JP2003297555A - Manufacturing method of organic el display and organic el display substrate - Google Patents
Manufacturing method of organic el display and organic el display substrateInfo
- Publication number
- JP2003297555A JP2003297555A JP2002097556A JP2002097556A JP2003297555A JP 2003297555 A JP2003297555 A JP 2003297555A JP 2002097556 A JP2002097556 A JP 2002097556A JP 2002097556 A JP2002097556 A JP 2002097556A JP 2003297555 A JP2003297555 A JP 2003297555A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- organic
- sealing material
- sealing
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 210
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000007789 sealing Methods 0.000 claims abstract description 85
- 239000000463 material Substances 0.000 claims abstract description 82
- 239000003566 sealing material Substances 0.000 claims description 177
- 230000002093 peripheral effect Effects 0.000 claims description 90
- 238000000034 method Methods 0.000 claims description 19
- 238000005304 joining Methods 0.000 claims description 7
- 239000000565 sealant Substances 0.000 claims description 7
- 230000006866 deterioration Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、有機ＥＬディスプ
レイの製造方法に関し、特に、基板上に形成された有機
ＥＬ素子を保護するために用いられる対向基板を基板上
に固定するための方法および有機ＥＬディスプレイ用基
板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an organic EL display, and more particularly to a method and an organic material for fixing a counter substrate used for protecting an organic EL element formed on the substrate on the substrate. The present invention relates to an EL display substrate.
【０００２】[0002]
【従来の技術】近年、有機ＥＬ（電界発光）素子を使用
した有機ＥＬディスプレイの研究が盛んに行われてい
る。有機ＥＬディスプレイは、自発光式表示素子であ
り、液晶表示装置と比較して視野角が広い。また、応答
速度も速く、有機物が有する発光性の多様性から、次世
代の表示装置として期待されている。有機ＥＬ素子は、
それぞれに電極が設けられた対向する基板間に薄膜状の
有機化合物を複数層重ねて製造される。2. Description of the Related Art In recent years, researches on organic EL displays using organic EL (electroluminescence) elements have been actively conducted. The organic EL display is a self-luminous display element and has a wider viewing angle than a liquid crystal display device. Further, the response speed is fast, and the organic materials are expected to be a next-generation display device due to the diversity of light emitting properties. The organic EL element is
It is manufactured by stacking a plurality of thin film organic compounds between opposing substrates provided with electrodes.
【０００３】このような有機ＥＬ素子は、水分に非常に
弱いという問題がある。例えば、有機ＥＬ素子内に侵入
した水分によって、有機ＥＬ材料としての有機物の変質
や電極の腐食などが発生する。その結果、非発光領域が
発生し、さらに非発光領域が拡大して発光効率が低下す
る。このように、有機ＥＬ素子内に侵入した水分によっ
て発光品位が劣化する。Such an organic EL device has a problem that it is very sensitive to moisture. For example, the moisture that has entered the organic EL element causes the deterioration of the organic material as the organic EL material and the corrosion of the electrodes. As a result, a non-luminous area is generated, and the non-luminous area is further expanded, so that the luminous efficiency is reduced. As described above, the light emission quality is deteriorated by the moisture that has entered the organic EL element.
【０００４】そのような問題を解決する技術として、例
えば特開平５−３６４７５号公報および特開平５−８９
９５９号公報には、有機ＥＬ素子の外表面に保護層を設
け、さらに、その外側にシールド層を設ける封止構造が
開示されている。また、特開平７−１６９５６７号公報
には、有機ＥＬ素子に、脱水剤を含有する保護層と封止
層とを設ける封止構造が開示されている。As a technique for solving such a problem, for example, Japanese Patent Application Laid-Open Nos. 5-36475 and 5-89.
Japanese Patent No. 959 discloses a sealing structure in which a protective layer is provided on the outer surface of an organic EL element, and a shield layer is provided outside the protective layer. Further, Japanese Patent Laid-Open No. 7-169567 discloses a sealing structure in which a protective layer containing a dehydrating agent and a sealing layer are provided in an organic EL element.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記のような
封止構造を形成する際に、封止層等で閉じられ有機ＥＬ
素子が形成されている封止空間と外部空間との間に圧力
差が生じることがある。そして、圧力差に起因して、封
止層等と基板とを接着するためのシール材の形状が不均
一になったり、シール材のパンクすなわち気道が発生す
る場合がある。気道の発生によって、封止の信頼性が低
くなり、有機ＥＬディスプレイの表示品位が劣化する。However, when forming the above sealing structure, the organic EL is closed by a sealing layer or the like.
A pressure difference may occur between the sealed space in which the element is formed and the external space. Due to the pressure difference, the shape of the sealing material for adhering the sealing layer and the substrate to each other may be non-uniform, or the sealing material may be flat, that is, the airway may occur. Due to the generation of airways, the reliability of sealing becomes low and the display quality of the organic EL display deteriorates.
【０００６】具体的には、加圧接着する際に、封止空間
が外部空間から隔離された後、さらに加圧しつづけるこ
とで封止空間の体積は減少する。体積減少に伴って、封
止空間の内圧が上昇する。内圧の上昇によりシール材が
剥離したり、シール材に気道が発生する。そして、封止
作業終了時点で気道が塞がることがなく封止不良が生ず
る。Specifically, when pressure bonding is performed, the volume of the sealed space is reduced by isolating the sealed space from the external space and then continuing to apply pressure. As the volume decreases, the internal pressure of the sealed space rises. Due to the increase in the internal pressure, the sealing material peels off or an airway occurs in the sealing material. Then, when the sealing work is completed, the airway is not blocked and a sealing failure occurs.
【０００７】このような問題を解決するため、例えば、
特開平１１−１７６５７１号公報には、粒状のスペーサ
を含有するとともにシール材として機能する接着剤で、
封止板を基板に加圧接着する技術が開示されている。そ
の技術では、加圧接着する際に、封止作業環境を減圧状
態にすることによって封止構造内部の圧力を上昇させ
る。そして、封止構造内部の圧力の上昇によって接着剤
を押し広げて気道を発生させ内部の気体が抜く。さら
に、気体が抜けきると同時に、再度、気道を閉じる。In order to solve such a problem, for example,
Japanese Unexamined Patent Publication No. 11-176571 discloses an adhesive containing a granular spacer and functioning as a sealing material.
A technique of press-bonding a sealing plate to a substrate is disclosed. In that technique, when pressure bonding is performed, the pressure inside the sealing structure is increased by reducing the pressure of the sealing work environment. Then, as the pressure inside the sealing structure rises, the adhesive is spread out to generate an airway and the gas inside is released. Further, the air passage is closed again when the gas is exhausted.
【０００８】しかし、封止板に均一に塗布された接着剤
に気道を発生させると、気道部分において周辺気体と接
触する部分が生ずる。そのために、最終的に気道が閉じ
た構造になってもシール材の内部に不均一な領域が残る
場合がある。However, when the airway is generated in the adhesive uniformly applied to the sealing plate, a portion of the airway portion that comes into contact with the surrounding gas is generated. Therefore, even if the airway is finally closed, a nonuniform region may remain inside the sealing material.
【０００９】本発明は、上記のような課題を解決するた
めの発明であって、シール材が劣化しないようにして封
止不良の発生を防止し、発光面積の減少や発光品位の劣
化を低減することができる有機ＥＬディスプレイの製造
方法および有機ＥＬディスプレイ用基板を提供すること
を目的とする。The present invention is an invention for solving the above-mentioned problems, and prevents the sealing material from deteriorating to prevent the occurrence of defective sealing, thereby reducing the emission area and the emission quality. An object of the present invention is to provide a method of manufacturing an organic EL display and a substrate for an organic EL display that can be manufactured.
【００１０】[0010]
【課題を解決するための手段】本発明の第１の要旨は、
有機発光材料を含む有機ＥＬ構造体および駆動用配線が
形成された第１の基板と、第１の基板に対向配置される
第２の基板とを、シール材を用いて接合する有機ＥＬデ
ィスプレイの製造方法において、第２の基板におけるシ
ール材で囲まれた領域よりも外側に該領域を囲むように
外周シール材を配置し、第１の基板と第２の基板とをシ
ール材によって接合した後、外周シール材を配置した領
域を除去することを特徴とする製造方法を提供する。The first gist of the present invention is as follows.
An organic EL display in which a first substrate on which an organic EL structure including an organic light emitting material and a driving wiring are formed and a second substrate which is arranged to face the first substrate are joined by using a sealing material. In the manufacturing method, an outer peripheral sealing material is arranged outside the area of the second substrate surrounded by the sealing material so as to surround the area, and after bonding the first substrate and the second substrate with the sealing material. Provided is a manufacturing method characterized by removing a region where an outer peripheral sealing material is arranged.
【００１１】第２の要旨は、有機発光材料を含む複数の
有機ＥＬ構造体および駆動用配線が形成された第１の基
板と、第１の基板に対向配置される第２の基板とを、シ
ール材を用いて接合する有機ＥＬディスプレイの製造方
法において、複数の有機ＥＬ構造体のそれぞれを囲むよ
うにシール材を配置し、第２の基板における前記シール
材で囲まれた領域よりも外側に該領域を囲むように外周
シール材を配置し、第１の基板と第２の基板とをシール
材によって接合した後、外周シール材を配置した領域を
除去することを特徴とする製造方法を提供する。The second gist is to provide a first substrate on which a plurality of organic EL structures containing an organic light emitting material and a driving wiring are formed, and a second substrate arranged to face the first substrate. In a method for manufacturing an organic EL display, which is joined by using a sealing material, the sealing material is arranged so as to surround each of a plurality of organic EL structures, and is arranged outside a region surrounded by the sealing material on the second substrate. An outer peripheral sealing material is arranged so as to surround the area, the first substrate and the second substrate are bonded by the sealing material, and then the area where the outer peripheral sealing material is arranged is removed. To do.
【００１２】本発明の態様１は、有機発光材料を含む有
機ＥＬ構造体および駆動用配線が形成された第１の基板
における有機ＥＬ構造体を、第１の基板に対向配置され
る第２の基板と、第１の基板と第２の基板とを接合する
シール材とを用いて封止して有機ＥＬ素子を形成する有
機ＥＬディスプレイの製造方法において、第２の基板に
おけるシール材で囲まれた領域よりも外側に該領域を囲
むように外周シール材を配置し、第２の基板およびシー
ル材によって有機ＥＬ構造体を封止した後、外周シール
材を配置した領域を除去することを特徴とする製造方法
を提供する。In the first aspect of the present invention, the organic EL structure containing the organic light emitting material and the organic EL structure in the first substrate on which the driving wiring is formed are arranged so as to face the first substrate. In a method of manufacturing an organic EL display in which an organic EL element is formed by sealing using a substrate and a sealing material that joins the first substrate and the second substrate, the organic EL display is surrounded by the sealing material on the second substrate. The outer peripheral sealing material is arranged outside the above area so as to surround the area, the organic EL structure is sealed by the second substrate and the sealing material, and then the area where the outer peripheral sealing material is arranged is removed. The manufacturing method is provided.
【００１３】態様２は、有機発光材料を含む複数の有機
ＥＬ構造体および駆動用配線が形成された第１の基板に
おけるそれぞれの有機ＥＬ構造体を、第１の基板に対向
配置される第２の基板と、第１の基板と第２の基板とを
接合するシール材とを用いて封止して有機ＥＬ素子を形
成する有機ＥＬディスプレイの製造方法において、複数
の有機ＥＬ構造体のそれぞれを囲むようにシール材を配
置し、第２の基板におけるシール材で囲まれた領域より
も外側に該領域を囲むように外周シール材を配置し、第
２の基板およびシール材によってそれぞれの有機ＥＬ構
造体を封止した後、外周シール材を配置した領域を除去
することを特徴とする製造方法を提供する。In a second aspect, a plurality of organic EL structures containing an organic light emitting material and each organic EL structure in the first substrate on which the driving wirings are formed are arranged to face the first substrate. In the method for manufacturing an organic EL display in which an organic EL element is formed by sealing the substrate and a sealing material that joins the first substrate and the second substrate, each of the plurality of organic EL structures is A sealing material is arranged so as to surround it, and a peripheral sealing material is arranged outside the area surrounded by the sealing material in the second substrate so as to surround the area. There is provided a manufacturing method characterized in that, after sealing a structure, a region in which a peripheral sealing material is arranged is removed.
【００１４】態様３は、態様２において、隣接するシー
ル材が配置された領域の間に補助シール材を配置し、第
２の基板およびシール材によって複数の有機ＥＬ構造体
を第１の基板と第２の基板の間の空間内に封止した後、
外周シール材を配置した領域とともに補助シール材を配
置した領域を除去することを特徴とする製造方法を提供
する。Aspect 3 is such that, in Aspect 2, the auxiliary sealant is arranged between the regions where the adjacent sealants are arranged, and a plurality of organic EL structures are formed on the first substrate by the second substrate and the sealant. After sealing in the space between the second substrates,
There is provided a manufacturing method characterized by removing an area where an auxiliary sealing material is arranged together with an area where an outer peripheral sealing material is arranged.
【００１５】態様４は、態様１、２または３において、
第１の基板と第２の基板とを接合する前のシール材の高
さＤＩＮと外周シール材の高さＤＯＵＴとの関係をＤ
ＯＵＴ＞ＤＩＮとすることを特徴とする製造方法を提供
する。Aspect 4 is the same as Aspect 1, 2 or 3,
The relationship between the height D IN of the sealing material before joining the first substrate and the second substrate and the height D OUT of the outer peripheral sealing material is D
Provided is a manufacturing method characterized in that OUT > D IN .
【００１６】態様５は、態様１、２、３または４におい
て、第１の基板と第２の基板とを接合する前のシール材
の幅ＷＩＮと外周シール材の幅ＷＯＵＴとの関係をＷ
ＯＵＴ＞ＷＩＮとすることを特徴とする製造方法を提供
する。Aspect 5 relates to the relation between the width W IN of the seal material and the width W OUT of the outer peripheral seal material before joining the first substrate and the second substrate in the aspect 1, 2, 3 or 4. W
There is provided a manufacturing method characterized in that OUT > W IN .
【００１７】態様６は、態様１、２、３、４または５に
おいて、第１の基板と第２の基板とを接合する前のシー
ル材の粘度ＣＩＮと外周シール材の粘度ＣＯＵＴとの関
係をＣＯＵＴ＞ＣＩＮとすることを特徴とする製造方法
を提供する。Aspect 6 is the same as Aspect 1, 2, 3, 4 or 5 in that the viscosity C IN of the seal material and the viscosity C OUT of the outer peripheral seal material before the first substrate and the second substrate are bonded to each other. Provided is a manufacturing method characterized in that the relationship is C OUT > C IN .
【００１８】態様７は、態様１、２、３、４、５または
６において、第１の基板と第２の基板とを接合する前の
外周シール材の高さをＤＢ０とし、封止後の外周シール
材の高さをＤＡ０とした場合に、封止作業室の内部の圧
力を１．０１３×１０５×Ｄ Ａｏ／ＤＢｏＰａの付近、
例えば１．０１３×１０５×ＤＡｏ／ＤＢｏＰａ±５％
の範囲内に設定することを特徴とする製造方法を提供す
る。Aspect 7 is aspect 1, 2, 3, 4, 5 or
6, before joining the first substrate and the second substrate
The height of the outer peripheral sealing material is DB0And the outer peripheral seal after sealing
Material height DA0In this case, the pressure inside the sealing work room
Power 1.013 × 105× D Ao/ DBoNear Pa,
For example, 1.013 × 105× DAo/ DBoPa ± 5%
The manufacturing method is characterized by setting within the range of
It
【００１９】態様８は、有機発光材料を含む有機ＥＬ構
造体および駆動用配線が形成された第１の基板と第１の
基板に対向配置された第２の基板とが、有機ＥＬ構造体
を囲むように第２の基板の面内で配置されたシール材
と、第２の基板におけるシール材で囲まれた領域よりも
外側に該領域を囲むように配置された外周シール材とに
よって接合された構造を有することを特徴とする有機Ｅ
Ｌディスプレイ用基板を提供する。In the eighth aspect, the first substrate on which the organic EL structure containing the organic light emitting material and the driving wiring are formed, and the second substrate arranged to face the first substrate form the organic EL structure. Bonded by a sealing material arranged so as to surround the second substrate and an outer peripheral sealing material arranged so as to surround the area of the second substrate outside the area surrounded by the sealing material. Organic E characterized by having a different structure
A substrate for an L display is provided.
【００２０】態様９は、有機発光材料を含む複数の有機
ＥＬ構造体および駆動用配線が形成された第１の基板と
第１の基板に対向配置された第２の基板とが、複数の有
機ＥＬ構造体のそれぞれを第２の基板の面内で囲むよう
に配置されたシール材と、第２の基板におけるシール材
で囲まれた複数の領域を囲むように配置された外周シー
ル材と、隣接するシール材で囲まれた領域の間に配置さ
れた補助シール材とによって接合された構造を有するこ
とを特徴とする有機ＥＬディスプレイ用基板を提供す
る。In a ninth aspect, a first substrate on which a plurality of organic EL structures containing an organic light emitting material and a driving wiring are formed and a second substrate arranged to face the first substrate include a plurality of organic EL elements. A sealing material arranged so as to surround each of the EL structures in the plane of the second substrate, and an outer peripheral sealing material arranged so as to surround a plurality of regions of the second substrate surrounded by the sealing material, There is provided a substrate for an organic EL display, which has a structure in which it is joined with an auxiliary sealing material arranged between regions surrounded by adjacent sealing materials.
【００２１】[0021]
【発明の実施の形態】（実施の形態１）以下、本発明の
実施の形態を図面を参照して説明する。図１〜図４は、
有機ＥＬディスプレイの製造方法の一例を説明するため
の断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 4 are
FIG. 6 is a cross-sectional view for explaining an example of the method for manufacturing the organic EL display.
【００２２】本実施の形態の製造方法によって製造され
る有機ＥＬ素子は、第１の基板１上に形成される有機Ｅ
Ｌ構造体２、有機ＥＬ構造体２を駆動するための駆動用
配線３、および有機ＥＬ構造体２の上に所定の空間を有
するように配置される第２の基板４を有する。さらに、
第１の基板１と第２の基板４とを接着し有機ＥＬ構造体
２を密閉するためのシール材５が、第２の基板４の面内
において有機ＥＬ構造体２を囲むように配置されてい
る。また、本実施の形態の製造方法では、シール材５を
囲むように第２の基板４の面内において外周シール材６
が配置される。有機ＥＬ構造体２は、例えば、陽極電
極、正孔輸送層、有機発光材料による発光層および陰極
電極が積層された構造体である。The organic EL device manufactured by the manufacturing method of the present embodiment is an organic EL device formed on the first substrate 1.
It has an L structure 2, a drive wiring 3 for driving the organic EL structure 2, and a second substrate 4 arranged on the organic EL structure 2 so as to have a predetermined space. further,
A sealing material 5 for adhering the first substrate 1 and the second substrate 4 and sealing the organic EL structure 2 is arranged so as to surround the organic EL structure 2 in the plane of the second substrate 4. ing. Further, in the manufacturing method of the present embodiment, the outer peripheral sealing material 6 is formed in the surface of the second substrate 4 so as to surround the sealing material 5.
Are placed. The organic EL structure 2 is, for example, a structure in which an anode electrode, a hole transport layer, a light emitting layer made of an organic light emitting material, and a cathode electrode are laminated.
【００２３】図１は、有機ＥＬ構造体２および駆動用配
線３が第１の基板１に形成され、シール材５および外周
シール材６が第２の基板４に塗布された状態を示す。図
２は、第１の基板１が上定盤８に固定され、第２の基板
４が下定盤９に固定された状態を示す。図３は、シール
材５および外周シール材６で第１の基板１と第２の基板
４とが接着された状態を示す。図４は、有機ＥＬ素子１
２が形成された状態を示す。上定盤８および下定盤９
は、ステンレス鋼等の金属材料やセラミック材料で形成
され、それぞれ平坦な板状体である。また、封止作業時
には、上定盤８と下定盤９とは、対向する面が平行にな
るように固定される。FIG. 1 shows a state in which the organic EL structure 2 and the drive wiring 3 are formed on the first substrate 1, and the sealing material 5 and the outer peripheral sealing material 6 are applied to the second substrate 4. FIG. 2 shows a state in which the first substrate 1 is fixed to the upper surface plate 8 and the second substrate 4 is fixed to the lower surface plate 9. FIG. 3 shows a state in which the first substrate 1 and the second substrate 4 are bonded by the seal material 5 and the outer peripheral seal material 6. FIG. 4 shows the organic EL element 1.
2 shows a state in which 2 is formed. Upper surface plate 8 and lower surface plate 9
Is a flat plate-shaped body formed of a metal material such as stainless steel or a ceramic material. Further, during the sealing work, the upper surface plate 8 and the lower surface plate 9 are fixed such that the surfaces facing each other are parallel to each other.
【００２４】有機ＥＬ素子を製造する場合、図１に示す
ように、まず、有機ＥＬ構造体２をガラス等の第１の基
板１上に積層する。さらに、有機ＥＬ構造体２に電圧を
印加して有機ＥＬ構造体２における有機薄膜に電流を供
給するための駆動用配線３を、ＩＴＯの成膜およびエッ
チング等によって第１の基板１上に形成する。When manufacturing an organic EL device, as shown in FIG. 1, first, an organic EL structure 2 is laminated on a first substrate 1 such as glass. Further, a drive wiring 3 for applying a voltage to the organic EL structure 2 to supply a current to the organic thin film in the organic EL structure 2 is formed on the first substrate 1 by film formation and etching of ITO or the like. To do.
【００２５】また、透明ガラス等の第２の基板４上に、
有機ＥＬ素子を囲むようにシール材５を塗布する。さら
に、第２の基板４上に、シール材５の塗布部分を囲むよ
うに外周シール材６を塗布する。シール材５および外周
シール材６の材質は、一定の接着力が確保でき、耐湿性
能が充分であれば特に制限されない。しかし、熱硬化性
樹脂材料を用いると硬化温度により有機ＥＬ素子を構成
する材料の特性を劣化させる場合があり、シール材５お
よび外周シール材６として紫外線硬化性樹脂材料を使用
することが好ましい。また、紫外線硬化性樹脂材料の中
には、硬化後、未反応種の溶出やガス放出により有機Ｅ
Ｌ素子の性能に影響を及ぼすものがあるので、カチオン
硬化タイプのエポキシ系紫外線硬化性樹脂材料を使用す
ることがより好ましい。ただし、特に有機ＥＬ素子の性
能に影響を与えない場合にはこの限りではない。On the second substrate 4 such as transparent glass,
The sealing material 5 is applied so as to surround the organic EL element. Further, the outer peripheral sealing material 6 is applied onto the second substrate 4 so as to surround the application portion of the sealing material 5. The materials of the seal material 5 and the outer peripheral seal material 6 are not particularly limited as long as a constant adhesive force can be secured and the moisture resistance performance is sufficient. However, when the thermosetting resin material is used, the characteristics of the material forming the organic EL element may be deteriorated depending on the curing temperature. Therefore, it is preferable to use the ultraviolet curable resin material as the sealing material 5 and the outer peripheral sealing material 6. In addition, some UV curable resin materials contain organic E due to elution of unreacted species and gas release after curing.
It is more preferable to use a cation-curing type epoxy-based UV-curable resin material because it may affect the performance of the L element. However, this does not apply particularly when the performance of the organic EL element is not affected.
【００２６】シール材５と外周シール材６を塗布する順
番には特に制約はないが、第１の基板１と第２の基板４
を接着する際に、いずれのシール材も有機ＥＬ構造体２
に接触しないように塗布する。シール材５および外周シ
ール材６の塗布温度は室温前後が好ましい。より好まし
くは２５℃〜３５℃である。シール材５の塗布後の高さ
は６０〜２００μｍが好ましいが、この限りではない。The order of applying the seal material 5 and the outer peripheral seal material 6 is not particularly limited, but the first substrate 1 and the second substrate 4 are applied.
When adhering, both sealing materials are organic EL structure 2
Apply it so that it does not come into contact with. The application temperature of the seal material 5 and the outer peripheral seal material 6 is preferably around room temperature. It is more preferably 25 ° C to 35 ° C. The height of the sealing material 5 after application is preferably 60 to 200 μm, but is not limited to this.
【００２７】また、窒素、Ａｒなどの不活性ガスの雰囲
気下のグローブボックス等の封止作業室内で、シール材
５と外周シール材６を第２の基板４に塗布してもよい
が、２０％程度の酸素等を含む活性ガスの雰囲気下の封
止作業室内で封止作業を行うと陽極層と陰極層との間の
層間短絡を低減することができるのでより好ましい。ま
た、雰囲気中の水分濃度は１ｐｐｍ以下であることが好
ましく、０．１ｐｐｍ以下であることがより好ましい。The sealing material 5 and the outer peripheral sealing material 6 may be applied to the second substrate 4 in a sealing work chamber such as a glove box under an atmosphere of an inert gas such as nitrogen or Ar. It is more preferable to perform the sealing work in the sealing work chamber under an atmosphere of an active gas containing about 0% oxygen or the like, because inter-layer short circuit between the anode layer and the cathode layer can be reduced. Further, the water concentration in the atmosphere is preferably 1 ppm or less, and more preferably 0.1 ppm or less.
【００２８】次に、図２に示すように、封止作業室内
で、第１の基板１を上定盤８に固定する。固定に際し
て、基板固定具８１や真空吸着用の吸着穴８２などを使
用する。すなわち、上定盤８において、外周シール材６
の塗布位置に相当する位置よりも外側に、第１の基板１
を係止できるような形状の基板固定具８１が設けられ、
第１の基板１が基板固定具８１に係止される。また、吸
着穴８２から封止作業室の内部の空間のガスを引くこと
によって第１の基板１を上定盤８に吸着させる。ここ
で、ガスを引く際の圧力は、第１の基板１が脱離落下し
ないように封止作業室内の圧力よりも低くする必要があ
る。後述するように、封止作業室の内部は減圧状態とさ
れるので、それよりも低い圧力で、吸着穴８２から封止
作業室の内部の空間のガスを引く。Next, as shown in FIG. 2, the first substrate 1 is fixed to the upper surface plate 8 in the sealing work chamber. At the time of fixing, the substrate fixing tool 81 and the suction hole 82 for vacuum suction are used. That is, in the upper surface plate 8, the outer peripheral sealing material 6
On the outer side of the position corresponding to the coating position of the first substrate 1
Is provided with a board fixture 81 having a shape capable of locking
The first board 1 is locked to the board fixture 81. Further, the first substrate 1 is sucked onto the upper surface plate 8 by drawing the gas in the space inside the sealing work chamber from the suction hole 82. Here, the pressure for drawing the gas needs to be lower than the pressure in the sealing work chamber so that the first substrate 1 does not detach and drop. As will be described later, since the inside of the sealing work chamber is in a depressurized state, the gas in the space inside the sealing work chamber is drawn from the adsorption hole 82 at a pressure lower than that.
【００２９】また、第２の基板４を、有機ＥＬ構造体２
が形成されている第１の基板１に対して適切な位置にな
るように位置決めした後、下定盤９に固定する。なお、
図２には、後述する紫外線遮光基板１０も設置された状
態が示されている。The second substrate 4 is replaced by the organic EL structure 2
After being positioned so as to be at an appropriate position with respect to the first substrate 1 on which is formed, it is fixed to the lower surface plate 9. In addition,
FIG. 2 shows a state in which an ultraviolet light shielding substrate 10 described later is also installed.
【００３０】次に、封止作業室の内部を減圧状態にす
る。封止作業室の内部の圧力は、塗布後の外周シール材
６の高さすなわち封止前の外周シール材６の配置高と、
封止作業終了後の外周シール材６の高さすなわち封止前
の外周シール材６の配置高との比で決定される。すなわ
ち、塗布後の外周シール材６の高さをＤＢｏ、封止作業
終了後の高さをＤＡｏとすると、封止作業室の内部の圧
力は、１．０１３×１０ ５×ＤＡｏ／ＤＢｏＰａに調整
される。ここで、調整範囲を±５％程度にしてもよい。
なお、人手により封止作業を行う場合に、封止作業に係
る動作はグローブボックス等の封止作業室の外部から行
うことができ、封止作業室の外部は通常の大気圧の環境
でよい。Next, the inside of the sealing work chamber is depressurized.
It The pressure inside the sealing work chamber is the outer peripheral sealant after application.
6, the height of the outer peripheral sealing material 6 before sealing,
Height of the outer peripheral sealing material 6 after the sealing work, that is, before sealing
It is determined by the ratio with the arrangement height of the outer peripheral sealing material 6. Sanawa
Then, the height of the outer peripheral sealing material 6 after application is DBo, Sealing work
The height after the end is DAoThen, the pressure inside the sealing work room
Power is 1.013 × 10 5× DAo/ DBoAdjust to Pa
To be done. Here, the adjustment range may be about ± 5%.
In addition, when performing the sealing work manually,
Operation is performed from outside the sealing work room such as a glove box.
The outside of the sealed work room is a normal atmospheric pressure environment.
Good.
【００３１】次いで、上定盤８を下降させて、第１の基
板１と第２の基板４とを合わせ加圧接着する。加圧接着
する際、第１の基板１と第２の基板４の間隔があらかじ
め決められている距離になるように上定盤８の下降量を
制御する。あらかじめ決められている距離は、封止作業
終了後の外周シール材６の高さＤＡｏに相当する。Next, the upper platen 8 is lowered and the first substrate 1 and the second substrate 4 are combined and pressure-bonded. At the time of pressure bonding, the lowering amount of the upper platen 8 is controlled so that the distance between the first substrate 1 and the second substrate 4 becomes a predetermined distance. The predetermined distance corresponds to the height D Ao of the outer peripheral sealing material 6 after the sealing work is completed.
【００３２】加圧接着が終了した時点でシール材５およ
び外周シール材６を同時に硬化させる。シール材５およ
び外周シール材６として紫外線硬化性樹脂材料を使用す
る場合には、加圧接着が終了した時点で紫外線を一定量
照射する。この場合には、下定盤９として、石英ガラス
製のものを使用する。また、紫外線を直接有機ＥＬ構造
体２に照射すると、有機ＥＬ構造体２の性能を劣化させ
ることがある。よって、下定盤９と第２の基板４との間
に、有機ＥＬ構造体２が形成された部分に紫外線非透過
領域１１が設けられた紫外線遮光基板１０を配置するこ
とが好ましい。When the pressure bonding is completed, the seal material 5 and the outer peripheral seal material 6 are simultaneously cured. When an ultraviolet curable resin material is used as the sealing material 5 and the outer peripheral sealing material 6, a certain amount of ultraviolet rays are irradiated when the pressure bonding is completed. In this case, the lower surface plate 9 is made of quartz glass. Further, when the organic EL structure 2 is directly irradiated with ultraviolet rays, the performance of the organic EL structure 2 may be deteriorated. Therefore, it is preferable to dispose between the lower surface plate 9 and the second substrate 4 the ultraviolet light shielding substrate 10 in which the ultraviolet light non-transmissive region 11 is provided in the portion where the organic EL structure 2 is formed.
【００３３】紫外線非透過領域１１の材料に特に制限は
ないが、Ｃｒなどを成膜およびパターニングしたものを
用いるのが好ましい。また、紫外線遮光基板１０は、紫
外線を充分透過できる材質が好ましく、石英ガラス製の
ものなどがよい。紫外線照射によってシール材５および
外周シール材６硬化させた後、封止作業室の内部を常圧
に戻し封止作業を終了する。なお、紫外線照射によって
シール材５および外周シール材６硬化させる前に、封止
作業室の内部を常圧に戻してもよい。The material of the ultraviolet ray non-transmissive area 11 is not particularly limited, but it is preferable to use a material such as Cr which is formed and patterned. Further, the ultraviolet light shielding substrate 10 is preferably made of a material capable of sufficiently transmitting ultraviolet light, and is preferably made of quartz glass or the like. After the sealing material 5 and the outer peripheral sealing material 6 are cured by irradiation of ultraviolet rays, the inside of the sealing work chamber is returned to normal pressure and the sealing work is completed. The interior of the sealing work chamber may be returned to normal pressure before the sealing material 5 and the outer peripheral sealing material 6 are cured by irradiation with ultraviolet rays.
【００３４】以上の工程が終了すると、図３に示すよう
に、シール材５によって有機ＥＬ構造体２が封止され、
さらに、シール材５を含む空間が外周シール材６で閉じ
られた有機ＥＬディスプレイ用基板２０が形成される。When the above steps are completed, as shown in FIG. 3, the organic EL structure 2 is sealed with the sealing material 5,
Further, the organic EL display substrate 20 in which the space containing the seal material 5 is closed by the outer peripheral seal material 6 is formed.
【００３５】この時点で、有機発光材料を含む有機ＥＬ
構造体２および駆動用配線３が形成された第１の基板１
と、第１の基板１に対向配置された第２の基板４とが、
有機ＥＬ構造体２を囲むように配置されたシール材５
と、第２の基板４におけるシール材５で囲まれた領域よ
りも外側に、その領域を囲むように配置された外周シー
ル材６とによって接合された構造を有する有機ＥＬディ
スプレイ用基板２０が形成されている。At this point, the organic EL containing the organic light emitting material
First substrate 1 on which structure 2 and drive wiring 3 are formed
And the second substrate 4 arranged to face the first substrate 1,
Sealing material 5 arranged so as to surround the organic EL structure 2
Then, an organic EL display substrate 20 having a structure of being joined to the outer periphery of the second substrate 4 by a peripheral sealing material 6 arranged so as to surround the area is formed outside the area surrounded by the sealing material 5. Has been done.
【００３６】封止作業終了後、図４に示すように、有機
ＥＬディスプレイ用基板２０における所定の位置、すな
わちシール材５が形成されている部分のやや外側を切断
することによって、所望の有機ＥＬ素子１２を得る。外
周シール材６は、所望の有機ＥＬ素子１２の外部に配置
されているので、切断後に破材１３の一部となり廃棄さ
れる。After the sealing operation is completed, as shown in FIG. 4, a desired organic EL is cut by cutting a predetermined position on the organic EL display substrate 20, that is, a part of the part where the sealing material 5 is formed. The element 12 is obtained. Since the outer peripheral sealing material 6 is disposed outside the desired organic EL element 12, it becomes a part of the breakage material 13 after cutting and is discarded.
【００３７】さらに、駆動用配線３のうちのデータ配線
にデータ配線ドライバを接続し、走査配線に走査配線ド
ライバを接続し、有機ＥＬディスプレイを得る。Further, a data wiring driver is connected to the data wiring of the driving wiring 3 and a scanning wiring driver is connected to the scanning wiring to obtain an organic EL display.
【００３８】以上に説明したように、本実施の形態で
は、有機ＥＬ構造体２が形成された第１の基板１に対向
して配置された第２の基板４を接着固定するシール材５
のさらに外側に外周シール材６を配置する。このような
構造では、加圧接着によって封止空間の体積が減少する
際に、外周シール材６で囲われた閉空間の体積も同様に
減少する。As described above, in the present embodiment, the sealing material 5 for adhering and fixing the second substrate 4 arranged so as to face the first substrate 1 on which the organic EL structure 2 is formed.
An outer peripheral sealing material 6 is arranged further outside. In such a structure, when the volume of the sealing space is reduced by pressure bonding, the volume of the closed space surrounded by the outer peripheral sealing material 6 is also reduced.
【００３９】体積減少に伴って、外周シール材６で囲わ
れた閉空間の内圧は上昇する。内圧は、有機ＥＬ構造体
２が形成された第１の基板１と第２の基板４との間の距
離に関係するが、内圧が上昇していく過程で、シール材
５の内部と外部とで、第１の基板１と第２の基板４との
間の距離は同じである。従って、シール材５の内部と外
部で、圧力の上昇の程度は同じであり、シール材５の外
部と内部とで圧力差が発生しない。既に述べたように、
シール材５に気道が発生する原因は、有機ＥＬ構造体２
が形成されている封止空間と外部空間との間に圧力差が
生じることであるが、本実施の形態の製造方法では、シ
ール材５の外部と内部とで圧力差が発生しないので、シ
ール材５に気道が発生することはない。As the volume decreases, the internal pressure of the closed space surrounded by the outer peripheral sealing material 6 increases. The internal pressure is related to the distance between the first substrate 1 and the second substrate 4 on which the organic EL structure 2 is formed, but in the process of increasing the internal pressure, the inside and outside of the sealing material 5 are Therefore, the distance between the first substrate 1 and the second substrate 4 is the same. Therefore, the degree of increase in pressure is the same inside and outside the seal material 5, and no pressure difference occurs between the inside and outside of the seal material 5. As already mentioned,
The cause of the airway in the sealing material 5 is the organic EL structure 2
A pressure difference is generated between the sealed space in which the seal is formed and the external space. However, in the manufacturing method of the present embodiment, since the pressure difference does not occur between the outside and the inside of the seal material 5, the seal is not formed. The airway does not occur in the material 5.
【００４０】ただし、シール材５の外部と内部とで圧力
差が発生しない状態は、外周シール材６に気道やシール
剥離などが発生しないことが前提である。外周シール材
６に気道が発生すると、シール材５の外部の加圧状態が
開放され、シール材５で囲われた閉空間のみで加圧状態
が残る。つまり、シール材５の外部と内部とで圧力差が
発生してしまう。However, the condition that there is no pressure difference between the outside and the inside of the seal material 5 is on the premise that no airway or peeling of the seal occurs in the outer peripheral seal material 6. When an airway is generated in the outer peripheral sealing material 6, the pressurized state outside the sealing material 5 is released, and the pressurized state remains only in the closed space surrounded by the sealing material 5. That is, a pressure difference occurs between the outside and the inside of the seal material 5.
【００４１】そこで、外周シール材６はシール材５に比
べて気道が発生しないような構造にする必要がある。そ
のために、塗布後の外周シール材６の高さを、シール材
５の高さよりも高くする。また、塗布後の外周シール材
６の幅すなわち封止前の外周シール材６の配置幅Ｗ
ＯＵＴを、シール材５の幅すなわち封止前のシール材５
の配置幅ＷＩＮよりも広くする。さらに、封止前の外周
シール材６の粘度ＣＯＵＴを、封止前のシール材５の粘
度ＣＩＮよりも高くする。なお、これらの関係（シール
材５と外周シール材６との間の、高さ、幅および粘度の
関係）の全てを採用してもよいし、１つまたは２つの関
係を採用してもよい。Therefore, it is necessary that the outer peripheral sealing material 6 has a structure in which airways are not generated as compared with the sealing material 5. Therefore, the height of the outer peripheral sealing material 6 after application is made higher than the height of the sealing material 5. Further, the width of the outer peripheral sealing material 6 after coating, that is, the arrangement width W of the outer peripheral sealing material 6 before sealing
OUT is the width of the sealing material 5, that is, the sealing material 5 before sealing.
Of the arrangement width W IN . Further, the viscosity C OUT of the outer peripheral sealing material 6 before sealing is made higher than the viscosity C IN of the sealing material 5 before sealing. It should be noted that all of these relationships (relationship between the sealing material 5 and the outer peripheral sealing material 6 in terms of height, width, and viscosity) may be adopted, or one or two relationships may be adopted. .
【００４２】また、封止作業終了後の封止空間の内部圧
力は、ほぼ大気圧に近いことが望ましい。従って、シー
ル材５が閉空間を形成後、体積減少した後、封止作業終
了の際の封止空間が０．０９６×１０５〜１．０４０×
１０５Ｐａの圧力となるように、封止作業前の雰囲気を
減圧状態にすることがより好ましい。例えば、塗布後の
外周シール材６の高さすなわち封止前の外周シール材６
の配置高をＤＢＯ、封止作業終了後の高さすなわち封止
後の外周シール材６の配置高をＤＡOとすると、封止作
業室の内部の圧力は、１．０１３×１０５×ＤＡO／Ｄ
ＢＯＰａ±５％程度に調整される。Further, it is desirable that the internal pressure of the sealed space after the sealing work is close to the atmospheric pressure. Therefore, after the sealing material 5 forms a closed space and then decreases in volume, the sealing space at the end of the sealing work is 0.096 × 10 5 to 1.040 ×.
It is more preferable to reduce the pressure of the atmosphere before the sealing operation so that the pressure is 10 5 Pa. For example, the height of the outer peripheral sealing material 6 after coating, that is, the outer peripheral sealing material 6 before sealing.
Is D BO , and the height after completion of the sealing work, that is, the arrangement height of the outer peripheral sealing material 6 after sealing is D AO , the pressure inside the sealing work chamber is 1.013 × 10 5 × D AO / D
BO Pa is adjusted to about ± 5%.
【００４３】（実施の形態２）実施の形態１では、１つ
の有機ＥＬ素子１２が形成されたが、複数の有機ＥＬ素
子１２を同時に形成してもよい。特に、量産時には、複
数の有機ＥＬ素子１２を同時に形成するのが有利であ
る。(Second Embodiment) In the first embodiment, one organic EL element 12 is formed, but a plurality of organic EL elements 12 may be formed at the same time. Particularly, in mass production, it is advantageous to simultaneously form a plurality of organic EL elements 12.
【００４４】図５〜図８は、複数の有機ＥＬ素子１２を
同時に形成する場合の有機ＥＬディスプレイの製造方法
の一例を説明するための断面図である。図５は、複数の
有機ＥＬ構造体２および駆動用配線３が第１の基板１に
形成され、シール材５、外周シール材６および補助シー
ル材７が第２の基板４に塗布された状態を示す。図６
は、第１の基板１が上定盤８に固定され、第２の基板４
が下定盤９に固定された状態を示す。図７は、シール材
５および外周シール材６で第１の基板１と第２の基板４
とが接着された状態を示す。図８は、複数の有機ＥＬ素
子１２が形成された状態を示す。5 to 8 are sectional views for explaining an example of a method of manufacturing an organic EL display when a plurality of organic EL elements 12 are simultaneously formed. FIG. 5 shows a state in which a plurality of organic EL structures 2 and drive wirings 3 are formed on the first substrate 1, and the sealing material 5, the peripheral sealing material 6 and the auxiliary sealing material 7 are applied to the second substrate 4. Indicates. Figure 6
Means that the first substrate 1 is fixed to the upper surface plate 8 and the second substrate 4 is
Shows the state of being fixed to the lower surface plate 9. In FIG. 7, the first substrate 1 and the second substrate 4 are formed by the seal material 5 and the outer peripheral seal material 6.
Shows the state where and are bonded. FIG. 8 shows a state in which a plurality of organic EL elements 12 are formed.
【００４５】本実施の形態では、第１の基板１上に複数
の有機ＥＬ構造体２および駆動用配線３を形成し、第２
の基板４にシール材５と外周シール材６とを塗布し、さ
らに、封止終了後、形成された有機ＥＬディスプレイ用
基板３０を切断して複数の有機ＥＬ素子１２に分離する
際に、第１の基板１の破材と第２の基板４の破材とが散
乱しないように接合するための補助シール材７を、第２
の基板４に塗布する。シール材５、外周シール材６およ
び補助シール材７は、有機ＥＬ構造体２には接触しない
ような位置に塗布される。In this embodiment, a plurality of organic EL structures 2 and drive wirings 3 are formed on the first substrate 1,
When the sealing material 5 and the outer peripheral sealing material 6 are applied to the substrate 4 and the organic EL display substrate 30 formed is cut and separated into a plurality of organic EL elements 12 after the sealing is completed, The auxiliary sealing material 7 for joining the broken material of the first substrate 1 and the broken material of the second substrate 4 so as not to scatter
To the substrate 4. The seal material 5, the outer peripheral seal material 6, and the auxiliary seal material 7 are applied to positions that do not contact the organic EL structure 2.
【００４６】なお、第１の基板１、有機ＥＬ構造体２、
駆動用配線３、第２の基板４、シール材５および外周シ
ール材６の材質と形成の仕方とは、実施の形態１の場合
と同じでよい。また、補助シール材７の材質は、シール
材５および外周シール材６の材質と同じでよく、補助シ
ール材７の塗布後の高さは、シール材５の塗布後の高さ
と同程度でよい。The first substrate 1, the organic EL structure 2,
The materials for the drive wiring 3, the second substrate 4, the seal material 5, and the outer peripheral seal material 6 and the method of forming them may be the same as in the first embodiment. Further, the material of the auxiliary seal material 7 may be the same as the material of the seal material 5 and the outer peripheral seal material 6, and the height after application of the auxiliary seal material 7 may be approximately the same as the height after application of the seal material 5. .
【００４７】また、実施の形態１の場合と同様に、塗布
後の外周シール材６の高さを、シール材５の高さよりも
高くする。また、塗布後の外周シール材６の幅すなわち
封止前の外周シール材６の配置幅ＷＯＵＴを、シール材
５の幅すなわち封止前のシール材５の配置幅ＷＩＮより
も広くする。さらに、封止前の外周シール材６の粘度Ｃ
ＯＵＴを、封止前のシール材５の粘度ＣＩＮよりも高く
する。これらの関係（シール材５と外周シール材６との
間の、高さ、幅および粘度の関係）の全てを採用しても
よいし、１つまたは２つの関係を採用してもよいことは
実施の形態１の場合と同様である。Further, as in the case of the first embodiment, the height of the outer peripheral sealing material 6 after application is made higher than the height of the sealing material 5. The width of the outer peripheral sealing material 6 after application, that is, the arrangement width W OUT of the outer peripheral sealing material 6 before sealing is made wider than the width of the sealing material 5, that is, the arrangement width W IN of the sealing material 5 before sealing. Further, the viscosity C of the outer peripheral sealing material 6 before sealing
OUT is made higher than the viscosity C IN of the sealing material 5 before sealing. All of these relationships (relationship between the sealing material 5 and the outer peripheral sealing material 6 in height, width and viscosity) may be adopted, or one or two relationships may be adopted. This is similar to the case of the first embodiment.
【００４８】シール材５、外周シール材６および補助シ
ール材７を第２の基板４に塗布した後、実施の形態１の
場合と同様に、第１の基板１を上定盤８に固定し、第２
の基板４を、有機ＥＬ構造体２が形成されている第１の
基板１に対して適切な位置になるように位置決めした
後、下定盤９に固定する（図６参照）。After the sealing material 5, the peripheral sealing material 6 and the auxiliary sealing material 7 are applied to the second substrate 4, the first substrate 1 is fixed to the upper surface plate 8 as in the case of the first embodiment. , Second
The substrate 4 of 1 is positioned so as to be at an appropriate position with respect to the first substrate 1 on which the organic EL structure 2 is formed, and then fixed to the lower surface plate 9 (see FIG. 6).
【００４９】さらに、実施の形態１の場合と同様に、封
止作業室の内部を減圧状態とし、上定盤８を下降させ
て、第１の基板１と第２の基板４とを合わせ加圧接着す
る。その後、実施の形態１の場合と同様にして、シール
材５、外周シール材６および補助シール材７を同時に硬
化させる。Further, as in the case of the first embodiment, the inside of the sealing work chamber is depressurized, the upper platen 8 is lowered, and the first substrate 1 and the second substrate 4 are added together. Pressure bonding. After that, as in the case of the first embodiment, the sealing material 5, the outer peripheral sealing material 6 and the auxiliary sealing material 7 are simultaneously cured.
【００５０】以上の工程が終了すると、図７に示すよう
に、シール材５によって有機ＥＬ構造体２が封止され、
さらに、シール材５を含む空間が外周シール材６で閉じ
られた有機ＥＬディスプレイ用基板３０が形成される。
この時点で、有機発光材料を含む複数の有機ＥＬ構造体
２および駆動用配線３が形成された第１の基板１と、第
１の基板１に対向配置された第２の基板４とが、複数の
有機ＥＬ構造体２のそれぞれを囲むように配置されたシ
ール材５と、第２の基板４におけるシール材５で囲まれ
た複数の領域を囲むように配置された外周シール材６
と、隣接するシール材５で囲まれた領域の間に配置され
た補助シール材７とによって接合された構造を有する有
機ＥＬディスプレイ用基板３０が形成されている。When the above steps are completed, as shown in FIG. 7, the organic EL structure 2 is sealed with the sealing material 5,
Further, the organic EL display substrate 30 in which the space including the seal material 5 is closed by the outer peripheral seal material 6 is formed.
At this point, the first substrate 1 on which the plurality of organic EL structures 2 including the organic light emitting material and the driving wiring 3 are formed, and the second substrate 4 arranged to face the first substrate 1, A sealing material 5 arranged so as to surround each of the plurality of organic EL structures 2, and an outer peripheral sealing material 6 arranged so as to surround a plurality of regions of the second substrate 4 surrounded by the sealing material 5.
The organic EL display substrate 30 having a structure in which the auxiliary sealing material 7 and the auxiliary sealing material 7 arranged between the areas surrounded by the adjacent sealing material 5 are joined together is formed.
【００５１】封止作業終了後、図８に示すように、有機
ＥＬディスプレイ用基板３０における所定の位置、すな
わちシール材５が形成されている部分のやや外側の近傍
を切断することによって、所望の有機ＥＬ素子１２を得
る。After the sealing work is completed, as shown in FIG. 8, a desired position on the organic EL display substrate 30, that is, a portion near the portion where the sealing material 5 is formed, is cut off to a desired position. The organic EL element 12 is obtained.
【００５２】図９は、形成された有機ＥＬディスプレイ
用基板３０を第１の基板１の上方から見た様子を示す模
式図である。図９において、破線は第２の基板４におけ
る切断線を示し、点線は第１の基板１における切断線を
示す。なお、外周シール材６および補助シール材７は、
所望の有機ＥＬ素子１２の外部に配置されているので、
切断の際に破材の一部１３となり廃棄される（図８参
照）。FIG. 9 is a schematic diagram showing the formed organic EL display substrate 30 as viewed from above the first substrate 1. In FIG. 9, the broken line indicates the cutting line on the second substrate 4, and the dotted line indicates the cutting line on the first substrate 1. The outer peripheral sealing material 6 and the auxiliary sealing material 7 are
Since it is arranged outside the desired organic EL element 12,
At the time of cutting, it becomes a part of the broken material 13 and is discarded (see FIG. 8).
【００５３】さらに、それぞれの有機ＥＬ素子１２にお
ける駆動用配線３のうちのデータ配線にデータ配線ドラ
イバを接続し、走査配線に走査配線ドライバを接続し、
複数の有機ＥＬディスプレイを得る。Further, a data wiring driver is connected to the data wiring of the driving wirings 3 in each organic EL element 12, and a scanning wiring driver is connected to the scanning wiring,
Obtain a plurality of organic EL displays.
【００５４】本実施の形態では、実施の形態１の場合と
同様に、シール材５に気道が発生することのない有機Ｅ
Ｌ素子１２を得ることができる。また、同時に複数の有
機ＥＬ素子１２を得ることができる。In the present embodiment, as in the case of the first embodiment, the organic E that does not generate airways in the sealing material 5 is used.
The L element 12 can be obtained. Moreover, a plurality of organic EL elements 12 can be obtained at the same time.
【００５５】[0055]
【実施例】（例１）ガラス基板による第１の基板１に膜
厚２００ｎｍのＩＴＯを成膜し、エッチングして線幅３
２０μｍのデータ駆動用配線を形成した。データ配線は
陽極配線として機能する。さらに、その上に、絶縁膜と
してポリイミドを塗布し、発光領域としての各画素を形
成するために、行方向および列方向ともに複数の３００
μｍの正方形の部分を除去した。(Example) (Example 1) An ITO film having a thickness of 200 nm was formed on a first substrate 1 made of a glass substrate and etched to obtain a line width of 3
A 20 μm data drive wiring was formed. The data wiring functions as an anode wiring. Further, polyimide is applied thereon as an insulating film, and in order to form each pixel as a light emitting region, a plurality of 300 in both the row direction and the column direction are formed.
The μm square part was removed.
【００５６】さらに、その上に、有機ＥＬ構造体２とな
る有機薄膜を真空蒸着法により積層した。まず、第１正
孔輸送層としての膜厚２０ｎｍの銅フタロシアニンと、
第２正孔輸送層としての膜厚４０ｎｍのα−ＮＰＤを形
成した。次に、発光層のホスト化合物としてＡｌｑ、ゲ
スト化合物の蛍光性色素としてクマリン６を同時に蒸着
し、膜厚６０ｎｍとなるように形成した。さらに、陰極
界面層としてＬｉＦを０．５ｎｍ蒸着した。最後に、陰
極配線として膜厚１００ｎｍのアルミニウムで６４本の
走査配線を形成した。Further, an organic thin film to be the organic EL structure 2 was laminated thereon by a vacuum vapor deposition method. First, a 20-nm-thick copper phthalocyanine as a first hole transport layer,
An α-NPD having a film thickness of 40 nm was formed as the second hole transport layer. Next, Alq as a host compound of the light emitting layer and coumarin 6 as a fluorescent dye of a guest compound were simultaneously vapor deposited to form a film thickness of 60 nm. Furthermore, 0.5 nm of LiF was vapor-deposited as a cathode interface layer. Finally, 64 scanning wirings were formed as the cathode wirings with aluminum having a film thickness of 100 nm.
【００５７】第１の基板１上に形成した有機ＥＬ構造体
２を、有機薄膜への水分の侵入を防ぐために、一枚の第
２の基板４を対向配置して封止した。第２の基板４にお
いて、有機ＥＬ構造体２に相当する位置の周辺部に、シ
ール材５としてエポキシ系紫外線硬化性樹脂材料を、封
止した際に、内部に封入される領域を外部と隔離できる
ように塗布した。また、第２の基板４の外周部分に内部
に封入される領域を外部から隔離できるようにエポキシ
系紫外線硬化性樹脂材料を外周シール材６として塗布し
た。シール材の幅が封止前に約１．５mm、高さが７５μ
ｍとなるように塗布した。また、外周シール材６の幅が
約３．０mm、高さが１００μｍとなるように塗布した。The organic EL structure 2 formed on the first substrate 1 was sealed by disposing one second substrate 4 so as to prevent water from entering the organic thin film. In the second substrate 4, when the epoxy-based UV curable resin material is sealed as the sealing material 5 in the peripheral portion of the position corresponding to the organic EL structure 2, the area to be sealed inside is isolated from the outside. It was applied as much as possible. Further, an epoxy-based ultraviolet curable resin material was applied as the outer peripheral sealing material 6 on the outer peripheral portion of the second substrate 4 so as to isolate the area sealed inside from the outside. The width of the sealing material is about 1.5mm before sealing, and the height is 75μ.
It was applied so that it would be m. Further, the outer peripheral sealing material 6 was applied so that the width was about 3.0 mm and the height was 100 μm.
【００５８】さらに、封止作業終了後に基板を切断する
際に破材が散乱しないように、補助シール材７を塗布し
た。シール材５の粘度を約１２０Ｐａ・Ｓ、外周シール
材６の粘度を約１５０Ｐａ・Ｓとした。Further, an auxiliary sealing material 7 was applied so that the broken material did not scatter when the substrate was cut after the sealing work was completed. The viscosity of the sealing material 5 was about 120 Pa · S and the viscosity of the outer peripheral sealing material 6 was about 150 Pa · S.
【００５９】そして、有機ＥＬ構造体２が形成された第
１の基板１を素子形成面を下にして上定盤８に吸着固定
し、対向する配置で第２の基板４を石英基板による下定
盤９上に固定した。このとき、下定盤９と第２の基板４
と間に、紫外線遮光基板１０を配置した。Then, the first substrate 1 on which the organic EL structure 2 is formed is adsorbed and fixed on the upper surface plate 8 with the element forming surface facing downward, and the second substrate 4 is placed on the upper surface of the upper surface plate 8 by a quartz substrate. It was fixed on the board 9. At this time, the lower surface plate 9 and the second substrate 4
The ultraviolet light shielding substrate 10 was arranged between the two.
【００６０】第１の基板１と第２の基板４の位置を適当
な配置に位置合わせした後、第１の基板１と第２の基板
４とを５mmの間隔まで近づけた。そして、封止作業室の
内部の圧力を０．５０７×１０５Ｐａに減圧し、第１の
基板１と第２の基板４との間隔が１００μmとなるよう
に近づけ、さらに、５０μmとなるように加圧圧着し
た。この後、第２の基板４を固定している下定盤９越し
に紫外線を所定量照射し、紫外線硬化性樹脂材料を硬化
させた。そして、封止作業室の内部を常圧（１．０１３
×１０５Ｐａ）に戻し、封止作業を終了した。その後、
得られた有機ＥＬディスプレイ用基板３０における所定
の位置をガラス切断機で切断し、有機ＥＬ素子１２を得
た。After aligning the positions of the first substrate 1 and the second substrate 4 to an appropriate arrangement, the first substrate 1 and the second substrate 4 were brought close to each other by a distance of 5 mm. Then, the pressure inside the sealing work chamber is reduced to 0.507 × 10 5 Pa, the distance between the first substrate 1 and the second substrate 4 is brought close to 100 μm, and further 50 μm. It was pressure-bonded to. After that, a predetermined amount of ultraviolet rays was radiated through the lower surface plate 9 to which the second substrate 4 was fixed to cure the ultraviolet ray curable resin material. Then, the inside of the sealing work chamber is kept at normal pressure (1.013
After returning to × 10 5 Pa), the sealing operation was completed. afterwards,
A predetermined position on the obtained organic EL display substrate 30 was cut with a glass cutting machine to obtain an organic EL element 12.
【００６１】さらに、シール材５の外部に引き出したデ
ータ配線にデータ配線ドライバを接続し、走査配線に走
査配線ドライバを接続した。なお、電極の本数に応じ
て、データ配線ドライバおよび走査配線ドライバが設け
られる。また、データ配線ドライバとして１２８出力の
定電流駆動ドライバＬＳＩを２個用い、走査配線ドライ
バとして３２出力の定電圧駆動ドライバＬＳＩを２個用
いた。データ配線ドライバとして、ＰＷＭ方式の階調表
示に対応するものを使用した。Further, the data wiring driver was connected to the data wiring drawn out of the sealing material 5, and the scanning wiring driver was connected to the scanning wiring. A data wiring driver and a scanning wiring driver are provided according to the number of electrodes. Also, two 128-output constant current drive driver LSIs were used as data wiring drivers, and two 32-output constant voltage drive driver LSIs were used as scanning wiring drivers. As the data wiring driver, one corresponding to the gradation display of the PWM system was used.
【００６２】そして、単純マトリックス法で有機ＥＬデ
ィスプレイを駆動し、有機ＥＬディスプレイのパネルの
表示を行ったところ、初期の表示状態では非発光領域の
発現はなかった。また、常温で５００時間連続して通電
した後の表示状態でも非発光領域の拡大は確認できなか
った。When the organic EL display was driven by the simple matrix method and the panel of the organic EL display was displayed, no non-light emitting region was expressed in the initial display state. In addition, no enlargement of the non-light emitting area could be confirmed even in the display state after energizing continuously for 500 hours at room temperature.
【００６３】[0063]
【発明の効果】本発明によれば、配置したシール材に気
道などを設ける工程がなくても、シール材が劣化しない
ようにして封止不良の発生を防止し、発光面積の減少や
発光品位の劣化を低減することができる。また、一枚の
基板から複数個の有機ＥＬ素子を作製する場合に、一枚
の第２の基板で一括封止することができ、封止不良の発
生を防止しつつ複数個の有機ＥＬディスプレイを効率よ
く製造することができる。According to the present invention, even if there is no step of providing an airway or the like in the disposed sealing material, the sealing material is prevented from deteriorating so as to prevent defective sealing, reduce the light emitting area, and improve the light emitting quality. Can be reduced. Moreover, when a plurality of organic EL elements are manufactured from one substrate, they can be collectively sealed with one second substrate, and a plurality of organic EL displays can be prevented while preventing the occurrence of sealing failure. Can be manufactured efficiently.
【図１】 実施形態１におけるシール材および外周シー
ル材が第２の基板に塗布された状態を示す断面図。FIG. 1 is a cross-sectional view showing a state in which a sealing material and a peripheral sealing material according to a first embodiment are applied to a second substrate.
【図２】 実施形態１における第１の基板が上定盤に固
定され第２の基板が下定盤に固定された状態を示す断面
図。FIG. 2 is a cross-sectional view showing a state in which a first substrate is fixed to an upper surface plate and a second substrate is fixed to a lower surface plate in the first embodiment.
【図３】 実施形態１における第１の基板と第２の基板
とが接着された状態を示す断面図。FIG. 3 is a cross-sectional view showing a state in which a first substrate and a second substrate according to Embodiment 1 are bonded together.
【図４】 実施形態１における有機ＥＬ素子が形成され
た状態を示す断面図。FIG. 4 is a sectional view showing a state in which an organic EL element according to the first embodiment is formed.
【図５】 実施形態２におけるシール材および外周シー
ル材が第２の基板に塗布された状態を示す断面図。FIG. 5 is a cross-sectional view showing a state in which a sealing material and a peripheral sealing material according to the second embodiment are applied to a second substrate.
【図６】 実施形態２における第１の基板が上定盤に固
定され第２の基板が下定盤に固定された状態を示す断面
図。FIG. 6 is a cross-sectional view showing a state in which a first substrate is fixed to an upper surface plate and a second substrate is fixed to a lower surface plate in the second embodiment.
【図７】 実施形態２における第１の基板と第２の基板
とが接着された状態を示す断面図。FIG. 7 is a cross-sectional view showing a state in which a first substrate and a second substrate according to the second embodiment are bonded together.
【図８】 実施形態２における有機ＥＬ素子が形成され
た状態を示す断面図。FIG. 8 is a cross-sectional view showing a state in which an organic EL element according to the second embodiment is formed.
【図９】 切断線を示す模式図。FIG. 9 is a schematic view showing a cutting line.
１ 第１の基板 ２ 有機ＥＬ構造体 ３ 駆動用配線 ４ 第２の基板 ５ シール材 ６ 外周シール材 ７ 補助シール材 ８ 上定盤 ８１ 基板固定具 ８２ 基板吸着用穴 ９ 下定盤 １０ 紫外線遮光基板 １１ 紫外線遮光部 １２ 有機ＥＬ素子 １３ 破材 ２０，３０ 有機ＥＬディスプレイ用基板 1st substrate 2 Organic EL structure 3 drive wiring 4 Second substrate 5 Seal material 6 Peripheral sealing material 7 Auxiliary sealing material 8 Upper plate 81 PCB fixture 82 Board suction holes 9 Lower surface plate 10 UV light shielding substrate 11 UV light shield 12 Organic EL device 13 broken materials 20,30 Organic EL display substrate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小嶋 誠司 神奈川県横浜市神奈川区羽沢町1150番地 旭硝子株式会社内 Ｆターム(参考） 3K007 AB11 AB12 AB13 AB18 BB01 DB03 FA02 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Seiji Kojima 1150 Hazawa-machi, Kanagawa-ku, Yokohama-shi, Kanagawa Asahi Glass Co., Ltd. F-term (reference) 3K007 AB11 AB12 AB13 AB18 BB01 DB03 FA02
Claims (9)
駆動用配線が形成された第１の基板における前記有機Ｅ
Ｌ構造体を、前記第１の基板に対向配置される第２の基
板と、前記第１の基板と前記第２の基板とを接合するシ
ール材とを用いて封止して有機ＥＬ素子を形成する有機
ＥＬディスプレイの製造方法において、前記第２の基板
における前記シール材で囲まれた領域よりも外側に該領
域を囲むように外周シール材を配置し、前記第２の基板
および前記シール材によって前記有機ＥＬ構造体を封止
した後、前記外周シール材を配置した領域を除去するこ
とを特徴とする有機ＥＬディスプレイの製造方法。1. An organic EL structure including an organic light emitting material and the organic E on a first substrate on which a driving wiring is formed.
The L structure is sealed by using a second substrate arranged to face the first substrate and a sealing material that joins the first substrate and the second substrate to each other to form an organic EL element. In the method for manufacturing an organic EL display to be formed, an outer peripheral sealing material is arranged outside the area of the second substrate surrounded by the sealing material so as to surround the area, and the second substrate and the sealing material are provided. A method for manufacturing an organic EL display, characterized in that after the organic EL structure is sealed by the method, a region in which the peripheral sealing material is arranged is removed.
および駆動用配線が形成された第１の基板におけるそれ
ぞれの有機ＥＬ構造体を、前記第１の基板に対向配置さ
れる第２の基板と、前記第１の基板と前記第２の基板と
を接合するシール材とを用いて封止して有機ＥＬ素子を
形成する有機ＥＬディスプレイの製造方法において、前
記複数の有機ＥＬ構造体のそれぞれを囲むようにシール
材を配置し、前記第２の基板における前記シール材で囲
まれた領域よりも外側に該領域を囲むように外周シール
材を配置し、前記第２の基板および前記シール材によっ
て複数の前記有機ＥＬ構造体を封止した後、前記外周シ
ール材を配置した領域を除去することを特徴とする有機
ＥＬディスプレイの製造方法。2. A plurality of organic EL structures containing an organic light emitting material and respective organic EL structures on a first substrate on which drive wirings are formed are arranged to face each other on the first substrate. In a method of manufacturing an organic EL display in which a substrate and a sealing material that joins the first substrate and the second substrate are used for sealing to form an organic EL element, A sealing material is arranged so as to surround each of them, and a peripheral sealing material is arranged outside the area of the second substrate surrounded by the sealing material so as to surround the area. A method for manufacturing an organic EL display, comprising: sealing a plurality of the organic EL structures with a material, and then removing a region where the outer peripheral sealing material is arranged.
補助シール材を配置し、第２の基板およびシール材によ
って複数の有機ＥＬ構造体を第１の基板と第２の基板の
間の空間内に封止した後、外周シール材を配置した領域
とともに前記補助シール材を配置した領域を除去する請
求項２に記載の有機ＥＬディスプレイの製造方法。3. An auxiliary sealant is arranged between regions where adjacent sealants are arranged, and a plurality of organic EL structures are provided between the first substrate and the second substrate by the second substrate and the sealant. 3. The method for manufacturing an organic EL display according to claim 2, wherein after sealing in the space, the area where the peripheral sealing material is arranged and the area where the auxiliary sealing material is arranged are removed.
シール材の高さＤＩＮと外周シール材の高さＤＯＵＴと
の関係をＤＯＵＴ＞ＤＩＮとする請求項１、２または３
に記載の有機ＥＬディスプレイの製造方法。4. The relationship between the height D IN of the sealing material before joining the first substrate and the second substrate and the height D OUT of the outer peripheral sealing material is D OUT > D IN. 2 or 3
The method for manufacturing an organic EL display according to item 1.
シール材の幅ＷＩＮと外周シール材の幅ＷＯＵＴとの関
係をＷＯＵＴ＞ＷＩＮとする請求項１、２、３または４
に記載の有機ＥＬディスプレイの製造方法。5. The relationship between the width W IN of the sealing material and the width W OUT of the outer peripheral sealing material before joining the first substrate and the second substrate is W OUT > W IN. 3 or 4
The method for manufacturing an organic EL display according to item 1.
シール材の粘度ＣＩＮと外周シール材の粘度ＣＯＵＴと
の関係をＣＯＵＴ＞ＣＩＮとする請求項１、２、３、４
または５に記載の有機ＥＬディスプレイの製造方法。6. The relationship between the viscosity C IN of the sealing material and the viscosity C OUT of the outer peripheral sealing material before the first substrate and the second substrate are bonded together is C OUT > C IN. 3, 4
Alternatively, the method of manufacturing the organic EL display according to item 5.
外周シール材の高さをＤＢｏとし、封止後の外周シール
材の高さをＤＡｏとした場合に、封止作業室の内部の圧
力を１．０１３×１０５×ＤＡｏ／ＤＢｏＰａの付近に
設定する請求項１、２、３、４、５または６に記載の有
機ＥＬディスプレイの製造方法。7. When the height of the outer peripheral sealing material before joining the first substrate and the second substrate is D Bo, and the height of the outer peripheral sealing material after sealing is D Ao , sealing is performed. The method for producing an organic EL display according to claim 1, 2, 3, 4, 5, or 6, wherein the pressure inside the work chamber is set to a value in the vicinity of 1.013 × 10 5 × D Ao / D Bo Pa.
駆動用配線が形成された第１の基板と、前記第１の基板
に対向配置された第２の基板とが、前記有機ＥＬ構造体
を囲むように前記第２の基板の面内で配置されたシール
材と、前記第２の基板における前記シール材で囲まれた
領域よりも外側に該領域を囲むように配置された外周シ
ール材とによって接合された構造を有することを特徴と
する有機ＥＬディスプレイ用基板。8. An organic EL structure including an organic EL structure containing an organic light-emitting material and a drive wiring, and a second substrate arranged to face the first substrate are the organic EL structure. A sealing material disposed in the plane of the second substrate so as to surround the outer peripheral sealing material, and an outer peripheral sealing material disposed so as to surround the area of the second substrate outside the area surrounded by the sealing material. A substrate for an organic EL display, which has a structure of being joined by.
および駆動用配線が形成された第１の基板と、前記第１
の基板に対向配置された第２の基板とが、前記複数の有
機ＥＬ構造体のそれぞれを囲むように前記第２の基板の
面内で配置されたシール材と、前記第２の基板における
前記シール材で囲まれた複数の領域を囲むように配置さ
れた外周シール材と、隣接するシール材で囲まれた領域
の間に配置された補助シール材とによって接合された構
造を有することを特徴とする有機ＥＬディスプレイ用基
板。9. A first substrate on which a plurality of organic EL structures containing an organic light emitting material and a driving wiring are formed, and the first substrate.
A second substrate disposed so as to face the substrate, and a sealing material disposed in the plane of the second substrate so as to surround each of the plurality of organic EL structures; and the second substrate in the second substrate. It has a structure in which it is joined by an outer peripheral sealing material arranged so as to surround a plurality of areas surrounded by the sealing material and an auxiliary sealing material arranged between the areas surrounded by adjacent sealing materials. Substrate for organic EL display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002097556A JP4101547B2 (en) | 2002-03-29 | 2002-03-29 | Manufacturing method of organic EL display and substrate for organic EL display |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002097556A JP4101547B2 (en) | 2002-03-29 | 2002-03-29 | Manufacturing method of organic EL display and substrate for organic EL display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003297555A true JP2003297555A (en) | 2003-10-17 |
| JP4101547B2 JP4101547B2 (en) | 2008-06-18 |
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|---|---|---|---|
| JP2002097556A Expired - Fee Related JP4101547B2 (en) | 2002-03-29 | 2002-03-29 | Manufacturing method of organic EL display and substrate for organic EL display |
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