JP2003318550A - Laminated wiring board and multilayer wiring assembly, and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated wiring board and a multilayer wiring assembly wherein heat radiation is superior, reliability of soldering of a surface mounted part and reliability of through hole connection are high, and high density mounting can be realized. <P>SOLUTION: A core material 1 uses a carbon aluminum with low thermal expansion and high heat radiation, in which a carbon molded body is impregnated with a melted aluminum, and a first wiring layer 5 is arranged on the core material 1 with a polymer coat 2, a resin 3 for hole filling with high heat resistance and low thermal expansion, and a pre-preg 4 for adhesion interposed, forming the laminated wiring board 10. Two laminated wiring boards 10 with a single-sided wiring layer are prepared, and the first wiring layers 5 are opposite to each other and a double-sided copper-clad laminated board 6 and the pre-preg 4 are alternately arranged between two laminated wiring boards 10, and furthermore, a third wiring layer 9 made of copper foil is arranged as an outer layer of the laminated wiring board 10, resulting in a carbon aluminum multilayer printed wiring board 100 wherein heat radiation is superior, reliability of soldering of a surface mounted part and reliability of through hole connection are high, and high density mounting can be realized. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated wiring board which is excellent in heat dissipation and can be mounted at a high density, a multilayer wiring assembly using the same, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, with the demand for higher functionality and higher speed of electronic equipment, the number of pins in mounted parts has tended to increase.
GA (Ceramic Ball Grid Array), FBGA (Fine pi)
A multilayer wiring board and a multilayer wiring assembly on which mounting components are mounted in a tch ball grid array) play an important role in its performance and connection reliability. Known laminated wiring boards include those having an organic insulating material as a core material, those having an inorganic insulating material such as ceramic as a core material, and a metal core board having a metal material as a core material. The metal core substrate has insulating layers on both sides of the metal core material having a through hole,
Further, since it has a wiring layer on the outer side thereof, it is excellent in heat dissipation and mechanical strength. Aluminum (Al) is widely used as a metal core material because it is lightweight and has excellent mechanical strength and heat dissipation. A conventional metal core substrate has a through hole of a pilot hole larger than the through hole diameter formed in an aluminum core material to provide adhesion with a hole filling resin, so the surface is roughened by a physical method such as buffing. Or, after being subjected to sulfuric acid alumite treatment, prepregs impregnated with resin on a glass woven fabric are laminated on both sides as insulating layers, and a conductor layer such as a copper foil is further laminated on the surface of the prepregs, followed by heat and pressure molding, The resin of the prepreg sheet is embedded and formed by filling the metal holes with the resin and curing the resin. Later,
It is manufactured through the same steps as those for manufacturing a general printed wiring board. The metal core substrate manufactured in this way is compared with a general glass epoxy multilayer printed wiring board,
Since the mechanical strength and elastic modulus of the substrate are extremely high, the dimensional stability is excellent, and it can withstand the mounting of heavy parts. Also,
Since it has a large thermal conductivity of 230w / mk, it has excellent heat dissipation properties and is used when mounting an electronic circuit that generates a large amount of heat.

Further, in order to strengthen the adhesive force between the aluminum core material and the organic insulating layer, for example, Japanese Patent Laid-Open No. 6-15208.
Japanese Patent Publication 9 proposes a metal core substrate structure as shown in FIG. That is, on the metal core material 20 made of aluminum, a nickel layer 21 which is a protective metal plating layer for protecting the metal core material 20, and a blackened copper which is a metal oxide layer for adhesion strengthening. It is a structure in which an epoxy prepreg layer 23 which is an organic insulating layer is formed via a layer 22. In the figure, 24 is a copper wiring layer formed on the epoxy prepreg layer 23, and 25 is a copper wiring layer 24.
A solder layer formed on the copper wiring layer 24 to prevent oxidation of the copper wiring layer 24,
26 is a solder resist layer formed on the epoxy prepreg 23, and 27 is a through hole.

[0004]

However, in the conventional metal core substrate using the aluminum core material, although the coefficient of thermal expansion of aluminum is as large as 24 ppm / ° C., it is made of a silicon semiconductor element or ceramics mounted on the substrate. Electronic circuits have a low coefficient of thermal expansion. In addition, since the metal core substrate has a high elastic modulus, when joining materials having different thermal expansion coefficients, a large thermal stress is applied to the joining surface. For this reason, the printed wiring board reliability test standard MIL (Military Specifica)
thermal shock test (15 cycles at a low temperature of -65 ° C and 15 minutes at a high temperature of 125 ° C for one cycle), the solder joint between the metal core substrate and the surface mount component is performed. There is a problem that stress is generated in a portion and a crack is generated between the pad of the board and the solder or between the mounted component and the solder. For example, the coefficient of thermal expansion is 7
The ppm / ° C CBGA surface mount components were mounted on a metal core board using aluminum as the core material, and as a result of the above thermal shock test, the solder joint reliability was very low at 22 cycles. Is currently almost impossible to implement. Similarly, when mounting plastic surface mount components, in the above thermal shock test, the use of plastic surface mount components is greatly limited because the solder joint reliability decreases significantly as the number of pins increases. It was

Furthermore, the metal core substrate using the aluminum core material has a mismatch of the thermal expansion coefficient and an increase in thermal strain caused by the high elastic modulus, which causes the aluminum and the organic insulating layer, or the aluminum hole. There is a problem in that the aluminum and the filling resin are peeled off from each other in some parts, and the insulation of the substrate is deteriorated. In particular, when the thickness of the metal core material is increased, there is a problem that the through hole and the resin for filling the hole portion are separated or a barrel crack is generated in the through hole portion, and the through hole connection reliability is deteriorated. It is effective to thicken the copper plating in the through hole as a measure to improve the barrel crack in the through hole part, but increasing the copper plating thickness causes problems such as an increase in substrate weight and difficulty in forming fine patterns. . On the other hand, in the case of a substrate using ceramics as the core material, since the thermal expansion coefficient of ceramics is as small as 7ppm / ° C, rapid thermal expansion does not occur, but the ceramics material lacks machinability such as drilling, resulting in substrate manufacturing. At times, there is a problem that the through holes cannot be directly formed, and cracks and fractures occur during machining. Furthermore, ceramics have a problem that the surface is hard and it is difficult to perform an appropriate surface treatment for improving the adhesion with the organic insulating layer.

Further, in the structure disclosed in Japanese Patent Laid-Open No. 6-152089, the tensile strength of nickel is as low as 3%, so that the thermal stress in the solder coat process at the time of manufacturing and the JIS or MIL of the test standard of the printed wiring board. In the solder heat resistance test (JIS: solder 260 ° C. for 20 seconds float test / MIL: solder 288 ° C. for 10 seconds float test), there is a drawback that cracks or peeling occur in the nickel layer due to thermal stress. Further, the metal oxide layer (blackened copper layer) has a drawback that the adhesive strength with the organic insulating layer is reduced due to a sudden heat stress, and peeling occurs partially. Further, for the same reason, even in a metal core substrate using copper as a core material of the metal core substrate, there is a problem that partial peeling occurs between the metal oxide layer and the organic insulating layer due to thermal strain. A composite material substrate made of tungsten, molybdenum and copper having a small coefficient of thermal expansion has also been devised, but this composite material substrate has a problem that it is heavy and difficult to process. As described above, the conventionally proposed substrate materials have drawbacks such as poor workability even if both conditions of thermal conductivity and thermal expansion coefficient are satisfied, and thus they are all poor in practicality.

The present invention has been made in order to solve the above-mentioned problems, and is excellent in heat dissipation, has high solder joint reliability with surface mount components and through hole connection reliability, and has high density packaging. It is an object of the present invention to provide a laminated wiring board capable of performing the above, a multilayer wiring assembly using the same, and a manufacturing method thereof.

[0008]

A laminated wiring board according to the present invention comprises a flat plate-like core material having a pair of main surfaces opposed to each other, which is made of a carbon molding impregnated with molten metal, and both of the core material. An adhesive resin layer provided on the main surface, and a wiring layer provided on at least one of the adhesive resin layers and having a predetermined wiring pattern formed thereon. Also, the core material is
It is made of carbon aluminum in which a carbon compact is impregnated with molten aluminum. Further, a protective layer for preventing carbon powder from scattering from the core material is provided on both main surfaces of the core material. The protective layer is made of epoxy resin. Further, the protective layer is composed of a copper plating layer having a surface subjected to an uneven treatment. Further, the adhesive resin layer is made of an adhesive prepreg having a low thermal expansion. The core material has a through hole for forming a through hole, and a copper plating layer is formed on the inner surface of the through hole with a protective layer and a hole portion filling resin layer interposed therebetween.

Further, the multilayer wiring assembly according to the present invention comprises a flat plate-shaped core material having a pair of main surfaces facing each other, which is made of a carbon molded body impregnated with a molten metal, and each core surface of the core material. At least one laminated wiring having the formed adhesive resin layer and a first wiring layer having a predetermined wiring pattern formed on the adhesive resin layer on both main surface sides or one main surface side of the core material. A multilayer wiring assembly using a substrate, comprising: at least one copper-clad laminate, which is arranged on at least one main surface side of a laminated wiring board and has a second wiring layer of a predetermined wiring pattern formed on one or both surfaces thereof. A second adhesive resin layer provided between the laminated wiring board and the copper-clad laminate or between the copper-clad laminate and forming a through hole penetrating the core material of the laminated wiring board and the copper-clad laminate The first and second wiring layers through the through holes. Is obtained by the gas-connected. Also,
A flat plate-like core material made of a carbon molded body impregnated with molten metal and having a pair of opposing main surfaces, an adhesive resin layer formed on each main surface of the core material, and both main surfaces of the core material. Using at least two laminated wiring boards having a first wiring layer of a predetermined wiring pattern formed on the adhesive resin layer on one surface side or one of the main surface sides, and arranging these laminated wiring boards facing each other A multi-layer wiring assembly, wherein at least one copper-clad laminate having a second wiring layer having a predetermined wiring pattern formed on one surface or both surfaces of the laminated wiring board,
A second bonding resin layer provided between the laminated wiring board and the copper-clad laminate or between the copper-clad laminates, and a through hole penetrating the core material of each laminated wiring board and the copper-clad laminate is formed. Then, the first and second wiring layers are electrically connected via the through holes.

Further, the method for manufacturing a laminated wiring board according to the present invention comprises a flat plate-shaped core material having a pair of main surfaces facing each other, which is made of a carbon molding impregnated with a molten metal, and at least one of the core materials. A method for manufacturing a laminated wiring board in which a wiring layer having a predetermined wiring pattern is formed on a main surface via a protective layer and an adhesive resin layer, wherein a through hole for a through hole is formed in a core material, and a core is formed. The first step of subjecting the material surface to uneven treatment,
Second step of forming a protective layer on both main surfaces of the core material and the inner surface of the through hole, third step of filling the hole filling resin inside the through hole of the core material, on both main surfaces of the core material A fourth step of stacking an adhesive prepreg and a copper foil, which are to be an adhesive resin layer via a protective layer, and heating and pressurizing, and patterning the copper foil on at least one main surface of the core material to form a predetermined wiring pattern It is manufactured by including a fifth step of forming a wiring layer having a.

Further, in the first step, sandblasting is applied as an unevenness treatment. Further, in the second step, the protective layer is formed by electroless copper plating using a palladium catalyst, and the surface of this copper plated layer is subjected to sandblasting as unevenness treatment. Further, in the third step, a high heat resistant / low thermal expansion epoxy prepreg obtained by coating and impregnating a glass cloth containing any one of talc, silica and mica with an epoxy resin as a resin for filling a hole is used to form an epoxy prepreg. The core material is overlaid on both main surfaces and heated and pressed by a vacuum press to fill the inside of the through hole with an epoxy resin.
Further, in the third step, a high thermal conductive / low thermal expansion epoxy resin mixed with alumina or aluminum nitride powder is used as the hole filling resin, and a metal mask having an opening with the same diameter as the through hole is printed. It is mounted on a machine and the inside of the through hole is filled with epoxy resin by screen printing.

Further, the method for manufacturing a multilayer wiring assembly according to the present invention comprises a flat plate-like core material having a first and a second main surface facing each other, which is made of a carbon molding impregnated with molten metal, and the core material. Adhesive resin layers respectively formed on the first and second main surfaces of the core material, and a first wiring layer having a predetermined wiring pattern formed only on the adhesive resin layer on the first main surface side of the core material. A first step of preparing at least one laminated wiring board having
A copper clad laminate having a second wiring layer having a predetermined wiring pattern and a bonding prepreg are alternately laminated on a first wiring layer side of the laminated wiring board, and heat-pressed.
Step, a third step of forming a through hole penetrating the core material of the laminated wiring board and the copper clad laminate, and copper plating the inner surface of the through hole, and adhesion of the second principal surface side of the laminated wiring board. It is manufactured including a fourth step of forming a third wiring layer having a predetermined wiring pattern on the resin layer for use.

Further, a flat plate-like core material made of a carbon compact impregnated with molten metal and having opposing first and second principal surfaces, and a first and a second principal surface of the core material, respectively. At least two laminated wiring boards having the formed adhesive resin layer and the first wiring layer having a predetermined wiring pattern formed only on the adhesive resin layer on the first main surface side of the core material are prepared. A first step of arranging these two laminated wiring boards so that the first wiring layers face each other, and bonding with a copper clad laminated board on which a second wiring layer of a predetermined wiring pattern is formed A predetermined number of prepregs are alternately stacked to form the first of each laminated wiring board.
Second step of arranging between the wiring layers and heating and pressurizing, and third step of forming through holes penetrating the core material of the laminated wiring board and the copper clad laminate and performing copper plating on the inner surface of the through holes. And a fourth step of forming a third wiring layer having a predetermined wiring pattern on the adhesive resin layer on the second main surface side of at least one of the laminated wiring boards.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Embodiments of the present invention will be described below with reference to the drawings. 1 is a cross-sectional view showing a carbon aluminum multilayer printed wiring board which is a multilayer wiring assembly according to Embodiment 1 of the present invention, and FIG. 2 shows a laminated wiring board constituting the carbon aluminum multilayer printed wiring board shown in FIG. It is sectional drawing shown. As shown in FIG. 2, the laminated wiring board 10 according to the present embodiment is
A core material 1 made of carbon aluminum is embedded in the center thereof. Carbon aluminum is a carbon compact impregnated with molten aluminum, and has the characteristics of both carbon and aluminum such as lightweight, low thermal expansion (coefficient of thermal expansion 5-8 ppm / ° C), and high thermal conductivity. Further, the core material 1 has a flat plate shape having a pair of main surfaces 1a and 1b facing each other and a side surface 1c connecting the main surfaces 1a and 1b. Further, the core material 1 is formed with a through hole 1d for a through hole having a diameter larger than that of the through hole. The entire surface of the core material 1, that is, both main surfaces 1a and 1b, the side surface 1c, and the inner surface of the through hole 1d is a protective layer having a thickness of 10
Covered with ˜20 μm polymer coat 2. The polymer coat 2 is made of a masking epoxy resin, and plays a role of strengthening the adhesive force with the hole filling resin 3 and preventing the carbon powder from scattering from the core 1. Carbon graphite is electrically conductive and may scatter to cause deterioration of insulation. Therefore, it is necessary to cover it with the polymer coat 2. Further, the through hole 1d of the core material 1 is filled with the hole filling resin 3, and in the present embodiment, the entire surface of the core material 1 is filled with the hole filling resin 3. In the present embodiment, epoxy resin talc is used as the hole filling resin 3,
A high heat resistant / low thermal expansion epoxy prepreg is used which is obtained by coating and impregnating a glass cloth containing either silica or mica. Further, on the hole filling resin 3, a low thermal expansion adhesive prepreg 4 which is an adhesive resin layer is arranged. Further, at least one main surface of the core material 1, as shown in FIG.
Then, on the main surface 1b, the wiring layer 5 in which the predetermined wiring pattern 5a is formed on the copper foil is arranged through the protective layer 2, the hole filling resin 3 and the bonding prepreg 4, and the single-sided wiring layer is laminated. The wiring board 10 is configured.

Next, the structure of carbon-aluminum multilayer printed wiring board 100 (hereinafter abbreviated as carbon-aluminum multilayer board 100) in the present embodiment will be described with reference to FIG. The carbon aluminum multilayer board 100 is prepared by preparing two laminated wiring boards 10 (FIG. 2) each having a single-sided wiring layer and arranging them so that the respective wiring layers (first wiring layers) 5 of the respective laminated wiring boards 10 face each other. A second adhesive resin layer for adhering at least one double-sided copper-clad laminate 6 between these two sheets and between the laminated wiring board 10 and the double-sided copper-clad laminate 6 or between the double-sided copper-clad laminate 6 The prepreg 4 for adhesion is arranged. In the present embodiment, two double-sided copper-clad laminates 6 and three bonding prepregs 4 are used, but the number of these is the use and purpose of the carbon-aluminum multilayer board 100, the board thickness, the weight, etc. It may be appropriately determined according to the limitation of. Copper-clad laminates are generally used as substrates for printed wiring boards. Thermosetting resins such as phenolic resin, polyester resin, and epoxy resin are applied and impregnated onto a base material such as synthetic fiber cloth or glass cloth. It is manufactured by stacking dried prepregs, arranging copper foil on one side or both sides, and processing and heating with a press, which is widely commercially available. In the present embodiment, a commercially available double-sided copper clad laminate made of a low thermal expansion / high heat resistant resin is patterned to obtain a laminate 6
A double-sided copper-clad laminate 6 having a predetermined wiring layer (second wiring layer) 6a on both sides of b was formed. Further, a wiring layer (third wiring layer) 9 in which a predetermined wiring pattern 9a is formed on a copper foil is arranged as an outer layer of the carbon-aluminum multilayer board 100, and the carbon-aluminum multilayer board 100 of a double-sided wiring layer is configured. There is. Further, the carbon aluminum multilayer board 100 includes the first and third wiring layers 5 and 9 of the laminated wiring board 10 and the double-sided copper-clad laminated board 6.
A through hole 7 for electrically connecting the second wiring layer 6a is provided, and a copper plating layer 8 is formed on the inner surface thereof. In the core material 1, the through hole 1d has a through hole 7d having a diameter larger than that of the through hole.
Is provided in the through hole 1d through the polymer coat 2 and the hole filling resin 3 on the inner surface of the through hole 1d.
A copper plating layer 8 to be the inner surface is formed.

Next, a method of manufacturing the carbon aluminum multilayer board 100 including the laminated wiring board 10 in the present embodiment will be described with reference to FIG. First, as shown in FIG. 3A, a flat plate-shaped core material 1 made of carbon aluminum 1
A through hole 1d for a through hole is opened in. As the core material 1, for example, SZ200 or SZ300 manufactured by Advanced Materials Co., Ltd. is used, and a super steel drill is used with an NC drilling machine to perform drilling according to a specified hole diameter larger than the through hole diameter. Next, in order to strengthen the adhesive strength with the polymer coat 2, the surface of the core material 1 is subjected to sandblasting, which is an uneven treatment, and the surface roughness is about 2
0 μm. When the surface roughness is 10 μm or less, the adhesive force is lowered, which is not preferable, and when the sandblasting is applied excessively, the through hole 1d portion is chipped or damaged, and thus the state where the surface roughness is 20 μm is suitable. Next, ultrasonic cleaning is performed for 5 minutes to remove the carbon powder attached to the core material 1. After being dried at 130 ° C. for 30 minutes in a dryer and cooled to room temperature, as shown in FIG. 3 (b), on the entire surface of the core material 1, that is, both main surfaces 1 a and 1 b, side surfaces 1 c and through holes 1.
d Epoxy resin for masking on the inner surface (Product name FR-4)
To form a polymer coat 2 having a thickness of 10 to 20 μm, which is a protective layer for strengthening the adhesive force with the hole-filling resin 3 and for preventing the carbon powder from scattering from the core material 1. When the thickness of the polymer coat 2 is 20 μm or more, the through hole 1d may be clogged with the polymer coat resin, which is not preferable. In addition, there is a tendency for voids to occur in the film thickness, which is not preferable. Then, it is cured for 1 hour in a dryer at 130 ° C to 140 ° C. Under this curing condition, the polymer coat 2 is in an under-cured state, and when it is cured at a temperature higher than this, the molding strain increases and the adhesive force with the hole-filling resin 3 decreases, which is not preferable.

Subsequently, as shown in FIG. 3C, the core material 1
In order to fill the hole filling resin 3 into the through-hole 1d, an epoxy prepreg for filling the hole is formed on both main surfaces 1a, 1b of the core material 1 (for example, a prepreg GEPL-190LOH containing a filler manufactured by Mitsubishi Gasification Co., Ltd.). Then, the copper foil 17 and the copper foil 17 are overlapped with each other and heated and pressed at 180 ° C. by a vacuum press to fill the hole filling resin 3 in the through hole 1d and cure the resin. As the hole-filling resin 3, a high heat resistant / low thermal expansion epoxy prepreg obtained by coating and impregnating a glass cloth containing any one of talc, silica and mica with an epoxy resin is used. The glass cloth is made of a plain weave, a twill weave, a sewn weave, or the like, and is widely used as a printed wiring board material or a heat-resistant thin film insulating material. In addition, as in the present embodiment, in the case where the through-hole 1d is filled with the hole-filling resin 3 by heat-press molding using an epoxy prepreg,
The hole filling resin 3 is formed not only on the through hole 1d portion but also on the main surfaces 1a, 1d and the side surface 1c of the core material 1.
The whole is buried. After that, in order to smooth the recesses in the through-hole 1d, the copper foil 17 is etched, dried in a dryer at 130 ° C. for 30 minutes, and cooled at room temperature.

Next, as shown in FIG. 3 (d), a low thermal expansion adhesive prepreg 4 is formed on both main surfaces 1a, 1b of the core material 1 through the polymer coat 2 and the hole filling resin 3.
(For example, Hitachi Chemical 679LD) and the copper foil 5b are overlapped and heated and pressed at 180 ° C. by a vacuum press. As a result, the through hole 1d is smoothed and the recess is
It becomes less than μm. Further, a film aligning hole (not shown) for aligning the mask film is formed by an NC punching machine. After that, the surfaces of the copper foils 5b on both sides that have been subjected to bubbling or chemical polishing are laminated with a resist (for example, a 38 μm dry film resist manufactured by DuPont MRC).
The copper foil 5b on the main surface 1b side, which is the inner layer side of the carbon-aluminum multilayer board 100, is exposed by aligning a predetermined negative mask film with the above film alignment hole. Further, a transparent film is placed on the copper foil 5b on the main surface 1a side which is the outer layer side, and the entire surface is exposed. Then, development and copper etching are performed to form the first wiring layer 5 having a predetermined wiring pattern 5a on only one side. Through the above steps, the single-sided wiring layer laminated wiring board 10 shown in FIG. 2 is obtained.

Subsequently, two laminated wiring boards 10 each having a single-sided wiring layer obtained in the above process are prepared, and the first wiring layers 5 of these two laminated wiring boards 10 are opposed to each other. Deploy. A predetermined number of double-sided copper clad laminates 6 with low thermal expansion and adhesive prepregs 4 are alternately placed between these two laminated wiring boards 10 and placed in a mold, then positioned with reference holes and pins, and further laminated. Copper foils are laid on both outer layers of the wiring board 10 and heat and pressure molding at 180 ° C. is performed by a vacuum press. When the two laminated wiring boards 10 have required strength or a limited thickness as a whole,
In consideration of these, core materials 1 having different thicknesses may be used. For example, in FIG. 1, the core material 1 having a thickness of 1.0 mm (upper side) and 0.8 mm (lower side) is used. The double-sided copper-clad laminate 6 (for example, Hitachi Chemical 679LD) is subjected to bubbling or chemical polishing, then laminated with the 38 μm dry film resist described above, aligned with a predetermined mask film, exposed, developed, and copper-etched. Then, the second wiring layer 6a having a predetermined wiring pattern is formed on both surfaces of the laminated plate 6b. Although the double-sided copper-clad laminate 6 is used in the present embodiment, a single-sided copper-clad laminate having a wiring pattern formed on only one side may be used depending on circumstances. Further, as the bonding prepreg 4, a core material embedded molded body 10 is used.
The same low-thermal-expansion adhesive prepreg (for example, Hitachi Chemical 679LD) used in the above is used. Next, at the center of the through hole 1d, a through hole for a through hole having a diameter smaller than that of the through hole 1d is opened by an NC drilling machine to form a through hole 7,
Copper plating is applied to the inner surface of the through hole 7. Finally, after polishing the copper foil arranged on the outer layer of the laminated wiring board 10, a dry film resist is laminated, the mask film is aligned, exposed, developed, and patterned by copper etching to have a predetermined wiring pattern 9a. Third wiring layer 9
To form. Through the above steps, the carbon aluminum multilayer plate 100 shown in FIG. 1 is completed.

According to the present embodiment, since carbon aluminum having low thermal expansion (coefficient of thermal expansion of 5 to 8 ppm / ° C.) and high thermal conductivity is used as the core material 1, laminated wiring having low thermal expansion and excellent heat dissipation properties is obtained. The substrate 10 and the carbon aluminum multilayer plate 100 are obtained. The coefficient of thermal expansion of a general multilayer printed wiring board is 15 to 17 ppm, and the coefficient of thermal expansion of aluminum widely used as a core material of a conventional metal core substrate is 24 ppm. The carbon-aluminum multilayer board 100 manufactured in the present embodiment and a conventional metal core board using aluminum as a core material are mounted with 304-pin CBGA of ceramic surface-mounted components and 352-pin PBGA of plastic surface-mounted components, respectively. , Thermal shock test of printed wiring board test standard (15 minutes at low temperature of -65 ° C, 125
The operation of leaving it under a high temperature of ℃ for 15 minutes was performed as one cycle), and the continuity resistance was continuously measured. as a result,
It was revealed that the solder joint of CBGA mounted on a conventional metal core substrate was broken in 22 cycles, and the solder joint reliability was very low. On the other hand, the CBGA and PBGA mounted on the carbon aluminum multilayer board 100 according to the present embodiment have no abnormality in the conduction resistance even after 1000 cycles, and it was verified that the solder joint reliability of the surface mount component is extremely high. Further, the carbon aluminum multilayer plate 100 in the present embodiment has a high heat resistance / low thermal expansion epoxy obtained by coating and impregnating the glass cloth containing talc, silica or mica with epoxy resin as the hole filling resin 3. Since prepreg is used, it has low thermal expansion and excellent strength, and high through-hole connection reliability was obtained.

Further, in this embodiment, since carbon aluminum which is the core material 1 is embedded and formed, it becomes a composite material, and the strength of carbon aluminum can be enhanced. Further, the surface of carbon aluminum, which is the core material 1, is subjected to sandblasting as unevenness treatment, whereby the core material 1
Can be processed into an appropriate surface roughness easily and at low cost, and the adhesive force with the polymer coat 2 is enhanced. For example, as a result of measuring the adhesive strength with a tensile tester, it was 100 g / cm in the case of untreated, whereas it was 700 g / cm in the treated product, and a great improvement in the adhesive strength was obtained. Also, the core material 1
By coating with the polymer coat 2, the insulating property is prevented from being deteriorated due to the scattering of carbon powder from the core material 1, and the adhesive force with the hole filling resin 3 is strengthened. As a result, the coefficient of thermal expansion of the laminated wiring board 10 approaches the coefficient of thermal expansion of carbon aluminum, so that the thermal expansion of the board as a whole is reduced. In addition, the two laminated wiring boards 10
By disposing the double-sided copper-clad laminate 6 and the bonding prepreg 4 between them to form a multilayer structure, the thermal expansion coefficient as a whole approaches the thermal expansion coefficient of the laminated wiring board 10 and is matched to cause thermal strain. Low carbon aluminum multi-layer board 100
Is obtained. Further, mechanical strength is increased, cracks are less likely to occur, and vibration resistance is also improved. In addition, by patterning the copper foil arranged on the outer layer of the laminated wiring substrate 10 during the heat and pressure molding in the sixth step to obtain the wiring layer 9, the wiring is performed by the copper plating described in the fifth embodiment to be described later. The carbon-aluminum multi-layered plate 100 having a simpler process and a lower manufacturing cost than the method for obtaining a layer is obtained.

Embodiment 2. In the first embodiment, 2
A predetermined number of double-sided copper-clad laminates 6 are arranged between a plurality of laminated wiring boards 10, and the laminated wiring board 10 and the double-sided copper-clad laminates 6 or the double-sided copper-clad laminates 6 are bonded with a bonding prepreg 4. The carbon aluminum multilayer plate 100 (FIG. 1) was shown.
However, the combination of the arrangement of the laminated wiring board 10 and the double-sided copper clad laminated board 6 is not limited to this, and various other combinations are possible. In the present embodiment, one laminated wiring board 10 is used, and at least one copper clad laminated board is arranged on one side of the laminated wiring board 10 in a stacked manner. A carbon aluminum multilayer plate (not shown) bonded with a bonding prepreg will be described. A method of manufacturing the carbon-aluminum multilayer plate in the present embodiment will be briefly described. The method of manufacturing the laminated wiring board is the same as that of the first embodiment, and therefore its explanation is omitted. Prepare one laminated wiring board with a single-sided wiring layer, and stack a predetermined number of double-sided copper-clad laminated boards having a low thermal expansion adhesive prepreg and a second wiring layer alternately on the first wiring layer side of this laminated wiring board. After placing the adhesive prepreg on the upper layer and installing it in the mold, position it with the reference hole and the pin, and then lay the copper foil on the outer layer side of the laminated wiring board and the outer layer side of the uppermost layer of the adhesive prepreg and vacuum press. Heat and pressure molding at 180 ° C. is performed. Next, a through hole for a through hole having a diameter smaller than that of the through hole is formed in the center of the through hole by an NC drilling machine to form a through hole, and the inner surface of the through hole is plated with copper. Finally, after polishing the copper foil arranged on the outer layer, dry film resist is laminated, the mask film is aligned, exposed, developed, and patterned by copper etching to form a third wiring layer having a predetermined wiring pattern. To do. Through the above steps, a carbon aluminum multilayer board in which one laminated wiring board and a predetermined number of double-sided copper clad laminated boards are laminated is completed. According to the present embodiment, it is possible to easily obtain a carbon-aluminum multilayer plate which has a low thermal expansion and is excellent in heat dissipation and which is thinner than the first embodiment. In the present embodiment, the copper clad laminate is arranged on only one side of the laminated wiring board, but it may be arranged on both sides.

Embodiment 3. In the first embodiment described above,
In the second step of the method for manufacturing the carbon-aluminum multilayer board 100, a masking epoxy resin is coated as a protective layer on the entire surface of the core material 1 made of carbon aluminum to form a polymer coat 2 having a thickness of 10 to 20 μm. (Fig. 3 (b)). In the present embodiment, as the protective layer of the core material 1, instead of the polymer coat 2, electroless copper plating using palladium as a catalyst is used to obtain a thickness of 10 to 20 μm.
m copper plating layer 11 was formed (FIG. 4). Furthermore, the surface of the copper plating layer 11 was subjected to sandblasting, which is an uneven treatment, so that the copper plating layer 11 was processed to have an appropriate surface roughness. Generally, nickel plating may be applied as the base plating of the copper plating layer 11. However, since the nickel plating has a low tensile strength of 3%, heat treatment is performed during the manufacturing process of the printed wiring board (during solder coating) or the solder heat resistance test. Cracks may occur due to stress, which is not preferable. Therefore, nickel plating is not applied in this embodiment. On the other hand, the tensile strength of copper is 15%, and problems such as cracks do not occur in the printed wiring board manufacturing process and the solder heat resistance test. The other structure and manufacturing process are the same as those in the first embodiment, and therefore the description thereof is omitted. According to the present embodiment, by adopting copper plating layer 11 as the protective layer of core material 1, it is possible to prevent carbon powder from scattering from core material 1 and to strengthen core material 1.
Furthermore, by sandblasting the surface of the copper plating layer 11, the copper plating layer 11 can be easily processed at an appropriate surface roughness at low cost, and the adhesive strength with the hole filling resin 3 can be enhanced. Planned. Further, since the copper plating layer 11 is conductive, it can be electrically connected to the carbon aluminum which is the core material 1.

Fourth Embodiment FIG. 5 is a sectional view showing a method of manufacturing a laminated wiring board according to a fourth embodiment of the present invention. In the figure, the same or corresponding parts are designated by the same reference numerals.
A method of manufacturing laminated wiring board 10a in the present embodiment will be described with reference to FIG. A step of forming through holes for through holes in the core material 1, subjecting the surface of the core material 1 to unevenness, and then forming a protective layer on both main surfaces 1a and 1b of the core material 1 and the inner surface of the through hole 1d. The description up to this point is omitted because it is the same as in the first embodiment. As the protective layer of the core material 1, either the polymer coat 2 or the copper plating layer 11 may be used. First, as the hole-filling resin 3a, powder of alumina or aluminum nitride (or a crushed product)
Prepare an epoxy resin with high thermal conductivity / low thermal expansion mixed with. Then, after forming the through hole 1d, the core material 1 made of carbon aluminum subjected to the surface treatment is attached to the release film 1
Install on top of 2. In addition, a metal mask 13 having an opening 13a having the same diameter as the diameter of the through hole 1d is printed by a printing machine (not shown).
(Fig. 5 (a)). Next, the hole filling resin 3a is filled inside the through hole 1d by screen printing (FIG. 5B). Then, a low thermal expansion bonding prepreg 4 (for example, Hitachi Chemical Co., Ltd. 679LD) and a copper foil 5b are provided on both main surfaces 1a and 1b of the core material 1 via a protective layer 2 (or 11).
And are heated and pressed at 180 ° C. by a vacuum press (FIG. 5C). Since the subsequent steps are the same as those in the first embodiment, the description thereof will be omitted.

In this embodiment, if Tetron plate making is used instead of the metal mask 13, after printing,
When the plate-making is separated, the hole burying resin 3a filled in the through-hole 1d of the core material 1 adheres to the plate-making again, and the through-hole 1
It is not preferable because it is removed from d. Further, a varnish containing 80 to 90% by weight of alumina or aluminum nitride powder (or a crushed product) is prepared and used as the hole-filling resin 3a. If the content ratio of these is low, the thermal conductivity is low. Is not preferable. Further, the viscosity of the hole-filling resin 3a is suitably 500 to 1000 poise, and if the viscosity is lower than this, it will flow out from the through hole 1d of the core material 1, and if it is higher than this, the inside of the through hole 1d will be filled. Cannot be applied. The diameter of the opening 13a of the metal mask 13 is preferably the same as the diameter of the through hole 1d of the core material 1. If the diameter of the opening 13a of the metal mask 13 is small, the through hole 1d cannot be sufficiently filled with the hole filling resin 3a. On the other hand, when the diameter of the opening 13a is larger than the diameter of the through hole 1d, the hole filling resin 3a adheres to the surface of the core 1 on the main surface 1a side, which is not preferable. Laminated wiring board 10a obtained in the present embodiment (FIG. 5C)
Since the hole filling resin 3a is filled only in the through hole 1d by screen printing using the metal mask 13, the laminated wiring board 10 obtained in the first embodiment is obtained.
The plate thickness can be reduced as compared with (FIG. 3D). Therefore, the throwing power with copper plating during the substrate manufacturing process is improved. Further, since the high thermal conductive resin is used as the hole filling resin 3a, the thermal conductivity and the heat dissipation property are excellent.

Embodiment 5. In the first embodiment, the third wiring layer 9 which is the outer layer of the carbon-aluminum multilayer board 100 is formed of copper foil. In the present embodiment, the outer third wiring layer 18 is formed by copper plating similarly to the inner surface of the through hole 7. The copper plating on the inner surface of the through hole 7 needs to have a sufficient thickness in order to secure the reliability of the through hole connection. On the other hand, the copper plating of the third wiring layer 18 is required for the finer wiring pattern of the outer layer. Is preferable to be thin. In addition, since the substrate thickness of the carbon aluminum multilayer plate 100 is as thick as 3 to 4 mm and the circumstance of attaching copper plating to the inner surface of the through hole 7 is poor, it is necessary to perform sufficient copper plating. Therefore, in the present embodiment, first, the through hole 7
Copper is plated only on the inner surface, and then the outer third wiring layer 18 is formed with the necessary minimum plating thickness, whereby the outer wiring pattern is made fine.

A method of manufacturing carbon-aluminum multilayer wiring board 100a in the present embodiment will be described with reference to FIGS. 6 to 11, (a) is a top view showing a part of the carbon aluminum multilayer plate 100a in each manufacturing step, and (b) is a partial cross-sectional view taken along line BB in (a). In the figure, reference numeral 14a indicates a substrate manufacturing / processing region effective as the carbon aluminum multilayer plate 100a, and 14b indicates a discarding plate region cut during the manufacturing process. First,
Two laminated wiring boards each having a single-sided wiring layer similar to those described in the first embodiment are prepared and arranged so that the respective wiring layers (first wiring layers) face each other. A predetermined number of low-thermal-expansion double-sided copper-clad laminates having a second wiring layer and adhesive prepregs are alternately stacked between these two laminated wiring boards, and a predetermined number of the laminated wiring boards are placed in a mold and positioned. Perform heat and pressure molding at ℃. The difference from the first embodiment is that copper foil is not stacked on the outer layer side of the laminated wiring board.
Although not shown in FIGS. 6 to 11, a protective layer made of a polymer coat or a copper plating layer is formed on the surface of the core material 1. As the hole filling resin, either the epoxy prepreg used in the first embodiment or the epoxy resin used in the fourth embodiment may be used.

After the through holes 7a for through holes are formed in the carbon aluminum multilayer plate 100a thus obtained,
Thin panel copper plating is applied to form a base, and a thin copper plating layer (not shown) is formed on the entire surface (FIG. 6). After polishing the surface, a 50 μm dry film resist 15 is laminated on both sides of the substrate, and a positive film having through holes 7a for through holes and an opening in the waste plate region 14b is used as a mask film (not shown). The resist 15 is exposed and developed (FIG. 7). Next, through-hole copper plating is performed to form a copper-plated layer 16 on the inner surface of the through-hole 7, and at the same time, a copper-plated layer 16b is also formed on the discard plate area 14b (FIG. 8). Then, the dry film resist 15 is removed in a peeling process (FIG. 9). Subsequently, thin copper plating is applied to the substrate manufacturing processing area 14a.
And the through hole 7 entrance is covered with copper plating. As a result, the copper plating layer 16a to be the conductor layer is formed (FIG. 10). Finally, the discard plate area 14b is cut and removed (FIG. 11). Then, the board manufacturing processing area 14 on both sides of the board
By laminating a dry film resist on the copper plating layer 16a formed on a, aligning a mask film (not shown), exposing, developing, and patterning by copper etching to form a predetermined wiring pattern, The carbon-aluminum multilayer board 100a having the third wiring layer 18 made of the copper plating layer 16a on both outer layers is completed (FIG. 12).

In the above manufacturing process, for example, if through-hole copper plating is applied only to the inner surface of the through-hole 7a for through hole, the copper plating area is extremely small, so that current concentration occurs during copper plating and copper plating burns. The problem arises. In order to prevent this copper plating burn, in the present embodiment, copper is also plated on the waste plate region 14b outside the substrate manufacturing / processing region 14a. Thereby, the copper plating burn did not occur, and the good copper plating layer 16 was obtained. Further, it is desirable that the opening diameter of the mask film used when performing through-hole copper plating be the same as the through-hole diameter. If it is larger than the through hole diameter,
If copper plating is deposited in areas other than the through holes 7 and is smaller than the diameter of the through holes, the deposition efficiency of the copper plating is reduced, which is not preferable. The carbon aluminum multilayer board 100a manufactured in the present embodiment was subjected to the thermal shock test of the above-mentioned printed wiring board standard, and as a result, no abnormality occurred even after 1000 cycles. From the above, also in the present embodiment, since the solder joint reliability with the surface mount component and the through hole connection reliability are high, and further, the wiring layer 18 made of the thin copper plating layer 16a is provided, the wiring pattern is fine. Thus, the carbon-aluminum multi-layer board 100a which can be realized in high density and can be mounted at high density can be obtained.

[0030]

As described above, according to the present invention, since the carbon molding impregnated with the molten metal is used as the core material, the thermal expansion of the carbon molding is lower than that of the conventional metal core, and the heat of the surface-mounted component is reduced. It is possible to obtain a laminated wiring board which has a small thermal strain caused by mismatch of expansion coefficients, has excellent solder joint reliability with surface-mounted components, heat dissipation and through-hole connection reliability, and is capable of high-density mounting.

The core material is made of carbon-aluminum obtained by impregnating a carbon molded body with molten aluminum, and has the characteristics of both carbon and aluminum such as light weight, low thermal expansion (coefficient of thermal expansion 5 to 8 ppm / ° C.), and high thermal conductivity. It has both, and is very suitable as a core material for laminated wiring boards.

Further, by providing a protective layer for preventing carbon powder from scattering from the core material on both main surfaces of the core material, the insulating property of the laminated wiring board is maintained, and the core material, the adhesive resin layer and the holes are provided. The adhesive strength with the filling resin layer is improved.

Further, since the protective layer is made of an epoxy resin, it has good adhesiveness to the core material, the adhesive resin layer and the hole filling resin layer, and can be formed by a simple process.

Further, since the protective layer is composed of a copper-plated layer having an uneven surface, the strength of the core material is enhanced,
Further, the unevenness treatment improves the adhesive strength between the adhesive resin layer and the hole filling resin layer. Further, since the copper plating layer is conductive, it is possible to electrically connect to the core material.

Furthermore, since the adhesive resin layer is composed of an adhesive prepreg having a low thermal expansion, the thermal distortion is small together with the carbon aluminum core material having a low thermal expansion, and the solder joint reliability with the surface mount component and the through hole connection reliability are excellent. A laminated wiring board is obtained.

In addition, since the copper plating layer is formed on the inner surface of the through hole for the through hole with the protective layer and the resin layer for filling the hole portion in the core material, the core material, the protective layer and the hole portion are filled. Since the resin layers are firmly adhered to each other, a laminated wiring board having high through-hole reliability can be obtained.

Further, by alternately arranging at least one copper clad laminate and the second adhesive resin layer on one or both sides of one laminated wiring board to form a multilayer, low thermal expansion and heat dissipation An excellent thin multi-layer wiring assembly can be obtained.

Further, by alternately disposing at least one copper clad laminate and the second adhesive resin layer between the two laminated wiring boards to form a multilayer structure, the thermal expansion coefficient as a whole is improved. It is possible to obtain a multi-layer wiring assembly which has a thermal expansion coefficient close to that of the laminated wiring board and is matched with the thermal expansion coefficient so that the thermal distortion is small. In addition, mechanical strength is increased, cracks are less likely to occur, and vibration resistance is improved.

Further, according to the method for manufacturing a laminated wiring board of the present invention, after the through hole for the through hole is formed in the core material, the unevenness is applied to enhance the adhesive force with the protective layer.

Further, by performing sandblasting as the unevenness treatment, it is possible to easily and inexpensively process the core material to have an appropriate surface roughness.

Further, the strength of the core material is enhanced by forming the protective layer by electroless copper plating using a palladium catalyst, and further, by subjecting the surface of the copper plating layer to sandblasting as an uneven treatment, The copper plating layer can be easily processed to have an appropriate surface roughness at low cost, and the adhesive force with the adhesive resin layer or the hole filling resin layer is improved.

As the hole filling resin, a high heat resistant / low thermal expansion epoxy prepreg obtained by coating and impregnating a glass cloth containing any one of talc, silica and mica with an epoxy resin is used, so that the resin composition has low thermal expansion and strength. It is possible to obtain a laminated wiring board which is excellent in the through hole connection reliability.

Further, as the hole filling resin, an epoxy resin having a high thermal conductivity / low thermal expansion mixed with powder of alumina or aluminum nitride is used, and the epoxy resin is filled in the through holes by screen printing to obtain a plate thickness. It is possible to obtain a laminated wiring board that is thin, has low thermal expansion, and has excellent thermal conductivity and heat dissipation.

Further, since at least one copper clad laminate and the second adhesive resin layer are alternately arranged on one side of one laminated wiring board for heat and pressure molding, low thermal expansion is achieved. A thin multilayer wiring assembly having excellent heat dissipation can be manufactured at low cost by a simple process.

Further, since at least one copper clad laminate and the second adhesive resin layer are alternately arranged between the two laminated wiring boards to perform heating and pressurization, low thermal expansion is achieved. A multilayer wiring assembly excellent in heat dissipation and strength can be manufactured at low cost by a simple process.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a carbon aluminum multilayer printed wiring board which is Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view showing a core-member-embedded molded body that is Embodiment 1 of the present invention.

FIG. 3 is a cross-sectional view showing the method of manufacturing a core-member-embedded compact according to Embodiment 1 of the present invention.

FIG. 4 is a cross-sectional view showing a method of manufacturing a core-member-embedded compact according to Embodiment 3 of the present invention.

FIG. 5 is a cross-sectional view showing a method of manufacturing a core-member-embedded compact according to Embodiment 4 of the present invention.

6A and 6B are a top view and a partial cross-sectional view showing a method of manufacturing a carbon aluminum multilayer printed wiring board according to a fifth embodiment of the present invention.

7A and 7B are a top view and a partial cross-sectional view showing a method of manufacturing a carbon aluminum multilayer printed wiring board according to a fifth embodiment of the present invention.

FIG. 8 is a top view and a partial cross-sectional view showing a method of manufacturing a carbon aluminum multilayer printed wiring board according to a fifth embodiment of the present invention.

9A and 9B are a top view and a partial sectional view showing a method of manufacturing a carbon-aluminum multilayer printed wiring board according to a fifth embodiment of the present invention.

FIG. 10 is a top view and a partial cross-sectional view showing a method for manufacturing a carbon aluminum multilayer printed wiring board according to a fifth embodiment of the present invention.

11A and 11B are a top view and a partial cross-sectional view showing a method of manufacturing a carbon-aluminum multilayer printed wiring board according to a fifth embodiment of the present invention.

FIG. 12 is a partial cross sectional view showing the method for manufacturing the carbon aluminum multilayer printed wiring board according to the fifth embodiment of the present invention.

FIG. 13 is a sectional view showing an example of a structure of a conventional metal core substrate.

[Explanation of symbols]

1 carbon aluminum core material, 1a, 1b main surface, 1
c side face, 1d through hole, 2 polymer coat, 3, 3
a Hole filling resin, 4 Adhesive prepreg, 5 1st
Wiring layer, 5a Wiring pattern, 5b Copper foil, 6 Double-sided copper clad laminated board, 6a Second wiring layer, 6b Laminated board, 7 through hole, 7a Through hole through hole, 8 Copper plated layer, 9, 18 Third wiring Layer, 9a wiring pattern, 1
0, 10a core material embedded molding, 11 copper plating layer, 12
Release film, 13 metal mask, 13a opening, 14a substrate manufacturing and processing area, 14b waste plate area,
15 Dry film resist, 16, 16a, 16b
Copper plating layer, 17 copper foil, 20 aluminum core material,
21 nickel layer, 22 blackened copper layer, 23
Epoxy prepreg layer, 24 copper wiring layer, 25 solder layer, 26 solder resist layer, 27 through hole,
100, 100a Carbon aluminum multilayer printed wiring board.

Continued front page    F-term (reference) 5E343 AA07 AA17 AA22 BB24 BB67                       DD76 EE05 EE33 GG11                 5E346 AA12 AA43 DD23 EE06 EE07                       EE13 EE19 FF07 FF13 GG15                       HH32

Claims (16)

[Claims] 1. A flat plate-shaped core member made of a carbon molded product impregnated with molten metal and having a pair of opposing main faces, and an adhesive resin layer provided on both of the main faces of the core member. And a wiring layer provided on at least one of the adhesive resin layers and having a predetermined wiring pattern formed thereon. 2. The laminated wiring board according to claim 1, wherein the core material is made of carbon aluminum obtained by impregnating a molded carbon body with molten aluminum. 3. The laminated wiring board according to claim 1, wherein a protective layer for preventing carbon powder from scattering from the core material is provided on both of the main surfaces of the core material. 4. The laminated wiring board according to claim 3, wherein the protective layer is made of an epoxy resin. 5. The laminated wiring board according to claim 3, wherein the protective layer is formed of a copper plating layer having an uneven surface. 6. The laminated wiring board according to claim 1, wherein the adhesive resin layer comprises an adhesive prepreg having a low thermal expansion coefficient. 7. The core material has a through hole for forming a through hole, and a copper plating layer is formed on the inner surface of the through hole via the protective layer and the hole portion filling resin layer. The laminated wiring board according to claim 3, which is characterized in that. 8. A flat-plate-shaped core material made of a carbon molded body impregnated with molten metal and having a pair of opposing main surfaces, and an adhesive resin layer formed on each of the main surfaces of the core material. A multilayer wiring using at least one laminated wiring board having a first wiring layer having a predetermined wiring pattern formed on the adhesive resin layer on both main surface sides or one main surface side of the core material In the assembly, at least one copper-clad laminate provided on at least one main surface side of the laminate wiring board and having a second wiring layer having a predetermined wiring pattern formed on one or both surfaces thereof, and the laminate wiring board And a second adhesive resin layer provided between the copper clad laminates or between the copper clad laminates to form a through hole penetrating the core material of the laminated wiring board and the copper clad laminate. The first and second wirings through the through hole. A multilayer wiring assembly characterized in that the layers are electrically connected. 9. A flat plate-shaped core material made of a carbon molded body impregnated with molten metal and having a pair of opposing main surfaces, and an adhesive resin layer formed on each of the main surfaces of the core material. Using at least two laminated wiring boards having a first wiring layer of a predetermined wiring pattern formed on the adhesive resin layer on both main surface sides or one main surface side of the core material, A multilayer wiring assembly in which wiring boards are arranged facing each other, wherein at least one copper-clad laminate is arranged between the laminated wiring boards, and a second wiring layer having a predetermined wiring pattern is formed on one surface or both surfaces thereof. A second adhesive resin layer provided between the laminated wiring board and the copper-clad laminate or between the copper-clad laminates, and the core material of each laminated wiring board and the copper-clad laminate Form a through hole that penetrates the board, and A multi-layer wiring assembly, characterized in that the first and second wiring layers are electrically connected via a wire. 10. A flat core material comprising a carbon molded body impregnated with molten metal and having a pair of opposing main surfaces,
A method of manufacturing a laminated wiring board, wherein a wiring layer having a predetermined wiring pattern is formed on at least one of the main surfaces of the core material via a protective layer and an adhesive resin layer, the through-hole being provided in the core material. A first step of forming a through hole for a hole and subjecting the surface of the core material to unevenness, a second step of forming a protective layer on both main surfaces of the core material and an inner surface of the through hole, the core material A third method for filling the hole filling resin into the through hole
Step, a fourth step of heating and press-molding by superposing an adhesive prepreg and a copper foil, which are to be the adhesive resin layer, on both main surfaces of the core material through the protective layers, and at least the core material A method of manufacturing a laminated wiring board, comprising: a fifth step of patterning the copper foil on the one main surface to form the wiring layer having a predetermined wiring pattern. 11. The method for manufacturing a laminated wiring board according to claim 10, wherein in the first step, sandblasting is performed as the unevenness treatment. 12. In the second step, the protective layer is formed by electroless copper plating using a palladium catalyst, and the surface of the copper plated layer is subjected to sandblasting as unevenness treatment. 11. The method for manufacturing a laminated wiring board according to 10. 13. A high heat resistant / low thermal expansion epoxy prepreg obtained by coating and impregnating a glass cloth containing any one of talc, silica and mica with an epoxy resin as the hole filling resin in the third step. 11. The laminated wiring according to claim 10, wherein the epoxy prepreg is superposed on both main surfaces of the core material, heat-pressed by a vacuum press, and the epoxy resin is filled inside the through hole. Substrate manufacturing method. 14. In the third step, a high thermal conductive / low thermal expansion epoxy resin mixed with alumina or aluminum nitride powder is used as the hole filling resin, and the opening having the same diameter as the through hole is used. 11. The method for manufacturing a laminated wiring board according to claim 10, wherein a metal mask having the above is attached to a printing machine, and the inside of the through hole is filled with the epoxy resin by screen printing. 15. A flat plate-like core material made of a carbon compact impregnated with molten metal and having opposing first and second main surfaces, and on the first and second main surfaces of the core material. At least a laminated wiring board having an adhesive resin layer formed respectively and a first wiring layer having a predetermined wiring pattern formed only on the adhesive resin layer on the first main surface side of the core material. 1
A first step of preparing a plurality of sheets, a predetermined number of copper clad laminates having a second wiring layer having a predetermined wiring pattern and adhesive prepregs are alternately stacked and arranged on the first wiring layer side of the laminated wiring board. And a second step of heating and pressurizing, forming a through hole penetrating the core material of the laminated wiring board and the copper clad laminate, and performing a copper plating on the inner surface of the through hole, and the laminating. A method for manufacturing a multilayer wiring assembly, comprising a fourth step of forming a third wiring layer having a predetermined wiring pattern on the adhesive resin layer on the second main surface side of a wiring board. 16. A flat plate-like core material made of a carbon compact impregnated with molten metal and having opposing first and second main surfaces, and on the first and second main surfaces of the core material. At least a laminated wiring board having an adhesive resin layer formed respectively and a first wiring layer having a predetermined wiring pattern formed only on the adhesive resin layer on the first main surface side of the core material. Two
A first step of preparing the two wiring boards and arranging these two wiring boards so that the first wiring layers face each other;
A copper clad laminate having a second wiring layer of a predetermined wiring pattern and a bonding prepreg are alternately stacked and arranged between the first wiring layers of each of the laminated wiring boards, and heated and pressed. A second step of forming, a third step of forming a through hole penetrating the core material of the laminated wiring board and the copper clad laminate, and performing copper plating on the inner surface of the through hole; and the at least one laminated wiring board. And a fourth step of forming a third wiring layer having a predetermined wiring pattern on the adhesive resin layer on the side of the second main surface, the method for manufacturing a multilayer wiring assembly.