JP2003243380A5 - - Google Patents
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- Publication number
- JP2003243380A5 JP2003243380A5 JP2003041345A JP2003041345A JP2003243380A5 JP 2003243380 A5 JP2003243380 A5 JP 2003243380A5 JP 2003041345 A JP2003041345 A JP 2003041345A JP 2003041345 A JP2003041345 A JP 2003041345A JP 2003243380 A5 JP2003243380 A5 JP 2003243380A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- electrode block
- control means
- temperature control
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003041345A JP4063689B2 (ja) | 2003-02-19 | 2003-02-19 | プラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003041345A JP4063689B2 (ja) | 2003-02-19 | 2003-02-19 | プラズマ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002038915A Division JP3742349B2 (ja) | 2002-02-15 | 2002-02-15 | プラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003243380A JP2003243380A (ja) | 2003-08-29 |
| JP2003243380A5 true JP2003243380A5 (cg-RX-API-DMAC7.html) | 2005-08-11 |
| JP4063689B2 JP4063689B2 (ja) | 2008-03-19 |
Family
ID=27785802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003041345A Expired - Lifetime JP4063689B2 (ja) | 2003-02-19 | 2003-02-19 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4063689B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1801861B1 (en) * | 2004-07-09 | 2012-10-03 | Sekisui Chemical Co., Ltd. | Method and device for treating outer periphery of a substrate |
| JP4539245B2 (ja) * | 2004-09-06 | 2010-09-08 | 横浜ゴム株式会社 | 樹脂集積配管およびその製造方法 |
| JP5198226B2 (ja) * | 2008-11-20 | 2013-05-15 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
| JP7450348B2 (ja) * | 2018-11-15 | 2024-03-15 | 東京エレクトロン株式会社 | 真空処理装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08191059A (ja) * | 1995-01-09 | 1996-07-23 | Hitachi Ltd | プラズマ処理装置 |
| JPH0917770A (ja) * | 1995-06-28 | 1997-01-17 | Sony Corp | プラズマ処理方法およびこれに用いるプラズマ装置 |
| JPH09167794A (ja) * | 1995-12-15 | 1997-06-24 | Sony Corp | 静電チャックおよびプラズマ処理方法 |
| JPH1154482A (ja) * | 1997-08-05 | 1999-02-26 | Hitachi Ltd | 半導体装置の製造方法および装置ならびにワークの処理方法 |
| JP4067633B2 (ja) * | 1998-03-06 | 2008-03-26 | 東京エレクトロン株式会社 | 処理装置 |
| JPH11260803A (ja) * | 1998-03-13 | 1999-09-24 | Hitachi Ltd | ウェハ温度の制御方法 |
| JPH11307513A (ja) * | 1998-04-20 | 1999-11-05 | Sony Corp | 絶縁体基板対応プラズマ処理装置 |
| JP2000216140A (ja) * | 1999-01-20 | 2000-08-04 | Hitachi Ltd | ウエハステ―ジおよびウエハ処理装置 |
| TW503440B (en) * | 1999-11-08 | 2002-09-21 | Applied Materials Inc | Apparatus for controlling temperature in a semiconductor processing system |
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2003
- 2003-02-19 JP JP2003041345A patent/JP4063689B2/ja not_active Expired - Lifetime