JP2003249509A - 半導体封止方法および封止された半導体 - Google Patents

半導体封止方法および封止された半導体

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Publication number
JP2003249509A
JP2003249509A JP2002049535A JP2002049535A JP2003249509A JP 2003249509 A JP2003249509 A JP 2003249509A JP 2002049535 A JP2002049535 A JP 2002049535A JP 2002049535 A JP2002049535 A JP 2002049535A JP 2003249509 A JP2003249509 A JP 2003249509A
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JP
Japan
Prior art keywords
semiconductor
resin
thickness
semiconductors
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002049535A
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English (en)
Japanese (ja)
Other versions
JP2003249509A5 (enExample
Inventor
Yoshihiro Dobashi
美博 土橋
Tadaharu Tomita
忠治 富田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
Original Assignee
Athlete FA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Athlete FA Corp filed Critical Athlete FA Corp
Priority to JP2002049535A priority Critical patent/JP2003249509A/ja
Publication of JP2003249509A publication Critical patent/JP2003249509A/ja
Publication of JP2003249509A5 publication Critical patent/JP2003249509A5/ja
Pending legal-status Critical Current

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JP2002049535A 2002-02-26 2002-02-26 半導体封止方法および封止された半導体 Pending JP2003249509A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002049535A JP2003249509A (ja) 2002-02-26 2002-02-26 半導体封止方法および封止された半導体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002049535A JP2003249509A (ja) 2002-02-26 2002-02-26 半導体封止方法および封止された半導体

Publications (2)

Publication Number Publication Date
JP2003249509A true JP2003249509A (ja) 2003-09-05
JP2003249509A5 JP2003249509A5 (enExample) 2005-08-25

Family

ID=28662019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002049535A Pending JP2003249509A (ja) 2002-02-26 2002-02-26 半導体封止方法および封止された半導体

Country Status (1)

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JP (1) JP2003249509A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009527117A (ja) * 2006-02-14 2009-07-23 デルファイ・テクノロジーズ・インコーポレーテッド 圧電アクチュエータ
JP2012059743A (ja) * 2010-09-06 2012-03-22 Nitto Denko Corp 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP2012151451A (ja) * 2010-12-27 2012-08-09 Shin Etsu Chem Co Ltd 繊維含有樹脂基板、封止後半導体素子搭載基板及び封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法
JP2013147589A (ja) * 2012-01-20 2013-08-01 Nitto Denko Corp 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法
JP2014076606A (ja) * 2012-10-11 2014-05-01 Nitto Denko Corp 積層体
WO2014080717A1 (ja) * 2012-11-20 2014-05-30 日東電工株式会社 電子部品装置の製造方法、及び、電子部品装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009527117A (ja) * 2006-02-14 2009-07-23 デルファイ・テクノロジーズ・インコーポレーテッド 圧電アクチュエータ
JP2012059743A (ja) * 2010-09-06 2012-03-22 Nitto Denko Corp 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP2012151451A (ja) * 2010-12-27 2012-08-09 Shin Etsu Chem Co Ltd 繊維含有樹脂基板、封止後半導体素子搭載基板及び封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法
US9240332B2 (en) 2010-12-27 2016-01-19 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
EP2469590A3 (en) * 2010-12-27 2016-06-08 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
JP2013147589A (ja) * 2012-01-20 2013-08-01 Nitto Denko Corp 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法
JP2014076606A (ja) * 2012-10-11 2014-05-01 Nitto Denko Corp 積層体
WO2014080717A1 (ja) * 2012-11-20 2014-05-30 日東電工株式会社 電子部品装置の製造方法、及び、電子部品装置

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