JP2007012372A - Manufacturing method of optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical device in which a viscous moisture absorbing member having a desired shape and thickness can be installed appropriately in a sealing space, and in which variations in a surface area of the viscous moisture absorbing member exposed in the sealing space can be reduced. <P>SOLUTION: The manufacturing method of an organic EL display device is the manufacturing method having a substrate, a counter substrate, and an organic EL element formed in the sealing space between the both substrates. A metal mask 300 having an aperture 300a in a prescribed region is arranged on the counter substrate 106, the viscous moisture absorbing member 107 is applied in the aperture 300a, an applied viscous moisture absorbing member 107 is pressed, and widened inside that wall, the metal mask 300 is taken off from the counter substrate 106, and both substrates are adhered by an adhesive so that the viscous moisture absorbing member 107 is arranged in the sealing space. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical device, and more particularly to a method for applying the viscous moisture absorbing member.

  An organic EL (Electro Luminescence) element has a laminate structure in which an organic EL layer containing an organic light emitting compound is sandwiched between an anode and a cathode. When a voltage is applied between the anode and the cathode, holes from the anode and electrons from the cathode are injected into the organic EL layer to recombine, and the organic light-emitting property contained in the organic EL layer is generated by the energy generated at that time. The molecule of the compound is excited. A light emission phenomenon occurs in the process in which the excited molecules are deactivated to the ground state. The organic EL element is a self-luminous element utilizing this light emission phenomenon.

  The organic EL layer includes at least an organic layer called a light-emitting layer that emits light by recombination of holes and electrons. If necessary, an organic layer called a hole transport layer that is easy to inject holes and hardly move electrons. The layer has a single layer structure or a multilayer structure including one or both of an organic layer called an electron transport layer that is easy to inject electrons and hardly move holes.

  In general, an organic EL panel is formed by sequentially laminating a transparent electrode serving as an anode with ITO (Indium Tin Oxide), an organic EL layer, and an electrode serving as a cathode with aluminum or the like on a glass substrate. The organic EL element is formed, and a concave counter substrate made of glass or the like covering the laminated body is hermetically disposed on the substrate via an ultraviolet curable adhesive.

  One of the major problems of this organic EL panel is to improve the lifetime of the light emitting layer. One of the causes for shortening the lifetime is the occurrence of non-light-emitting portions called dark frames or dark spots. The non-light emitting portion grows with the lighting elapsed time, and the non-light emitting area gradually increases, and the light emission luminance of the light emitting portion decreases. The main cause of the generation of the non-light-emitting portion is a reaction between the organic EL layer constituting the organic EL element and moisture or oxygen in the sealed container. As a result, it is known that non-light emitting portions are generated and grown.

  Therefore, in the conventional organic EL display device, the lifetime of the organic EL element is improved by disposing a hygroscopic member in a sealed space obtained by the substrate on which the organic EL element is disposed and the counter substrate. As this moisture absorbing member, an inorganic desiccant is known (see Patent Document 1).

  In addition, an organic metal compound that is highly reactive with moisture is formed into a film, a water capturing layer is formed in a sealed space obtained by the substrate on which the organic EL element is disposed and the counter substrate, and a chemical reaction is used. A method for effectively capturing moisture is known (see Patent Document 2).

Further, for example, a moisture absorbing member having a viscosity obtained by mixing a solid adsorbent in a predetermined ratio in an inert liquid made of fluorinated oil is applied to the surface facing the laminate of the counter substrate, and sealed A structure that absorbs moisture in the space is known (see Patent Document 3).
Japanese Patent Laid-Open No. 9-148066 JP 2002-33187 A JP 2003-163076 A

  As disclosed in Patent Document 3, an organic EL display device using a viscous moisture-absorbing member is manufactured by applying a moisture-absorbing member to a surface of the counter substrate facing the laminate. In this application step, the moisture absorbing member is applied to a predetermined position using an application device such as a dispenser. The viscous hygroscopic member can be disposed at a desired position by a dispenser, and is also an excellent hygroscopic member from the viewpoint of cost.

  It is known that the moisture absorption amount of the moisture absorbing member generally depends on the surface area of the moisture absorbing member exposed to the sealed space. When a viscous hygroscopic member is applied using an applicator such as a dispenser, the viscous hygroscopic member cannot be thinly and widely applied to the counter substrate, and a large surface area of the viscous hygroscopic member exposed to the sealing space can be secured. Can not.

Further, when a large number of organic EL display devices are manufactured, it is important to suppress variations in the surface area of the viscous moisture absorbing member exposed to the sealed space. This is because the variation in the surface area causes a difference in moisture absorption amount and moisture absorption speed between the organic EL display devices, resulting in variations in quality.
The present invention has been made in the background as described above, and appropriately provides a viscous moisture absorbing member having a desired shape in the sealed space, and the surface area of the viscous moisture absorbing member exposed in the sealed space. The purpose is to reduce the variation.

  An optical device manufacturing method according to the present invention includes a first substrate, a second substrate, and an element formed in a sealed space between the first substrate and the second substrate. And a step of providing a wall surrounding a predetermined region on the surface of the second substrate on the second substrate, and applying a viscous moisture absorbing member to the inside of the wall on the second substrate. Pressing the viscous hygroscopic member and spreading it inside the wall, and fixing the first substrate and the second substrate so that the viscous hygroscopic member is disposed in the sealed space. It is a waste.

  In this way, a wall surrounding a predetermined region of the second substrate surface is provided on the second substrate, the viscous moisture absorbing member is applied to the inside of the wall on the second substrate, and the applied viscous moisture absorbing member is Since it is pressed and spread on the inside of the wall, a viscous moisture absorbing member having a desired shape can be appropriately provided in the sealed space, and variation in the surface area of the viscous moisture absorbing member exposed in the sealed space can be reduced. .

In addition, a mask having an opening in a predetermined region is disposed in close contact with the second substrate to provide a wall surrounding the predetermined region on the surface of the second substrate, and the mask is attached to the second substrate after the viscous moisture absorbing member is spread. It is good to remove from.
By doing so, the viscous moisture absorbing member can be further applied in accordance with the mask thickness, the viscous moisture absorbing member having a desired shape and thickness can be appropriately provided in the sealed space, and exposed to the sealed space. Variation in the surface area of the viscous hygroscopic member can be reduced.

Moreover, it is good to press and spread a viscous moisture absorbing member, moving the pressing member which presses the said viscous moisture absorbing member to the direction which faces a 2nd board | substrate surface. Thus, by using the pressing member, it is possible to easily and efficiently spread the viscous moisture absorbing member.
Moreover, it is good to press and spread a viscous moisture absorbing member, moving the pressing member which presses the said viscous moisture absorbing member along the surface on a 2nd board | substrate. Accordingly, the viscous moisture absorbing member having a desired shape and thickness can be appropriately provided in the sealed space while removing the excess viscous moisture absorbing member, and the surface area of the viscous moisture absorbing member exposed to the sealed space varies. Can be reduced more stably.

  Further, the pressing member may be positioned in contact with the upper surface of the wall, and the viscous hygroscopic member may be pressed and spread so as to have a predetermined thickness. By doing in this way, the viscous moisture absorbing member having a desired shape and thickness can be further appropriately provided in the sealed space, and the variation in the surface area of the viscous moisture absorbing member exposed to the sealed space can be stabilized more stably. Can be reduced.

  Further, it is preferable that an uneven surface is formed on the surface of the pressing member on the viscous moisture absorbing member side. The mask may have a plurality of openings, and the viscous moisture absorbing member may be applied to a plurality of locations on the second substrate. By doing in this way, the surface area of the viscous moisture absorption member exposed in sealing space can be ensured widely.

  Further, the mask may be removed from the second substrate while gas is blown against the viscous moisture absorbing member. By doing so, it is possible to reduce stringing and horn generation of the viscous hygroscopic member that occurs when the mask is removed from the second substrate, and contact between the viscous hygroscopic member and the display element can be prevented.

  Further, a step is formed on the second substrate, and the mask is preferably formed in a shape matching the step shape. By doing in this way, even when a step is formed on the second substrate, the inner end face side of the opening in the bottom surface of the metal mask can be adhered to the second substrate and the viscous moisture absorbing member can be applied, A viscous moisture absorbing member having a desired shape and thickness can be appropriately provided in the sealed space.

  ADVANTAGE OF THE INVENTION According to this invention, a viscous moisture absorption member can be provided appropriately in sealed space, and the dispersion | variation in the surface area of the viscous moisture absorption member exposed in sealed space can be reduced.

  A configuration of an organic EL display device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a part of the configuration of an organic EL panel 100 according to an embodiment of the present invention. FIG. 1 schematically shows the configuration of the organic EL panel, and does not reflect the detailed configuration of the actual organic EL panel.

  The organic EL panel 100 has a configuration in which an organic EL element 110 is formed in an airtight space (sealing space) obtained by a substrate 101 made of glass or the like and a counter substrate 106. The substrate 101 and the counter substrate 106 are bonded with an adhesive 108. The organic EL element 110 formed on the substrate 101 includes an anode 102, an insulating layer 103, an organic EL layer 104, and a cathode 105. When a voltage is applied between the anode 102 and the cathode 105, holes are injected from the anode and electrons are injected from the cathode into the organic EL layer 104 to recombine, and energy generated at that time causes recombination in the organic EL layer 104. The molecule of the organic light emitting compound is excited. The excited molecules are deactivated to the ground state, and the organic EL layer 104 emits light in the process.

  As shown in FIG. 1, an anode 102 is formed on the lowermost layer on the substrate 101. The anode 102 is formed of a transparent conductive thin film such as ITO. On the anode 102, an insulating layer 103 made of polyimide or the like is formed. The insulating layer 103 has an opening at a position where the anode 102 and the cathode 105 intersect (that is, a position where a pixel is formed). An organic EL layer 104 is formed in the opening of the insulating layer 103.

  The insulating layer 103 plays a role of defining an opening where the organic EL layer 104 and the anode 102 are in contact with each other. Further, the insulating layer 103 is disposed so as not to cause a short circuit between the anode 102 and the cathode 105. As shown in FIG. 1, a cathode 105 made of a metal having a high light reflectance such as Al is provided on the organic EL layer 104 in order to increase emission luminance. Although not shown here, a partition wall (not shown) made of, for example, a novolak resin or the like is provided for separating the cathode 105.

  A plurality of organic EL elements 110 are provided on the substrate 101, and a region where the organic EL elements 110 are formed becomes a display region. On the substrate 101, auxiliary wiring for supplying a signal to each organic EL element 110 is further provided. In FIG. 1, a portion of the auxiliary cathode wiring 109 connected to the cathode 105 is illustrated. The anode 102 and the cathode 105 of the organic EL element 110 are connected to respective auxiliary wirings, and these auxiliary wirings are extended outside the adhesive 108. A driving circuit (not shown) is mounted on the end of the substrate 101, and the anode 102 and the cathode 105 are each connected to the driving circuit via auxiliary wiring. By supplying a current from the drive circuit to the organic EL element 110, the organic EL element 110 can emit light and display a desired image.

  The counter substrate 106 is provided so that moisture and oxygen do not enter the panel. As the counter substrate 106, in addition to metals such as stainless steel, aluminum, or an alloy thereof, one or two or more types such as glass and acrylic resin can be used. As shown in FIG. 1, the counter substrate 106 and the substrate 101 are bonded by an adhesive 108, and a sealing space (region) is formed between the counter substrate 106 and the substrate 101. In addition to the organic EL element 110, a viscous moisture absorbing member 107 is disposed in the sealed space. The viscous hygroscopic member 107 is used to suppress the influence of moisture and oxygen on the organic EL element 110 and maintain stable light emission characteristics. As shown in FIG. 1, the viscous moisture absorbing member 107 is disposed on the counter substrate 106 and on the surface facing the organic EL element 110.

  The viscous hygroscopic member 107 has such a viscosity that the adsorbent does not flow. It adheres to the coated surface in the form of cream or gel. As the adsorbent, one that physically or chemically adsorbs moisture, such as activated alumina, molecular sieves, calcium oxide, and barium oxide, is used. For example, the viscous moisture absorbing member 107 is configured by mixing a predetermined amount of an adsorbent in an inert liquid made of fluorinated oil, or a predetermined amount of adsorbent is added to an inert gel-like member such as a fluorinated gel. It is obtained by mixing. Examples of the fluorine-based oil include poly-trifluoro-chloroethylene, poly-fluoroalkylene glycol, and the like. As shown in FIG. 1, the viscous moisture absorbing member 107 is disposed with a certain distance d so as not to contact the inner side surface of the recess formed in the counter substrate 106.

  Further, for example, the viscous moisture absorbing member 107 can be configured by mixing a predetermined amount of an adsorbent into an inert liquid or an inert gel-like member made of silicone oil. Examples of silicone oils include dimethylsilicones such as methylpolysiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, cyclic dimethylsilicones such as decamethylcyclopentasiloxane, octamethylcyclotetrasiloxane, and polymethylsiloxane having a cyclic structure. There are methylphenyl silicons such as methylphenylpolysiloxane and polysiloxanes having a phenyl group in addition to a methyl group.

  Other silicone oils such as trimethylsiloxysilicic acid and methyl-modified polysiloxane, polyoxyethylene / methylpolysiloxane copolymer, poly (oxyethylene, oxypropylene) methylpolysiloxane copolymer, etc. Examples include silicone and methylhydrogen polysiloxane. The mixing ratio of the silicone oil and the adsorbent can be, for example, about 25 to 60 wt% so that the silicone oil and the adsorbent are not separated. Preferably, the mixing ratio is about 40 to 60 wt%, and in this case, thixotropy can be enhanced.

  The thixotropy refers to the property that the viscosity is low in a moving state (eg, stirring) and the viscosity is high in a stationary state (static state). More preferably, the mixing ratio is about 50 to 60 wt% and can be stably applied by a dispenser. In this embodiment, as an example of the viscous moisture absorbing member 107 using silicone oil, a material in which 7.0 g of dimethylpolysiloxane (manufactured by Shin-Etsu Chemical Co., Ltd.) and 55 wt% of molecular sieves 8.5 g are mixed. By using this, the viscous hygroscopic member 107 having high thixotropy can be stably applied with a dispenser without separation.

Next, a method for manufacturing an organic EL display device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a flowchart showing manufacturing steps of the organic EL display device according to the embodiment of the present invention.
First, as shown in FIGS. 1 and 2, a substrate 101 on which an organic EL element 110 is formed is prepared (step (hereinafter referred to as S) 101). An anode material is deposited on the substrate 101 (S102). The anode material is formed on the substrate with good uniformity by, for example, vapor deposition or sputtering. Thereafter, it is patterned into a predetermined pattern shape by photolithography and etching (S103), and this pattern becomes the anode 102.

  Next, as shown in FIG. 2, an auxiliary wiring material (not shown) is formed on the anode 102 (S104). The film can be formed by an auxiliary wiring material vapor deposition method, a sputtering method, or the like. Next, as shown in FIG. 2, the auxiliary wiring material is patterned by photolithography and etching to form an auxiliary wiring pattern (S105). The anode 102 and the cathode 105 to be formed later are connected to a drive circuit mounted on the end portion of the substrate through this auxiliary wiring pattern, and a signal is supplied.

  Next, as shown in FIGS. 1 and 2, the insulating layer 103 is formed on the anode 102 by using spin coating and photolithography (S106). The insulating layer 103 is provided with an opening at a position where the anode 102 and a cathode 105 described later intersect (that is, a position where a display pixel is formed). An organic EL layer 104 is formed in the opening. Next, a partition (not shown) is formed to separate the cathode 105 (S107). For example, a novolac resin is spin-coated on the partition wall, patterned by a photolithography process, and then subjected to photoreaction to form a cathode partition wall. It is preferable to use a negative type photosensitive resin so that the cathode partition wall has a reverse taper structure.

  Next, as shown in FIGS. 1 and 2, the organic EL layer 104 is stacked on the anode 102 formed in the opening of the insulating layer 103 by vapor deposition, coating, or the like (S108). The organic EL layer 104 is often composed of a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer, and the like. For example, copper phthalocyanine (CuPc) can be used as the hole injection layer. Further, N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine (α-NPD) can be used as the hole transport layer. Then, tris (8-quinolinolato) aluminum (Alq3) can be used as the light emitting layer, and lithium fluoride (LiF) can be used as the electron injection layer.

  Next, as shown in FIGS. 1 and 2, a cathode 105 is formed on the organic EL layer 104 by physical vapor deposition (PVD) such as sputtering (S109). Thus, the organic EL element 110 is formed by stacking the anode 102, the insulating layer 103, the organic EL layer 104, and the cathode 105. Through these steps, an element substrate having a plurality of organic EL elements 110 formed on the substrate 101 is manufactured.

  Next, a manufacturing process of the counter substrate 106 for sealing the organic EL element 110 will be described. The counter substrate 106 is prepared (S201). Next, a metal mask (not shown in FIG. 3) having an opening in a predetermined region is disposed on the counter substrate 106 at a predetermined position (S202). A predetermined amount of the viscous moisture absorbing member 107 is disposed in the opening of the metal mask disposed on the counter substrate 106 (S203). That is, first, the viscous moisture absorbing member 107 is applied on the counter substrate 106 in a dry atmosphere with an inert gas (for example, dry nitrogen) from which moisture is removed as much as possible.

  Subsequently, the viscous moisture absorbing member 107 in the opening of the metal mask is pressed by a pressing member (not shown in FIG. 3) (S204). Next, the metal mask is removed from the counter substrate 106 (S205). In addition, the arrangement | positioning method (S202-S205) of the viscous moisture absorption member 107 is explained in full detail later. Next, an adhesive 108 for fixing the substrate 101 and the counter substrate 106 is applied (S206). The adhesive 108 is provided on the outside of the viscous moisture absorbing member 107 using a dispenser, and is provided on the counter substrate 106 so as to surround the entire periphery of the display area. As the adhesive 108, an epoxy resin adhesive having low permeability such as moisture, a photocurable resin, or the like can be used.

  Next, as shown in FIGS. 1 and 2, the counter substrate 106 on which the viscous moisture absorbing member 107 is disposed and the substrate 101 on which the organic EL element 110 is formed are bonded and sealed (S110). After aligning the two substrates, the adhesive 108 can be cured and bonded to each other by irradiating UV light while applying pressure. In this way, the organic EL panel 100 is manufactured. Through the above-described process, the space between the substrate 101 and the counter substrate 106 is sealed with the adhesive 108.

  Thereafter, a drive circuit and the like are mounted (S111). A terminal portion is formed at an outer end portion of the auxiliary wiring, and an anisotropic conductive film (ACF) is attached to the terminal portion to connect a TCP (Tape Carrier Package) provided with a drive circuit. This organic EL panel is attached to the housing, and the organic EL display is completed (S112).

  Here, the arrangement method (steps S202 to S205) of the viscous moisture absorbing member 107 will be described in detail with reference to FIGS. FIG. 3 is a schematic diagram showing a coating device for a viscous moisture absorbing member. FIG. 4 is a diagram for explaining a viscous moisture absorbing member application process according to an embodiment of the present invention. FIG. 4A illustrates a case where a metal mask 300 is disposed on a counter substrate and the viscous moisture absorbing member 107 is applied. FIG. 4B is a cross-sectional view taken along the line AA of FIG. 4A. In FIG. 4B, the pressing member 400 to the viscous hygroscopic member 107 is also shown. FIG. 5 is a diagram showing the application state of the viscous moisture absorbing member 107 according to the embodiment of the present invention. FIG. 5A is a plan view of the viscous moisture absorbing member 107 spread on the counter substrate 106. FIG. 5B is a cross-sectional view taken along the line BB in FIG.

  As shown in FIG. 3, the coating apparatus 200 includes a stage 201 on which the counter substrate 106 is mounted, and a dispenser 202 for applying a viscous hygroscopic member 107 having viscosity. The dispenser 202 includes a viscous hygroscopic member. A needle 203 for discharging 107 is provided. In addition, the coating apparatus 200 includes a viscous moisture absorbing member 107 discharged from the discharge port of the needle 203 and a nozzle 204 for blowing gas to the viscous moisture absorbing member 107 when the metal mask 300 is separated from the counter substrate 106. . In addition, the coating apparatus 200 includes an XYZ moving unit 205 including an actuator, a servo motor, and the like, and can move the dispenser 202 and the nozzle 204 to an arbitrary position and height. Further, a control device 206 capable of controlling the discharge amount of the viscous moisture absorbing member 107, the position and moving speed of the dispenser 202, the gas blowing position, and the like is provided.

  First, the counter substrate 106 is placed on the stage 201. Next, as shown in FIGS. 3 and 4A, a metal mask 300 having an opening 300a in a predetermined region is placed in close contact with the counter substrate 107 (S202). In the case where positioning portions such as positioning pins and positioning holes are provided on the counter substrate 106 and the metal mask 300, the metal mask 300 having a rectangular predetermined region opening 300 a is attached to the counter substrate 106. Place on top. Thereby, the opening 300 a of the metal mask 300 can be accurately arranged at a desired position on the counter substrate 106. The metal mask 300 is bonded to the substrate 101 and the counter substrate 106, and after sealing the organic EL element 110 (S110), the metal mask 300 has a thickness that does not contact the organic EL element 110 formed on the substrate 101 (for example, About 0.2 mm to about 0.3 mm).

  Then, as shown in FIG. 3, the dispenser 202 is lowered by the XYZ moving means 205, and the needle 203 is brought close to the counter substrate 106 so that the needle 203 and the counter substrate 106 become a predetermined distance. Arrange. Next, the viscous moisture absorbing member 107 having viscosity is discharged from the discharge port of the needle 203 and applied onto the counter substrate 106. Specifically, the viscous moisture absorbing member 107 is moved by the XYZ moving unit 205 while moving the needle 203 parallel to the entire inside of the opening 300a of the metal mask 300 while keeping the distance between the needle 203 and the counter substrate 106 substantially constant. Is applied (S203).

  The position of the viscous moisture absorbing member 107 to be applied on the counter substrate 106, the discharge amount, the moving speed of the dispenser 202, and the like can be arbitrarily set by the control device 206, and are controlled by a control signal output from the control device 206. . From the application start point position to the application end point position, the viscous moisture absorbing member 107 is always discharged and continuously applied onto the counter substrate 106. When moving to the application end point position, the discharge of the viscous moisture absorbing member 107 and the movement of the dispenser 202 are stopped. At the stop position, the dispenser 202 is raised and the viscous hygroscopic member 107 and the needle 203 are separated. Before starting the raising of the dispenser 202 or during the raising of the dispenser 202, a gas is blown from the nozzle 204 to the application end portion of the viscous moisture absorbing member 107.

  At this time, the reason why the gas is blown at the application end point is to prevent the viscous hygroscopic member 107 having a viscosity from being dragged to the tip of the needle 203 to cause horns or stringing. . Next, as shown in FIG. 4B, the viscous moisture absorbing member 107 in the opening 300a of the metal mask 300 is pressed using a pressing member 400 formed of a metal such as stainless steel or a resin material, for example. And spread (S204). The pressing member 400 descends toward the surface of the counter substrate 106 and stops at a position where it comes into contact with the upper surface of the metal mask 300. In this example, the pressing member 400 moves in the direction perpendicular to the surface of the counter substrate 106 (FIG. 4B, Z direction).

The pressing member 400 has an outer shape larger than the opening 300a of the metal mask 300, and in the state where the pressing member 400 is positioned in contact with the upper surface of the metal mask 300, the entire opening 300a is covered. The viscous moisture absorbing member 107 is applied in substantially the same volume as the volume in the opening 300a, and fills the opening 300a by being spread by the pressing member 400. That is, the viscous moisture absorbing member 107 is in contact with each inner wall of the metal mask 300. Further, the thickness of the viscous moisture absorbing member 107 is substantially the same as the thickness of the metal mask 300.
A material having releasability such as a fluororesin may be applied to the surface of the pressing member 400 on the viscous moisture absorbing member 107 side. Thereby, it is possible to prevent occurrence of horns and stringing of the viscous moisture absorbing member 107 that occur when the pressing member 400 is pulled away from the viscous moisture absorbing member 107 after pressing.

  Further, the metal mask 300 is removed from the counter substrate 106 (S205). When the metal mask 300 is separated, it is better to blow gas from the nozzle 204 to the viscous moisture absorbing member 107 along the inner end portion of the opening 300a of the metal mask 300 with such strength that the shape of the viscous moisture absorbing member 107 does not deform. . This prevents the viscous moisture absorbing member 107 having viscosity from being dragged around the opening 300a of the metal mask 300, particularly to the corners, thereby forming horns or causing stringing. Specifically, gas is blown from the nozzle 204 when the metal mask 300 is raised, thereby preventing horn formation or stringing of the viscous moisture absorbing member 107. Note that a material having releasability such as a fluororesin can be applied to the inner side surface of the opening 300a of the metal mask 300, or the mask can be formed of a fluororesin. Thereby, the mask can be removed from the counter substrate 106 more easily.

  5A and 5B, the viscous moisture absorbing member 107 has a shape and thickness along the contour inside the opening 300a of the metal mask 300 on the counter substrate 106. Arranged. In this way, by using the metal mask 300 having the opening 300a in a predetermined region and spreading the viscous moisture absorbing member 107 in the opening 300a, the viscous moisture absorbing member 107 having a desired shape is appropriately provided in the sealed space. And variation in the surface area can be reduced. Further, by using the pressing member 400, the viscous moisture absorbing member 107 can be spread easily and efficiently.

  Unlike the above, by moving the pressing member 400 along the surface of the counter substrate 106, the viscous moisture absorbing member 107 may be pressed and expanded in the opening 300a of the metal mask 300 while gradually moving the pressing region. The pressing member 400 is thinly formed in a direction (Y direction) perpendicular to the paper surface of FIG. The pressing member 400 moves in the Y direction. In the direction perpendicular to the moving direction (X direction), the length of the pressing member 400 is larger than the opening 300 a, and the pressing member 400 moves while pressing the viscous moisture absorbing member 107 in a state of being in contact with the upper surface of the metal mask 300. To do. In this way, by moving the pressing member 400 and gradually moving the pressing region, the excess viscous moisture absorbing member 107 overflowing from the opening 300a of the metal mask 300 can be removed, and the viscous moisture absorbing member 107 on the counter substrate 106 can be removed. The shape and thickness can be made more stable and constant. Note that after the viscous moisture absorbing member 107 is applied, the excess viscous moisture absorbing member attached to the pressing member 400 is washed.

Here, in general, the amount of moisture absorbed by the viscous moisture absorbing member 107 depends on the surface area of the viscous moisture absorbing member 107 that is exposed to the sealing space between the substrate 101 and the counter substrate 106. In order to ensure a wider area, an uneven surface 401a may be formed on the surface of the pressing member 401 as shown in FIG.
As shown in FIG. 6, an uneven surface 401 a is formed on the surface of the pressing member 401 on the viscous moisture absorbing member 107 side. As shown in FIG. 6, the uneven surface 401a is formed in a sawtooth shape. Note that the shape of the uneven surface 401a is not limited to this shape, and may be formed as a wave-like or rectangular uneven surface. By doing in this way, the surface area by the side of the press member 401 of the viscous moisture absorption member 107 can be enlarged.

  Further, in addition to forming the uneven surface 401a on the surface of the pressing member 401 on the viscous moisture absorbing member 107 side, for example, by arranging the viscous moisture absorbing member 107 at a plurality of spaced locations, the substrate 101 and the counter substrate 106 can be arranged. A large surface area of the viscous hygroscopic member 107 exposed in the sealed space can be secured. FIG. 7 is a view for explaining a second modification of the application process of the viscous hygroscopic member according to the embodiment of the present invention. FIG. 7A shows a viscous structure in which a metal mask is arranged on the counter substrate. It is a top view which shows the state which apply | coated the moisture absorption member, FIG.7 (b) is sectional drawing in CC cut line of Fig.7 (a).

  As shown in FIG. 7A, the metal mask 301 is formed with a plurality of spaced apart openings 301a. FIG. 7A shows a metal mask 301 in which a rectangular opening 301a of 4 rows and 10 columns is formed as an example. The viscous moisture absorbing member 107 is applied to the inside of the plurality of openings 301 a formed as described above, and the viscous moisture absorbing member 107 applied to the inside of each of the plurality of openings 301 a of the metal mask 301 is applied to the metal mask 301 by the pressing member 400. The metal mask 301 is removed from the counter substrate 106 by pressing in the Z direction from above.

  As a result, a plurality of rectangular viscous moisture absorbing members 107 are arranged on the counter substrate 106 so as to be spaced apart from each other. By doing in this way, the surface area of the viscous moisture absorption member 107 exposed in the sealing space between the board | substrate 101 and the opposing board | substrate 106 can be ensured widely. In order to prevent the occurrence of horns and stringing of the viscous moisture absorbing member 107, release of fluororesin or the like on the inner end face of each opening 301 a of the metal mask 301 or the surface of the pressing member 400 on the viscous moisture absorbing member 107 side. It is even better to apply the material.

  5B, the thickness of the viscous moisture absorbing member 107, that is, the thickness (height) t of the metal mask in this example is 50 to 90% of the depth D of the recess of the counter substrate 106. Preferably there is. More preferably, it is 70 to 90%. As a result, contact with the organic EL element 110 can be reliably prevented, and deterioration of display characteristics associated therewith can be suppressed. That is, the maximum thickness of the viscous hygroscopic member 107 can be made less than the distance between the counter substrate 106 and the organic EL element 110, and the viscous hygroscopic member 107 can be prevented from contacting the organic EL element 110.

  Further, as shown in FIG. 1 and FIG. 5B, the viscous moisture absorbing member 107 may be provided with a certain distance d so that it does not contact the inner side surface of the recess formed in the counter substrate 106. preferable. By doing so, the viscous moisture absorbing member 107 does not enter the position of the adhesive 108, and the counter substrate 106 and the substrate 101 on which the organic EL element is formed can be bonded reliably.

  Further, when the counter substrate 106 is multi-faceted, it is necessary to consider the step formed around the counter substrate 106 in order to efficiently apply the viscous moisture absorbing member 107 on each counter substrate 106. FIG. 8 is a cross-sectional view in which a metal mask is arranged on the counter substrate when the counter substrate is multifaceted. As shown in FIG. 8, between the opposing substrates 106 of the mother substrate 160 for the opposing substrate 106 in which a plurality of opposing substrates 106 are arranged, a cutting line MM for separating the opposing substrates 106 and a cutting line are provided. A step 161 having a line NN at the center is formed.

Therefore, as shown in FIG. 8, the metal mask 302 is bent in accordance with the shape of each step 161 of the mother substrate 160 of the counter substrate so that the viscous moisture absorbing member 107 can be applied onto the counter substrate 106 at a time. The bent portion 302b is formed.
As a result, even when a step is formed on the counter substrate 106, the viscous moisture absorbing member 107 is placed in a state where the inner end surface side of the opening 302 a on the bottom surface of the metal mask 302 is in close contact with the counter substrate 106. The viscous moisture-absorbing member 107 having a desired shape and thickness can be appropriately provided in the sealed space.

The above description is for explaining the embodiment of the present invention, and the present invention is not limited to the above embodiment. Moreover, those skilled in the art can easily change, add, and convert each element of the above embodiment within the scope of the present invention.
For example, in the above-described aspect of the invention, the viscous moisture absorbing member 107 in a predetermined region is applied on the counter substrate 106 using the metal mask 300 or the like, but a wall (not shown) surrounding the predetermined region on the surface of the counter substrate 106 is used. It may be provided so as to protrude on the counter substrate 106, and the viscous moisture absorbing member 107 may be applied to the inside of a wall (not shown) provided on the counter substrate 106. Further, similarly to the above-described aspect of the invention, the viscous moisture-absorbing member 107 may be pressed to the height of the wall by bringing the pressing member into contact with the upper surface of the wall. Further, in order to press the viscous moisture absorbing member 107, it may be pressed while moving the pressing member in the X direction or the Y direction shown in FIG. 4 or the direction corresponding to the Z direction. Has an effect.

  For example, in the above-described aspect of the invention, the shape of the viscous moisture absorbing member 107 disposed on the counter substrate 106 is rectangular. However, as long as the wall provided on the metal mask or the counter substrate can be manufactured, a circular shape or an oval shape is used. Any shape such as a polygonal shape or a star shape may be used. Moreover, although the example which used the dispenser 202 for application | coating of the viscous moisture absorption member 107 was shown in the form of the said invention, for example, this invention can also be applied to the hand-painting etc. which used application | coating means, such as a medicine spoon. It is. Application of the viscous hygroscopic member of this embodiment is particularly suitable for manufacturing an organic EL panel, but it can also be applied to the application of the viscous hygroscopic member to other substrates.

1 is a schematic cross-sectional view of an organic EL display device according to an embodiment of the present invention. It is a flowchart which shows the manufacturing process of the organic electroluminescence display which concerns on embodiment of this invention. It is a typical schematic diagram of an application device which coats a viscous hygroscopic member of an embodiment of the invention. It is a figure for demonstrating the application | coating process of the viscous hygroscopic member of embodiment of this invention, Comprising: Fig.4 (a) is a plane which shows the state which has arrange | positioned the metal hygroscopic member on the counter substrate and spread the viscous hygroscopic member. FIG. 4B is a cross-sectional view taken along the line AA in FIG. FIG. 5A is a plan view showing a state in which the viscous moisture absorbing member is spread on the counter substrate, and FIG. 5B is a diagram illustrating the application state of the viscous moisture absorbing member according to the embodiment of the present invention. These are sectional drawings in the BB cut line of Drawing 5 (a). It is a figure for demonstrating the 1st modification of the application process of the viscous moisture absorption member of embodiment of this invention, Comprising: A metal mask is arrange | positioned on an opposing board | substrate, a viscosity moisture absorption member is apply | coated, and from on metal mask It is sectional drawing which shows the state which pressed the viscous hygroscopic member, and is sectional drawing equivalent to FIG.5 (b). It is a figure for demonstrating the 2nd modification of the application | coating process of the viscous hygroscopic member of embodiment of this invention, Comprising: Fig.7 (a) arrange | positions a metal mask on a counter substrate, and applies a viscous hygroscopic member. 7B is a cross-sectional view taken along the line CC of FIG. 7A. It is a typical sectional view of a mother substrate for counter substrates in which a plurality of counter substrates are arranged.

Explanation of symbols

100 Organic EL Panel, 101 Substrate, 102 Anode, 103 Insulating Layer 104 Organic EL Layer, 105 Cathode, 106 Opposite Substrate, 107 Viscous Moisture Absorbing Member 108 Adhesive, 109 Cathode Auxiliary Wiring, 160 Opposite Substrate Mother Substrate 161 Step, 200 Application Device, 201 Stage, 202 Dispenser 203 Needle, 204 Nozzle, 205 Moving means, 206 Control device 300, 301, 302 Metal mask, 300a, 301a, 302a Opening 302b Bent part, 400, 401 Press member, 401a Uneven surface

Claims (9)

A method of manufacturing an optical device having a first substrate, a second substrate, and an element formed in a sealed space between the first substrate and the second substrate,
Providing a wall on the second substrate surrounding a predetermined region of the second substrate surface;
Applying a viscous hygroscopic member to the inside of the wall on the second substrate, pressing the applied viscous hygroscopic member and spreading the inner side of the wall;
A method of manufacturing an optical device, comprising: adhering the first substrate and the second substrate so that the viscous hygroscopic member is disposed in the sealed space.   A mask having an opening in a predetermined region is disposed in close contact with the second substrate to provide a wall surrounding the predetermined region on the surface of the second substrate, and the mask is attached to the first substrate after the viscous moisture absorbing member is spread. The manufacturing method according to claim 1, wherein the manufacturing method is removed from the second substrate.   The manufacturing method of Claim 1 or 2 which presses and spreads the said viscous moisture absorbing member, moving the pressing member which presses the said viscous moisture absorbing member in the direction which goes to the said 2nd board | substrate surface.   The manufacturing method of Claim 1 or 2 which presses and spreads the said viscous moisture absorbing member, moving the pressing member which presses the said viscous moisture absorbing member along the surface on the said 2nd board | substrate.   The manufacturing method according to claim 3 or 4, wherein the pressing member is positioned in contact with the upper surface of the wall, and the viscous hygroscopic member is pressed and spread so as to have a predetermined thickness.   The manufacturing method according to claim 3, 4 or 5, wherein an uneven surface is formed on a surface of the pressing member on the viscous moisture absorbing member side.   The manufacturing method according to claim 2, wherein the mask has a plurality of openings, and the viscous moisture absorbing member is applied to a plurality of locations on the second substrate.   The manufacturing method according to claim 2 or 7, wherein the mask is removed from the second substrate while gas is blown against the viscous moisture absorbing member.   The manufacturing method according to claim 2, 7 or 8, wherein a step is formed on the second substrate, and the mask is formed in a shape matching the step shape.

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