JP2003500843A5 - - Google Patents

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Publication number
JP2003500843A5
JP2003500843A5 JP2000619588A JP2000619588A JP2003500843A5 JP 2003500843 A5 JP2003500843 A5 JP 2003500843A5 JP 2000619588 A JP2000619588 A JP 2000619588A JP 2000619588 A JP2000619588 A JP 2000619588A JP 2003500843 A5 JP2003500843 A5 JP 2003500843A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000619588A
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Japanese (ja)
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JP2003500843A (ja
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Publication date
Priority claimed from US09/316,166 external-priority patent/US6261168B1/en
Application filed filed Critical
Publication of JP2003500843A publication Critical patent/JP2003500843A/ja
Publication of JP2003500843A5 publication Critical patent/JP2003500843A5/ja
Pending legal-status Critical Current

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JP2000619588A 1999-05-21 2000-05-15 異なる溝パターンをもつセクションを備えた化学機械式平坦化すなわち研摩パッド Pending JP2003500843A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/316,166 US6261168B1 (en) 1999-05-21 1999-05-21 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US09/316,166 1999-05-21
PCT/US2000/013328 WO2000071297A1 (en) 1999-05-21 2000-05-15 Chemical mechanical planarization or polishing pad with sections having varied groove patterns

Publications (2)

Publication Number Publication Date
JP2003500843A JP2003500843A (ja) 2003-01-07
JP2003500843A5 true JP2003500843A5 (enExample) 2007-07-05

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ID=23227799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000619588A Pending JP2003500843A (ja) 1999-05-21 2000-05-15 異なる溝パターンをもつセクションを備えた化学機械式平坦化すなわち研摩パッド

Country Status (9)

Country Link
US (3) US6261168B1 (enExample)
EP (2) EP1178872B1 (enExample)
JP (1) JP2003500843A (enExample)
KR (1) KR100706148B1 (enExample)
AT (1) ATE251524T1 (enExample)
DE (1) DE60005816T2 (enExample)
SG (1) SG152899A1 (enExample)
TW (1) TW462906B (enExample)
WO (1) WO2000071297A1 (enExample)

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KR100578133B1 (ko) * 2003-11-04 2006-05-10 삼성전자주식회사 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드
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TWI321503B (en) 2007-06-15 2010-03-11 Univ Nat Taiwan Science Tech The analytical method of the effective polishing frequency and number of times towards the polishing pads having different grooves and profiles
TWI409868B (zh) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd 研磨方法、研磨墊及研磨系統
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CN103109355B (zh) * 2010-09-15 2016-07-06 株式会社Lg化学 用于cmp的研磨垫
CN102615571A (zh) * 2011-01-28 2012-08-01 中芯国际集成电路制造(上海)有限公司 抛光装置及方法
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
KR102717581B1 (ko) * 2016-12-22 2024-10-16 삼성전자주식회사 금속 판, 패턴 형성 장치 및 이를 이용한 패턴 형성 방법
MX2020009155A (es) * 2018-03-14 2020-12-03 Mirka Ltd Método y aparato para erosionar y los productos y usos de éste.
CN113579990B (zh) * 2021-07-30 2022-07-26 上海积塔半导体有限公司 固定研磨粒抛光装置及抛光方法
CN119703981B (zh) * 2025-02-28 2025-04-25 江西祥益鼎盛科技有限公司 一种pcb板磨毛边装置

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