JP2003303946A - 固体撮像装置およびその製造方法 - Google Patents

固体撮像装置およびその製造方法

Info

Publication number
JP2003303946A
JP2003303946A JP2002110071A JP2002110071A JP2003303946A JP 2003303946 A JP2003303946 A JP 2003303946A JP 2002110071 A JP2002110071 A JP 2002110071A JP 2002110071 A JP2002110071 A JP 2002110071A JP 2003303946 A JP2003303946 A JP 2003303946A
Authority
JP
Japan
Prior art keywords
solid
state imaging
transparent substrate
imaging device
connection region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002110071A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003303946A5 (enExample
Inventor
Hideo Yamanaka
英雄 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2002110071A priority Critical patent/JP2003303946A/ja
Publication of JP2003303946A publication Critical patent/JP2003303946A/ja
Publication of JP2003303946A5 publication Critical patent/JP2003303946A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Wire Bonding (AREA)
JP2002110071A 2002-04-12 2002-04-12 固体撮像装置およびその製造方法 Pending JP2003303946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002110071A JP2003303946A (ja) 2002-04-12 2002-04-12 固体撮像装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002110071A JP2003303946A (ja) 2002-04-12 2002-04-12 固体撮像装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2003303946A true JP2003303946A (ja) 2003-10-24
JP2003303946A5 JP2003303946A5 (enExample) 2005-09-08

Family

ID=29393322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002110071A Pending JP2003303946A (ja) 2002-04-12 2002-04-12 固体撮像装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2003303946A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP2006108690A (ja) * 2004-10-08 2006-04-20 Easetech Korea Co Ltd 再配線基板を用いたウェーハレベルチップスケールパッケージの製造方法
JP2006147916A (ja) * 2004-11-22 2006-06-08 Matsushita Electric Ind Co Ltd 光学デバイス及び光学装置
JP2010010580A (ja) * 2008-06-30 2010-01-14 Fujinon Corp 撮像モジュール及びその製造方法並びに内視鏡装置
JP2010118469A (ja) * 2008-11-12 2010-05-27 Fujitsu Ltd 半導体装置及びその製造方法
JP2011114054A (ja) * 2009-11-25 2011-06-09 Dainippon Printing Co Ltd センサーユニットおよびその製造方法
JP2011254528A (ja) * 2005-09-29 2011-12-15 Cao Jin Science&Technology Co Ltd ウエハーレベルの撮像モジュールの製造方法、及び組み立て設備
JP2012007926A (ja) * 2010-06-23 2012-01-12 Hitachi Consumer Electronics Co Ltd 放射線検出器の製造方法、及び放射線検出器
JP2012124318A (ja) * 2010-12-08 2012-06-28 Sony Corp 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP2013175861A (ja) * 2012-02-24 2013-09-05 Fujifilm Corp 基板モジュールおよびその製造方法
WO2020039733A1 (ja) * 2018-08-21 2020-02-27 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
JP7160865B2 (ja) 2020-07-16 2022-10-25 ソニー・オリンパスメディカルソリューションズ株式会社 医療用カメラヘッド及び医療用カメラ装置
US11587964B2 (en) 2019-03-22 2023-02-21 Canon Kabushiki Kaisha Method of manufacturing package unit, package unit, electronic module, and equipment

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP2006108690A (ja) * 2004-10-08 2006-04-20 Easetech Korea Co Ltd 再配線基板を用いたウェーハレベルチップスケールパッケージの製造方法
JP2006147916A (ja) * 2004-11-22 2006-06-08 Matsushita Electric Ind Co Ltd 光学デバイス及び光学装置
JP2011254528A (ja) * 2005-09-29 2011-12-15 Cao Jin Science&Technology Co Ltd ウエハーレベルの撮像モジュールの製造方法、及び組み立て設備
JP2010010580A (ja) * 2008-06-30 2010-01-14 Fujinon Corp 撮像モジュール及びその製造方法並びに内視鏡装置
JP2010118469A (ja) * 2008-11-12 2010-05-27 Fujitsu Ltd 半導体装置及びその製造方法
JP2011114054A (ja) * 2009-11-25 2011-06-09 Dainippon Printing Co Ltd センサーユニットおよびその製造方法
JP2012007926A (ja) * 2010-06-23 2012-01-12 Hitachi Consumer Electronics Co Ltd 放射線検出器の製造方法、及び放射線検出器
JP2012124318A (ja) * 2010-12-08 2012-06-28 Sony Corp 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP2013175861A (ja) * 2012-02-24 2013-09-05 Fujifilm Corp 基板モジュールおよびその製造方法
WO2020039733A1 (ja) * 2018-08-21 2020-02-27 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
JPWO2020039733A1 (ja) * 2018-08-21 2021-08-26 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
JP7414720B2 (ja) 2018-08-21 2024-01-16 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法
US12074182B2 (en) 2018-08-21 2024-08-27 Sony Semiconductor Solutions Corporation Semiconductor device, electronic apparatus, and method for manufacturing semiconductor device
US11587964B2 (en) 2019-03-22 2023-02-21 Canon Kabushiki Kaisha Method of manufacturing package unit, package unit, electronic module, and equipment
US11830722B2 (en) 2019-03-22 2023-11-28 Canon Kabushiki Kaisha Method of manufacturing package unit, package unit, electronic module, and equipment
JP7160865B2 (ja) 2020-07-16 2022-10-25 ソニー・オリンパスメディカルソリューションズ株式会社 医療用カメラヘッド及び医療用カメラ装置

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