JP2003297809A5 - - Google Patents
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- Publication number
- JP2003297809A5 JP2003297809A5 JP2002096896A JP2002096896A JP2003297809A5 JP 2003297809 A5 JP2003297809 A5 JP 2003297809A5 JP 2002096896 A JP2002096896 A JP 2002096896A JP 2002096896 A JP2002096896 A JP 2002096896A JP 2003297809 A5 JP2003297809 A5 JP 2003297809A5
- Authority
- JP
- Japan
- Prior art keywords
- yag
- plasma etching
- yttrium oxide
- film
- yttrium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 21
- 238000001020 plasma etching Methods 0.000 claims description 14
- 229910052727 yttrium Inorganic materials 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- -1 yttrium compound Chemical class 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 5
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000007750 plasma spraying Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000003891 oxalate salts Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002096896A JP3613472B2 (ja) | 2002-03-29 | 2002-03-29 | プラズマエッチング装置用部材及びその製造方法 |
| TW092125680A TWI242245B (en) | 2002-03-29 | 2003-09-16 | Component for plasma etching device and the making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002096896A JP3613472B2 (ja) | 2002-03-29 | 2002-03-29 | プラズマエッチング装置用部材及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003297809A JP2003297809A (ja) | 2003-10-17 |
| JP2003297809A5 true JP2003297809A5 (OSRAM) | 2004-12-24 |
| JP3613472B2 JP3613472B2 (ja) | 2005-01-26 |
Family
ID=29387549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002096896A Expired - Lifetime JP3613472B2 (ja) | 2002-03-29 | 2002-03-29 | プラズマエッチング装置用部材及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3613472B2 (OSRAM) |
| TW (1) | TWI242245B (OSRAM) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003266517A1 (en) | 2003-09-16 | 2005-04-11 | Shin-Etsu Quartz Products Co., Ltd. | Member for plasma etching device and method for manufacture thereof |
| TWI282597B (en) | 2004-12-28 | 2007-06-11 | Toshiba Ceramics Co | Yttrium-containing ceramic coated material and method of manufacturing the same |
| JP4981294B2 (ja) * | 2005-09-30 | 2012-07-18 | 株式会社フジミインコーポレーテッド | 溶射皮膜 |
| JP2010183092A (ja) * | 2005-11-15 | 2010-08-19 | Panasonic Corp | プラズマ処理装置 |
| JP5283824B2 (ja) | 2006-01-18 | 2013-09-04 | 東京応化工業株式会社 | 膜形成組成物 |
| JP4970887B2 (ja) * | 2006-10-06 | 2012-07-11 | 株式会社アルバック | 装置構成部品の再生方法 |
| CN101971715B (zh) | 2008-03-05 | 2016-09-28 | Emd株式会社 | 高频天线单元及等离子处理装置 |
| US10961620B2 (en) * | 2016-03-04 | 2021-03-30 | Beneq Oy | Plasma etch-resistant film and a method for its fabrication |
| US11017984B2 (en) * | 2016-04-28 | 2021-05-25 | Applied Materials, Inc. | Ceramic coated quartz lid for processing chamber |
| JP6991474B2 (ja) * | 2017-02-28 | 2022-01-12 | 国立大学法人長岡技術科学大学 | 酸化ケイ素基材上に酸化イットリウム膜が形成された複合材料の製造方法 |
| TWI709653B (zh) * | 2018-02-15 | 2020-11-11 | 日商京瓷股份有限公司 | 電漿處理裝置用構件及具備其之電漿處理裝置 |
| US11087961B2 (en) * | 2018-03-02 | 2021-08-10 | Lam Research Corporation | Quartz component with protective coating |
| JP7115582B2 (ja) * | 2020-04-30 | 2022-08-09 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| TW202302910A (zh) | 2020-04-30 | 2023-01-16 | 日商Ｔｏｔｏ股份有限公司 | 複合結構物及具備複合結構物之半導體製造裝置 |
| JP7140222B2 (ja) * | 2020-04-30 | 2022-09-21 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| CN117985949B (zh) * | 2024-04-03 | 2024-06-21 | 苏州高芯众科半导体有限公司 | 一种硅钇铝铬镁氧中间相喷涂粉及其制备方法 |
-
2002
- 2002-03-29 JP JP2002096896A patent/JP3613472B2/ja not_active Expired - Lifetime
-
2003
- 2003-09-16 TW TW092125680A patent/TWI242245B/zh not_active IP Right Cessation
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