JP2003207690A - Optical fiber array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical fiber array which has a substrate and a lid part securely fixed across an adhesion layer, is free of peeling between the substrate and lid part, and adhesion layer and a shift of the position of an optical fiber, and can accurately transmit a light signal. <P>SOLUTION: The optical fiber array comprises the substrate and lid part which are fixed across the adhesion layer and has a plurality of grooves formed in a portion of the surface of the substrate or lid part and optical fibers stored in the grooves, and is characterized in that the transmissivity of the whole of or some area of the substrate and/or lid part to ultraviolet rays perpendicular to a main surface is 65 to 100%. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an optical fiber array.

[0002]

2. Description of the Related Art In recent years, attention has been focused on optical fibers mainly in the communication field. Particularly in the IT (information technology) field, communication technology using optical fibers is required to maintain a high-speed Internet network. Optical fiber has the features of low loss, high bandwidth, small diameter / light weight, no induction, resource saving, etc. In the communication system using the optical fiber having this feature, the communication using the conventional metallic cable is used. Compared with the system, the number of repeaters can be greatly reduced, construction and maintenance are facilitated, and the communication system can be made economical and highly reliable.

Further, in the optical fiber, not only the light of one wavelength but also the light of many different wavelengths can be simultaneously multiplexed and transmitted by one optical fiber, so that it has a large capacity for various purposes. This has a great advantage that a transmission line can be realized and a video service can be supported.

In optical communication using an optical fiber, an optical fiber ribbon in which a plurality of optical fibers are arranged in parallel and a coating resin layer is formed around the optical fibers is used. Then, this optical fiber ribbon is used for a light receiving element, a light emitting element, various terminal devices (personal computer, mobile, game, etc.)
In order to connect with the optical fiber ribbon, the coating resin layer at the end of the optical fiber ribbon is usually removed to expose the ends of the plurality of optical fibers, and the exposed optical fibers are mounted in the groove of the substrate having the V groove. There is used an optical fiber array in which a plurality of optical fibers are arranged at a predetermined interval by placing, fixing, and further attaching a lid portion covering the exposed optical fibers to a substrate via an adhesive layer.

Therefore, conventionally, as an optical fiber array, for example, the optical fibers are housed in alignment with each of a plurality of V grooves formed on a substrate, and the optical fibers are covered with an adhesive layer on the substrate. Thus, the one with the lid attached is disclosed.

[0006]

In such an optical fiber array, when the optical fiber array is connected to an optical element or when an external force due to heat or humidity is applied to the optical fiber array, The position of the optical fiber may be displaced or the optical fiber may be damaged in some cases, causing the connection failure between the optical fiber array and the optical element such as the light receiving element or the light emitting element. Was sometimes. It is considered that such positional deviation of the optical fiber, breakage of the optical fiber and the like occur due to insufficient adhesion between the substrate and the lid and the adhesive layer.

Specifically, in the conventional optical fiber array, for example, a cured product of an ultraviolet curable resin composition is used as the adhesive layer for fixing the substrate and the optical fiber or the lid. However, when manufacturing an optical fiber array using an adhesive layer made of such a material, usually, after filling the uncured ultraviolet curable resin composition in the gap between the substrate and the optical fiber or the lid, The uncured resin composition was cured by irradiating with ultraviolet rays through the substrate or the lid, and the substrate and the lid were fixed via the adhesive layer (cured product of the ultraviolet curable resin composition). .

However, when irradiated with ultraviolet rays, the uncured resin composition may not be sufficiently irradiated with ultraviolet rays and the resin composition may not be sufficiently cured. In this case, the uncured resin composition is At the starting point, cracks may occur in the adhesive layer, or peeling may occur between the adhesive layer and the substrate or lid. As a result, it is considered that the cause of this is a positional shift of the optical fiber or damage to the optical fiber.

[0009]

Therefore, the present inventors have
As a result of earnest studies on means for solving the above-mentioned various problems, it was found that the adhesion between the substrate and the lid and the adhesive layer should be improved. It was found that the transmittance of ultraviolet rays should be set to a predetermined value, and the optical fiber array of the present invention was completed.

That is, the optical fiber array of the present invention is
An optical fiber array comprising a substrate fixed via an adhesive layer and a lid, wherein a plurality of grooves are formed on a part of the surface of the substrate or the lid, and an optical fiber is housed in the groove. The ultraviolet transmittance in the direction perpendicular to the main surface in all or a part of the area of the substrate and / or the lid is 65 to 100%. Also,
The transmittance is preferably 70 to 100%.

In the optical fiber array of the present invention, a plurality of grooves are formed on the surface of the substrate, and the substrate includes a member capable of forming grooves having a desired shape by etching. Is desirable.

Further, in the optical fiber array of the present invention, a plurality of grooves are formed on the surface of the lid, and the lid includes a member capable of forming a groove having a desired shape by etching. It is also desirable to have been done.

In the above optical fiber array, it is preferable that the transmittance of the ultraviolet rays is a transmittance per 1 mm of a light having a wavelength of 360 nm.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The optical fiber array of the present invention will be described below. The optical fiber array of the present invention comprises a substrate fixed with an adhesive layer and a lid, a plurality of grooves are formed in a part of the surface of the substrate or the lid, and the optical fiber is housed in the groove. The optical fiber array described above is characterized in that the transmittance of ultraviolet rays in the direction perpendicular to the main surface is 65 to 100% in all or a part of the area of the substrate and / or the lid.

In the optical fiber array of the present invention, the transmittance of ultraviolet rays in the direction perpendicular to the main surface (hereinafter, also simply referred to as transmittance) in the whole or a part of the area of the substrate and / or the lid is in the above range. Therefore, in the production of the optical fiber array of the present invention, when ultraviolet rays are radiated through the substrate or the lid having the above-mentioned transmittance, the ultraviolet rays are surely radiated to the uncured adhesive layer. In the optical fiber array thus constructed, the substrate and the lid are securely fixed via the adhesive layer. Therefore, in the optical fiber array of the present invention, the optical signal can be accurately transmitted without causing the positional deviation of the optical fiber or the damage of the optical fiber as described above.

Further, in the optical fiber array of the present invention in which the optical fibers are aligned, it is possible to easily perform alignment with a light receiving component (for example, a waveguide, an AWG module, etc.) that receives the light from the optical fiber. In addition, it is possible to determine the positional deviation of the optical fiber or the optical fiber array, the defect of the adhesive agent, etc. by visual inspection or a device having a camera, and perform screening in advance. Furthermore, when the target mark for alignment with the light receiving component is formed on the substrate or the like, the substrate and / or the lid has good light transmittance,
The position of the optical fiber array can be accurately aligned.

Embodiments of the optical fiber array of the present invention will be described below with reference to the drawings. The embodiments of the optical fiber array of the present invention are not limited to those illustrated below.

FIG. 1A is a partial perspective view schematically showing an example of the embodiment of the optical fiber array of the present invention.
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows the lid part which comprises the optical fiber array of (a), (d) is a partial perspective view which shows the board | substrate which accommodated the optical fiber which comprises the optical fiber array of (a).

As shown in FIG. 1, the optical fiber array 10
In 00, the optical fiber 115 is housed and fixed to each of the plurality of V grooves 157 formed in parallel on a part of the upper surface of the substrate 151 via the adhesive layer 159. A lid 160 is fixed on a substrate 151 accommodating the optical fiber ribbon 110 via an adhesive layer 159, and a portion of the optical fiber 115 (a groove 157 of the optical fiber is attached to the lid 160). A part 161 which is not stored in the above is collectively formed. In the above optical fiber array, the groove formed on the upper surface of the substrate is not limited to the V groove, and for example, a groove having a rectangular cross section in a direction perpendicular to the axis of the optical fiber may be used. Good.

Further, in the optical fiber array 100 of the present invention, in addition to the groove 157, a coating resin layer holding portion 158 for holding the optical fiber together with the coating resin layer 114 around it is provided on the upper surface of the substrate 151. Has been formed. The upper surface of the coating resin layer holding portion 158 is lower than the groove forming surface in which the groove 157 is formed. Further, an adhesive layer 159 ′ is formed around the coating resin layer 114 placed on the coating resin layer holding portion 158. The coating resin layer holding portion 158 may be formed as needed,
Only the V groove may be formed on the substrate.

In addition, in the optical fiber array 1000, the boundary between the groove forming surface and the coating resin layer holding portion is a wall surface that is inclined toward the coating resin layer holding portion. When the boundary between the groove forming surface and the coating resin layer holding portion has such a shape, it is possible to reduce the load applied to the optical fiber when the optical fiber is housed. In the present specification, the wall surface of the boundary between the groove forming surface and the coating resin layer holding portion is also included in the coating resin layer holding portion. Further, in such an optical fiber array in which the boundary between the groove forming surface and the covering resin layer holding portion is a wall surface having an inclination, the optical fiber exposed in the groove is fixed, and the exposed optical fiber in the covering resin layer holding portion is fixed. And the coating resin layer are fixed. In the figure, 111 is a core and 112 is a clad.

Examples of the material of the substrate and the lid include inorganic materials such as silicon, silicon carbide, alumina, aluminum nitride, mullite, ceramics, gallium arsenide, zirconia; quartz glass, high silicate glass, soda lime glass. , Glass such as borosilicate glass, lead glass, and fluoride glass; metal materials such as copper, iron, and nickel; thermosetting resins, thermoplastic resins, photosensitive resins, organic materials such as composites thereof, and organic materials thereof Examples include materials impregnated with a reinforcing material such as glass fiber. The material of the lid and the material of the substrate may be the same or different.

In the optical fiber array of the present invention, the transmittance of ultraviolet rays in the direction perpendicular to the main surface in all or a part of the area of the substrate and / or the lid is 65 to 100%.
Is. The above transmittance is preferably 70 to 100%. This is because when such a transmittance is provided, the alignment is improved in the adhesive layers made of various kinds of materials. The material having a transmittance in the above range, for example, quartz glass, high silicate glass, soda lime glass, borosilicate glass, lead glass, inorganic materials such as fluoride glass, thermosetting resin, thermoplastic resin, Examples include photosensitive resins and organic materials such as composites thereof. Of these, high silicate glass is desirable. Therefore,
In the optical fiber array of the present invention, it is desirable that at least one of the substrate and the lid includes the above-mentioned material. Further, the above-mentioned transmittance of the substrate and the lid portion depends not only on the material of the substrate and the lid portion but also on the thickness of the substrate and the lid portion and their surface condition (whether they are a smooth surface or a rough surface). It will change. Therefore, in order to control the transmittance of the substrate and / or the lid within the above range, the above-mentioned material, surface condition, etc. may be controlled appropriately.

Further, the above-mentioned materials having excellent ultraviolet ray transmittance are also usually excellent in visible ray transmittance. Therefore, for example, when forming an alignment mark on a substrate when forming a groove on the substrate and using a lid made of the above-mentioned material, use this alignment mark for aligning the lid. Furthermore, when connecting the optical fiber array to other optical components, the alignment marks formed on the substrate and the alignment marks previously formed on the optical component are used to align the two. Can be done mechanically. Normally, when connecting an optical fiber array and other optical components, light was introduced into the optical fiber, etc., and both were aligned so that the peak of light was maximized. It takes time to connect the optical fiber array and the optical component by using such a positioning method. On the other hand, in the mechanical connection using the alignment mark formed on the optical fiber array and the alignment mark formed on the optical component, the alignment of the both can be performed in a short time and the light It can be performed with the same accuracy as active alignment in which the alignment is performed.
In addition, here, the alignment mark is formed on the substrate,
Although the description has been given as to the effect of using the lid made of the above-mentioned material, the same effect can be obtained when the alignment mark is formed on the lid and the substrate made of the above-mentioned material is used.

Further, in the present specification, ultraviolet rays mean light having a wavelength of 240 to 500 nm. The ultraviolet ray transmittance of 65 to 100% means that the above-mentioned wavelength range (2
40 to 500 nm) in the entire region, 65 to 100%
It does not mean that it has a transmittance of 6 to 100% at any wavelength in the above wavelength range.

Further, the transmittance of the above-mentioned ultraviolet rays has a wavelength of 360
It is desirable that the transmittance is per 1 mm of the length of nm light. Specifically, ultraviolet light having a wavelength of 360 nm and an intensity of I ₀ is incident on the substrate and / or the lid portion in a direction perpendicular to the main surface thereof, and passes through the substrate and / or the lid portion for 1 mm to exit. upon the in has, when the strength of the outcoming light is I _t, it is desirable that the value calculated by the following equation (1).

Transmittance (%) = I _t / I ₀ × 100 (1)

In the optical fiber array of the present invention, a plurality of grooves are formed on the surface of the substrate, and the substrate includes a member capable of forming grooves having a desired shape by etching. Is desirable. In such an optical fiber array, the accommodating accuracy of the optical fibers is excellent. When manufacturing an optical fiber array, the groove for housing the optical fiber is usually formed by machining or etching in consideration of the material of the member forming the groove, but it is formed by etching. The groove is superior in relative positional accuracy to the groove formed by machining. This is because when a groove is formed by etching, a plurality of grooves can be formed at once, so that variations in the distance between adjacent grooves are less likely to occur, whereas the groove is formed by machining. In this case, since the individual grooves are formed separately, variations occur in each groove, and the spacing between adjacent grooves also tends to vary.

FIG. 2A is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention,
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 2, the optical fiber array 20
In 00, the optical fiber 115 is provided in each of the plurality of V grooves 2157 formed in parallel on a part of the upper surface of the substrate 2151.
Are stored and fixed via the adhesive layer 2159. In addition, a lid portion 2160 is fixed on a substrate 2151 that houses the optical fiber ribbon 110 via an adhesive layer 2159. In this optical fiber array 2000, the substrate 2151 has a plate-shaped holding member 2151a, and its width (L _{2 in the} drawing) and depth (L _{1 in the} drawing) are both smaller than that of the holding member 2151a. A groove forming member 2151b having a plurality of V grooves 2157 formed on its upper surface is formed.

Further, in the optical fiber array 2000, a part of the upper surface of the holding member 2151a where the groove forming member 2151b is not laminated holds the optical fiber together with the coating resin layer 114 around the optical fiber. The coating resin layer holding portion 2158 plays a role, and the coating resin layer 11 placed on the coating resin layer holding portion 2158.
An adhesive layer 2159 ′ is formed around the periphery of No. 4.

The optical fiber array 200 having such a configuration
In No. 0, it is desirable that the groove forming member 2151b is a member that can form a groove having a desired shape by etching. Specific examples of the material of such a member include silicon and gallium arsenide.

Further, in the optical fiber array 2000, the material of the lid portion 2160 is preferably such that the transmittance of ultraviolet rays in the direction perpendicular to the main surface is 65 to 100%, and 70 to 10
What is 0% is more desirable. When such a lid is used and a cured product of the ultraviolet curable resin composition is used as the adhesive layer, when producing an optical fiber array,
This is because the substrate and the lid can be reliably fixed to each other via the adhesive layer by irradiating with ultraviolet rays through the lid. Further, it is desirable that the material of the holding member 2151a forming the substrate also has a transmittance within the above range.

FIG. 3 (a) is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention.
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 3, the optical fiber array 30
In 00, the optical fiber 115 is provided in each of the plurality of V grooves 3157 formed in parallel on a part of the upper surface of the substrate 3151.
Are stored and fixed via an adhesive layer 3159. Further, a lid portion 3160 is fixed on a substrate 3151 that accommodates the optical fiber ribbon 110 via an adhesive layer 3159. In this optical fiber array 3000, a substrate 3151 has a holding member 3151a in which a concave portion having a rectangular cross section is formed in a part thereof, the width thereof is equal to the width of the concave portion, and the depth thereof is larger than the depth of the concave portion. The groove forming member 1151b is small and has a plurality of V grooves 3157 formed on the upper surface thereof.
51b is housed in the recess of the holding member 3151a so that its one end surface is aligned with the one end surface of the holding member 3151b.

Further, in the optical fiber array 3000, of the concave portions formed in the holding member 3151a, the portion in which the groove forming member is not housed holds the optical fiber together with the coating resin layer 114 around the optical fiber. Of the coating resin layer holding portion 3158, and the coating resin layer 11 placed on the coating resin layer holding portion 3158.
An adhesive layer 3159 ′ is formed around the periphery of No. 4.

The optical fiber array 300 having such a configuration
Even in 0, the groove forming member 3151b is preferably a member that can form a groove having a desired shape by etching. Also in the optical fiber array 3000, the material of the lid portion 3160 is preferably such that the transmittance of ultraviolet rays in the direction perpendicular to the main surface is 65 to 100%,
More preferably, it is 70 to 100%. Furthermore, it is desirable that the material of the holding member 3151a that constitutes the substrate also has a transmittance within the above range.

FIG. 4A is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention,
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 4, the optical fiber array 40
In 00, the optical fiber 115 is provided in each of the plurality of V grooves 4157 formed in parallel on a part of the upper surface of the substrate 4151.
Are stored and fixed via an adhesive layer 4159. A lid 4160 is fixed on the substrate 4151 housing the optical fiber ribbon 110 via an adhesive layer 4159. In this optical fiber array 4000, the substrate 4151 includes a plate-shaped holding member 4151a and a plurality of Vs.
The groove 4157 and the coating resin layer holding portion 4158 are separately formed in different regions, and further, the width thereof is larger than that of the holding member 4151.
The holding member 4151 is smaller than a and has a depth
and a groove forming member 4151b equal to a. Further, an adhesive layer 4159 ′ is formed around the coating resin layer 114 placed on the coating resin layer holding portion 4158.

The optical fiber array 400 having such a configuration
Even in 0, the groove forming member 4151b is preferably a member capable of forming a groove having a desired shape by etching. Also in the optical fiber array 4000, the material of the lid portion 4160 is preferably such that the transmittance of ultraviolet rays in the direction perpendicular to the main surface is 65 to 100%,
More preferably, it is 70 to 100%. Furthermore, it is desirable that the material of the holding member 4151a that constitutes the substrate also has a transmittance within the above range.

In the optical fiber array of the present invention, a plurality of grooves are formed on the surface of the lid portion, and the lid portion includes a member capable of forming the groove having a desired shape by etching. It is also desirable to be present. In such an optical fiber array, the accommodating accuracy of the optical fibers is excellent.

FIG. 5 (a) is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention.
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 5, the optical fiber array 50.
00, the optical fiber 115 is provided in each of the plurality of V grooves 5157 formed in parallel on a part of the surface of the lid portion 5160.
Are accommodated and fixed via the adhesive layer 5159. Further, the lid portion 5160 accommodating the optical fiber ribbon 110 and the substrate 5151 are fixed via an adhesive layer 5159. In this optical fiber array 5000, a lid portion 5160 has a plate-shaped holding member 5160a, a width thereof is smaller than that of the holding member 5160a, a depth thereof is equal to that of the holding member 5160, and a plurality of V grooves 515 are formed on the surface thereof.
7 is formed on the groove forming member 5160b. Further, the coating resin layer 114 is attached to the substrate 5151 via an adhesive layer 5159 'formed around it.

The optical fiber array 500 having such a configuration
At 0, the groove forming member 5160b is preferably a member capable of forming a groove having a desired shape by etching. Specific examples of the material thereof include silicon and gallium arsenide. Further, in the optical fiber array 5000, the material of the substrate 5151 preferably has a transmittance of ultraviolet rays in the direction perpendicular to the main surface of 65 to 100%, more preferably 70 to 100%.

When such a lid is used and a cured product of the ultraviolet curable resin composition is used as the adhesive layer, the substrate is irradiated with ultraviolet rays through the substrate when the optical fiber array is manufactured. This is because the lid and the lid can be reliably fixed to each other via the adhesive layer. Furthermore, it is desirable that the material of the holding member 5160a that constitutes the lid portion also has a transmittance within the above range.

FIG. 6A is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention.
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 6, the optical fiber array 60.
In 00, the optical fiber 115 is provided in each of the plurality of V grooves 6157 formed in parallel on a part of the surface of the lid portion 6160.
Are stored and fixed via an adhesive layer 6159. The lid 6160 accommodating the optical fiber ribbon 110 and the substrate 6151 are fixed via an adhesive layer 6159. In this optical fiber array 6000, the lid portion 6160 is plate-shaped, and the width and depth of the lid portion 6160 are the substrate 615.
1 and a groove forming member 5160b having a width and depth smaller than that of the holding member 6160a and a plurality of V grooves 5157 formed on the surface thereof.
It consists of and. In addition, the coating resin layer 114 is formed on the substrate 6 via the adhesive layer 6159 'formed around it.
151 and the lid (holding member 6160a).

The optical fiber array 600 having such a configuration
Even in 0, the groove forming member 6160b is preferably a member that can form a groove having a desired shape by etching. Also in the optical fiber array 6000, the material of the substrate 6151 is preferably such that the transmittance of ultraviolet rays in the direction perpendicular to the main surface is 65 to 100%,
More preferably, it is 70 to 100%. Furthermore, it is desirable that the material of the holding member 6160a that constitutes the lid portion also has a transmittance within the above range.

FIG. 7A is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention.
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 7, an optical fiber array 70 is provided.
In 00, the optical fiber 115 is provided in each of the plurality of V grooves 7157 formed in parallel on a part of the surface of the lid portion 7160.
Are stored and fixed via the adhesive layer 7159. Further, the lid portion 7160 accommodating the optical fiber ribbon 110 and the substrate 7151 are fixed via an adhesive layer 7159. In this optical fiber array 7000, a lid portion 7160 has a holding member 7160a in which a concave portion having a rectangular cross section is formed, and its width and depth are equal to the width and depth of the concave portion and its surface. And a groove forming member 7160b in which a plurality of V grooves 7157 are formed in the holding member 7160b. The groove forming member 7160b is formed so that both end surfaces thereof are aligned with the end surface of the holding member 7160a.
It is stored in 160a. Note that the lid portion 7160 has the same width as that of the substrate 7151, but the depth thereof is smaller than that of the substrate 7151. In addition, the coating resin layer 114
Through the adhesive layer 7159 'formed around it,
It is attached to the substrate 7151.

The optical fiber array 700 having such a configuration
Even in 0, the groove forming member 7160b is preferably a member that can form a groove having a desired shape by etching. Also in the optical fiber array 7000, the material of the substrate 7151 is preferably such that the transmittance of ultraviolet rays in the direction perpendicular to the main surface is 65 to 100%,
More preferably, it is 70 to 100%. Furthermore, it is desirable that the material of the holding member 7160a that constitutes the lid portion also has a transmittance within the above range.

FIG. 8A is a partial perspective view schematically showing another embodiment of the optical fiber array of the present invention.
(B) is the sectional view on the AA line of (a), (c) is
It is a perspective view which shows only the lid part of (a), (d) is
It is a perspective view which shows only the board | substrate of (a).

As shown in FIG. 8, an optical fiber array 80
00, the optical fiber 115 is provided in each of the plurality of V grooves 8157 formed in parallel on a part of the surface of the lid portion 8160.
Are stored and fixed via an adhesive layer 8159. Further, the lid portion 8160 accommodating the optical fiber ribbon 110 and the substrate 8151 are fixed via an adhesive layer 8159. In this optical fiber array 8000, a lid portion 8160 has a holding member 8160a having a concave portion having a rectangular cross section formed in a part thereof, the width thereof is equal to the width of the concave portion, and the depth thereof is larger than the depth of the concave portion. And a groove forming member 8160b having a plurality of V grooves 8157 formed on the surface thereof.
60b is housed in the recess of the holding member 8160a such that its one end surface is aligned with the one end surface of the holding member 8160a. The lid 8160 has the same width and depth as the width and depth of the substrate 8151. In addition, the coating resin layer 114 has an adhesive layer 815 formed around it.
9 ', the substrate 8151 and the lid (holding member 81
60a).

Optical fiber array 800 having such a configuration
Even in 0, the groove forming member 8160b is preferably a member that can form a groove having a desired shape by etching. Also in the optical fiber array 8000, it is desirable that the material of the substrate 8151 has an ultraviolet transmittance of 65 to 100% in a direction perpendicular to the main surface,
More preferably, it is 70 to 100%. Furthermore, it is desirable that the material of the holding member 8160a that constitutes the lid portion also has a transmittance within the above range.

The optical fiber array 7000 shown in FIG.
And the optical fiber array 8000 shown in FIG. 8 is different from the optical fiber array 8000 in the depth of the holding member constituting the lid portion. In the optical fiber array 7000 shown in FIG.
8 is equal to the depth of the groove forming member 7160b, the optical fiber array 8000 shown in FIG.
The depth of the holding member 8160a is equal to that of the groove forming member 8160b.
Therefore, the concave portion formed in the holding member 8160a has a portion in which the groove forming member 8160b is not housed, and in this portion, the coating resin layer can be held via the adhesive layer. .

FIG. 9A is a perspective view schematically showing another embodiment of the optical fiber array of the present invention, and FIG.
Is a sectional view taken along line AA of (a), and (c) is (a).
3D is a perspective view showing only the lid portion of FIG. 3D, and FIG. 3D is a perspective view showing only the substrate of FIG.

As shown in FIG. 9, an optical fiber array 90
In 00, the optical fiber 115 is provided in each of the plurality of V grooves 9157 formed in parallel on a part of the surface of the substrate 9000.
Are stored and fixed via the adhesive layer 9159. Further, the lid 9160 accommodating the optical fiber ribbon 110 and the substrate 9151 are fixed via an adhesive layer 9159. In this optical fiber array 9000, the substrate 9151 has a plate-shaped holding member 9151a and a width and depth both smaller than those of the holding member, and a groove forming member 915 having a plurality of V grooves 9157 formed on the upper surface thereof.
1b and. Further, a groove forming member 9151a except that the lid portion 9160 does not have a plate-shaped body 9160a having the same shape as the holding member 9151a and the groove is formed.
And a plate-shaped body 9160b having the same shape as the above.

In the optical fiber array shown in FIG. 9,
It is desirable that the transmittance of ultraviolet rays in the direction perpendicular to the main surface of the holding member 9151a forming the substrate and / or the plate-shaped body 9160a forming the lid is 65 to 100%. In this case, even if the transmittance of the groove forming member 9151b that constitutes the substrate or the plate-shaped body 9160b that constitutes the lid is less than 65%, the transmittance of ultraviolet rays in a partial region of the substrate and / or the lid. Is from 65 to 100%. Further, the transmittance of the plate-shaped body 9160a is more preferably 70 to 100%.

Also in the optical fiber array 9000 having such a configuration, it is desirable that the groove forming member 9151b is a member capable of forming a groove having a desired shape by etching.

The optical fiber array 90 shown in FIG.
In No. 00, a plurality of V-grooves are formed on the groove forming member 9151b forming the substrate, but in the optical fiber array of the present invention, the V-groove is not formed on the groove forming member 9151b, and the lid portion is formed. V-shaped groove is formed in the plate-shaped body 9160b,
The optical fiber may be housed in the V-shaped groove formed in the plate-shaped body 9160b. Further, V grooves may be formed in both the groove forming member 9151b and the plate-shaped body 9160b, and the optical fibers may be housed in the V grooves of both of them.

Further, in the optical fiber array of the present invention shown in FIGS. 2 to 9, the boundary between the groove forming surface and the coating resin layer holding portion is a vertical wall surface, but as shown in FIG. The boundary of may be a wall surface having an inclination so as to descend toward the coating resin layer holding portion. This is because when the optical fiber is stored, the load applied to the optical fiber can be reduced.

Further, the optical fiber array of the present invention shown in FIGS. 1 to 9 has an effect peculiar to each embodiment.
This will be briefly described below. That is,
When manufacturing the optical fiber array as shown in FIGS. 2 and 3, when the groove forming member is attached to a predetermined position of the holding member, a part of the surface of the holding member serves as the covering resin layer holding portion. Therefore, it is not necessary to separately form the coating resin layer holding portion by machining or the like.

Further, in the optical fiber array of the form shown in FIG. 1, when the material of the substrate is silicon, there is no thick silicon, so that the substrate may be made too thick. It could not be done, and the silicon was likely to be chipped or cracked. On the other hand, in the optical fiber array shown in FIGS. 2 to 8, when the material of the groove forming member is silicon and the material of the holding member is other than silicon such as high silicate glass, silicon is used. Chips and cracks are less likely to occur.

Further, in the optical fiber array shown in FIGS. 2, 3 and 5-8, when the material of the groove forming member is silicon and the material of the holding member is other than silicon such as high silicate glass. Since the size of the groove forming member may be small as long as a predetermined groove can be formed, the number of the groove forming members to be manufactured increases.
When the material of the groove forming member is silicon, it is desirable that the size of the groove forming member is small also from the viewpoint of translucency of ultraviolet rays.

The embodiments of the present invention are not limited to those shown in FIGS. 1 to 9, and the ultraviolet rays in the direction perpendicular to the main surface in all or a part of the area of the substrate and / or the lid are transmitted. It is only necessary for the embodiment to have a ratio of 65 to 100%, and for example, one of the substrates forming the optical fiber array shown in FIGS. 1 to 9 and the lid portion forming the optical fiber array shown in FIGS. It may be a combination of any of the above and any of the above. Further, the outer shape of the optical fiber array may be appropriately processed in accordance with the shape of the mounting portion of the device or the like for mounting the optical fiber array.

In the optical fiber array of the present invention, the upper surface of the substrate (including the wall surface of the groove when formed),
The surface of the lid portion facing the substrate (when a groove is formed,
It is desirable that a roughened surface is formed on the wall surface). This is because the above-mentioned portion usually comes into contact with the adhesive layer, and thus the formation of the roughened surface improves the adhesiveness with the adhesive layer. This is because by forming the roughened surface, the contact area between the substrate and the lid and the adhesive layer is increased, and even if external stress is generated,
This is because the stress can be absorbed by the roughened surface.
Here, the external stress means a force externally applied due to heat or humidity, or a force due to a difference in coefficient of thermal expansion. Further, the roughened surface may be formed only on a part of the above-mentioned portion (for example, the wall surface of the groove), but is preferably formed on all of the above-mentioned portion. Of course,
The roughened surface may not be formed.

The surface roughness of this roughened surface is JIS B 0.
The average roughness Ra based on 601 is preferably 5 to 1000 nm. If the average roughness Ra is less than 5 nm, sufficient adhesion between the substrate or the lid and the adhesive layer may not be obtained, and further, due to the generated stress,
Misalignment of the optical fiber may occur. On the other hand, even if the average roughness Ra exceeds 1000 nm, the adhesiveness with the adhesive layer is not improved so much.
It is performed by pouring an uncured adhesive between the substrate and the lid and further performing a curing treatment. If the average roughness Ra exceeds 1000 nm, the uncured adhesive is filled. In this case, a part where no adhesive layer is formed or a void is generated, and from this part, a crack may occur in the adhesive layer or peeling may occur between the substrate and the lid part. There is.

Further, the average roughness Ra of the roughened surface is appropriately determined in consideration of the material of the substrate and the lid, etc. so that the adhesiveness with the adhesive layer is excellent. Is desirable. Specifically, for example, when a roughened surface is formed on a portion whose material is silicon, its average roughness Ra
The lower limit of is preferably 5 nm, more preferably 10 nm. On the other hand, the upper limit of the average roughness Ra is preferably 500 nm, and more preferably 100 nm. When a roughened surface is formed on a portion whose material is silicon, the average roughness Ra is 5 nm.
If it is less than 100 nm, it may not be possible to sufficiently relax the external stress when it occurs. On the other hand, if it exceeds 500 nm, when an uncured adhesive is filled at the time of production, this adhesive may have The filling may be hindered, and damage (chips, cracks, etc.) is likely to occur on the substrate and the lid.

When a roughened surface is formed on a portion whose material is glass, the lower limit of the average roughness Ra is 5
The thickness is preferably nm, and more preferably 10 nm. On the other hand, the upper limit of the average roughness Ra is 500 n.
The thickness is preferably m, and more preferably 100 nm. When a roughened surface is formed on a portion whose material is glass, the average roughness Ra is less than 5 nm,
When an external stress is generated, it may not be able to be sufficiently relaxed. On the other hand, if it exceeds 500 nm, the filling of the uncured adhesive is hindered when the uncured adhesive is filled during the production. In some cases, damage (chips, cracks, etc.) is likely to occur on the substrate and the lid.

The surface roughness of the roughened surface is JIS B 0.
The average spacing Sm of the unevenness based on 601 is 0.
It is desirable that the thickness is 1 μm and the upper limit is 100 μm.
If the average spacing Sm of the irregularities is less than 0.1 μm, sufficient adhesion between the substrate or lid and the adhesive layer may not be obtained. On the other hand, the average spacing Sm of the irregularities is 100 μm
Even if it exceeds, the adhesion with the adhesive layer does not improve so much,
When manufacturing an optical fiber array, it may hinder the filling of the uncured adhesive, in this case, a portion where the adhesive layer is not formed, starting from this portion, cracks occur in the adhesive layer, Peeling may occur between the substrate or the lid and the adhesive layer. A more desirable lower limit of the average spacing Sm of the irregularities is 1 μm, and a more desirable upper limit thereof is 50.
μm. When the average spacing Sm of the irregularities is within this range, the degree of freedom in selecting the material of the adhesive layer is improved, and
This is because it has been confirmed in the reliability test that no inconvenience occurs in the optical fiber array for a longer time.

Further, it is desirable that the roughened surface has a depression on the wall surface of the unevenness forming the roughened surface. In this way, when the uneven wall surface has a depression, the contact area between the substrate or the lid and the adhesive layer is larger, so that the adhesive strength is further improved and the peeling between the substrate or the lid and the adhesive layer is performed. Is less likely to occur.

The size of the depression formed on the uneven wall surface is
It is not particularly limited as long as it is smaller than the average interval Sm of the irregularities. Specifically, for example, when the roughened surface having the depressions is viewed in a plane with a microscope, the depressions are lined with a plurality of particulate matters. When observed as an image, it is desirable that the lower limit of the average particle diameter of the particulate matter is 100 nm and the upper limit thereof is 1000 nm. The more desirable lower limit of the average particle diameter is 200 nm, and the more desirable upper limit thereof is 500 nm. The average particle size of the particulate matter (hereinafter, simply referred to as the average particle size of the particulate matter) observed when the roughened surface having the depressions is viewed in a plane with a microscope or a scanning electron microscope (500 times or more). Is also one of the indexes showing the surface roughness of the roughened surface. The particle size of the particulate matter refers to the length of the longest part of the particulate matter.

Further, when the wall surface of the unevenness forming the roughened surface has a depression, the surface roughness of the roughened surface is determined according to JIS B.
It is desirable that the lower limit is 100 nm and the upper limit is 1000 nm in the average interval S of local peaks based on 0601. This is because the roughened surface having the average spacing S of the local peaks in this range has more excellent adhesion to the adhesive layer. The lower limit of the average spacing S of the local peaks is 200 nm
Is more preferable, and the average interval S of the local peaks is
The upper limit of is more preferably 500 nm.

The method for forming a roughened surface having a surface roughness within the above range on the substrate or the lid is not particularly limited, and examples thereof include a solution containing an acid, an alkali, an oxidizing agent, etc., a solvent, etc. Examples of the method include immersing the substrate and the lid in the liquid, or applying the liquid by spraying.
The specific method to be selected may be appropriately determined in consideration of the materials of the substrate and the lid, the surface roughness to be formed, and the like. Further, the formation of the roughened surface may be performed by mechanical polishing, or may be performed by combining mechanical polishing with a method using the above solution or solvent. Therefore, a method of forming a roughened surface on a portion made of high silicate glass and a method of forming a roughened surface on a portion made of silicon will be described below.

As a method of forming a roughened surface on the portion made of the high silicate glass, for example, etching using a roughening solution containing a fluoride can be mentioned. Specific examples of the roughening solution containing a fluoride are mentioned. Examples include, for example, HF aqueous solution, HF
-NH ₄ F mixture, NaF aqueous solution, BaF ₂ aqueous solution, K
F aqueous solution, CaF ₂ aqueous solution, XeF ₂ aqueous solution and the like can be mentioned. Among these, a solution containing HF is desirable.
This is because the roughened surface having the above-mentioned surface roughness can be formed in a short time.

Further, the following conditions are desirable as specific conditions for forming a roughened surface having the above-mentioned surface roughness by using an HF aqueous solution in the portion made of the high silicate glass. That is, the concentration of the HF aqueous solution is HF:
H ₂ O = 1: 10 to 1:30 is desirable, and HF: H ₂ O
= 1: 20 is more desirable. The lower limit of the etching temperature is preferably 30 ° C, and more preferably 40 ° C. On the other hand, the upper limit of the etching temperature is preferably 80 ° C, more preferably about 50 ° C. Furthermore, the etching time is 1
It is preferably 0 to 120 minutes, more preferably about 30 minutes.

Further, normally, even if an attempt is made to perform etching on a high silicate glass plate having a smooth surface, the etching is difficult to proceed. This is because the etching using the roughening solution is
This is because the high silicate glass progresses (erodes) starting from irregularities and scratches on the surface, and therefore the high silicate glass having a smooth surface has few starting points for etching. Therefore, when forming a roughened surface by etching using the roughening liquid in the portion made of the high silicate glass,
It is desirable to preliminarily perform a pretreatment such as a polishing treatment so that the surface of the high silicate glass is ground into a glass shape. Specifically, one-side grain polishing (# 500, # 700, # 1000,
# 1500), alumina-based abrasive grains, diamond abrasive grains or the like is preferably used for polishing. Further, commercially available ground glass may be used.

As a method of forming a roughened surface on the portion made of silicon, for example, etching using a solution containing an alkali such as KOH or NaOH can be mentioned. Among these, etching using a solution containing KOH is desirable. This is because the etching rate is high and the roughened surface can be formed in a short time. When etching is performed using a solution containing NaOH, in some cases,
The treated surface may be discolored or foreign matter may occur on the treated surface.

The following conditions are desirable as specific conditions for forming a roughened surface having the above-mentioned surface roughness using a solution containing KOH in the portion made of silicon. That is, the concentration of the KOH solution is preferably 10 to 40% by weight, more preferably about 20% by weight. When the concentration of the solution containing KOH is less than 10% by weight or more than 40% by weight, the etching rate may be slow. The etching temperature is preferably 30 to 90 ° C, more preferably 40 to 60 ° C. Furthermore, the etching time is preferably 4 to 10 minutes, more preferably about 5 to 7 minutes.

When a roughened surface is formed on a portion made of high silicate glass or a portion made of silicon under the above-mentioned conditions, the surface roughness of the roughened surface is within the above range. The roughness (average roughness Ra, average spacing Sm of irregularities, average particle size of particulate matter, and average spacing S of local peaks) will be satisfied.

When a roughened surface is formed under the above etching conditions using a solution containing KOH in a portion made of silicon, the average roughness R formed by the crystal surface is
a will be different. Specifically, when a roughened surface is formed using a solution containing KOH under the desirable processing conditions described above, the average roughness Ra of the (100) surface is 50 to 500 n.
Thus, a roughened surface of m is formed, and a roughened surface having an average roughness Ra of 5 to 100 nm is formed on the (111) surface. Further, when the roughened surface is formed under the more preferable processing conditions described above, the average roughness R is obtained on the (100) surface.
Thus, a roughened surface having a of 200 to 300 nm is formed, and a roughened surface having an average roughness Ra of 10 to 80 nm is formed on the (111) surface.

In the optical fiber array of the present invention, a plurality of grooves are formed on the surface of the substrate, and the substrate includes a member capable of forming grooves having a desired shape by etching. (See FIGS. 2 to 4 and FIG. 9) or a plurality of grooves are formed on the surface of the lid portion, and the lid portion is configured to include a member capable of forming a groove having a desired shape by etching. In the case (see FIGS. 5 to 8), that is, in the case where the substrate or the lid portion is composed of the groove forming member and a member (holding member) that constitutes the substrate or the lid portion by being integrated with the groove forming member. A roughened surface is preferably formed on the surface of the groove forming member that contacts the holding member and / or the surface of the holding member that contacts the groove forming member. When forming a substrate or a lid portion composed of a groove forming member and a holding member, both of them are usually fixed with an adhesive, so that by forming the roughened surface, the groove forming member and This is because the adhesion with the holding member is improved. Examples of the adhesive that fixes the groove forming member and the holding member include the same adhesives as the adhesive layer that fixes the substrate and the lid. The adhesive for fixing the groove forming member and the holding member is preferably a cured product of a resin composition containing a thermosetting resin. This is because the adhesive strength is stronger and the reliability is superior to that of the cured product of the ultraviolet curable resin composition. In addition, usually, when fixing the groove forming member and the holding member, since the optical fiber is not housed in the groove of the groove forming member, when curing the resin composition containing a thermosetting resin. There is no risk of the optical fiber being deformed by the heat of.

As described above, when a roughened surface is formed on the surfaces of the groove forming member and the holding member which are in contact with each other, the surface roughness of the roughened surface (average roughness Ra, average interval Sm of irregularities, The average particle size of the particulate matter and the average spacing S) of the local peaks should be in the same range as the surface roughness of the roughened surface formed on the surface of the substrate or the lid in contact with the adhesive layer. Is desirable. As the method for forming the roughened surface, the same method as the method for forming the roughened surface on the surface of the substrate or the lid portion in contact with the adhesive layer can be used.

When the roughened surface is formed, it is desirable that the roughened surface is formed on the entire portion of the groove forming member that contacts the holding member or the portion of the holding member that contacts the groove forming member. However, it may be formed only partially. Whether to form the entire surface or only a part thereof may be appropriately selected in consideration of the material of the portion where the roughened surface is formed and the like. Note that the roughened surface may be formed only on the groove forming member, may be formed only on the holding member, or may be formed on both.

Here, the average roughness Ra based on JIS B 0601, the average interval Sm of the unevenness, and the average interval S of the local peaks will be briefly described with reference to the drawings. FIG. 10 is a reference diagram for explaining the average roughness Ra based on JIS B 0601, the average spacing Sm of the irregularities, and the average spacing S of the local peaks. In FIG. 10, 501 is the roughness curve of the roughened surface,
2 is the average line. The roughness curve of the roughened surface shown in FIG. 10 is an example for explaining the above-mentioned parameters of the surface roughness, and the roughness curve formed on the substrate or the lid constituting the optical fiber array of the present invention. It does not show the actual roughness curve of the chemical conversion surface.

For the average roughness Ra, the reference length is extracted from the roughness curve in the direction of the average line, the X axis is taken in the direction of the average line of the extracted portion, and the Y axis is taken in the direction of longitudinal magnification.
When the roughness curve is represented by y = f (x), it means the value obtained by the following equation (2).

[0087]

[Formula 1]

(Where l is the reference length). In addition,
In the present specification, the average roughness Ra is nanometer (n
It is represented by m).

The average spacing Sm of the irregularities is the roughness curve 50.
Sampling the standard length from 1 in the direction of the average line 502
In this sampling part, one mountain and its neighbor
The sum of the lengths of the average line 502 corresponding to one matching valley (below
Bottom, uneven distance: Sm in the figure ₁, Sm_TwoIndicates)
Was calculated, and the distance of these many irregularities was expressed by the arithmetic mean value.
Of. In addition, in this specification, the average interval of the unevenness is
Sm is expressed in micrometers (μm). Also,
The above-mentioned mountain means that when the roughness curve is cut at the average line
Roughness curve and average line between two adjacent points at these intersections
The actual part composed of (for example, the part indicated by 503 in the figure)
Min), and the above valley is the roughness curve cut by the average line.
Sometimes, the roughness curve between two adjacent points at those intersections
A space portion composed of a line and an average line (for example, 5 in the figure)
(Part indicated by 04).

The average interval S of the local peaks is the roughness curve 5
The length of the average line corresponding to the distance between the adjacent local peaks in this extracted portion is extracted from 01 in the direction of the average line 502 (hereinafter, referred to as the interval between the local peaks: S ₁ and S _{2 in the} figure). Is shown), and the interval between the large number of local peaks is represented by an arithmetic mean value. In addition, in this specification, the average interval S of the local peaks is nanometer (n
It is represented by m). Further, the local mountain peak is the highest elevation point in the local mountain (for example, the point indicated by 505a in the figure), and the local mountain is the actual portion between two adjacent minimum points of the roughness curve. (For example, a portion indicated by 505 in the drawing).

The average roughness Ra, which represents the surface roughness of the roughened surface formed on the lid, and the average spacing S between the irregularities.
It is desirable that m and the average interval S of the local peaks be measured by a surface roughness meter using an interference fringe. This is because the surface roughness meter using the above interference fringes is a combination of an interferometer and an optical microscope, and can measure the surface shape of the lid or the like with high accuracy and high sensitivity. Further, the surface roughness meter using the above interference fringes can measure the surface condition of the sample (the substrate or the lid) in a non-contact manner, and there is no risk of damaging these surfaces.

Generally, in an interferometer using the above interference fringes,
The light emitted from the light source is split into two by the beam splitter, one of which is reflected by the reference mirror and returns to the beam splitter, and the other of which is reflected by the surface of the sample and returns to the beam splitter. The two lights of the above become one light again by the beam splitter, and this one light is taken into a detector such as a CCD camera.
At this time, the light reflected by the reference mirror and the light reflected by the surface of the sample interfere with each other when they become one light again by the beam splitter. Therefore, the surface state of the sample is determined by the image of the interference light. Can be measured.

In the optical fiber array of the present invention, when the groove is formed on the substrate, the shape of the lid portion fixed to the substrate via the adhesive layer is such that a part of the optical fiber as shown in FIG. The shape in which the recess for accommodating is formed, and FIGS.
However, the shape is not limited to the plate-like body as shown in (1), and may be, for example, a shape in which a groove for separately accommodating optical fibers is formed on the surface facing the substrate. Further, it may have a shape as shown in FIG. In the case of the lid having a shape in which a concave portion for accommodating a part of the optical fibers is formed, since there is a gap between the optical fibers accommodated in the concave portion, Positional deviation is unlikely to occur, and it is easy to fill an uncured adhesive or the like into the void.

Further, when the lid is provided with a recess for accommodating a part of the optical fibers in a lump, the shape of the recess is a combination of only substantially perpendicular planes, or a curved surface. The formed shape, the shape which combined the flat surface and the curved surface, etc. are mentioned.

Further, the lid portion may have a cross-sectional shape in a direction perpendicular to the axis of the optical fiber such that both side lower portions of the rectangle are cut off. In this case, Examples of the cut-out shape include a shape surrounded by a triangle, a quadrangle, a polygon, and two straight lines orthogonal to an arc (elliptic arc).

The size of the lid may be such that it covers only the grooved region of the substrate as shown in FIGS. 1 to 4, but it is the size that covers the entire upper surface of the substrate. May be. In addition, a lid having a shape that covers only the grooved region of the substrate (see FIGS. 1 to 4) and a lid that has a shape that covers the coating resin layer of the optical fiber array may be separately attached. In this case, There may or may not be a gap between the lid portion that covers the region where the groove is formed and the lid portion that covers the coating resin layer.

In the optical fiber array shown in FIGS. 1 to 9, four optical fibers are stored, but the number of optical fibers stored in the groove of the optical fiber array of the present invention is four. The number is not limited and may be 3 or less, or 5 or more.

Further, in the optical fiber array of the present invention, the optical fiber ribbon in which the optical fibers are exposed by removing the coating resin layer at one end is housed in the substrate or the lid having the plurality of V grooves formed therein. Has been done. The optical fiber ribbon is not particularly limited, and a conventionally known optical fiber ribbon can be used. Specifically, for example, the optical fiber 1 including a core 111 and a clad 112 as shown in FIG.
The primary coating resin layer 113 is formed around the optical fiber 15, and the optical fibers 115 coated with the primary coating resin layer 113 are collectively covered with the secondary coating resin layer 114 in a state of being arranged in parallel. Ribbon 110 can be used.

An optical fiber forming an optical fiber ribbon,
For example, quartz glass (SiO _Two) Is the main component
Quartz optical fiber, soda lime, glass, borosilicate glass
Optical fiber mainly composed of fiber, silicone resin
Plastics mainly composed of plastics such as grease and acrylic resin
Stick-type optical fibers and the like can be mentioned. Among these
Is preferably a silica-based optical fiber. Roughened surface
By forming, the adhesion with the adhesive layer is particularly improved.
Therefore, it is suitable for the optical fiber array of the present invention.
It

The primary coating resin layer 113 plays a role as a protective layer for preventing the optical fiber from being damaged. The material is not particularly limited,
For example, a thermosetting resin such as an epoxy resin, a silicone resin, a urethane resin, a phenol resin, a polyimide resin, a polyolefin resin, or a fluororesin, or methacrylic acid or acrylic acid is used, and the thermosetting group of the thermosetting resin described above is used. Examples thereof include (meth) acrylated photosensitive resins. The number of the primary coating resin layers is not limited to one and may be two or more.

The secondary coating resin layer 114 plays a role of protecting the optical fiber formed around the primary coating resin layer and maintaining the shape of the optical fiber ribbon in which the optical fibers are arranged in parallel. There is. The material is not particularly limited, and examples thereof include the same thermosetting resin and photosensitive resin as the material of the primary coating resin layer. The number of the secondary coating resin layers is not limited to one, and
It may be more than one layer.

In the optical fiber array of the present invention, the coating resin layer may be removed and a roughened surface may be formed on the surface of the optical fiber housed in the V groove 157. This is because the adhesion between the optical fiber and the adhesive layer is improved. The lower limit of the average roughness Ra of the roughened surface is preferably 1 nm, and the upper limit thereof is preferably 100 nm. When the average roughness Ra is less than 1 nm, the adhesiveness between the optical fiber and the adhesive layer is hardly improved, while when the average roughness Ra exceeds 100 nm, the unevenness of the surface of the optical fiber becomes large, so that The shape of the cross section deviates from the circular shape, the positional deviation of the optical fiber is likely to occur, and the optical signal transmission may be adversely affected. The lower limit of the average roughness Ra of the roughened surface is more preferably 10 nm, and the upper limit thereof is more preferably 50 nm.

The method for forming the roughened surface is not particularly limited, but it is desirable to use a roughening solution containing a fluoride. This is because the roughened surface having the average roughness Ra in the above range can be formed in a short time.

As the roughening liquid containing the above-mentioned fluoride, for example, the same ones as those used for forming the roughened surface on the substrate or the lid made of the above-mentioned high silicate glass can be mentioned. Among them, a solution containing HF is desirable. This is because a roughened surface having a desired average roughness Ra can be formed in a short time without adversely affecting the optical fiber (deformation of the optical fiber, etc.). It is suitable for forming a roughened surface on the surface of an optical fiber.

Further, in the optical fiber array of the present invention, the optical fiber ribbon from which the coating resin layer at one end is removed is housed in the substrate, but a plurality of optical fibers are housed in the groove of the substrate. It may be a single-core optical fiber or a laminated optical fiber ribbon in which a plurality of optical fiber ribbons are stacked. When a laminated optical fiber ribbon is used, a plurality of optical fibers can be arranged in high density in parallel in the groove of the substrate.

FIG. 11A is a partial perspective view schematically showing an example of an optical fiber array of the present invention using a laminated optical fiber ribbon, and FIG. 11B is a diagram showing the optical fiber array of FIG. It is a partial perspective view which shows only the board | substrate and laminated | multilayer optical fiber ribbon, (c) is the sectional view on the AA line of (a). As shown in FIG. 11, the optical fiber array 200
Then, the exposed optical fibers 235 and 245 at one end of the laminated optical fiber ribbon 210 are connected to the V groove 257 on the substrate 251.
And a part of the laminated optical fiber ribbon 210 together with the coating resin layer is covered with the adhesive layer 259.
It is held at 8. An adhesive layer 259 ′ is formed around the coating resin layer held by the coating resin layer holding portion 258.

In the laminated optical fiber ribbon 210, two optical fiber ribbons 230 and 240 each having an exposed optical fiber at one end are stacked, and the exposed optical fiber 245 of the lower optical fiber ribbon 240 and the upper optical fiber 245 of the upper optical fiber ribbon 240 are stacked. The exposed optical fibers 235 of the optical fiber ribbon 230 are alternately arranged.

In the laminated optical fiber ribbon 210,
The exposed optical fibers 235, 245 are arranged so that the exposed optical fibers 235, 245 are arranged at the same height.
Each is bent in part. In the laminated optical fiber ribbon 210, the upper optical fiber ribbon 2
Although the exposed optical fibers 235 of 30 and the exposed optical fibers 245 of the lower optical fiber ribbon 240 are partly bent, both optical fibers can be arranged at the same height. If so, only the exposed optical fiber of the upper optical fiber ribbon may be bent, or only the exposed optical fiber of the lower optical fiber ribbon may be bent.

In the laminated optical fiber ribbon 210, it is desirable that the upper optical fiber ribbon 230 and the lower optical fiber ribbon 240 are fixed to each other with an adhesive or the like. This is because the positional deviation of the optical fibers arranged in parallel at high density is less likely to occur. Also,
Also in this optical fiber array 200, a groove forming surface,
The boundary with the coating resin layer holding portion is a wall surface that is inclined toward the coating resin layer holding portion. The shape of the coating resin layer holding portion may be a concave shape capable of accommodating the optical fiber together with the coating resin layer.

In the optical fiber array of the present invention, the substrate and the lid are fixed via the adhesive layer, and the optical fiber is accommodated in the groove formed in the substrate or the lid via the adhesive layer. It is fixed. Further, in the case where the above-mentioned substrate is provided with the covering resin layer holding portion, the covering resin layer holding portion holds the covering resin layer via the adhesive layer.

The adhesive layer is preferably made of, for example, a cured product of an epoxy-based or acrylate-based UV-curable resin composition. In the optical fiber array of the present invention, the ultraviolet ray transmissivity in the direction perpendicular to the main surface in the entire region of the substrate and / or the lid is within the above range, so that the ultraviolet curable resin composition is surely cured. It is suitable for Further, when the above ultraviolet curable resin composition is cured, heat treatment at a high temperature is hardly required, so that there is no possibility that the coating resin layer around the optical fiber is deformed or discolored due to heat.

Further, as will be described later, when an uncured adhesive (resin composition) is poured into the gap between the optical fiber and the groove or the gap between the substrate and the lid when manufacturing the optical fiber array, Although the uncured adhesive will be filled in these gaps by the tension, the above-mentioned ultraviolet-curable resin composition can more reliably fill the gap between the optical fiber and the groove. The optical fiber fixed via the cured product of the ultraviolet curable resin composition does not cause positional deviation. Further, the cured product of this epoxy or acrylate-based ultraviolet curable resin composition can also be used as an adhesive layer for fixing the coating resin layer to the coating resin layer holding portion. Moreover, it is desirable that a part of the cured product of the ultraviolet curable resin composition is fluorinated. By fluorinating, it is difficult for water to be generated in the adhesive layer and the moisture resistance is improved. In addition, insulation, heat resistance, chemical resistance, etc. are also improved.

Specific examples of the epoxy-based UV-curable resin composition include, for example, Optodyne UV-1000, Optodyne UV-1100, manufactured by Daikin Industries, Ltd.,
Optodyne UV-2100, Optodyne UV-31
00, Optodyne UV-3200, Optodyne UV
-4000 etc. are mentioned.

Specific examples of the acrylate-based UV-curable resin composition include, for example, Optodyne UV-2.
000, Optodyne UV-3000 and the like.
Specific examples of the acrylate-based UV curable resin composition include, for example, 40 to 50% by weight of acrylate oligomer, 1 to 10% by weight of vinyl ester resin, and 45.
-55 wt% acrylate-based monomer, and 1-
Those containing 10% by weight of a polymerization initiator are also included.

Further, it is desirable that a part of the acrylate oligomer or the acrylate-based monomer is fluorinated. Thus, when a part of the components contained in the ultraviolet curable resin composition is fluorinated,
Since the ultraviolet curable resin composition has excellent translucency, the entire resin composition will be cured in a short time upon irradiation with ultraviolet rays.

When the adhesive layer is a cured product of the ultraviolet-curable resin composition, the adhesive layer for fixing the exposed optical fiber or lid and the coating resin layer are both epoxy-based or acrylate-based. The cured product of the ultraviolet-curable resin composition may be used, or the cured resin of the epoxy-based ultraviolet-curable resin composition may be used as the adhesive layer for fixing the exposed optical fiber and the lid, and the coating resin layer may be fixed. A cured product of an acrylate-based UV-curable resin composition may be used as the adhesive layer.

By using a cured product of a relatively hard epoxy-based UV-curable resin composition as the adhesive layer for fixing the exposed optical fiber and the lid, positional deviation of the optical fiber is less likely to occur and the coating resin By using a cured product of a relatively soft acrylate-based UV-curable resin composition as an adhesive layer for fixing the layers, the coating resin layer portion should be deformed to some extent according to the shape of the portion to which the optical fiber array is attached. Will be possible.
When the substrate and the lid part that integrally covers the substrate are fixed via the adhesive layer, the adhesive layer is made of a cured product of one type of ultraviolet curable resin composition. Is desirable.

When the cured product of the ultraviolet curable resin composition is used as the adhesive layer, the viscosity of the ultraviolet curable resin composition at 25 ° C. is not particularly limited, but 2
It is desirable that it is from 00 to 2000 mPa · s. If the viscosity is less than 200 mPa · s, the viscosity is too low, and thus the UV curable resin composition poured into the gap between the groove and the optical fiber may flow out before curing.
If it exceeds 000 mPa · s, the gap between the groove and the optical fiber may not be reliably filled.

In addition, 25 of the above ultraviolet curable resin composition
As for the viscosity at 0 ° C., the viscosity of the ultraviolet curable resin composition used for fixing the exposed optical fiber and the lid is 2
It is also desirable that the UV curable resin composition used for fixing the optical fiber together with the coating resin layer has a viscosity of 5,000 to 30,000 mPa · s. By using a resin composition having a viscosity in the above range as the ultraviolet curable resin composition for fixing the optical fiber, the resin composition is reliably filled in the gap between the optical fiber and the groove, When a resin composition having a viscosity in the above range is used as the ultraviolet curable resin composition for fixing the fiber together with the resin composition, it is easy to apply the resin composition around the coating resin layer. The viscosity of the ultraviolet curable resin composition may be adjusted by adjusting the blending amount of the solvent and various additives.

As the adhesive layer for fixing the optical fiber together with the coating resin layer, instead of the cured product of the acrylate-based UV-curable resin composition, or the acrylate-based UV-curable resin composition. A silicone adhesive may be used in combination with the cured product. As the silicone-based adhesive, for example, manufactured by Shin-Etsu Chemical Co.,
KJC-7806, Dow Corning 734, etc. are mentioned.

The above ultraviolet curable resin composition contains, if necessary, a curing agent, resin particles, inorganic particles, particles such as metal particles, an additive such as a brightening agent, a reaction stabilizer and a photopolymerization agent. May be. By including these additives, it is possible to improve the fluidity and adjust the degree of curing. The curing agent is not particularly limited, and commonly used curing agents can be used, and specific examples thereof include an imidazole curing agent and an amine curing agent.

Examples of the resin particles include thermosetting resins and thermoplastic resins. Specifically, for example, amino resins (melamine resin, urea resin,
(Guanamine resin), epoxy resin, phenol resin, phenoxy resin, polyimide resin, polyphenylene resin,
Examples include polyolefin resins, fluororesins, bismaleimide-triazine resins, and the like. These may be used alone or in combination of two or more. Also,
As the resin particles, particles made of rubber such as acrylonitrile-butadiene rubber and polychloroprene rubber can also be used.

Examples of the inorganic particles include aluminum compounds such as alumina and aluminum hydroxide, calcium compounds such as calcium carbonate and calcium hydroxide, potassium compounds such as potassium carbonate, magnesium compounds such as magnesia, dolomite and basic magnesium carbonate, Examples thereof include silicon compounds such as silica and zeolite, titanium compounds such as titania, and the like. These may be used alone or in combination of two or more, and as the above-mentioned inorganic particles, phosphorus or a phosphorus compound may be used.

Examples of the metal particles include gold, silver,
Examples include copper, tin, zinc, stainless steel, aluminum, nickel, iron and lead. These may be used alone or in combination of two or more. By including these particles, adjustment of the thermal expansion coefficient and improvement of flame retardancy can be achieved.

The ultraviolet curable resin composition may contain a solvent or may not contain a solvent at all. When a solvent is included, examples of the solvent include NMP (normal methylpyrrolidone) and DMDG.
(Diethylene glycol dimethyl ether), glycerin, cyclohexanol, cyclohexanone, methyl cellosolve, methyl cellosolve acetate, methanol,
Examples include ethanol, butanol, propanol and the like.

The adhesive layer in the optical fiber array of the present invention may be a resin containing at least one of a thermoplastic resin, a thermosetting resin, a UV curable thermosetting resin, and a photosensitive resin. It may be composed of an organic adhesive such as a cured product of the composition. Examples of the thermosetting resin include epoxy resin, phenol resin, silicone resin, polyimide resin, and fluororesin.

Examples of the epoxy resin include bisphenol type epoxy resin and novolac type epoxy resin. The use of the above bisphenol type epoxy resin is desirable in that the viscosity can be adjusted by selecting an A type or F type resin without using a diluting solvent, and it is preferable to adjust the viscosity to a lower value. The bisphenol F type epoxy resin is more preferable in that it can be obtained. Further, it is preferable to use the above novolac type epoxy resin because the resin has high strength, excellent heat resistance and chemical resistance, and is less likely to be thermally decomposed. Further, as the novolac type epoxy resin, a phenol novolac type epoxy resin and a cresol novolac type epoxy resin are desirable.

Further, it is desirable that the bisphenol type epoxy resin and the novolac type epoxy resin are mixed and used. In this case, the mixing ratio of the bisphenol type epoxy resin and the novolac type epoxy resin is preferably 1: 1 to 1: 100. This is because mixing within this range can suppress an increase in viscosity.

Further, as the above-mentioned photosensitive resin, for example,
Examples thereof include resins obtained by imparting photosensitivity to the thermosetting resin. Specifically, for example, the one in which the thermosetting group of the thermosetting resin is (meth) acrylated by using (meth) acrylic acid or the like can be mentioned. Among these, the (meth) acrylate of the epoxy resin is preferable, and the epoxy resin having two or more epoxy groups in one molecule is more preferable.
Examples of the photosensitive resin also include acrylic resin and the like. These photosensitive resins may be used alone or in combination of two or more.

Also, for these organic adhesives, if necessary, curing agents, particles such as resin particles, inorganic particles and metal particles, brighteners, reaction stabilizers, additives such as photopolymerization agents, solvents, etc. Etc. may be included.

Next, a method for manufacturing the optical fiber array of the present invention will be described. Here, first, a method of manufacturing an optical fiber array in which a groove for accommodating an optical fiber is formed in a substrate will be described in the order of steps.

(1) A substrate having a plurality of grooves formed on a part of its upper surface is manufactured. Specifically, for example, a plate-shaped body made of silicon or the like is used as a starting material, and the following (i) to (viii)
A groove may be formed in the plate-shaped body by performing the step of 1. and the plate-shaped body in which the groove is formed may be used as the substrate in which the groove is formed. The body may be fixed to another member (holding member) and used as a substrate. Figure 1
2A to 2G are cross-sectional views showing an example of a method for forming a groove.

(I) First, the mask layer 1 is formed on the plate 151.
52 (152a, 152b) is formed (FIG. 12A).
reference). The number of mask layers is not limited to two layers as shown in FIG. 12, and may be one layer or three or more layers.

As a method of forming the mask layer 152,
For example, a method of forming a thin film by sputtering, CVD, plating or the like, a method of forming an oxide film by thermal oxidation or the like, a method combining these, or the like can be used. Among these, for example, when forming a mask layer on a plate-shaped body made of silicon, first, an oxide film (SiO ₂ film) is formed by thermal oxidation, and then CVD is performed on this oxide film. The method of forming a thin film is desirable. By forming such a mask layer, it is possible to form a mask having an arbitrary shape by etching an arbitrary portion in a later step.

(Ii) Next, a resist resin layer 154 is formed on the mask layer 152 (see FIG. 12B). Specifically, a method in which a resist resin composition whose viscosity has been adjusted in advance is applied by a spin coater, a curtain coater, a roll coater, printing, or the like, or a resist resin film which has been formed into a film shape in advance is attached. A method of attaching can be used.

The resin composition for resist and the resin film for resist are composed of, for example, a resin component and a curing agent, particles, a rubber component, an additive, a reaction stabilizer, a solvent and the like which are blended as necessary. There are things. Examples of the resin component include a thermosetting resin, a thermoplastic resin, a photosensitive resin, a resin in which a part of the thermosetting resin is replaced with a photosensitive group, a composite resin of these, and the like.

Specifically, for example, thermosetting resins such as epoxy resin, phenol resin, polyimide resin, bismaleimide resin, polyphenylene resin, polyolefin resin, and fluororesin; thermosetting groups of these thermosetting resins (for example, , (Epoxy group in epoxy resin) is reacted with methacrylic acid or acrylic acid to form an acrylic group (photosensitive group).
Resins provided with: thermoplastics such as phenoxy resin, polyether sulfone (PES), polysulfone (PSF), polyphenylene sulfone (PPS), polyphenylene sulfide (PPES), polyphenyl ether (PPE), and polyetherimide (PI) Resin: Acrylic resin, photosensitive resin such as ultraviolet curable resin, and the like. Among these, epoxy resin, phenol resin, polyimide resin, acrylic resin, and ultraviolet curable resin are preferable. This is because when the mask layer under the resist resin layer is treated with an etching solution in a later step, the resistance to the etching solution is excellent. Examples of the curing agent include imidazole curing agents, amine curing agents, acid anhydride curing agents, and the like.

The thickness of the resist resin layer is 10
˜50 μm is desirable. The resist resin layer may be in a cured state or a semi-cured state. Specifically, for example, in the case where the resist resin layer in the portion corresponding to the groove is removed by exposure and development processing in a later step, a semi-cured state is desirable, and a laser treatment or the like corresponds to the groove. When the portion of the resist resin layer to be removed is removed, it may be in a cured state or a semi-cured state. In the case of forming a resist resin layer in a completely cured state or a semi-cured state, it is desirable to perform the curing treatment by heating at 70 to 200 ° C, for example. Moreover, you may perform step hardening which changes a heating temperature step by step.

(Iii) Next, a part of the resist resin layer 154, that is, a part corresponding to the groove is removed to form an etching resist 155 (see FIG. 12C). The resist resin layer 154 can be removed by, for example, exposure and development treatment. Specifically, for example, a mask is placed on the semi-cured resin layer for resist, an exposure process is performed, and then a development process using a chemical solution such as an alkaline solution or an organic solvent is performed. The developing treatment can be performed by immersing the plate-shaped body on which the resist resin layer is formed in the chemical solution or by spraying the chemical solution. As the mask, it is possible to use a mask in which a groove pattern is drawn in a portion corresponding to the removed portion of the resist resin layer.

Further, the removal of the resist resin layer 154
Alternatively, laser processing may be used. Examples of the laser used for the laser processing include carbon dioxide gas laser, excimer laser, UV laser, and YAG laser.
These lasers may be selectively used in consideration of the shape of the removed portion of the resist resin layer, the composition of the resist resin layer, and the like. By adjusting the shape of the etching resist formed in this step, it is possible to adjust the shape of the groove formed through the subsequent steps.

(Iv) Next, the mask layer 152 exposed in the portion where the etching resist 155 is not formed is removed, and the plate-shaped body 15 is removed.
A mask 156 is formed by exposing the portion where the groove 1 is formed (see FIG. 12D). Removal of the mask layer 152
For example, dry etching such as RIE (reactive ion etching), plasma treatment using oxygen plasma or nitrogen plasma, corona treatment, reverse sputtering, or the like can be performed. Specifically, for example, it can be performed by irradiating the mask layer with oxygen plasma under vacuum or reduced pressure. By performing such dry etching, it is possible to selectively remove only the mask layer in the resist non-formed portion without causing damage or deformation of the etching resist.

The mask layer 152 can be removed by, for example,
By immersing the plate-shaped body on which the mask layer 152 is formed in the etching solution or the acid solution, immersing the plate-shaped body in the solution and performing ultrasonic treatment, or spraying the etching solution or the acid solution on the mask layer. Can also be done. What kind of removal method is specifically selected may be appropriately determined in consideration of the material and thickness of the mask layer.
When the mask layer is made of an oxide film, RIE, plasma treatment, or treatment with an etching solution may be selected, and when the mask layer is made of a metal layer, reverse sputtering or treatment with an etching solution may be selected.

(V) Next, the etching resist 155 is peeled and removed (see FIG. 12E). The removal of the etching resist 155 should be carried out using an alkaline solution such as NaOH, KOH, an acid solution such as sulfuric acid, acetic acid, carbonic acid, alcohols such as methanol and ethanol, amines, ketones, organic solvents such as acetone, and the like. You can As a result, only the mask 156 having the opening corresponding to the portion where the groove is formed is formed on the substrate 151.

(Vi) Next, the groove 157 is formed in the plate member 151 (see FIG. 12F). The groove 157 can be formed, for example, by spraying an etching solution onto the plate-shaped body 151 through a mask 156 or by immersing the plate-shaped body 151 on which the mask 156 is formed in the etching solution. Examples of the etching solution include Na
Alkali such as OH and KOH, acid such as nitric acid, phosphoric acid and sulfuric acid,
Fluorine compounds such as hydrogen fluoride and bromine fluoride, halides, aqueous hydrogen peroxide, alcohols such as methanol and ethanol, and the like can be used. When the groove is formed by using these etching solutions, the cross-sectional shape of the groove is V-shaped, inverted trapezoidal shape, rectangular shape, or a combination thereof.

The concentration of the etching solution is preferably 10 to 50% by weight. If the above concentration is less than 10% by weight, it may take a long time for etching, while 50% by weight is required.
Even if it exceeds, the etching rate hardly changes. The temperature of the etching solution is preferably 20 to 90 ° C., and the etching rate is preferably 0.5 to 5.0 μm / min. If the temperature of the etching solution is lower than 20 ° C., the etching may not be sufficiently performed, and even if the temperature of the etching solution exceeds 90 ° C., the etching amount is hardly changed, and the safety during the work is lowered.

Here, when a groove is formed in a substrate made of silicon or gallium arsenide, it is desirable to carry out etching using an alkaline solution such as KOH. When etching a plate made of silicon or gallium arsenide, a groove having a desired shape is formed by selecting an appropriate etching surface, type of etching solution, and shape of the etching resist non-forming portion. can do.

That is, when a plate-shaped body made of silicon is etched using an etching solution containing KOH, the (100) plane of the plate-shaped body made of silicon has priority over the (111) plane and the (110) plane. Etched,
Since the etching rate ratio of each crystal plane is almost constant, it is possible to form a groove having a desired shape. Specifically, when etching the (100) surface of a plate-shaped body made of silicon, it is possible to form a groove having a V-shaped cross section or an inverted trapezoidal shape, and the (110) surface is etched. In the case of carrying out, a groove having a rectangular cross section can be formed.

When a plate-like body made of gallium arsenide is etched using an etching solution containing KOH, the etching rate of the (111) Ga plane is the slowest,
A groove having a desired shape can be formed by utilizing the fact that the etching rate of the (111) As plane is the highest.

When etching is performed in this step, a surfactant or the like may be added to the etching liquid.
When foaming violently during etching, irregularities may be formed on the etching surface due to this foaming, but foaming during etching can be suppressed by adding a surfactant. Further, the above etching may be performed while applying ultrasonic waves. This is because foaming can also be suppressed by applying ultrasonic waves.

When the plate-shaped body is immersed in the etching solution for etching, the plate-shaped body may be swung or the etching solution may be stirred.

(Vii) Next, if necessary, the plate-like body 15
The mask 156 on 1 is removed (see FIG. 12G).
By removing the mask layer 156, the entire upper surface of the plate-shaped body including the wall surface of the groove is made of the same composition, and a roughened surface can be formed under the same conditions in a later step. .

As a method of removing the mask 156, the same method as the method used in the step (iv) can be used. That is, the process used to remove the mask layer 152 exposed in the etching resist 155 non-forming portion in the above step (iv) may be performed in this step as well. When the mask is composed of a plurality of layers, only a part of the layers forming the mask may be removed.
Specifically, for example, when the plate-shaped body made of silicon is made of an oxide film and a CVD film, both the oxide film and the CVD film may be removed, or only the CVD film may be removed. Good.

It is not necessary to remove the mask 156. In that case, strictly speaking, in a portion where the optical fiber is housed in a later step, the portion where the mask is not formed and the groove provided in the plate-like body are aligned with each other. However, in the present specification, a portion obtained by combining the mask non-forming portion and the groove provided in the plate-shaped body is also referred to as a groove, unless otherwise specified.

(Viii) Next, if necessary, a roughened surface (not shown) is formed on the entire upper surface (including the wall surface of the groove) or a part of the upper surface of the plate-shaped body in which the groove is formed. The roughened surface may be formed only on a part of the upper surface of the plate-like body (for example, the wall surface of the groove, a portion of the upper surface of the plate-like body where the groove is not formed, etc.).
It is desirable to be formed on the entire upper surface of the plate-shaped body.
This is because the adhesion with the adhesive layer is further improved. The method described above can be used as the method for forming the roughened surface. Through the steps (i) to (viii), it is possible to form a groove having a desired shape on the plate-shaped body.

In the step (1), as described above,
When manufacturing the optical fiber array of the present invention, such a plate-shaped body in which a groove is formed may be used as a substrate in which a groove is formed (see FIG. 1). The plate-shaped body may be used as a groove forming member, and the groove forming member may be fixed to a holding member to form a grooved substrate (FIG. 2).
~ 4).

When the holding member is a plate-like member (FIG. 2,
4), the groove forming member may be attached to a predetermined position of the plate-like body via an adhesive, and a recess for accommodating the groove forming member is formed in the holding member (see FIG. 4). 3), a recess is first formed by cutting or the like using a device equipped with a diamond blade, and then a groove forming member is housed in a predetermined position of this recess and fixed with an adhesive. .

Further, when the groove forming member is fixed to the holding member via an adhesive to form a substrate having grooves, the above-mentioned portion where the holding member and the groove forming member come into contact with each other is described above. It is desirable to form a roughened surface as described above. The holding member may be fixed after the optical fiber is housed in the groove formed in the groove forming member in a later step.

When a groove is formed in a plate-like body made of silicon or the like through the steps (i) to (viii) described above, the mask layer formed in the step (i) is usually a groove. Not only the formation surface, but the entire surface of the plate-shaped body is formed. Therefore, when fixing the groove forming member to the holding member, the plate-like body may be exposed at the portion of the groove forming member that comes into contact with the holding member, or the mask layer is exposed. There are also cases.

Specifically, a mask layer made of a SiO ₂ film and a Si ₃ N ₄ film is formed on the surface of a plate-like body made of silicon, and then the groove forming member produced through the steps described above. Then, the material of the portion of the groove forming member that is in contact with the holding member is silicon, SiO ₂ , or Si ₃ N ₄ .
Here, a method for forming a roughened surface on a SiO ₂ film or a Si ₃ N ₄ film will be briefly described, that is, SiO.
_{When the} roughened surface is formed on the _two films or the Si ₃ N ₄ film, for example, the method of removing the mask layer described in the step (iv) may be performed under mild conditions.

Further, in the step (1), the method of forming the groove is not limited to the above-described etching method, and the material of the plate-like body for forming the groove, the shape of the groove to be formed, etc. The optimum forming method may be selected in consideration. Specifically, for example, when a groove is formed in a plate-like body made of high silicate glass, the groove can be formed by performing a cutting process using an apparatus equipped with a diamond blade. Even when forming a groove on a substrate made of silicon, the groove may be formed by performing a cutting process, but as described above, in general, when the groove is formed by etching,
Since the relative positional accuracy of adjacent grooves is superior to the case where the grooves are formed by cutting, the grooves may be formed by anisotropic etching when forming the grooves on a substrate made of silicon. desirable.

In the step (1), a groove may be formed in the substrate and a covering resin layer holding portion for holding the optical fiber or the optical fiber ribbon together with the covering resin layer may be formed. The method for forming the coated resin layer holding portion is not particularly limited, and examples thereof include a method using a device equipped with a diamond blade. Further, the formation of the coating resin layer holding portion may be performed once or may be performed twice or more.

When the coated resin layer holding portion is formed, the upper surface of the coated resin layer holding portion may have irregularities. In this case, a polishing process may be performed to flatten the unevenness, but if the unevenness is such that the optical fiber ribbon is greatly inclined when holding the optical fiber ribbon or the like, the polishing process is particularly performed. It is desirable to leave it as it is. This is because when the coating resin layer holding portion holds the coating resin layer via the adhesive layer, the adhesion effect improves the adhesion between the coating resin layer holding portion and the adhesive layer. Further, when forming the coated resin layer holding portion here, even if a plurality of holding surfaces having different heights are formed in the coated resin layer holding portion so as to follow the shape of the optical fiber ribbon or the like to be held. Good.

When the above-mentioned coated resin layer holding portion is formed, the boundary between the groove forming surface and the coated resin layer holding portion is inclined so as to descend toward the coated resin layer holding portion as shown in FIG. It is desirable that the wall surface has This is because the load on the optical fiber can be reduced. Further, the shape of the covering resin layer holding portion may be a concave shape capable of accommodating the optical fiber together with the surrounding covering resin layer.

(2) Here, apart from the production of the substrate, an optical fiber ribbon in which a part of the coating resin layer is removed and the optical fiber is exposed is produced. Here, the coating resin layer to be removed may be the coating resin layer at one end of the optical fiber ribbon or may be a portion of the coating resin layer other than both ends of the optical fiber ribbon. It is desirable that it is a part of the coating resin layer other than both end portions of. In such an optical fiber ribbon from which a part of the coating resin layer other than both ends is removed, both ends of the exposed optical fiber are fixed, so that variation in the axial direction of the optical fiber is less likely to occur, and in a post-process. This is because it is suitable for being stored in the substrate.

The above-mentioned coating resin layer is removed, for example, by a mechanical removal method using a coating resin layer peeling device such as a stripper, or by chemically dissolving the coating resin layer by using an organic solvent. The method etc. can be used. Alternatively, a method of removing by irradiation with laser light may be used.

Further, after removing the coating resin layer, it is desirable to form a roughened surface on the surface of the optical fiber by the above-mentioned method. When the roughened surface is formed on the surface of the optical fiber, the degree of inflow of the uncured adhesive due to the surface tension is substantially uniform when the uncured adhesive is poured from the end surface of the substrate in the subsequent process. As a result, the uncured adhesive can be reliably poured into the gap between the groove and the optical fiber.

(3) Next, the optical fiber ribbon produced by the above step (2) and having a part of the optical fiber exposed is housed in the groove of the substrate. Here, when storing the optical fiber ribbon from which the coating resin layer at one end is removed, the optical fiber ribbon may be stored so that the end face of each optical fiber and the side face of the substrate are aligned, or each optical fiber is placed on the substrate. You may store so that it may protrude from the side surface of a certain length. In addition,
When housing the optical fiber ribbon from which the coating resin layer at one end has been removed, it is desirable to house the exposed optical fiber while holding it with an aligner or the like. This is because the optical fiber can be reliably stored at the predetermined position.

When the optical fiber ribbon from which a part of the coating resin layer other than both ends thereof is removed is housed, the optical fiber ribbon which has not been housed in the substrate after housing the optical fiber ribbon is housed. Will be cut off at one end. In addition, when cutting and removing one end of the optical fiber ribbon, it may be cut and removed so that the end face of each optical fiber and the side surface of the substrate are aligned, or each optical fiber has a certain length from the side surface of the substrate. You may cut and remove so that it may protrude. The cutting and removal of the optical fiber ribbon can be performed by cutting using a cutter or the like. Alternatively, mechanical polishing may be performed.

When the coating resin layer holding portion is formed in the step (1), the optical fiber is housed in the groove and the optical fiber ribbon is placed on the coating resin layer holding portion in this step. Place the coating resin layer together.

(4) Next, if necessary, an uncured adhesive is filled in the portion of the groove in which the optical fiber is not housed, and thereafter,
The optical fiber is fixed in the groove by performing a curing treatment.
Specifically, for example, the uncured ultraviolet curable resin composition is poured from the end face (end of the groove) of the substrate, and then the optical fiber is fixed by irradiating with ultraviolet rays to perform a curing treatment. Further, when the coating resin layer holding portion is formed on a part of the substrate and the optical fiber ribbon is placed on the coating resin layer holding portion together with the coating resin layer, the uncured adhesive is also applied around the coating resin layer. The coating resin layer may be fixed by applying an agent or the like and curing the uncured adhesive. Here, when the shape of the coating resin layer holding portion is a shape including an inclined wall surface, in this coating resin layer holding portion, a part of the exposed optical fiber and the coating resin layer are fixed via an adhesive layer. It is desirable to do. In addition, before storing the optical fiber, an uncured adhesive may be poured into the groove or the like in advance, and after storing the optical fiber, the adhesive may be cured to fix the optical fiber.

(5) Next, a lid is attached on the substrate via an adhesive layer so as to cover the optical fiber housed in the groove of the substrate. In the case where the lid part attached in this step has a shape in which a concave part for accommodating a part of the optical fiber is formed, or the shape of the cross section in the direction perpendicular to the axis of the optical fiber is rectangular. When both side lower parts have a cut-out shape, the above-described shape is cut in advance.

When attaching the lid, the uncured adhesive is applied in advance to the portion of the upper surface of the substrate facing the lid, and the lid is placed on the uncured adhesive. The lid may be attached by performing a curing process after placing the lid on the substrate (optical fiber), and then placing the lid on the substrate (optical fiber) and then the gap between the lid and the substrate or the optical fiber. It is desirable to pour an uncured adhesive into the container and then to apply a curing treatment to attach the lid. When the lid is placed on the uncured adhesive, air easily enters between the adhesive layer and the lid, and this air may be the starting point of peeling between the adhesive layer and the lid. Is.

In the step (4), only the optical fiber is stored without forming an adhesive layer in the optical fiber non-storage portion of the groove, and the substrate (optical fiber) is stored in this step.
After the lid is placed on the cover, when the uncured adhesive is poured into the gap between the lid and the substrate or the optical fiber, the uncured adhesive may be simultaneously poured into the optical fiber non-accommodating portion of the groove. .

Further, in this step, it is desirable to form a roughened surface on the portion of the lid portion facing the substrate in advance.

In the step (3), when the optical fiber ribbon from which a part of the coating resin layer other than both ends thereof is removed is housed, the optical fiber ribbon is attached after the lid is attached in this step. The part which was not stored in the substrate is cut and removed.

Also, after storing the optical fiber ribbon with one end exposed, or after storing a part of the exposed optical fiber other than both ends and cutting and removing one end of the optical fiber ribbon. It is desirable to polish the end surface of the optical fiber. Here, when performing the polishing treatment, it is desirable to perform the polishing treatment so that the end faces of the optical fiber, the substrate and the lid are inclined. This is because it is possible to suppress the generation of return light when transmitting an optical signal. In this case, while polishing the end face of the optical fiber,
The side surface of the substrate or the lid may be polished.

Through these steps, it is possible to manufacture the optical fiber array of the present invention in which the groove is formed in the substrate and the optical fiber is housed in the groove.

Next, a method of manufacturing an optical fiber array in which a groove for accommodating an optical fiber is formed in the lid will be described in the order of steps.

(1) A lid having a plurality of grooves formed on a part of its surface is produced. Specifically, for example, a plate-like body made of silicon or the like is used as a starting material, and the plate-like body is obtained by going through the same steps as the steps (i) to (viii) described as the method of forming the groove in the substrate. Form a groove in the body.

In manufacturing the optical fiber array of the present invention, such a plate-shaped body having a groove may be used as a lid having a groove, or the plate having the groove formed therein. The groove may be used as a groove forming member, and the groove forming member may be fixed to a holding member to form a lid having a groove (FIG. 5).
~ 8). The fixing of the groove forming member and the holding member may be performed after the optical fiber is housed in the groove formed in the groove forming member in a later step.

When the holding member is a plate-like member (FIG. 5,
6), it suffices to attach the groove forming member to a predetermined position of the plate-like body through an adhesive, and in the case where a recess for accommodating the groove forming member is formed in the holding member (see FIG. 7 and 8), first, a recess is formed by cutting using a device equipped with a diamond blade or the like, and then a groove forming member is housed at a predetermined position of the recess, and an adhesive is used to bond the groove forming member. Fix it.

When the groove forming member is fixed to the holding member with an adhesive to form a grooved lid portion, the above-mentioned portion where the holding member and the groove forming member are in contact is described above. It is desirable to form the roughened surface as described above.

Further, in the step (1), the method of forming the groove is not limited to the above-described etching method as in the case of manufacturing the substrate in which the groove is formed, and the groove is formed. The optimum forming method may be selected in consideration of the material of the plate-like body, the shape of the groove to be formed, and the like.

When manufacturing the optical fiber array as shown in FIGS. 6 and 8, when the groove forming member is attached to the holding member at a predetermined position, the resin coating layer covers a part of the surface of the holding member. Can be protected.

(2) Next, apart from the production of the lid portion, an optical fiber ribbon in which a part of the coating resin layer is removed and the optical fiber is exposed is produced. Here, an optical fiber ribbon in which the optical fiber is exposed may be manufactured in the same manner as the step (2) described as the method of manufacturing the optical fiber array in which the groove is formed in the substrate.

(3) Next, the optical fiber ribbon produced by the above step (2) and having a part of the optical fiber exposed is housed in the groove of the substrate, and, if necessary, the optical fiber in the groove. After the uncured adhesive is filled in the storage portion, a curing process is performed to fix the optical fiber in the groove. Here, an optical fiber ribbon in which the optical fiber is exposed may be manufactured in the same manner as the steps (3) and (4) described as the method of manufacturing the optical fiber array in which the groove is formed in the substrate.

(4) Next, the lid portion in which the optical fiber is housed in the groove and the substrate are fixed via an adhesive layer. In particular,
For example, after arranging the lid portion containing the optical fiber and the substrate so as to face each other, the uncured ultraviolet curable resin composition is poured from the end surface of the substrate (the end portion of the groove), and then ultraviolet rays are passed through the substrate. The cover and the substrate are fixed via the adhesive layer by irradiation and curing treatment. Further, when the coating resin layer of the optical fiber ribbon is held by a part of the substrate, the above coating resin is used in this step. An uncured adhesive may be applied around the layer, and the coating resin layer may be fixed by curing the uncured adhesive.
A roughened surface is preferably formed in advance on the surface of the substrate fixed in this step, which is in contact with the adhesive layer.

When fixing the lid and the substrate via the adhesive layer, an uncured adhesive is previously applied to either the groove forming surface of the lid or the surface of the substrate facing the lid. The coating may be applied, and then the two may be arranged to face each other and further subjected to a curing treatment to fix the lid and the substrate via the adhesive layer. In this case, the lid and the adhesive layer Air easily enters between the substrates or the adhesive layer, and the air may be used as a starting point for peeling between the substrate and the adhesive layer or peeling between the lid portion and the adhesive layer. Like
A method of pouring an uncured adhesive from the lid and the end of the substrate is desirable.

In the step (3), the optical fiber is only accommodated without forming an adhesive layer in the optical fiber non-accommodating portion of the groove, and in the step (4), the lid and the substrate are accommodated. After arranging and at a predetermined position, when the uncured adhesive is poured into the gap between the lid and the substrate or the optical fiber, the uncured adhesive may be simultaneously poured into the optical fiber non-accommodating portion of the groove.

Further, in the step (3), when the optical fiber ribbon from which a part of the coating resin layer other than both ends thereof is removed is housed, the optical fiber ribbon is attached after the lid is attached in this step. The part which was not stored in the substrate is cut and removed.

After storing the optical fiber ribbon whose one end is exposed, or after storing a part of the exposed optical fiber other than both ends and cutting and removing one end of the optical fiber ribbon, It is desirable to polish the end surface of the optical fiber. Here, when performing the polishing treatment, it is desirable to perform the polishing treatment so that the end faces of the optical fiber, the substrate and the lid are inclined. This is because it is possible to suppress the generation of return light when transmitting an optical signal. In this case, while polishing the end face of the optical fiber,
The side surface of the substrate or the lid may be polished.

Through these steps, it is possible to manufacture the optical fiber array of the present invention in which the groove is formed in the lid and the optical fiber is housed in the groove.

The manufacturing method of the optical fiber array described above is a method using an optical fiber ribbon, but the optical fiber array of the present invention uses a single-core optical fiber,
It can also be manufactured using a laminated optical fiber ribbon.

Specifically, when manufacturing an optical fiber array using a single-core optical fiber, for example, a plurality of optical fibers from which the coating resin layer at one end is peeled off are arranged in parallel using an aligner. In step (3) above, the optical fiber is housed in the groove of the substrate or the lid portion in which the groove is formed while being held by the aligner in the above step (3), and then the same method as the above method is applied. An optical fiber array can be manufactured by fixing an optical fiber, forming a lid, etc. by using it.

When an optical fiber array is manufactured by using the laminated optical fiber ribbon, for example, a laminated optical fiber ribbon 300 in which a part of the coating resin layer is removed is prepared as shown in FIG. After that, the optical fiber array can be manufactured by housing and fixing this laminated optical fiber ribbon on the substrate. FIG. 13 is a partial perspective view schematically showing an embodiment of the laminated optical fiber ribbon.

As shown in FIG. 13, the laminated optical fiber ribbon 300 has a part of the optical fibers 345 other than both ends thereof.
a of the second optical fiber ribbon (lower optical fiber ribbon) 340 exposed between the exposed optical fibers 345a of the first optical fiber ribbon 335a at one end thereof (upper optical fiber ribbon ) The first optical fiber ribbon 330 and the second optical fiber ribbon 3 are arranged so that the exposed optical fibers 335a of 330 are arranged.
And 40 are stacked.

In the laminated optical fiber ribbon 300,
The exposed optical fibers 335a, 345a are arranged so that the exposed optical fibers 335a, 345a are arranged at the same height.
Each of 5a is bent at a part thereof. Thus, optical fiber 335a and optical fiber 345a
By arranging the same at the same height, it becomes a shape suitable for being housed in the groove of the substrate.

In the laminated optical fiber ribbon 300,
The exposed optical fiber 3 of the first optical fiber ribbon 330
35a and a part of each of the exposed optical fibers 345a of the second optical fiber ribbon 340 are bent, but if both optical fibers can be arranged at the same height, Only the exposed optical fiber of the optical fiber ribbon may be bent, or only the exposed optical fiber of the second optical fiber ribbon may be bent.

Further, in the laminated optical fiber ribbon 300, it is desirable that the first optical fiber ribbon 330 and the second optical fiber ribbon 340 be fixed with an adhesive. Note that in the laminated optical fiber ribbon 300 shown in FIG. 13, eight optical fibers are arranged at the same height, but the number of optical fibers in the laminated optical fiber ribbon is not limited to eight, and seven optical fibers are provided. It may be the following or 9 or more. The number of optical fibers in each of the first and second optical fiber ribbons is the same as in the optical fiber ribbon shown in FIG. 13, the first optical fiber ribbon is one more, or It is desirable that the number of the second optical fiber ribbons is one. This is because in such a case, the optical fibers can be arranged at the highest density.

In the production of the laminated optical fiber ribbon, for example, first, the coating resin layer at one end of the optical fiber ribbon is
As described above, a method of using the coating resin layer peeling device, a method of dissolving with an organic solvent, a method of irradiating with a laser beam and the like to produce a first optical fiber ribbon by removing it, apart from this, A second optical fiber ribbon is produced by removing a part of the coating resin layer other than both end portions of the optical fiber ribbon by using the same method for removing the coating resin layer as described above. After bending the part, the first and second optical fiber ribbons may be stacked with an adhesive so that the two optical fibers are alternately arranged at equal intervals.

As a method of housing and fixing such a laminated optical fiber ribbon on a substrate, the same method as the method of housing and fixing the above-mentioned optical fiber ribbon can be used. Even when an optical fiber array is manufactured using the laminated optical fiber ribbon, after the laminated optical fiber ribbon is housed and fixed in the substrate, the second optical fiber ribbon is cut off and the end face of the optical fiber is removed. And the like.

[0202]

The present invention will be described in more detail below.

(Example 1) A. Fabrication of an optical fiber ribbon from which a part of the coating resin layer has been removed.
Optical fiber ribbons (Sumitomo Electric Industrial Co., Ltd.) in which eight fibers of 50 μm are arranged in parallel, and a coating resin layer (primary coating layer 113 and secondary coating layer 114) made of an acrylate-based ultraviolet curable resin is coated around the optical fibers. Made),
A coating resin layer (primary coating layer and secondary coating layer) at a portion 5 to 50 mm from one end of this optical fiber ribbon
Was peeled off by a coating resin layer peeling device (see FIG. 14 (a)).

B. Manufacture of lid part A plate-like body made of high silicate glass is cut using a device equipped with a diamond blade to form a recess 161 for accommodating an exposed optical fiber. (See FIG. 15A). The recess is
The shape of the cross section is rectangular.

[0205] In addition, JIS B 06 on the surface of the lid part
The surface roughness based on 01 is used as a surface roughness meter using interference fringes (WYKO NT-2 manufactured by Veeco Instruments Inc.).
000 system), the average roughness Ra was 1 nm.

Further, with respect to a plate-like body having a thickness of 1.0 ± 0.05 mm and made of the same material (high silicate glass) as that of the lid portion, the ultraviolet transmittance of this plate-like body was measured by the following method. Then, the transmittance was 90%.

The transmittance was measured by first placing the plate-like body on the light-receiving surface of a photometer (UV-351, manufactured by Oak Manufacturing Co., Ltd .; the sensitive region is near a wavelength of 360 nm), and then vertically measuring the photometer. UV spot light source in the upper direction (made by Hamamatsu Photonics,
LC5L8222 (Direct irradiation uniform irradiation unit E625
5)) was placed. The distance between the light receiving surface of the photometer and the lens surface of the UV spot light source is 40 cm.

Next, the operation of irradiating the photometer with ultraviolet rays from the UV spot light source and measuring the irradiation intensity on the light receiving surface of the photometer was repeated three times, and the average value was calculated. The average irradiation intensity was 19.0 mW / cm ² . The average irradiation intensity measured without placing the plate-shaped body was 21.1 mW / cm ² .

C. Fabrication of optical fiber array (1) Thickness 0.5-2.0 with polishing treatment on its surface
A silicon substrate 151 having a size of mm was used as a starting material, and a mask layer 152 was formed on the silicon substrate 151 by the following method (see FIG. 12A). That is, first, the thickness of the surface of the silicon substrate 151 was 0.04 μm in a thermal oxidation furnace.
Of SiO ₂ film 152a is formed, and a low pressure CVD method is used on this SiO ₂ film to form Si ₃ N having a thickness of 0.1 μm.
_The SiO ₂ film 152 is formed by forming the ₄ film 152b.
a and a mask layer 1 composed of two layers of Si ₃ N ₄ film 152b
52 was formed.

(2) Next, a resin composition for resist is applied onto the mask layer 152 by using a spin coater to give a thickness of 2
A resist resin layer 154 having a thickness of 5 μm was formed (FIG. 12).
(See (b)).

(3) Next, the resist resin layer 154 is formed.
Place a mask with a groove pattern drawn on it, 800m
It is exposed to J / cm ² and then developed with an alkaline solution to form an etching resist 15 on the mask layer.
5 was formed (see FIG. 12 (c)).

(4) Next, the mask layer exposed in the non-formed portion of the etching resist 155 is removed by the following method,
A mask 156 was formed by exposing a part of the substrate 151 (see FIG. 12D). That is, first, the exposed Si
_The SiO ₂ film is exposed by removing the ₃ N ₄ film by RIE treatment at 50 W for 2.5 hours, and the SiO ₂ film is wet-etched with a 3 wt% HF solution for 3 minutes. It was removed by application to expose the silicon substrate.

(5) Next, the etching resist was peeled off using a 10% by weight NaOH aqueous solution (FIG. 12).
(See (e)). As a result, on the silicon substrate 151, only the mask 156 having the opening corresponding to the portion where the groove is formed is formed.

(6) Next, the silicon substrate 151 on which the mask 156 is formed is subjected to a KOH concentration of 25% by weight and a liquid temperature of 7%.
8 ° C. etching solution (KOH: 100 g, H ₂ O: 30
0 g) to form eight V-grooves having a depth of 120 μm (see FIG. 12 (f)).

(7) Next, the mask 156 composed of the Si ₃ N ₄ film and the SiO ₂ film was removed by the following method (see FIG. 12 (g)). That is, the Si ₃ N ₄ film is removed by performing the same process as the RIE process used in the above step (4), and then the SiO ₂ film is removed in the same manner as the wet etching used in the above step (4). Then, the mask 156 is removed by performing the above process. Through this step, the entire upper surface of the substrate (including the wall surface of the groove) is made of silicon.

After that, a coating resin layer holding portion 158 (see FIG. 14A) for holding the optical fiber ribbon together with the coating resin layer on a part of the substrate 151 is cut using a device equipped with a diamond blade. It was formed by applying. Although only four grooves are formed on the substrate shown in FIG. 14, this drawing is a schematic diagram, and in fact, eight grooves were formed on the substrate as described above.

(8) Next, a roughened surface was formed under the following conditions on the entire upper surface (including the wall surface of the groove) of the substrate on which the groove and the coating resin layer holding portion were formed. That is, a roughened surface was formed on the entire upper surface of the substrate by immersing the substrate in a KOH solution having a concentration of 20% by weight and a temperature of 50 ° C. for 6 minutes. As for the surface roughness of the roughened surface formed on the upper surface of the substrate in this step, the average roughness Ra according to JIS B 0601 is 20 nm on the wall surface {(111) surface} of the groove, and the groove-unformed portion on the upper surface of the substrate. And the upper surface of the coating resin layer holding portion {(100) surface}
Was 250 nm. The average roughness Ra is a surface roughness meter (WYKO NT-2000) using interference fringes.
system).

(9) Next, the exposed portion of the optical fiber 115 of the optical fiber ribbon 110A produced in the above A is
It was housed in the V-shaped groove 157 (see FIGS. 14A and 14B), and the lid 160 manufactured in the above B was placed on the substrate 151 (see FIG. 15A). Furthermore, the gap between the groove 157 and the optical fiber 115, and the lid 160 and the substrate 15
An uncured adhesive (UV-3000, manufactured by Daikin Industries, Ltd.) was poured into the gap between the 1 (optical fiber 115).
The uncured adhesive (UV-3000) was also applied around the coating resin layer placed on the coating resin layer holding portion 158.

Next, an ultraviolet ray of 10 J / cm ² is irradiated from the upper portion of the substrate 151 provided with the lid portion 160 with a high pressure mercury lamp, and then the adhesive is heated at 60 ° C. for 1 hour. It was completely cured and the lid 160 was fixed. Further, here, by irradiating the coating resin layer holding portion with ultraviolet rays as well, a part of the exposed optical fiber and the coating resin layer are exposed to the coating resin layer holding portion via an adhesive (not shown). Fixed

(10) Next, the optical fiber ribbon 110A
Resin layer 114a not housed in the substrate at one end of the
And the optical fiber covered with this coating resin layer are cut and removed by a diamond cutter, and further, a polishing process is performed so that the end face of the optical fiber and the end faces of the substrate and the lid are aligned, and the optical fiber array 102 is formed. Manufactured (Fig. 15)
(See (b)).

(Embodiment 2) In the process B of Embodiment 1, except that a roughened surface is formed on the surface of the lid portion facing the substrate by single-sided grain polishing (# 1000). An optical fiber array was manufactured in the same manner as in Example 1. The average roughness Ra of the roughened surface formed in this step is 40.
It was 0 nm.

[0222] In addition, JIS B 0601 of the above roughened surface
The surface roughness based on is based on a surface roughness meter using interference fringes (WYKO NT-2000 manufactured by Biko Instruments Inc.).
system).

Further, a roughened surface was formed on one surface of a plate-like body made of the same material (high silicate glass) and having a thickness of 1.0 ± 0.05 mm as the above-mentioned lid by the same method as described above. The ultraviolet transmittance of this plate-shaped body was measured by the following method, and the transmittance was 71.5%. The transmittance was measured in the same manner as in Example 1. When the transmittance was measured, the roughened surface was placed so that it was on the light receiving surface side of the photometer.

(Embodiment 3) Embodiment 2 is the same as Embodiment 2 except that the roughened surface is formed by performing a one-side grain polishing (# 1000) and then treating with a 20% by weight KOH solution for 5 minutes. An optical fiber array was manufactured in the same manner as in. The average roughness Ra of the roughened surface formed in this step is 600 nm.
Met.

As in the second embodiment, the thickness is 1.0 ± 0.05 made of the same material (high silicate glass) as that of the lid.
A roughened surface was formed on one surface of a plate-shaped body having a thickness of mm by the same method as described above, and then the transmittance of ultraviolet rays of this plate-shaped body was measured. The transmittance was 75.0%.

(Embodiment 4) Instead of the one-sided grain polishing (# 1000) in Example 2, one-sided grain polishing (# 150).
0) was applied, and then an optical fiber array was manufactured in the same manner as in Example 2 except that a roughened surface was formed by treating with a KOH solution of 20% by weight for 5 minutes. The average roughness Ra of the roughened surface formed in this step was 450 nm.

As in the second embodiment, the thickness of the lid portion made of the same material (high silicate glass) is 1.0 ± 0.05.
A roughened surface was formed on one surface of the plate-shaped body of mm by the same method as described above, and then the transmittance of ultraviolet rays of this plate-shaped body was measured. The transmittance was 78.0%.

(Embodiment 5) In Embodiment 2, instead of the one-sided grain polishing (# 1000), one-sided grain polishing (# 50).
0) was applied, and then an optical fiber array was manufactured in the same manner as in Example 2 except that a roughened surface was formed by treating with a KOH solution of 20% by weight for 5 minutes. The average roughness Ra of the roughened surface formed in this step was 760 nm.

As in the second embodiment, the thickness is 1.0 ± 0.05 made of the same material (high silicate glass) as that of the lid.
A roughened surface was formed on one surface of the plate-shaped body of mm by the same method as described above, and the transmittance of ultraviolet rays of this plate-shaped body was measured. The transmittance was 73.0%.

Example 6 Example 2 is different from Example 2 except that the single sided grain polishing (# 1000) is not carried out and the roughened surface is formed only by treating with a 20% by weight KOH solution for 5 minutes. An optical fiber array was manufactured in the same manner as in. The average roughness Ra of the roughened surface formed in this step was 300 nm.

As in the second embodiment, the thickness is 1.0 ± 0.05 made of the same material (high silicate glass) as the lid.
A roughened surface was formed on one surface of the plate-shaped body of mm by the same method as described above, and the transmittance of ultraviolet rays of this plate-shaped body was measured. The transmittance was 82.5%.

(Example 7) A. Production of Optical Fiber Ribbon with Part of the Covering Resin Layer Removed In the same manner as in step A of Example 1, an optical fiber ribbon with some of the covering resin layer removed was produced.

B. Manufacture of Lid Section A plate-shaped lid section was manufactured in the same manner as in Example 1B, except that the recess for accommodating the exposed optical fiber was not formed. A roughened surface was formed on the surface of the lid facing the substrate in the same manner as in Example 1B.

C. Fabrication of Optical Fiber Array (1) Grooves were formed in a silicon substrate by the same method as the steps (1) to (7) of C in Example 1, and this was used as a groove forming member. Here, the coating resin layer holding portion was not formed. Then, Example 1 was formed on the surface of the groove forming member.
A roughened surface was formed by using a method similar to the step (8) of C. The surface roughness of the roughened surface formed on the groove forming member in this step is the average roughness R based on JIS B 0601.
a is 20 nm on the wall surface {(111) plane} of the groove, the groove non-forming portion on the upper surface of the groove forming member and the bottom surface of the groove forming member (portion to be brought into contact with the holding member in a later step) {(100)
Surface} of 250 nm, the side surface of the groove forming member {(010) plane}
Was 45 nm.

(2) Next, a plate-shaped body made of high silicate glass is prepared, and a groove forming member made of silicon is provided on the plate-shaped body (holding member) with a thermosetting adhesive (epoxy adhesive: Able Stick). A substrate in which a groove was formed was prepared by fixing using RP621-1E manufactured by the company (FIG. 2).
(See (d)). A roughened surface was formed on the surface of the holding member to which the groove forming member was fixed by the following method.

That is, first, the surface on which the groove forming member is to be fixed is subjected to single-sided grain polishing (# 1000), and then the lid portion is HF: H ₂ O = 1: 20 at a temperature of 45 ° C.
The roughened surface was formed by immersing in the HF aqueous solution for 30 minutes.

The surface roughness of the roughened surface formed in this step is
Average roughness Ra based on JIS B 0601 is 400n
It was m.

(3) Next, steps similar to the steps (9) and (10) of C of Example 1 were performed to complete the optical fiber array (see FIG. 2).

(Example 8) A. Production of Optical Fiber Ribbon with Part of the Covering Resin Layer Removed In the same manner as in step A of Example 1, an optical fiber ribbon with some of the covering resin layer removed was produced.

B. Fabrication of Lid (1) Grooves were formed in the silicon substrate by the same method as the steps (1) to (7) of C in Example 1, and this was used as a groove forming member. Here, the coating resin layer holding portion was not formed. Then, Example 1 was formed on the surface of the groove forming member.
A roughened surface was formed by using a method similar to the step (8) of C. The surface roughness of the roughened surface formed on the groove forming member in this step is the average roughness R based on JIS B 0601.
a is 20 nm on the wall surface {(111) plane} of the groove, a groove-unformed portion of the groove-formed surface of the groove-forming member, and a surface parallel to the groove-formed surface (a portion that will come into contact with the holding member in a later step).
The {(100) plane} was 250 nm, and the side surface of the groove forming member {(010) plane} was 40 nm.

(2) Next, a plate-shaped body made of high silicate glass having a width larger than that of the groove forming member and the same depth as the groove forming member is prepared. )
The groove forming member with a thermosetting adhesive (epoxy adhesive:
By fixing using RP621-1E manufactured by Able Stick Co., Ltd., a lid having a groove was produced (see FIG. 5 (d)). A roughened surface was formed on the surface of the holding member to which the groove forming member was fixed by the following method.

That is, first, the surface on which the groove forming member is to be fixed is grinded on one side (# 1000), and then the lid is HF: H ₂ O = 1: 20 at a temperature of 45 ° C.
The roughened surface was formed by immersing in the HF aqueous solution for 30 minutes.

The surface roughness of the roughened surface formed in this step is
Average roughness Ra based on JIS B 0601 is 400n
It was m.

C. Fabrication of optical fiber array (1) A plate-shaped substrate made of high silicate glass was prepared. (2) Next, the exposed portion of the optical fiber of the optical fiber ribbon produced in the above A is stored in the V groove of the lid,
The lid portion containing the optical fiber and the substrate are arranged such that the groove forming surface faces the substrate, and further, the gap between the groove and the optical fiber and the gap between the lid portion (optical fiber) and the substrate. Uncured adhesive (made by Daikin Industries, Ltd., UV-30
00) was poured. Further, the uncured adhesive (UV-3) is also applied to the periphery of the coating resin layer placed on the coating resin layer holder.
000) was applied.

Next, using a high pressure mercury lamp, 10 J /
Irradiate with cm ² of ultraviolet rays through the substrate, then 60 ° C.
The adhesive was completely hardened by heating for 1 hour at, and the lid was fixed. Further, here, the uncured adhesive around the coating resin layer was also irradiated with ultraviolet rays to fix the coating resin layer to a part of the substrate.

(3) Next, the coating resin layer not housed in the substrate at one end of the optical fiber ribbon and the optical fiber covered with this coating resin layer are cut and removed by a diamond cutter, and the optical fiber is further cut. An optical fiber array was manufactured by performing a polishing treatment so that the end face of the substrate and the end faces of the substrate and the lid were aligned with each other (see FIG. 5).

(Embodiment 9) When manufacturing the groove forming member in the step (1) of C of the embodiment 7, (7) of C of the embodiment 1 is performed.
An optical fiber array was manufactured in the same manner as in Example 7 except that the mask was not removed according to the process of 1. In the groove forming member according to the present embodiment, the wall surface of the groove {(11
1) surface only, a roughened surface having an average roughness Ra of 20 nm is formed, and the groove-unformed portion of the upper surface of the groove forming member and the bottom surface of the groove forming member (will come into contact with the holding member in a later step). The portion) and the side surface of the groove forming member were smooth surfaces made of Si ₃ N ₄ .

(Embodiment 10) In the step (1) of C of the embodiment 7, when the groove forming member is manufactured, (7) of the embodiment C is used.
An optical fiber array was manufactured in the same manner as in Example 7 except that the mask removal according to the process of 1) was performed only on the mask made of Si ₃ N ₄ and the mask made of SiO ₂ was not removed. In the groove forming member according to the present example, the roughened surface having the average roughness Ra of 20 nm is formed only on the wall surface {(111) surface} of the groove, and the groove non-forming portion of the upper surface of the groove forming member is formed. , The bottom surface of the groove forming member (the portion that will come into contact with the holding member in a later step) and the side surface of the groove forming member are
It was a smooth surface made of SiO ₂ .

With respect to the optical fiber arrays obtained in Examples 1 to 10, a cycle of holding at 130 ° C. for 3 minutes and at −65 ° C. for 3 minutes was defined as 1 cycle, and this cycle was set to 1 cycle.
A reliability test (heat cycle test) was repeated for 000 cycles, and then the optical fiber array was cut in a direction perpendicular to the axial direction of the optical fiber, and the cross section thereof was observed. As a result, Examples 1 to 10
In the optical fiber array of No. 3, the adhesive was reliably formed between the lid portion and the adhesive layer, and no crack was generated in the adhesive layer. Further, no peeling was observed between the substrate and the adhesive layer.

When the coupling loss of the optical fiber arrays of Examples 1 to 10 was measured, the coupling loss was 1.0 dB or less, and the quality required as a product was sufficiently satisfied. Incidentally, the above-mentioned coupling loss was measured by measuring the coupling loss by connecting the optical fiber array to the light receiving device while aligning the target mark of the optical fiber array and the target mark of the light receiving device, and then aligning them. . The binding loss was measured 3 times each and calculated as an average value.

Further, the amount of positional deviation of the optical fiber in the XY directions was 1.0 mm or less, which sufficiently satisfied the quality required as a product. The positional deviation amount R in the XY directions was calculated by the following calculation formula (3).

R = √ (x ² + y ² ) ... (3)

(Where x is a deviation from the design in the X-axis direction (direction parallel to the upper surface of the substrate and perpendicular to the groove), and y is
The deviation from the design in the Y-axis direction (direction perpendicular to the upper surface of the substrate) is shown. )

Further, an optical fiber array was manufactured in the same manner as in Example 1 except that the ultraviolet ray transmittance (%) of the lid portion was changed to an arbitrary size, and the data was used to determine the positional deviation amount of the optical fiber. , Coupling loss and simulated. The results are shown in Tables 1 and 2. The transmittance (%), the amount of positional deviation of the optical fiber, and the coupling loss were calculated by the same method as described above.

[0255]

[Table 1]

[0256]

[Table 2]

As is clear from the results shown in Tables 1 and 2, in the optical fiber array in which the ultraviolet ray transmittance of the lid is less than 65%, the positional deviation amount of the optical fiber is 1.0 m.
On the other hand, when the transmittance is 65% or more, the positional deviation amount of the optical fiber is 1 mm or less. Further, in an optical fiber array in which the transmittance of ultraviolet rays of the lid is less than 65%, there is no one having a splice loss of 0.5 dB or less, and there is one having a splice loss of more than 1.0 dB. Above 65%, the coupling loss is less than 1.0 dB. Further, it can be seen that there are many coupling losses of 0.5 dB or less when the transmittance is 70% or more.

In the optical fiber array of the present invention, the smaller the positional deviation of the lid is, the more preferable it is. However, if the positional deviation is within 1.0 mm, it is within the allowable range, and there is no problem as a product. Further, in the optical fiber array of the present invention, the smaller the coupling loss is, the more preferable it is. The above coupling loss is 1.0
If it exceeds dB, a problem easily occurs in the transmission of the optical signal.
In the optical fiber array of the present invention, when the positional deviation amount and the coupling loss are within the above ranges, the peeling of the substrate and the adhesive layer, the positional deviation of the lid and the optical fiber are less likely to occur, and various stresses are generated. However, the stress can be alleviated further.

In addition, after aligning one optical fiber array on one side and eight optical fiber arrays on the opposite side of the optical module in which the optical waveguide is formed on the silicon substrate with fluorinated polyimide, ultraviolet curing adhesive is used. 1 × 8 star coupler (optical branch coupler) by fixing and connecting with agent
Was manufactured. Here, the star coupler was manufactured by using one of the optical fiber arrays manufactured in Examples 7 to 10 as the optical fiber array connected to the optical module. Specifically, the optical module and the optical fiber array are attached to a joining device, and while the light is incident, the positions of the optical fibers are shifted, and the alignment is performed so that the peaks of the light at both ends are maximized. The uncured UV-curable adhesive was applied, and the uncured UV-curable adhesive was cured by irradiating light from various directions in the upper and lower directions. In this way, when an optical coupler is manufactured using the optical fiber array of the present invention and the optical module on which the optical waveguide is formed, the optical fiber array and the optical module are securely connected via the ultraviolet curable adhesive. It was connected.

[0260]

As described above, since the optical fiber array of the present invention has the above-mentioned structure, the substrate and the lid are securely fixed via the adhesive layer, and the substrate and the lid are bonded. In the optical fiber array of the present invention, an optical signal can be accurately transmitted without causing peeling between layers and displacement of the optical fiber.

[Brief description of drawings]

FIG. 1A is a partial perspective view schematically showing an example of an optical fiber array of the present invention, and FIG. 1B is a part A of FIG.
FIG. (C) is a perspective view showing a lid part constituting the optical fiber array of (a), and (d) is
It is a partial perspective view which shows the board | substrate which accommodated the optical fiber array which comprises the optical fiber array of (a).

FIG. 2 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 2 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

FIG. 3 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 3 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

FIG. 4 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 4 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

FIG. 5 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 5 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

FIG. 6 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 6 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

7 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 7 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

FIG. 8 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 8 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

9 (a) is a partial perspective view schematically showing another example of the optical fiber array of the present invention, and FIG. 9 (b) is (a).
FIG. 9 is a sectional view taken along line AA of FIG. (C) is a perspective view showing a lid portion constituting the optical fiber array of (a), and (d).
[Fig. 3] is a perspective view showing a substrate forming the optical fiber array of (a).

FIG. 10: Average spacing Sm of irregularities based on JIS B 0601, average spacing S of local peaks, and average roughness Ra
It is a reference diagram for explaining.

FIG. 11A is a partial perspective view schematically showing an example of the optical fiber array of the present invention in which a lid is formed,
(B) is a partial perspective view showing only a substrate and a laminated optical fiber ribbon which constitute the optical fiber array of (a),
(C) is the sectional view on the AA line of (a).

12A to 12G are cross-sectional views showing an example of a method for forming a groove on a substrate.

FIG. 13 is a partial perspective view schematically showing an embodiment of a laminated optical fiber ribbon.

14 (a) and 14 (b) are perspective views schematically showing a part of the manufacturing process of the optical fiber array of the present invention.

15A and 15B are perspective views schematically showing a part of the manufacturing process of the optical fiber array of the present invention.

[Explanation of symbols]

110 optical fiber ribbon 115, 235, 245 optical fiber 151,251 substrate 157,257 groove 160, 170 lid 100,200 Fiber Optic Array 210 laminated optical fiber ribbon

Continued front page    (72) Inventor Kunio Nagaya             1-1 Ibide, Northern Ibigawa-cho, Ibi-gun, Gifu Prefecture             Ogaki Kita Factory (72) Inventor Kazuhito Yamada             1-1 Ibide, Northern Ibigawa-cho, Ibi-gun, Gifu Prefecture             Ogaki Kita Factory F term (reference) 2H036 JA04 KA02 QA17 QA20 QA23                       QA24

Claims (4)

[Claims] 1. An optical device comprising a substrate and a lid portion fixed via an adhesive layer, wherein a plurality of grooves are formed on a part of the surface of the substrate or the lid portion, and an optical fiber is housed in the groove. An optical fiber array, wherein the transmittance of ultraviolet rays in a direction perpendicular to the main surface is 65 to 100% in all or a part of the area of the substrate and / or the lid. 2. A plurality of grooves are formed on the surface of the substrate,
The optical fiber array according to claim 1, wherein the substrate includes a member capable of forming a groove having a desired shape by etching. 3. A plurality of grooves are formed on the surface of the lid portion,
The optical fiber array according to claim 1, wherein the lid portion includes a member capable of forming a groove having a desired shape by etching. 4. The ultraviolet transmittance has a wavelength of 360 nm.
The optical fiber array according to any one of claims 1 to 3, which has a transmittance per 1 mm of light length.