JP2003229408A5 - - Google Patents

Download PDF

Info

Publication number
JP2003229408A5
JP2003229408A5 JP2002027630A JP2002027630A JP2003229408A5 JP 2003229408 A5 JP2003229408 A5 JP 2003229408A5 JP 2002027630 A JP2002027630 A JP 2002027630A JP 2002027630 A JP2002027630 A JP 2002027630A JP 2003229408 A5 JP2003229408 A5 JP 2003229408A5
Authority
JP
Japan
Prior art keywords
ring
processed
processing apparatus
flat surface
surface portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002027630A
Other languages
English (en)
Japanese (ja)
Other versions
JP4209618B2 (ja
JP2003229408A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002027630A external-priority patent/JP4209618B2/ja
Priority to JP2002027630A priority Critical patent/JP4209618B2/ja
Priority to US10/498,478 priority patent/US7882800B2/en
Priority to PCT/JP2002/013016 priority patent/WO2003054947A1/ja
Priority to AU2002366921A priority patent/AU2002366921A1/en
Priority to TW091135997A priority patent/TWI272877B/zh
Priority to TW095107948A priority patent/TW200626020A/zh
Publication of JP2003229408A publication Critical patent/JP2003229408A/ja
Publication of JP2003229408A5 publication Critical patent/JP2003229408A5/ja
Publication of JP4209618B2 publication Critical patent/JP4209618B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002027630A 2001-12-13 2002-02-05 プラズマ処理装置及びリング部材 Expired - Fee Related JP4209618B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
PCT/JP2002/013016 WO2003054947A1 (fr) 2001-12-13 2002-12-12 Mecanisme en anneau, et dispositif de traitement de plasma utilisant ce mecanisme en anneau
AU2002366921A AU2002366921A1 (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
US10/498,478 US7882800B2 (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
TW095107948A TW200626020A (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材

Publications (3)

Publication Number Publication Date
JP2003229408A JP2003229408A (ja) 2003-08-15
JP2003229408A5 true JP2003229408A5 (OSRAM) 2005-07-14
JP4209618B2 JP4209618B2 (ja) 2009-01-14

Family

ID=27749086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002027630A Expired - Fee Related JP4209618B2 (ja) 2001-12-13 2002-02-05 プラズマ処理装置及びリング部材

Country Status (1)

Country Link
JP (1) JP4209618B2 (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303099A (ja) 2004-04-14 2005-10-27 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
JP4670311B2 (ja) * 2004-10-28 2011-04-13 住友精密工業株式会社 ドライエッチング装置
US8382941B2 (en) 2008-09-15 2013-02-26 Micron Technology, Inc. Plasma reactor with adjustable plasma electrodes and associated methods
JP5398358B2 (ja) 2009-05-29 2014-01-29 三菱重工業株式会社 基板支持台の構造及びプラズマ処理装置
JP6085079B2 (ja) 2011-03-28 2017-02-22 東京エレクトロン株式会社 パターン形成方法、処理容器内の部材の温度制御方法、及び基板処理システム
JP2015005634A (ja) * 2013-06-21 2015-01-08 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US20160099162A1 (en) * 2013-06-26 2016-04-07 Applied Materials, Inc. Single ring design for high yield, substrate extreme edge defect reduction in icp plasma processing chamber
US20150001180A1 (en) * 2013-06-28 2015-01-01 Applied Materials, Inc. Process kit for edge critical dimension uniformity control
US20170002465A1 (en) * 2015-06-30 2017-01-05 Lam Research Corporation Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity
JP6966286B2 (ja) 2017-10-11 2021-11-10 東京エレクトロン株式会社 プラズマ処理装置、フォーカスリングの昇降制御方法およびフォーカスリングの昇降制御プログラム
WO2020081644A1 (en) 2018-10-18 2020-04-23 Lam Research Corporation Lower plasma exclusion zone ring for bevel etcher
JP7541005B2 (ja) * 2018-12-03 2024-08-27 アプライド マテリアルズ インコーポレイテッド チャックとアーク放電に関する性能が改良された静電チャック設計
KR20220024568A (ko) 2019-06-18 2022-03-03 램 리써치 코포레이션 기판 프로세싱 시스템들을 위한 감소된 직경 캐리어 링 하드웨어
CN116469803B (zh) * 2023-04-17 2024-11-05 浙江海纳半导体股份有限公司 一种去边设备

Similar Documents

Publication Publication Date Title
JP2003229408A5 (OSRAM)
WO2003009363A1 (fr) Processeur a plasma et procede de traitement au plasma
KR20180084647A (ko) 플라즈마 처리 장치
TW200520632A (en) Focus ring and plasma processing apparatus
TW200741860A (en) Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
TW200711029A (en) Substrate processing apparatus and substrate stage used therein
TW200507156A (en) Plasma processing apparatus, focus ring, and susceptor
MY154832A (en) Actively heated aluminium baffle component having improved particle performance and methods of use and manufacture thereof
JP2004235623A5 (OSRAM)
TW200644117A (en) Plasma processing apparatus and plasma processing method
JP2007250967A5 (OSRAM)
KR20150068312A (ko) 플라즈마 처리 장치 및 포커스 링
TW200636851A (en) Etching method and device
TW201604954A (zh) 電漿體蝕刻裝置
WO2009063755A1 (ja) プラズマ処理装置および半導体基板のプラズマ処理方法
JP2011512021A (ja) 基板処理装置及び基板処理方法
JP2009246172A (ja) プラズマ処理装置
WO2007038514A3 (en) Apparatus and method for substrate edge etching
WO2005009089A3 (en) Plasma processing apparatus
JP2012049376A5 (OSRAM)
CN104425202A (zh) 等离子处理装置
JP2012104579A5 (OSRAM)
JP2019061849A5 (OSRAM)
IL164439A0 (en) Silicon parts for plasma reaction chambers
JP2003264169A5 (OSRAM)