JP2003347522A5 - - Google Patents
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- Publication number
- JP2003347522A5 JP2003347522A5 JP2002151301A JP2002151301A JP2003347522A5 JP 2003347522 A5 JP2003347522 A5 JP 2003347522A5 JP 2002151301 A JP2002151301 A JP 2002151301A JP 2002151301 A JP2002151301 A JP 2002151301A JP 2003347522 A5 JP2003347522 A5 JP 2003347522A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor substrate
- crystal orientation
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 47
- 239000000758 substrate Substances 0.000 claims 31
- 239000013078 crystal Substances 0.000 claims 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002151301A JP2003347522A (ja) | 2002-05-24 | 2002-05-24 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002151301A JP2003347522A (ja) | 2002-05-24 | 2002-05-24 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003347522A JP2003347522A (ja) | 2003-12-05 |
| JP2003347522A5 true JP2003347522A5 (OSRAM) | 2005-09-29 |
Family
ID=29768933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002151301A Pending JP2003347522A (ja) | 2002-05-24 | 2002-05-24 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003347522A (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2856192B1 (fr) * | 2003-06-11 | 2005-07-29 | Soitec Silicon On Insulator | Procede de realisation de structure heterogene et structure obtenue par un tel procede |
| JP2007012897A (ja) * | 2005-06-30 | 2007-01-18 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| JP4648134B2 (ja) * | 2005-09-02 | 2011-03-09 | 大日本印刷株式会社 | Ｓｏｉ基板、荷電粒子線露光用マスクブランクスおよび荷電粒子線露光用マスク |
| JP5107539B2 (ja) * | 2006-08-03 | 2012-12-26 | 新光電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
| JP4888276B2 (ja) * | 2007-08-09 | 2012-02-29 | 三菱電機株式会社 | 半導体ウエハ装置 |
| JP5665599B2 (ja) | 2011-02-24 | 2015-02-04 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
| FR2985369B1 (fr) * | 2011-12-29 | 2014-01-10 | Commissariat Energie Atomique | Procede de fabrication d'une structure multicouche sur un support |
| US9331153B2 (en) * | 2013-12-13 | 2016-05-03 | Raytheon Company | Methods and structures for forming microstrip transmission lines on thin silicon on insulator (SOI) wafers |
| JP6617718B2 (ja) * | 2014-12-10 | 2019-12-11 | 株式会社ニコン | 基板重ね合わせ装置および基板処理方法 |
-
2002
- 2002-05-24 JP JP2002151301A patent/JP2003347522A/ja active Pending
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