JP5076196B2 - Printed wiring board and manufacturing method thereof - Google Patents

Printed wiring board and manufacturing method thereof Download PDF

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JP5076196B2
JP5076196B2 JP2008204309A JP2008204309A JP5076196B2 JP 5076196 B2 JP5076196 B2 JP 5076196B2 JP 2008204309 A JP2008204309 A JP 2008204309A JP 2008204309 A JP2008204309 A JP 2008204309A JP 5076196 B2 JP5076196 B2 JP 5076196B2
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core
hole
adhesive member
conductive layer
wiring board
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JP2009135415A (en
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壮平 鮫島
貞夫 佐藤
毅志 尾崎
弘行 大須賀
輝彦 熊田
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Mitsubishi Electric Corp
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本発明は、プリント配線板およびその製造方法に関するものであり、特に、炭素繊維強化プラスチックを含むコアを有するプリント配線板およびその製造方法に関するものである。   The present invention relates to a printed wiring board and a method for manufacturing the same, and more particularly to a printed wiring board having a core containing carbon fiber reinforced plastic and a method for manufacturing the same.

近年、プリント配線板は、電子部品の高密度化に伴い、放熱性の良い基板が望まれるようになっている。放熱性に優れたプリント配線板として、金属コア基板が知られており、既に実用化されている。金属コア基板は、コア材として熱伝導率の高いアルミニウム（Ａｌ）や銅（Ｃｕ）などの金属を用いることで、発熱部品からの熱を基板全体に分散し、発熱部品の温度上昇を抑えることが可能である。中でも、比重の小さいアルミニウムがコア材として一般的に用いられている。   In recent years, printed circuit boards have come to be desired to have a substrate with good heat dissipation as the density of electronic components increases. A metal core substrate is known as a printed wiring board excellent in heat dissipation and has already been put into practical use. The metal core board uses a metal with high thermal conductivity such as aluminum (Al) or copper (Cu) as the core material to disperse the heat from the heat-generating component throughout the board and suppress the temperature rise of the heat-generating component. Is possible. Among these, aluminum having a small specific gravity is generally used as the core material.

しかしながら、アルミニウムの熱膨張率は約２４ｐｐｍ／℃と高く、セラミック部品の熱膨張率は約７ｐｐｍ／℃と低い。このため、ヒートサイクル試験を行なうと、アルミニウムとセラミック部品との熱膨張率差によって、はんだ接合部にクラックが発生し、実装信頼性が得られないといった課題がある。   However, the coefficient of thermal expansion of aluminum is as high as about 24 ppm / ° C., and the coefficient of thermal expansion of ceramic parts is as low as about 7 ppm / ° C. For this reason, when a heat cycle test is performed, a crack occurs in a solder joint due to a difference in thermal expansion coefficient between aluminum and a ceramic component, and there is a problem that mounting reliability cannot be obtained.

上記、課題を解決できるコア材として、炭素繊維強化プラスチック（Carbon Fiber Reinforced Plastics：以下、ＣＦＲＰと称する）が知られている（たとえば、特許文献１参照）。ＣＦＲＰは、カーボン繊維と樹脂からなる複合材料であり、低熱膨張（±２ｐｐｍ／℃）、高熱伝導（１４０〜８００Ｗ／ｍ・Ｋ）、低比重（１．６ｇ／ｃｍ3）といった特性を有する。このＣＦＲＰを用いてコア基板を作製できれば、高熱伝導で、かつアルミニウムよりも実装信頼性に優れた基板を得ることができる。 Carbon fiber reinforced plastics (Carbon Fiber Reinforced Plastics: hereinafter referred to as CFRP) are known as a core material that can solve the above problems (for example, see Patent Document 1). CFRP is a composite material composed of carbon fiber and resin, and has characteristics such as low thermal expansion (± 2 ppm / ° C.), high thermal conductivity (140 to 800 W / m · K), and low specific gravity (1.6 g / cm 3 ). If a core substrate can be produced using this CFRP, a substrate having high thermal conductivity and better mounting reliability than aluminum can be obtained.

ＣＦＲＰコア基板は、他の金属コアと同様、導電性を有するため、コア上下の配線を接続する貫通スルーホールとは絶縁する必要がある。
特開平１１−４０９０２号公報 Since the CFRP core substrate has conductivity like other metal cores, it is necessary to insulate the through-holes connecting the wirings above and below the core.
Japanese Patent Laid-Open No. 11-40902

しかしながら、一方向のカーボン繊維からなるプリプレグを０°／９０°／９０°／０°に積層したＣＦＲＰをコア材に用いた基板は、ヒートサイクル試験によって、基板側面のＣＦＲＰ層で剥離するという課題があった。これは、ＣＦＲＰのカーボン繊維と樹脂との密着強度よりも、ＣＦＲＰと基板材料および銅との熱膨張率差によって発生する応力が強いことが原因と考えられる。   However, a substrate using CFRP in which a prepreg made of unidirectional carbon fiber is laminated at 0 ° / 90 ° / 90 ° / 0 ° as a core material is peeled off by a CFRP layer on the side surface of the substrate by a heat cycle test. was there. This is presumably because the stress generated by the difference in thermal expansion coefficient between CFRP and the substrate material and copper is stronger than the adhesion strength between the carbon fiber of CFRP and the resin.

また、基板側面は、ＣＦＲＰ層が剥き出しであるため、導電性のカーボン粉が脱落して基板の配線間やデバイスの絶縁部に付着し、配線間を短絡する危険性があった。特に、ヒートサイクル試験によって基板端部のＣＦＲＰ層において剥離が生じると、カーボン粉の脱落の影響は大きく、許容できないレベルであった。   Further, since the CFRP layer is exposed on the side surface of the substrate, there is a risk that the conductive carbon powder falls off and adheres to the wiring between the substrates and the insulating portion of the device, thereby short-circuiting the wirings. In particular, when peeling occurred in the CFRP layer at the edge of the substrate by the heat cycle test, the influence of the falling off of the carbon powder was large and was an unacceptable level.

本発明は、上記の課題を鑑みてなされたものであり、その目的は、ＣＦＲＰをコアに用いた基板において基板側面におけるＣＦＲＰ層の剥離やＣＦＲＰ層からのカーボン粉の脱落を防止できる低熱膨張で、かつ高熱伝導のプリント配線板およびその製造方法を提供することである。   The present invention has been made in view of the above problems, and its purpose is low thermal expansion that can prevent the separation of the CFRP layer on the side surface of the substrate and the falling off of the carbon powder from the CFRP layer in a substrate using CFRP as a core. And providing a printed wiring board having high thermal conductivity and a method for manufacturing the same.

本発明のプリント配線板は、１対の信号回路層と、炭素繊維強化プラスチックを含むコアと、接着部材と、第１の導電層と、被覆層と、表面側導電パターンおよび裏面側導電パターンとを備えている。１対の信号回路層のそれぞれは信号配線を有している。炭素繊維強化プラスチックを含むコアは、１対の信号回路層の間に設けられた１次貫通穴を有している。接着部材は、１対の信号回路層とコアとを接着し、かつコアの１次貫通穴の壁面を覆い、かつ１次貫通穴内を通る２次貫通穴を有している。第１の導電層は、１対の信号回路層の各々の信号配線を２次貫通穴を介して電気的に接続するために２次貫通穴の壁面に形成されている。被覆層は、コアの平面視における外周端縁を被覆している。被覆層は接着部材および第２の導電層を含んでいる。コアの平面視における外周端縁は接着部材により被覆され、かつ接着部材によって被覆されていない外周端縁は第２の導電層により被覆されている。表面側導電パターンおよび裏面側導電パターンは、コアの表面側および裏面側の各々に接着部材を介して形成されている。第２の導電層は、めっきにより形成された導電材料よりなっている。表面側導電パターンおよび裏面側導電パターンは、第２の導電層によって互いに電気的に接続されている。 The printed wiring board of the present invention includes a pair of signal circuit layers, a core including carbon fiber reinforced plastic, an adhesive member, a first conductive layer, a covering layer, a front side conductive pattern, and a back side conductive pattern. It has. Each of the pair of signal circuit layers has a signal wiring. The core containing carbon fiber reinforced plastic has a primary through hole provided between a pair of signal circuit layers. The adhesive member has a secondary through hole that bonds the pair of signal circuit layers and the core, covers the wall surface of the primary through hole of the core, and passes through the primary through hole. The first conductive layer is formed on the wall surface of the secondary through hole in order to electrically connect each signal wiring of the pair of signal circuit layers through the secondary through hole. The coating layer covers the outer peripheral edge of the core in plan view. The covering layer includes an adhesive member and a second conductive layer. The outer peripheral edge in a plan view of the core is covered with an adhesive member, and the outer peripheral edge that is not covered with the adhesive member is covered with a second conductive layer. The front surface side conductive pattern and the back surface side conductive pattern are formed on each of the front surface side and the back surface side of the core via an adhesive member. The second conductive layer is made of a conductive material formed by plating. The front surface side conductive pattern and the back surface side conductive pattern are electrically connected to each other by the second conductive layer.

本発明のプリント配線板の製造方法は、以下の工程を備えている。
製品部と支持部とを繋ぐ連結部を残して製品部の周りを取り囲む第１の１次貫通穴と、製品部に形成された第２の１次貫通穴とを有する炭素繊維強化プラスチックを含むコアが形成される。コアの両面を覆い、かつ第１および第２の１次貫通穴を埋め込むように接着部材が形成される。コアの両面の各々に接着部材を介して、それぞれが信号配線を有する１対の信号回路層の各々が接着される。連結部を跨いで第１の１次貫通穴の端部同士を接続するように接着部材およびコアを貫通する第１の２次貫通穴が形成されるとともに、第２の１次貫通穴内を通るように接着部材を貫通する第２の２次貫通穴が形成される。第１および第２の２次貫通穴の壁面にコアの両面の前記信号配線とつながる導電層がめっきにより被覆される。製品部と支持部との間の接着部材および第１の２次貫通穴の部分を切断することで支持部から製品部が切り取られる。 The manufacturing method of the printed wiring board of this invention is equipped with the following processes.
Including a carbon fiber reinforced plastic having a first primary through hole surrounding the product part, leaving a connecting part connecting the product part and the support part, and a second primary through hole formed in the product part A core is formed. An adhesive member is formed so as to cover both surfaces of the core and fill the first and second primary through holes. Each of a pair of signal circuit layers each having a signal wiring is bonded to each of both surfaces of the core via an adhesive member. A first secondary through hole penetrating the adhesive member and the core is formed so as to connect the end portions of the first primary through hole across the connecting portion, and passes through the second primary through hole. Thus, the second secondary through hole penetrating the adhesive member is formed. Conductive layers connected to the signal wirings on both surfaces of the core are coated on the wall surfaces of the first and second secondary through holes by plating . The product part is cut out from the support part by cutting the adhesive member between the product part and the support part and the first secondary through hole.

本発明によれば、被覆層がコアの平面視における外周端縁を被覆しているため、炭素繊維強化プラスチックよりなるコアからのカーボン粉の脱落を抑制することができ、ヒートサイクル試験において炭素繊維強化プラスチック層が剥離することがない。したがって、絶縁信頼性およびヒートサイクル信頼性を高めることができる。   According to the present invention, since the coating layer covers the outer peripheral edge in the plan view of the core, it is possible to suppress the falling off of the carbon powder from the core made of carbon fiber reinforced plastic. The reinforced plastic layer does not peel off. Therefore, insulation reliability and heat cycle reliability can be improved.

以下、本発明の実施の形態について図に基づいて説明する。
（実施の形態１）
図１は、本発明の実施の形態１におけるプリント配線板の構成を概略的に示す断面図である。また図２は、図１のＩＩ−ＩＩ線に沿う部分の断面を平面視において示す概略断面図である。なお図２のＩ−Ｉ線に沿う断面部分が図１の断面に対応する。また図２においては、説明の便宜上、導電層８の図示は省略されている。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a cross-sectional view schematically showing a configuration of a printed wiring board according to Embodiment 1 of the present invention. FIG. 2 is a schematic cross-sectional view showing a cross-section of the portion along the line II-II in FIG. 2 corresponds to the cross section of FIG. 1. In FIG. 2, the conductive layer 8 is not shown for convenience of explanation.

図１を参照して、プリント配線板１は、上下１対の信号回路層４ａ、４ｂと、ＣＦＲＰ層５を含むコア（以下、ＣＦＲＰコアと称する）と、接着部材６と、第１の導電層２ｂと、被覆層２ｃ、６とを主に有している。   Referring to FIG. 1, printed wiring board 1 includes a pair of upper and lower signal circuit layers 4a and 4b, a core including a CFRP layer 5 (hereinafter referred to as a CFRP core), an adhesive member 6, and a first conductive layer. It mainly has a layer 2b and coating layers 2c and 6.

上下１対の信号回路層４ａ、４ｂの各々は、絶縁基材３と、その絶縁基材３の表面上に形成された信号配線２ａとを有している。絶縁基材３は、たとえばガラスクロスにエポキシ樹脂などを含浸したプリプレグを硬化した材質よりなり、ＣＦＲＰ層５との熱膨張率差によって発生する応力を低減するためＣＦＲＰ層５程度の低熱膨張の材質であることが好ましい。ＣＦＲＰ層５の熱膨張率はたとえば約０ｐｐｍ／℃である。また絶縁基材３の熱膨張率は一般的には約１６ｐｐｍ／℃であるが、低熱膨張の絶縁基材３の熱膨張率はたとえば約８〜１２ｐｐｍ／℃である。信号配線２ａは、たとえば銅よりなっている。   Each of the pair of upper and lower signal circuit layers 4 a and 4 b has an insulating base 3 and a signal wiring 2 a formed on the surface of the insulating base 3. The insulating base material 3 is made of, for example, a material obtained by curing a prepreg in which a glass cloth is impregnated with an epoxy resin or the like. It is preferable that The coefficient of thermal expansion of the CFRP layer 5 is, for example, about 0 ppm / ° C. The thermal expansion coefficient of the insulating base material 3 is generally about 16 ppm / ° C., but the thermal expansion coefficient of the low thermal expansion insulating base material 3 is, for example, about 8 to 12 ppm / ° C. The signal wiring 2a is made of, for example, copper.

ＣＦＲＰコアは、上下１対の信号回路層４ａ、４ｂの間に設けられている。このＣＦＲＰコアは、ＣＦＲＰ層５と、導電層８とを有している。このＣＦＲＰ層５は、炭素繊維と樹脂とからなる複合材料であればよく、その複合材料中のカーボン繊維の含有率、構造（一方向材、クロス材）などは特に限定されるものではない。しかしながら、前述したように一方向材からなるプリプレグの成形板は、カーボン繊維と樹脂との界面で剥離し易いため、ＣＦＲＰ層５にはクロス材を用いる方が好ましい。またＣＦＲＰ層５は、１次貫通穴５ａを有している。導電層８は、ＣＦＲＰコアの１次貫通穴５ａの壁面およびＣＦＲＰ層５の表面の一部と側面とに形成されており、たとえば銅よりなっている。   The CFRP core is provided between a pair of upper and lower signal circuit layers 4a and 4b. The CFRP core has a CFRP layer 5 and a conductive layer 8. The CFRP layer 5 may be a composite material composed of carbon fibers and a resin, and the carbon fiber content, structure (unidirectional material, cloth material), etc. in the composite material are not particularly limited. However, as described above, since the prepreg molded plate made of a unidirectional material is easily peeled at the interface between the carbon fiber and the resin, it is preferable to use a cloth material for the CFRP layer 5. The CFRP layer 5 has a primary through hole 5a. The conductive layer 8 is formed on the wall surface of the primary through hole 5a of the CFRP core and a part of the surface and the side surface of the CFRP layer 5, and is made of, for example, copper.

接着部材６は、上下１対の信号回路層４ａ、４ｂの各々とＣＦＲＰコアとの間に形成され、上下１対の信号回路層４ａ、４ｂとＣＦＲＰコアとを接着している。この接着部材６は、ＣＦＲＰ層５の１次貫通穴５ａの壁面を導電層８を介して覆い、かつ１次貫通穴５ａ内を通る２次貫通穴１ａを有している。接着部材６は、たとえば無機フィラーと樹脂とガラスクロスとから構成され、１〜１５Ｗ／ｍ・Ｋの熱伝導率を有することが好ましい。ここで、樹脂は、エポキシ、ビスマレイミド、シアネートエステル、ポリイミドなどに、一部、ＣＴＢＮ(Carboxy-terminated butadiene-acrylonitrile)などゴム成分を混合して弾性率を低下させたものが好ましい。また、無機フィラーの例として、アルミナ、シリカ、マグネシア、窒化アルミニウム、窒化ホウ素、窒化ケイ素などの酸化物や窒化物が挙げられ、その混合物が用いられてもよい。接着部材６にフィラー含有樹脂を用いる理由としては、ＣＦＲＰコアと２次貫通穴１ａの側壁の第１の導電層２ｂとの間の応力緩和と良熱伝導化のためである。   The adhesive member 6 is formed between each of the upper and lower pair of signal circuit layers 4a and 4b and the CFRP core, and bonds the upper and lower pair of signal circuit layers 4a and 4b and the CFRP core. The adhesive member 6 has a secondary through hole 1a that covers the wall surface of the primary through hole 5a of the CFRP layer 5 via the conductive layer 8 and passes through the primary through hole 5a. The adhesive member 6 is made of, for example, an inorganic filler, a resin, and a glass cloth, and preferably has a thermal conductivity of 1 to 15 W / m · K. Here, the resin is preferably a resin whose elastic modulus is lowered by mixing a rubber component such as CTBN (Carboxy-terminated butadiene-acrylonitrile) in part with epoxy, bismaleimide, cyanate ester, polyimide or the like. Examples of the inorganic filler include oxides and nitrides such as alumina, silica, magnesia, aluminum nitride, boron nitride, and silicon nitride, and a mixture thereof may be used. The reason why the filler-containing resin is used for the adhesive member 6 is to relieve stress between the CFRP core and the first conductive layer 2b on the side wall of the secondary through hole 1a and to improve heat conductivity.

２次貫通穴１ａは、１次貫通穴５ａ内に設けられるので１次貫通穴５ａよりも小径であり、上下１対の信号回路層４ａ、４ｂの絶縁基材３にも開口されている。   Since the secondary through hole 1a is provided in the primary through hole 5a, it has a smaller diameter than the primary through hole 5a, and is also opened in the insulating base material 3 of the pair of upper and lower signal circuit layers 4a and 4b.

第１の導電層２ｂは、２次貫通穴１ａの壁面に形成されており、上下１対の信号回路層４ａ、４ｂの各信号配線２ａ同士を電気的に接続している。この第１の導電層２ｂはたとえば銅よりなっている。また第１の導電層２ｂとＣＦＲＰコアとは接着部材６によって電気的に絶縁されている。   The first conductive layer 2b is formed on the wall surface of the secondary through hole 1a, and electrically connects the signal wirings 2a of the pair of upper and lower signal circuit layers 4a and 4b. The first conductive layer 2b is made of, for example, copper. The first conductive layer 2b and the CFRP core are electrically insulated by the adhesive member 6.

被覆層２ｃ、６は、ＣＦＲＰコアの平面視における外周端縁を被覆している。具体的には、ＣＦＲＰコアの外周端縁５ｂは被覆層としての接着部材６により被覆されており、ＣＦＲＰコアの外周端縁５ｃは被覆層としての第２の導電層２ｃにより被覆されている。第２の導電層２ｃはたとえば銅よりなっており、第１の導電層２ｂと同一の材質よりなっている。   The coating layers 2c and 6 cover the outer peripheral edge in a plan view of the CFRP core. Specifically, the outer peripheral edge 5b of the CFRP core is covered with an adhesive member 6 as a covering layer, and the outer peripheral edge 5c of the CFRP core is covered with a second conductive layer 2c as a covering layer. The second conductive layer 2c is made of copper, for example, and is made of the same material as the first conductive layer 2b.

なお導電層２ａ、２ｂ、２ｃの表面には、はんだコート（図示せず）が形成されている。このはんだコートは、最終工程でたとえば２３５℃の温度で５秒間のはんだレベラー処理（つまり、はんだ浴に基板が沈められる処理）が行なわれることにより、第２の導電層２ｃの表面に形成されるものである。   A solder coat (not shown) is formed on the surfaces of the conductive layers 2a, 2b and 2c. This solder coat is formed on the surface of the second conductive layer 2c by performing a solder leveler process (that is, a process in which the substrate is submerged in a solder bath) at a temperature of, for example, 235 ° C. for 5 seconds in the final process. Is.

図２を参照して、ＣＦＲＰコアの外周端縁の全周は被覆層２ｃ、６により被覆されている。第２の導電層２ｃは、ＣＦＲＰコアの平面視における外周端縁５ｂ、５ｃのうち接着部材６により被覆されていない外周端縁５ｃを被覆している。   Referring to FIG. 2, the entire outer peripheral edge of the CFRP core is covered with coating layers 2 c and 6. The second conductive layer 2c covers the outer peripheral edge 5c that is not covered by the adhesive member 6 among the outer peripheral edges 5b and 5c in plan view of the CFRP core.

次に、本実施の形態のプリント配線板の製造方法について説明する。
図３〜図１２は本発明の実施の形態１におけるプリント配線板の製造方法を工程順に示す概略断面図である。また図１３〜図１７は本発明の実施の形態１におけるプリント配線板の製造方法を工程順に示す図２の断面と同一断面における概略断面図である。 Next, the manufacturing method of the printed wiring board of this Embodiment is demonstrated.
3 to 12 are schematic cross-sectional views showing the method of manufacturing the printed wiring board in Embodiment 1 of the present invention in the order of steps. 13 to 17 are schematic cross-sectional views in the same cross section as the cross section of FIG. 2 showing the method of manufacturing the printed wiring board in the first embodiment of the present invention in the order of steps.

図３を参照して、ＣＦＲＰ層５の両面に、たとえば銅よりなる導電層８が張られたＣＦＲＰコアが準備される。   Referring to FIG. 3, a CFRP core in which conductive layer 8 made of, for example, copper is stretched on both surfaces of CFRP layer 5 is prepared.

図４および図１３を参照して、ＣＦＲＰコアに１次貫通穴５ａ、５ｂが同一の工程で形成される。１次貫通穴５ｂは、平面視において、たとえばＣＦＲＰコアの製品部５１と支持部５２とを繋ぐ連結部５３を残して製品部５１の周りを取り囲むように形成される。また１次貫通穴５ａは製品部５１に形成される。   4 and 13, primary through holes 5a and 5b are formed in the CFRP core in the same process. The primary through hole 5b is formed so as to surround the product part 51 in a plan view, for example, leaving a connecting part 53 that connects the product part 51 and the support part 52 of the CFRP core. The primary through hole 5 a is formed in the product part 51.

なお図１３は１次貫通穴５ｂと連結部５３とが１個ずつ形成された状態について示しているが、１次貫通穴５ｂは複数個に分割されて製品部５１の周りを取り囲んでいてもよく、この場合には連結部５３も複数個必要となる。また図１３は１次貫通穴５ａが製品部５１に１個形成された状態について示しているが、１次貫通穴５ａは製品部５１に複数個形成されていてもよい。   Although FIG. 13 shows a state in which one primary through hole 5b and one connecting portion 53 are formed, the primary through hole 5b may be divided into a plurality of parts and surround the product portion 51. In this case, a plurality of connecting portions 53 are also required. FIG. 13 shows a state where one primary through hole 5 a is formed in the product part 51, but a plurality of primary through holes 5 a may be formed in the product part 51.

図５を参照して、ＣＦＲＰコアに銅めっきが行なわれる。これにより、１次貫通穴５ａ、５ｂの各々の壁面が銅めっきよりなる導電層８で被覆され、これによりカーボン粉の脱落が防止される。   Referring to FIG. 5, copper plating is performed on the CFRP core. Thereby, each wall surface of primary through-hole 5a, 5b is coat | covered with the conductive layer 8 which consists of copper plating, and, thereby, drop-off | omission of carbon powder is prevented.

図６を参照して、導電層８がパターニングされ、導電層８の不要な部分が除去される。
図７および図１４を参照して、たとえば半硬化状態の無機フィラー含有樹脂シートよりなる接着部材６が準備され、真空ラミネートによりＣＦＲＰコアの表裏両面に張り合わせられる。このとき、１次貫通穴５ａ、５ｂは接着部材６で充填される。 Referring to FIG. 6, conductive layer 8 is patterned, and unnecessary portions of conductive layer 8 are removed.
Referring to FIGS. 7 and 14, for example, an adhesive member 6 made of a semi-cured inorganic filler-containing resin sheet is prepared and bonded to both the front and back surfaces of the CFRP core by vacuum lamination. At this time, the primary through holes 5 a and 5 b are filled with the adhesive member 6.

図８を参照して、ＣＦＲＰコアの両面に接着部材６を介して、たとえば未硬化の絶縁プリプレグよりなる絶縁基材３が貼り付けられる。   Referring to FIG. 8, insulating base material 3 made of, for example, an uncured insulating prepreg is attached to both surfaces of the CFRP core via adhesive member 6.

図９を参照して、たとえば銅箔よりなる導電層２が絶縁基材３の表面に貼り付けられるとともに、真空プレスを用いて所定の条件で加圧加熱が施される。   Referring to FIG. 9, conductive layer 2 made of, for example, copper foil is attached to the surface of insulating base material 3, and is heated under a predetermined condition using a vacuum press.

図１０および図１５を参照して、２次貫通穴１ａ、１ｂが同一の工程で形成される。２次貫通穴１ａは１次貫通穴５ａ内を通るように１次貫通穴５ａと同軸上に導電層２、絶縁基材３および接着部材６の各々を貫通して形成される。また２次貫通穴１ｂは連結部５３を跨いで１次貫通穴５ｂの端部同士を接続するように導電層２、絶縁基材３、接着部材６およびＣＦＲＰコアの各々を貫通して形成される。この２次貫通穴１ｂの壁面においては、ＣＦＲＰ層５が露出する。   Referring to FIGS. 10 and 15, secondary through holes 1a and 1b are formed in the same process. The secondary through hole 1a is formed through the conductive layer 2, the insulating base material 3 and the adhesive member 6 coaxially with the primary through hole 5a so as to pass through the primary through hole 5a. The secondary through hole 1b is formed through the conductive layer 2, the insulating base 3, the adhesive member 6 and the CFRP core so as to connect the end portions of the primary through hole 5b across the connecting portion 53. The The CFRP layer 5 is exposed on the wall surface of the secondary through hole 1b.

図１１および図１６を参照して、銅めっきが行なわれ、２次貫通穴１ａの壁面全面に銅めっきよりなる導電層２ｂが形成され、２次貫通穴１ｂの壁面全面に銅めっきよりなる導電層２ｃが形成される。これによりＣＦＲＰコアの表裏両面に形成された導電層２ａが導電層２ｂ、２ｃにより電気的に接続されるとともに、２次貫通穴１ｂの壁面において露出していたＣＦＲＰ層５が導電層２ｃにより被覆される。   Referring to FIGS. 11 and 16, copper plating is performed, conductive layer 2b made of copper plating is formed on the entire wall surface of secondary through hole 1a, and conductive film made of copper plating is formed on the entire wall surface of secondary through hole 1b. Layer 2c is formed. As a result, the conductive layers 2a formed on the front and back surfaces of the CFRP core are electrically connected by the conductive layers 2b and 2c, and the CFRP layer 5 exposed on the wall surface of the secondary through hole 1b is covered by the conductive layer 2c. Is done.

図１２および図１７を参照して、導電層２ａのパターニングが行なわれる。これにより、導電層２ａから所定のパターン形状を有する信号配線２ａが形成される。この後、ソルダーレジスト塗工、ガスレベラー処理によるはんだコートが行なわれた後に、外形加工が行なわれる。この外形加工は、図中破線の外形加工線で示すように、製品部５１と支持部５２との間の接着部材６（つまり１次貫通穴５ｂ内の接着部材６）と２次貫通穴１ｂとの部分をルータ加工で切断しくり抜くことにより行なわれる。これにより、支持部５２から製品部５１が切り取られて、図１および図２に示す本実施の形態のプリント配線板１が製造される。   Referring to FIGS. 12 and 17, patterning of conductive layer 2a is performed. Thereby, the signal wiring 2a having a predetermined pattern shape is formed from the conductive layer 2a. Thereafter, the outer shape processing is performed after solder resist coating and solder coating by gas leveler processing are performed. As shown by the outline processing line indicated by a broken line in the figure, the outer shape processing is performed by using the adhesive member 6 between the product portion 51 and the support portion 52 (that is, the adhesive member 6 in the primary through hole 5b) and the secondary through hole 1b. This is done by cutting and cutting the part with router processing. Thereby, the product part 51 is cut out from the support part 52, and the printed wiring board 1 of this Embodiment shown in FIG. 1 and FIG. 2 is manufactured.

本実施の形態のプリント配線板１によれば、図１および図２に示すようにＣＦＲＰコアの外周端縁５ｂ、５ｃが被覆層（第２の導電層２ｃ、接着部材６）により被覆されているため、ＣＦＲＰ層５からのカーボン粉の脱落はなく、ヒートサイクル試験でＣＦＲＰ層５が剥離することもない。   According to the printed wiring board 1 of the present embodiment, as shown in FIGS. 1 and 2, the outer peripheral edges 5b and 5c of the CFRP core are covered with the covering layer (the second conductive layer 2c and the adhesive member 6). Therefore, the carbon powder does not fall off from the CFRP layer 5, and the CFRP layer 5 does not peel off in the heat cycle test.

またＣＦＲＰコアの外周端縁５ｂ、５ｃの全周を接着部材６で被覆できない理由としては、図１および図２に示す製品のサイズよりも基板製造時のサイズ（ワークサイズ）が大きくなるためである。また製品のサイズよりもワークサイズが大きくなる理由は、ワークの外周部分（製品部５１よりも外周の部分）には位置決め穴などの製品には残らない製造過程において必要なものを配置する必要があるためである。   The reason why the entire circumference of the outer peripheral edges 5b and 5c of the CFRP core cannot be covered with the adhesive member 6 is that the size (workpiece size) at the time of manufacturing the substrate is larger than the size of the product shown in FIGS. is there. The reason why the workpiece size becomes larger than the size of the product is that the outer peripheral portion of the workpiece (the outer peripheral portion of the product portion 51) needs to be arranged in the manufacturing process that does not remain in the product, such as positioning holes. Because there is.

このように製品のサイズよりもワークサイズが大きくなるために、図１７に示すように製品部５１をその外周の支持部５２から切り離す必要がある。ここで、仮に１次貫通穴５ｂが製品部５１の外周全周を途切れることなく連続的に取り囲む場合には、製品部５１と支持部５２とが完全に分離して、製造途中においてワークから製品部５１が抜け落ちてしまい、通常の基板製造設備ではプリント配線板１の製造は困難となる。   Since the workpiece size is larger than the product size in this way, it is necessary to separate the product portion 51 from the outer peripheral support portion 52 as shown in FIG. Here, if the primary through hole 5b continuously surrounds the entire outer periphery of the product part 51 without being interrupted, the product part 51 and the support part 52 are completely separated, and the product is removed from the workpiece in the course of manufacture. The part 51 falls off, and it becomes difficult to manufacture the printed wiring board 1 with normal board manufacturing equipment.

そこで、製品部５１と支持部５２とを連結するための連結部５３を一部に残す必要がある。しかし、連結部５３を残した場合、製品部５１を支持部５２から切り離す際に、連結部５３などのＣＦＲＰコアを切断する必要が生じる。このＣＦＲＰコアの連結部５３などの切断面は接着部材６により被覆されていないため、ＣＦＲＰコアの外周端縁の全周を接着部材６で被覆することができないのである。   Therefore, it is necessary to leave a connection part 53 for connecting the product part 51 and the support part 52 in part. However, when the connection part 53 is left, when the product part 51 is separated from the support part 52, it is necessary to cut the CFRP core such as the connection part 53. Since the cut surface of the CFRP core connecting portion 53 or the like is not covered with the adhesive member 6, the entire periphery of the outer peripheral edge of the CFRP core cannot be covered with the adhesive member 6.

本実施の形態の製造方法においては、図１３に示すように１次貫通穴５ｂを連結部５３を残して製品部５１を取り囲むように形成することで、製造途中において製品部５１がワークから抜け落ちることが防止されている。また図１４に示すように、１次貫通穴５ｂ内を接着部材６で埋め込むことにより、ＣＦＲＰコアの外周端縁５ｂを接着部材６で被覆することができる。   In the manufacturing method of the present embodiment, as shown in FIG. 13, the primary through hole 5b is formed so as to surround the product part 51 while leaving the connecting part 53, so that the product part 51 falls off from the workpiece during the manufacturing. It is prevented. Further, as shown in FIG. 14, the outer peripheral edge 5 b of the CFRP core can be covered with the adhesive member 6 by embedding the primary through hole 5 b with the adhesive member 6.

また図１５に示すように、１次貫通穴５ｂ内を接着部材６で埋め込んだ状態で連結部５３を跨ぐように２次貫通穴１ｂが形成されるため、この２次貫通穴１ｂが１次貫通穴５ｂの端部同士を接続するように形成されても、製品部５１がワークから抜け落ちることが防止される。   Further, as shown in FIG. 15, since the secondary through hole 1b is formed so as to straddle the connecting portion 53 in a state where the primary through hole 5b is buried with the adhesive member 6, the secondary through hole 1b is formed into the primary through hole 1b. Even if the end portions of the through holes 5b are formed so as to be connected to each other, the product portion 51 is prevented from falling off the workpiece.

また図１６に示すように、２次貫通穴１ａと１ｂとの双方の壁面に同一の工程で導電層２ｂ、２ｃが形成されるため、被覆層としての導電層２ｃを導電層２ｂと別個の工程で形成する必要がなく、工程を簡略化することができる。また２次貫通穴１ｂの壁面に被覆層としての導電層２ｃが形成されるため、２次貫通穴１ｂの壁面にて露出していたＣＦＲＰ層５の外周端縁５ｃを導電層２ｃで被覆することができる。これにより、ＣＦＲＰ層５からのカーボン粉の脱落、ヒートサイクル試験におけるＣＦＲＰ層５の剥離を防止することができる。   Further, as shown in FIG. 16, since the conductive layers 2b and 2c are formed in the same process on the wall surfaces of both the secondary through holes 1a and 1b, the conductive layer 2c as the covering layer is separated from the conductive layer 2b. It is not necessary to form in the process, and the process can be simplified. Further, since the conductive layer 2c as a covering layer is formed on the wall surface of the secondary through hole 1b, the outer peripheral edge 5c of the CFRP layer 5 exposed on the wall surface of the secondary through hole 1b is covered with the conductive layer 2c. be able to. Thereby, it is possible to prevent the carbon powder from falling off the CFRP layer 5 and peeling of the CFRP layer 5 in the heat cycle test.

また図１７に示す工程における上記のガスレベラー処理によるはんだコート前に切り穴を形成することで、導電層２ｃの露出を防ぐことが可能である。以下、そのことを説明する。   Moreover, it is possible to prevent the conductive layer 2c from being exposed by forming a cut hole before the solder coating by the gas leveler process in the step shown in FIG. This will be described below.

図１８は、図１７の領域Ｐを拡大して示す拡大図である。図１８を参照して、ガスレベラー処理によるはんだコートが施されると、導電層２ａ、２ｂ、２ｃの表面にはんだがコーティングされる。このため、このはんだコート直後の状態においては、導電層２ａ、２ｂ、２ｃの表面は露出していない。しかし、この後に、図中破線で示す外形加工線に沿って切断すると、図１９に示すように導電層２ｃの切断面において銅が外部に露出する。   FIG. 18 is an enlarged view showing a region P in FIG. 17 in an enlarged manner. Referring to FIG. 18, when the solder coating is performed by the gas leveler process, the surface of conductive layers 2a, 2b, and 2c is coated with solder. For this reason, in the state immediately after this solder coating, the surfaces of the conductive layers 2a, 2b and 2c are not exposed. However, after this, when cutting along the outline processing line indicated by a broken line in the drawing, copper is exposed to the outside at the cut surface of the conductive layer 2c as shown in FIG.

一方、図１８に示す領域Ｒに切り穴を形成した後にガスレベラー処理によるはんだコートが施されると、図２０に示すように外形加工線に沿って切断した後も、導電層２ｃの銅が外部に露出することはない。このようにガスレベラー処理によるはんだコート前に切り穴を形成することで、導電層２ｃの露出を防ぐことが可能となり、導電層２ｃにはんだによる防錆処理が可能となる。   On the other hand, when solder coating is performed by gas leveler processing after forming a cut hole in the region R shown in FIG. 18, the copper of the conductive layer 2 c remains even after cutting along the outline processing line as shown in FIG. 20. There is no external exposure. Thus, by forming the cut hole before the solder coating by the gas leveler process, it is possible to prevent the conductive layer 2c from being exposed, and the conductive layer 2c can be subjected to a rust preventive process using solder.

またプリント配線板１の側面の補強と放熱性をさらに向上させるために、銅めっきにより表裏パターンが接続されるとともに、その表裏パターンを短絡するためのスルーホールが設けられてもよい。以下、その構成について説明する。   Further, in order to further improve the side surface reinforcement and heat dissipation of the printed wiring board 1, the front and back patterns may be connected by copper plating, and through holes for short-circuiting the front and back patterns may be provided. Hereinafter, the configuration will be described.

図２３は、本発明の実施の形態１におけるプリント配線板の構成を概略的に示す斜視図である。図２４は図２３のＸＸＩＶ−ＸＸＩＶ線に沿う概略断面図である。   FIG. 23 is a perspective view schematically showing the configuration of the printed wiring board according to Embodiment 1 of the present invention. 24 is a schematic sectional view taken along line XXIV-XXIV in FIG.

図２３および図２４を参照して、プリント配線板１の外周端縁付近には、ＣＦＲＰコア５の表面側には接着部材６および絶縁基板３を介して表面側導電パターン２ａ1が形成されており、ＣＦＲＰコア５の裏面側には接着部材６および絶縁基板３を介して裏面側導電パターン２ａ2が形成されている。これらの表面側導電パターン２ａ1と裏面側導電パターン２ａ2との双方は、たとえば銅めっきにより形成された導電材料よりなっている。 Referring to FIGS. 23 and 24, surface side conductive pattern 2a 1 is formed near the outer peripheral edge of printed wiring board 1 on the surface side of CFRP core 5 with adhesive member 6 and insulating substrate 3 interposed therebetween. A back side conductive pattern 2 a 2 is formed on the back side of the CFRP core 5 with the adhesive member 6 and the insulating substrate 3 interposed therebetween. Both the front surface side conductive pattern 2a 1 and the back surface side conductive pattern 2a 2 are made of a conductive material formed by, for example, copper plating.

ＣＦＲＰコア５の外周端縁５ｃは被覆層としての第２の導電層２ｃにより被覆されており、その第２の導電層２ｃによって表面側導電パターン２ａ1と裏面側導電パターン２ａ2とが電気的に接続されている。この第２の導電層２ｃは、たとえば銅めっきにより形成された導電材料よりなっている。第２の導電層２ｃはＣＦＲＰコア５に接しており、ＣＦＲＰコア５と電気的に短絡している。 The outer peripheral edge 5c of the CFRP core 5 is covered with a second conductive layer 2c as a covering layer, and the front side conductive pattern 2a 1 and the back side conductive pattern 2a 2 are electrically connected by the second conductive layer 2c. It is connected to the. The second conductive layer 2c is made of a conductive material formed by, for example, copper plating. The second conductive layer 2 c is in contact with the CFRP core 5 and is electrically short-circuited with the CFRP core 5.

また表面側導電パターン２ａ1、裏面側導電パターン２ａ2、絶縁基板３、ＣＦＲＰコア５、接着部材６などを貫通する短絡スルーホール１ｃが形成されている。この短絡スルーホール１ｃの壁面には、ＣＦＲＰコア５の露出面を覆うように第３の導電層２ｄが形成されている。第３の導電層２ｄは、たとえば銅めっきにより形成された導電材料よりなっている。第３の導電層２ｄはＣＦＲＰコア５に接しており、ＣＦＲＰコア５と電気的に短絡している。 Further, a short-circuit through hole 1c penetrating through the front surface side conductive pattern 2a 1 , the back surface side conductive pattern 2a 2 , the insulating substrate 3, the CFRP core 5 and the adhesive member 6 is formed. A third conductive layer 2d is formed on the wall surface of the short-circuit through hole 1c so as to cover the exposed surface of the CFRP core 5. Third conductive layer 2d is made of a conductive material formed by, for example, copper plating. The third conductive layer 2 d is in contact with the CFRP core 5 and is electrically short-circuited with the CFRP core 5.

このようにＣＦＲＰコア５に接するように第２の導電層２ｃおよび第３の導電層２ｄが形成されており、さらに第２の導電層２ｃおよび第３の導電層２ｄの各々が表面側導電パターン２ａ1および裏面側導電パターン２ａ2の双方に接しているため、プリント配線板１の側面の補強と放熱性をさらに向上させることができる。 Thus, the second conductive layer 2c and the third conductive layer 2d are formed so as to be in contact with the CFRP core 5, and each of the second conductive layer 2c and the third conductive layer 2d is a surface-side conductive pattern. Since it is in contact with both 2a 1 and the back surface side conductive pattern 2a 2 , the side surface reinforcement and heat dissipation of the printed wiring board 1 can be further improved.

なお図２４に示すように、導電層２ａ〜２ｄ、２ａ1および２ａ2の各々の表面ははんだコートされており、各表面にはんだ３１が形成されている。また図２４において図１の要素と対応する要素には図１に示す符号と同一の符号を付している。 Incidentally, as shown in FIG. 24, the conductive layer 2 a to 2 d, each of the surface of the 2a 1 and 2a 2 are solder coated, and solder 31 is formed on each surface. In FIG. 24, elements corresponding to those in FIG. 1 are denoted by the same reference numerals as those in FIG.

また図２５に示すように上記スルーホール１ｃを設けたことにより、そのスルーホール１ｃにねじ４２を差し込むことによりプリント配線板１を筐体４１に取り付けることができる。これにより、表面側導電パターン２ａ1と裏面側導電パターン２ａ2とのいずれかをはんだ３１を介して筐体４１に接続させることができるため、プリント配線板１から筐体４１への放熱性を高めることが可能となる。 Further, by providing the through hole 1c as shown in FIG. 25, the printed wiring board 1 can be attached to the housing 41 by inserting a screw 42 into the through hole 1c. Thereby, since either the front surface side conductive pattern 2a 1 or the back surface side conductive pattern 2a 2 can be connected to the housing 41 via the solder 31, heat dissipation from the printed wiring board 1 to the housing 41 is improved. It becomes possible to raise.

またサイズ的な問題でＣＦＲＰコア５の外周端縁を第２の導電層２ｃまたは接着部材６により被覆できない箇所が生じる場合には、図２６に示すように、その箇所においてＣＦＲＰコア５の外周端縁が樹脂層３２により被覆されてもよい。樹脂層３２はＣＦＲＰコア５の露出部分だけを被覆すればよいが、製造上、その部分だけに塗るのは困難であるため、プリント配線板１の表裏面全体にわたって塗られている。   Further, when there is a portion where the outer peripheral edge of the CFRP core 5 cannot be covered with the second conductive layer 2c or the adhesive member 6 due to a size problem, as shown in FIG. The edge may be covered with the resin layer 32. The resin layer 32 only needs to cover only the exposed portion of the CFRP core 5, but it is difficult to apply only to that portion in manufacturing, so it is applied over the entire front and back surfaces of the printed wiring board 1.

この樹脂層３２は、たとえばエポキシ樹脂であり、プリント配線板１の製造方法の最終工程で被覆される。また樹脂層３２の材質は、エポキシ樹脂に限定されず、接着性、耐熱性などが必要なことから基板材料に用いられている熱硬化系の樹脂が好ましく、たとえばポリイミド樹脂、ビスマレイミドトリアジン樹脂、ポリフェニレンオキサイド樹脂、ポリフェニレンエーテル樹脂などであってもよい。   This resin layer 32 is, for example, an epoxy resin and is covered in the final step of the method for manufacturing the printed wiring board 1. The material of the resin layer 32 is not limited to an epoxy resin, and is preferably a thermosetting resin used for a substrate material because it requires adhesion, heat resistance, and the like. For example, a polyimide resin, a bismaleimide triazine resin, Polyphenylene oxide resin, polyphenylene ether resin and the like may be used.

このようにサイズ的な問題で第２の導電層２ｃおよび接着部材６により被覆できないＣＦＲＰコア５の外周端縁を樹脂層３２により被覆できるため、ＣＦＲＰコア５からのカーボン粉の脱落を防止することができる。   Thus, since the outer peripheral edge of the CFRP core 5 that cannot be covered with the second conductive layer 2c and the adhesive member 6 due to the size problem can be covered with the resin layer 32, it is possible to prevent the carbon powder from falling off the CFRP core 5. Can do.

なお図２６は図２３のＸＸＶＩ−ＸＸＶＩ線に沿う概略断面図であり、図２６において図１の要素と対応する要素には図１に示す符号と同一の符号を付している。   26 is a schematic sectional view taken along line XXVI-XXVI in FIG. 23. In FIG. 26, elements corresponding to those in FIG. 1 are denoted by the same reference numerals as those in FIG.

（実施の形態２）
実施の形態１では、図８に示す積層体１０が形成された後、図９に示すようにその積層体の上下に銅箔２ａを置いて積層した場合について説明した。これに対して、本実施の形態では、図８に示す積層体１０を用いて４層板のプリント配線板が製造される。以下、そのことについて説明する。 (Embodiment 2)
In Embodiment 1, the case where the laminated body 10 shown in FIG. 8 is formed and then the copper foils 2a are placed on the upper and lower sides of the laminated body as shown in FIG. 9 has been described. In contrast, in the present embodiment, a four-layer printed wiring board is manufactured using the laminate 10 shown in FIG. This will be described below.

図２１は、本発明の実施の形態２におけるプリント配線板の製造方法を示す概略断面図である。図２１を参照して、図８に示す積層板１０が２つ準備される。これら２つの積層板１０の中央に、ガラスエポキシプリプレグ１４を介して内層信号回路層１３が配置され、また２つの積層板１０の内層信号回路層１３とは反対側にたとえば銅箔よりなる導電層２ａが配置される。この配置状態で、たとえば真空プレスを用いた加圧加熱が施される。その後、図１０〜図１２および図１５〜図１７に示す実施の形態１と同様の工程を経ることにより図２２に示すような４層板が得られる。   FIG. 21 is a schematic cross-sectional view showing the method for manufacturing the printed wiring board according to Embodiment 2 of the present invention. Referring to FIG. 21, two laminates 10 shown in FIG. 8 are prepared. An inner signal circuit layer 13 is disposed in the center of these two laminated plates 10 via a glass epoxy prepreg 14, and a conductive layer made of copper foil, for example, on the opposite side of the two laminated plates 10 from the inner signal circuit layer 13. 2a is arranged. In this arrangement state, for example, pressure heating using a vacuum press is performed. Thereafter, a four-layer plate as shown in FIG. 22 is obtained through the same steps as those in the first embodiment shown in FIGS. 10 to 12 and 15 to 17.

なお、上記において内層信号回路層１３は、絶縁基材１２と、その絶縁基材１２の表面上に形成された信号配線１１とを有している。絶縁基材１２は、たとえばガラスクロスにエポキシ樹脂などを含浸したプリプレグを硬化した材質よりなっている。信号配線２ａは、たとえば銅よりなっている。   In the above description, the inner signal circuit layer 13 includes the insulating base 12 and the signal wiring 11 formed on the surface of the insulating base 12. The insulating base 12 is made of, for example, a material obtained by curing a prepreg in which a glass cloth is impregnated with an epoxy resin or the like. The signal wiring 2a is made of, for example, copper.

図２２を参照して、上記のようにして得られた４層板の構成においては、上下の接着部材６間に、パターニングされた複数層（たとえば２層）の信号配線１１が形成されている。これら複数の信号配線１１の各々は他の信号配線とガラスエポキシなどの絶縁層２１により電気的に絶縁されている。   Referring to FIG. 22, in the configuration of the four-layer board obtained as described above, a plurality of (for example, two-layer) patterned signal wirings 11 are formed between upper and lower adhesive members 6. . Each of the plurality of signal wirings 11 is electrically insulated from other signal wirings by an insulating layer 21 such as glass epoxy.

また本実施の形態の４層板の構成は、図１に示す実施の形態１の構成と同様、被覆層２ｃ、６が、ＣＦＲＰコアの平面視における外周端縁５ｂ、５ｃを被覆している。具体的には、ＣＦＲＰコアの外周端縁５ｂは被覆層としての接着部材６により被覆されており、ＣＦＲＰコアの外周端縁５ｃは被覆層としての第２の導電層２ｃにより被覆されている。第２の導電層２ｃはたとえば銅よりなっており、第１の導電層２ｂと同一の材質よりなっている。   Further, in the configuration of the four-layer plate of the present embodiment, the coating layers 2c and 6 cover the outer peripheral edges 5b and 5c in a plan view of the CFRP core, as in the configuration of the first embodiment shown in FIG. . Specifically, the outer peripheral edge 5b of the CFRP core is covered with an adhesive member 6 as a covering layer, and the outer peripheral edge 5c of the CFRP core is covered with a second conductive layer 2c as a covering layer. The second conductive layer 2c is made of copper, for example, and is made of the same material as the first conductive layer 2b.

また図２２におけるＩＩ−ＩＩ線に沿う断面の構造は、図２の構成をほぼ同じである。つまり、図２を参照して、ＣＦＲＰコアの外周端縁の全周は被覆層２ｃ、６により被覆されている。第２の導電層２ｃは、ＣＦＲＰコアの平面視における外周端縁５ｂ、５ｃのうち接着部材６により被覆されていない外周端縁５ｃを被覆している。   Moreover, the structure of the cross section along the II-II line in FIG. 22 is substantially the same as the structure of FIG. That is, referring to FIG. 2, the entire outer periphery of the CFRP core is covered with the coating layers 2 c and 6. The second conductive layer 2c covers the outer peripheral edge 5c that is not covered by the adhesive member 6 among the outer peripheral edges 5b and 5c in plan view of the CFRP core.

なお上記以外の本実施の形態の構成は実施の形態１の構成とほぼ同じであるため、同一の要素については同一の符号を付し、その説明を省略する。   Since the configuration of the present embodiment other than the above is substantially the same as the configuration of the first embodiment, the same elements are denoted by the same reference numerals and the description thereof is omitted.

本実施の形態においても、実施の形態１と同様の作用効果を得ることができる。   Also in the present embodiment, the same operational effects as in the first embodiment can be obtained.

以下に実施例を示し、さらに詳しく説明する。
（実施例１）
まず、熱伝導率が５００Ｗ／ｍ・Ｋのカーボン繊維（クロス材）からなるプリプレグ５（ＣＦＲＰ層５）を１８μｍの厚みの銅箔８と積層したＣＦＲＰコア（厚み０．３５ｍｍ、サイズ３４０ｍｍ×２５０ｍｍ）を準備した（図３参照）。 Hereinafter, examples will be shown and described in more detail.
Example 1
First, a CFRP core (thickness 0.35 mm, size 340 mm × 250 mm) in which a prepreg 5 (CFRP layer 5) made of carbon fiber (cross material) having a thermal conductivity of 500 W / m · K and a copper foil 8 having a thickness of 18 μm is laminated. ) Was prepared (see FIG. 3).

次に、ＣＦＲＰコアにドリル穴あけを行ない、直径１．５ｍｍの１次貫通穴５ａと幅４ｍｍの長穴の１次貫通穴５ｂとを設けた（図４参照）。このとき、１次貫通穴５ａ、５ｂの壁面からは、カーボン粉が発生する。次に、銅めっきを行なった（図５参照）。このようにすることで１次貫通穴５ａ、５ｂの双方の壁面に銅めっき８が形成され、この壁面からのカーボン粉の飛散を防止できる。   Next, a drill hole was drilled in the CFRP core to provide a primary through hole 5a having a diameter of 1.5 mm and an elongated primary through hole 5b having a width of 4 mm (see FIG. 4). At this time, carbon powder is generated from the wall surfaces of the primary through holes 5a and 5b. Next, copper plating was performed (see FIG. 5). By doing in this way, the copper plating 8 is formed in the wall surface of both the primary through-holes 5a and 5b, and the scattering of the carbon powder from this wall surface can be prevented.

次に、不要な部分の銅８をパターニングにより除去した（図６参照）。これにより、ＣＦＲＰ層５の表面から銅がなくなり、ＣＦＲＰ層５の表面が露出する。しかし、銅８から露出したＣＦＲＰ層５の表面においては、ＣＦＲＰ層５を構成するＣＦＲＰプリプレグの樹脂が露出しており、ＣＦＲＰプリプレグの炭素繊維が露出していないため、カーボン粉は発生しない。また、不要な部分の銅８を除去する目的は、応力緩和と軽量化である。ＣＦＲＰ層５の熱膨張率は±２ｐｐｍ／℃と低く、銅８（熱膨張率１６ｐｐｍ／℃）をＣＦＲＰ層５の全面に設けると、熱膨張差による応力が発生し、製品のヒートサイクル試験でＣＦＲＰ層５と銅８との界面で剥離することがある。   Next, unnecessary portions of copper 8 were removed by patterning (see FIG. 6). Thereby, copper disappears from the surface of the CFRP layer 5, and the surface of the CFRP layer 5 is exposed. However, since the CFRP prepreg resin constituting the CFRP layer 5 is exposed on the surface of the CFRP layer 5 exposed from the copper 8, and the carbon fiber of the CFRP prepreg is not exposed, no carbon powder is generated. The purpose of removing unnecessary portions of copper 8 is to relieve stress and reduce weight. The thermal expansion coefficient of the CFRP layer 5 is as low as ± 2 ppm / ° C. When copper 8 (coefficient of thermal expansion 16 ppm / ° C.) is provided on the entire surface of the CFRP layer 5, stress due to the thermal expansion difference is generated, and the product heat cycle test There are cases where peeling occurs at the interface between the CFRP layer 5 and the copper 8.

次に、離型フィルムが表裏に貼られた半硬化状態の高熱伝導樹脂シート６（厚み１２０μｍ）を準備した。この高熱伝導樹脂は、アルミナフィラーとＣＴＢＮを混合したエポキシ樹脂からなり、硬化後の特性は、熱伝導率が３Ｗ／ｍ・Ｋ、弾性率が１９ＧＰａ、熱膨張率が２７ｐｐｍ／℃であり、通常樹脂に比べて低熱膨張、低弾性の樹脂である。   Next, a semi-cured high thermal conductive resin sheet 6 (thickness 120 μm) in which release films were attached to the front and back sides was prepared. This high thermal conductive resin is made of an epoxy resin in which an alumina filler and CTBN are mixed, and after curing, the thermal conductivity is 3 W / m · K, the elastic modulus is 19 GPa, and the thermal expansion coefficient is 27 ppm / ° C. Compared to resin, it has low thermal expansion and low elasticity.

次に、片面の離型フィルムを剥がし、ステンレス製の平滑板とともに真空ラミネートした（図７参照）。このラミネート後、表面の離型フィルムを剥がした。   Next, the release film on one side was peeled off and vacuum laminated with a stainless steel smooth plate (see FIG. 7). After this lamination, the release film on the surface was peeled off.

これを２回繰り返し、ＣＦＲＰコアの表裏に２４０μｍずつ、高熱伝導樹脂シート６を張り合わせた。このとき、１次貫通穴５ａ、５ｂを、できるだけ高熱伝導樹脂シート６で充填した。真空ラミネートは、１５０℃で１ｍｉｎ真空引きした後、１０ｋｇ／ｃｍ2で２ｍｉｎ加圧することにより行なった。 This was repeated twice, and the high thermal conductive resin sheet 6 was bonded to the front and back of the CFRP core by 240 μm. At this time, the primary through holes 5a and 5b were filled with the high thermal conductive resin sheet 6 as much as possible. The vacuum lamination was performed by evacuating at 150 ° C. for 1 min and then applying pressure at 10 kg / cm 2 for 2 min.

次に、６０μｍのガラスエポキシプリプレグ３を準備した。プリプレグ３には、通常プリプレグよりも低熱膨張のもので、日立化成工業株式会社製：ＧＥＡ−６７９Ｎ（ＬＤ）、熱膨張率８〜１２ｐｐｍ／℃のものを使用した。   Next, a 60 μm glass epoxy prepreg 3 was prepared. As the prepreg 3, a material having a lower thermal expansion than that of a normal prepreg, Hitachi Chemical Co., Ltd .: GEA-679N (LD), having a thermal expansion coefficient of 8 to 12 ppm / ° C. was used.

プリプレグ３を高熱伝導樹脂シート６の表裏両面に、真空ラミネートした（図８参照）。真空ラミネートは、１００℃で３０ｓ真空引きした後、１０ｋｇ／ｃｍ2で３０ｓ加圧することにより行なった。 The prepreg 3 was vacuum laminated on both the front and back surfaces of the high thermal conductive resin sheet 6 (see FIG. 8). Vacuum lamination was performed by evacuating at 100 ° C. for 30 s and then applying pressure at 10 kg / cm 2 for 30 s.

次に１８μｍの厚みの銅箔２ａとともに、真空プレスを用いて昇温速度５℃／ｍｉｎ、保持時間１９０℃／１ｈ、積層圧力３０ｋｇ／ｃｍ2の条件で加圧加熱することで積層板を得た（図９参照）。 Next, together with the copper foil 2a having a thickness of 18 μm, a laminated plate is obtained by pressurizing and heating using a vacuum press under the conditions of a heating rate of 5 ° C./min, a holding time of 190 ° C./1 h, and a lamination pressure of 30 kg / cm 2 (See FIG. 9).

次に、直径１．５ｍｍの１次貫通穴５ａと同軸上に、直径０．９ｍｍの２次貫通穴１ａを設けた（図１０参照）。また、このとき図１５に示すように、ＣＦＲＰコアに設けた長穴５ｂと重なるように、幅４ｍｍの長穴の貫通穴１ｂを形成した（図１０参照）。また、このとき図２４に示すように直径５ｍｍの短絡スルーホール１ｃを形成した。   Next, a secondary through hole 1a having a diameter of 0.9 mm was provided coaxially with the primary through hole 5a having a diameter of 1.5 mm (see FIG. 10). Further, at this time, as shown in FIG. 15, an elongated through-hole 1 b having a width of 4 mm was formed so as to overlap with the elongated hole 5 b provided in the CFRP core (see FIG. 10). At this time, as shown in FIG. 24, a short-circuit through hole 1c having a diameter of 5 mm was formed.

次に、銅めっきを行なって、２次貫通穴１ａと貫通穴１ｂと短絡スルーホール１ｃとの各壁面に銅層２ｂ、２ｃ、２ｄを形成した（図１１、図２４参照）。次に、図１８に示す領域Ｒに切り穴として直径３ｍｍの貫通穴を形成した。次に、銅箔２ａのパターニングを行なった（図１２、図２４参照）。このパターニングの際には、銅層２ｂ、２ｃとつながるように銅箔２ａを残した。また図２４に示すように短絡スルーホール１ｃの壁面の銅層２ｄにより表面側導電パターン２ａ1と裏面側導電パターン２ａ2とが短絡するように銅箔２ａ1、２ａ2を残した。 Next, copper plating was performed to form copper layers 2b, 2c, and 2d on the respective wall surfaces of the secondary through hole 1a, the through hole 1b, and the short-circuit through hole 1c (see FIGS. 11 and 24). Next, a through hole having a diameter of 3 mm was formed as a cut hole in a region R shown in FIG. Next, the copper foil 2a was patterned (see FIGS. 12 and 24). In this patterning, the copper foil 2a was left so as to be connected to the copper layers 2b and 2c. Further, as shown in FIG. 24, the copper foils 2a 1 and 2a 2 were left so that the front-side conductive pattern 2a 1 and the back-side conductive pattern 2a 2 are short-circuited by the copper layer 2d on the wall surface of the short-circuit through hole 1c.

次に、ソルダーレジスト塗工、ガスレベラー処理によるはんだコートをした後、図１２および図１７に示す外形加工線に沿って外形加工を行なった。このようにして、図１および図２に示すようなプリント配線板１を得た。   Next, after solder coating by solder resist coating and gas leveler treatment, outer shape processing was performed along the outer shape processing lines shown in FIGS. In this way, a printed wiring board 1 as shown in FIGS. 1 and 2 was obtained.

得られたＣＦＲＰコア基板について、ＣＦＲＰコアと導電層２ｂとの間の絶縁抵抗を調べた。１０００Ｖを印加したときの絶縁抵抗は、放射線照射前後でいずれも５ＧΩ以上あり、全く問題ないことがわかった。また、ヒートサイクル試験（−６５℃／１５ｍｉｎ⇔１２５℃／１５ｍｉｎ、５００サイクル）を実施したところ、短絡・断線などはなく、基板側面にも剥離などは見られなかった。さらに、大型セラミック部品（約１０ｍｍ×約２０ｍｍ×約４ｍｍ）を上記のＣＦＲＰコア基板に実装し、ヒートサイクル試験（−３０℃／１５ｍｉｎ⇔１００℃／１５ｍｉｎ、５００サイクル）を実施した。その結果、はんだ接続部にクラックは発生しなかった。   With respect to the obtained CFRP core substrate, the insulation resistance between the CFRP core and the conductive layer 2b was examined. The insulation resistance when 1000 V was applied was 5 GΩ or more before and after radiation irradiation, and it was found that there was no problem at all. Further, when a heat cycle test (−65 ° C./15 min to 125 ° C./15 min, 500 cycles) was carried out, there was no short circuit or disconnection, and no peeling or the like was observed on the side surface of the substrate. Furthermore, a large ceramic component (about 10 mm × about 20 mm × about 4 mm) was mounted on the CFRP core substrate, and a heat cycle test (−30 ° C./15 min to 100 ° C./15 min, 500 cycles) was performed. As a result, no crack was generated in the solder connection portion.

なお図２５に示すように短絡スルーホール１ｃにねじ４２を差し込むことによりプリント配線板１を筐体４１に取り付けた。これにより、表面側導電パターン２ａ1と裏面側導電パターン２ａ2とのいずれかをはんだ３１を介して筐体４１に接続させた。 In addition, as shown in FIG. 25, the printed wiring board 1 was attached to the housing | casing 41 by inserting the screw 42 in the short circuit through hole 1c. Thus, either the front surface side conductive pattern 2 a 1 or the back surface side conductive pattern 2 a 2 was connected to the housing 41 via the solder 31.

（実施例２）
実施例１と同様、ＣＦＲＰコアに１次貫通穴５ａを設け、銅めっきを行ない、パターニングを行なった。次に、高熱伝導樹脂、低熱膨張ガラスエポキシを順次、真空ラミネートにより張り合わせ、図８に示すような積層板１０を得た。 (Example 2)
As in Example 1, the CFRP core was provided with primary through holes 5a, and copper plating was performed for patterning. Next, a high thermal conductive resin and a low thermal expansion glass epoxy were sequentially laminated together by vacuum lamination to obtain a laminate 10 as shown in FIG.

次に、低熱膨張ガラスエポキシ両面銅張板（ＭＣＬ−Ｅ−６７９（ＬＤ）、ｔ０．２ｍｍ−１８／１８μｍ）を準備し、その銅張板の銅のパターニングを行なった。   Next, a low thermal expansion glass epoxy double-sided copper-clad plate (MCL-E-679 (LD), t0.2 mm-18 / 18 μm) was prepared, and copper patterning of the copper-clad plate was performed.

図２１に示すように、上記積層板１０と、パターニングされた銅層を有する低熱膨張ガラスエポキシ両面銅張板と、１８μｍの厚みの銅箔２ａとを配置し、真空プレスを用いて昇温速度５℃／ｍｉｎ、保持時間１９０℃／１ｈ、積層圧力３０ｋｇ／ｃｍ2で加圧加熱した。その後、実施例１と同様の工程を行ない、図２２に示すような積層板を得た。 As shown in FIG. 21, the laminated plate 10, the low thermal expansion glass epoxy double-sided copper-clad plate having a patterned copper layer, and a copper foil 2a having a thickness of 18 μm are arranged, and the rate of temperature rise using a vacuum press Pressurization heating was performed at 5 ° C./min, a holding time of 190 ° C./1 h, and a lamination pressure of 30 kg / cm 2 . Then, the process similar to Example 1 was performed and the laminated board as shown in FIG. 22 was obtained.

得られたＣＦＲＰコア基板について、ＣＦＲＰコアと導電層２ｂとの間の絶縁抵抗を調べた。１０００Ｖを印加したときの絶縁抵抗は、放射線照射前後でいずれも５ＧΩ以上あり、全く問題ないことがわかった。また、ヒートサイクル試験（−６５℃／１５ｍｉｎ⇔１２５℃／１５ｍｉｎ、５００サイクル）を実施したところ、短絡・断線などはなく、基板側面にも剥離などは見られなかった。さらに、大型セラミック部品（約１０ｍｍ×約２０ｍｍ×約４ｍｍ）を上記ＣＦＲＰコア基板に実装し、ヒートサイクル試験（−３０℃／１５ｍｉｎ⇔１００℃／１５ｍｉｎ、５００サイクル）を実施した。その結果、はんだ接続部にクラックは発生しなかった。   With respect to the obtained CFRP core substrate, the insulation resistance between the CFRP core and the conductive layer 2b was examined. The insulation resistance when 1000 V was applied was 5 GΩ or more before and after radiation irradiation, and it was found that there was no problem at all. Further, when a heat cycle test (−65 ° C./15 min to 125 ° C./15 min, 500 cycles) was carried out, there was no short circuit or disconnection, and no peeling or the like was observed on the side surface of the substrate. Furthermore, a large ceramic component (about 10 mm × about 20 mm × about 4 mm) was mounted on the CFRP core substrate, and a heat cycle test (−30 ° C./15 min to 100 ° C./15 min, 500 cycles) was performed. As a result, no crack was generated in the solder connection portion.

なおサイズ的な問題で、被覆層２ｃ、６により被覆できなかったＣＦＲＰコア５の外周端縁には、最終工程で、図２６に示すように樹脂層３２を塗布して被覆した。この樹脂層３２の被覆は、塗布したい部分以外の部分（配線部の上など）に粘着力の弱いテープを貼着したうえで、シンナーで希釈したミリオンクリヤー（耐薬品用エポキシ樹脂クリアーペイント（関西ペイント（株）製））を塗布したい部分にハケあるいはスプレーで塗工し、１００℃の温度で１時間オーブンで乾燥・硬化させることにより行なった。   In addition, as shown in FIG. 26, the outer peripheral edge of the CFRP core 5 that could not be covered with the coating layers 2c and 6 due to the size problem was coated with a resin layer 32 as shown in FIG. The resin layer 32 is covered with a million clear (chemical resistant epoxy resin clear paint (Kansai) diluted with thinner after a tape with weak adhesiveness is applied to the part other than the part to be applied (such as on the wiring part). (Paint Co., Ltd.)) was applied to the part to be coated by brushing or spraying, and dried and cured in an oven at a temperature of 100 ° C. for 1 hour.

今回開示された実施の形態および実施例はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。   It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

本発明は、ＣＦＲＰを含むコアを有するプリント配線板およびその製造方法に特に有利に適用され得る。   The present invention can be particularly advantageously applied to a printed wiring board having a core containing CFRP and a manufacturing method thereof.

本発明の実施の形態１におけるプリント配線板の構成を概略的に示す断面図であり、図２のＩ−Ｉ線に沿う断面図である。It is sectional drawing which shows schematically the structure of the printed wiring board in Embodiment 1 of this invention, and is sectional drawing which follows the II line | wire of FIG. 図１のＩＩ−ＩＩ線に沿う部分の断面を平面視において示す概略断面図であり、導電層８の図示を省略した図である。It is a schematic sectional drawing which shows the cross section of the part which follows the II-II line of FIG. 1 in planar view, and is a figure which abbreviate | omitted illustration of the conductive layer 8. FIG. 本発明の実施の形態１におけるプリント配線板の製造方法の第１工程を示す概略断面図である。It is a schematic sectional drawing which shows the 1st process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第２工程を示す概略断面図である。It is a schematic sectional drawing which shows the 2nd process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第３工程を示す概略断面図である。It is a schematic sectional drawing which shows the 3rd process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第４工程を示す概略断面図である。It is a schematic sectional drawing which shows the 4th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第５工程を示す概略断面図である。It is a schematic sectional drawing which shows the 5th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第６工程を示す概略断面図である。It is a schematic sectional drawing which shows the 6th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第７工程を示す概略断面図である。It is a schematic sectional drawing which shows the 7th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第８工程を示す概略断面図である。It is a schematic sectional drawing which shows the 8th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第９工程を示す概略断面図である。It is a schematic sectional drawing which shows the 9th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第１０工程を示す概略断面図である。It is a schematic sectional drawing which shows the 10th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第１工程を示す図２の断面と同一断面における概略断面図である。It is a schematic sectional drawing in the same cross section of FIG. 2 which shows the 1st process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第２工程を示す図２の断面と同一断面における概略断面図である。It is a schematic sectional drawing in the same cross section of FIG. 2 which shows the 2nd process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第３工程を示す図２の断面と同一断面における概略断面図である。It is a schematic sectional drawing in the same cross section of FIG. 2 which shows the 3rd process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第４工程を示す図２の断面と同一断面における概略断面図である。It is a schematic sectional drawing in the same cross section of FIG. 2 which shows the 4th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 本発明の実施の形態１におけるプリント配線板の製造方法の第５工程を示す図２の断面と同一断面における概略断面図である。It is a schematic sectional drawing in the same cross section of FIG. 2 which shows the 5th process of the manufacturing method of the printed wiring board in Embodiment 1 of this invention. 図１７の領域Ｐを拡大して示す拡大図である。It is an enlarged view which expands and shows the area | region P of FIG. ガスレベラー処理によるはんだコート前に切り穴を形成しない場合に導電層２ｃが露出することを説明するための図である。It is a figure for demonstrating that the conductive layer 2c is exposed when not forming a cut hole before the solder coat by a gas leveler process. ガスレベラー処理によるはんだコート前に切り穴を形成した場合に導電層２ｃが露出しないことを説明するための図である。It is a figure for demonstrating that the conductive layer 2c is not exposed when a cut hole is formed before the solder coat by a gas leveler process. 本発明の実施の形態２におけるプリント配線板の製造方法を示す概略断面図である。It is a schematic sectional drawing which shows the manufacturing method of the printed wiring board in Embodiment 2 of this invention. 本発明の実施の形態２におけるプリント配線板の構成を概略的に示す断面図である。It is sectional drawing which shows schematically the structure of the printed wiring board in Embodiment 2 of this invention. 本発明の実施の形態１におけるプリント配線板の構成を概略的に示す斜視図である。It is a perspective view which shows roughly the structure of the printed wiring board in Embodiment 1 of this invention. 図２３のＸＸＩＶ−ＸＸＩＶ線に沿う概略断面図である。It is a schematic sectional drawing which follows the XXIV-XXIV line | wire of FIG. 短絡スルーホールにねじを差し込んでプリント配線板を筐体に取り付けた様子を概略的に示す部分断面図である。It is a fragmentary sectional view which shows roughly a mode that the screw was inserted in the short circuit through hole and the printed wiring board was attached to the housing | casing. 図２３のＸＸＶＩ−ＸＸＶＩ線に沿う概略断面図である。It is a schematic sectional drawing which follows the XXVI-XXVI line of FIG.

符号の説明Explanation of symbols

１ プリント配線板、１ａ，１ｂ ２次貫通穴、２ａ 信号配線、２ｂ，２ｃ，８ 導電層、３ 絶縁基材、４ａ 信号回路層、５ ＣＦＲＰ層、５ａ １次貫通穴、５ｂ，５ｃ 外周端縁、６ 接着部材、１０ 積層板、１１ 信号配線、１３ 内層信号回路層、１４ ガラスエポキシプリプレグ、２１ 絶縁層、３１ はんだ、３２ 樹脂層、４１ 筐体、４２ ねじ、５１ 製品部、５２ 支持部、５３ 連結部。   DESCRIPTION OF SYMBOLS 1 Printed wiring board, 1a, 1b Secondary through hole, 2a Signal wiring, 2b, 2c, 8 Conductive layer, 3 Insulating base material, 4a Signal circuit layer, 5 CFRP layer, 5a Primary through hole, 5b, 5c Outer edge Edge, 6 Adhesive member, 10 Laminate plate, 11 Signal wiring, 13 Inner signal circuit layer, 14 Glass epoxy prepreg, 21 Insulating layer, 31 Solder, 32 Resin layer, 41 Housing, 42 Screw, 51 Product part, 52 Support part 53 connection part.

Claims (8)

それぞれが信号配線を有する１対の信号回路層と、
前記１対の信号回路層の間に設けられた１次貫通穴を有する炭素繊維強化プラスチックを含むコアと、
前記１対の信号回路層と前記コアとを接着し、かつ前記コアの前記１次貫通穴の壁面を覆い、かつ前記１次貫通穴内を通る２次貫通穴を有する接着部材と、
前記１対の信号回路層の各々の前記信号配線を前記２次貫通穴を介して電気的に接続するために前記２次貫通穴の壁面に形成された第１の導電層と、
前記コアの平面視における外周端縁を被覆する被覆層とを備え、
前記被覆層は前記接着部材および第２の導電層を含み、
前記コアの平面視における前記外周端縁は前記接着部材により被覆され、かつ前記接着部材によって被覆されていない前記外周端縁が前記第２の導電層により被覆され、
前記コアの表面側および裏面側の各々に前記接着部材を介して形成された表面側導電パターンおよび裏面側導電パターンをさらに備え、
前記第２の導電層は、めっきにより形成された導電材料よりなり、
前記表面側導電パターンおよび前記裏面側導電パターンは、前記第２の導電層によって互いに電気的に接続されている、プリント配線板。 A pair of signal circuit layers each having a signal wiring;
A core comprising a carbon fiber reinforced plastic having a primary through hole provided between the pair of signal circuit layers;
An adhesive member that adheres the pair of signal circuit layers and the core, covers a wall surface of the primary through hole of the core, and has a secondary through hole passing through the primary through hole;
A first conductive layer formed on a wall surface of the secondary through hole to electrically connect the signal wirings of each of the pair of signal circuit layers through the secondary through hole;
A coating layer covering an outer peripheral edge in a plan view of the core ,
The covering layer includes the adhesive member and a second conductive layer,
The outer peripheral edge in plan view of the core is covered with the adhesive member, and the outer peripheral edge not covered with the adhesive member is covered with the second conductive layer,
A front surface side conductive pattern and a back surface side conductive pattern formed through the adhesive member on each of the front surface side and the back surface side of the core,
The second conductive layer is made of a conductive material formed by plating,
The printed wiring board , wherein the front-side conductive pattern and the back-side conductive pattern are electrically connected to each other by the second conductive layer . 前記第１の導電層と前記第２の導電層とは互いに同じ材質により構成されている、請求項１に記載のプリント配線板。 The printed wiring board according to claim 1 , wherein the first conductive layer and the second conductive layer are made of the same material. 前記表面側導電パターン、前記裏面側導電パターン、前記接着部材および前記コアを貫通する短絡スルーホールが形成されており、
前記短絡スルーホールの壁面に形成された第３の導電層をさらに備え、
前記第３の導電層により前記表面側導電パターンと前記裏面側導電パターンとが電気的に接続されている、請求項１に記載のプリント配線板。 A short-circuit through hole penetrating the front surface side conductive pattern, the back surface side conductive pattern, the adhesive member and the core is formed,
Further comprising a third conductive layer formed on the wall surface of the short-circuited through hole;
The printed wiring board according to claim 1 , wherein the surface-side conductive pattern and the back-side conductive pattern are electrically connected by the third conductive layer. 前記第２の導電層は前記コアと電気的に短絡している、請求項１〜３のいずれかに記載のプリント配線板。 The second conductive layer are short-circuited electrically with said core, a printed wiring board according to any one of claims 1-3. 前記被覆層は樹脂層を含み、
前記コアの平面視における前記外周端縁のうち前記接着部材および前記第２の導電層によって被覆されていない前記外周端部が前記樹脂層により被覆されている、請求項１〜４のいずれかに記載のプリント配線板。 The coating layer includes a resin layer,
The outer peripheral end portion which is not covered by the adhesive member and the second conductive layer of the outer peripheral edge in a plan view of the core is covered by the resin layer, to any one of claims 1 to 4, The printed wiring board as described. 前記被覆層は前記コアの平面視における前記外周端縁の全周を被覆している、請求項１〜５のいずれかに記載のプリント配線板。 The coating layer covers the entire circumference of the outer peripheral edge in a plan view of the core, a printed wiring board according to any one of claims 1-5. 前記接着部材は無機フィラーとゴム成分とを含む、請求項１〜６のいずれかに記載のプリント配線板。 The adhesive member comprises an inorganic filler and a rubber component, a printed wiring board according to any one of claims 1-6. 製品部と支持部とを繋ぐ連結部を残して前記製品部の周りを取り囲む第１の１次貫通穴と、前記製品部に形成された第２の１次貫通穴とを有する炭素繊維強化プラスチックを含むコアを形成する工程と、
前記コアの両面を覆い、かつ前記第１および第２の１次貫通穴を埋め込むように接着部材を形成する工程と、
前記コアの両面の各々に前記接着部材を介して、それぞれが信号配線を有する１対の信号回路層の各々を接着する工程と、
前記連結部を跨いで前記第１の１次貫通穴の端部同士を接続するように前記接着部材および前記コアを貫通する第１の２次貫通穴を形成するとともに、前記第２の１次貫通穴内を通るように前記接着部材を貫通する第２の２次貫通穴を形成する工程と、
前記第１および第２の２次貫通穴の壁面に前記コアの両面の前記信号配線とつながる導電層をめっきにより被覆する工程と、
前記製品部と前記支持部との間の前記接着部材および前記第１の２次貫通穴の部分を切断することで前記支持部から前記製品部を切り取る工程とを備えた、プリント配線板の製造方法。 A carbon fiber reinforced plastic having a first primary through hole surrounding the product part leaving a connecting part connecting the product part and the support part, and a second primary through hole formed in the product part. Forming a core comprising:
Forming an adhesive member so as to cover both surfaces of the core and embed the first and second primary through holes;
Bonding each of a pair of signal circuit layers each having a signal wiring to each of both surfaces of the core via the adhesive member;
A first secondary through hole penetrating the adhesive member and the core is formed so as to connect ends of the first primary through hole across the coupling portion, and the second primary Forming a second secondary through hole penetrating the adhesive member so as to pass through the through hole;
Covering the wall surfaces of the first and second secondary through holes with a conductive layer connected to the signal wirings on both surfaces of the core by plating ;
Manufacturing the printed wiring board, comprising: cutting the product part from the support part by cutting the adhesive member between the product part and the support part and the first secondary through hole. Method.
JP2008204309A 2007-10-29 2008-08-07 Printed wiring board and manufacturing method thereof Expired - Fee Related JP5076196B2 (en)

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