JP2003249510A - 半導体封止方法 - Google Patents

半導体封止方法

Info

Publication number
JP2003249510A
JP2003249510A JP2002049542A JP2002049542A JP2003249510A JP 2003249510 A JP2003249510 A JP 2003249510A JP 2002049542 A JP2002049542 A JP 2002049542A JP 2002049542 A JP2002049542 A JP 2002049542A JP 2003249510 A JP2003249510 A JP 2003249510A
Authority
JP
Japan
Prior art keywords
semiconductor
resin sheet
thin
thickness
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002049542A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003249510A5 (enExample
Inventor
Yoshihiro Dobashi
美博 土橋
Tadaharu Tomita
忠治 富田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
Original Assignee
Athlete FA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Athlete FA Corp filed Critical Athlete FA Corp
Priority to JP2002049542A priority Critical patent/JP2003249510A/ja
Publication of JP2003249510A publication Critical patent/JP2003249510A/ja
Publication of JP2003249510A5 publication Critical patent/JP2003249510A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2002049542A 2002-02-26 2002-02-26 半導体封止方法 Pending JP2003249510A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002049542A JP2003249510A (ja) 2002-02-26 2002-02-26 半導体封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002049542A JP2003249510A (ja) 2002-02-26 2002-02-26 半導体封止方法

Publications (2)

Publication Number Publication Date
JP2003249510A true JP2003249510A (ja) 2003-09-05
JP2003249510A5 JP2003249510A5 (enExample) 2005-09-02

Family

ID=28662024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002049542A Pending JP2003249510A (ja) 2002-02-26 2002-02-26 半導体封止方法

Country Status (1)

Country Link
JP (1) JP2003249510A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1585179A1 (en) * 2004-04-05 2005-10-12 Nitto Denko Corporation Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
WO2006011508A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
JP2007142247A (ja) * 2005-11-21 2007-06-07 Lintec Corp 樹脂封止型半導体装置の製造方法
KR100828925B1 (ko) * 2004-07-30 2008-05-13 가부시키가이샤 무라타 세이사쿠쇼 복합형 전자부품 및 그 제조방법
JP2009218305A (ja) * 2008-03-10 2009-09-24 Fuji Electric Device Technology Co Ltd 絶縁膜形成方法
US7594316B2 (en) 2004-07-30 2009-09-29 Murata Manufacturing Co., Ltd. Method of manufacturing composite electronic component
JP2010109383A (ja) * 2010-01-12 2010-05-13 Lintec Corp 樹脂封止型半導体装置の製造方法
JP2011049298A (ja) * 2009-08-26 2011-03-10 Fujitsu Semiconductor Ltd 半導体装置の製造方法
JP2013048284A (ja) * 2012-11-01 2013-03-07 Lintec Corp 樹脂封止型半導体装置の製造方法
JP2014159555A (ja) * 2013-01-23 2014-09-04 Nitto Denko Corp シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP5680210B2 (ja) * 2012-07-17 2015-03-04 日東電工株式会社 封止層被覆半導体素子および半導体装置の製造方法
JP2023118943A (ja) * 2019-02-04 2023-08-25 株式会社ソニー・インタラクティブエンタテインメント 半導体装置、絶縁シート、及び半導体装置の製造方法
CN117690918A (zh) * 2023-11-13 2024-03-12 深圳市艾比森光电股份有限公司 显示面板的制备方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7221007B2 (en) 2004-04-05 2007-05-22 Nitto Denko Corporation Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
EP1585179A1 (en) * 2004-04-05 2005-10-12 Nitto Denko Corporation Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
WO2006011508A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
KR100828925B1 (ko) * 2004-07-30 2008-05-13 가부시키가이샤 무라타 세이사쿠쇼 복합형 전자부품 및 그 제조방법
US7594316B2 (en) 2004-07-30 2009-09-29 Murata Manufacturing Co., Ltd. Method of manufacturing composite electronic component
US7684207B2 (en) 2004-07-30 2010-03-23 Murata Manufacturing Co., Ltd. Composite electronic component
JP2007142247A (ja) * 2005-11-21 2007-06-07 Lintec Corp 樹脂封止型半導体装置の製造方法
JP2009218305A (ja) * 2008-03-10 2009-09-24 Fuji Electric Device Technology Co Ltd 絶縁膜形成方法
JP2011049298A (ja) * 2009-08-26 2011-03-10 Fujitsu Semiconductor Ltd 半導体装置の製造方法
JP2010109383A (ja) * 2010-01-12 2010-05-13 Lintec Corp 樹脂封止型半導体装置の製造方法
JP5680210B2 (ja) * 2012-07-17 2015-03-04 日東電工株式会社 封止層被覆半導体素子および半導体装置の製造方法
CN104471692A (zh) * 2012-07-17 2015-03-25 日东电工株式会社 封装层覆盖半导体元件以及半导体装置的制造方法
JP2013048284A (ja) * 2012-11-01 2013-03-07 Lintec Corp 樹脂封止型半導体装置の製造方法
JP2014159555A (ja) * 2013-01-23 2014-09-04 Nitto Denko Corp シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP2023118943A (ja) * 2019-02-04 2023-08-25 株式会社ソニー・インタラクティブエンタテインメント 半導体装置、絶縁シート、及び半導体装置の製造方法
JP7899133B2 (ja) 2019-02-04 2026-08-03 株式会社ソニー・インタラクティブエンタテインメント 半導体装置、絶縁シート、及び半導体装置の製造方法
CN117690918A (zh) * 2023-11-13 2024-03-12 深圳市艾比森光电股份有限公司 显示面板的制备方法

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