JP2009146733A - Organic electroluminescence device manufacturing method, and organic electroluminescence device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device manufacturing method for laminating a first substrate and a second substrate on each other via a first seal material which is applied to a peripheral region in a framed shape and a second seal material which is filled in a region encircled by the first seal material, while surely preventing the second seal material from breaking through the first seal material, and to provide an organic EL device manufactured using the same. <P>SOLUTION: The manufacturing method for the organic EL device 100 where a reinforcing protrusion 95 is formed in a peripheral region 10c of the first substrate 10 comprises a first seal material applying step of applying the ultraviolet-curable first seal material 91a along the peripheral region 10c, a second seal material applying step of applying the heat-curable second seal material 92a in the region encircled by the first seal material 91a, a laying step of laying the first substrate 10 and the second substrate 20 on each other to hold the first seal material 91a and the second seal material 92a therebetween, and a seal material curing step of curing the first seal material 91a and the second seal material 92a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an organic electroluminescence (hereinafter referred to as organic EL) device, and an organic EL device manufactured by the method.

  The organic EL device includes an organic EL element on which a positive electrode, an organic functional layer, and a cathode are stacked on a substrate. For the purpose of enhancing the electron injection effect at a low voltage, between the light emitting functional layer and the cathode, In some cases, an electron injection layer mainly composed of an alkali metal or an alkaline earth metal is disposed. Since the organic functional layer, the cathode, and the electron injection layer used in such an organic EL element are very active, they easily react with moisture present in the atmosphere and are easily altered. When such alteration occurs, the electron injection effect is impaired, and a non-light emitting portion called a dark spot is generated.

  Therefore, conventionally, the side plate part of a lid-like cover made of glass or the like that blocks moisture is attached to the substrate with an adhesive to form a hollow structure, and a desiccant is placed in the hollow part to penetrate moisture from the adhesive cross section. Has been proposed for a structure that does not reach the organic EL element by being trapped with a desiccant (see Patent Document 1).

In addition, after a UV curable resin is applied in a frame shape to the peripheral region of the sealing substrate, silicon oil is filled in a region surrounded by the UV curable resin in a vacuum, and then the organic EL element is vacuumed. There has also been proposed a technique in which a substrate on which the substrate is formed and a sealing substrate are overlapped, and then the substrates are bonded together by curing a UV curable resin (see Patent Document 2).
Japanese Patent Laid-Open No. 2003-2231992 JP 2003-173868 A

  However, as disclosed in Patent Document 1, the structure in which the side plate portion of the lid-like cover is attached to the substrate with an adhesive and the desiccant is disposed in the hollow portion has significant problems in terms of strength and cost. Further, as disclosed in Patent Document 2, in the method of curing the UV curable resin after stacking the substrates in a vacuum, the silicon oil is uncured UV when the vacuum state is changed to the atmospheric pressure state. There is a problem in that the curable resin is pressurized to the outside and the silicone oil breaks through the UV curable resin and leaks to the outside.

  Here, in bonding the two substrates, as shown in FIG. 12A, the inventor of the present application applied the first sealing material 91a in a frame shape to the peripheral region of the substrate, and then the first sealing material 91a. The second sealing material 92a is applied to the region surrounded by the substrate, and then, as shown in FIG. 12 (b), the substrates are overlapped to expand the second sealing material 92a between the substrates. The first sealing material 91a and the second sealing material 92a are cured and the substrates are bonded to each other.

  However, even when such a configuration is adopted, as shown in FIG. 12C, as shown in FIG. 12C, when the second sealing material 92a is deployed between the substrates, as shown in FIG. As described above, the second sealing material 92a presses the uncured first sealing material 91a and faces the problem of breaking through the first sealing material 91a.

  In view of such problems, an object of the present invention is to provide a first substrate by a first sealing material applied in a frame shape to a peripheral region and a second sealing material filled in a region surrounded by the first sealing material. A method for manufacturing an organic EL device capable of reliably preventing the second sealing material from breaking through the first sealing material when bonding the substrate and the second substrate, and an organic EL device manufactured by such a method are provided. It is in.

  In order to solve the above problems, in the present invention, a first substrate in which a plurality of organic EL elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; In the manufacturing method of the organic EL device having the second substrate bonded to the surface side on which the organic EL element is formed, the first substrate or the second substrate is bonded to the first substrate or the second substrate. And / or a reinforcing projection that protrudes from one substrate toward the other substrate along a peripheral region surrounding the pixel region in the second substrate, and the first sealing material is formed along the reinforcing projection. A first sealing material application step, a second sealing material application step in which a second sealing material is applied in a region surrounded by the first sealing material, and the first sealing material and the second sealing material. The first so as to sandwich And overlaying step of overlaying the substrate and the second substrate, and performing a sealing material curing step of curing the first sealing member and said second sealing member.

  In the present invention, in the overlapping step, the substrates are overlapped so as to sandwich the first sealing material and the second sealing material, the second sealing material is developed between the substrates, and the second sealing material is uncured in the second sealing material. 1 Damping with sealing material. At this time, the second sealing material presses the uncured first sealing material toward the outside, but the first sealing material is reinforced by the reinforcing protrusion, so the second sealing material breaks through the first sealing material. There is nothing. Therefore, the second sealing material can be prevented from flowing out. Further, even if the first sealing material is uncured, the first sealing material is not interrupted in the overlapping process, so that the first sealing material and the second sealing material are continuously applied. Since the first sealing material and the second sealing material may be cured later, productivity can be improved.

  An organic EL device manufactured by such a method includes a first substrate in which a plurality of organic EL elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region, and the organic EL device on the first substrate. A frame-shaped first seal formed in a peripheral region surrounding the pixel region. The second substrate is stacked on a surface side on which an element is formed. The first sealing material layer is bonded to the first substrate and / or the second substrate by a material layer and a second sealing material layer formed over the entire region surrounded by the first sealing material layer. In the formation region, a reinforcing protrusion protruding from one substrate toward the other substrate is formed.

  In the present invention, the second substrate and the second sealing material layer are translucent, and a color filter layer of a different color is formed on each region facing the plurality of organic EL elements on the second substrate. It is preferable. If comprised in this way, while being able to radiate | emit white light and the mixed light of each color from each of several organic EL element, such light can be radiate | emitted through a color filter layer, A color image can be displayed. .

  In the present invention, the reinforcing protrusion is formed on both the first substrate and the second substrate, and only one of the first substrate and the second substrate is formed. Can be adopted. In the present invention, from the viewpoint of improving productivity, it is preferable that the reinforcing protrusion is formed on only one of the first substrate and the second substrate.

  In the present invention, the first sealing material preferably has a higher viscosity than the second sealing material. If comprised in this way, when the 1st sealing material is applied, it can prevent that the 1st sealing material flows out outside. Moreover, about the 2nd sealing material, it can be filled over the whole area | region enclosed with the 1st sealing material.

  In the present invention, it is preferable that the first sealing material is photocurable and the second sealing material is thermosetting. If comprised in this way, in a sealing material hardening process, a 1st sealing material and a 2nd sealing material can be selectively hardened in a predetermined order. In the pixel region, various light-shielding films are often formed on the first substrate and the second substrate. In such a case, the second sealing material cannot be irradiated with sufficient light. For this reason, if a photocurable adhesive is used for the second sealing material, it cannot be sufficiently cured, but if the second sealing material is thermosetting, the second sealing material formed in the pixel region. Can be reliably cured.

  In the present invention, in the sealing material curing step, it is preferable that the second sealing material is cured after the first sealing material is cured. If comprised in this way, even if a 2nd sealing material may press a 1st sealing material toward an outer side, when a 2nd sealing material is hardened, a 2nd sealing material uses a 1st sealing material. There is no breakthrough.

  In the present invention, the superposition process is preferably performed in a reduced pressure atmosphere. If comprised in this way, it can prevent that a bubble mixes between a 1st board | substrate and a 2nd board | substrate. Further, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure, so that the second sealing material reaches every corner between the first substrate and the second substrate, and the second sealing material. The filling property of the is improved.

  In the present invention, when forming a plurality of films in the pixel region of the first substrate and / or the second substrate, the plurality of films are stacked in the peripheral region to form the reinforcing protrusion. preferable. If comprised in this way, since it is not necessary to form the protrusion for a reinforcement by another process, productivity can be improved.

  In the present invention, the reinforcing protrusions include a first reinforcing protrusion formed on the first substrate, and a second reinforcing protrusion formed at a position shifted from the first reinforcing protrusion on the second substrate. You may employ | adopt the structure containing these.

  In the present invention, it is preferable that the reinforcing protrusions are formed so as to surround the pixel region in multiple layers. If comprised in this way, a 1st sealing material can be strengthened firmly. Further, since the first sealing material is also present in the region sandwiched between the reinforcing protrusions, the first substrate and the second substrate can be firmly bonded together by the first sealing material.

  In the present invention, it is preferable that the reinforcing protrusion is divided into a plurality of portions in the circumferential direction by a discontinuous portion. With this configuration, when the first sealing material is applied, the first sealing material applied to the region sandwiching the reinforcing projection can flow through the discontinuous portion, and thus the first seal is formed in the region sandwiching the reinforcing projection. The application state of the material can be made equivalent. Therefore, the first substrate and the second substrate can be firmly bonded by the first sealing material.

  An organic EL device to which the present invention is applied is used as a direct-view display unit or the like in an electronic device such as a mobile phone or a mobile computer.

  Embodiments of the present invention will be described below. In the drawings to be referred to in the following description, the scales of the layers and the members are different from each other in order to make the layers and the members large enough to be recognized on the drawings. Further, in the following description, as much as possible, the same reference numerals are given to the corresponding portions so that the correspondence with the configuration described with reference to FIG. 12 can be easily understood.

[Embodiment 1]
(overall structure)
FIG. 1 is an equivalent circuit diagram showing an electrical configuration of the organic EL device according to Embodiment 1 of the present invention. In the organic EL device 100 shown in FIG. 1, on the first substrate 10, a plurality of scanning lines 3a, a plurality of data lines 6a extending in a direction intersecting the scanning lines 3a, and a scanning line 3a are arranged in parallel. And a plurality of power supply lines 3e extending. In the first substrate 10, a plurality of pixels 100a are arranged in a matrix in a rectangular pixel region 10a. A data line driving circuit 101 is connected to the data line 6a, and a scanning line driving circuit 104 is connected to the scanning line 3a. Each pixel region 10a holds a switching thin film transistor 30b to which a scanning signal is supplied to the gate electrode via the scanning line 3a, and a pixel signal supplied from the data line 6a via the switching thin film transistor 30b. The storage capacitor 70 to be driven, the driving thin film transistor 30c to which the pixel signal held by the storage capacitor 70 is supplied to the gate electrode, and the power supply line 3e when electrically connected to the power supply line 3e through the thin film transistor 30c. A first electrode 81 (anode layer) into which a drive current flows and an organic EL element 80 in which an organic functional layer is sandwiched between the first electrode 81 and the cathode layer are formed.

  According to this configuration, when the scanning line 3a is driven and the switching thin film transistor 30b is turned on, the potential of the data line 6a at that time is held in the holding capacitor 70, and according to the charge held in the holding capacitor 70, The on / off state of the driving thin film transistor 30c is determined. Then, a current flows from the power supply line 3e to the first electrode 81 through the channel of the driving thin film transistor 30c, and further a current flows to the counter electrode layer through the organic functional layer. As a result, the organic EL element 80 emits light according to the amount of current flowing therethrough.

  In the organic EL device 100 configured as described above, each of the plurality of pixels 100a corresponds to red (R), green (G), and blue (B), and red (R), green (G), and blue (B). The three pixels 100a constitute one pixel. In this embodiment, the organic EL element 80 emits white light or mixed color light of red (R), green (G), and blue (B), and the pixel 100a is red (R), green (G), blue ( Which of B) corresponds is defined by a color filter layer described later.

  In the configuration shown in FIG. 1, the power supply line 3e is parallel to the scanning line 3a. However, a configuration in which the power supply line 3e is parallel to the data line 6a may be adopted. In the configuration shown in FIG. 1, the storage capacitor 70 is configured using the power supply line 3e. However, the storage capacitor 70 may be configured by forming a capacitance line separately from the power supply line 3e. Good.

(Specific configuration of organic EL device)
FIGS. 2A and 2B are plan views of the planar configuration of the organic EL device according to Embodiment 1 of the present invention as viewed from the second substrate side together with the respective components, and JJ ′ thereof. It is sectional drawing. In addition, illustration of a color filter layer etc. is abbreviate | omitted in FIG.2 (b). 2A and 2B, in the organic EL device 100 of the present embodiment, a first substrate 10 as an element substrate and a second substrate 20 that functions as both a sealing substrate and a color filter layer substrate are provided. In the first substrate 10, the second substrate 20 is disposed so as to overlap the surface side on which the plurality of organic EL elements 80 are formed.

  Here, the first substrate 10 and the second substrate 20 are bonded together by the first sealing material layer 91 and the second sealing material layer 92. Although the detailed configuration of the first sealing material layer 91 and the second sealing material layer 92 will be described later, the first sealing material layer 91 is shown by a region where dots are densely attached in FIG. A frame is formed along a peripheral region 10c surrounding the pixel region 10a. On the other hand, the second sealing material layer 92 is formed over the entire area surrounded by the first sealing material layer 91, as shown by the area where dots are sparsely attached in FIG. Yes.

  In the first substrate 10, a terminal 102 is formed in an overhanging region from the second substrate 20. In the first substrate 10, the data line driving circuit 101 and the scanning line driving circuit 104 described with reference to FIG. 1 are used by using the peripheral region 10 c or a region sandwiched between the pixel region 10 a and the peripheral region 10 c. (Not shown) is formed.

(Configuration of organic EL element)
FIGS. 3A and 3B are a cross-sectional view schematically showing a cross-sectional configuration of the organic EL device according to Embodiment 1 of the present invention, and a plan view schematically showing a plane configuration of the peripheral region 10c, respectively. It is. FIG. 3 shows only three organic EL elements corresponding to red (R), green (G), and blue (B) as organic EL elements.

  As shown in FIG. 3A, the first substrate 10 includes a support substrate 10d made of a quartz substrate, a glass substrate, a ceramic substrate, a metal substrate, or the like. Insulating films 11, 12, 13, 14, and 15 are formed on the surface of the support substrate 10 d, and an organic EL element 80 is formed on the insulating film 15. In this embodiment, the insulating films 11, 12, 13, and 15 are formed of a silicon oxide film, a silicon nitride film, or the like, and the insulating film 14 is a flat film made of a thick photosensitive resin having a thickness of 1.5 to 2.0 μm. It is formed as a chemical film. The insulating film 11 is a base insulating layer, and although not shown, the thin film transistors 30b and 30c, the storage capacitor 70, and the like described with reference to FIG. 1 using the layers of the insulating films 11, 12, 13, and 14 are used. Various wirings and driving circuits are formed. In addition, the conductive films formed between different layers are electrically connected to each other by using the contact holes formed in the insulating films 12, 13, 14, and 15.

  The organic EL device 100 of the present embodiment is a top emission type, and, as indicated by an arrow L1, light is extracted from the side where the organic EL element 80 is formed as viewed from the support substrate 10d. Opaque substrates such as ceramics, stainless steel, etc. can be used. In addition, a light reflection layer 41 made of aluminum, silver, or an alloy thereof is formed between the insulating films 14 and 15, and light emitted from the organic EL element 80 toward the support substrate 10d is reflected on the light reflection layer. By reflecting at 41, light can be emitted. When the organic EL device 100 is configured as a bottom emission type, light is extracted from the support substrate 10d side, and therefore a transparent substrate such as glass is used as the support substrate 10d.

  In the first substrate 10, a first electrode layer 81 (anode / pixel electrode) made of an ITO film or the like is formed in an island shape on the insulating film 15, and a light emitting region is formed on the upper layer of the first electrode layer 81. A thick partition wall 51 made of a photosensitive resin or the like having an opening for defining is formed.

  An organic functional layer 82 and a second electrode layer 83 (cathode) are laminated on the upper layer of the first electrode layer 81, and the organic EL element is formed by the first electrode layer 81, the organic functional layer 82, and the second electrode layer 83. 80 is formed. In this embodiment, the organic functional layer 82 and the second electrode layer 83 are formed over the entire surface of the pixel region 10a including the region where the partition walls 51 are formed.

In this embodiment, the organic functional layer 82 includes a hole injection layer made of a triarylamine (ATP) multimer, a TPD (triphenyldiamine) -based hole transport layer, an styrylamine-based material containing an anthracene-based dopant or a rubrene-based dopant. A light emitting layer made of (host) and an electron injection layer made of aluminum quinolinol (Alq ₃ ) are laminated in this order, and a second electrode layer 83 made of a thin film metal such as MgAg is formed thereon. Yes. In addition, an electron injection buffer layer made of LiF may be formed between the organic functional layer 82 and the second electrode layer 83. Among these materials, each layer constituting the organic functional layer 82 and the electron injection buffer layer can be sequentially formed by a vacuum evaporation method using a heating boat (crucible). Further, the metal material constituting the second electrode layer 83 and the like can be formed by a vacuum deposition method, and the oxide material such as ITO constituting the first electrode layer 81 can be formed by an ECR plasma sputtering method or a plasma gun type ion plating. It can be formed by a high-density plasma film forming method such as a method or a magnetron sputtering method.

  In this embodiment, the organic EL element 80 emits white light or mixed color light of red (R), green (G), and blue (B). For this reason, in the organic EL device 100, the red (R), green (G), and blue (B) color filter layers 22 (R) formed on the second substrate 20 at positions facing the organic EL element 80 ( Full color display is performed by performing color conversion according to G) and (B). That is, the second substrate 20 has a transparent support substrate 20d made of a plastic substrate such as polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, or a glass substrate, and red (R), green (G), blue (B ) Color filter layer 22 (R), (G), (B), color filter layer 22 (R), (G), light shielding layer 23 (black matrix for preventing leakage of light) between (B) Layer), a light-transmitting planarizing film 24, a light-transmitting gas barrier layer 25 made of a silicon oxynitride layer, and the like are formed in this order. In this embodiment, the color filter layers 22 (R), (G), and (B), the light shielding layer 23, the planarizing film 24, and the gas barrier layer 25 are formed only in the pixel region 10 a of the second substrate 20, and the peripheral region It is not formed in 10c. For this reason, the support substrate 20d is exposed in the peripheral region 10c of the second substrate 20.

  The color filter layers 22 (R), (G), and (B) are layers in which pigments or dyes are mixed in the transparent binder layer, and red (R), green (G), and blue (B) are used. However, light blue, light cyan, white, etc. may be added depending on the purpose. The thickness of the color filter layers 22 (R), (G), and (B) is preferably as thin as possible in consideration of the light transmittance, and is formed in a range of 0.1 to 1.5 μm. It may be different depending on the corresponding color. The light shielding layer 23 is made of a resin containing a black pigment, and the thickness thereof is thicker than the color filter layers 22 (R), (G), and (B), and a film thickness of about 1 to 2 μm is preferable. The above film thickness may be sufficient. The second substrate 20 may be provided with a functional layer such as an ultraviolet blocking / absorbing layer that prevents the incidence of ultraviolet rays, a light reflection preventing layer, or a heat dissipation layer.

(Sealing structure)
In the organic EL device 100 configured as described above, the organic functional layer 82, the second electrode layer 83 used as the cathode, the electron injection layer, and the like are easily deteriorated by moisture, and such deterioration causes deterioration of the electron injection effect. , A non-light-emitting portion called a dark spot is generated. Therefore, in this embodiment, the configuration in which the second substrate 20 is used as a sealing substrate and the first substrate 10 are bonded together and the configuration in which the sealing film 60 described below is formed on the first substrate 10 are used in combination.

First, the sealing film 60 is formed on the first substrate 10 over the second electrode layer 83 over a region wider than the pixel region 10a. As the sealing film 60, in this embodiment, a first film 61 made of a silicon compound layer laminated on the second electrode layer 83, a second film 62 made of a resin layer laminated on the first film 61, In addition, a laminated film including a third film 63 made of a silicon compound laminated on the second film 62 is used. The first film 61 and the third film 63 are formed by a high-density plasma vapor deposition method using a high-density plasma source, for example, plasma gun type ion plating, ECR plasma sputtering, ECR plasma CVD, surface wave plasma CVD, ICP-CVD. It is composed of silicon nitride (SiN _x ), silicon oxynitride (SiO _x N _y ), etc. that are deposited using such a method, and such a thin film has a high density that reliably blocks moisture even when deposited at low temperatures. Functions as a gas barrier layer. The second layer 62 is composed of a resin layer, and serves as an organic buffer layer that flattens surface irregularities caused by the partition walls 51 and wirings and prevents cracks in the first film 61 and the second film 62. It is functioning.

  In this embodiment, the first film 61 and the third film 63 (high-density gas barrier layer) constituting the sealing film 60 are formed in the pixel region 10a, the vicinity region of the pixel region 10a, and the peripheral region 10c far from the pixel region 10a. It is formed on the entire surface of the first substrate 10 including all. On the other hand, the second layer 62 (organic buffer layer) is formed thick only in the pixel region 10a and a region near the pixel region 10a, and is not formed in the peripheral region 10c far from the pixel region 10a. The insulating films 14 and 15 are generally formed only in the pixel region 10a.

  Next, in this embodiment, as shown in FIGS. 2A and 2B and FIGS. 3A and 3B, the peripheral region 10c is formed between the first substrate 10 and the second substrate 20. A first sealing material layer 91 is formed in a rectangular frame shape, and a translucent second sealing material layer 92 is formed over the entire region surrounded by the peripheral region 10c. The substrate 20 is bonded to the first sealing material layer 91 and the second sealing material layer 92. Further, the first substrate 10 is formed with a reinforcing projection 95 that protrudes toward the second substrate 20 along the first sealing material layer 91 and the peripheral region 10c in a single rectangular frame shape. The reinforcing protrusions 95 are formed in a single line along the substantially central position in the width direction of the first sealing material layer 91 and the peripheral region 10 c, and the first sealing material layer 91 is formed on both sides of the reinforcing protrusions 95. Exists. Further, the reinforcing protrusion 95 is formed to have a height that does not reach the second substrate 20, and the first sealing material layer 91 is also present on the upper surface of the reinforcing protrusion 95.

  In this embodiment, an epoxy adhesive that is cured by ultraviolet rays is used for the first sealing material layer 91 (first sealing material 91a), and the epoxy adhesive preferably has an epoxy group and a molecular weight of 3000 or less. Epoxy monomer / oligomer (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000) is used. More specifically, the first sealing material layer 91 includes, for example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, 3,4-epoxycyclohexenylmethyl-3 ′, 4′- Epoxycyclohexenecarboxylate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarboxylate, etc. are used alone or in combination. In addition, as a curing agent that reacts with epoxy monomer / oligomer, photoreactive type that causes cationic polymerization reaction such as diazonium salt, diphenyliodonium salt, triphenylsulfonium salt, sulfonate ester, iron arene complex, silanol / aluminum complex, etc. An initiator is added, and a cationic polymerization reaction is caused mainly by ultraviolet irradiation.

  For the second sealing material layer 92 (second sealing material 92a), an epoxy adhesive that is cured by heat is used. As a raw material main component of such an epoxy-based adhesive, it is necessary to be an organic compound material that is excellent in fluidity and does not have a volatile component such as a solvent, and preferably an epoxy monooligomer having an epoxy group and a molecular weight of 3000 or less. Preferred are epoxy monomers having a molecular weight of 1000 or less. For example, the second sealing material layer 92 may be formed by using a hard bisphenol A type epoxy monomer, a bisphenol F type epoxy monomer, a novolac type phenol epoxy monomer, 3,4-epoxycyclohexenylmethyl-3 ', 4'-epoxycyclohexene carboxy. Rate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, etc. may be used alone or in combination. Further, as the curing agent that reacts with the epoxy monomer, an addition polymerization type that forms a tough and excellent heat-resistant cured film is good, and amines such as aromatic amine, diethylenetriamine, triethylenetetramine, and polyetherdiamine, Methyl-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-undomethylene-1,2,3,6-tetrahydrophthalic anhydride, 1,2,4,5-benzenetetracarboxylic dianhydride Products, acid anhydride curing agents such as 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, dicyandiamide and the like. These are mixed with a reaction initiator such as aromatic amino alcohol, alcohol, mercaptan, tertiary amine catalyst or silane coupling agent.

  As will be described later, the reinforcing protrusion 95 can be formed by laminating each film formed on the pixel region 10a of the first substrate 10, and as in the present embodiment, the first sealing material layer 91 (first sealing material 91a). Or a resin material similar to that of the second sealing material layer 92 (second sealing material 92a).

(Production method)
With reference to FIG. 4 and FIG. 5, the manufacturing method of the organic electroluminescent apparatus 100 of this form is demonstrated. FIGS. 4 and 5 illustrate the manufacturing process of the organic EL device 100 according to the present embodiment, from the formation of the reinforcing protrusion 95 on the first substrate 10 to the time immediately before the first substrate 10 and the second substrate 20 are bonded together. It is process sectional drawing which shows a mode, and explanatory drawing which shows typically a mode that this process is performed in the state of a large sized substrate.

  In manufacturing the organic EL device 100 of the present embodiment, in addition to a method of bonding the first substrate 10 and the second substrate 20 in a single product size, a large size capable of taking a large number of the first substrate 10 and the second substrate 20. In some cases, the substrates are bonded together and then a large substrate is cut into a single size. Since any one of these methods is adopted, the basic configuration is the same, and therefore, with reference to FIG. 4, the manner in which the first substrate 10 and the second substrate 20 having a single product size are bonded together is mainly described. A method for bonding substrates together with a large substrate will also be described with reference to FIG.

  First, as shown in FIG. 4A, after the organic electroluminescence element 80 and the sealing layer 60 are formed on the first substrate 10, the peripheral region 10c of the first substrate 10 is formed as shown in FIG. 4B. A reinforcing projection 95 is formed on the substrate. In order to form the reinforcing protrusion 95, an ultraviolet curable epoxy resin material similar to that of the first sealing material layer 91 is applied by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, and the like. Curing is performed by heating. In order to form the reinforcing protrusions 95, a thermosetting epoxy resin material similar to that of the second sealing material layer 92 may be used, and after printing or dispenser drawing, heat treatment may be performed and cured. In any case, since the reinforcing protrusion 95 is formed in a linear shape, the resin material preferably has a higher viscosity when applied.

  When this process is performed in the state of a large substrate, as shown in FIG. 5A, along a scribe line (not shown) when cutting out the single substrate 1 of the large substrate 10x. A reinforcing projection 95 is formed.

  Next, in the first seal coating step shown in FIG. 4C, a reinforcing projection is formed on the peripheral region 10c of the first substrate 10 by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, or the like. 95, the first sealing material 91a made of the above-described photo-curable epoxy resin material is applied to a narrow width dimension of 1 mm or less. As a result, the first sealing material 91 a is applied so as to cover the reinforcing protrusion 95. Here, from the viewpoint of applying the first sealing material 91a to a narrow width dimension of 1 mm or less, the viscosity at the time of application of the first sealing material 91a is preferably about 20,000 to 200,000 mPa · s at room temperature. More preferred is about 100,000 mPa · s. In addition, when the first sealing material 91a contains moisture, bubbles are generated and the strength is reduced. Therefore, the moisture content is preferably dehydrated to 0.1 wt% (1000 ppm) or less.

  When this process is performed in the state of a large substrate, as shown in FIG. 5B, the first sealing material 91a is applied along the reinforcing protrusions 95 formed on the large substrate 10x.

  Next, in the second sealing material application step shown in FIG. 4 (d), the first sealing material 91a is surrounded on the first substrate 10 by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, or the like. The second sealing material 92a made of the above-described thermosetting epoxy resin material is applied in the region. The second sealing material 92a is applied in a pattern such as a solid shape, a dot shape, or a stripe shape. The viscosity at the time of application of the second sealing material 92a is preferably 500 mPa · s or less, more preferably 300 mPa · s or less, from the viewpoint of increasing the filling property with a thin film. Since the second sealing material 92a is also susceptible to curing inhibition if it contains a large amount of water, bubbles are generated when the second sealing material 92a contains water as well as the first sealing material 91a. In order to reduce the strength, the water content is preferably dehydrated to 0.1 wt% (1000 ppm) or less. In addition, if a curing accelerator that promotes ring opening of acid anhydride or a photoreactive initiator that causes a cationic polymerization reaction is added to the second sealing material 92a, curing can be performed at a low temperature in a short time. It becomes.

  When this process is performed in the state of a large substrate, as shown in FIG. 5C, the second sealing material is located in a region surrounded by the reinforcing projection 95 and the first sealing material 91a formed on the large substrate 10x. 92a is applied.

  Next, in the overlapping process, as shown in FIGS. 2B and 3A, the first substrate 10 and the second substrate 20 are sandwiched between the first seal material 91a and the second seal material 92a. And overlay. At that time, the second substrate 20 is pressed toward the first substrate 10 with a force of about 600 N, and this state is maintained for about 200 seconds. In the superposition process, first, the first sealing material 91 a contacts the second substrate 20 to seal the inside, and then the second sealing material 92 a is developed between the first substrate 10 and the second substrate 20. Such a superposition process is performed in a reduced pressure atmosphere with a degree of vacuum of about 1 Pa.

  Next, when the pressure is returned to normal pressure, it becomes the same state as when pressurized by atmospheric pressure, so the second sealing material 92a expands to every corner between the first substrate 10 and the second substrate 20, The filling property of the second sealing material 92a is improved. At that time, the first sealing material 91a and the reinforcing protrusion 95 function as a bank for the second sealing material 92a. For this reason, the second sealing material 92a is blocked by the first sealing material 91a and the reinforcing protrusion 95 even when the pressure is reduced to the normal pressure from the reduced pressure state and the pressure is increased by the atmospheric pressure. Will not flow out. In addition, it is ensured between the 1st board | substrate 10 and the 2nd board | substrate 20 with the 1st sealing material 91a and the 2nd sealing material 92a which intervene between them. Further, a gap material may be added to the first seal material 91a.

Next, in the curing step, ultraviolet light having a light amount of about 2000 mJ / cm ² is applied to the first sealing material 91a from the first substrate 10 and / or the second substrate 20 side with a power of about 30 mW / cm ^2. Only the first sealing material 91 a is selectively cured to form the first sealing material layer 91. Next, the first substrate 10 and the second substrate 20 bonded to each other by the first sealing material layer 91 are heated at 60 to 100 ° C. with the first substrate 10 and the second substrate 20 placed on a hot plate. The second sealing material 92a is hardened while spreading the second sealing material 92a to every corner between the two and the second sealing material layer 92 is formed. In this way, the first substrate 10 and the second substrate 20 are bonded to each other by the first sealing material layer 91 and the second sealing material layer 92 (bonding step).

  By performing such steps, the organic EL device 100 is obtained. When the above process is performed on a large substrate, the large substrate is cut to obtain a single-size organic EL device 100. In the organic EL device 100 configured as described above, since the second sealing material layer 92 is cured, convection does not occur when left at a high temperature, so that the third layer 63 of the sealing film 60 is not damaged, and the second sealing material layer 92 is not damaged. The two sealing material layers 92 function as a protective film for the third layer 63 of the sealing film 60. Here, the thickness of the second sealing material layer 92 is 1 to 5 μm, and it is preferable that the second sealing material layer 92 is thinner as the pixel becomes higher in definition. In addition, fillers such as clay minerals, silica balls, and resin balls that are contained in a large amount in general adhesives cause damage to the third layer 63 of the sealing film 60, and thus the first sealing material 91 a. It is preferable that such a filler is not blended in the second sealing material 92a. In particular, the second sealing material 92a is in contact with the sealing film 60, and considering the light transmittance, the filler is blended. Preferably not.

(Main effects of this form)
As described above, in the organic EL device 100 and the manufacturing method thereof according to the present embodiment, the organic EL device 80 is formed over a region wider than the pixel region 10a on the second electrode layer 83 for the purpose of protecting the organic EL element 80 from moisture and the like. The sealing film 60 is formed, and the first substrate 10 and the second substrate 20 are bonded together in this state.

  In adopting such a bonding structure, in the overlapping step, the second sealing material 92a is developed between the substrates while the uncured second sealing material 92a is dammed by the uncured first sealing material 91a. At this time, even if the second sealing material 92a presses the uncured first sealing material 91a outward, in the present embodiment, the first sealing material 91a is reinforced by the reinforcing protrusion 95. Therefore, the second sealing material 92a does not break through the first sealing material 91a. Accordingly, the second seal material 92a can be prevented from flowing out. Further, even if the first sealing material 91a is uncured, the first sealing material 91a is not interrupted in the overlapping process, so that the application of the first sealing material 91a and the application of the second sealing material 92a are continued. After that, the first sealing material 91a and the second sealing material 92a may be cured, so that productivity can be improved.

  Moreover, since the 1st sealing material 91a has a viscosity higher than the 2nd sealing material 92a, when the 1st sealing material 91a is apply | coated, it can also prevent that the 1st sealing material 91a flows out outside. Further, the second sealing material 92a can be filled over the entire region surrounded by the first sealing material 91a.

  Furthermore, since the first sealing material 91a is photocurable and the second sealing material 92a is thermosetting, the first sealing material 91a and the second sealing material 92a can be cured in a predetermined order, After only the first sealing material 91a is cured, the second sealing material 92a can be cured. Therefore, even if the second sealing material 92a presses the first sealing material layer 91 outward when the second sealing material 92a is cured, the first sealing material layer 91 is already cured. Therefore, the second sealing material 92a does not break through the first sealing material layer 91. In the pixel region 10a, various light-shielding films are formed on the first substrate 10 and the second substrate 20. Even in such a case, since the second sealant 92a is thermosetting, the pixel region The second sealing material 92a formed in 10a can be reliably cured.

  Furthermore, since the overlapping process is performed in a reduced-pressure atmosphere, it is possible to prevent bubbles from being mixed between the first substrate 10 and the second substrate 20. Further, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure. Therefore, the second sealing material 92a reaches every corner between the first substrate 10 and the second substrate 20, and the second The filling property of the two sealing materials 92a is improved.

[Improvement of Embodiment 1]
6A and 6B are a cross-sectional view schematically showing a cross-sectional configuration of an organic EL device according to an improved example of the first embodiment of the present invention, and a plan configuration of the peripheral region 10c, respectively. FIG. FIGS. 7A and 7B are a cross-sectional view schematically showing a cross-sectional configuration of an organic EL device according to another modified example of the first embodiment of the present invention, and a plan configuration of the peripheral region 10c. FIG. Since the basic configuration of this embodiment is the same as that of Embodiment 1, portions having common functions are denoted by the same reference numerals and description thereof is omitted.

  In the first embodiment, when the reinforcing protrusion 95 is formed in a frame shape in the peripheral region 10c, the single reinforcing protrusion 95 is formed in a continuous linear shape, as shown in FIGS. 6 (a) and 6 (b). As described above, the reinforcing protrusions 95 may be formed in the peripheral region 10c in a double manner. Here, the reinforcing protrusion 95 is divided by a discontinuous portion 95y in a direction surrounding the pixel region 10a. However, the discontinuous portion 95y is positioned at the pixel region in the inner reinforcing protrusion 95 and the outer reinforcing protrusion 95. It has shifted | deviated in the direction surrounding 10a. For this reason, the first sealing material 91a is reinforced by the reinforcing protrusions 95 over the entire area surrounding the pixel region 10a. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  Even in this configuration, since the first sealing material 91a is reinforced by the reinforcing protrusions 95 as in the first embodiment, the first sealing material 91a and the second sealing material 92a are applied and then the first sealing material 91a is applied. Even if the first substrate 10 and the second substrate 20 are overlapped in the overlapping step while the sealant 91a is not cured, the second sealant 92a does not break through the first sealant 91a.

  Further, since the reinforcing protrusion 95 is formed so as to double surround the pixel region 10a, the first sealing material 91a can be strongly reinforced. Further, when the first sealing material 91a is applied along the reinforcing protrusions 95, the flow of the first sealing material 91a can be prevented. Further, since the first sealing material 91a exists also in the region sandwiched between the reinforcing protrusions 95, the first substrate 10 and the second substrate 20 can be firmly bonded together by the first sealing material 91a.

  Furthermore, since the reinforcing protrusion 95 is divided into a plurality of portions in the circumferential direction by the interrupted portion 95y, the first seal material 91a can flow through the interrupted portion 95y. Therefore, the first sealing material 91a can be equally applied between the inside and the outside of the reinforcing protrusion 95, and the first substrate 10 and the second substrate 20 can be firmly bonded.

  In the example shown in FIGS. 6A and 6B, the reinforcing protrusion 95 is formed so as to surround the peripheral region 10c twice. However, as shown in FIGS. The reinforcing protrusions 95 may be formed so as to surround the region 10c in triplicate. Here, each of the reinforcing protrusions 95 is divided by a discontinuous portion 95y in a direction surrounding the pixel region 10a. However, the inner and outer reinforcing protrusions 95 and the central reinforcing protrusion 95 have a discontinuous portion 95y. Is shifted in the direction surrounding the pixel region 10a. For this reason, the first sealing material 91a is reinforced by the reinforcing protrusions 95 over the entire area surrounding the pixel region 10a. The other configuration is the same as the configuration described with reference to FIG.

[Embodiment 2]
8A and 8B are a cross-sectional view schematically showing a cross-sectional configuration of an organic EL device according to Embodiment 2 of the present invention, and a plan view schematically showing a plan configuration of a peripheral region 10c thereof. It is. FIG. 9 shows a state of the manufacturing process of the organic EL device 100 according to the present embodiment, after the reinforcing protrusion 95 is formed on the second substrate 20 and immediately before the first substrate 10 and the second substrate 20 are bonded together. It is process sectional drawing. Since the basic configuration of this embodiment is the same as that of Embodiment 1, portions having common functions are denoted by the same reference numerals and description thereof is omitted. Further, in manufacturing the organic EL device 100 of the present embodiment, a bonding process or the like is performed in a state of a large substrate that can take a large number of the first substrate 10 and the second substrate 20, and then the large substrate is reduced to a single product size. As for the explanation when the cutting method is adopted, FIG. 5 is referred to as in the first embodiment. In FIG. 9, the second substrate 20 is shown upside down with respect to the state shown in FIG.

  In the first embodiment, the reinforcing protrusion 95 that protrudes toward the second substrate 20 is formed on the first substrate 10, but in this embodiment, as shown in FIGS. Reinforcing protrusions 95 that protrude toward the first substrate 10 are formed on the two substrates 20 side. In order to manufacture the organic EL device 100 having such a configuration, the color filter layers 22 (R), (G), and (B) are formed on the support substrate 20 d of the second substrate 20 as shown in FIG. 9A. After that, as shown in FIG. 9B, reinforcing protrusions 95 are formed in the peripheral region 10c of the second substrate 20. In order to form the reinforcing protrusion 95, the color filter layers 22 (R), (G), and (B), the light shielding layer 23, the planarizing film 24, and the gas barrier layer 25 are formed on the second substrate 20 as described later. However, in the present embodiment, as in the first embodiment, an ultraviolet curable epoxy resin material or a thermosetting epoxy resin material is dispensed by drawing, a screen printing method, and a micro piezo head. After applying by an ink jet method using, etc., it is cured. Since the reinforcing protrusions 95 are formed in a linear shape, the resin material preferably has a higher viscosity when applied. When this process is performed in the state of a large substrate, as shown in FIG. 5A, when the second substrate 20 having a single size is cut out from the large substrate 20x for taking a large number of second substrates 20. A reinforcing projection 95 is formed along the scribe line (not shown).

  Next, in the first sealing material application step shown in FIG. 9C, a reinforcing projection for the peripheral region 10c of the second substrate 20 by dispenser drawing, screen printing method, ink jet method using a micro piezo head, or the like. 95, the first sealing material 91a made of the photocurable epoxy resin material described in the first embodiment is applied to a narrow width dimension of 1 mm or less. As a result, the first sealing material 91 a is applied so as to cover the reinforcing protrusion 95. When this process is performed in the state of a large substrate, as shown in FIG. 5B, the first sealing material 91a is applied along the reinforcing protrusions 95 formed on the large substrate 20x.

  Next, in the second sealing material application step shown in FIG. 9D, the first substrate 10 is surrounded by the first sealing material 91a by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, or the like. The second sealing material 92a made of the thermosetting epoxy resin material described in Embodiment 1 is applied in a predetermined pattern such as a solid shape, a dot shape, or a stripe shape in the region. When this step is performed in the state of a large substrate, as shown in FIG. 5C, the second sealing material is located in a region surrounded by the reinforcing protrusion 95 and the first sealing material 91a formed on the large substrate 20x. 92a is applied.

  Next, in the overlapping process, as shown in FIGS. 2B and 8A, the first substrate 10 and the second substrate 20 are sandwiched between the first seal material 91a and the second seal material 92a. And overlay. At that time, as in the first embodiment, the first substrate 10 is pressurized toward the second substrate 20, and this state is maintained for about 200 seconds. In this superposition process, first, the first sealing material 91 a contacts the first substrate 10 to seal the inside, and then the second sealing material 92 a is developed between the first substrate 10 and the second substrate 20. Such a superposition process is performed in a reduced pressure atmosphere with a degree of vacuum of about 1 Pa.

  Next, when the pressure is returned to normal pressure, it becomes the same state as when pressurized by atmospheric pressure, so the second sealing material 92a expands to every corner between the first substrate 10 and the second substrate 20, The filling property of the second sealing material 92a is improved. At that time, the first sealing material 91a and the reinforcing protrusion 95 function as a bank for the second sealing material 92a. For this reason, the second sealing material 92a is blocked by the first sealing material 91a and the reinforcing protrusion 95 even when the pressure is reduced to the normal pressure from the reduced pressure state and the pressure is increased by the atmospheric pressure. Will not flow out.

  Next, in the curing step, only the first sealing material 91a is selectively cured by irradiating the first sealing material 91a with ultraviolet rays from the first substrate 10 and / or the second substrate 20 side. A sealing material layer 91 is formed. Next, heating is performed in a state where the first substrate 10 and the second substrate 20 bonded together by the first sealing material layer 91 are arranged on a hot plate, and the first substrate 10 and the second substrate 20 are heated between the first substrate 10 and the second substrate 20. The second sealing material 92a is cured while spreading the two sealing materials 92a to every corner, and the second sealing material layer 92 is formed. Thus, the first substrate 10 and the second substrate 20 are bonded to each other by the first sealing material layer 91 and the second sealing material layer 92.

  By performing such steps, the organic EL device 100 is obtained. When the above process is performed on a large substrate, the large substrate is cut to obtain a single-size organic EL device 100. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  As described above, also in the organic EL device 100 and the manufacturing method thereof according to the present embodiment, the uncured second sealing material 92a is replaced by the uncured first sealing material 91a in the overlapping process, as in the first embodiment. The second sealing material 92a is spread between the substrates while damming. At this time, even if the second sealing material 92a presses the uncured first sealing material 91a outward, in the present embodiment, the first sealing material 91a is reinforced by the reinforcing protrusion 95. Therefore, the second sealing material 92a does not break through the first sealing material 91a. Accordingly, the same effects as those of the first embodiment can be obtained, such as preventing the second sealing material 92a from flowing out.

  In this embodiment as well, as described with reference to FIGS. 6 and 7, the reinforcing protrusions 95 may be formed in a double or triple manner.

[Embodiment 3]
FIGS. 10A and 10B are a cross-sectional view schematically showing a cross-sectional configuration of the organic EL device according to Embodiment 3 of the present invention, and a plan view schematically showing a plan configuration of the peripheral region 10c. It is. Since the basic configuration of this embodiment is the same as that of Embodiments 1 and 2, portions having common functions are denoted by the same reference numerals and description thereof is omitted.

  In the first embodiment, a reinforcing projection 95 that protrudes toward the second substrate 20 is formed on the first substrate 10, and in the second embodiment, the second substrate 20 faces the first substrate 10. Although the protruding reinforcing protrusion 95 is formed, in this embodiment, as shown in FIGS. 10A and 10B, the peripheral region 10 c protrudes toward the first substrate 10 toward the second substrate 20. A reinforcing protrusion 951 (first reinforcing protrusion) is formed, and a reinforcing protrusion 952 (second reinforcing protrusion) protruding toward the first substrate 10 is also formed on the second substrate 20. Here, both the reinforcing protrusions 951 and 952 are formed in a rectangular frame shape along the peripheral region 10 c, but the reinforcing protrusion 951 and the reinforcing protrusion 952 are the first substrate 10 and the second substrate 20. When they are stacked, they are formed so as to be displaced from each other. The reinforcing protrusions 951 and 952 can be formed in a single layer, but in this embodiment, the reinforcing protrusions 951 are formed in a double shape, and the reinforcing protrusions 952 are sandwiched between the reinforcing protrusions 951. The reinforcing projection 952 is formed in a single region, and the reinforcing projection 952 is located in the region sandwiched between the reinforcing projections 951. Further, both the reinforcing protrusions 951 and 952 are divided into a plurality of parts in the direction surrounding the pixel region 10a by the interrupted portions 951y and 952y.

  Also in manufacturing the organic EL device 100, as in the first and second embodiments, the reinforcing protrusions 951 and 952 are formed on the first substrate 10 and the second substrate 20, and UV curing is performed along the peripheral region. A first sealing material application step for applying a first sealing material 91a, and a second sealing material application step for applying a thermosetting second sealing material 92a in a region surrounded by the first sealing material 91a; A stacking step of stacking the first substrate 10 and the second substrate 20 so as to sandwich the first seal material 91a and the second seal material 92a, and a seal for curing the first seal material 91a and the second seal material 92a A material curing step is performed.

  When performing such a method, in this embodiment, the reinforcing protrusion 951 is formed on the first substrate 10, and the reinforcing protrusion 952 is formed on the second substrate 20. Therefore, in the first sealing material application step, the first sealing material 91a is applied to the first substrate 10, the first sealing material 91a is applied to the second substrate 20, and the first sealing material 91a is applied to the first substrate 10. Either of the methods applied to both the second substrate 20 and the second substrate 20 may be employed. In the second sealing material application step, the second sealing material 92a is applied to the first substrate 10, the second sealing material 92a is applied to the second substrate 20, and the second sealing material 92a is applied to the first substrate 10. Either of the methods applied to both the second substrate 20 and the second substrate 20 may be employed. In any case, when the second sealing material 92a is deployed between the substrates while the uncured second sealing material 92a is dammed up by the uncured first sealing material 91a in the overlapping process, the second sealing material 92a Even if the uncured first sealing material 91a is pressed outward, in the present embodiment, since the first sealing material 91a is reinforced by the reinforcing protrusions 951 and 952, the second sealing material. 92a does not break through the first sealing material 91a. Therefore, the same effects as those of the first and second embodiments can be obtained, such as preventing the second sealing material 92a from flowing out.

[Improvements of Embodiments 1 and 2]
In the above embodiment, the reinforcing protrusions 95, 951, and 952 are formed by applying resin and then curing, but the pixel region 10a of the first substrate 10 includes a plurality of insulating films, partition walls 51, and light. A reflective layer 41 and various wirings are formed. Therefore, when the reinforcing protrusions 95 and 951 are formed on the first substrate 10, a plurality of insulating films, the partition walls 51, the light reflecting layer 41, and various wirings are laminated in a predetermined pattern in the peripheral region 10 c to reinforce. The protrusions 95 and 951 may be formed. In the second substrate 10, the color filter layers 22 (R), (G), and (B), the light shielding layer 23, the overcoat layer 24, and the gas barrier layer 25 are formed in the pixel region 10 a. When the reinforcing protrusions 95 and 952 are formed on the substrate 10, the color filter layers 22 (R), (G), and (B), the light shielding layer 23, the overcoat layer 24, and the gas barrier layer 25 are predetermined in the peripheral region 10 c. The reinforcing protrusions 95 and 952 may be formed by being laminated on the pattern.

  With this configuration, the reinforcing protrusions 95, 951, and 952 can be formed simply by changing the formation pattern of each thin film, such as changing the mask pattern for mask vapor deposition or the pattern of the etching mask for patterning. . Further, it is not necessary to add a separate process for forming the reinforcing protrusions 95, 951, 952. Therefore, the productivity of the organic EL device 100 can be improved.

[Other embodiments]
In the above embodiment, the case where the color filter layers 22 (R), (G), and (B) are provided on the second substrate 20 in the top emission type organic EL device 100 has been described as an example. However, the organic EL element itself However, the present invention may be applied to an organic EL device that emits light of each color. In this case, the second substrate 20 functions only as a sealing substrate.

  In the above embodiment, the organic EL device 100 for color display has been described as an example. However, when used as an optical head of a copying machine, monochrome may be used, and such a monochrome organic EL device may be used. The present invention may be applied. Also in this case, the second substrate 20 functions only as a sealing substrate.

  Furthermore, in the above embodiment, the top emission type organic EL device 100 has been described as an example. However, the present invention may be applied to a bottom emission type organic EL device. In this case, the second substrate 20 is sealed. It functions as a substrate only.

  In the above embodiment, the example in which the organic functional layer 82 is formed on the entire surface of the pixel region 10a has been described. However, after the organic functional layer is selectively applied to the region surrounded by the partition wall 51 by an inkjet method or the like, the fixing is performed. As a result, an upper layer of the first electrode layer 81 was formed with a hole injection layer made of 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like, and an organic functional layer made of a light emitting layer. The invention may be applied to an organic EL device. In this case, the light emitting layer is made of, for example, a polyfluorene derivative, a polyphenylene derivative, a polyvinyl carbazole, a polythiophene derivative, or a polymer material thereof, a perylene dye, a coumarin dye, a rhodamine dye, for example, rubrene, perylene, 9,10. -It is composed of a material doped with diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like. Further, as the light emitting layer, a π-conjugated polymer material in which double-bonded π electrons are non-polarized on the polymer chain is also a conductive polymer, so that it is excellent in light emitting performance, and thus is preferably used. . In particular, a compound having a fluorene skeleton in the molecule, that is, a polyfluorene compound is more preferably used. In addition to such materials, it is also possible to use a composition comprising a conjugated polymer organic compound precursor and at least one fluorescent dye for changing light emission characteristics.

[Example of mounting on electronic equipment]
With reference to FIG. 11, an electronic apparatus equipped with the organic EL device 100 according to the above-described embodiment will be described. FIG. 11 is an explanatory diagram of an electronic apparatus using the organic EL device according to the present invention.

  FIG. 11A shows a configuration of a mobile personal computer including the organic EL device 100. The personal computer 2000 includes an organic EL device 100 as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002. FIG. 11B shows a configuration of a mobile phone provided with the organic EL device 100. The cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the organic EL device 100 as a display unit. By operating the scroll button 3002, the screen displayed on the organic EL device 100 is scrolled. FIG. 11C shows the configuration of a personal digital assistant (PDA) to which the organic EL device 100 is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the organic EL device 100 as a display unit. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the organic EL device 100. Electronic devices to which the organic EL device 100 is applied include those shown in FIGS. 9A to 9C, a digital still camera, a liquid crystal television, a viewfinder type, a monitor direct-view type video tape recorder, a car navigation system. Examples thereof include a device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, and a device equipped with a touch panel. And the organic electroluminescent apparatus 100 mentioned above is applicable as a display part of these various electronic devices.

1 is an equivalent circuit diagram showing an electrical configuration of an organic EL device according to Embodiment 1 of the present invention. (A), (b) is the top view which looked at the planar structure of the organic electroluminescent apparatus which concerns on Embodiment 1 of this invention from the opposing substrate side with each component, respectively, and its JJ 'sectional drawing It is. (A), (b) is sectional drawing which shows typically the cross-sectional structure of the organic electroluminescent apparatus which concerns on Embodiment 1 of this invention, and the top view which shows typically the planar structure of the peripheral region, respectively. Process sectional drawing which shows a mode until it is just before bonding a 1st board | substrate and a 2nd board | substrate after forming the protrusion for a reinforcement in the 1st board | substrate among the manufacturing processes of the organic electroluminescent apparatus which concerns on Embodiment 1 of this invention. It is. It is explanatory drawing which shows typically a mode that the process to a bonding process is performed in the state of a large sized board | substrate among the manufacturing processes of the organic EL apparatus which concerns on Embodiment 1 of this invention. (A), (b) is sectional drawing which shows typically the cross-sectional structure of the organic electroluminescent apparatus which concerns on the improvement example of Embodiment 1 of this invention, and the top view which shows typically the planar structure of the peripheral region It is. (A), (b) each shows typically sectional drawing which shows the cross-sectional structure of the organic electroluminescent apparatus which concerns on another example of improvement of Embodiment 1 of this invention, and the plane structure of the peripheral region typically It is a top view. (A), (b) is sectional drawing which shows typically the cross-sectional structure of the organic electroluminescent apparatus which concerns on Embodiment 2 of this invention, and the top view which shows typically the planar structure of the peripheral region, respectively. Process sectional drawing which shows the mode until it is just before bonding a 1st board | substrate and a 2nd board | substrate after forming the protrusion for a reinforcement in the 1st board | substrate among the manufacturing processes of the organic electroluminescent apparatus which concerns on Embodiment 2 of this invention. It is. (A), (b) is sectional drawing which shows typically the cross-sectional structure of the organic electroluminescent apparatus which concerns on Embodiment 3 of this invention, and the top view which shows typically the planar structure of the peripheral region, respectively. It is explanatory drawing of the electronic device using the organic EL apparatus which concerns on this invention. (A), (b), (c), (d) is explanatory drawing which shows the problem in the manufacturing method of the organic electroluminescent apparatus based on the reference example of this invention, respectively.

Explanation of symbols

10 .. First substrate, 10 a... Pixel region, 10 c. 81 .. First electrode layer, 82 .. Organic functional layer, 83 .. Second electrode layer, 91 .. First sealing material layer, 91a ... First sealing material, 92 ... Second sealing material layer, 92a ... Second sealing material, 95, 951, 952 ... Reinforcing projection, 100 ... Organic EL device, 100a ... Pixel

Claims (14)

A first substrate on which a plurality of organic electroluminescent elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; and a surface side on which the organic electroluminescent elements are formed on the first substrate In the manufacturing method of the organic electroluminescence device having the second substrate bonded to
When the first substrate and the second substrate are bonded, the first substrate and / or the second substrate protrude from one substrate toward the other substrate along a peripheral region surrounding the pixel region. Forming a reinforcing protrusion to be
A first sealing material application step of applying a first sealing material along the reinforcing protrusion;
A second sealing material application step of applying a second sealing material in a region surrounded by the first sealing material;
An overlapping step of overlapping the first substrate and the second substrate so as to sandwich the first sealing material and the second sealing material;
A sealing material curing step for curing the first sealing material and the second sealing material;
The manufacturing method of the organic electroluminescent apparatus characterized by performing. The second substrate and the second sealing material layer are translucent,
2. The method of manufacturing an organic electroluminescence device according to claim 1, wherein a color filter layer of a different color is formed on each region facing the plurality of organic electroluminescence elements on the second substrate.   3. The method of manufacturing an organic electroluminescence device according to claim 1, wherein the reinforcing protrusion is formed only on one of the first substrate and the second substrate.   4. The method of manufacturing an organic electroluminescence device according to claim 1, wherein the first sealing material has a viscosity higher than that of the second sealing material. 5.   5. The method of manufacturing an organic electroluminescence device according to claim 1, wherein the first sealing material is photocurable, and the second sealing material is thermosetting. 6.   6. The manufacturing of the organic electroluminescence device according to claim 1, wherein, in the sealing material curing step, the second sealing material is cured after the first sealing material is cured. Method.   The method of manufacturing an organic electroluminescence device according to claim 1, wherein the superimposing step is performed in a reduced-pressure atmosphere.   When forming a plurality of films in the pixel region of the first substrate and / or the second substrate, the reinforcing protrusions are formed by stacking the plurality of films in the peripheral region. Item 8. A method for producing an organic electroluminescence device according to any one of Items 1 to 7. A first substrate on which a plurality of organic electroluminescent elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; and a surface side on which the organic electroluminescent elements are formed on the first substrate An organic electroluminescence device having a second substrate overlaid on
The first substrate and the second substrate are formed in a frame-shaped first sealing material layer formed in a peripheral region surrounding the pixel region and the entire region surrounded by the first sealing material layer. Bonded with the second sealing material layer,
In the first substrate and / or the second substrate, a reinforcing protrusion that protrudes from one substrate toward the other substrate is formed in the formation region of the first sealing material layer. Organic electroluminescence device. The second substrate and the second sealing material layer are translucent,
10. The organic electroluminescence device according to claim 9, wherein a color filter layer of a different color is formed on each region facing the plurality of organic electroluminescence elements on the second substrate.   The organic electroluminescence device according to claim 9 or 10, wherein the reinforcing protrusion is formed only on one of the first substrate and the second substrate.   12. The organic electroluminescence device according to claim 9, wherein the reinforcing protrusions are formed so as to surround the pixel region in a multiple manner.   The organic electroluminescence device according to any one of claims 9 to 12, wherein the reinforcing protrusion is divided into a plurality in the circumferential direction by an interrupted portion.   14. The reinforcing protrusion is formed by laminating a plurality of films formed in the pixel region on the first substrate and / or the second substrate in the peripheral region. The organic electroluminescent device according to claim 1.

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