JP2003249510A - 半導体封止方法 - Google Patents
半導体封止方法Info
- Publication number
- JP2003249510A JP2003249510A JP2002049542A JP2002049542A JP2003249510A JP 2003249510 A JP2003249510 A JP 2003249510A JP 2002049542 A JP2002049542 A JP 2002049542A JP 2002049542 A JP2002049542 A JP 2002049542A JP 2003249510 A JP2003249510 A JP 2003249510A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- resin sheet
- thin
- thickness
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 164
- 238000007789 sealing Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims description 44
- 229920005989 resin Polymers 0.000 claims abstract description 94
- 239000011347 resin Substances 0.000 claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 239000003566 sealing material Substances 0.000 claims description 30
- 238000005538 encapsulation Methods 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000126 substance Substances 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002049542A JP2003249510A (ja) | 2002-02-26 | 2002-02-26 | 半導体封止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002049542A JP2003249510A (ja) | 2002-02-26 | 2002-02-26 | 半導体封止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003249510A true JP2003249510A (ja) | 2003-09-05 |
| JP2003249510A5 JP2003249510A5 (enExample) | 2005-09-02 |
Family
ID=28662024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002049542A Pending JP2003249510A (ja) | 2002-02-26 | 2002-02-26 | 半導体封止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003249510A (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1585179A1 (en) * | 2004-04-05 | 2005-10-12 | Nitto Denko Corporation | Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet |
| WO2006011508A1 (ja) * | 2004-07-30 | 2006-02-02 | Murata Manufacturing Co., Ltd. | 複合型電子部品及びその製造方法 |
| JP2007142247A (ja) * | 2005-11-21 | 2007-06-07 | Lintec Corp | 樹脂封止型半導体装置の製造方法 |
| KR100828925B1 (ko) * | 2004-07-30 | 2008-05-13 | 가부시키가이샤 무라타 세이사쿠쇼 | 복합형 전자부품 및 그 제조방법 |
| JP2009218305A (ja) * | 2008-03-10 | 2009-09-24 | Fuji Electric Device Technology Co Ltd | 絶縁膜形成方法 |
| US7594316B2 (en) | 2004-07-30 | 2009-09-29 | Murata Manufacturing Co., Ltd. | Method of manufacturing composite electronic component |
| JP2010109383A (ja) * | 2010-01-12 | 2010-05-13 | Lintec Corp | 樹脂封止型半導体装置の製造方法 |
| JP2011049298A (ja) * | 2009-08-26 | 2011-03-10 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
| JP2013048284A (ja) * | 2012-11-01 | 2013-03-07 | Lintec Corp | 樹脂封止型半導体装置の製造方法 |
| JP2014159555A (ja) * | 2013-01-23 | 2014-09-04 | Nitto Denko Corp | シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 |
| JP5680210B2 (ja) * | 2012-07-17 | 2015-03-04 | 日東電工株式会社 | 封止層被覆半導体素子および半導体装置の製造方法 |
| JP2023118943A (ja) * | 2019-02-04 | 2023-08-25 | 株式会社ソニー・インタラクティブエンタテインメント | 半導体装置、絶縁シート、及び半導体装置の製造方法 |
-
2002
- 2002-02-26 JP JP2002049542A patent/JP2003249510A/ja active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7221007B2 (en) | 2004-04-05 | 2007-05-22 | Nitto Denko Corporation | Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet |
| EP1585179A1 (en) * | 2004-04-05 | 2005-10-12 | Nitto Denko Corporation | Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet |
| US7594316B2 (en) | 2004-07-30 | 2009-09-29 | Murata Manufacturing Co., Ltd. | Method of manufacturing composite electronic component |
| WO2006011508A1 (ja) * | 2004-07-30 | 2006-02-02 | Murata Manufacturing Co., Ltd. | 複合型電子部品及びその製造方法 |
| KR100828925B1 (ko) * | 2004-07-30 | 2008-05-13 | 가부시키가이샤 무라타 세이사쿠쇼 | 복합형 전자부품 및 그 제조방법 |
| US7684207B2 (en) | 2004-07-30 | 2010-03-23 | Murata Manufacturing Co., Ltd. | Composite electronic component |
| JP2007142247A (ja) * | 2005-11-21 | 2007-06-07 | Lintec Corp | 樹脂封止型半導体装置の製造方法 |
| JP2009218305A (ja) * | 2008-03-10 | 2009-09-24 | Fuji Electric Device Technology Co Ltd | 絶縁膜形成方法 |
| JP2011049298A (ja) * | 2009-08-26 | 2011-03-10 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
| JP2010109383A (ja) * | 2010-01-12 | 2010-05-13 | Lintec Corp | 樹脂封止型半導体装置の製造方法 |
| JP5680210B2 (ja) * | 2012-07-17 | 2015-03-04 | 日東電工株式会社 | 封止層被覆半導体素子および半導体装置の製造方法 |
| CN104471692A (zh) * | 2012-07-17 | 2015-03-25 | 日东电工株式会社 | 封装层覆盖半导体元件以及半导体装置的制造方法 |
| JP2013048284A (ja) * | 2012-11-01 | 2013-03-07 | Lintec Corp | 樹脂封止型半導体装置の製造方法 |
| JP2014159555A (ja) * | 2013-01-23 | 2014-09-04 | Nitto Denko Corp | シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 |
| JP2023118943A (ja) * | 2019-02-04 | 2023-08-25 | 株式会社ソニー・インタラクティブエンタテインメント | 半導体装置、絶縁シート、及び半導体装置の製造方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Effective date: 20050217 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050307 |
|
| A977 | Report on retrieval |
Effective date: 20050721 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20060829 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070109 |