KR101099454B1 - A manufacturing method for multilayer flexible printed cirkit board - Google Patents

A manufacturing method for multilayer flexible printed cirkit board Download PDF

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KR101099454B1
KR101099454B1 KR1020090060023A KR20090060023A KR101099454B1 KR 101099454 B1 KR101099454 B1 KR 101099454B1 KR 1020090060023 A KR1020090060023 A KR 1020090060023A KR 20090060023 A KR20090060023 A KR 20090060023A KR 101099454 B1 KR101099454 B1 KR 101099454B1
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copper foil
foil layer
layer
polyimide film
adhesive
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KR1020090060023A
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Korean (ko)
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KR20110002527A (en
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이충식
신동민
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대덕지디에스 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Abstract

본 발명은 다층 연성회로기판 제조방법에 관한 것으로서, 제 1연성절연재와, 제 1연성절연재의 1이상의 면에 접착되어 회로 패턴이 형성되는 제 1동박층과, 제 1동박층에 접착되는 제 2연성절연재와, 얇은 두께를 가지는 접착제 접착층을 통하여 제 2연성절연재에 접착되어 회로 패턴이 형성되는 제 2동박층을 포함하여 이루어진다. 이러한 연성회로기판은 연성절연재와 접착층 및 동박층을 별도의 공정을 통하여 커버레이 원자재로서 미리 생산하였다가 연성동박적층판과 하나의 공정을 통하여 결합시킴으로써, 회로기판을 박판화하고 제조공정 및 제조비용을 절감할 수 있다.The present invention relates to a method for manufacturing a multi-layer flexible circuit board, comprising: a first flexible insulating material, a first copper foil layer bonded to at least one surface of the first flexible insulating material, and having a circuit pattern formed thereon, and a second bonded to the first copper foil layer. It comprises a flexible insulating material and a second copper foil layer bonded to the second flexible insulating material through the adhesive adhesive layer having a thin thickness to form a circuit pattern. The flexible circuit board is produced in advance as a coverlay material through a separate process by combining the flexible insulating material, the adhesive layer and the copper foil layer, and then combined with the flexible copper clad laminate board in one process, thereby thinning the circuit board and reducing the manufacturing process and manufacturing cost. can do.

연성회로기판, 커버레이, 박판화 Flexible Circuit Board, Coverlay, Thinning

Description

다층 연성회로기판 제조방법{A manufacturing method for multilayer flexible printed cirkit board}A manufacturing method for multilayer flexible printed cirkit board}

본 발명은 다층 연성회로기판 제조방법에 관한 것으로서, 절연재에 접착층 및 동박층이 미리 접착된 커버레이 원자재를 사용하여 다층 연성회로기판을 제조함으로써, 회로기판을 박판화하고 제조공정 및 제조비용을 절감하기 위한 것이다.The present invention relates to a method for manufacturing a multilayer flexible circuit board, wherein a multilayer flexible circuit board is manufactured by using a coverlay raw material in which an adhesive layer and a copper foil layer are previously bonded to an insulating material, thereby making the circuit board thin and reducing the manufacturing process and manufacturing cost. It is for.

전자기기는 고주파신호, 디지털화 등에 더하여 소형, 경량화가 진행되고 있으며, 이에 탑재되는 인쇄회로기판에 있어서도 소형, 고밀도 실장화 등이 요구되고 있다.In addition to high frequency signals and digitization, electronic devices are becoming smaller and lighter, and smaller and higher density mounting is also required in printed circuit boards mounted thereon.

따라서 경연성 기판에 있어서도 Fine pitch, 박판화의 요구가 증가하고 있다.Therefore, the demand for fine pitch and thickness reduction also increases in the flexible substrate.

종래의 다층 연성회로기판은, 폴리이미드 필름 상에 회로가 형성된 제 1동박층이 접착된 연성동박적층판(FCCL), 제 1동박층을 보호하는 커버레이, 커버레이에 접착되는 프리프레그(prepreg;PPG) 또는 본딩시트(Bonding sheet)로 이루어지는 접착시트, 접착시트에 접착되는 제 2동박층으로 구성된다.Conventional multilayer flexible printed circuit boards include a flexible copper clad laminate (FCCL) bonded to a first copper foil layer having a circuit formed on a polyimide film, a coverlay protecting the first copper foil layer, and a prepreg adhered to a coverlay; PPG) or an adhesive sheet composed of a bonding sheet, and a second copper foil layer bonded to the adhesive sheet.

커버레이는 절연성의 재질로 이루어지는 동시에 내굴곡성이 높은 재질로 이루어진다.The coverlay is made of an insulating material and is made of a material having high bending resistance.

제 1동박층은 내층 회로를 형성하고, 제 2동박층은 외층 회로를 형성한다.The first copper foil layer forms an inner layer circuit, and the second copper foil layer forms an outer layer circuit.

한편, 제 2동박층과 제 1동박층을 관통하는 블라인드 비아홀을 형성하고, 비아홀 내에 동도금을 실시함으로써, 제 1동박층과 제 2동박층을 도통시킨다.On the other hand, a blind via hole penetrating through the second copper foil layer and the first copper foil layer is formed, and copper plating is performed in the via hole to thereby conduct the first copper foil layer and the second copper foil layer.

커버레이를 구성하는 폴리이미드 필름은 통상 그 두께가 13~25um이고, 제 2동박층을 커버레이에 접착시키기 위해 사용되는 접착시트는 접착력을 갖는 반경화 상태로서 통상 그 두께가 12.5~50um이다. 이러한 접착시트는 주로 에폭시계열의 혼합 조성물이 사용된다.The polyimide film constituting the coverlay usually has a thickness of 13 to 25 µm, and the adhesive sheet used for adhering the second copper foil layer to the coverlay is a semi-cured state having adhesive strength and usually has a thickness of 12.5 to 50 µm. The adhesive sheet is mainly used in the epoxy-based mixed composition.

이하에서는 종래의 다층 연성회로기판 제조 공정을 살펴본다.Hereinafter, a conventional multilayer flexible circuit board manufacturing process will be described.

먼저 도 1과 같은 제 1폴리이미드 필름(10)의 양면에 제 1동박층(12)을 각각 접착한다. 이 과정은 에폭시계열의 접착제를 제 1폴리이미드 필름(10) 상에 코팅하여 제 1접착층(13)을 형성하여 제 1동박층(12)를 접착시키므로, 제 1접착층(13)을 매우 얇게 형성하는 것이 가능하다. 이 접착층의 두께는 5~40um이며, 5um 근방의 두께로 형성하는 것이 가능하다.First, the first copper foil layers 12 are adhered to both surfaces of the first polyimide film 10 as shown in FIG. 1. In this process, an epoxy-based adhesive is coated on the first polyimide film 10 to form a first adhesive layer 13 to bond the first copper foil layer 12 to form a very thin first adhesive layer 13. It is possible to. The thickness of this adhesive layer is 5-40 micrometers, and can be formed in the thickness of 5 micrometer vicinity.

그리고, 도 2와 같이 제 1동박층(12)에 에칭 공정으로 식각부분(14)을 형성함으로써 회로를 형성하고, 시트 상태로 절단한 상태에서 표면처리 한다.Then, as shown in FIG. 2, the etching portion 14 is formed in the first copper foil layer 12 by an etching process to form a circuit, and the surface treatment is performed in a state of cutting into a sheet state.

그리고, 도 3과 같이 커버레이를 구성하는 제 2폴리이미드 필름(20)에 제 1접착층(13)과 동일한 성분의 제 2접착층(22)을 반경화 상태로 코팅한 후, 제 2폴리이미드 필름(20)을 제 2접착층(22)에 가접한 후, 핫 프레스 공정을 통하여 제 2접 착층(22)과 제 2폴리이미드 필름(20)을 제 1동박층(12)에 완전 접착한다.And after coating the 2nd adhesive layer 22 of the same component as the 1st adhesive layer 13 to the 2nd polyimide film 20 which comprises a coverlay like FIG. 3 in the semi-cured state, a 2nd polyimide film After attaching the 20 to the second adhesive layer 22, the second adhesive layer 22 and the second polyimide film 20 are completely adhered to the first copper foil layer 12 through a hot pressing process.

그리고, 도 4와 같이 제 2폴리이미드 필름(20)의 상면에 프리프레그(prepreg) 또는 본딩시트(bonding sheet)로 이루어지는 접착시트(30)를 올리고, 그 위에 제 2동박층(40)을 가접시킨다. 이후 핫프레스 공정으로 제 2동박층(40)을 접착시트(30)의 상면에 완전 접착시킨다. Then, as shown in FIG. 4, the adhesive sheet 30 made of prepreg or bonding sheet is placed on the upper surface of the second polyimide film 20, and the second copper foil layer 40 is temporarily welded thereon. Let's do it. Thereafter, the second copper foil layer 40 is completely adhered to the upper surface of the adhesive sheet 30 by a hot press process.

그리고, 도 5와 같이 제 1동박층(12)과 제 2동박층(40)을 연결하기 위한 블라인드 비아홀(60)을 형성하고, 이 블라인드 비아홀(60)에 화학 동도금과 전기 동도금을 연속 실시하여 도금층(50)을 형성함으로써 제 1동박층(12)과 제 2동박층(40)을 전기적으로 접속시킨다.As shown in FIG. 5, a blind via hole 60 for connecting the first copper foil layer 12 and the second copper foil layer 40 is formed, and chemical copper plating and electric copper plating are continuously performed on the blind via hole 60. By forming the plating layer 50, the 1st copper foil layer 12 and the 2nd copper foil layer 40 are electrically connected.

그리고, 도 6과 같이 제 2동박층(40)에 에칭공정 등으로 식각부분(44)을 형성하여 회로를 형성한다.As shown in FIG. 6, an etching portion 44 is formed on the second copper foil layer 40 by an etching process to form a circuit.

이후, PSR 공정과 MK 공정 및 후공정을 통하여 다층 연성회로기판을 완성한다.Thereafter, the multilayer flexible printed circuit board is completed through a PSR process, an MK process, and a post process.

한편, 이와 같은 공정을 통해 완성되는 종래의 다층 연성회로기판은, 연성동박적층판과 커버레이가 접착된 후, 제 2동박층을 커버레이에 접착시킨다.On the other hand, in a conventional multilayer flexible circuit board completed through such a process, after the flexible copper clad laminate and the coverlay are bonded, the second copper foil layer is bonded to the coverlay.

따라서 제 2동박층을 커버레이에 접착시키는 공정으로서 12.5~50um의 두께를 갖는 접착시트를 핫프레스 공정으로 접착시키기 때문에 두께가 두꺼워졌으며, 그 공정수도 증가하였다. Therefore, as the process of adhering the second copper foil layer to the coverlay, since the adhesive sheet having a thickness of 12.5 ~ 50um is bonded by a hot press process, the thickness was increased, and the number of processes was also increased.

이와 같이, 종래의 다층 연성회로기판은 접착시트의 두께 만큼 박판화의 한계가 있으며, 접착시트를 접착하는 공정의 복잡성으로 인하여 연성 회로기판의 제 조비용이 높아지는 문제점 있었다.As described above, the conventional multilayer flexible circuit board has a limitation of thinning as much as the thickness of the adhesive sheet, and the manufacturing cost of the flexible circuit board increases due to the complexity of the process of adhering the adhesive sheet.

본 발명은 상기와 같은 문제점을 해소하기 위하여 안출한 것으로서, 본 발명의 목적은 절연재에 접착층 및 동박층이 미리 접착된 커버레이 원자재를 사용하여 다층 연성회로기판을 제조함으로써, 회로기판을 박판화하고 제조공정 및 제조비용을 절감하기 위한 것이다.The present invention has been made to solve the above problems, and an object of the present invention is to manufacture a multilayer flexible circuit board using a coverlay raw material in which an adhesive layer and a copper foil layer are previously bonded to an insulating material, thereby making the circuit board thin and manufactured. To reduce the process and manufacturing costs.

상기와 같은 목적을 달성하기 위한 본 발명인, 다층 연성회로기판 제조공정은, 제1폴리이미드필름 상에 에폭시계열의 접착제를 코팅하여 제1접착층을 형성한 후, 상기 제1접착층을 통해 상기 제1폴리이미드필름 상에 제1동박층을 접착시키고, 상기 제1동박층에 의해 회로 패턴을 형성하는 공정; 제2폴리이미드필름의 일면에 에폭시계열의 접착제를 코팅하여 제2접착층을 형성하고, 상기 제2접착층을 통해 상기 제2폴리이미드필름 제2동박층을 접착시키는 공정; 상기 제2폴리이미드필름의 타면에 에폭시계열의 접착제를 코팅하여 제3접착층을 형성하고, 상기 제3접착층을 반경화 상태로 건조시킨 후 이형지를 덮어서 완전 경화를 방지하는 공정; 상기 이형지가 제거된 상기 제3접착층을 상기 제1동박층에 가접한 후, 핫프레스 공정을 통해 상기 제3접착층에 의해 상기 제2폴리이미드필름을 상기 제1동박층에 완전 접착시키는 공정; 상기 제1동박층 및 상기 제2동박층을 전기적으로 연결하기 위하여 적어도 하나 이상의 블라인드 비아홀을 형성하는 공정: 및 상기 블라인드 비아홀에 도금층을 형성하고, 상기 제2동박층에 회로 패턴을 형성하는 공정을 포함하여 이루어진 것을 특징으로 한다.In the present invention, the multilayer flexible circuit board manufacturing process for achieving the above object, after coating an epoxy-based adhesive on the first polyimide film to form a first adhesive layer, the first adhesive layer through the first adhesive layer Bonding a first copper foil layer on the polyimide film, and forming a circuit pattern by the first copper foil layer; Coating an epoxy-based adhesive on one surface of the second polyimide film to form a second adhesive layer, and adhering the second polyimide film second copper foil layer through the second adhesive layer; Forming a third adhesive layer by coating an epoxy-based adhesive on the other surface of the second polyimide film, drying the third adhesive layer in a semi-cured state, and then covering the release paper to prevent complete curing; Attaching the third adhesive layer from which the release paper is removed to the first copper foil layer, and then completely bonding the second polyimide film to the first copper foil layer by the third adhesive layer through a hot press process; Forming at least one blind via hole to electrically connect the first copper foil layer and the second copper foil layer; and forming a plating layer in the blind via hole and forming a circuit pattern in the second copper foil layer. Characterized in that the made up.

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본 발명은, 절연재에 접착층 및 동박층이 미리 접착된 커버레이 원자재를 사용하여 다층 연성회로기판을 제조함으로써, 회로기판을 박판화하고 제조공정 및 제조비용을 절감할 수 있는 효과가 있다.According to the present invention, by manufacturing a multilayer flexible circuit board using a coverlay raw material in which an adhesive layer and a copper foil layer are previously bonded to an insulating material, the circuit board can be thinned, and the manufacturing process and manufacturing cost can be reduced.

이하에서는 본 발명의 실시예를 첨부도면과 함께 설명하여 본 발명의 실시를 구체화 한다.Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings to implement the present invention.

도 7내지 도 11은 본 발명의 일실시예로서 연성회로기판 제조 공정을 나타낸 도면이다.7 to 11 illustrate a flexible circuit board manufacturing process as an embodiment of the present invention.

본 실시예의 연성회로기판은, 제 1폴리이미드 필름(110)과, 제 1폴리이미드 필름(110)의 양면에 접착되어 회로 패턴이 형성되는 제 1동박층(112)과, 제 1동박층(112)에 접착되는 제 2폴리이미드 필름(130)과, 제 2폴리이미드 필름(130)에 10um이하의 두께를 갖는 접착제가 코팅된 접착층을 통해 접착되어 회로 패턴이 형성되는 제 2동박층(140)을 갖는다.The flexible circuit board according to the present embodiment may include a first polyimide film 110, a first copper foil layer 112 bonded to both surfaces of the first polyimide film 110, and a circuit pattern formed thereon, and a first copper foil layer ( The second copper foil layer 140 is bonded to the second polyimide film 130 adhered to 112 and the second polyimide film 130 through an adhesive layer coated with an adhesive having a thickness of 10 μm or less, thereby forming a circuit pattern 140. Has

제 1동박층(112)과 제 2동박층(140)을 전기적으로 연결하기 위하여 제 2폴리이미드 필름(130)을 관통하는 관통하는 1 이상의 블라인드 비아홀(through hole: 160)이 형성된다. 이 블라인드 비아홀(160)에 동도금층(150)이 형성된다.In order to electrically connect the first copper foil layer 112 and the second copper foil layer 140, one or more blind via holes penetrating through the second polyimide film 130 are formed. A copper plating layer 150 is formed in the blind via hole 160.

제 1폴리이미드 필름(110)과 제 2폴리이미드 필름(130)은 절연성의 재질로 이루어지는 동시에 내굴곡성이 높은 재질로 이루어진다.The first polyimide film 110 and the second polyimide film 130 are made of an insulating material and are made of a material having high bending resistance.

제 1동박층(112)은 내층 회로를 형성하고, 제 2동박층(140)은 외층 회로를 형성한다.The first copper foil layer 112 forms an inner layer circuit, and the second copper foil layer 140 forms an outer layer circuit.

폴리이미드 필름은 두께가 13~25um이며, 폴리이미드 필름을 접착시키기 위한 접착층과 동박층을 접착시키기 위한 접착층은 각각 10um이하의 두께를 갖도록 한다.The polyimide film has a thickness of 13 to 25 μm, and the adhesive layer for adhering the polyimide film and the adhesive layer for adhering the copper foil layer have a thickness of 10 μm or less, respectively.

각각의 접착층은 에폭시 계열의 혼합 조성물로 이루어지며, 러버(RUBBER) 30~50%, 에폭시(EPOXY) 40~60%, 경화제 10~30%로 구성함이 양호하다.Each adhesive layer is composed of an epoxy-based mixed composition, rubber (RUBBER) 30 to 50%, epoxy (EPOXY) 40 to 60%, preferably composed of 10 to 30% of the curing agent.

이하에서는 상기와 같은 연성회로기판을 제조하기 위한 공정을 설명한다.Hereinafter, a process for manufacturing the flexible circuit board as described above will be described.

먼저, 도 7과 같이 제 1폴리이미드 필름(110) 상에 에폭시계열의 접착제를 코팅하여 제 1접착층(113)을 형성한 후, 제 1접착층(113)에 도 8과 같이 제 1동박층(112)을 접착하고, 제 1동박층(112)에 회로 패턴을 형성한다.First, as shown in FIG. 7, an epoxy-based adhesive is coated on the first polyimide film 110 to form a first adhesive layer 113, and then the first copper foil layer (as illustrated in FIG. 8) on the first adhesive layer 113. 112 is bonded and a circuit pattern is formed in the 1st copper foil layer 112. FIG.

이 공정에서는 제 1동박층(112)의 두께를 약 5um로 매우 얇게 형성하는 것이 가능하다.In this process, it is possible to form the thickness of the first copper foil layer 112 very thin, about 5 um.

도 9와 같이 별도의 공정을 통하여, 제 2폴리이미드 필름(130)의 일면에 에폭시 계열의 접착제를 약 5um 두께로 코팅하여 제 2접착층(131)을 형성하고, 제 2접착층(131)에 제 2동박층(140)을 접착시킨다.Through a separate process as shown in FIG. 9, an epoxy-based adhesive is coated on one surface of the second polyimide film 130 to a thickness of about 5 μm to form a second adhesive layer 131, and the second adhesive layer 131 is formed of a second adhesive layer 131. 2 copper foil layer 140 is bonded.

그리고 제 2폴리이미드 필름(130)의 다른 면에 에폭시 계열의 접착제를 약 5um 두께로 코팅하여 제 3접착층(133)을 형성하고 반경화 상태로 건조시킨 후 이형지를 덮어서 완전 경화를 방지한다.In addition, an epoxy-based adhesive is coated on the other side of the second polyimide film 130 to a thickness of about 5 μm to form a third adhesive layer 133, dried in a semi-cured state, and then covered with a release paper to prevent complete curing.

그리고, 도 10과 같이 상기 이형지를 제거한 후 상기 제 2폴리이미드 필름(130)에 접착된 제 3접착층(133)을 제 1동박층(112)에 가접한 후, 핫프레스 공정으로 제 2폴리이미드 필름(130)을 제 1동박층(112)에 완전 접착시킨다.After removing the release paper as shown in FIG. 10, the third adhesive layer 133 attached to the second polyimide film 130 is temporarily welded to the first copper foil layer 112, and then the second polyimide is hot-pressed. The film 130 is completely adhered to the first copper foil layer 112.

이어서, 도 11과 같이 제 1동박층(112) 및 제 2동박층(140)을 전기적으로 연결하기 위하여 제 2폴리이미드 필름(130)을 관통하는 다수의 블라인드 비아홀(160)을 형성한다.Subsequently, a plurality of blind via holes 160 penetrating through the second polyimide film 130 are formed to electrically connect the first copper foil layer 112 and the second copper foil layer 140 as shown in FIG. 11.

그리고, 제 2동박층(140)과 블라인드 비아홀(160)의 내부에 화학 동도금을 실시하고 이어서 전기 동도금을 연속하여 실시하여 도금층(150)을 형성한다.Then, chemical copper plating is performed on the second copper foil layer 140 and the blind via hole 160, and then electroplating is successively performed to form the plating layer 150.

이 공정은, UV레이저 가공으로 비아홀(160)을 형성하는 방법과 CO2 레이저 가공으로 비아홀(160)을 형성하는 방법이 있다.This process includes a method of forming the via hole 160 by UV laser processing and a method of forming the via hole 160 by CO 2 laser processing.

그리고, 도 12와 같이 제 2동박층(140)에 식각부분(144)을 형성하여 회로 패턴을 형성한다.As shown in FIG. 12, an etching portion 144 is formed on the second copper foil layer 140 to form a circuit pattern.

이후, PSR 공정과 MK 공정 및 후공정을 통하여 다층 연성회로기판을 완성한다.Thereafter, the multilayer flexible printed circuit board is completed through a PSR process, an MK process, and a post process.

지금까지 본 발명을 바람직한 실시 예를 참조하여 상세히 설명하였지만, 본 발명이 상기한 실시 예에 한정되는 것은 아니며, 이하의 특허청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 또는 수정이 가능한 범위까지 본 발명의 기술적 사상이 미친다 할 것이다.Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above-described embodiments, and the technical field to which the present invention belongs without departing from the gist of the present invention as claimed in the following claims. Anyone skilled in the art will have the technical idea of the present invention to the extent that various modifications or changes are possible.

도 1 내지 도 6은 종래의 연성회로기판을 제조하는 공정을 나타낸 도면이고,1 to 6 are views showing a process for manufacturing a conventional flexible circuit board,

도 7내지 도 12는 본 발명의 일실시예에 의한 연성회로기판 제조공정을 나타낸 도면이다.7 to 12 are views illustrating a flexible circuit board manufacturing process according to an embodiment of the present invention.

〈도면의 주요 부분에 대한 부호의 설명〉Description of the Related Art

110: 제 1폴리이미드 필름 112:제 1동박층110: first polyimide film 112: first copper foil layer

114: 식각부분 130: 제 2폴리이미드 필름114: etching portion 130: the second polyimide film

140: 제 2동박층 150: 도금층140: second copper foil layer 150: plating layer

160: 블라인드 비아홀 160: blind via hole

Claims (4)

제1폴리이미드필름 상에 에폭시계열의 접착제를 코팅하여 제1접착층을 형성한 후, 상기 제1접착층을 통해 상기 제1폴리이미드필름 상에 제1동박층을 접착시키고, 상기 제1동박층에 의해 회로 패턴을 형성하는 공정;After the epoxy-based adhesive is coated on the first polyimide film to form a first adhesive layer, the first copper foil layer is adhered on the first polyimide film through the first adhesive layer, and then the first copper foil layer Forming a circuit pattern; 제2폴리이미드필름의 일면에 에폭시계열의 접착제를 코팅하여 10㎛이하의 두께를 갖는 제2접착층을 형성하고, 상기 제2접착층을 통해 상기 제2폴리이미드필름의 일면에 회로 패턴이 형성되는 제2동박층을 접착시키는 공정;An epoxy-based adhesive is coated on one surface of the second polyimide film to form a second adhesive layer having a thickness of 10 μm or less, and a circuit pattern is formed on one surface of the second polyimide film through the second adhesive layer. Bonding a copper foil layer; 상기 제2폴리이미드필름의 타면에 에폭시계열의 접착제를 코팅하여 제3접착층을 형성하고, 상기 제3접착층을 반경화 상태로 건조시킨 후 이형지를 덮어서 완전 경화를 방지하는 공정;Forming a third adhesive layer by coating an epoxy-based adhesive on the other surface of the second polyimide film, drying the third adhesive layer in a semi-cured state, and then covering the release paper to prevent complete curing; 상기 이형지가 제거된 상기 제3접착층을 상기 제1동박층에 가접한 후, 핫프레스 공정을 통해 상기 제3접착층에 의해 상기 제2폴리이미드필름을 상기 제1동박층에 완전 접착시키는 공정;Attaching the third adhesive layer from which the release paper is removed to the first copper foil layer, and then completely bonding the second polyimide film to the first copper foil layer by the third adhesive layer through a hot press process; 상기 제1동박층 및 상기 제2동박층을 전기적으로 연결하기 위하여 적어도 하나 이상의 블라인드 비아홀을 형성하는 공정: 및Forming at least one blind via hole to electrically connect the first copper foil layer and the second copper foil layer; and 상기 블라인드 비아홀에 도금층을 형성하고, 상기 제2동박층에 회로 패턴을 형성하는 공정을 포함하여 이루어진 것을 특징으로 하는 다층 연성회로기판 제조공정.Forming a plating layer in the blind via hole and forming a circuit pattern in the second copper foil layer. 삭제delete 삭제delete 삭제delete
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