JP2003309214A - Method of manufacturing wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which is capable of manufacturing wiring boards formed with fine vias on an industrial base. <P>SOLUTION: The wiring board 30 is formed with the vias 18 through a resin board 10, with one end of each via bonded to a wiring pattern 22 formed on one face of the resin board 10. The method of manufacturing the wiring board 30 comprises steps of: forming the vias 18 by filling the through holes 12 with metals by electrolytic plating wherein a thin metal layer 14 formed on the entire surface including inner wall faces of the through holes 12 formed through the resin board 10 used as a power supply layer; forming, on one face of the resin board 10, a metal layer 20 which is thicker than a metal layer 16 formed on the other face of the resin board 10; then, etching the metal layers 16 and 20 formed on both faces of the resin board 10 so that a prescribed thickness of the metal layer 20 is left over on one face of the resin board 10 while the metal layer 16 formed on the other face of the resin board 10 is removed; and patterning the metal layer 20 left over on one face of the resin board 10, to form the wiring pattern 22. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board, and more specifically, one end side of a via formed through a resin plate is joined to a wiring pattern formed on one surface side of the resin plate. Manufacturing method of the wiring board.

[0002]

2. Description of the Related Art As a wiring board used for electronic equipment such as a semiconductor device, there is a wiring board 100 shown in FIG. 6, for example. The wiring board 100 shown in FIG. 6 is a multilayer wiring board, and the wiring pattern 102 including the pads 104 laminated in multiple layers is laminated via the resin layer 106 as an insulating layer, and the wiring pattern 102 and the pad 104 are , Resin layer 1
They are electrically connected to each other via a via 108 penetrating 06. In the wiring board 100 shown in FIG. 1, the electrode terminals of the semiconductor element 110 to be mounted are brought into contact with the pads 104, 104, ... Formed on the upper surface side thereof, and are formed on the lower surface side of the wiring board 100. Pad 10
An external connection terminal 112 such as a solder ball is attached to each of 4, 104. Wiring board 100 shown in FIG.
Is a plurality of resin boards 100a, 10 as shown in FIG.
It can be formed by stacking 0b and 100c. Each of the resin substrates 100a, 100b, 100c includes
Via 1 in which a wiring pattern 108 including a pad 104 is formed on one side or both sides of the resin layer 106 and one end side is joined to the pad 104 or the wiring pattern
08 is formed so as to penetrate the resin layer 106.

By the way, the resin substrates 100a, 100b,
Each of 100c is conventionally manufactured by the method shown in FIG. 8 or FIG. In the method shown in FIG. 8, first, the resin layer 10
6 is a single-sided copper clad plate shown in FIG.
Are formed [step of FIG. 8 (b)]. This via hole 120
The back surface of the copper foil 116 is exposed on the bottom surface of the. Next, the via holes 120 are filled with copper by electrolytic plating using the copper foil 116 as a power supply layer to form the vias 108 [step of FIG. 8C]. Then, by patterning the copper foil 116 by a known method, the wiring pattern 108 including the pad 104 having a desired shape can be formed.

In the method shown in FIG. 9, first, a photosensitive dry film 202 is attached to one surface of the aluminum plate 200 [step of FIG. 9 (a)], and the dry film 202 is patterned to a predetermined position. .. are formed in the substrate [step of FIG. 9B]. The aluminum plate 200 is exposed on the bottom surface of the recess 204. Furthermore, aluminum plate 20
After the recesses 204 are filled with copper metal to form the posts 206, 206 ... By electrolytic plating using 0 as a power supply layer [step of FIG. 9C], the dry film 202 is removed [FIG. ) Step]. Then post 206, 20
A resin having heat resistance is applied to one surface side of the aluminum plate 200 on which 6 ...
Step (e)]. A post 206 is formed on the formed resin layer 208,
Since 206 ... Are covered, the resin layer 208 is polished to make the upper surfaces of the posts 206, 206 ... As exposed surfaces [step of FIG. 9 (f)]. Then post 206, 20
After the wiring pattern 108 is formed on the exposed surface of the resin layer 208 where the respective upper surfaces 6 and 6 are exposed by a conventional method, the aluminum plate 200 is removed to form the resin substrate 1 shown in FIG.
00a, 100b can be formed.

By the way, when the wiring pattern 102 and the pad 104 are formed on both sides of the resin layer 106 like the resin substrate 100c shown in FIG. 7, after the step shown in FIG. A thin copper layer is formed on the other side of 106 by electroless plating. Next, electrolytic plating using the copper foil 116 as a power feeding layer is performed on the other surface side of the resin layer 106 to form a copper layer having a desired thickness on the other surface side of the resin layer 106. afterwards,
By patterning each of the copper foil 116 of the resin layer 106 and the copper layer formed by electrolytic plating, the resin layer 1
It is possible to obtain the wiring board 100c in which the wiring pattern 108 and the pad 104 having a desired shape are formed on both surface sides of 06. Alternatively, after the step shown in FIG.
After forming the wiring pattern 108 on the exposed surface of the resin layer 208 where the upper surfaces of 6, 206 ...
The aluminum plate 200 is removed. Then, a thin copper layer is formed by electroless plating on the surface of the resin layer 208 from which the aluminum plate 200 has been removed. Further, electrolytic plating using the formed thin copper layer as a power feeding layer is performed on the removal surface side of the resin layer 208, and a copper layer having a desired thickness is formed on the removal surface side of the resin layer 208. Then, the copper layer formed on the removed surface side of the resin layer 208 is patterned to obtain the wiring board 100c in which the wiring pattern 108 and the pad 104 having a desired shape are formed on both surface sides of the resin layer 208. .

[0006]

The via 108 or the post 206 of the resin substrate obtained by the method shown in FIG. 8 or 9 has a smaller diameter than the via formed by using the through hole formed in the resin plate by the drill. You can However, in the method shown in FIG. 8, the resin layer 106 is formed by laser irradiation on the inner wall surface of the via hole 120 formed by irradiating the laser from the other surface side of the single-sided copper clad plate shown in FIG. 8A. Foreign substances such as carbides formed by carbonizing the resin are attached.
Therefore, it is necessary to sufficiently remove the residue on the inner wall surface of the via hole 120 with an etching solution such as potassium permanganate. If such residue removal is insufficient,
Electrolytic plating using the copper foil 116 as a power supply layer may not sufficiently fill the via hole 120 with metal. On the other hand, by sufficiently removing the residue in the via hole 120, the metal can be sufficiently filled in the via hole 120 by electrolytic plating, but this reduces the productivity of the wiring board. In contrast to the method shown in FIG. 8, according to the method shown in FIG. 9, since the recesses 204 are formed using the dry film 202 without using a laser or the like, it is possible to easily remove the residue of the formed recesses 204. . However, in the method shown in FIG.
Compared with the method shown in FIG. 8, the process is long and complicated, and includes a polishing process [FIG. 9 (e)], so that it is difficult to reduce the thickness of the finally obtained wiring board.

Further, in the method shown in FIGS. 8 and 9, when the via hole 120 or the recess 204 is filled with metal by electrolytic plating, the circulation speed of the plating solution to the via hole 120 or the recess 204 (circulation of metal ions) Speed) is via hole 120
Alternatively, the smaller the opening diameter of the concave portion 204 is, the smaller it is, and the metal filling speed into the via hole 120 or the concave portion 204 becomes slower. Therefore, from the viewpoint of the metal filling speed into the via hole 120 or the concave portion 204, there is a limit to the opening diameter of the via hole 120 or the concave portion 204 that can be formed.
There is a limit to the diameter of 08. On the other hand, in recent years, the density of wiring patterns has been increasing in wiring boards as well.
It is desired to propose an industrial manufacturing method for fine vias. Then, the subject of this invention is providing the manufacturing method of the wiring board which can industrially produce the wiring board in which the fine via was formed.

[0008]

Means for Solving the Problems As a result of studies to solve the above-mentioned problems, the present inventor has found that a through hole formed by penetrating a resin plate by a laser has a stain formed on the inner wall surface by the laser. The inventors have found that the number is extremely smaller than that of the via holes 120, and that the plating solution in the through holes can be easily updated when electrolytic plating is performed in the through holes, and thus the present invention has been reached. That is, according to the present invention, when manufacturing a wiring board in which one end side of a via formed through a resin plate is joined to a wiring pattern formed on one surface side of the resin plate, the via is penetrated through the resin plate. By filling the through hole with metal to form a via by electrolytic plating using a thin metal layer formed on the entire surface including the inner wall surface of the through hole as a power supply layer, the resin is provided on one surface side of the resin plate. Forming a metal layer thicker than the metal layer formed on the other side of the plate, and then removing the metal layer formed on the other side of the resin plate,
After etching the metal layers formed on both sides of the resin plate so that a metal layer having a predetermined thickness remains on the one side of the resin plate, the metal layer remaining on the one side of the resin plate A method of manufacturing a wiring board is characterized by forming a wiring pattern by patterning.

In the present invention, by forming the through holes with a laser, fine vias can be finally formed, and by forming the thin metal layer by electroless plating, the inner wall surface of the fine through holes can also be formed. A thin metal layer can be formed.
By performing electrolytic plating using this thin metal layer as a power supply layer with the current density on one side of the resin plate higher than the current density on the other side, the thickness of the resin plate on one side and the other side can be increased. Different metal layers can be formed in one step. Also, by forming a joint portion made of a brazing material such as solder or conductive paste on the other end side of the via exposed on the other surface side of the resin plate, the vias can be laminated in multiple layers to facilitate stacked vias. Can be formed. Alternatively, mounting on a mounting substrate or the like can be facilitated by forming a connection terminal made of a brazing material such as a solder ball on the other end side of the via exposed on the other surface side of the resin plate. Further, a wiring pattern is formed on one surface side of the resin plate, and a plurality of resin substrates having vias penetrating through the resin plate are electrically connected to each other by the wiring patterns laminated in multiple layers. By stacking so as to be connected, a multilayer wiring board can be easily obtained.

In the present invention, the via is formed by utilizing the through hole formed through the resin plate. When the through hole is penetrated from one surface side to the other surface side of the resin plate, shavings generated during the formation of the through hole are blown to the other surface side of the resin plate. The residual amount of dust and the like can be made extremely smaller than that of the via hole 120, which is a recess where shavings and the like tend to remain, and the removal of the residue in the through hole can be simplified. Further, when forming a via by filling a metal into the through-hole by electrolytic plating, the plating solution in the through-hole has better liquid flow compared to the recess, and the plating solution in the through-hole is Since it is easily renewed as compared with the plating solution in the inside, even a through hole having a diameter smaller than the opening diameter of the recess can be filled with metal and fine vias can be formed. Moreover, at this time, since the metal layer is formed on the entire inner wall surface of the through hole, the via formed by filling the inside of the through hole with metal can be formed in a shorter time than before, and removal of residues in the through hole is easy. The productivity of the wiring board can be improved in combination with the realization.

[0011]

FIG. 1 shows an example of a method of manufacturing a wiring board according to the present invention. First, the resin plate 10 has through holes 12,
12 ... are formed [steps of FIGS. 1 (a) and 1 (b)]. As the resin plate 10, a resin plate used for a wiring board, for example, a resin plate made of epoxy resin or polyimide resin can be used. When the resin plate 10 is formed of a thermosetting resin, a resin plate semi-cured to the extent that the shape of the resin plate 10 can be retained can be used. As the resin plate 10, a resin plate reinforced with a reinforcing material made of an insulating material such as glass cloth can be preferably used. A known method can be used to form the through holes 12 in the resin plate 10 as described above. However, forming the through holes 12 by a laser can form fine through holes 12 having a diameter of about 30 μm. preferable. By the way, when forming the through hole 12 with a laser, as shown in FIG.
As shown in FIG. 5, the laser output can be set to a higher output than in the case where the via hole 120 is formed, and foreign matter such as a carbide formed by carbonizing the resin forming the resin plate 10 by laser irradiation is generated in the through hole 12. When formed, it blows out from the through hole 12, so that the amount of foreign matter adhering to the inner wall surface of the through hole 12 can be made extremely small. Therefore, the foreign matter attached to the inner wall surface or the like of the formed through hole 12 is removed (residue removal) by an etching solution such as potassium permanganate.
Although it does not need to be performed sufficiently as in the case of the method shown in FIG. 8, it is preferable to perform simple residue removal.

Resin plate 1 having through holes 12, 12 ...
For 0, the thin metal layer 14 is formed on the entire surface of the resin plate 10 including the inner wall surface of each through hole 12 by electroless plating [step of FIG. 1 (c)]. The thin metal layer 14 is preferably a thin metal layer made of copper. Then, a metal layer 16 is formed on the entire surface of the thin metal layer 14 by electrolytic plating using the thin metal layer 14 as a power feeding layer, and the through holes 12 are filled with metal to form vias 18 (FIG. 1D). Process]. As described above, according to the electrolytic plating in which the thin metal layer 14 formed on the entire inner wall surface of the through hole 12 is used as the power feeding layer, the electrolytic plating shown in FIG.
As in the case of filling the via hole 120 of FIG. 9B or the recess 204 of FIG. 9B with metal by electrolytic plating, the via hole 12
The filling speed of the metal can be made extremely high as compared with the case where the metal is sequentially filled from the copper foil 116 exposed on the bottom surface of the concave portion 204 or the aluminum plate 200. The metal layer 16 is preferably made of the same metal as the thin metal layer 14, and particularly preferably made of copper. At the time of this electrolytic plating, it is preferable to sufficiently stir the plating solution in which the resin plate 10 is immersed. By stirring, the plating solution in the through hole 12 can be quickly updated, and the filling speed of the metal in the through hole 12 can be improved.

After filling the through holes 12 with metal to form the vias 18, electrolytic plating is applied only to one surface side of the resin plate 10 [step of FIG. 1 (e)]. By such one-sided electroplating, the metal layer 20 formed on one surface side of the resin plate 10 can be formed thicker than the metal layer 16 formed on the other surface side of the resin plate 10. Thus, the metal layers 20 and 16 formed on both sides of the resin plate 10 are subjected to etching containing at least one of sulfuric acid, hydrochloric acid, hydrogen peroxide, formic acid, cupric chloride and ferric chloride, The metal layer 16 is removed to expose the other surface side of the resin plate 10 [step of FIG. 1 (f)]. During this etching, the metal layer 20 formed on the one surface side of the resin plate 10
Although the metal layer 20 is also etched,
Since the metal layer 16 is thicker than the above, when the metal layer 16 is removed and the other surface side of the resin plate 10 is exposed, the metal layer 20 remains on the one surface side of the resin layer 10 with a reduced thickness.

Thereafter, by patterning the metal layer 20 remaining on the one surface side of the resin layer 10, the wiring patterns 22, 22 connected to the vias 18, 18, ... On the one surface side of the resin layer 10. By forming .., the wiring board 30 can be obtained [step of FIG. 1 (g)]. As a patterning adopted in this step, a known method can be adopted. For example, a resist layer formed by applying a photosensitive resist on the metal layer 20 is exposed to light and developed, and the resist layer is left according to the wiring pattern to be formed. Then, by etching the metal layer 20 using the remaining resist layer as a mask, the wiring patterns 22, 22 ... Of a desired pattern can be formed. By laminating the plurality of wiring boards 30, 30 ... Obtained in this way, the multilayer wiring board shown in FIG. 6 can be obtained.

By the way, the wiring board 30 obtained by passing through the process of FIG. 1 (g) has wiring patterns 22, 22 ... Formed on one surface side of the resin plate 10. When forming the substrate, a wiring substrate having the wiring pattern 10 and the like formed on both sides of the resin plate 10 may be used. Such a wiring board in which the wiring patterns 10 and the like are formed on both sides of the resin plate 10 has a metal layer 16 of a predetermined thickness on both sides of the resin plate 10 by electrolytic plating in the step shown in FIG. , 16 and then each metal layer 1
It can be obtained by patterning 6.

Further, when a plurality of wiring boards 30 are laminated to form a multi-layer wiring board, the via 18 and the wiring pattern 22 formed on another wiring board 30 are joined together in a favorable manner as shown in FIG. By removing the metal layer 16 by etching in the step (f), a joint portion 24 made of a brazing material such as solder or conductive paste is formed on the other end side of the via 18 exposed on the other surface side of the resin plate 10. It is preferable that [Fig. 1
Step (h)]. At this time, in order to prevent migration of the metal forming the via 18 and the metal forming the joint portion 24, a barrier layer such as nickel is formed on the other end surface of the via 18 by plating or the like, and then solder or a conductive paste is formed. It is also preferable to form the joint portion 24 made of a brazing material such as. When a plurality of wiring boards 30, 30 ... Obtained through the step of FIG. 1 (h) are laminated in multiple layers, the via 18 and the wiring pattern 22 can be reliably joined together. As shown, it is possible to easily form a multilayer wiring board in which a stacked via in which a plurality of vias 18, 18, ... Are laminated in series is formed.

The wiring board 30 obtained by passing through the steps shown in FIG. 1G can also be used as a single-layer wiring board 40 as shown in FIG. The single-layer wiring board 40 shown in FIG. 3 has wiring patterns 22, 22 formed on one surface side of the resin plate 10.
··· Vias 18, 18 on which pads for contacting terminals of other electronic parts are formed and exposed on the other surface side of the resin plate 10
..External connection terminals 28 such as solder balls on each end face
28 ... is attached. In the single-layer wiring board 40, one surface side of the resin plate 10 is covered with the protective resist 26 except for the pads of the wiring patterns 22, 22 ... Connected to the terminals of other electronic components, and the resin plate 10 is also covered. The other surface side is also covered with the protective resist 26 except for the external connection terminals 28, 28 ,.

The wiring board 30 obtained through the process shown in FIG. 1G can also be used as a wiring board 50 for a semiconductor device, as shown in FIG. On the wiring board 50 for the semiconductor device shown in FIG. 4, the external connection terminals 28, 28, ..., such as solder balls, are mounted on the pads of the wiring patterns 22, 22 ,. It is used as a pad for external connection terminals. The one surface of the resin plate 10 has a protective resist 2 except for pads for external connection terminals.
It is covered with 6. Further, bumps 34, 34, ... Made of a brazing material such as solder are formed on each end surface of the vias 18, 18 exposed on the other surface side of the resin plate 10, and electrode terminals of the semiconductor element 32 to be mounted are formed. Are joined. The gap between the mounted semiconductor element 32 and the other surface of the resin plate 10 is sealed with a sealing resin 36 such as an underfill material.

By the way, in the process shown in FIG.
Filling 2 with metal to form via 18 [Fig. 1
Step (d)] and electrolytic plating is performed only on one surface side of the resin plate 10 to form a metal layer 20 thicker than the metal layer 16 formed on the other surface side on the one surface side of the resin plate 10 by single-sided electrolytic plating. The process [the process of FIG. 1 (e)] was divided into two processes. However, as shown in FIG. 5, these two steps are applied to each of the one surface side and the other surface side of the resin plate so that the current density on one surface side of the resin plate is higher than the current density on the other surface side. The electrolytic plating performed by controlling the electric current value can be performed in one step in the same electrolytic plating bath. First, as shown in FIG. 5 (a), a power source 1 and a power source 2 are used as two power source devices and are connected to respective anodes of the power source 1 and the power source 2 in the electrolytic plating solution 42 of the electrolytic plating tank 40. The copper electrode plates 44a and 44b as the anode electrodes are immersed. This copper electrode plate 44a,
A resin plate 10 having a metal layer 14 made of copper formed on the entire surface including the inner wall surfaces of the formed through holes 12, 12 ... Is disposed between the 44b, and the thin metal layer 14 is connected to the power source 1 and It is connected to each cathode of the power supply 2. Copper electrode plates 44a, 44b
The distance between the resin plate 10 and the resin plate 10 is equal on both sides of the resin plate 10.

In FIG. 5 (a), electrolytic copper plating is started with the value of the current flowing between the anode and the cathode of the power source 1 being larger than the value of the current flowing between the anode and the cathode of the power source 2. In this way, by controlling the power source 1 and the power source 2 so that the value of the current flowing on one side of the resin plate 10 is larger than the value of the current flowing on the other side, the one side of the resin plate 10 Current density,
The current density on the other surface side of the resin plate 10 can be made higher. By performing electrolytic copper plating while maintaining such a current density difference, as shown in FIG. 5B, the through holes 12, 12 ... Penetrating the resin plate 10 are filled with copper metal and the vias 18, 1 are formed.
A metal layer 20 that is thicker than the metal layer 16 that is formed on one surface side of the resin plate 10 that has a high current density.
Can be formed.

In FIGS. 5A and 5B, the power source 1 and the power source 2
, And the electrolytic copper plating is performed so that the current value flowing between the anode and the cathode of the power source 1 is larger than the current value flowing between the anode and the cathode of the power source 2, but one power source is used. Even with electrolytic plating, the current density on one side of the resin plate 10 is
The current density on the other surface side of 0 can be made higher. That is, the copper electrode plates 44a and 44b connected to the anode of the single power source,
The gap between the resin plate 10 and the entire surface covered with the thin metal layer 14 connected to the cathode of the same power source is different. For example, the gap between the copper electrode 44a and the one surface of the resin plate 10 is set to the copper electrode 44.
By making the distance between b and the other surface side of the resin plate 10 narrower, the current density on the one surface side of the resin plate 10 can be reduced.
It can be higher than the current density on the other surface side. As a result, the metal layer 20 thicker than the metal layer 16 formed on the one surface of the resin plate 10 on the other surface can be formed in one step.

[0022]

According to the present invention, it is possible to industrially produce a wiring board on which fine vias are formed, and it is possible to cope with a high density of a wiring pattern or the like of the wiring board.

[Brief description of drawings]

FIG. 1 is a process drawing for explaining an example of a method of manufacturing a wiring board according to the present invention.

FIG. 2 is a partial cross-sectional view of a multilayer wiring board formed by laminating a plurality of wiring boards obtained in the step shown in FIG.

FIG. 3 is a partial cross-sectional view of a single-layer wiring board using the wiring board obtained in the step shown in FIG. 1 as a single layer.

FIG. 4 is a cross-sectional view of a wiring board for a semiconductor device using the wiring board obtained in the step shown in FIG.

FIG. 5 is an explanatory diagram illustrating another example of the steps shown in FIGS. 1D and 1E.

FIG. 6 is a partial cross-sectional view showing an example of a multilayer wiring board.

FIG. 7 is an explanatory view explaining a manufacturing method for manufacturing the multilayer wiring board shown in FIG. 6;

8A to 8C are process diagrams illustrating an example of a conventional method for manufacturing the wiring board shown in FIG.

9A to 9C are process drawings for explaining another example of the conventional method for manufacturing the wiring board shown in FIG.

[Explanation of symbols]

10 resin plate 12 through holes 14 Thin metal layer 16,20 Metal layer 18 Via 22 wiring pattern 24 joints 28 External connection terminal 34 bump 44a, 44b Electrode plate

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H01L 23/12 NF term (reference) 5E317 AA01 AA24 BB02 BB12 BB18 CC32 CC33 CC38 CC44 CC51 CD25 CD32 GG14 5E346 AA06 AA12 AA15 AA22 AA35 AA43 BB01 BB16 CC02 CC09 CC32 CC33 CC40 DD02 DD25 DD32 FF07 FF35 GG15 GG17 GG22 GG28 HH07 HH25

Claims (7)

[Claims] 1. When manufacturing a wiring board in which one end side of a via formed through a resin plate is joined to a wiring pattern formed on one surface side of the resin plate, the via hole penetrates through the resin plate. By electrolytic plating using a thin metal layer formed on the entire surface including the inner wall surface of the through hole as a power supply layer, the through hole is filled with metal to form a via,
On one side of the resin plate, a metal layer thicker than the metal layer formed on the other side of the resin plate is formed, and then, when the metal layer formed on the other side of the resin plate is removed, After etching the metal layers formed on both sides of the resin plate so that a metal layer having a predetermined thickness remains on the one side of the resin plate, patterning on the metal layer remaining on the one side of the resin plate And a wiring pattern are formed, the method for manufacturing a wiring board. 2. The method for manufacturing a wiring board according to claim 1, wherein the through hole is formed by laser. 3. The method for manufacturing a wiring board according to claim 1, wherein the thin metal layer is formed by electroless plating. 4. The electrolytic plating is carried out with the current density on one surface side of the resin plate being higher than the current density on the other surface side.
A method for manufacturing a wiring board according to any one of 1. 5. The wiring according to claim 1, wherein a joint portion made of a brazing material such as solder or conductive paste is formed on the other end side of the via exposed on the other surface side of the resin plate. Substrate manufacturing method. 6. The wiring board manufacturing method according to claim 1, wherein a connecting terminal made of a brazing material such as a solder ball is formed on the other end side of the via exposed on the other surface side of the resin plate. Method. 7. A wiring pattern is formed on one surface side of a resin plate, and a plurality of resin substrates having vias penetrating the resin plate are electrically laminated by a via wiring pattern. The method for manufacturing a wiring board according to claim 1, wherein the wiring boards are laminated so as to be connected to each other.