JP2003303946A - 固体撮像装置およびその製造方法 - Google Patents

固体撮像装置およびその製造方法

Info

Publication number
JP2003303946A
JP2003303946A JP2002110071A JP2002110071A JP2003303946A JP 2003303946 A JP2003303946 A JP 2003303946A JP 2002110071 A JP2002110071 A JP 2002110071A JP 2002110071 A JP2002110071 A JP 2002110071A JP 2003303946 A JP2003303946 A JP 2003303946A
Authority
JP
Japan
Prior art keywords
solid
state imaging
transparent substrate
imaging device
connection region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002110071A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003303946A5 (https=
Inventor
Hideo Yamanaka
英雄 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2002110071A priority Critical patent/JP2003303946A/ja
Publication of JP2003303946A publication Critical patent/JP2003303946A/ja
Publication of JP2003303946A5 publication Critical patent/JP2003303946A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/285—Alignment aids, e.g. alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Wire Bonding (AREA)
JP2002110071A 2002-04-12 2002-04-12 固体撮像装置およびその製造方法 Pending JP2003303946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002110071A JP2003303946A (ja) 2002-04-12 2002-04-12 固体撮像装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002110071A JP2003303946A (ja) 2002-04-12 2002-04-12 固体撮像装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2003303946A true JP2003303946A (ja) 2003-10-24
JP2003303946A5 JP2003303946A5 (https=) 2005-09-08

Family

ID=29393322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002110071A Pending JP2003303946A (ja) 2002-04-12 2002-04-12 固体撮像装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2003303946A (https=)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP2006108690A (ja) * 2004-10-08 2006-04-20 Easetech Korea Co Ltd 再配線基板を用いたウェーハレベルチップスケールパッケージの製造方法
JP2006147916A (ja) * 2004-11-22 2006-06-08 Matsushita Electric Ind Co Ltd 光学デバイス及び光学装置
JP2010010580A (ja) * 2008-06-30 2010-01-14 Fujinon Corp 撮像モジュール及びその製造方法並びに内視鏡装置
JP2010118469A (ja) * 2008-11-12 2010-05-27 Fujitsu Ltd 半導体装置及びその製造方法
JP2011114054A (ja) * 2009-11-25 2011-06-09 Dainippon Printing Co Ltd センサーユニットおよびその製造方法
JP2011254528A (ja) * 2005-09-29 2011-12-15 Cao Jin Science&Technology Co Ltd ウエハーレベルの撮像モジュールの製造方法、及び組み立て設備
JP2012007926A (ja) * 2010-06-23 2012-01-12 Hitachi Consumer Electronics Co Ltd 放射線検出器の製造方法、及び放射線検出器
JP2012124318A (ja) * 2010-12-08 2012-06-28 Sony Corp 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP2013175861A (ja) * 2012-02-24 2013-09-05 Fujifilm Corp 基板モジュールおよびその製造方法
WO2020039733A1 (ja) * 2018-08-21 2020-02-27 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
JP7160865B2 (ja) 2020-07-16 2022-10-25 ソニー・オリンパスメディカルソリューションズ株式会社 医療用カメラヘッド及び医療用カメラ装置
US11587964B2 (en) 2019-03-22 2023-02-21 Canon Kabushiki Kaisha Method of manufacturing package unit, package unit, electronic module, and equipment

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP2006108690A (ja) * 2004-10-08 2006-04-20 Easetech Korea Co Ltd 再配線基板を用いたウェーハレベルチップスケールパッケージの製造方法
JP2006147916A (ja) * 2004-11-22 2006-06-08 Matsushita Electric Ind Co Ltd 光学デバイス及び光学装置
JP2011254528A (ja) * 2005-09-29 2011-12-15 Cao Jin Science&Technology Co Ltd ウエハーレベルの撮像モジュールの製造方法、及び組み立て設備
JP2010010580A (ja) * 2008-06-30 2010-01-14 Fujinon Corp 撮像モジュール及びその製造方法並びに内視鏡装置
JP2010118469A (ja) * 2008-11-12 2010-05-27 Fujitsu Ltd 半導体装置及びその製造方法
JP2011114054A (ja) * 2009-11-25 2011-06-09 Dainippon Printing Co Ltd センサーユニットおよびその製造方法
JP2012007926A (ja) * 2010-06-23 2012-01-12 Hitachi Consumer Electronics Co Ltd 放射線検出器の製造方法、及び放射線検出器
JP2012124318A (ja) * 2010-12-08 2012-06-28 Sony Corp 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP2013175861A (ja) * 2012-02-24 2013-09-05 Fujifilm Corp 基板モジュールおよびその製造方法
WO2020039733A1 (ja) * 2018-08-21 2020-02-27 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
JPWO2020039733A1 (ja) * 2018-08-21 2021-08-26 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
JP7414720B2 (ja) 2018-08-21 2024-01-16 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
US12074182B2 (en) 2018-08-21 2024-08-27 Sony Semiconductor Solutions Corporation Semiconductor device, electronic apparatus, and method for manufacturing semiconductor device
US11587964B2 (en) 2019-03-22 2023-02-21 Canon Kabushiki Kaisha Method of manufacturing package unit, package unit, electronic module, and equipment
US11830722B2 (en) 2019-03-22 2023-11-28 Canon Kabushiki Kaisha Method of manufacturing package unit, package unit, electronic module, and equipment
JP7160865B2 (ja) 2020-07-16 2022-10-25 ソニー・オリンパスメディカルソリューションズ株式会社 医療用カメラヘッド及び医療用カメラ装置

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