JP2003226967A5 - - Google Patents

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Publication number
JP2003226967A5
JP2003226967A5 JP2002028112A JP2002028112A JP2003226967A5 JP 2003226967 A5 JP2003226967 A5 JP 2003226967A5 JP 2002028112 A JP2002028112 A JP 2002028112A JP 2002028112 A JP2002028112 A JP 2002028112A JP 2003226967 A5 JP2003226967 A5 JP 2003226967A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002028112A
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Japanese (ja)
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JP4101524B2 (ja
JP2003226967A (ja
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Publication date
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Priority to JP2002028112A priority Critical patent/JP4101524B2/ja
Priority claimed from JP2002028112A external-priority patent/JP4101524B2/ja
Publication of JP2003226967A publication Critical patent/JP2003226967A/ja
Publication of JP2003226967A5 publication Critical patent/JP2003226967A5/ja
Application granted granted Critical
Publication of JP4101524B2 publication Critical patent/JP4101524B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002028112A 2002-02-05 2002-02-05 成膜装置 Expired - Fee Related JP4101524B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002028112A JP4101524B2 (ja) 2002-02-05 2002-02-05 成膜装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002028112A JP4101524B2 (ja) 2002-02-05 2002-02-05 成膜装置

Publications (3)

Publication Number Publication Date
JP2003226967A JP2003226967A (ja) 2003-08-15
JP2003226967A5 true JP2003226967A5 (cg-RX-API-DMAC10.html) 2005-08-11
JP4101524B2 JP4101524B2 (ja) 2008-06-18

Family

ID=27749431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002028112A Expired - Fee Related JP4101524B2 (ja) 2002-02-05 2002-02-05 成膜装置

Country Status (1)

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JP (1) JP4101524B2 (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116605A (ja) * 2008-11-13 2010-05-27 Fujikura Ltd ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法
JP5995419B2 (ja) * 2011-09-01 2016-09-21 株式会社東芝 スパッタリングターゲット及びそれを用いた磁気メモリの製造方法
WO2013088600A1 (ja) 2011-12-12 2013-06-20 キヤノンアネルバ株式会社 スパッタリング装置、ターゲットおよびシールド
JP5708472B2 (ja) * 2011-12-21 2015-04-30 住友金属鉱山株式会社 マグネトロンスパッタリングカソード及びこれを備えたスパッタリング装置
RU2665059C2 (ru) * 2013-04-08 2018-08-28 Эрликон Серфиз Солюшнз Аг, Пфеффикон Мишень для распыления, имеющая увеличенную энергетическую совместимость
JP6339871B2 (ja) * 2014-06-19 2018-06-06 東京エレクトロン株式会社 板状部材の固定機構、ｐｖｄ処理装置及び板状部材の固定方法
JP6508774B2 (ja) * 2015-06-09 2019-05-08 株式会社高純度化学研究所 スパッタリングターゲット組立体
TWI788618B (zh) * 2019-01-25 2023-01-01 美商應用材料股份有限公司 物理氣相沉積靶材組件

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