JP2003243160A - Manufacturing method and device of electro-optic device, electro-optic device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electro-optic device which can maintain a high productivity in laminating a substrate with a sealing member. <P>SOLUTION: The substrate 1 and a sealing substrate 2 are laminated together by a manufacturing process consisting of a process of placing a first adhesive 21 at a first region AR1 of a bonding region R of the substrate 1 and the sealing substrate 2, a process of placing as second adhesive 22 at a second region AR2 of the laminating region R, a process of making a first treatment on the first adhesive 21 after laminating the substrate 1 and the sealing substrate 2, and a process of making a second treatment on the second adhesive 22. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an electro-optical device, an electro-optical device, and an electronic apparatus having the electro-optical device, and more particularly to an electro-optical device including a light emitting element such as an organic EL element. The present invention relates to a manufacturing method and manufacturing apparatus, an electro-optical device, and an electronic device.

[0002]

2. Description of the Related Art Conventionally, in electro-optical devices such as liquid crystal devices and organic EL (electroluminescence) devices, a plurality of circuit elements, electrodes,
Some have a structure in which liquid crystal or EL elements are laminated. For example, an organic EL device has a light emitting element in which a light emitting layer containing a light emitting substance is sandwiched between electrode layers of an anode and a cathode, and holes injected from the anode side and electrons injected from the cathode side are included. The phenomenon of emitting light when recombination between and in the light-emitting layer having light-emitting ability and when the excited state is collapsed is used.

[0003]

However, the above-mentioned conventional electro-optical device has the following problems. Since the organic EL device having the above-described configuration includes the current-driven light emitting element, a current must be passed between the anode and the cathode when emitting light. As a result, the element generates heat during light emission, and when oxygen or moisture is present around the element, oxidation of the element constituent material due to the oxygen or moisture is promoted to deteriorate the element. In particular, the alkali metal or alkaline earth metal used for the cathode has the property of being easily oxidized. The typical deterioration of the device due to oxidation and water is the generation and growth of dark spots. The dark spot is a light emission defect point. Then, as the deterioration of the light emitting element progresses along with the driving of the organic EL device, the emission brightness decreases, the light emission becomes unstable, and the like.
There is a problem that stability with time is low and life is short.

Therefore, as an example of a measure for suppressing the above deterioration, the substrate on which the light emitting element is arranged and the sealing member are integrated with each other with an adhesive, and the substrate, the sealing member and the adhesive are formed. There is known a technique of arranging a light emitting element in a closed space to shield the atmosphere from the atmosphere. However, when the electro-optical device is transported, for example, during the manufacturing process, the adhesive may be completely cured because the substrate and the sealing member may be misaligned unless the adhesive is completely cured and then transported. However, there is a problem in that productivity cannot be reduced even if it cannot be carried, or even if it is carried, it must be carried at a slower carrying speed.

The present invention has been made in view of the above circumstances, and a method of manufacturing an electro-optical device, an electro-optical device, and an electro-optical device capable of maintaining high productivity when the substrate and the sealing member are bonded together. An object of the present invention is to provide an electronic device having this electro-optical device.

[0006]

In order to solve the above problems, a method of manufacturing an electro-optical device according to the present invention is a method of manufacturing an electro-optical device provided with a light emitting element arranged on a first member, There is a bonding step of bonding the second member to the first member, and the bonding step includes
Arranging a first material in a first region, which is a part of a bonding region where the first member and the second member are bonded together, and in the bonding region, The step of disposing the second material in the second area other than the first area, and the step of adhering the first member and the second member together, and then disposing in the first area. It is characterized by including a step of performing a first treatment on the first material and a step of performing a second treatment on the second material arranged in the second region.

According to the present invention, by arranging the first material and the second material in the bonding area, and adopting a material that can be cured by the first treatment as the first material, for example, in a short time. The first member and the second member can be temporarily fixed with the first material in a short time, and the waiting time for curing can be shortened. Therefore, the subsequent manufacturing process can be efficiently performed,
High productivity can be maintained. Then, by adopting a material having desired performance such as high sealing performance as the second material, an electro-optical device exhibiting desired performance can be manufactured using this second material.

The light emitting element is formed between the first member and the second member,
If a material having high sealing performance is used as the second material,
The member and the second member can hermetically seal the light emitting element.

Further, in the method of manufacturing the electro-optical device of the present invention, the first material is a photo-curable material and the second material is a thermosetting material. Thereby, the first member and the second member can be temporarily fixed in a short time by irradiating the first material with light such as ultraviolet rays. Moreover, the sealing performance can be improved by adopting a thermosetting material as the second material.

At this time, the first treatment includes a step of irradiating the first material arranged in the first region with light having a predetermined wavelength, and the second treatment is performed. , Heating the second material disposed in the second region.

Here, the first material and the second material may be any adhesives that can bond the first member and the second member, and may be any of the above-mentioned ultraviolet curable material and thermosetting material. In addition to such an adhesive, it is also possible to use an EB (electron beam) curable material, a two-liquid mixed curable material, or a thermoplastic material called a hot melt type. That is, as the first material, a material that can be hardened in a short time to temporarily fix the first member and the second member is preferable, and as the second material, the first member and It is preferable to use a material that can suppress the invasion of air and moisture into the space formed between the second member and the second member.

Further, in the method of manufacturing an electro-optical device of the present invention, a construction is adopted in which the bonding step is performed in an inert gas atmosphere. Thereby, deterioration of the light emitting element can be prevented. Here, the inert gas is a gas inert to the light emitting element, and examples thereof include nitrogen gas and argon gas.

Further, in the method of manufacturing the electro-optical device according to the present invention, when the first material or the second material is arranged in the bonding area, the structure is discontinuously arranged. In addition, in the method of manufacturing an electro-optical device of the present invention, when the first material and the second material are applied to the bonding area, they are applied discontinuously, and then the first member and A configuration is adopted in which at least one of the first material and the second material is bonded so as to be in a continuous arrangement by the step of pressure-bonding the second member. As a result, when the first member and the second member are pressure-bonded in the bonding step, the first member or the second member is blown out to a portion other than the bonding region to cause a sealing failure. However, since the first material or the second material is discontinuously arranged,
In the initial stage of pressure bonding, the pressurized gas inside the space formed between the first member and the second member can be discharged to the outside from the formed discontinuous portion (gap). After that, the first member and the second member are extremely close to each other, so that the first member
Capillary phenomenon occurs between the first material and the second material, and at least one of the first material and the second material forms a continuous arrangement, so that the first member and the second member The space formed between them is completely isolated from the external environment and is sealed.

In the method of manufacturing an electro-optical device according to the present invention, the third material is arranged in the third region other than the first region and the second region in the bonding region. Adopted. Thereby, by adopting, for example, a hygroscopic material as the third material,
It is possible to prevent moisture from entering the light emitting element from the outside and further prevent element deterioration. Thus, by adopting a material having a desired function as the third material, high performance of the electro-optical device can be achieved. Here, the third material may be an adhesive capable of adhering the first member and the second member, or may be a material other than the adhesive.

The electro-optical device of the present invention is the electro-optical device manufacturing apparatus including a light-emitting element disposed on a first member and a second member bonded to the first member, wherein A first coating device capable of arranging a first material in a first region, which is a part of a bonding region where the first member and the second member are bonded together, and the bonding region. A second coating device capable of arranging the second material in the second region other than the first region is provided.

According to the present invention, by arranging the first material which can be cured in a short time, for example, in the bonding area by the first coating device, the first member and the second member are made of the first material. Can be temporarily fixed in a short time, and the waiting time for curing can be shortened. Therefore, the subsequent manufacturing process can be efficiently performed. Then, by disposing, for example, a second material having a high sealing performance by the second coating device, the sealing property for the light emitting element can be improved and the element deterioration can be prevented. Therefore, the manufactured electro-optical device can exhibit desired performance.

Further, since it has a structure having two coating devices,
It is also possible to apply the first material and the second material at the same time, and the productivity can be improved. Of course, the coating device is 2
It is not limited to one and may have a configuration including an arbitrary plurality of three or more. In addition to the configuration in which the first coating device arranges the first material on the member and the second coating device arranges the second material on the member, each of the first coating device and the second coating device The same material may be arranged on the member.

Further, in the electro-optical device manufacturing apparatus of the present invention, the first coating device and the second coating device are:
A configuration is adopted in which each of the first material and the second material can be arranged in a predetermined pattern. Accordingly, the material can be arranged at a desired position with a desired coating amount in the bonding region, so that the adhesiveness can be improved and the amount of the material used can be suppressed and the bonding can be performed efficiently.

Further, in the electro-optical device manufacturing apparatus of the present invention, the first coating device and the second coating device are:
A configuration is adopted in which the bonding area can be moved independently of each other. Accordingly, the first coating device and the second coating device can simultaneously arrange the first material and the second material without interfering with each other. Therefore, workability is improved.

Further, in the electro-optical device manufacturing apparatus of the present invention, a detection device capable of detecting the distance between the bonding area and each of the first coating device and the second coating device is provided, and the detection is performed. A configuration is adopted in which the positions of the first coating device and the second coating device are adjusted based on the detection result of the device. Accordingly, each of the first coating device and the second coating device can apply the material from the optimum position with respect to the bonding region, and can arrange the appropriate amount of material at the desired position in the bonding region.

An electro-optical device according to the present invention is an electro-optical device including a light emitting element arranged on a first member, and a second member bonded to the first member and the first member. A first material disposed in a first region which is a part of a bonding region where the second member and the second member are bonded, and a second material other than the first region in the bonding region. And a second material disposed in the region of.

According to the present invention, by bonding the first member and the second member with the first material and the second material, a good adhesion state can be maintained.

Since the light emitting element is formed between the first member and the second member,
If a material having a high atmospheric barrier performance is used as the second material, the light emitting element can be hermetically sealed by the first member and the second member, and the electro-optical device can exhibit desired performance.

Electronic equipment of the present invention is characterized by including the electro-optical device described above.

According to the present invention, it is possible to obtain a thin and long-life electronic device in which deterioration of the light emitting element is suppressed.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an electro-optical device manufacturing method and device, an electro-optical device, and an electronic apparatus according to the present invention will be described below with reference to the drawings. here,
The electro-optical device of the present invention will be described using an example in which the electro-optical device is an organic EL device.

FIG. 1 is a sectional view of a main part of an organic EL device (electro-optical device). In FIG. 1, an organic EL device (electro-optical device) A includes a substrate (first member) 1, a light emitting element 3 arranged on the substrate 1, and sealing as a sealing member bonded to the substrate 1. And a substrate (second member) 2.

Here, the organic EL device A shown in FIG. 1 has a form in which light emitted from the light emitting element 3 is taken out from the substrate 1 side to the outside of the device. The material for forming the substrate 1 is transparent or transparent to light. Examples include translucent materials such as transparent glass, quartz, sapphire, and transparent synthetic resins such as polyolefin, polyester, polyacrylate, polycarbonate, and polyetherketone. In particular, inexpensive soda glass is preferably used as the material for forming the substrate 1.

On the other hand, when the emitted light is taken out from the side opposite to the substrate 1, the substrate 1 may be opaque. In that case, a ceramic sheet such as alumina or a metal sheet such as stainless steel is subjected to an insulation treatment such as surface oxidation. A resin, a thermosetting resin, a thermoplastic resin or the like can be used.

The light emitting element 3 includes an anode 5 formed on the substrate 1, a hole transport layer 6, and an insulating layer 7 formed so as to expose a surface where the anode 5 is in contact with the hole transport layer 6. The organic light emitting layer 8, the electron transport layer 9, and the cathode 10 are roughly configured.

The material of the anode 5 is aluminum (A
l), gold (Au), silver (Ag), magnesium (M
g), nickel (Ni), zinc-vanadium (Zn
V), indium (In), tin (Sn), and other simple substances, their compounds or mixtures, and conductive adhesives containing metal fillers.
O (Indium Tin Oxide) is used. The anode 5 is preferably formed by sputtering, ion plating, or vacuum deposition, but is formed by the WET process coating method using a spin coater, a gravure coater, a knife coater, screen printing, flexo printing, or the like. May be. The light transmittance of the anode 5 is preferably set to 80% or more.

As the hole transport layer 6, for example, a carbazole polymer and a TPD: triphenyl compound are co-evaporated to have a thickness of 10 to 1000 nm (preferably 100 to 700 n).
The film thickness is m). Here, the material for forming the hole transport layer 6 is not particularly limited, and known materials can be used, and examples thereof include a pyrazoline derivative, an arylamine derivative, a stilbene derivative, and a triphenyldiamine derivative. Specifically, JP-A-63-7025
No. 7, 63-175860, and JP-A-2-135.
359, 2-135361, 2-209988.
No. 3,37,992, and No. 3-152184 are exemplified, but triphenyldiamine derivatives are preferable, and 4,4′-bis (N
(3-Methylphenyl) -N-phenylamino) biphenyl is preferred.

The hole injection layer may be formed in place of the hole transport layer 6, or both the hole injection layer and the hole transport layer may be formed. In that case, examples of the material for forming the hole injection layer include copper phthalocyanine (CuPc), polyphenylene vinylene that is polytetrahydrothiophenylphenylene, and 1,1-bis-
(4-N, N-ditolylaminophenyl) cyclohexane, tris (8-hydroxyquinolinol) aluminum and the like can be mentioned, but especially copper phthalocyanine (CuP
Preference is given to using c).

Alternatively, the hole transport layer 6 may be formed by ejecting a composition ink containing a hole injecting and transport layer material onto the anode 5 by, for example, an ink jet method, and then performing a drying treatment and a heat treatment. Formed on. That is, after the composition ink containing the hole transport layer material or the hole injection layer material described above is ejected onto the electrode surface of the anode 5, the hole transport layer (on the anode 5 is subjected to a drying treatment and a heat treatment. A hole injection layer) is formed. For example, an ink jet head (not shown) is filled with a composition ink containing a hole transport layer material or a hole injection layer material, the ejection nozzle of the ink jet head is opposed to the electrode surface of the anode 5, and the ink jet head and the substrate 1 are While relatively moving the ink droplets, ink droplets whose liquid amount per droplet is controlled are discharged from the discharge nozzle onto the electrode surface. Next, the ejected ink droplets are dried to evaporate the polar solvent contained in the composition ink to form a hole transport layer (hole injection layer).

As the composition ink, it is possible to use, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrene sulfonic acid dissolved in a polar solvent such as isopropyl alcohol. Here, the ejected ink droplets spread on the electrode surface of the anode 5 that has been subjected to the ink-philic treatment. On the other hand, ink drops are repelled and do not adhere to the upper surface of the insulating layer 7 that has been subjected to the ink repellent treatment. Therefore, even if the ink droplet is ejected from the predetermined ejection position onto the upper surface of the insulating layer 7, the upper surface is not wetted by the ink droplet, and the repelled ink droplet is supposed to roll onto the anode 5. There is.

After the step of forming the hole transport layer 6,
In order to prevent the hole transport layer 6 and the organic light emitting layer 8 from being oxidized, it is preferable to carry out in an inert gas atmosphere such as a nitrogen atmosphere or an argon atmosphere.

The insulating layer 7 is formed by forming a silicon oxide film or a nitride film on the entire surface of the substrate by plasma CVD using TEOS, oxygen gas or the like as a raw material, and then patterning it by using a photolithography technique and an etching technique. You can

Similar to the hole transport layer 6, the organic light emitting layer 8 is dried by ejecting the composition ink containing the material for the light emitting layer onto the hole transport layer 6 by, for example, an inkjet method or a mask vapor deposition method. Alternatively, it is formed on the hole transport layer 6 by performing heat treatment. As the light emitting material forming the organic light emitting layer 8, a fluorene polymer derivative, a (poly) paraphenylene vinylene derivative, a polyphenylene derivative, a polyfluorene derivative, a polyvinylcarbazole, a polythiophene derivative, a perylene dye, a coumarin dye, and a rhodamine dye are used. A low molecular weight organic EL material, a high molecular weight organic EL material or the like which is soluble in a dye or other benzene derivative can be used. Materials suitable for the inkjet method include, for example, paraphenylene vinylene derivative, polyphenylene derivative, polyfluorene derivative, polyvinylcarbazole, and polythiophene derivative, and materials suitable for the mask vapor deposition method are perylene-based dyes and coumarin-based materials. Examples thereof include dyes and rhodamine dyes.

As the electron transport layer 9, a metal complex compound formed from a metal and an organic ligand, preferably A
1q3 (tris (8-quinolinolate) aluminum complex), Znq2 (bis (8-quinolinolate) zinc complex),
Bebq2 (bis (8-quinolinolate) beryllium complex), Zn-BTZ (2- (o-hydroxyphenyl) benzothiazole zinc), perylene derivative, etc.
It is vapor-deposited and laminated so as to have a film thickness of 000 nm (preferably 100 to 700 nm).

The cathode 10 is a metal having a low work function, which is preferably Ca, which can efficiently inject electrons into the electron transport layer 9.
It can be formed of a simple substance such as Au, Mg, Sn, In, Ag, Li or Al, or an alloy or compound thereof. In the present embodiment, a cathode mainly composed of Ca and A
It has a two-layer structure of a reflective layer mainly composed of l.

Although not shown, the organic EL device A of the present embodiment is an active matrix type, and actually has a plurality of data lines and a plurality of scanning lines arranged in a grid pattern.
The light emitting element 3 is connected to each pixel arranged in a matrix divided into these data lines and scanning lines via a driving TFT such as a switching transistor or a driving transistor. Then, when a drive signal is supplied through the data line or the scanning line, a current flows between the electrodes,
The light emitting element 3 emits light, and light is emitted to the outer surface side of the transparent substrate 1 to light up the pixel. It goes without saying that the present invention is not limited to the active matrix type and can be applied to a passive drive type display element.

The sealing substrate 2 blocks the entry of air into the light emitting element 3 including the electrodes 5 and 10 from the outside, and is bonded to the substrate 1. Examples of the material for forming the sealing substrate 2 include transparent or translucent materials such as glass, quartz, sapphire, and synthetic resin. Examples of the glass include soda lime glass, lead alkali glass, borosilicate glass, aluminosilicate glass, silica glass and the like. Examples of the synthetic resin include transparent synthetic resins such as polyolefin, polyester, polyacrylate, polycarbonate, and polyetherketone.

The sealing substrate 2 is formed in a U shape facing downward in cross section, and the region (bonding region) R outside the portion where the light emitting element 3 is provided on the upper surface of the substrate 1 and the sealing substrate 2 are sealed.
The sealing space K is formed between the flat substrate 1 and the sealing substrate 2 by being bonded to the lower end surface (bonding region) C of the. The light emitting element 3 including the electrodes 5 and 10 is arranged in the sealed space K. Further, a desiccant 11 is provided on the sealing space K side of the sealing substrate 2. The desiccant 11 suppresses deterioration of the light emitting element 3 arranged in the sealed space K due to moisture.

The substrate 1 and the sealing substrate 2 are adhered to each other with a first adhesive (first material) 21 and a second adhesive (second material) 22. FIG. 2 is a view taken along the line BB of FIG. As shown in FIG. 2, a first adhesive 21 and a second adhesive 22 are arranged in a bonding region R that is bonded to the sealing substrate 2 on the upper surface of the substrate 1. First
The adhesive 21 is arranged in the inner region (first region) AR1 of the square-shaped bonding region R, and the second adhesive 22 is arranged in the outer region (second region) AR2. Has been done.

The first adhesive 21 and the second adhesive 22 are made of different materials. Of these, the first adhesive 21 is a photo-curable adhesive and the second adhesive 22 is a thermosetting adhesive.

The photo-curable adhesive that constitutes the first adhesive 21 reacts in the ultraviolet region of 200 to 400 nm,
Short time (for example, 1-10
Examples include ultraviolet (UV) curable adhesives that cure in seconds. As the ultraviolet curable adhesive, for example, various acrylates such as ester acrylates, urethane acrylates, epoxy acrylates, melamine acrylates, ether acrylates, radical adhesives using radical polymerization of various methacrylates, epoxy compounds,
Examples include cationic adhesives that use cationic polymerization of vinyl ether compounds and octacene compounds, thiol / ene addition type resin adhesives, etc. Among them, there is no inhibition by oxygen and the polymerization reaction proceeds even after light irradiation. Adhesives are preferred. As the cationic adhesive, a cationic polymerization type ultraviolet curable epoxy adhesive is preferable. The cationic polymerization type UV-curable epoxy adhesive includes a Lewis acid salt type curing agent that releases a Lewis acid catalyst by photolysis by irradiation with light such as ultraviolet rays as a main photopolymerization initiator, and is generated by light irradiation. This is a type of adhesive in which an oligomer having an epoxy group, which is a main component, uses Lewis acid as a catalyst to polymerize and cure by a cationic polymerization type reaction mechanism.

Examples of the epoxy compound which is the main component of the adhesive include epoxidized olefin compounds, aromatic epoxy compounds, aliphatic epoxy compounds, alicyclic epoxy compounds and novolac epoxy compounds. Examples of the photopolymerization initiator include Lewis acid salts of aromatic diazonium, Lewis acid salts of diallyl iodonium, Lewis acid salts of triallyl sulfonium, Lewis acid salts of triallyl selenium, and the like. Furthermore, an inorganic filler such as clay minerals or whiskers for the purpose of moisture resistance or viscosity adjustment, synthetic clay, etc. may be introduced, and for the purpose of modifying the inorganic filler or the substrate interface, a surface active agent such as a silane coupling agent is used. Agents may be introduced.

Examples of the thermosetting adhesive that constitutes the second adhesive 22 include a two-component mixed type adhesive that also uses a curing agent, and an adhesive that uses a thermosetting material such as epoxy, amide imide, phenol, and melamine. Well-known ones can be used. A characteristic of these adhesives is that they are polymerized and cured by utilizing dehydration condensation and activation of functional groups by heat, so that a resin having a high crosslink density and excellent moisture resistance is generally easily used. Further, similarly to the above, an inorganic filler or a surfactant may be introduced for the purpose of preventing moisture.

Further, the first adhesive 21 and the second adhesive 22
A spacer is provided on at least one of them in order to hold the sealing substrate 2 at a predetermined height, specifically, a height at which the sealing substrate 2 and the organic EL structure do not come into contact with or are not in pressure contact with each other. It may be mixed. The height of the sealing substrate 2 can be easily adjusted by mixing the spacer in the adhesive. Examples of the spacer include spherical or fibrous glass, quartz, resin, and the like, and fibrous glass is particularly preferable. The spacer may be mixed in the adhesive in advance or may be mixed at the time of bonding.

Next, the process of bonding the substrate 1 and the sealing substrate 2 in the organic EL device A having the above-mentioned structure will be described with reference to FIG. Here, FIG.
(A1)-(d1) is a schematic side view of each process.
2) to (d2) are views showing the surface of the substrate 1 of (a1) to (d1).

Further, FIG. 4A is a schematic perspective view showing a manufacturing apparatus capable of bonding the substrate 1 and the sealing substrate 2 in the manufacturing apparatus for manufacturing the organic EL device A. The apparatus includes a stage ST capable of supporting the substrate 1 and a first adhesive 21 for the substrate 1 supported by the stage ST.
A first coating device 31 capable of disposing
And a second coating device 32 on which the adhesive 22 can be placed.

The laminating process described below is
In order to prevent the deterioration of the optical element 3, it is performed in an atmosphere of an inert gas such as nitrogen gas or argon gas.

First, as shown in FIG. 3A, the substrate 1 provided with the light emitting element 3 including the anode and the cathode is the stage S.
Placed on T. The stage ST is movable in each of the X direction which is one direction in the horizontal plane, the Y direction which is a direction orthogonal to the X direction in the horizontal plane, and the Z direction which is orthogonal to the X direction and the Y direction. The stage ST is, for example, a vacuum chuck or an electrostatic chuck for the substrate 1
Hold. Then, the substrate 1 placed on the stage ST
On the other hand, the first adhesive 21 and the second adhesive 22 are respectively arranged by the first coating device 31 and the second coating device 32.

Each of the first coating device 31 and the second coating device 32 is composed of a dropping device capable of quantitatively dropping the first adhesive 21 and the second adhesive 22 onto the substrate 1. . The dropping device is a device that can quantitatively discharge the fluid and can intermittently and intermittently drip the fluid. Therefore, the first coating device 2 which is a dropping device
The adhesive dropped from each of the first and second coating devices 32 is a fluid.

The fluid is a medium having a viscosity capable of being discharged (dripping) from the nozzle of the dropping device. It is enough that the material has fluidity (viscosity) that can be discharged from a nozzle, etc., and the material (in this case, an adhesive) is dissolved or dispersed in an organic solvent, or the material is heated to a temperature above its melting point to form a fluid Is mentioned. In addition, even if a solid substance such as a spacer is mixed in the fluid as described above, it may be a fluid as a whole. In addition to the solvent, a dye, a pigment or other functional material may be added.

Examples of the dropping device include a dispenser and an ink jet device. For example, by adopting an inkjet method as a method of applying the adhesive, the adhesive can be attached to an arbitrary position on the upper surface of the substrate 1 at an arbitrary coating thickness with inexpensive equipment. The inkjet method may be a piezo jet method in which the fluid is ejected by a change in the volume of the piezoelectric element, or a method in which the fluid is ejected by rapidly generating steam by applying heat. .

Each of the first coating device 31 and the second coating device 32 is provided so as to be independently movable with respect to the substrate 1 placed on the stage ST, and is arranged in the X direction, the Y direction, and the Z direction. It is provided so as to be movable in each of the directions. Further, the ejection operations of the first coating device 31 and the second coating device 32 are also performed independently. Therefore, the first coating device 31 and the second coating device 3
2 is the first by discharging the adhesive while moving independently of the substrate 1 placed on the stage ST.
Each of the adhesive 21 and the second adhesive 22 can be arranged in a predetermined pattern.

Each of the first coating device 31 and the second coating device 32 includes a first detecting device 41 and a second detecting device 42 capable of detecting the distance from the surface of the substrate 1. Each of the first detection device 41 and the second detection device 42 is configured by an optical sensor, irradiates the detection light onto the substrate 1, and receives the light generated from the substrate 1 based on the irradiation detection light. By doing so, the distance to the substrate 1 can be detected, and as shown in FIG. 4B, the distance in the Z direction between each of the first coating device 31 and the second coating device 32 and the substrate 1 can be detected. is there. First coating device 31 and second
Each of the coating devices 32 includes a first detection device 41 and a second detection device 41.
Based on the detection results of the detection device 42, the substrate 1
The position of the adhesive in the height direction (Z direction) is adjusted, and the adhesive is dropped onto the substrate 1 from the optimum height position (position in the Z direction).
By doing so, even if the surface of the substrate 1 has irregularities, interference between the nozzles 31a and 32a of the first and second coating devices 31 and 32 and the substrate 1 is suppressed, and damage to the substrate 1 is prevented. To be done. The first detection device 41 and the second detection device 42 may be fixed to the first coating device 31 and the second coating device 32, respectively.
The configuration may be provided independently for the first and second coating devices 32. In the configuration provided independently of the first coating device 31 and the second coating device 32, the detection device optically detects the distance between the tip of the nozzle of the coating device and the substrate 1.

Each of the first coating device 31 and the second coating device 32 disposes an adhesive on the bonding region R set on the substrate 1 in advance. And the first
The coating device 31 arranges the first adhesive 21 in a predetermined region (first region) AR1 inside the bonding region R, and the second coating device 32 defines a predetermined region outside the bonding region R ( The second adhesive 22 is arranged in the second area AR2.

When arranging the adhesive, the first coating device 31
Each of the second coating device 32 and the second coating device 32 moves independently in the X direction and the Y direction, and transfers the first adhesive 21 and the second adhesive 22 to the first area AR1 and the second area AR2.
To each of the above. At this time, as described above, each of the first coating device 31 and the second coating device 32 adjusts the distance from the substrate 1 based on the detection results of the first detection device 41 and the second detection device 42. A coating operation (ejection operation) is performed. Thus, as shown in FIG. 3A2, each of the first adhesive 21 and the second adhesive 22 is arranged in a predetermined pattern.

Here, as shown in FIG. 3 (a2), the first
The coating device 31 disposes the first adhesive 21 discontinuously at a predetermined interval in the first area AR1. On the other hand, the second coating device 32 disposes the second adhesive 22 discontinuously at the edge portion in the second region AR2 and continuously at the portion other than the edge portion. That is, the second adhesive 22 is applied to the second area A.
It is arranged so as to be discontinuous at the edge portion in R2.

When applying the adhesive onto the substrate 1, the adhesive may be applied while moving the stage ST side. In addition, after the coating operation of the first coating device 31 (or the second coating device 32) is completed without simultaneously performing the coating operation of the first coating device 31 and the second coating device 32, the second coating device 32
(Or, the coating operation of the first coating device 31) may be performed. Furthermore, the first coating device 31 and the second coating device 3
The coating operation with 2 may be performed alternately.

The first coating device 31 and the first area AR
The alignment with 1 can be performed using an alignment mark (alignment mark) (not shown) provided on the substrate 1, for example. For example, the alignment mark position detection sensor (not shown) optically detects the alignment mark position, and based on the detection result, the position is uniquely set with respect to the alignment mark.
The area AR1 and the first coating device 31 are aligned with each other. Similarly, the second coating device 32 and the second area AR2
The alignment with and can also be performed by using the alignment mark provided on the substrate 1.

The first adhesive 21 and the second adhesive 2 are respectively applied to the first area AR1 and the second area AR2 of the substrate 1.
After arranging 2, the sealing substrate 2 is transferred onto the substrate 1 by the transfer device 50, as shown in FIG. The transfer device 50 holds and transfers the sealing substrate 2 by, for example, vacuum suction. Then, the carrier device 50 aligns the lower end surface C of the sealing substrate 2 with the bonding area R of the substrate 1 where the adhesive is disposed, and contacts the lower end surface C with the bonding area R. Then, the substrate 1 and the sealing substrate 2 are pressure-bonded to each other with a predetermined force.

The adhesive placed in the bonding region R is set to a predetermined thickness by pressure bonding between the substrate 1 and the sealing substrate 2, and as shown in FIG. 3 (b2),
The application area can be expanded. That is, before the pressure bonding, the first adhesive 21 arranged in a circular shape in a plan view has an oval shape in a plan view. Here, after pressure bonding, the first adhesive 21
The coating amount and the coating position of the first adhesive 21 before pressure bonding are optimally set in advance so as not to protrude from the bonding region R or the lower end surface C. Similarly, the second adhesive 22 applied so as to discontinue the edge portion of the second region AR2 before the pressure bonding makes the discontinuous portion of the edge portion continuous after the pressure bonding. After the pressure bonding, the second adhesive 22 continues to block the flow of gas between the inside and the outside of the formed sealed space K. here,
The application amount and application position of the second adhesive 22 before pressure bonding so that the second adhesive 22 does not protrude from the bonding region R or the lower end surface C after pressure bonding and the discontinuous portions are connected after pressure bonding. Is preset to be optimal.

By providing the discontinuous portion on the second adhesive 22 before the pressure bonding, the gas in the space formed between the substrate 1 and the sealing substrate 2 during the pressure bonding is discharged to the outside through the discontinuous portion. Therefore, it is possible to suppress the pressure increase inside the space, suppress the occurrence of positional deviation between the substrate 1 and the sealing substrate 2 due to the pressure increase inside the space, and perform the pressure bonding operation stably. After the pressure bonding, the second adhesive 22 continues in the entire second region AR2, so that the flow of gas between the inside and the outside of the sealed space K is regulated.

When the substrate 1 and the sealing substrate 2 are connected via the first adhesive 21 and the second adhesive 22, as shown in FIG. 3 (c1), the first adhesive 21 is connected to the light source 60 by the light source 60. Light irradiation processing for irradiating light having a predetermined wavelength (first processing)
Is done. Ultraviolet light having a wavelength of 360 nm, for example, is emitted from the light source 60. The first adhesive 21 which is an ultraviolet curable adhesive is hardened in a short time by the ultraviolet light from the light source 60. In this way, the substrate 1 and the sealing substrate 2 are temporarily fixed using the first adhesive 21. The amount of the first adhesive 21 applied is set to be sufficiently smaller than the amount of the second adhesive 22 in order to perform the temporary fixing process in a short time. Specifically, the first adhesive 21 is configured such that temporary fixing is performed in the shortest possible time, and the substrate 1 and the sealing substrate 2 are not peeled or misaligned in a transfer process or the like in a subsequent process. It is set to the optimum coating amount.

After the substrate 1 and the sealing substrate 2 are temporarily fixed with the first adhesive 21, the organic EL device A is placed in the heating chamber 70 as shown in FIG. 3 (d1). In the heating chamber 70, heat treatment for heating the second adhesive 22 (second treatment)
Is done. The second adhesive 22 which is a thermosetting adhesive is hardened by the heat treatment. Second adhesive 2
The coating amount of 2 is set to be larger than that of the first adhesive 21,
Since they are arranged so as to be continuous in the second region AR2, the adhesive force between the substrate 1 and the sealing substrate 2 is improved by curing the second adhesive 22, and the sealing space K is also provided.
The sealing property of is also improved.

As described above, the first adhesive 21 which can be cured in a short time by ultraviolet irradiation is arranged in the first area AR1 of the bonding area R, and the first area A
By disposing the second adhesive 22 that is curable by heating in the second area AR2 different from R1, the substrate 1 and the sealing substrate 2 are irradiated with the first adhesive 21 by performing ultraviolet irradiation.
Since it can be temporarily fixed in a short time, the waiting time for curing the adhesive can be shortened, and the positional deviation between the substrate 1 and the sealing substrate 2 can be prevented, and the subsequent steps (transportation processing, etc.) can be performed. Then, by adopting a thermosetting adhesive having high sealing performance as the second adhesive 22, the second adhesive 2
2 can be used to manufacture the organic EL device A having high sealing performance. Therefore, the organic EL device A can exhibit desired performance such as long life and high visibility.

Since the bonding step is performed in a gas atmosphere such as nitrogen gas or argon gas which is inert to the light emitting element 3, deterioration of the light emitting element 3 during the manufacturing process can be prevented.

When the first adhesive 21 or the second adhesive 22 is applied before the pressure-bonding step, the adhesive is provided with a discontinuous portion to apply the adhesive.
When the and the sealing substrate 2 are pressure-bonded to each other, the pressure of the space formed between the substrate 1 and the sealing substrate 2 increases, and the increase in the pressure may cause the substrate 1 and the sealing substrate 2 to be misaligned. However, by disposing these adhesives discontinuously and then performing the pressure bonding step, the gas inside the space can be discharged to the outside from the formed discontinuous portion. Therefore, it is possible to prevent the occurrence of displacement due to the pressure increase inside the space.

Each of the first coating device 31 and the second coating device 32 for coating the first adhesive 21 and the second adhesive 22 is provided so as to be independently movable with respect to the substrate 1, and the adhesives are independent of each other. As a result, the first coating device 31 and the second coating device 32 can respectively coat the first adhesive 21 and the second adhesive 22 with a desired pattern and coating amount in a short time. . Therefore, the adhesiveness and the productivity can be improved.

Detection devices 41 and 42 capable of detecting the distance between the bonding region R of the substrate 1 and each of the first coating device 31 and the second coating device 32 are provided.
Since the positions of the first coating device 31 and the second coating device 32 in the height direction are adjusted based on the detection result of the above, the first coating device 31 and the second coating device 32 are bonded to each other. The adhesive can be dropped from the optimum height position with respect to the region R, and the adhesive can be arranged at the desired position in the bonding region R with the optimum coating amount.

In the above embodiment, the adhesive is applied to the bonding area R of the substrate 1. However, it goes without saying that the adhesive is applied to the lower end surface C of the sealing substrate 2 before the adhesive is applied to the substrate 1. The sealing substrate 2 may be attached.

In the above embodiment, the first adhesive 21 is an ultraviolet curable adhesive and the second adhesive 22 is a thermosetting adhesive. However, the substrate 1 and the sealing substrate 2 are adhered to each other. Any adhesive that can be used may be used, and as the first adhesive 21, it is also possible to use an EB (electron beam) curable material or a two-liquid mixed curable material that can be cured in a short time.

In the above embodiment, the first adhesive 21 is arranged in the inner area AR1 of the bonding area R and the second adhesive 22 is arranged in the outer area AR2. As shown, in the bonding area R, the second adhesive 22 is arranged in the area AR1 on the inner side and the area A on the outer side is arranged.
The first adhesive 21 may be placed on R2.

In the above embodiment, the discontinuous portion of the second adhesive 22 is provided at the edge portion of the second area AR2, but it is not limited to the edge portion and may be provided at the side portion. Good. That is, the arrangement pattern of the first adhesive 21 and the second adhesive 22 can be set arbitrarily.

As shown in FIG. 6, in the bonding region R, the third material 23 is arranged in a region (third region) AR3 between the first adhesive 21 and the second adhesive 22. , Substrate 1
And the sealing substrate 2 may be attached. 6 is a view showing the upper surface of the substrate 1 after the substrate 1 is pressure-bonded with the sealing substrate 2. The third material 23 includes the substrate 1 and the sealing substrate 2.
It may be an adhesive capable of adhering and, or any synthetic resin material such as polyacrylate, polymethacrylate, polyester, polyethylene, polypropylene, or a combination thereof. this house,
As a material for forming the third material 23, for example, a material having a hygroscopic property is preferably adopted. By doing so, it is possible to prevent moisture from entering the light emitting element 3 from the outside, and further prevent element deterioration. Further, the arrangement position of the third material 23 is not limited to the position between the first adhesive 21 and the second adhesive 22, and the inside of the first adhesive 21 or the outside of the second adhesive 22 is not limited. , Can be arranged at any position in the bonding region R.

Next, examples of electronic equipment provided with the organic EL device A of the above-mentioned embodiment will be described. FIG. 7A shows
It is a perspective view showing an example of a mobile phone. In FIG. 7A, reference numeral 1000 indicates a mobile phone body, and reference numeral 100.
Reference numeral 1 denotes a display unit using the above organic EL device A.

FIG. 7B is a perspective view showing an example of a wrist watch type electronic device. In FIG. 7B, reference numeral 110
Reference numeral 0 indicates a watch body, and reference numeral 1101 indicates a display section using the organic EL device A described above.

FIG. 7C is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. Figure 7
In (c), reference numeral 1200 is an information processing device, reference numeral 1
Reference numeral 202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus main body, and reference numeral 1206 denotes a display unit using the above organic EL device A.

Since the electronic equipment shown in FIGS. 7A to 7C includes the organic EL device A of the above-described embodiment, an electronic equipment having a thin and long-life organic EL display portion is realized. be able to.

The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above-mentioned embodiment, the sealing space K has a hollow shape, but a predetermined material such as synthetic resin may be placed in the sealing space K.

Further, in the above embodiment, the light emitting element 3
The light emission of the light emitting element 3 is emitted through the substrate 1 to the outer surface side, but the light emission of the light emitting element 3 is emitted through the sealing substrate 2 from the cathode 10 side opposite to the substrate 1. Even the format is applicable. In this case, as the sealing substrate 2, a transparent or semitransparent material that can extract light is used.

When the sealing substrate 2 is made of a transparent material,
When ultraviolet rays are applied from above to cure the first adhesive 21, the ultraviolet rays may adversely affect the light emitting element 3. Therefore, when irradiating with ultraviolet rays, a light shielding member (mask) is provided at a position corresponding to the light emitting element 3 such as the central portion of the sealing substrate 2, and the ultraviolet rays are irradiated only to the area AR1 where the first adhesive 21 is arranged. It is good to do so.

In the above embodiment, the first and second detection devices 4
Based on the detection results of 1, 42, the first and second coating devices 3
Although the coating operation is performed while adjusting the distance between the substrates 1 and 32 and the substrate 1, the surface shape of the substrate 1 is detected in advance by using the first and second detection devices 41 and 42 (at this time, the coating operation is performed). The detection result is stored in the storage device, and the coating operation is performed while adjusting the height positions of the first and second coating devices 31 and 32 based on the stored result. You may do it.

[0088]

As described above, the first member and the second member
The first area that can be hardened in a short time in the bonding area with the member
And the second material having desired performance such as sealing performance are arranged and cured,
With the above material, the first member and the second member can be temporarily fixed in a short time, and the subsequent manufacturing process can be efficiently performed. Then, the sealing function can be obtained by curing the second material. Therefore, it is possible to manufacture the electro-optical device that suppresses element deterioration and exhibits desired performance with high productivity.

[Brief description of drawings]

FIG. 1 is a main-portion cross-sectional view showing an embodiment of an electro-optical device of the present invention.

FIG. 2 is a sectional view taken along the line BB of FIG.

FIG. 3 is a schematic view showing an embodiment of a method for manufacturing an electro-optical device according to the invention.

FIG. 4 is a schematic view showing an embodiment of an electro-optical device manufacturing apparatus according to the invention.

FIG. 5 is a diagram showing another embodiment of the present invention and is a diagram showing a top surface of a first member.

FIG. 6 is a diagram showing another embodiment of the present invention and is a diagram showing a top surface of a first member.

FIG. 7 is a diagram showing an example of an electronic device including an organic EL display device, in which (a) is a mobile phone, (b) is a wristwatch type electronic device, and (c) is a portable information processing device. Is.

[Explanation of symbols]

1 substrate (first member) 2 Sealing substrate (second member) 3 light emitting element 21 First adhesive (first material) 22 Second adhesive (second material) 23 Third Material 31 First coating device 32 Second coating device 41 First Detection Device (Detection Device) 42 Second Detection Device (Detection Device) A Organic EL device (electro-optical device) AR1 first area AR2 second area AR3 Third area K Sealed space (space) R bonding area

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hidekazu Kobayashi             Seiko, 3-3-3 Yamato, Suwa City, Nagano Prefecture             -In Epson Corporation F term (reference) 3K007 AB08 AB12 AB13 AB18 BB01                       DB03 FA02

Claims (15)

[Claims] 1. A method of manufacturing an electro-optical device including a light emitting element arranged on a first member, comprising a bonding step of bonding a second member to the first member, The bonding step includes a step of arranging a first material in a first region, which is a part of a bonding region where the first member and the second member are bonded, and the bonding process. A step of disposing a second material in a second area other than the first area in the combined area; and a step of bonding the first member and the second member together,
Performing a first treatment on the first material disposed in the first region, and performing a second treatment on the second material disposed in the second region And a method for manufacturing an electro-optical device. 2. The method of manufacturing an electro-optical device according to claim 1, wherein the light emitting element is formed between the first member and the second member. 3. The first material is a photocurable material,
The method of manufacturing an electro-optical device according to claim 1, wherein the second material is a thermosetting material. 4. The first treatment includes a step of irradiating the first material arranged in the first region with light having a predetermined wavelength, and the second treatment comprises The method of manufacturing an electro-optical device according to claim 1, further comprising heating the second material arranged in the second region. 5. The method for manufacturing an electro-optical device according to claim 1, wherein the bonding step is performed in an inert gas atmosphere. 6. The electro-optical device according to claim 1, wherein when the first material or the second material is arranged in the bonding area, they are discontinuously arranged. Device manufacturing method. 7. When applying the first material and the second material to the bonding area, they are applied discontinuously and then the first member and the second member are pressure-bonded. The electro-optical device manufacturing according to claim 1, wherein at least one of the first material and the second material is bonded so as to be arranged continuously by the step. Method. 8. The third material is arranged in a third region other than the first region and the second region in the bonding region, and the third material is arranged in the third region. A method of manufacturing an electro-optical device according to claim 1. 9. An electro-optical device manufacturing apparatus comprising: a light emitting element disposed on a first member; and a second member bonded to the first member, wherein the first member and the A first coating device capable of arranging a first material in a first region, which is a part of a bonding region where the second member is bonded, and the first coating device in the bonding region. An electro-optical device manufacturing apparatus, comprising: a second coating device capable of disposing a second material in a second region other than the region. 10. The first coating device and the second coating device can arrange each of the first material and the second material in a predetermined pattern. Electro-optical device manufacturing equipment. 11. The manufacturing of the electro-optical device according to claim 9, wherein the first coating device and the second coating device are independently movable with respect to the bonding area. apparatus. 12. A detection device capable of detecting a distance between the bonding area and each of the first coating device and the second coating device, wherein the first coating is performed based on a detection result of the detection device. The device for manufacturing an electro-optical device according to claim 9, wherein the positions of the device and the second coating device are adjusted. 13. An electro-optical device including a light emitting element arranged on a first member, a second member bonded to the first member, the first member and the second member. And a first material disposed in a first region that is a part of a bonding region to which the and are bonded, and a second region other than the first region in the bonding region. An electro-optical device comprising a second material. 14. The electro-optical device according to claim 13, wherein the light emitting element is formed between the first member and the second member. 15. An electronic apparatus comprising the electro-optical device according to claim 13 or 14.