JP6039867B1 - Winding body and substrate sheet - Google Patents

Abstract

The wound body of the present disclosure has a winding structure in which a long laminated sheet 1 is wound in a length direction. The laminated sheet 1 includes a long supporting sheet 5 and the supporting sheet. 5 includes an inorganic insulating layer 9 having inorganic insulating particles 15 disposed on the surface 5 and a first resin layer 11 disposed on the inorganic insulating layer 9, and the side surface of the inorganic insulating layer 9 in the width direction of the support sheet 5. Is covered with the first resin layer 11.

Description

  The present invention relates to a wound body and a substrate sheet.

  2. Description of the Related Art Conventionally, a mounting structure in an electronic device is known in which an electronic component is mounted on a wiring board. A laminated sheet for forming such a wiring board is configured by forming a resin layer on a copper foil (support sheet), for example. This laminated sheet is wound into a drum shape to produce a wound body, and is sold in this state.

  A laminated sheet is drawn out from such a wound body by a predetermined length, cut to a predetermined length, and a plurality of layers of the cut sheet for a substrate are laminated to produce a wiring board. A part of the copper foil of the laminated substrate sheet is etched to form a wiring.

  As a laminated sheet for producing such a wiring board, an inorganic insulating layer containing first inorganic insulating particles and second inorganic insulating particles having different particle sizes is formed on a support sheet, and the inorganic insulating layer is formed on the inorganic insulating layer. A resin layer is known (see Patent Document 1). This Patent Document 1 describes that the first inorganic insulating particles are bonded to each other, and the second inorganic insulating particles are bonded to each other through the first inorganic insulating particles to have a three-dimensional network structure skeleton. .

International Publication No. 2011/037260

  The wound body of the present disclosure has a winding structure in which a long laminated sheet is wound in a length direction, and the laminated sheet includes a long supporting sheet and the supporting sheet. An inorganic insulating layer having inorganic insulating particles disposed thereon, and a first resin layer disposed on the inorganic insulating layer, wherein a side surface of the inorganic insulating layer in the width direction of the support sheet is the first resin layer. It is covered with.

  A substrate sheet of the present disclosure includes a rectangular support sheet having a pair of first sides and a pair of second sides opposed to each other, and an inorganic insulating layer having inorganic insulating particles disposed on the support sheet; And a first resin layer disposed on the inorganic insulating layer, and a side surface of the inorganic insulating layer in the first side-to-side direction is covered with the first resin layer.

(A) is explanatory drawing which showed the outline of the wound body of this indication, (b) is sectional drawing of a part of laminated sheet. (A) is the top view which looked at the lamination sheet from the upper part, (b) is sectional drawing along the 2b-2b line of (a). It shows the winding direction of the laminated sheet, (a) is an explanatory view showing the outline of the wound body, (b) is an enlarged view of the portion B shown by the wavy line of (a), (c) is ( It is an expanded sectional view of the part of C shown by the wavy line of b). The cut position of the ear | edge part of a lamination sheet is shown, (a) is a top view, (b) is sectional drawing along the 3b-3b line of (a). (A) is a top view which shows the cut position for obtaining the board | substrate sheet | seat from the lamination sheet of Fig.2 (a), (b) is the cross section (of the board | substrate sheet | seat) along the 4b-4b line of (a). FIG. 4C is a cross-sectional view (of the substrate sheet) taken along line 4c-4c in FIG. (A) is a plan view showing a laminated sheet in which a plurality of inorganic insulating layers are formed at predetermined intervals in the length direction of the support sheet, (b) is a sectional view taken along line 5b-5b in (a), (C) is sectional drawing of the lamination sheet which formed the 2nd resin layer at predetermined intervals in the length direction of the support sheet. (A) is sectional drawing which shows the side surface in the width direction of an inorganic insulating layer, and its vicinity, (b) is explanatory drawing which shows the coupling | bonding state of an inorganic insulating particle. It is sectional drawing which showed 1 process of the manufacturing method of the wiring board using a lamination sheet. It is sectional drawing which showed 1 process of the manufacturing method of the wiring board using a lamination sheet.

  Hereinafter, an embodiment of the wound body of the present disclosure will be described with reference to FIGS. Note that the wound body of the present disclosure is not limited to the following embodiment, and various changes and improvements can be made without departing from the gist of the present disclosure.

  Fig.1 (a) has shown the wound body from which the one part lamination sheet 1 was pulled out. The wound body is configured by winding a long laminated sheet 1 around a cylindrical core member 3 a plurality of times in the length direction. In addition, although Fig.1 (a) described what was wound once, it is comprised by winding in multiple times in fact.

  The long laminated sheet 1 has a long strip shape. The wound body is formed by winding the laminated sheet 1 around the core material 3 in a spiral shape, and is configured by winding the laminated sheet 1 around the core material 3 so as to surround the core material 3 multiple times. Yes.

  This laminated sheet 1 is a support sheet 5 as shown in FIG. 1 (b) which is a cross section obtained by cutting the laminated sheet 1 of FIG. 1 (a) in the vertical direction (the thickness direction (Z-axis direction) of the laminated sheet 1). And an inorganic insulating layer 9 on the support sheet 5 and a first resin layer 11 on the inorganic insulating layer 9. A second resin layer 13 is disposed between the support sheet 5 and the inorganic insulating layer 9. The first resin layer 11 and the second resin layer 13 are layers made of uncured or semi-cured resin.

  As shown in FIG. 2, side surfaces 9 a on both sides in the width direction (Y-axis direction) of the support sheet 5 in the inorganic insulating layer 9 are covered with the first resin layer 11. Furthermore, as shown in FIG. 2B, the side surface 5a in the Y-axis direction of the support sheet 5 and the side surface 11a in the Y-axis direction of the first resin layer 11 form the same surface. The same surface means that the side surface 5a and the side surface 11a constitute the same plane. Note that FIG. 2B and FIGS. 4B, 5B, and 5C described later are cross-sectional views, but the hatched lines are omitted for easy understanding.

  In other words, the side surface 13a in the Y-axis direction of the second resin layer 13 is located inside the side surface 5a in the Y-axis direction of the support sheet 5, and the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 is the second resin. The side surfaces 13 a and 9 a in the Y-axis direction of the second resin layer 13 and the inorganic insulating layer 9 are covered with the first resin layer 11, which is located inside the side surface 13 a in the Y-axis direction of the layer 13. The side surfaces 5a and 11a of the support sheet 5 and the first resin layer 11 extend in the X-axis direction and the Z-axis direction, respectively, and form the same surface.

  When the side surface of the inorganic insulating layer is exposed, the inorganic insulating particles in the inorganic insulating layer may fall off due to some impact or stress. In particular, in the wound body, a bending force acts on the laminated sheet, and therefore, the inorganic insulating particles may fall off due to some impact or stress in the portion where the inorganic insulating layer is exposed. On the other hand, according to the wound body of the present disclosure, the inorganic insulating layer 9 is not exposed because the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 is covered with the first resin layer 11. Moreover, it can reduce that the inorganic insulating particle which comprises the inorganic insulating layer 9 falls.

  Moreover, in the wound body of this indication, as shown to FIG.3 (b) (c), you may comprise the protective film 12 on the 2nd resin layer 11. FIG. As the protective film 12, a resin sheet can be used.

  And in FIG.3 (b) (c), in the laminated sheet 1 which comprises the protective film 12 on the 2nd resin layer 11, the surface on the opposite side to the inorganic insulating layer 9 of the support sheet 5, and the inorganic insulating layer 9 of FIG. The relationship between the distance a between the surface of the support sheet 5 and the distance b between the surface of the protective film 12 opposite to the first resin layer 11 and the surface of the inorganic insulating layer 9 on the first resin layer 11 side is as follows. When a <b is satisfied, the laminated sheet 1 is wound with the support sheet 5 inside, and when a> b is satisfied, the laminated sheet 1 is wound with the protective film 12 inside.

  In other words, the distance a between the outer surface of the support sheet 5 and the surface of the inorganic insulating layer 9 on the support sheet 5 side, and the distance between the outer surface of the protective film 12 and the surface of the inorganic insulating layer 9 on the protective film 12 side. When the relationship with b is a <b, the laminated sheet 1 is wound with the support sheet 5 inside, and when a> b, the laminated sheet 1 is wound with the protective film 12 inside, A wound body is configured.

  For example, as shown in FIG. 3C, the distance a between the outer surface (lower surface) of the support sheet 5 and the surface (lower surface) of the inorganic insulating layer 9 on the support sheet 5 side is the outer side of the protective film 12. When the distance (b) between the surface (upper surface) and the surface (upper surface) of the inorganic insulating layer 9 on the protective film 12 side is smaller (when a <b), as shown in FIG. The support sheet 5 is wound inside (core body 3 side).

  According to such a configuration as shown in FIG. 3B, the laminated sheet 1 is wound with the support sheet 5 having a small distance from the surface of the inorganic insulating layer 9 inside, so that the inorganic sheet 1 is inorganic. The stress generated in the insulating layer 9 becomes a compressive stress, and the generation of cracks in the inorganic insulating layer 9 can be reduced. Further, when inorganic insulating particles constituting the inorganic insulating layer 9 are connected as described later, the disconnection between the inorganic insulating particles can be reduced, and the generation of defects can be reduced.

  In addition, as shown in FIG. 2, the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 is not covered with the first resin layer 11, that is, the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 is Even if it is exposed, when a <b, the laminated sheet 1 is wound with the support sheet 5 inside, and when a> b, the laminated sheet 1 is wound with the protective film 12 inside. As a result, the generation of cracks in the inorganic insulating layer 9 can be reduced, the connection between the inorganic insulating particles constituting the inorganic insulating layer 9 can be suppressed, and the generation of defects can be reduced.

  The side surface 9a of the inorganic insulating layer 9 only needs to be covered with the first resin layer 11. When a <b, the laminated sheet 1 is wound with the support sheet 5 inside, and a> In the case of b, the laminated sheet 1 does not have to be wound with the protective film 12 inside.

  The outer surface of the protective film 12 is the surface of the protective film 12 located on the opposite side of the surface of the protective film 12 on the inorganic insulating layer 9 side, and the outer surface of the support sheet 5 is the surface of the support sheet 5. It is the surface of the support sheet 5 located on the side opposite to the surface on the inorganic insulating layer 9 side.

  In such a laminated sheet, as shown in FIG. 4, the side surface 13 a in the Y-axis direction of the second resin layer 13 is located inside the side surface 5 a in the Y-axis direction of the support sheet 5, and the inorganic insulating layer 9 The side surface 9a in the Y-axis direction is laminated so as to be located inside the side surface 13a in the Y-axis direction of the second resin layer 13, and the side surfaces 13a, 9a in the Y-axis direction of the second resin layer 13 and the inorganic insulating layer 9 are stacked. Is covered with the first resin layer 11.

  In this state, the side surfaces 13a, 9a, and 11a in the Y-axis direction of the second resin layer 13, the inorganic insulating layer 9, and the first resin layer 11 on the support sheet 5 are slanted and inclined due to paste application. Thereafter, for example, the position of the thickness of the first resin layer 11 on the support sheet 5 is substantially the same as the distance from the support sheet 5 to the surface of the first resin layer 11 at the center in the Y-axis direction (indicated by a dashed line) The laminated sheet 1 is cut at (part), and the ear portion 10 is removed. Thereby, the side surface 5a in the Y-axis direction of the support sheet 5 and the side surface 11a in the Y-axis direction of the first resin layer 11 form the same surface, and the laminated sheet 1 shown in FIG. 2 can be manufactured.

  Such a laminated sheet 1 is wound around the core material 3 to obtain a wound body. That is, for example, the distance a between the outer surface of the support sheet 5 and the surface of the inorganic insulating layer 9 on the support sheet 5 side, and the outer surface of the protective film 12 and the surface of the inorganic insulating layer 9 on the protective film 12 side. When the relationship with the distance b is a <b, the laminated sheet 1 is wound around the core 3 with the support sheet 5 inside. When a> b, the laminated sheet 1 is wound around the core body 3 with the protective film 12 on the inside to produce a wound body.

  In addition, in the said form, although the ear | edge part 10 of the lamination sheet 1 was cut and removed, it is not necessary to remove. That is, a wound body in which the laminated sheet 1 of FIG. 4B is wound may be used.

  The process of producing the board | substrate sheet | seat using the lamination sheet of FIG. 2 is demonstrated using FIG. First, the lamination sheet 1 from which the ear | edge part 10 was removed shown in FIG. 2 is prepared, and the part shown with a dashed-dotted line in FIG. 5 (a) is cut. That is, the board | substrate sheet | seat can be obtained by cutting the lamination sheet 1 by predetermined length.

  The substrate sheet includes a rectangular support sheet 5 having a pair of first sides and a pair of second sides opposed to each other, an inorganic insulating layer 9 disposed on the support sheet 5, and the inorganic insulation. 5a, the side surface 9a of the inorganic insulating layer 9 in the first inter-side direction is covered with the first resin layer 11 as shown in FIG. 5B. Yes. The first side is a side constituting the side surface 5a of the support sheet 5 in the Y-axis direction, and the second side is a side orthogonal to the first side (a side in the X-axis direction (a dashed line in FIG. 5A). Side)).

  In this substrate sheet, the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 is covered with the first resin layer 11 as shown in FIG. 5B, and the side surface 5a of the support sheet 5 in the Y-axis direction. And the side surface 11a of the first resin layer 11 in the Y-axis direction form the same surface. On the other hand, as shown in FIG. 5C, the side surface of the inorganic insulating layer 9 is exposed on the side surface in the X-axis direction, and the side surface of the inorganic insulating layer 9, the support sheet 5, the second resin layer 13, and the first The side surfaces of the resin layer 11 form the same surface.

  Since the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 of such a substrate sheet is covered with the first resin layer 11, the side surface 9a of the inorganic insulating layer 9 is not exposed, and the inorganic insulating layer 9 It is possible to reduce the falling off of the inorganic insulating particles constituting the.

  Note that the support sheet 5 in the Y-axis direction and the first resin layer 11 in the Y-axis direction are not cut, and as shown in FIG. Dropping off of the inorganic insulating particles constituting the insulating layer 9 can be reduced.

  FIG. 6 shows another example of the wound body of the present disclosure. In this wound body, as shown in FIG. 6A, a predetermined interval is provided in the length direction (X-axis direction) of the support sheet 5. A plurality of inorganic insulating layers 9 are formed, and the side surface 9b in the X-axis direction of each inorganic insulating layer 9 is covered with the first resin layer 11 as shown in FIG. .

  In such a wound body, not only the side surface 9a in the Y-axis direction of the inorganic insulating layer 9 but also the side surface 9b in the X-axis direction are covered with the first resin layer 11, and the rectangular inorganic insulating layer 9 A side surface of the entire circumference is covered with the first resin layer 11. In such a wound body, the laminated sheet 1 can be pulled out and cut at a portion indicated by a one-dot chain line to form a substrate sheet. In such a substrate sheet, not only the side surface 9a in the Y-axis direction but also the side surface 9b in the X-axis direction of the inorganic insulating layer 9 is not exposed in the step of forming the wiring substrate by stacking the substrate sheets. Moreover, dropping off of the inorganic insulating particles constituting the inorganic insulating layer 9 can be reduced, and handling of the substrate sheet is facilitated.

  FIG. 6C illustrates still another example of the wound body of the present disclosure. In this wound body, a plurality of the wound sheets are spaced apart at predetermined intervals in the length direction of the support sheet 5 (X-axis direction). The second resin layer 13 and the plurality of inorganic insulating layers 9 are formed. The side surface 9b in the X-axis direction of each inorganic insulating layer 9 and the side surface in the X-axis direction of the second resin layer 13 are the first resin layer 11. It is covered with.

  In such a wound body, it can be cut at a portion indicated by a one-dot chain line to form a sheet for a substrate. In such a sheet for a substrate, in the process of forming a wiring substrate by laminating the sheet for a substrate, inorganic insulation Not only the side surface 9a in the Y-axis direction of the layer 9 but also the side surface 9b in the X-axis direction are not exposed. Thereby, dropout of the inorganic insulating particles constituting the inorganic insulating layer 9 can be reduced, and handling of the substrate sheet is facilitated.

  Hereinafter, each member which comprises the lamination sheet 1 is demonstrated. The support sheet 5 supports the inorganic insulating layer 9 when the laminated sheet 1 is handled, and is peeled off from the inorganic insulating layer 9 or processed into wiring when the wiring board is manufactured. The support sheet 5 is made of, for example, a flat copper foil. Since the support sheet 5 consists of copper foil, the heat resistance of the support sheet 5 can be improved.

  As shown in FIG. 1B, the support sheet 5 has an inorganic insulating layer 9 laminated on a flat support sheet 5. In order to improve the adhesive strength with the inorganic insulating layer 9, a second resin layer (primer layer) 13 is formed on the main surface of the support sheet 5, and the inorganic insulating layer 9 is laminated on the second resin layer 13. Yes. The second resin layer (primer layer) 13 is not necessarily formed, but the formation of the inorganic insulating layer 9 on the support sheet 5 is facilitated by forming the second resin layer 13.

  The thickness of the support sheet 5 is set to 3 μm or more and 100 μm or less, for example. The Young's modulus of the support sheet 5 is set to, for example, 70 GPa or more and 150 GPa or less. The thermal expansion coefficient of the support sheet 5 is set to, for example, 13 ppm / ° C. or more and 20 ppm / ° C. or less. The Young's modulus of the support sheet 5 is measured using Nano Indentor XP / DCM manufactured by MTS Systems. Moreover, the thermal expansion coefficient of the support sheet 5 is measured by a measuring method according to JISK7197-1991 using a commercially available TMA apparatus. A resin film can also be used as the support sheet 5.

  The inorganic insulating layer 9 ensures insulation between the wirings of the produced wiring board. The thickness of the inorganic insulating layer 9 is set to, for example, 1 μm or more and 15 μm or less.

  As shown in FIG. 7, the inorganic insulating layer 9 is formed of a plurality of inorganic insulating particles 15 a and 15 b (hereinafter simply referred to as 15) and the first resin portion 16. A plurality of inorganic insulating particles 15 are bonded at a part of each other while maintaining the particle shape (concept including contact), thereby forming a three-dimensional network structure and forming a skeleton which is a main part of the inorganic insulating layer 9 Has been. Since the plurality of inorganic insulating particles 15 are bonded to each other while maintaining the particle shape, a gap exists between the plurality of inorganic insulating particles 15, and resin is present in at least a part of the gap. Arranged to form the first resin portion 16.

  Further, since the inorganic insulating layer 9 has a plurality of inorganic insulating particles 15 bonded together, the rigidity of the inorganic insulating layer 9 is improved as compared with the case where the plurality of inorganic insulating particles are simply dispersed in the resin. Can be made. As a result, deformation of the inorganic insulating layer 9 can be reduced.

  The inorganic insulating particles 15 include first inorganic insulating particles 15a and second inorganic insulating particles 15b. The particle diameter of the first inorganic insulating particles 15a is set to 5 nm or more and 80 nm or less, and the second inorganic insulating particles 15b The particle diameter is set to 0.1 μm or more and 5 μm or less. The particle diameters of the first inorganic insulating particles 15a and the second inorganic insulating particles 15b are, for example, by first observing the cross section of the inorganic insulating layer 9 with a transmission electron microscope (TEM), It is calculated by photographing a cross section enlarged so as to include and measuring the maximum diameter of each particle in the enlarged cross section.

  For example, the first inorganic insulating particles 15 a are contained in the plurality of inorganic insulating particles 15 by 10 volume% or more and 40 volume% or less, and the second inorganic insulating particles 15 b are, for example, 60 volumes in the plurality of inorganic insulating particles 15. % Or more and 90% by volume or less. As described above, if the particle size distribution of the plurality of inorganic insulating particles 15 is set, the gap between the inorganic insulating layers 9 is suppressed to be too small, and the resin of the first resin layer 11 to be described later can easily enter. it can. More preferably, the particle diameter of the first inorganic insulating particles 15a is set to 8 nm or more and 70 nm or less, and the plurality of inorganic insulating particles 15 are contained in an amount of 15% by volume or more and 30% by volume or less. The particle diameter of 15b is set to 0.15 μm or more and 2 μm or less, and 70% by volume or more and 85% by volume or less may be contained in the plurality of inorganic insulating particles 15. The inorganic insulating layer 9 may contain inorganic particles other than the first inorganic insulating particles 15a and the second inorganic insulating particles 15b.

  The inorganic insulating particles 15 form the main part (skeleton) of the inorganic insulating layer 9. The shape of the inorganic insulating particles 15 is, for example, spherical. The inorganic insulating particles 15 are made of an inorganic insulating material such as silicon oxide, aluminum oxide, titanium oxide, magnesium oxide, or zirconium oxide. The inorganic insulating particles 15 may be made of a single material or a plurality of types of materials. The inorganic insulating particles 15 are made of a material having a thermal expansion coefficient of, for example, not less than 0.6 ppm / ° C. and not more than 12 ppm / ° C. The inorganic insulating particles 15 are made of a material having a Young's modulus of, for example, 10 GPa or more and 300 GPa or less. Moreover, the content rate with respect to the inorganic insulating layer 9 of the some inorganic insulating particle 15 is set to 70 volume% or more, for example, Preferably it is set to 75 volume% or more. The content of the inorganic insulating particles 15 can be determined from the area ratio in the micrograph of the cross section of the inorganic insulating layer 9.

  In the above embodiment, the case where the inorganic insulating particles 15 in the inorganic insulating layer 9 are bonded to form a skeleton has been described. However, the content of the plurality of inorganic insulating particles 15 with respect to the inorganic insulating layer 9 is 70% by volume. In the case of more than the above, the inorganic insulating particles 15 may be dispersed in the resin without being bonded.

  The first resin portion 16 is made of, for example, a thermosetting resin such as an epoxy resin, a bismaleimide triazine resin, a cyanate resin, a polyphenylene ether resin, a wholly aromatic polyamide resin, or a polyimide resin, and the first resin portion 16 is For example, it is made of a material having a thermal expansion coefficient of 30 ppm / ° C. or more and 60 ppm / ° C. or less. Moreover, the 1st resin part 16 consists of material whose Young's modulus is 2 GPa or more and 10 GPa or less, for example. The first resin portion 16 is uncured or semi-cured in the laminated sheet 1.

  The 1st resin layer 11 adheres the inorganic insulating layer 9 and wiring, or the inorganic insulating layer 9 and the other inorganic insulating layer 9 laminated | stacked on this inorganic insulating layer 9 at the time of manufacture of a wiring board. The 1st resin layer 11 has the inorganic filler 20 distribute | arranged in resin of the 2nd resin part 18 and the 2nd resin part 18, as shown to Fig.7 (a).

  The thickness of the first resin layer 11 may be smaller than the thickness of the inorganic insulating layer 9. Thereby, the influence of the thermal expansion of the 1st resin layer 11 becomes small, and the inorganic insulating layer 9 can reduce the amount of thermal expansion of the 1st resin layer 11 effectively. In addition, the thickness of the 1st resin layer 11 is set to 1 to 40 micrometers, for example.

  The second resin portion 18 of the first resin layer 11 may be in contact with the first resin portion 16 of the inorganic insulating layer 9. As a result, the adhesive strength between the inorganic insulating layer 9 and the first resin layer 11 can be improved, and for example, peeling due to the difference in thermal expansion coefficient between the inorganic insulating layer 9 and the first resin layer 11 can be reduced.

  Further, the second resin portion 18 of the first resin layer 11 may be formed integrally with the first resin portion 16 of the inorganic insulating layer 9. That is, the resin that forms the first resin layer 11 may enter the gap between the inorganic insulating layers 9 to form the first resin portion 16. As a result, peeling between the first resin layer 11 and the inorganic insulating layer 9 can be effectively reduced.

  The second resin portion 18 mainly constitutes the first resin layer 11. The second resin portion 18 is made of, for example, a thermosetting resin such as an epoxy resin, a bismaleimide triazine resin, a cyanate resin, a polyphenylene ether resin, a wholly aromatic polyamide resin, or a polyimide resin. The second resin portion 18 is made of a material having a coefficient of thermal expansion of, for example, 30 ppm / ° C. or more and 60 ppm / ° C. or less. The second resin portion 18 is made of a material having a Young's modulus of, for example, 2 GPa or more and 10 GPa or less. The second resin portion 18 is in an uncured state or a semi-cured state in the laminated sheet 1.

  The inorganic filler 20 improves the rigidity of the first resin layer 11 or decreases the thermal expansion coefficient. The inorganic filler 20 has a spherical shape, for example. The particle diameter of the inorganic filler 20 may be greater than or equal to the particle diameter of the second inorganic insulating particles 15b. The particle diameter of the inorganic filler 20 is set to 0.1 μm or more and 5 μm or less, for example. The content of the inorganic filler 20 with respect to the first resin layer 11 may be smaller than the content of the inorganic insulating particles 15 with respect to the inorganic insulating layer 9. The content rate with respect to the 1st resin layer 11 of the inorganic filler 20 is set to 60 volume% or less, for example.

  The second resin layer 13 may be made of the same material as the first resin layer 11 or may be made of a different material.

  Next, the wiring board 24 shown in FIG. 8A manufactured using the above-described laminated sheet 1 will be described. FIG. 8A schematically shows a cross section of the wiring board 24 cut in the vertical direction.

  The wiring board 24 is used for electronic devices such as various audiovisual devices, home appliances, communication devices, computer devices or peripheral devices thereof. The wiring board 24 is, for example, a build-up multilayer wiring board, and includes a core substrate 25 and a pair of wiring layers 26 formed above and below the core substrate 25 as shown in FIG.

  The core board 25 is intended to enhance the rigidity of the wiring board 26 and to conduct between the pair of wiring layers 26. The core substrate 25 includes a resin base 27, a cylindrical through-hole conductor 28 formed through the resin base 27 in the vertical direction, and a columnar insulator disposed in a region surrounded by the through-hole conductor 28. 29.

  The resin base 27 increases the rigidity of the core substrate 25. The resin substrate 27 includes, for example, a resin, a base material coated with the resin, and an inorganic insulating filler.

  The resin contained in the resin substrate 27 forms the main part of the resin substrate 27. Examples of this resin include epoxy resins, bismaleimide triazine resins, cyanate resins, polyparaphenylene benzbisoxazole resins, wholly aromatic polyamide resins, polyimide resins, aromatic liquid crystal polyester resins, polyether ether ketone resins or polyether ketone resins. Made of resin material.

  The base material contained in the resin base 27 is to make the resin base 27 highly rigid and low in thermal expansion. This base material consists of what arranged the woven fabric or nonwoven fabric comprised by the fiber, or the fiber in one direction. Moreover, this fiber consists of glass fiber or resin fiber, for example.

  The inorganic insulating filler contained in the resin base 27 makes the resin base 27 highly rigid and low in thermal expansion. The inorganic insulating filler is composed of a plurality of particles made of an inorganic insulating material such as silicon oxide, aluminum oxide, aluminum nitride, aluminum hydroxide, or calcium carbonate.

  The through-hole conductor 28 is for electrically connecting the upper and lower wiring layers 26 of the core substrate 25. The through-hole conductor 28 is made of a conductive material such as copper, silver, gold, aluminum, nickel, or chromium.

  The insulator 29 forms a support surface of a via conductor 30 described later. The insulator 29 is made of a resin material such as polyimide resin, acrylic resin, epoxy resin, cyanate resin, fluororesin, silicon resin, polyphenylene ether resin, or bismaleimide triazine resin.

  On the other hand, a pair of wiring layers 26 are formed above and below the core substrate 25 as described above. The wiring layer 26 is formed in the via hole and the inorganic insulating layer 9 in which the via hole along the thickness direction is formed, the wiring 31 partially formed on the resin substrate 27 or on the inorganic insulating layer 9, and the via hole. Via conductor 30 is included.

  The wiring layer 26 includes a first resin layer 11 positioned on the core substrate 25 side, an inorganic insulating layer 9 stacked on the first resin layer 11, and a second stacked on the inorganic insulating layer 9. And a resin layer 13. In addition, the inorganic insulating layer 9, the 1st resin layer 11, and the 2nd resin layer 13 are what the laminated sheet 1 mentioned above was equipped with. Further, in the wound body and the substrate sheet, the first resin portion 16 of the inorganic insulating layer 9 and the second resin portion 18 of the first and second resin layers 11 and 13 were uncured or semi-cured. In the substrate 24, the first resin portion 16 and the second resin portion 18 are cured.

  The first resin layer 11 adheres the resin base 27 and the inorganic insulating layer 9 or adheres the laminated inorganic insulating layers 9 to each other while adhering to the side surface and upper surface of the wiring 31 on the surface of the core substrate 25. . The inorganic insulating layer 9 constitutes a main part of the inorganic insulating layer 9 and functions as an insulating member between the wirings 31 arranged apart along the thickness direction. Since the inorganic insulating layer 9 has a low coefficient of thermal expansion and high rigidity compared to the resin material, the coefficient of thermal expansion in the planar direction of the inorganic insulating layer 9 can be reduced. Therefore, the difference in thermal expansion coefficient in the planar direction between the wiring board 24 and an electronic component (not shown) mounted on the wiring board 24 can be reduced, and thus the warping of the wiring board 24 can be reduced.

  The wirings 31 are arranged away from each other along the planar direction or the thickness direction, and function as grounding wirings, power supply wirings, or signal wirings. The wiring 31 is made of a conductive material such as copper, silver, gold, aluminum, nickel, or chromium. The thickness of the wiring 31 is set to 3 μm or more and 20 μm or less, for example. The coefficient of thermal expansion of the wiring 31 is set to, for example, 14 ppm / ° C. or more and 18 ppm / ° C. or less. The L / S (line / space) of the wiring 31 is set to, for example, 3/3 μm or more and 40/40 μm or less.

  The via conductor 30 electrically connects the wirings 31 that are spaced apart from each other in the thickness direction, and is formed in a columnar shape that becomes narrower toward the core substrate 25. The via conductor 30 is made of, for example, a conductive material such as copper, silver, gold, aluminum, nickel, or chromium. The via conductor 30 has a thermal expansion coefficient set to, for example, 14 ppm / ° C. or more and 18 ppm / ° C. or less.

  A method for manufacturing the wiring substrate 24 using the wound body of the present disclosure will be described with reference to FIGS. FIG. 8B to FIG. 9 are cross-sectional views illustrating one process of a method for manufacturing a wiring board manufactured using the wound body of the present disclosure.

  (1) First, the laminated sheet 1 having a predetermined length is pulled out from the wound body, cut to a predetermined length, and a substrate sheet having a predetermined length is prepared. The board sheet and the wound body are prepared through the following steps (2) to (4).

  (2) First, the second resin layer 13 is laminated on the support sheet 5. Specifically, first, a mixture of a solvent, an inorganic filler, and an uncured resin is applied to the main surface of the support sheet 5. At this time, the coating film of the second resin layer 13 is applied such that the side surface 13 a in the Y-axis direction of the second resin layer 13 is positioned on the inner side than the side surface 5 a in the Y-axis direction of the support sheet 5. By drying the applied mixture and evaporating the solvent from the mixture, the second resin layer 13 is formed. Application of the mixture can be performed using an existing molding method such as a doctor blade method, a dispenser method, a bar coater method, a die coater method, or a gravure printing method.

  (3) Next, a plurality of inorganic insulating particles 15, water or an organic solvent, and an appropriate dispersant are prepared, weighed and mixed to prepare a slurry containing the inorganic insulating particles 15. The first and second inorganic insulating particles 15a and 15b, which are the plurality of inorganic insulating particles 15, are coupled and have the same functional groups on their surfaces. The slurry contains, for example, 10% by volume or more and 60% by volume or less of inorganic insulating particles 15, and 40% by volume or more and 90% by volume or less of water or an organic solvent and a dispersing agent. The organic solvent is selected from, for example, methanol, isopropanol, n-butanol, ethylene glycol, ethylene glycol monopropyl ether, methyl ethyl ketone, methyl isobutyl ketone, xylene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dimethylacetamide or the like. Alternatively, an organic solvent containing a mixture of two or more kinds can be used.

  Examples of the dispersant include known dispersants such as cationic, anionic and nonionic.

  (4) Next, the slurry is formed (coated) into a sheet shape on the surface of the second resin layer 13 on the support sheet 5. The slurry is applied so that the side surface 9 a in the Y-axis direction of the inorganic insulating layer 9 is positioned on the inner side than the side surface 13 a in the Y-axis direction of the second resin layer 13. As the molding method, an existing molding method, for example, a doctor blade method, a dispenser method, a bar coater method, a die coater method, or a gravure printing method is used, and water or a solvent is removed by drying. A skeleton of the inorganic insulating layer 9 bonded to each other can be formed.

  (5) The first resin layer 11 is formed on the skeleton of the inorganic insulating layer 9. Specifically, first, a mixture of a solvent, an inorganic filler, and an uncured resin is applied to the main surface of the skeleton of the inorganic insulating layer 9. This mixture is applied so as to cover the side surfaces 13a, 9a of the second resin layer 13 and the inorganic insulating layer 9 in the Y-axis direction. Next, the first resin layer 11 is formed by drying the mixture and evaporating the solvent from the mixture. Application of the mixture can be performed using an existing molding method such as a doctor blade method, a dispenser method, a bar coater method, a die coater method, or a gravure printing method.

  Subsequently, a part of the first resin layer 11 (a part of the second resin part 18) enters the gap of the skeleton of the inorganic insulating layer 9 to form the first resin part 16. Specifically, the support sheet 5, the skeleton of the inorganic insulating layer 9, and the first resin layer 11 are heated and pressurized in the vertical direction, so that the first resin layer 11 (the second resin layer 11 is formed in at least a part of the gap between the inorganic insulating layers 9. A part of the resin part 18) is allowed to enter. At this time, part of the resin of the second resin layer 13 may also enter the gap of the inorganic insulating layer 9.

  At this time, it is desirable to use a roll laminator as a heating and pressurizing device and to carry out continuously. The heating temperature of the support sheet 5 or the like is set to, for example, 60 ° C. or more and 160 ° C. or less. The pressurizing pressure of the support sheet 5 or the like is set to, for example, 0.1 MPa or more and 2 MPa or less. The heating and pressing time for the support sheet 5 or the like is set to, for example, 0.5 to 10 minutes, and when using a roll laminator, it is desirable to set the feed rate to 1 to 50 m / second. . The melt viscosity of the resin material of the first resin layer 11 during the heating time is set to 10,000 Pa · s or less, for example.

  Alternatively, on the carrier film, a mixture of the above-described solvent, inorganic filler and uncured resin formed into a sheet shape by the same existing molding method as described above is prepared. A part of the first resin layer 11 (second resin portion 18) can be inserted into the gap of the inorganic insulating layer 9 by placing it on and heating and pressing in the same manner as described above. The carrier film may function as a protective film.

  As described above, the laminated sheet 1 including the support sheet 5, the second resin layer 13, the inorganic insulating layer 9, and the first resin layer 11 is produced, and the wound body is produced by winding this around the core material 3. To do.

  (6) The core substrate 25 (substrate) is produced. For production of the core substrate 25, first, for example, a resin substrate 27 in which a plurality of resin layers are laminated on a metal foil is formed. Next, after a through hole is formed in the resin base 27 by, for example, drilling or laser processing, a cylindrical shape is formed on the inner wall of the through hole by, for example, electroless plating, electroplating, vapor deposition, CVD, or sputtering. A through-hole conductor 28 is formed. Next, an insulator 29 is formed by filling a region surrounded by the through-hole conductor 28 with a resin material. After the conductive material is deposited on the exposed portion of the insulator 29, a conventionally known photolithography technique or etching is used. The wiring 31 is formed by patterning with the above. The core substrate 25 is prepared as described above.

  (7) As shown in FIG. 8B, the laminated sheet 1 is cut into a predetermined length from the wound body to produce a substrate sheet 35, and the substrate sheet 35 is laminated on the core substrate 25. Specifically, the lamination of the substrate sheet 35 is performed so that the first resin layer 11 of the substrate sheet 35 is in contact with the core substrate 25.

  Thereafter, in order to integrate the substrate sheet 35 and the core substrate 25, a part of the first resin layer 11 (second resin portion 18) enters the gap between the inorganic insulating layers 9 by heating and pressing in the vertical direction. At this time, part of the resin of the second resin layer 13 may also enter the gap of the inorganic insulating layer 9. At this time, it is desirable to adjust the heating and pressing conditions so that the resin enters almost all the gaps of the inorganic insulating layer 9 in order to ensure insulation reliability.

  The heating temperature is set to, for example, 60 ° C. or more and 160 ° C. or less, and the pressurizing pressure is set, for example, to 0.1 MPa or more and 4 MPa or less. The heating and pressing time for the support sheet 5 or the like is set to, for example, not less than 0.5 minutes and not more than 180 minutes.

  (8) The first resin portion 16 and the second resin portion 18 are thermoset. Specifically, the first resin in the uncured state in the substrate sheet 35 is heated by heating the substrate sheet 35 and the core substrate 25 at a temperature equal to or higher than the thermosetting start temperature of the first resin portion 16 and the second resin portion 18. The part 16 and the second resin part 18 are thermoset. The heating temperature of the substrate sheet 35 or the like is set to, for example, 80 ° C. or higher and 180 ° C. or lower.

  The thermosetting of the resin part may be performed simultaneously with the heating and pressurization in the above-described step (7).

  (9) As shown in FIG. 9 (b), through-holes that penetrate the inorganic insulating layer 9, the first resin layer 11, and the second resin layer 13 from the surface of the support sheet 5 in the thickness direction are formed. The through hole is formed by irradiating the upper surface of the support sheet 5 with laser light using, for example, a YAG laser device or a carbon dioxide laser device.

  (10) Next, in order to remove a resin residue (smear) generated by laser processing at the bottom of the above-described through hole, a strong alkali treatment is performed. As the strong alkaline aqueous solution, for example, an aqueous solution of potassium permanganate or sodium permanganate is suitable.

  (11) The via conductor 30 is formed in the through hole. The via conductor 30 is formed by filling a conductive material in the through hole using, for example, electroless plating, vapor deposition, CVD, or sputtering.

  (12) A wiring layer is formed by patterning the support sheet 5 made of copper foil using, for example, a photolithography technique or the like.

  In addition, when not using copper foil for a support sheet, a support sheet is peeled by the process of the above-mentioned (11), and when forming a via conductor in the process of (11), it is the whole surface of an insulating layer. After the conductive material is deposited and formed, the above-mentioned patterning is performed to form a wiring layer. As described above, the wiring board 24 as shown in FIG. 8A is manufactured.

  An electronic component is arranged on the upper surface of the wiring board 24 formed in this way, and the electronic component is mounted on the wiring 31 via a bonding member such as a bump or solder, thereby producing a mounting structure.

  The present disclosure is not limited to the above-described embodiments, and various changes, improvements, combinations, and the like can be made without departing from the scope of the present disclosure.

  In the embodiment of the wiring substrate 24 described above, the configuration in which one inorganic insulating layer 9 is stacked has been described as an example, but any number of inorganic insulating layers 9 may be stacked.

  Moreover, although embodiment of this indication mentioned above demonstrated the example which forms the 1st resin part 16 and the 2nd resin part 18 integrally, the 1st resin part 16 and the 2nd resin part 18 are formed separately. It doesn't matter. In this case, the first resin layer 11 (second resin portion) is formed after the first resin portion 16 is disposed in the gap.

DESCRIPTION OF SYMBOLS 1 Laminated sheet 5 Support sheet 9 Inorganic insulating layer 11 1st resin layer 13 2nd resin layer 15 Inorganic insulating particle 15a 1st inorganic insulating particle 15b 2nd inorganic insulating particle 16 1st resin part 18 2nd resin part 24 Wiring board

Claims (12)

  A long laminated sheet has a winding structure wound in the length direction, and the laminated sheet has a long supporting sheet and inorganic insulating particles arranged on the supporting sheet. It includes an inorganic insulating layer and a first resin layer disposed on the inorganic insulating layer, and a side surface of the inorganic insulating layer in the width direction of the support sheet is covered with the first resin layer. A wound body.   The wound body according to claim 1, wherein a side surface in the width direction of the support sheet and a side surface of the first resin layer in the width direction of the support sheet form the same surface.   2. The wound body according to claim 1, wherein a side surface of the first resin layer in the width direction of the support sheet is positioned on an inner side than a side surface of the support sheet in the width direction.   A second resin layer is provided between the support sheet and the inorganic insulating layer, and the side surface of the inorganic insulating layer in the width direction of the support sheet is the side of the second resin layer in the width direction of the support sheet. The wound body according to any one of claims 1 to 3, which is located on an inner side than a side surface.   The inorganic insulating layer is formed at a predetermined interval in the length direction of the support sheet, and the side surface of the inorganic insulating layer in the length direction of the support sheet is covered with the first resin layer. Item 5. A wound body according to any one of Items 1 to 4.   A protective film disposed on the first resin layer, the distance a between the surface of the support sheet opposite to the inorganic insulating layer and the surface of the inorganic insulating layer on the support sheet side, and the protective film When the relationship between the distance b between the surface opposite to the first resin layer and the surface of the inorganic insulating layer on the first resin layer side satisfies a <b, the support sheet is 6. The laminated sheet according to claim 1, wherein when the laminated sheet is wound and a> b is satisfied, the laminated sheet is wound with the protective film inside. Winding body.   The wound body according to claim 6, wherein the support sheet is made of copper foil, satisfies the relationship of a <b, and the laminated sheet is wound with the support sheet inside.   The wound body according to any one of claims 1 to 7, wherein the inorganic insulating layer has a plurality of inorganic insulating particles, and the inorganic insulating particles are connected to each other.   The wound body according to any one of claims 1 to 7, wherein the inorganic insulating layer is formed by dispersing a plurality of inorganic insulating particles of 70% by volume or more in a resin.   A rectangular support sheet having a pair of first sides and a pair of second sides facing each other, an inorganic insulating layer having inorganic insulating particles disposed on the support sheet, and an inorganic insulating layer disposed on the inorganic insulating layer. A substrate sheet comprising: the first resin layer, wherein a side surface of the inorganic insulating layer in the first inter-side direction is covered with the first resin layer.   The board | substrate sheet | seat of Claim 10 in which the side surface by the side of the 1st edge | side of the said support sheet and the side surface of the said 1st resin layer in the said 1st edge | side direction form the same surface.   The substrate sheet according to claim 10 or 11, wherein a side surface of the inorganic insulating layer in the direction between the second sides is covered with the first resin layer.

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