JP2003318236A - 半導体ウェハの電気特性測定装置及び測定方法 - Google Patents

半導体ウェハの電気特性測定装置及び測定方法

Info

Publication number
JP2003318236A
JP2003318236A JP2003108292A JP2003108292A JP2003318236A JP 2003318236 A JP2003318236 A JP 2003318236A JP 2003108292 A JP2003108292 A JP 2003108292A JP 2003108292 A JP2003108292 A JP 2003108292A JP 2003318236 A JP2003318236 A JP 2003318236A
Authority
JP
Japan
Prior art keywords
probe
electrical
stimulus
semiconductor layer
characteristic measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003108292A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003318236A5 (enExample
Inventor
William H Howland
ウィリアム エイチ ハウランド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solid State Measurements Inc
Original Assignee
Solid State Measurements Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State Measurements Inc filed Critical Solid State Measurements Inc
Publication of JP2003318236A publication Critical patent/JP2003318236A/ja
Publication of JP2003318236A5 publication Critical patent/JP2003318236A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2003108292A 2002-04-11 2003-04-11 半導体ウェハの電気特性測定装置及び測定方法 Pending JP2003318236A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/121,130 US6894519B2 (en) 2002-04-11 2002-04-11 Apparatus and method for determining electrical properties of a semiconductor wafer
US10/121130 2002-04-11

Publications (2)

Publication Number Publication Date
JP2003318236A true JP2003318236A (ja) 2003-11-07
JP2003318236A5 JP2003318236A5 (enExample) 2006-05-25

Family

ID=29268665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003108292A Pending JP2003318236A (ja) 2002-04-11 2003-04-11 半導体ウェハの電気特性測定装置及び測定方法

Country Status (4)

Country Link
US (1) US6894519B2 (enExample)
EP (1) EP1363323A3 (enExample)
JP (1) JP2003318236A (enExample)
TW (1) TWI273256B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009540578A (ja) * 2006-06-06 2009-11-19 フォームファクター， インコーポレイテッド Ａｃ結合パラメトリック試験プローブ

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US6972582B2 (en) * 2003-02-10 2005-12-06 Solid State Measurements, Inc. Apparatus and method for measuring semiconductor wafer electrical properties
US20050110478A1 (en) * 2003-11-21 2005-05-26 Peng-Cheng Shi Method and apparatus for detecting electrostatic charges during semiconductor fabrication process
US7023231B2 (en) * 2004-05-14 2006-04-04 Solid State Measurements, Inc. Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
KR100595137B1 (ko) 2004-12-31 2006-06-30 동부일렉트로닉스 주식회사 Ｆｉｂ 장치를 이용한 반도체 소자의 전기적 특성 검사 방법
DE102008044884A1 (de) * 2008-08-29 2010-03-04 Albert-Ludwigs-Universität Freiburg Verfahren zur Bestimmung der Rekombinationseigenschaften an einem Messteilbereich einer Messseite einer Halbleiterstruktur
WO2015095857A2 (en) * 2013-12-22 2015-06-25 Lehighton Electronics, Inc. System and method for noncontact sensing maximum open circuit voltage of photovoltaic semiconductors
TWI555326B (zh) * 2015-05-29 2016-10-21 Lehighton Electronics Inc 非接觸式感測光伏半導體的最大開路電壓的裝置及方法
EP3374775B1 (de) * 2015-11-09 2019-09-04 Feinmetall GmbH Kontaktstift mit lichtquelle und kontaktstiftanordnung mit lichtquelle

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS5881944U (ja) * 1981-11-27 1983-06-03 株式会社日立製作所 半導体ウエハ検査装置
JPS6446946A (en) * 1987-07-22 1989-02-21 Akira Matsushita Semiconductor polarity discriminator
JPH05206243A (ja) * 1991-10-08 1993-08-13 Internatl Business Mach Corp <Ibm> ドーパント濃度の非接触測定方法

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JP2527965B2 (ja) * 1987-05-31 1996-08-28 浜松ホトニクス株式会社 電圧検出装置
JP2571385B2 (ja) * 1987-05-31 1997-01-16 浜松ホトニクス株式会社 電圧検出装置
US4812756A (en) * 1987-08-26 1989-03-14 International Business Machines Corporation Contactless technique for semicondutor wafer testing
US4859939A (en) * 1987-12-21 1989-08-22 The United States Of America As Represented By The Secretary Of The Army Non-destructive testing of SOS wafers using surface photovoltage measurements
US4891584A (en) * 1988-03-21 1990-01-02 Semitest, Inc. Apparatus for making surface photovoltage measurements of a semiconductor
US4891580A (en) * 1988-04-29 1990-01-02 American Telephone And Telegraph Co., At&T Bell Laboratories Electro-optic measurements of voltage waveforms on electrical conductors
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US5331275A (en) * 1991-12-09 1994-07-19 Fujitsu Limited Probing device and system for testing an integrated circuit
JPH06102295A (ja) * 1992-07-28 1994-04-15 Hewlett Packard Co <Hp> 非接触型プローブおよび非接触電圧測定装置
JP2802868B2 (ja) * 1992-12-22 1998-09-24 大日本スクリーン製造株式会社 半導体ウエハの非接触電気測定用センサおよびその製造方法、並びに、そのセンサを用いた測定方法
US5412330A (en) * 1993-06-16 1995-05-02 Tektronix, Inc. Optical module for an optically based measurement system
EP0892446B1 (en) * 1993-11-02 2006-05-24 Matsushita Electric Industrial Co., Ltd. Method of manufacturing an aggregate of semiconductor micro-needles and method of manufacturing a semiconductor device comprising an aggregate of semiconductor micro-needles
US5453703A (en) * 1993-11-29 1995-09-26 Semitest Inc. Method for determining the minority carrier surface recombination lifetime constant (ts of a specimen of semiconductor material
US5500607A (en) * 1993-12-22 1996-03-19 International Business Machines Corporation Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer
US5430305A (en) * 1994-04-08 1995-07-04 The United States Of America As Represented By The United States Department Of Energy Light-induced voltage alteration for integrated circuit analysis
US5596207A (en) * 1994-04-08 1997-01-21 Texas Instruments Incorporated Apparatus and method for detecting defects in insulative layers of MOS active devices
US5508627A (en) * 1994-05-11 1996-04-16 Patterson; Joseph M. Photon assisted sub-tunneling electrical probe, probe tip, and probing method
US5416429A (en) * 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
JPH0823014A (ja) * 1994-07-08 1996-01-23 Fujitsu Ltd 信号波形測定装置及び信号波形測定方法
TW341664B (en) * 1995-05-12 1998-10-01 Ibm Photovoltaic oxide charge measurement probe technique
US5744704A (en) * 1995-06-07 1998-04-28 The Regents, University Of California Apparatus for imaging liquid and dielectric materials with scanning polarization force microscopy
US6054393A (en) * 1997-01-09 2000-04-25 Texas Instruments Incorporated Method for improving the wet process chemical sequence
US5943552A (en) * 1997-02-06 1999-08-24 Seh America, Inc. Schottky metal detection method
US6097205A (en) * 1997-02-14 2000-08-01 Semitest, Inc. Method and apparatus for characterizing a specimen of semiconductor material
US6011404A (en) * 1997-07-03 2000-01-04 Lucent Technologies Inc. System and method for determining near--surface lifetimes and the tunneling field of a dielectric in a semiconductor
US6181144B1 (en) * 1998-02-25 2001-01-30 Micron Technology, Inc. Semiconductor probe card having resistance measuring circuitry and method fabrication
EP0974845A1 (en) * 1998-07-08 2000-01-26 Christian Leth Petersen Apparatus for testing electric properties using a multi-point probe
US6417673B1 (en) * 1998-11-19 2002-07-09 Lucent Technologies Inc. Scanning depletion microscopy for carrier profiling
US6163162A (en) * 1999-01-11 2000-12-19 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
ATE333652T1 (de) * 1999-10-19 2006-08-15 Solid State Measurements Inc Nicht-invasive elektrische messung von halbleiterscheiben
US6741093B2 (en) * 2000-10-19 2004-05-25 Solid State Measurements, Inc. Method of determining one or more properties of a semiconductor wafer
US6632691B1 (en) * 2002-04-11 2003-10-14 Solid State Measurements, Inc. Apparatus and method for determining doping concentration of a semiconductor wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5881944U (ja) * 1981-11-27 1983-06-03 株式会社日立製作所 半導体ウエハ検査装置
JPS6446946A (en) * 1987-07-22 1989-02-21 Akira Matsushita Semiconductor polarity discriminator
JPH05206243A (ja) * 1991-10-08 1993-08-13 Internatl Business Mach Corp <Ibm> ドーパント濃度の非接触測定方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009540578A (ja) * 2006-06-06 2009-11-19 フォームファクター， インコーポレイテッド Ａｃ結合パラメトリック試験プローブ

Also Published As

Publication number Publication date
EP1363323A3 (en) 2009-01-07
US6894519B2 (en) 2005-05-17
TWI273256B (en) 2007-02-11
TW200307137A (en) 2003-12-01
EP1363323A2 (en) 2003-11-19
US20030210066A1 (en) 2003-11-13

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