JP2003218472A5 - - Google Patents

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Publication number
JP2003218472A5
JP2003218472A5 JP2002014369A JP2002014369A JP2003218472A5 JP 2003218472 A5 JP2003218472 A5 JP 2003218472A5 JP 2002014369 A JP2002014369 A JP 2002014369A JP 2002014369 A JP2002014369 A JP 2002014369A JP 2003218472 A5 JP2003218472 A5 JP 2003218472A5
Authority
JP
Japan
Prior art keywords
module
substrate
back surface
ground electrode
module substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002014369A
Other languages
English (en)
Japanese (ja)
Other versions
JP4171218B2 (ja
JP2003218472A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002014369A priority Critical patent/JP4171218B2/ja
Priority claimed from JP2002014369A external-priority patent/JP4171218B2/ja
Priority to US10/222,850 priority patent/US6735087B2/en
Publication of JP2003218472A publication Critical patent/JP2003218472A/ja
Publication of JP2003218472A5 publication Critical patent/JP2003218472A5/ja
Application granted granted Critical
Publication of JP4171218B2 publication Critical patent/JP4171218B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002014369A 2002-01-23 2002-01-23 表面実装モジュール Expired - Fee Related JP4171218B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002014369A JP4171218B2 (ja) 2002-01-23 2002-01-23 表面実装モジュール
US10/222,850 US6735087B2 (en) 2002-01-23 2002-08-19 Module and surface-mounted module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002014369A JP4171218B2 (ja) 2002-01-23 2002-01-23 表面実装モジュール

Publications (3)

Publication Number Publication Date
JP2003218472A JP2003218472A (ja) 2003-07-31
JP2003218472A5 true JP2003218472A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2005-07-28
JP4171218B2 JP4171218B2 (ja) 2008-10-22

Family

ID=19191869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002014369A Expired - Fee Related JP4171218B2 (ja) 2002-01-23 2002-01-23 表面実装モジュール

Country Status (2)

Country Link
US (1) US6735087B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4171218B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD109781S1 (zh) * 2003-08-27 2006-03-21 東芝股份有限公司 半導體元件
TWI220787B (en) * 2003-10-24 2004-09-01 Asustek Comp Inc Electric device with electrostatic discharge protection structure thereof
JP4418250B2 (ja) * 2004-02-05 2010-02-17 株式会社ルネサステクノロジ 高周波回路モジュール
JP2005277075A (ja) * 2004-03-24 2005-10-06 Kyocera Corp 配線基板
US7902654B2 (en) * 2006-05-10 2011-03-08 Qualcomm Incorporated System and method of silicon switched power delivery using a package
JP5460983B2 (ja) * 2008-08-01 2014-04-02 トヨタ紡織株式会社 ボード
TWI490117B (zh) * 2010-11-24 2015-07-01 Nat Univ Tsing Hua 具氮化鋁薄膜之熱擴散元件及其製作方法
CN102623416B (zh) * 2012-04-24 2015-09-02 苏州远创达科技有限公司 一种射频功放模块的功率器件无封装结构及其组装方法
US9941242B2 (en) 2012-04-24 2018-04-10 Innogration (Suzhou) Co., Ltd. Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4858071A (en) * 1987-02-24 1989-08-15 Nissan Motor Co., Ltd. Electronic circuit apparatus
FR2674078B1 (fr) * 1991-03-12 1994-10-07 Thomson Trt Defense Emetteur-recepteur hyperfrequence utilisant la technique des circuits imprimes multicouches.
EP0586888B1 (en) * 1992-08-05 2001-07-18 Fujitsu Limited Three-dimensional multichip module
JP3252605B2 (ja) * 1994-07-04 2002-02-04 株式会社村田製作所 電子部品及びその製造方法
US6031723A (en) * 1994-08-18 2000-02-29 Allen-Bradley Company, Llc Insulated surface mount circuit board construction
JPH10241996A (ja) * 1997-02-26 1998-09-11 Ngk Spark Plug Co Ltd 積層回路
US5963429A (en) * 1997-08-20 1999-10-05 Sulzer Intermedics Inc. Printed circuit substrate with cavities for encapsulating integrated circuits
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
JP2001024312A (ja) * 1999-07-13 2001-01-26 Taiyo Yuden Co Ltd 電子装置の製造方法及び電子装置並びに樹脂充填方法

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