 2008-12-22 | 2010-07-01 | Nippon Mektron Ltd | 基板検査装置及び検査治具の製造方法 |
| JP2013002976A (ja) * | 2011-06-17 | 2013-01-07 | Hioki Ee Corp | プローブユニット、回路基板検査装置およびプローブユニット製造方法 |
| JP2014038091A (ja) * | 2012-08-10 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | 電気検査用治具の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1204988A2 (en) | 2002-05-15 |
| WO2001009980A3 (en) | 2001-08-30 |
| WO2001009980A2 (en) | 2001-02-08 |
| AU6750900A (en) | 2001-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7160119B2 (en) | Controlled compliance fine pitch electrical interconnect | |
| US5838160A (en) | Integral rigid chip test probe | |
| US7900347B2 (en) | Method of making a compliant interconnect assembly | |
| EP0925509B1 (en) | Probe structure having a plurality of discrete insulated probe tips | |
| US6329827B1 (en) | High density cantilevered probe for electronic devices | |
| US6939143B2 (en) | Flexible compliant interconnect assembly | |
| US6722032B2 (en) | Method of forming a structure for electronic devices contact locations | |
| US8754666B2 (en) | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof | |
| US6392429B1 (en) | Temporary semiconductor package having dense array external contacts | |
| US5914614A (en) | High density cantilevered probe for electronic devices | |
| US5811982A (en) | High density cantilevered probe for electronic devices | |
| US6483328B1 (en) | Probe card for probing wafers with raised contact elements | |
| US6104201A (en) | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage | |
| US20080088332A1 (en) | High density cantilevered probe for electronic devices | |
| JPH0619371B2 (ja) | 電気コネクタ | |
| KR100337588B1 (ko) | 반도체 검사장치 및 이를 사용한 검사방법 | |
| KR20010070133A (ko) | 실리콘 핑거 콘택터를 구비한 콘택트 구조물과 이를이용한 토탈 스택-업 구조물 | |
| WO1998014998A1 (en) | Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication | |
| WO1998014998A9 (en) | Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication | |
| JP2001524256A (ja) | マルチモードコンプライアンスのコネクタと当該コネクタを用いる取り替え可能なチップモジュール | |
| JP2003506833A (ja) | コンプライアンスを制御したファインピッチ配線 | |
| US5568057A (en) | Method for performing a burn-in test | |
| US20040124507A1 (en) | Contact structure and production method thereof | |
| US6433565B1 (en) | Test fixture for flip chip ball grid array circuits | |
| JP2979289B2 (ja) | 高密度アレイ外部コンタクトを有する半導体試験用パッケージ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070425 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070425 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090901 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20091130 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20091207 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20091228 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100108 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100129 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100205 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100713 |