JP2003114362A - Optical fiber array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide such an optical fiber array that, since optical fibers are surely fixed to grooves formed on a substrate with a UV-curing adhesive, the displacement of the optical fibers does not occur and optical signals can be accurately transmitted even when the optical fiber array is connected to optical devices or external force is added to the optical fiber array. SOLUTION: The optical fiber array is composed of a substrate having a plurality of grooves and a holding part of a coating resin layer formed on its upper surface and of an optical fiber ribbon having a plurality of coated optical fibers arranged in parallel and a coating resin layer formed around the fibers. The coated optical fibers are fixed to the grooves with an adhesive and the coated optical fibers and the coating resin layer are fixed with the adhesive to the holding part of the coating resin layer. The adhesive is a hardened product of an epoxy-based or acrylate-based UV-curing resin composition.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The first and second inventions are
The present invention relates to an optical fiber array.

[0002]

2. Description of the Related Art In recent years, attention has been focused on optical fibers mainly in the communication field. Particularly in the IT (information technology) field, communication technology using optical fibers is required to maintain a high-speed Internet network. Optical fiber has the features of low loss, high bandwidth, small diameter / light weight, no induction, resource saving, etc. In the communication system using the optical fiber having this feature, the communication using the conventional metallic cable is used. Compared with the system, the number of repeaters can be greatly reduced, construction and maintenance are facilitated, and the communication system can be made economical and highly reliable.

Further, in the optical fiber, not only the light of one wavelength but also the light of many different wavelengths can be simultaneously multiplexed and transmitted by one optical fiber, so that it has a large capacity for various purposes. This has a great advantage that a transmission line can be realized and a video service can be supported.

Further, in optical fiber communication, in order to connect the optical fiber to a light receiving element, a terminal device (personal computer, mobile, game, etc.) directly or through an optical waveguide or the like, a plurality of optical fibers are arranged at predetermined intervals. In order to achieve this, an optical fiber array is used.

Conventionally, as an optical fiber array, for example, an optical fiber array is disclosed in which the optical fibers are housed in alignment with each of a plurality of V-grooves, and the optical fibers are fixed via an adhesive. ing. Further, an optical fiber array in which a lid is further formed on a substrate accommodating an optical fiber is also disclosed.

[0006]

Such an optical fiber array has, for example, a groove formed on the upper surface of a substrate,
It is manufactured by placing an optical fiber, then pouring an uncured adhesive from the side surface of the substrate into the gap between the optical fiber and the groove, and then performing a curing treatment to store and fix the optical fiber in the groove. Was there. Further, in the case of manufacturing an optical fiber array in which a lid is attached on a substrate as an optical fiber array, after placing the optical fiber in the groove of the substrate, the lid is attached on the substrate, and then the substrate and Pouring an uncured adhesive into the gap between the groove and the optical fiber and the gap between the lid and the optical fiber from the side surface of the lid, and then applying a curing treatment to store and fix the optical fiber in the groove. Was manufactured by.

However, in the optical fiber array manufactured by such a method, the positional displacement of the optical fiber occurs when the optical fiber array is connected to an optical element or when an external force is applied to the optical fiber array. However, a connection failure may occur between the optical fiber array and the optical element such as the light receiving element or the light emitting element.

[0008]

Therefore, the present inventors have
As a result of diligent studies, such a positional deviation of the optical fiber is caused by the fact that the gap between the groove and the optical fiber or the gap between the lid and the optical fiber is not sufficiently filled with the adhesive. Therefore, it was found that the positional deviation of the optical fiber does not occur by surely filling the gap between the groove and the optical fiber with the adhesive, and the first and second optical fiber arrays of the present invention were completed.

That is, in the optical fiber array of the first aspect of the present invention, a substrate having a plurality of grooves and a coating resin layer holding portion formed on the upper surface thereof and a plurality of optical fiber core wires are arranged in parallel, and the periphery thereof is arranged. An optical fiber array comprising an optical fiber ribbon on which a coating resin layer is formed, wherein an optical fiber core wire is fixed to the groove via an adhesive, and an optical fiber is attached to the coating resin layer holding portion via an adhesive. The fiber core wire and the coating resin layer are fixed, and the adhesive is a cured product of an epoxy or acrylate ultraviolet curable resin composition.

In the optical fiber array of the first aspect of the present invention, the ultraviolet curable resin composition has a viscosity of 200 to 2
It is desirable that the pressure is 000 mPa · s. Further, in the optical fiber array of the first aspect of the present invention, the viscosity of the ultraviolet curable resin composition for fixing the optical fiber core wire is 200.
To 2000 mPa · s, and the viscosity of the ultraviolet curable resin composition for fixing the coating resin layer is 5000 to 3000.
It is also preferable that it is 0 mPa · s.

In the optical fiber array of the second aspect of the present invention, a substrate having a plurality of grooves and a coating resin layer holding portion formed on the upper surface thereof and a plurality of optical fiber core wires are arranged in parallel, and a coating resin is provided around the substrate. An optical fiber array comprising a layered optical fiber ribbon, wherein an optical fiber core wire is fixed to the groove with an adhesive agent, and an optical fiber core wire is applied to the coating resin layer holding section with an adhesive agent. And the coating resin layer are fixed, the adhesive for fixing the optical fiber core is a cured product of an epoxy-based ultraviolet curable resin composition, and the adhesive for fixing the coating resin layer is an acrylate or silicone. It is characterized in that it is a cured product of an ultraviolet curable resin composition of the system.

In the optical fiber array according to the second aspect of the present invention, the epoxy-based UV-curable resin composition and the acrylate- or silicone-based UV-curable resin composition both have a viscosity of 200 to 2000 mPas.
・ S is desirable.

In the optical fiber array according to the second aspect of the present invention, the viscosity of the epoxy-based UV-curable resin composition is 200 to 2000 mPa · s, and the viscosity of the acrylate-based UV-curable resin composition is Is 5000
30,000 mPa · s, or the viscosity of the silicone-based ultraviolet-curable resin composition is 5,000 to 50
It is also desirable that the pressure is 000 mPa · s.

In the optical fiber array according to the first or second aspect of the present invention, it is desirable that a lid is attached to at least a part of the substrate via an adhesive layer so as to cover the optical fiber core wire. In this case, it is desirable that the adhesive layer has a cross-sectional shape in a direction perpendicular to the axis of the optical fiber core, which is divergent toward the outer edge portion of the substrate. Further, it is desirable that the shape of the lid is such that a recess for accommodating a part of the optical fiber core wire is formed.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An optical fiber array according to the first aspect of the present invention comprises a substrate having a plurality of grooves and a coating resin layer holding portion formed on the upper surface thereof, and a plurality of optical fiber core wires arranged in parallel.
An optical fiber array comprising an optical fiber ribbon on which a coating resin layer is formed, wherein an optical fiber core wire is fixed to the groove via an adhesive, and an adhesive is applied to the coating resin layer holding portion. The optical fiber core wire and the coating resin layer are fixed to each other with the adhesive, and the adhesive is a cured product of an epoxy-based or acrylate-based UV-curable resin composition.

In the optical fiber array of the first aspect of the present invention, the optical fiber core wire and the coating resin layer, the groove formed on the upper surface of the substrate and the coating resin layer holding portion, are cured products of the ultraviolet curable composition (hereinafter , UV curable adhesive), and the optical fiber core wire is securely connected to the optical fiber array even when the optical fiber array is connected to an optical element or when an external force is applied to the optical fiber array. It is possible to accurately transmit an optical signal without causing a positional deviation.

The optical fiber array according to the first aspect of the present invention will be described with reference to the drawings. FIG. 1A is a partial perspective view schematically showing an example of the optical fiber array of the first aspect of the present invention, and FIG. 1B is a sectional view taken along the line AA of FIG.
(C) is a BB line sectional view of (a).

As shown in FIG. 1, the optical fiber array 10
In No. 0, a plurality of V grooves 157 are formed in parallel on the upper surface of the substrate 151, and the optical fiber core wires 115 of the optical fiber ribbon 110 are fixed to the respective V grooves 157 with an adhesive 159. In addition, the groove 1 is formed on the upper surface of the substrate 151.
Separately from 57, the optical fiber core wire 115 and the coating resin layer 1
A coating resin layer holding portion 158 for fixing the optical fiber core wire 115 and the coating resin layer 113 is fixed to the coating resin layer holding portion 158 with an adhesive 159. In the figure, 111 is a core, 11
2 is a clad.

The portion for fixing the coating resin layer is the groove 1
It is lower than the groove forming surface on which 57 is formed, and the boundary between this groove forming surface and the portion for fixing the coating resin layer is an inclined surface that descends toward the portion for fixing the coating resin layer. . The boundary between the groove forming surface and the portion for fixing the coating resin layer may be a vertical wall surface, but since the load applied to the optical fiber core can be reduced, an inclined surface as shown in FIG. 1 is used. Is desirable. In the present specification, the wall surface of the boundary between the groove forming surface and the coating resin layer holding portion is also included in the coating resin layer holding portion.

Further, the shape of the coating resin layer holding portion may be a concave shape capable of accommodating the optical fiber core wire together with the surrounding coating resin layer. Note that the concave shape referred to here is, for example, a shape in which a wall surface having the same height as the upper surface of the substrate or a lower wall surface than the upper surface of the substrate is provided on the lateral outer edge of the coating resin layer holding portion shown in FIG. Etc.

The adhesive 159 for fixing the optical fiber core wire and the coating resin layer is both an epoxy or acrylate ultraviolet curable adhesive (cured product of an ultraviolet curable resin composition). As will be described later, when manufacturing the optical fiber array of the first aspect of the present invention, when an uncured adhesive is poured into the gap between the groove and the optical fiber core wire from the side surface of the substrate, uncured in the gap due to surface tension. The adhesive will be filled, but by using the above epoxy or acrylate ultraviolet curable resin composition,
The gap between the groove and the optical fiber core is surely filled with the uncured adhesive (ultraviolet curable resin composition).
As a result, the optical fiber core wire is fixed in the groove via the ultraviolet curable adhesive, and the positional deviation of the optical fiber core wire does not occur. Further, this ultraviolet curable adhesive is also suitable as an adhesive for fixing the coating resin layer to the coating resin layer holding portion. The adhesive for fixing the optical fiber core wire is an adhesive indicated by 159a in FIG. 1, and the adhesive for fixing the coating resin layer is an adhesive indicated by 159b in FIG.

Further, it is desirable that a part of the ultraviolet curable adhesive is fluorinated. By fluorinating, it is difficult for water to be generated by the cured adhesive, and the moisture resistance is improved. In addition, insulation, heat resistance, chemical resistance, etc. are also improved.

The viscosity of the ultraviolet curable resin composition is 2
00 to 2000 mPa · s is desirable. The above viscosity is 20
If the viscosity is less than 0 mPa · s, the viscosity is too low, and thus the UV curable resin composition that has flowed into the gap between the groove and the optical fiber core wire may flow out before curing.
If it exceeds a · s, the gap between the groove and the optical fiber core wire may not be completely filled.

In the optical fiber array according to the first aspect of the present invention, the viscosity of the ultraviolet curable resin composition for fixing the optical fiber core is 200 to 2000 mPa · s, and the ultraviolet curing for fixing the coating resin layer is performed. It is also desirable that the viscosity of the mold resin composition is 5,000 to 30,000 mPa · s. Further, the viscosity of the ultraviolet curable resin composition for fixing the coating resin layer is more preferably 5000 to 20000 mPa · s. By using a resin composition having a viscosity in the above range as the ultraviolet curable resin composition for fixing the optical fiber core wire, the resin composition is reliably filled in the gap between the optical fiber core wire and the groove, and the coating When a resin composition having a viscosity in the above range is used as the ultraviolet curable resin composition for fixing the resin layer, it is easy to apply the resin composition around the coating resin layer. The adjustment of the viscosity of the ultraviolet curable resin composition may be carried out by adjusting the blending amount of a solvent and various additives, and the viscosity is adjusted by blending a solvent and various additives in a commercial product described later. May be used. In addition, in the present specification, the viscosity of the resin composition refers to the viscosity at 25 ° C., unless otherwise specified.

Specific examples of the above-mentioned epoxy-based UV-curable resin composition are, for example, Daikin Industries, Ltd., Optodyne UV-1000 (viscosity: 250 mPa · s), Optodyne UV-1100 (viscosity: 250 mPa · s).
s), Optodyne UV-2100 (viscosity: 290 mP
a ・ s), Optodyne UV-3100 (viscosity: 480
mPa · s), Optodyne UV-3200 (viscosity: 3
10 mPa · s), Optodyne UV-4000 (viscosity: 450 mPa · s), NTT Advance Technology's NA3925M (viscosity: 185 mPa · s),
AT9390 (viscosity: 600 mPa · s) and the like can be mentioned.

Specific examples of the acrylate-based UV-curable resin composition include Optodyne UV-2000 (viscosity: 360 mPa.
s), Optodyne UV-3000 (viscosity: 1600 m
Pa · s), NTT Advanced Technology Co., AT
6001 High Tg product (viscosity: 200-800 mPa.
s), AT6177 (viscosity: 1470 mPa · s),
Ablelux A4083 manufactured by Ablestik
(Viscosity: 300 mPa · s), Ablelux A40
65 (viscosity: 850 mPa · s), Ablelux A
4031 (viscosity: 800 mPa · s) and the like.

The UV curable resin composition for fixing the coating resin layer has a viscosity of 5,000 to 30,000 mPas.
When the ultraviolet curable resin composition of s is used, for example,
An epoxy-based ultraviolet curable resin composition such as AT9575 (viscosity: 30000 mPa · s) manufactured by NTT Advanced Technology can be used, and further, for example,
AT8083 (viscosity: 20000 mPa · s) manufactured by NTT Advanced Technology, or Ablelux A4088 (viscosity: 15000 m) manufactured by Ablestik.
Pa ・ s), Ablelux A4025 (viscosity: 50
An acrylate-based UV-curable resin composition such as 00 mPa · s) can be used.

Specific examples of the acrylate-based UV-curable adhesive include 40 to 50% by weight of acrylate oligomer, 1 to 10% by weight of vinyl ester resin, 45 to 55% by weight of acrylate monomer, and An ultraviolet curable resin composition containing 1 to 10% by weight of a polymerization initiator is also included.

Further, it is desirable that a part of the acrylate oligomer or the acrylate-based monomer is fluorinated. As described above, when a part of the acrylate oligomer or the like is fluorinated, the above-described effects can be obtained, and the ultraviolet-curable resin composition has excellent translucency, and therefore, at the time of ultraviolet irradiation, The entire resin composition will be cured in a short time.

The UV-curable resin composition may contain, if necessary, resin particles, particles such as inorganic particles and metal particles, and additives such as a brightener and a reaction stabilizer. By including these additives, the fluidity and the degree of curing can be adjusted.

Examples of the resin particles include those made of thermosetting resin, thermoplastic resin, and the like. Specifically, for example, amino resin (melamine resin, urea resin,
(Guanamine resin), epoxy resin, phenol resin, phenoxy resin, polyimide resin, polyphenylene resin,
Examples include polyolefin resins, fluororesins, bismaleimide-triazine resins, and the like. These may be used alone or in combination of two or more. Also,
As the resin particles, particles made of rubber such as acrylonitrile-butadiene rubber and polychloroprene rubber can also be used.

Examples of the inorganic particles include aluminum compounds such as alumina and aluminum hydroxide, calcium compounds such as calcium carbonate and calcium hydroxide, potassium compounds such as potassium carbonate, magnesium compounds such as magnesia, dolomite and basic magnesium carbonate, Examples thereof include silicon compounds such as silica and zeolite, titanium compounds such as titania, and the like. These may be used alone or in combination of two or more, and as the above-mentioned inorganic particles, phosphorus or a phosphorus compound may be used.

Examples of the metal particles include gold, silver,
Examples include copper, tin, zinc, stainless steel, aluminum, nickel, iron and lead. These may be used alone or in combination of two or more. By including these particles, adjustment of the thermal expansion coefficient and improvement of flame retardancy can be achieved.

The above ultraviolet curable resin composition preferably has a refractive index of 1.4 to 1.6 after curing and a light transmittance of 90% or more after curing. In addition,
In this specification, the refractive index means a refractive index when light of 589 nm is transmitted, and the light transmittance means a transmittance of light having a wavelength of 500 to 1600 nm.

The UV curable resin composition has a thermal expansion coefficient of 3 × 10 ^{−5 to} 11 × 10 ⁻⁵ (1) after curing.
/ ° C.) is desirable. This is because when using the optical fiber array, it is possible to prevent the positional deviation of the optical fiber core wire due to thermal expansion or the like. In addition, in this specification, a thermal expansion coefficient is 25-80 degreeC.
The average coefficient of thermal expansion in.

Further, the above ultraviolet curable resin composition is
It is desirable that the curing shrinkage is 3 to 9%. This is because it is possible to prevent the positional deviation from occurring in the optical fiber core wire when the above ultraviolet curable resin composition is cured.

The optical fiber array 100 shown in FIG.
In, the four optical fiber core wires are fixed to the groove on the substrate, but the number of the optical fiber core wires fixed to the groove in the optical fiber array of the first aspect of the present invention is not limited to four. Alternatively, the number may be three or less, or may be five or more.

Further, in the optical fiber array of the first aspect of the present invention, it is desirable that a lid is attached to at least a part of the substrate via an adhesive layer so as to cover the optical fiber core wire. The adhesive layer is preferably formed by curing the same resin composition as the ultraviolet curable adhesive that fixes the optical fiber core wire in the groove of the substrate. The shape of the lid is not particularly limited as long as it can protect the upper surface of the optical fiber array, and may be, for example, a plate-like member, but a part of the optical fiber core wire can be stored together. A shape in which a concave portion is formed is desirable. Hereinafter, an optical fiber array having a lid will be described with reference to the drawings.

FIG. 2 (a) is a partial perspective view schematically showing an example of the optical fiber array of the first aspect of the present invention to which a lid is attached, and FIG. 2 (b) is a lid attached to the optical fiber array. It is a perspective view which shows only a part, (c) is A of (a).
FIG. 6A is a sectional view taken along line A-A, and FIG. 7D is a sectional view taken along line BB in FIG. As shown in FIG. 2, in the optical fiber array 101, the lid portion 160 is attached on the substrate 151 that houses the optical fiber ribbon 110.
A recessed portion 161 is formed on one side to collectively accommodate a part of the optical fiber core wire 115 (a portion of the optical fiber core wire which is not accommodated in the groove 157). In addition, the recess 16
An adhesive layer 169 is formed in the gap between the optical fiber 1 and the optical fiber core wire. The outer edge of the substrate 151 and the outer edge of the lid 160 are in close contact with each other via an adhesive layer (not shown). In the figure, 159 is an adhesive, of which 1
Reference numeral 59a is an ultraviolet curable adhesive for fixing the optical fiber core wire, and 159b is an ultraviolet curable adhesive for fixing the coating resin layer.

Here, it is desirable that the adhesive layer 169 filled in the recess formed in the lid portion and the gap between the optical fiber core wires is also an epoxy or acrylate ultraviolet curing adhesive. Examples thereof include the same ones as the above-mentioned UV-curable adhesive that fills the gap between the groove formed in the substrate and the optical fiber core wire as described above.

When the shape of the lid has a recess for accommodating a part of the optical fiber core wire in a lump, the depth of the recess is 95% or less of the diameter of the optical fiber core wire. desirable. When the depth of the concave portion exceeds 95% of the diameter of the optical fiber core wire, the portion occupied by the optical fiber core wire in the concave portion is small depending on the depth of the groove formed on the upper surface of the substrate, and the optical fiber core wire moves vertically. It may cause misalignment. The depth of the recess is preferably the same as the height of the portion of the optical fiber core wire that is housed in the recess.

In the optical fiber array of the first aspect of the present invention as shown in FIGS. 1 and 2, the coating resin layers 113, 11
It is desirable that a roughened surface (not shown) is formed on the surface of the optical fiber core wire from which 4 has been removed. This is because the adhesion between the optical fiber core wire and the ultraviolet curable adhesive is improved. The roughened surface has an average roughness Ra of 1
It is desirable that the thickness is ˜100 nm. The average roughness Ra is
If it is less than 1 nm, the adhesion between the optical fiber core wire and the ultraviolet curable adhesive is hardly improved, while if the average roughness Ra exceeds 100 nm, the unevenness of the surface of the optical fiber core wire becomes large, so that the optical fiber core wire becomes large. The cross-sectional shape of the optical fiber deviates from the circular shape, the optical fiber core wire is likely to be displaced, and the optical signal transmission may be adversely affected. The lower limit of the average roughness of the roughened surface is more preferably 10 nm, and the upper limit thereof is more preferably 50 nm.

The method for forming the roughened surface is not particularly limited, but it is preferable that the roughened surface is formed using a roughening liquid containing fluoride. This is because a roughened surface having an average roughness Ra within the above range can be formed in a short time.

As the roughening liquid containing the above-mentioned fluoride, for example, HF aqueous solution, HF-NH ₄ F mixed liquid, NaF aqueous solution, BaF ₂ aqueous solution, KF aqueous solution, CaF ₂ aqueous solution, X
Examples include eF ₂ aqueous solution. Among these, HF
A solution containing is desirable. This is because a roughened surface having a desired average roughness Ra can be formed in a short time without adversely affecting the optical fiber ribbon (deformation of the optical fiber core wire, etc.). It is suitable for forming a roughened surface on the surface of a component type optical fiber.

Further, in the optical fiber arrays 100 and 101 shown in FIGS. 1 and 2, the optical fiber core wire is exposed by removing the coating resin layer at one end on the substrate 151 on which the plurality of V grooves 157 are formed. The optical fiber ribbon 110 is fixed. The optical fiber ribbon is not particularly limited, and a conventionally known one can be used. For example, the core 111 and the clad 1 as shown in FIG.
A primary coating resin layer 113 is formed around an optical fiber core wire 115 composed of 12 and the optical fiber core wires 115 covered with the primary coating resin layer 113 are arranged in parallel to each other and are collectively covered by the secondary coating resin layer 114. The coated optical fiber ribbon 110 can be used.

As the optical fiber core wire 115 constituting the optical fiber ribbon, for example, a silica optical fiber containing silica glass (SiO ₂ ) as a main component, soda lime, glass,
Examples thereof include a multi-component optical fiber containing borosilicate glass as a main component, a plastic optical fiber containing a plastic such as silicone resin or acrylic resin as a main component, and the like. Of these, quartz optical fiber is desirable.

The primary coating resin layer 113 serves as a protective layer for preventing the optical fiber core wire from being damaged. Further, the material is not particularly limited, for example, thermosetting resin such as epoxy resin, silicone resin, urethane resin, phenol resin, polyimide resin, polyolefin resin, fluororesin, methacrylic acid or acrylic acid, The photosensitive resin etc. which made the (meth) acrylic reaction of the thermosetting group of the thermosetting resin mentioned above are mentioned. The number of the primary coating resin layers is not limited to one and may be two or more.

The secondary coating resin layer 114 serves to protect the optical fiber core wire around which the primary coating resin layer is formed and to maintain the shape of the optical fiber ribbon in which the optical fiber core wires are arranged in parallel. Plays. The material is not particularly limited, and examples thereof include the same thermosetting resin and photosensitive resin as the material of the primary coating resin layer. The number of the secondary coating resin layers is not limited to one and may be two or more.

In the optical fiber arrays 100 and 101, one optical fiber ribbon from which the coating resin layer at one end is removed is fixed to the substrate. The constituting optical fiber ribbon may be a laminated optical fiber ribbon in which a plurality of optical fiber ribbons (for example, two pieces) are stacked. When a laminated optical fiber ribbon is used, a plurality of optical fiber core wires can be arranged in parallel at high density in the groove of the substrate.

FIG. 3 is a partial perspective view schematically showing an example of the optical fiber array of the first invention using the laminated optical fiber ribbon. As shown in FIG. 3, in the optical fiber array 200, the exposed optical fiber core wires 235 and 245 at one end of the laminated optical fiber ribbon 210 are fixed to the V groove 257 on the substrate 251 via the ultraviolet curable adhesive 259. ing. In addition to the groove 257, a coating resin layer holding portion 258 for fixing the optical fiber core wires 235 and 245 and the coating resin layer is formed on the upper surface of the substrate 251, and the coating resin layer holding portion 258 is provided in the coating resin layer holding portion 258. , Optical fiber core wire 2
35, 245 and the coating resin layer are ultraviolet curable adhesives 25
It is fixed through 9. Also, in such an optical fiber array using a laminated optical fiber ribbon,
The shape of the coating resin layer holding portion may be a concave shape that allows the optical fiber core wire to be fixed together with the surrounding coating resin layer.

In the laminated optical fiber ribbon 210, two optical fiber ribbons 230 and 240 each having an exposed optical fiber core wire at one end are stacked, and the exposed optical fiber core wire 245 of the lower optical fiber ribbon 240 is stacked.
And the exposed optical fiber core wires 235 of the upper optical fiber ribbon 230 are alternately arranged.

In the laminated optical fiber ribbon 210,
The exposed optical fiber core wires 235, 2 are arranged so that the exposed optical fiber core wires 235, 245 are arranged at the same height.
Each of 45 is bent at a part thereof. In the laminated optical fiber ribbon 210, a part of each of the exposed optical fiber core wire 235 of the upper optical fiber ribbon 230 and the exposed optical fiber core wire 245 of the lower optical fiber ribbon 240 is bent, If both optical fiber cores can be arranged at the same height, only the exposed optical fiber core of the upper optical fiber ribbon may be bent, or the exposed optical fiber of the lower optical fiber ribbon may be bent. Only the fiber core wire may be bent.

In the laminated optical fiber ribbon 210, it is desirable that the upper optical fiber ribbon 230 and the lower optical fiber ribbon 240 are fixed to each other with an adhesive or the like. This is because the positional deviation of the optical fiber core wires arranged in high density in parallel is less likely to occur. Examples of the adhesive used here for fixing the optical fiber ribbons to each other include the above-mentioned epoxy-based or acrylate-based UV-curable adhesive.
In addition, conventionally known adhesives can also be used.

In the optical fiber array of the first aspect of the present invention, an optical fiber ribbon (including a laminated optical fiber ribbon).
However, instead of the optical fiber ribbon as described above, a plurality of single-core optical fibers arranged in parallel may be used.

Next, a method of manufacturing the optical fiber array according to the first aspect of the present invention will be described. (1) To manufacture the optical fiber array, first, a plurality of grooves are formed in the substrate. The material of the substrate is not particularly limited as long as it is excellent in flatness when subjected to outer shape processing, easily subjected to mirror surface processing, and excellent in shape retention. Specifically, for example, silicon, silicon carbide,
Alumina, aluminum nitride, mullite, ceramic,
Inorganic materials such as gallium arsenide, zirconia, quartz and glass; metallic materials such as copper, iron and nickel; thermosetting resins, thermoplastic resins, photosensitive resins, organic materials such as composites thereof, and organic materials thereof Examples include those impregnated with a reinforcing material such as glass fiber.

Among these, an inorganic material is preferable because it is less likely to expand or contract (deform) due to heat or humidity and has excellent mechanical strength. In the substrate made of an inorganic material having such characteristics, when the optical fiber core wire is fixed, in particular, deformation or waviness of the optical fiber core wire is unlikely to occur, and particularly when transmitting an optical signal through the optical fiber core wire. This is because inconvenience is unlikely to occur.

As a method of forming the groove on the substrate, for example, a method of passing through the following steps (i) to (vi) can be used. 4A to 4F are cross-sectional views showing an example of a method for forming a groove on a substrate.

(I) First, the mask layer 15 is formed on the substrate 151.
2 (152a, 152b) are formed (see FIG. 4A). The number of mask layers is not limited to two as shown in FIG. 4 and may be one or three or more.

As a method of forming the mask layer 152,
For example, a method of forming a thin film by sputtering, CVD, plating or the like, a method of forming an oxide film by thermal oxidation or the like, a method combining these, or the like can be used. Among these, for example, when forming a mask layer on a substrate made of silicon, first an oxide film (SiO ₂ film) is formed by thermal oxidation, and then a thin film is formed on this oxide film by CVD. A method of forming is desirable. By forming such a mask layer, it is possible to form a mask having an arbitrary shape by subjecting an arbitrary portion to etching treatment in a later step.

(Ii) Next, a resist resin layer 154 is formed on the mask layer 152 (see FIG. 4B). Specifically, a method in which a resist resin composition whose viscosity has been adjusted in advance is applied by a spin coater, a curtain coater, a roll coater, printing, or the like, or a resist resin film which has been formed into a film shape in advance is attached. A method of attaching can be used.

The resin composition for resist and the resin film for resist are composed of, for example, a resin component and a curing agent, particles, a rubber component, an additive, a reaction stabilizer, a solvent and the like which are blended as necessary. There are things. Examples of the resin component include a thermosetting resin, a thermoplastic resin, a photosensitive resin, a resin in which a part of the thermosetting resin is replaced with a photosensitive group, a composite resin of these, and the like.

Specifically, for example, a thermosetting resin such as an epoxy resin, a phenol resin, a polyimide resin, a bismaleimide resin, a polyphenylene resin, a polyolefin resin, or a fluororesin; a thermosetting group of these thermosetting resins (for example, , (Epoxy group in epoxy resin) is reacted with methacrylic acid or acrylic acid to form an acrylic group (photosensitive group).
Resins provided with: thermoplastics such as phenoxy resin, polyether sulfone (PES), polysulfone (PSF), polyphenylene sulfone (PPS), polyphenylene sulfide (PPES), polyphenyl ether (PPE), and polyetherimide (PI) Resin: Acrylic resin, photosensitive resin such as ultraviolet curable resin, and the like. Among these, epoxy resin, phenol resin, polyimide resin, acrylic resin, and ultraviolet curable resin are preferable. This is because when the mask layer under the resist resin layer is treated with an etching solution in a later step, the resistance to the etching solution is excellent. Examples of the curing agent include imidazole curing agents, amine curing agents, acid anhydride curing agents, and the like.

The thickness of the resin layer for resist is 10
˜50 μm is desirable. The resist resin layer may be in a cured state or a semi-cured state. Specifically, for example, in the case where the resist resin layer in the portion corresponding to the groove to be formed on the substrate is removed by exposure and development in a later step, it is preferably in a semi-cured state. When the resist resin layer corresponding to the groove is removed, it may be in a cured state or a semi-cured state. In the case of forming a resist resin layer in a completely cured state or a semi-cured state, it is desirable to perform the curing treatment by heating at 70 to 200 ° C, for example. Moreover, you may perform step hardening which changes a heating temperature step by step.

(Iii) Next, a part of the resist resin layer 154, that is, a part corresponding to a groove formed in the substrate 151 is removed to obtain an etching resist 155 (FIG. 4).
(See (c)). The resist resin layer 154 can be removed by, for example, exposure and development treatment. Specifically, for example, a mask is placed on the semi-cured resin layer for resist, an exposure process is performed, and then a development process using a chemical solution such as an alkaline solution or an organic solvent is performed. The developing treatment can be performed by immersing the substrate having the resin layer for resist in the chemical solution or spraying the chemical solution. As the mask, it is possible to use a mask in which a groove pattern is drawn in a portion corresponding to the removed portion of the resist resin layer.

The removal of the resist resin layer 154 is
Alternatively, laser processing may be used. Examples of the laser used for the laser processing include carbon dioxide gas laser, excimer laser, UV laser, and YAG laser.
These lasers may be selectively used in consideration of the shape of the removed portion of the resist resin layer, the composition of the resist resin layer, and the like. By adjusting the shape of the etching resist formed in this step, it is possible to adjust the shape of the groove formed through the subsequent steps.

(Iv) Next, the mask layer 152 exposed in the portion where the etching resist 155 is not formed is removed, and the substrate 151 is removed.
A mask 156 is formed by exposing a portion where the groove is formed (see FIG. 4D). The mask layer 152 can be removed by, for example, plasma treatment using oxygen plasma or nitrogen plasma, corona treatment, or dry etching treatment such as reverse sputtering. Specifically, for example,
This can be performed by irradiating the mask layer with oxygen plasma under vacuum or reduced pressure. By performing such a dry etching process, it is possible to selectively remove only the mask layer in the resist non-forming portion without causing damage or deformation of the etching resist.

The mask layer 152 can be removed by, for example,
It is also performed by immersing the substrate on which the mask layer 152 is formed in an etching solution or an acid solution, immersing the substrate in the solution and performing ultrasonic treatment, or spraying the etching solution or the acid solution on the mask layer. be able to. The removal method to be specifically selected may be appropriately determined in consideration of the material and thickness of the mask layer. For example, when the mask layer is made of an oxide film, plasma treatment or etching solution is used. When the mask layer is made of a metal layer, reverse sputtering or a treatment with an etching solution may be selected.

(V) Next, the etching resist 15
5 is peeled and removed (see FIG. 4E). The removal of the etching resist 155 should be carried out using an alkaline solution such as NaOH, KOH, an acid solution such as sulfuric acid, acetic acid, carbonic acid, alcohols such as methanol and ethanol, amines, ketones, organic solvents such as acetone, and the like. You can As a result, only the mask 156 having the opening corresponding to the portion where the groove is formed is formed on the substrate 151.

(F) Next, a groove 157 is formed in the substrate 151 (see FIG. 4F). The groove 157 is, for example, the substrate 1
It can be formed by spraying an etching solution on 51 through the mask 156 or by immersing the substrate 151 on which the mask 156 is formed in the etching solution. Examples of the etching solution include NaOH and K
An alkali such as OH, an acid such as nitric acid, phosphoric acid, sulfuric acid, a fluorine-based compound such as hydrogen fluoride or bromine fluoride, a halide, a hydrogen peroxide solution, an alcohol such as methanol or ethanol, or the like can be used. When the groove is formed by using these etching solutions, the cross-sectional shape of the groove is V-shaped, inverted trapezoidal shape, rectangular shape, or a combination thereof.

The concentration of the etching solution is preferably 10 to 50% by weight. If the concentration is less than 10% by weight, the etching process may take a long time, while if it exceeds 50% by weight, the etching rate hardly changes.
The temperature of the etching solution is preferably 20 to 90 ° C., and the etching rate is preferably 0.5 to 5.0 μm / min. If the temperature of the etching solution is lower than 20 ° C., the etching may not be sufficiently performed, and even if the temperature of the etching solution exceeds 90 ° C., the etching amount is hardly changed, and the safety during the work is lowered.

Here, when the groove is formed in the substrate whose material is silicon or gallium arsenide, it is desirable to perform etching treatment using an alkaline solution such as KOH. When a substrate made of silicon or gallium arsenide is subjected to etching treatment, a groove having a desired shape is formed by selecting an appropriate etching surface, type of etching solution, and shape of the etching resist non-forming portion. be able to.

That is, when a silicon substrate is etched using an etching solution containing KOH, the (100) plane of the silicon substrate is preferentially etched as compared with the (111) plane and the (110) plane, and the respective crystals are crystallized. Since the etching rate ratio of the surface is almost constant, a groove having a desired shape can be formed. Specifically, when the (100) surface of the silicon substrate is subjected to etching treatment, it is possible to form a groove having a V-shaped or inverted trapezoidal cross section.
When the (110) plane is subjected to etching treatment, a groove having a rectangular cross section can be formed.

When the gallium arsenide substrate is etched using an etching solution containing KOH, (11
1) The slowest etching rate of Ga surface is (111) A
By utilizing the fact that the s-plane has the highest etching rate, it is possible to form a groove having a desired shape.

When the etching treatment is performed in this step, a surfactant or the like may be added to the etching solution. When the foaming occurs violently during the etching process, irregularities may be formed on the etching surface due to the foaming, but by adding a surfactant, the foaming during the etching process can be suppressed. Also,
The etching process may be performed while applying ultrasonic waves. This is because foaming can also be suppressed by applying ultrasonic waves.

When the substrate is dipped in the etching solution to perform the etching process, the etching process may be performed while the substrate is rocked or the etching solution is stirred. Through the steps (i) to (vi), a groove having a desired shape can be formed on the substrate.

In the step (1), the laminate having the resin layer formed on the base material layer may be used as the substrate, and the groove may be formed in the resin layer of the laminate. Examples of the base material layer include inorganic materials such as silicon, silicon carbide, alumina, aluminum nitride, mullite, ceramics, gallium arsenide, zirconia, quartz, and glass; metal materials such as copper, iron, and nickel; thermosetting resins. , Thermoplastic resin, photosensitive resin,
Examples thereof include organic materials such as these composites and those obtained by impregnating these organic materials with a reinforcing material such as glass fiber.

As the resin layer, for example, at least one of thermosetting resin, thermoplastic resin, photosensitive resin, and resin in which a part of the thermosetting resin is replaced with a photosensitive group is used. Examples of the resin composition include: Examples of the thermosetting resin include epoxy resin, phenol resin, polyimide resin, bismaleimide resin, polyphenylene resin, polyolefin resin, and fluororesin.

Examples of the above-mentioned thermoplastic resin include phenoxy resin and polyether sulfone (PE).
S), polysulfone (PSF), polyphenylene sulfone (PPS), polyphenylene sulfide (PPE)
S), polyphenyl ether (PPE), polyether imide (PI) and the like. Examples of the photosensitive resin include acrylic resin and ultraviolet curable resin. As the resin in which a part of the thermosetting resin is substituted with a photosensitive group, a thermosetting group of the thermosetting resin is reacted with (meth) acrylic acid or the like to give a photosensitive group. Resin etc. are mentioned.

As a method of forming a groove in the laminate composed of such a base material layer and a resin layer, for example, exposure, development treatment, laser treatment or the like can be used. Specifically, when performing exposure and development processing, for example, after placing a mask on which a pattern corresponding to the groove to be formed is drawn on the resin layer, exposure processing is performed, and then a developing solution is used. A plurality of grooves can be collectively formed in the resin layer by subjecting the resin layer to development processing. When the exposure and development processes are performed, it is desirable that the resin layer before the exposure process is in a semi-cured state, and after the development process, in order to completely cure the resin layer in which the groove is formed, heat treatment or the like is performed. May be given.

When laser processing is performed, the laser may be, for example, carbon dioxide gas laser, excimer laser,
A UV laser, a YAG laser or the like can be used. In the laser treatment, the groove can be formed regardless of the material of the resin layer. When performing the laser treatment, the resin layer before the laser treatment may be in a semi-cured state or a completely cured state.

Further, in the step (1), the groove is formed in the substrate and the cover resin layer holding portion for fixing the optical fiber core wire and the cover resin layer is formed. The method for forming the coating resin layer holding portion is not particularly limited,
For example, a method using an apparatus equipped with a diamond blade and the like can be mentioned. Further, the formation of the coating resin layer holding portion may be performed once or may be performed twice or more.

When the coated resin layer holding portion is formed, the upper surface of the coated resin layer holding portion may have irregularities. In this case, a polishing treatment may be performed to flatten the unevenness, but if the unevenness is such that the optical fiber ribbon is largely inclined when the optical fiber ribbon or the like is fixed, the polishing treatment or the like is particularly performed. It is desirable to leave it as it is. This is because when the coating resin layer holding portion is coated with the ultraviolet curable resin composition and then the resin composition is cured to fix the coating resin layer to the substrate (coating resin layer holding portion), the anchor effect is obtained. This improves the adhesion between the substrate and the adhesive. In addition, a plurality of holding surfaces having different heights may be formed on the coating resin layer holding portion so as to follow the shape of the optical fiber ribbon or the like to be fixed. Also, when forming the concave-shaped coating resin layer holding portion on the substrate, the concave-shaped coating resin layer holding portion may be formed by cutting the substrate here.

(2) Here, apart from the production of the substrate, an optical fiber ribbon in which a part of the coating resin layer is removed and the optical fiber core wire is exposed is produced. Here, the coating resin layer to be removed may be the coating resin layer at one end of the optical fiber ribbon or may be a portion of the coating resin layer other than both ends of the optical fiber ribbon. It is desirable that it is a part of the coating resin layer other than both ends of the ribbon. In such an optical fiber ribbon from which a part of the coating resin layer other than both ends is removed, since both ends of the exposed optical fiber core wire are fixed, variation in the axial direction of the optical fiber core wire is less likely to occur. This is because it is suitable for fixing to the substrate in the process.

The above-mentioned coating resin layer can be removed, for example, by a mechanical removal method using a coating resin peeling device such as a stripper or a chemical removal method by dissolving the coating resin layer using an organic solvent. Etc. can be used. Alternatively, a method of removing by irradiation with laser light may be used.

A method of removing the coating resin layer by irradiating with laser light will be described below. The coating resin layer is removed, for example, by horizontally fixing the optical fiber ribbon on a support such as a copper clad laminate and then irradiating it with laser light.

In this case, first, laser light is irradiated from one direction perpendicular to the main surface of the optical fiber ribbon, and then laser light is irradiated from a direction opposite to the one direction perpendicular to the main surface of the optical fiber ribbon. Irradiation is desirable. If the laser light is irradiated only from one direction perpendicular to the main surface of the optical fiber ribbon, the coating resin layer in the shadow of the optical fiber core wire cannot be removed sufficiently and the coating resin layer in this part cannot be completely removed. In order to remove it, it is necessary to irradiate a high-power laser beam for a long time, which increases the risk of damaging the surface of the optical fiber core wire, and is also economically disadvantageous. On the other hand, in the case of irradiating the laser beam by the method described above, the coating resin layer can be reliably and efficiently removed, further, the shape of the coating resin layer after removal, particularly,
The shape of the end surface of the non-removed portion of the coating resin layer can be accurately controlled.

Irradiation of the above laser light can be performed using, for example, a CO ₂ laser, an excimer laser, or the like. Of these, it is desirable to use a CO ₂ laser. This is because there is less risk of damaging the optical fiber core wire, and only the coating resin layer at a desired portion can be removed. Incidentally, even when peeling the coating resin layer of the silica-based optical fiber using an excimer laser does not cause a particularly large problem, compared to the carbon dioxide laser, running cost is low, after peeling the coating resin layer, Carbide of the coating resin may remain on the surface of the optical fiber core wire.

When the optical fiber ribbon is irradiated with laser light by using the CO ₂ laser, the laser light may be continuously irradiated, but intermittent irradiation (hereinafter, pulse irradiation) is desirable. . In the case of pulse irradiation, the output can be increased as compared with the case of continuous irradiation, so that the coating resin layer can be efficiently removed,
Further, since the coating resin layer is gradually removed, the processing can be performed while confirming the removal state, and the possibility of damaging the optical fiber core wire is further reduced.

When the CO ₂ laser is used to pulse-irradiate the laser light, the pulse width is 10 to 100.
It is preferably μs. If the pulse width is less than 10 μs, it is necessary to increase the number of times of laser light irradiation in order to sufficiently remove the coating resin layer, which is not very efficient. On the other hand, if the pulse width exceeds 100 μs, the optical fiber core wire May hurt.

When the CO ₂ laser is used to irradiate the laser beam, the irradiation conditions may be appropriately selected in consideration of the material, thickness, etc. of the coating resin layer, but normally the integrated energy is It is desirable that it is 2.0 to 9.0 mJ / cm ² . If the cumulative energy is less than 2.0 mJ / cm ² , the coating resin layer may not be completely removed, while the cumulative energy is 9.0 mJ / cm ^2.
If it exceeds, the optical fiber core wire may be damaged.

The number of times of laser light irradiation may be appropriately selected according to the material and thickness of the coating resin layer, the output of the CO ₂ laser, and the like. For example, the clad diameter is 125 μm.
When irradiating an optical fiber ribbon having a shortest distance between outer edges of adjacent clads (hereinafter also referred to as a clad interval) of 250 μm with a laser beam with a pulse width and integrated energy in the above range, 3 to 8 It is desirable to be about once. If the number of irradiations is less than 3, it may be difficult to completely remove the coating resin layer, while 8
Beyond the number of times, most of the coating resin layer is removed when the main surface of the optical fiber ribbon is irradiated with laser light, and before the main surface of the optical fiber ribbon is irradiated with laser light. The optical fiber core wires may be scattered, and it may be difficult to irradiate the opposite surface with laser light.

FIG. 5A is a front view schematically showing an example of a method of peeling the coating resin layer of the optical fiber ribbon, and FIG. 5B is a side view thereof. As shown in FIGS. 5A and 5B, when the coating resin layer is peeled off by irradiating with laser light, the laser irradiation device 20 is arranged above one main surface of the optical fiber ribbon 110, and A laser beam 21 perpendicular to one main surface of the optical fiber ribbon 110 is directed from the irradiation device 20 toward the optical fiber ribbon 110.
The optical fiber ribbon 110 is moved in the width direction while removing the coating resin layer of the portion irradiated with the laser beam 21.

In this case, first, the optical fiber ribbon 110
After removing the coating resin layer having a thickness of about 1/2, it is desirable to reverse the optical fiber ribbon 110 and irradiate the laser beam 21 to remove the remaining coating resin layer. If there are too many coating resin layers to be removed initially, the respective optical fiber core wires 115 will come apart at that time, and then, after inverting the optical fiber ribbon 110, when irradiating the laser beam 21 again. In some cases, it may be difficult to accurately irradiate the laser light 21, and the irradiation amount of the laser light directly radiated to the optical fiber core wire 115 increases,
This is because the risk of damaging the optical fiber core wire 115 is further increased.

Further, it is desirable that the movement of the optical fiber ribbon in the width direction is performed by the radius of the laser irradiation area each time the coating resin layer of about ¼ of the thickness of the optical fiber ribbon 110 is removed. By moving the optical fiber ribbon in this manner, the region initially irradiated with the laser light 21 and
Next, the coating resin layer in the area overlapping with the area irradiated with the laser light 21 is 1 / thick of the thickness of the optical fiber ribbon 110.
This is because about 2 is removed, and the coating resin layer having such a thickness can be reliably removed over the entire width direction of the optical fiber ribbon 110. Note that the coating resin layer at the right end in FIG. 5A (the portion where the laser light is first irradiated) is irradiated by the radius of the irradiation area of the laser light, and the coating is about 1/4 of the thickness of the optical fiber ribbon. It is only necessary to remove the resin layer.

After removing the coating resin layer of about ½ of the thickness of the optical fiber ribbon in the width direction by the above method,
By repeating the step of shifting the optical fiber ribbon 110 in the axial direction and removing the coating resin layer having a thickness of about ½ in the width direction, the coating resin layer in a region wider than the irradiation diameter of the laser light 21. Can be removed. Then, after the optical fiber ribbon 110 is turned over, the remaining coating resin layer is similarly removed, whereby the coating resin layer in a region wider than the irradiation diameter of the laser light 21 can be completely removed.

In this case, it is desirable to control the laser irradiation area so that the previously removed coating resin layer area and the subsequent laser light irradiation area do not overlap. When the coating resin layer region removed earlier and the laser irradiation region later overlap,
This is because the coating resin layer in the overlapping portion may be excessively removed, and the optical fiber core wires may be disjointed. Further, the control of the laser irradiation region may be performed by aligning the optical fiber ribbon, by irradiating the laser beam through a mask, a lens, or the like, or by combining these. Good.

Although the method of removing the coating resin layer while moving the optical fiber ribbon has been described here, the coating resin layer may be removed while moving the laser irradiation device. Further, depending on the size of the area where the coating resin layer is removed, the irradiation diameter of the laser light, and the like, the entire area where the coating resin layer is removed may be irradiated with the laser light at once.

(3) Next, after the exposed optical fiber core wire of the optical fiber ribbon is housed in the groove of the substrate manufactured in the above step (1), the optical fiber core wire is put through an ultraviolet curable adhesive. Fix to the board. Here, when fixing the optical fiber ribbon from which the coating resin layer at one end is removed,
The optical fibers may be fixed so that the end faces of the optical fiber cores and the side surfaces of the substrate are aligned, or the optical fiber cores may be fixed so as to protrude from the side surface of the substrate by a certain length.

When the optical fiber ribbon from which a part of the coating resin layer other than both ends thereof is removed is fixed, the optical fiber ribbon is not fixed to the substrate after fixing the optical fiber ribbon. Will be cut off at one end. When cutting and removing one end of the optical fiber ribbon, it may be cut and removed so that the end face of each optical fiber core line and the end face of the substrate are aligned, or each optical fiber core line has a constant length from the end face of the substrate. You may cut and remove so that it may protrude only a little. The cutting and removal of the optical fiber ribbon can be performed by cutting using a cutter or the like. Alternatively, mechanical polishing may be performed.

In this step, the optical fiber core wire is fixed in the groove, and the optical fiber core wire and the coating resin layer are bonded to the covering resin layer holding portion formed in the above step (1) with an ultraviolet curable adhesive. To fix.

In the step (1), when the groove is formed by going through the steps (i) to (vi), the mask is formed on the substrate, and thus the light is not used in this step. Strictly speaking, the portion for fixing the fiber core wire is a portion where the mask non-forming portion and the groove provided on the substrate are combined, but in the present specification, after forming the groove on the substrate,
The combined portion of these two is called a groove.

After accommodating the optical fiber core wire in the groove in this way, the optical fiber core wire is fixed in the groove. In particular,
For example, an epoxy-based or acrylate-based ultraviolet curable resin composition is poured from the end of the groove, the ultraviolet curable resin composition is then cured, and the optical fiber core wire is passed through the cured product of the ultraviolet curable resin composition. Is fixed in the groove. As a method for fixing the optical fiber core wire in the groove, an ultraviolet curable resin composition is applied in advance in the groove, the optical fiber core wire is housed in the groove, and then the ultraviolet curable resin composition is cured. Alternatively, a method of fixing the optical fiber core wire to the groove may be used. At this time, an ultraviolet curable resin composition for fixing the optical fiber core wire is also poured into the coating resin layer holding portion, and the ultraviolet curable resin composition is cured, so that the cured product of the ultraviolet curable resin composition is passed through. The optical fiber core wire may be fixed to the groove. Further, the ultraviolet curable resin composition may be semi-cured and then completely cured.

A UV curable resin composition is applied in advance to the periphery of the cover resin layer fixed to the cover resin layer holding portion, and the UV curable resin composition is cured to coat the cover resin layer. It is fixed to the resin layer holder. Also,
The coating resin layer is placed on the coating resin layer holding portion, and thereafter, the ultraviolet curable resin composition is applied so as to cover the coating resin layer placed on the coating resin layer holding portion. The coating resin layer may be fixed to the coating resin layer holding portion by curing. Further, by previously coating the coating resin layer holding portion with an ultraviolet curable resin composition, placing the coating resin layer on the coating resin layer holding portion, and then curing the ultraviolet curable resin composition, You may fix a coating resin layer to a coating resin layer holding part. In addition, after coating the coating resin layer holding portion with an ultraviolet curable resin composition in advance and placing the coating resin layer on the coating resin layer holding portion, further ultraviolet curing is performed on the upper surface and the periphery of the coating resin layer. The coating resin layer may be fixed to the coating resin layer holding portion by applying the mold resin composition and curing the applied ultraviolet curable resin composition.

The curing treatment of the ultraviolet curable resin composition for fixing the coating resin layer to the coating resin layer holding portion may be performed after the curing treatment of the ultraviolet curing resin composition for fixing the optical fiber core wire in the groove is completed. . Depending on the case, these curing treatments may be performed simultaneously. Further, once the ultraviolet curable resin composition for fixing the optical fiber core wire to the groove is semi-cured, and then the ultraviolet curable resin composition is completely cured, the covering resin layer is fixed to the covering resin layer holding portion. The ultraviolet curable resin composition may be cured.

In the optical fiber array of the first aspect of the present invention, as described above, the epoxy-based or acrylate-based UV-curable adhesive is used as the adhesive. Therefore, when the epoxy-based or acrylate-based ultraviolet curable resin composition described above is poured into the gap between the optical fiber core wire and the groove from the side surface of the substrate, the gap between the optical fiber core wire and the groove is caused by the surface tension of the ultraviolet curable resin. It will be reliably filled with the composition. As a result, the optical fiber core wire is surely fixed in the groove via the cured product of the epoxy-based or acrylate-based ultraviolet curable resin composition, and the positional deviation of the optical fiber core wire does not occur.

Further, here, the optical fiber core wire is fixed through an adhesive by irradiating the ultraviolet curable resin composition with ultraviolet rays. In this case, the intensity of the ultraviolet rays to be applied is not particularly limited and may be appropriately selected in consideration of the composition of the ultraviolet curable resin composition and the like. Moreover, after irradiating with ultraviolet rays, you may heat-process as needed.

Further, after the exposed optical fiber core wire of the optical fiber ribbon is housed and fixed, a lid portion which covers at least a portion of the exposed optical fiber core wire fixed to the groove is attached via an adhesive layer. Is desirable. The adhesive layer is preferably formed by using the same resin composition as the ultraviolet curable resin composition used for fixing the optical fiber core wire in the groove of the substrate.

The shape of the lid portion may be a plate-like body as described above, or is a shape in which a groove for separately accommodating each optical fiber core wire is formed on the surface facing the substrate. However, it is desirable that the surface facing the substrate be formed with a recess for accommodating all the optical fiber core wires not fixed in the groove. The recess for accommodating the optical fiber cores in a lump is easy to form, and since there is a gap between the optical fiber cores housed in the recesses, the relative recesses of the optical fiber cores are Positional deviation is unlikely to occur, and furthermore, an adhesive or the like is easily filled in the void.

When manufacturing an optical fiber array, usually, after the lid is mounted on the substrate, polishing treatment is performed to align the end face of the lid with the optical fiber core wire or the end face of the substrate. However, here, when the shape of the lid is a shape having a recess for accommodating the optical fiber core wires collectively, only the vicinity of the side surface of the optical fiber array is largely scraped off, The end face of the optical fiber array is easily polished into a desired shape without the parts being polished obliquely.

Further, when the lid portion is formed with a concave portion for accommodating the optical fiber core wires collectively, the concave portion is formed by a curved surface formed by combining planes intersecting at substantially right angles. And a combination of a flat surface and a curved surface.

Examples of the material of the lid include the same materials as those of the substrate, and among them, glass or quartz is preferable. Since the lid made of glass or quartz allows ultraviolet rays to pass therethrough, it is suitable for use in combination with an ultraviolet curable resin composition. The material of the lid and the material of the substrate may be the same or different. Further, the formation of the concave portion, when the lid portion is made of an inorganic material or a metal material, may be performed by subjecting a plate-like body made of these to a cutting process,
When the lid portion is made of an organic material, the organic material is molded into a plate-like body, and then subjected to exposure and development processing or laser treatment, or cutting into a plate-like body made of a completely cured organic material. It may be performed by applying.

The size of the lid may be a size that covers the entire surface of the substrate (a size that integrally covers the region where the groove is formed and the coating resin layer holding part). In addition, a lid having a shape that covers only the grooved region of the substrate and a lid that covers only the coating resin layer holding portion may be separately attached on the substrate.

When such a lid is mounted on the substrate, the method (A) or the method (B) described below can be used as a specific method.

That is, (A) after housing the optical fiber core wire in the groove of the substrate and before fixing the optical fiber core wire in the groove,
First, the lid is formed, and while lightly pressing the lid with a jig or the like, using a coating device such as a dispenser,
The ultraviolet curable resin composition is poured into the gap between the groove and the optical fiber core wire, and the gap between the lid portion (the concave portion when the lid portion has a concave portion) and the optical fiber core wire. Device) to irradiate the ultraviolet curable resin composition with ultraviolet rays to semi-cure it. The irradiation with ultraviolet rays may be performed by, for example, irradiating with ultraviolet rays having an intensity of 5 to 10 J / cm ² for 10 to 30 minutes. Then, the jig holding the lid is removed, and ultraviolet rays are irradiated to completely cure the ultraviolet curable resin composition. Specifically, for example, the strength is 15 to 35 J / c.
It suffices to irradiate the ultraviolet ray of m ² for 30 to 50 minutes. By using the method as described above, it is possible to attach the lid portion that covers at least the portion fixed to the groove of the exposed optical fiber core wire.

In the method (A), a temporary lid may be used in place of the lid until the ultraviolet-curable resin composition is semi-cured. That is, after the optical fiber core wire is housed in the groove of the substrate, a temporary lid is attached so as to cover the optical fiber core wire housed in the groove, and the groove and the optical fiber core wire are lightly pressed by a jig or the like. The ultraviolet-curable resin composition is poured into the gap of, and the ultraviolet-curable resin composition is irradiated with ultraviolet rays to be semi-cured. The temporary lid is made of a material to which the ultraviolet curable resin composition does not adhere, such as rubber or film (for example, made of silicone resin) or the like, and has substantially the same size as the lid. The thing etc. are mentioned. After that, the jig and the temporary lid are removed, and the uncured ultraviolet curable resin composition is applied onto the semi-cured ultraviolet curable resin composition.
Further, by attaching a lid on it and irradiating it with ultraviolet rays, the semi-cured ultraviolet-curable resin composition and the uncured ultraviolet-curable resin composition are completely cured to attach the lid. May be.

(B) The ultraviolet curable resin composition is applied to the groove of the substrate in advance, and the optical fiber core wire is housed in the groove. After that, the lid portion is attached, and while the lid portion is lightly pressed by a jig or the like, the ultraviolet curable resin composition is poured into the gap between the lid portion and the optical fiber core wire by using a coating device such as a dispenser. Further, the high pressure mercury lamp (ultraviolet ray irradiation device) is used to irradiate the ultraviolet ray curable resin composition with ultraviolet rays to semi-cure it. At this time, ultraviolet rays may be irradiated under the same conditions as in the method (A) to semi-cure the ultraviolet curable resin composition. Then, the jig holding the lid is removed, and ultraviolet rays are irradiated to completely cure the ultraviolet curable resin composition. At this time, ultraviolet rays may be irradiated under the same conditions as in the method (A) to completely cure the ultraviolet curable resin composition. By doing so, it is possible to attach the lid portion that covers at least the portion fixed to the groove of the exposed optical fiber core wire.

In the method (B), as in the method (A), a temporary lid is used instead of the lid until the UV-curable resin composition is semi-cured. it can. By using such methods (A) and (B), the lid can be attached to at least a part of the substrate via the adhesive layer so as to cover the optical fiber core wire.

In the step (3), the optical fiber ribbon from which a part of the coating resin layer other than both ends thereof is removed is fixed, and the portion of the optical fiber ribbon which is not accommodated in the substrate is cut and removed. In this case, this cutting removal may be performed after the lid is attached.

After fixing the optical fiber ribbon having the exposed optical fiber core wire at one end, fixing part of the exposed optical fiber core wire other than both ends, and cutting and removing one end of the optical fiber ribbon. After the above step, it is desirable to polish the end face of the optical fiber core wire. Here, when the polishing treatment is performed, it is desirable to perform the polishing treatment so that the end faces of the optical fiber core wire, the substrate and the lid are inclined. This is because it is possible to suppress the generation of return light when transmitting an optical signal. Further, in this case, the end face of the optical fiber core may be subjected to the polishing treatment, and the side faces of the substrate and the lid may be subjected to the polishing treatment.

The optical fiber array according to the first aspect of the present invention can be manufactured through these steps. Here, the method of manufacturing an optical fiber array using one optical fiber ribbon has been described, but the optical fiber array of the first present invention is a laminated optical fiber ribbon in which a plurality of optical fiber ribbons are stacked. Can also be used.

When an optical fiber array is manufactured by using the laminated optical fiber ribbon, for example, a laminated optical fiber ribbon 300 in which a part of the coating resin layer is removed is prepared as shown in FIG. After that, the optical fiber array can be manufactured by housing and fixing this laminated optical fiber ribbon on the substrate. FIG. 6 is a partial perspective view schematically showing an embodiment of the laminated optical fiber ribbon.

As shown in FIG. 6, the laminated optical fiber ribbon 300 has a part of the optical fiber core wire 34 other than both ends thereof.
The exposed optical fiber core wire 345a of the second optical fiber ribbon (lower optical fiber ribbon) 340 in which 5a is exposed
The first optical fiber ribbon (the upper optical fiber ribbon) in which the optical fiber core wire 335a at one end thereof is exposed between
The first optical fiber ribbon 330 and the second optical fiber ribbon 340 are stacked so that the exposed optical fiber core wire 335a of 330 is arranged.

In the laminated optical fiber ribbon 300,
The exposed optical fiber core wires 335a and 345a are arranged at the same height so that the exposed optical fiber core wires 335a and 345a are arranged at the same height.
Each of a and 345a is bent at a part thereof. In this way, by arranging the optical fiber core wire 335a and the optical fiber core wire 345a at the same height, it becomes a shape suitable for being housed and fixed in the groove of the substrate.

In the laminated optical fiber ribbon 300,
A part of each of the exposed optical fiber core wire 335a of the first optical fiber ribbon 330 and the exposed optical fiber core wire 345a of the second optical fiber ribbon 340 is bent, but both optical fiber core wires are the same. Of the first optical fiber ribbon, only the exposed optical fiber core wire of the first optical fiber ribbon may be bent, or only the exposed optical fiber core wire of the second optical fiber ribbon may be bent. It may be.

In the laminated optical fiber ribbon 300, it is desirable that the first optical fiber ribbon 330 and the second optical fiber ribbon are fixed to each other with an adhesive. In the laminated optical fiber ribbon 300 shown in FIG. 6, eight optical fiber cores are arranged at the same height, but the number of optical fiber cores in the laminated optical fiber ribbon is not limited to eight. The number may be 7 or less, or 9 or more. Further, the number of optical fiber core wires of each of the first and second optical fiber ribbons is the same as in the optical fiber ribbon shown in FIG.
One more fiber optic ribbon, or
It is desirable that there be one more second optical fiber ribbon. In such a case, the optical fiber core wires can be arranged at the highest density.

In the production of the laminated optical fiber ribbon, for example, first, the coating resin layer at one end of the optical fiber ribbon is
As described above, a first optical fiber ribbon is produced by removing it by using a method using a tool, a method of dissolving with an organic solvent, a method of irradiating with a laser beam, etc. A second optical fiber ribbon is produced by removing a part of the coating resin layer other than both ends of the optical fiber ribbon by using the method for removing the coating resin layer, and then a part of the exposed optical fiber core wire. After bending, so that the optical fiber core wires of both are alternately arranged at equal intervals,
This can be done by stacking the first and second optical fiber ribbons via an adhesive.

As a method for accommodating and fixing such a laminated optical fiber ribbon on a substrate, the same method as the method used in the step (3) can be used. Even when manufacturing an optical fiber array using the laminated optical fiber ribbon, after accommodating and fixing the laminated optical fiber ribbon on the substrate, cutting and removing one end of the second optical fiber ribbon and the optical fiber core wire Polishing of the end face and the like is performed.
By using such a method, an optical fiber array using a laminated optical fiber ribbon can be manufactured.

When an optical fiber array using a plurality of single-core optical fibers arranged in parallel is used instead of the optical fiber ribbon as described above, for example, the coating resin layer at one end is used. After aligning the plurality of optical fibers separated from each other in parallel by using an aligner, in the step (3), the optical fibers are stored in the substrate while being held by the aligner, and then,
An optical fiber array can be manufactured by fixing an optical fiber, forming a lid, and the like using the same method as described above.

In the optical fiber array of the first aspect of the present invention, as described above, the lid is attached to at least a part of the substrate via the adhesive layer so as to cover the optical fiber core wire. In this case, the adhesive layer has a cross-sectional shape in a direction perpendicular to the axis of the optical fiber core wire,
It is also preferable that the substrate is flared toward the outer edge of the substrate. In this case, since the uncured adhesive layer does not protrude from the side surface of the substrate at the time of manufacturing, it is not necessary to perform a polishing process for aligning the side surface of the adhesive layer and the side surface of the substrate, which are formed by the curing treatment. Thus, there is no risk of damaging the surface of the outermost optical fiber core wire, and it is possible to transmit the optical signal more accurately. In addition, the adhesive strength between the substrate and the lid fixed via the adhesive layer is improved,
Even after the reliability test, the adhesive strength between the substrate and the lid hardly decreases, so that the reliability of the optical fiber array is excellent.

The optical fiber array of the first invention having the adhesive layer having such a shape will be described below with reference to the drawings. FIG. 11A is a partial perspective view schematically showing an example of the optical fiber array of the first present invention,
(B) is the sectional view on the AA line of (a), (c) is
It is the BB sectional drawing of (a).

As shown in FIG. 11, the optical fiber array 1
In 100, a plurality of V grooves 1157 are formed in parallel on the substrate 1151, and an optical fiber core wire 1115 is housed in each of the V grooves 1157 via an adhesive agent 1159. In addition to the groove 1157, an optical fiber core wire is provided on the upper surface of the substrate 1151 to cover the surrounding resin layer 1114.
Together with the coating resin layer holding portion 11 for holding together
58 is formed. In addition, this coating resin layer holding portion 1
The upper surface of 158 is lower than the groove forming surface in which the groove 1157 is formed. Further, the coating resin layer 1114 is fixed to the coating resin layer holding portion 1158 by an adhesive agent 1159 around the coating resin layer 1114. The covering resin layer holding portion 1158 is
It may be formed as needed, and only the V groove may be formed on the substrate. In the figure, 1110 is an optical fiber ribbon, 1111 is a core, and 1112 is a clad. Further, 1159a is an adhesive that fixes the optical fiber core wire, and 1159b is an adhesive that fixes the coating resin layer.

Further, a plate-like lid portion 1160 is attached via an adhesive layer 1169 on the region where the groove 1157 for accommodating the optical fiber core wire 1115 is formed, and the optical fiber core wire of this adhesive layer 1169 is attached. The cross-sectional shape of 1115 in the direction perpendicular to the axis is divergent toward the outer edge of the substrate 1151 (see FIG. 11B).

As shown in the figure, the adhesive layer 1169 may have any shape as long as the shape of both ends of the cross section in the direction perpendicular to the axis of the optical fiber core is widened toward the outer edge. Side surface of 1169 (optical fiber core wire 1115
The side surface along the axis of 1) may be a curved surface having a convex lower surface, a curved surface having an upward convex surface, or a flat surface. Further, the size of the side surface portion of the adhesive layer 1169 is not particularly limited, and the viscosity and surface tension of the uncured adhesive layer,
It is appropriately determined depending on the size of the substrate and the lid, the distance between the substrate and the lid, and the like.

The width of the bottom surface of the lid portion in the direction perpendicular to the axis of the optical fiber core wire (hereinafter, simply referred to as lateral width) is the direction perpendicular to the axis of the optical fiber core wire on the upper surface of the substrate. Is smaller than the width (width of the upper surface of the substrate). Specifically, the lower limit of the horizontal width of the bottom surface of the lid is preferably 70% of the horizontal width of the upper surface of the substrate, and more preferably 85%. The upper limit of the width of the bottom surface of the lid is 99% of the width of the upper surface of the substrate.
Is preferable, and 98% is more preferable. When the width of the bottom surface of the lid portion is such a size, the optical fiber core wire extends from near the lower side surface of the lid portion or near the lateral outer edge portion of the lid bottom surface toward the lateral outer edge portion of the substrate upper surface. This is because it is possible to form an adhesive layer having a cross-sectional shape in a direction perpendicular to the axis of (1).

If the lateral width of the lid portion (not only the lateral width of the bottom surface of the lid portion but also the lateral width of all the portions) is smaller than the lateral width of the upper surface of the substrate, the substrate is not manufactured at the time of manufacturing the optical fiber array. When the lid is attached via the adhesive layer, even if the attached lid is slightly inclined due to the fluidity of the uncured adhesive and the stress generated in the adhesive during curing, Does not protrude from the upper extension of the side surface of the substrate, it is not necessary to perform a polishing process to remove the protruding portion in a later step.

The lower limit of the lateral width of the bottom surface of the lid is preferably 2 mm shorter than the lateral width of the upper surface of the substrate, and is 0.5 m.
It is more desirable that the length is shorter. The upper limit of the lateral width of the bottom surface of the lid is preferably 0.1 mm shorter than the upper surface of the substrate, and more preferably 0.2 mm shorter.
When the lateral width of the bottom surface of the lid is shorter than the lateral width of the upper surface of the substrate by the length in the above range, the cross-sectional shape in the direction perpendicular to the axis of the optical fiber core wire of the adhesive layer becomes divergent, This is because it is suitable for downsizing the optical fiber array. In this case, the ratio of the lateral width of the bottom surface of the lid to the lateral width of the upper surface of the substrate may be within the above range or may be outside the above range.

The vertical width of the lid is not particularly limited,
For example, it may be the same as the vertical width of the region in which the groove of the substrate is formed, or may be the same as the vertical width of the entire substrate. In this specification, the vertical width of the substrate and the vertical width of the lid portion refer to the length in the direction parallel to the axis of the optical fiber core wire.

The lid attached via the adhesive layer having the above-described shape has a rectangular cross-sectional shape in the direction perpendicular to the axis of the optical fiber core wire (hereinafter, also simply referred to as a cross-sectional shape). Is desirable. This is because the lid portion having such a shape is suitable for forming the divergent adhesive layer described above and is easy to form.

It is also preferable that the shape of the cross section of the lid portion is a rectangular shape in which both lateral lower portions are cut off. When the lid portion has such a shape, it is formed by cutting into both side lower portions of the lid portion to expose the exposed surface (the portion indicated by α in FIG. 12) from the side outer edge portion of the upper surface of the substrate. By forming the adhesive layer having the above-described shape, the adhesive area between the lid portion and the adhesive layer is increased, so that the adhesive strength between the substrate and the lid portion attached via the adhesive layer is improved. However, this leads to improvement in reliability of the optical fiber array.

When the shape of the lid is such a shape, the cut-out shape is a shape surrounded by a triangle, a quadrangle, a polygon, or two straight lines orthogonal to an arc, or
It is desirable that the shape be surrounded by an elliptic arc and two straight lines orthogonal to each other. FIG. 12 is a cross-sectional view schematically showing an example of the cross-sectional shape of the lid portion forming the optical fiber array in the optical fiber array of the first aspect of the present invention having the adhesive layer having the above-described shape. As the shape of the cross section of the lid portion, when the cut-out shape is a triangle, for example, a shape like the lid portion 1161 shown in FIG. 12 can be mentioned. When the cut-out shape is a shape surrounded by two straight lines orthogonal to an arc (elliptic arc), the shape of the arc (elliptic arc) may be convex outward or convex inward. It may be.

When the shape of the cross section of the lid is a shape in which both side lower parts of the rectangle are cut out, the height of the side cut out of the rectangle (indicated by H _{1 in} FIG. 12) is particularly limited. However, the lower limit of the cut-out height of the rectangle is the thickness of the rectangle (indicated by H _{2 in} FIG. 12) from the viewpoint of excellent adhesive strength between the substrate and the lid attached via the adhesive layer. 1/1
0 is desirable and 1/5 is more desirable. Further, the upper limit of the cut-out height of the rectangle is preferably 1/2 of the thickness of the rectangle, and more preferably 1/3.

Further, the lower limit of the lateral cutting height of the rectangle is preferably 0.1 mm, more preferably 0.2 mm, and the upper limit of the lateral cutting height of the rectangle is
0.5 mm is preferable, and 0.3 mm is more preferable. If the cutting height of the side of the above rectangle is within the above range,
This is because the adhesive strength between the substrate attached via the adhesive layer and the lid becomes excellent. In this case, the ratio of the height of the side cut out of the rectangle to the thickness of the rectangle may be within the above range or may be outside the above range. In addition, the cut-off height may be the same as the thickness of the lid in some cases. In addition, in the present specification, even when the height of the side portion of the rectangle that is cut out is the same as the thickness of the lid portion, the shape in which both side lower portions of the rectangle are cut out is included.

As described above, the lower limit of the length of the bottom side of the rectangle in which both lateral lower portions are cut off is preferably 70% of the horizontal width of the upper surface of the substrate, and more preferably 85%. Further, the upper limit of the length of the bottom side of the shape obtained by cutting out both side lower portions of the rectangle is 99 of the lateral width of the upper surface of the substrate.
% Is desirable, and 98% is more desirable. The lower limit of the horizontal width of the bottom surface of the lid is preferably 2 mm shorter than the upper surface of the substrate, and more preferably 0.5 mm shorter.
Further, the upper limit of the lateral width of the bottom surface of the lid is preferably 0.1 mm shorter than the lateral width of the upper surface of the substrate, and is 0.2 mm.
Shorter is more desirable.

Further, also in the optical fiber array of the first aspect of the present invention having the above-mentioned divergent adhesive layer, a part of the optical fiber core wire (the optical fiber core wire A recess may be formed to collectively store a part of the portion not stored in the groove formed in the substrate. This is because the optical fiber array to which the lid having such a recess is attached is less likely to cause positional deviation of the optical fiber core wire.
Furthermore, the shape of the cross section of the lid part attached via the divergent adhesive layer described above is such that the lower parts of both side faces are cut off, and a part of the optical fiber core wire is housed collectively on the bottom face side. It may have a shape in which the concave portion is formed.

As a method of manufacturing an optical fiber array in which the lid is attached via such a divergent adhesive layer, the shape of the cross section in the direction perpendicular to the axis of the optical fiber core is the outer edge of the substrate. It can be manufactured by a method similar to the above-mentioned method except that an adhesive layer having a divergent shape toward the end is formed. Incidentally, in order to make the shape of the adhesive layer the above-mentioned shape, after accommodating the optical fiber core wire in the groove, the lid portion is placed so as to cover the optical fiber core wire, and then the lid portion and the optical fiber Pour uncured adhesive into the gap,
It is desirable to use a method of forming an adhesive layer by further performing a curing treatment.

When such a method is used, the uncured adhesive flows along the optical fiber core wire, the substrate and the lid portion due to the surface tension thereof.
If the width of the bottom surface of the lid is adjusted to be smaller than the width of the upper surface of the substrate, an uncured adhesive layer formed by being poured into the outer portion of the optical fiber core wire housed in the outermost groove of the substrate Is formed in a divergent shape from the vicinity of the lower side surface of the lid portion or the vicinity of the lateral outer edge portion of the bottom surface of the lid portion toward the vicinity of the lateral outer edge portion of the substrate upper surface. Further, the surface tension of the uncured adhesive prevents the formed uncured adhesive layer from protruding from the side surface of the substrate. Therefore, by performing a curing treatment on the uncured adhesive layer having such a shape, the cross-sectional shape in the direction perpendicular to the axis of the optical fiber core wire can be made wider toward the end. Further, as described above, the shape of the side surface of the adhesive layer may be a curved surface convex downward,
It may be a curved surface that is convex upward or a flat surface.
It should be noted that the shape to be formed can be selected by adjusting the filling amount of the uncured adhesive.

Next, the optical fiber array of the second present invention will be described. The optical fiber array of the second invention is
An optical fiber array including a substrate having a plurality of grooves and a coating resin layer holding portion formed on the upper surface thereof and an optical fiber ribbon in which a plurality of optical fiber core wires are arranged in parallel and a coating resin layer is formed around the optical fiber core wires. The optical fiber core wire is fixed to the groove via an adhesive agent, and the optical fiber core wire and the coating resin layer are fixed to the covering resin layer holding portion via an adhesive agent. The adhesive for fixing the core wire is a cured product of an epoxy-based ultraviolet curable resin composition, and the adhesive for fixing the coating resin layer is a cured product of an acrylate-based or silicone-based ultraviolet curable resin composition. Is characterized by.

In the optical fiber array according to the second aspect of the present invention, the optical fiber core wire and the coating resin layer are securely attached to the groove formed on the upper surface of the substrate and the coating resin layer holding portion via the ultraviolet curable adhesive. The optical fiber array is fixed, and when the optical fiber array is connected to an optical element or when a force is applied to the optical fiber array from the outside, the optical fiber core wire is not displaced and the optical signal is accurately generated. Can be transmitted.

Usually, when connecting the optical fiber core wire fixed to the groove on the upper surface of the substrate of the optical fiber array and the optical component (for example, optical switch component, wavelength multiplexing component, optical branching component, etc.), for example, active After the optical fiber core wire is aligned with the optical component by a method such as alignment, the optical fiber core wire and the optical component are connected by an adhesive or the like. In the optical fiber array of the second aspect of the present invention, the optical fiber core wire is fixed using an epoxy-based ultraviolet curable adhesive having a relatively large Young's modulus and a relatively high hardness, so that the positional deviation of the optical fiber core wire is further reduced. It is unlikely to occur, and it becomes possible to reliably maintain the state of performing the alignment as described above.

On the other hand, a male-type single-core connector (for example, SC connector, FC connector, etc.) is usually attached to the optical fiber core wire on the side opposite to the side housed in the groove of the substrate, and the male-type single core connector is attached. By connecting the connector to a female single core connector attached to a printed circuit board or the like, the optical fiber core wire and the printed circuit board or the like are connected. At this time, if the coating resin layer is firmly fixed with a hard UV-curable adhesive having a large Young's modulus, the coating resin layer can hardly be deformed and the optical fiber connected to the connection printed circuit board or the like can be obtained. The core wire may be cracked or cracked. However, in the optical fiber array of the second aspect of the present invention, the coating resin layer is fixed by using a relatively soft acrylate-based or silicone-based UV-curable resin adhesive having a relatively small Young's modulus. The layer portion can be deformed to some extent according to the shape of the portion to which the optical fiber array is attached, etc., and the optical fiber core wire is not cracked or cracked even during the connection work as described above.

Compared with the optical fiber array of the first aspect of the present invention, the optical fiber array of the second aspect of the present invention fixes the optical fiber core wire and the coating resin layer by different cured products of the ultraviolet curable resin composition. Other than that, the structure of the optical fiber array, members constituting the optical fiber array, and the like are the same as those of the optical fiber array of the first aspect of the present invention. Therefore, here, the cured product of the ultraviolet curable resin composition for fixing each of the optical fiber core wire and the coating resin layer will be described in detail, and in addition, regarding the structure of the optical fiber array and the members constituting the optical fiber array, etc. The description thereof will be omitted unless it is different from the optical fiber array of the first present invention.

The optical fiber array of the second invention will be described with reference to the drawings. FIG. 7A is a partial perspective view schematically showing an example of the optical fiber array of the second aspect of the invention, FIG. 7B is a sectional view taken along line AA of FIG.
(C) is a BB line sectional view of (a).

As shown in FIG. 7, the optical fiber array 40
In No. 0, a plurality of V grooves 457 are formed in parallel on the upper surface of the substrate 451, and the optical fiber core wire 415 of the optical fiber ribbon 410 is fixed to each of the V grooves 457 via the ultraviolet curable adhesive 459a. . Further, on the upper surface of the substrate 451, apart from the groove 457, the optical fiber core wire 415,
A coating resin layer holding portion 458 for fixing the coating resin layer 413 is formed, and the coating resin layer holding portion 458 is formed.
The optical fiber core wire 415 and the coating resin layer 413 are fixed to each other via an ultraviolet curable adhesive 459 (459a, 459b). Further, in the optical fiber array 400, the ultraviolet curable adhesive 459a that fixes the optical fiber core wire 415 is a cured product of an epoxy-based ultraviolet curable resin composition, and the ultraviolet curable adhesive that fixes the coating resin layer 413. 459b is a cured product of an acrylate-based or silicone-based ultraviolet curable resin composition. In the figure, 411 is a core and 412 is a clad.

In the optical fiber array 400, an epoxy ultraviolet curing adhesive is used as an adhesive for fixing the optical fiber core, and an acrylate or silicone ultraviolet light is used as an adhesive for fixing the coating resin layer. A curable adhesive is used. As described above, by using a relatively hard epoxy-based ultraviolet-curable adhesive as the adhesive for fixing the optical fiber core wire, the positional deviation of the optical fiber core wire is less likely to occur. Also, by using a relatively soft acrylate-based or silicone-based UV-curable adhesive as the adhesive for fixing the coating resin layer, the coating resin layer portion can be adjusted to the shape of the portion where the optical fiber array is attached. Can be deformed to some extent. in this way,
If the coating resin layer portion can be deformed to some extent according to the shape of the portion to which the optical fiber array is attached, as described above, the optical fiber core wire on the side opposite to the side housed in the groove of the substrate and the printed circuit board The optical fiber core wire will not be cracked or cracked even during connection work with the like.

Further, it is desirable that a part of the above-mentioned epoxy ultraviolet curing adhesive and the above acrylate or silicone ultraviolet curing adhesive be fluorinated. By fluorinating, it is difficult for water to be generated by the cured adhesive, and the moisture resistance is improved. In addition, insulation, heat resistance, chemical resistance, etc. are also improved.

The viscosity of the epoxy-based UV-curable resin composition and the acrylate-based or silicone-based UV-curable resin composition is 200 to 2000 mP.
a · s is desirable. If the viscosity is less than 200 mPa · s, the viscosity is too low, so that the ultraviolet curable resin composition poured into the gap between the groove and the optical fiber core may flow out before curing, and if it exceeds 2000 mPa · s. ,
The gap between the groove and the optical fiber core wire may not be completely filled. Therefore, it is particularly desirable that the viscosity of the epoxy ultraviolet curable resin composition is in the above range.

In the optical fiber array of the second aspect of the present invention, the viscosity of the epoxy-based UV-curable resin composition is 200 to 2000 mPa · s, and the viscosity of the acrylate-based UV-curable resin composition is Is 5000-3
0000 mPa · s, or the viscosity of the silicone-based ultraviolet-curable resin composition is 5000 to 500
It is also desirable that the pressure is 00 mPa · s. By using a resin composition having a viscosity in the above range as the epoxy-based UV-curable resin composition, the resin composition is reliably filled in the gap between the optical fiber core wire and the groove, and the acrylate-based UV light is used. When a resin composition having a viscosity in the above range is used as the curable resin composition, or when a resin composition having a viscosity in the above range is used as the silicone-based UV curable resin composition, a coating resin is used. It is easy to apply the resin composition around the layer.

Specific examples of the above-mentioned epoxy-based UV-curable resin composition include, for example, Optodyne UV-1000 (viscosity: 250 mPa · s), Optodyne UV-1100 (viscosity: 250 mPa · s, manufactured by Daikin Industries, Ltd.).
s), Optodyne UV-2100 (viscosity: 290 mP
a ・ s), Optodyne UV-3100 (viscosity: 480
mPa · s), Optodyne UV-3200 (viscosity: 3
10 mPa · s), Optodyne UV-4000 (viscosity: 450 mPa · s), NTT Advance Technology's NA3925M (viscosity: 185 mPa · s),
AT9390 (viscosity: 600 mPa · s) and the like can be mentioned.

Specific examples of the acrylate-based ultraviolet-curable resin composition include, for example, Optodyne UV-2000 (viscosity: 360 mPa.
s), Optodyne UV-3000 (viscosity: 1600 m
Pa · s), NTT Advanced Technology Co., AT
6001 High Tg product (viscosity: 200-800 mPa.
s), AT6177 (viscosity: 1470 mPa · s),
Ablelux A4083 manufactured by Ablestik
(Viscosity: 300 mPa · s), Ablelux A40
65 (viscosity: 850 mPa · s), Ablelux A
4031 (viscosity: 800 mPa · s) and the like.

The UV curable resin composition for fixing the coating resin layer has a viscosity of 5,000 to 30,000 mPas.
When using the acrylate-based UV-curable resin composition of s, for example, A manufactured by NTT Advanced Technology Co., Ltd.
T8083 (viscosity: 20000 mPa · s), Abl
Ablelux A4088 manufactured by Estik (viscosity:
15000 mPa · s), Ablelux A4025
(Viscosity: 5000 mPa · s) or the like can be used.

The UV curable resin composition for fixing the coating resin layer has a viscosity of 5,000 to 50,000 mPas.
When using the silicone-based ultraviolet-curable resin composition of s, for example, KJC-7806 manufactured by Shin-Etsu Chemical Co., Ltd.
(Viscosity: 10000 mPa · s), Dow Corning 734 (Viscosity: 45000 mPa · s) or the like can be used.

Specific examples of the acrylate-based UV-curable adhesive include 40 to 50% by weight of acrylate oligomer, 1 to 10% by weight of vinyl ester resin, and 45.
-55 wt% acrylate-based monomer, and 1-
An ultraviolet curable resin composition containing 10% by weight of a polymerization initiator is also included.

Further, it is desirable that a part of the acrylate oligomer or the acrylate-based monomer is fluorinated. As described above, when a part of the acrylate oligomer or the like is fluorinated, the above-mentioned effects can be obtained, and the acrylate-based UV-curable resin composition has excellent light-transmitting properties, so that the UV light At the time of irradiation, the entire resin composition will be cured in a short time.

Further, also in the case of manufacturing the optical fiber array of the second aspect of the present invention, as in the case of manufacturing the optical fiber array of the first aspect of the present invention, an uncured adhesive (epoxy ultraviolet curing resin) is used. The composition) is poured into the gap between the groove and the optical fiber core wire from the side surface of the substrate. In this case, the gap is filled with the epoxy-based UV-curable resin composition. By using the ultraviolet curable resin composition of the system, the gap between the groove and the optical fiber core wire is surely filled with the epoxy curable resin composition of the epoxy system. As a result, the optical fiber core wire is securely fixed to the groove via the cured product of the epoxy-based ultraviolet curable resin composition, and the positional deviation of the optical fiber core wire does not occur.

The epoxy-based UV-curable resin composition and the acrylate-based or silicone-based UV-curable resin composition are the same as the UV-curable resin composition used in the optical fiber array of the first present invention. , As necessary, particles such as resin particles, inorganic particles, and metal particles, a brightener,
It may contain an additive such as a reaction stabilizer, and specific examples of the additive include those similar to the additive contained in the ultraviolet curable resin composition used for the optical fiber array of the first present invention. Is mentioned.

Like the optical fiber array according to the first aspect of the present invention, the ultraviolet curable resin composition preferably has a refractive index after curing of 1.4 to 1.6 and a light transmittance after curing. Is preferably 90% or more.

Further, the epoxy-based ultraviolet curable resin composition used as an adhesive for fixing the optical fiber core wire in the groove of the substrate has a thermal expansion coefficient of 3 × 10 ^{−5 to} 11 × 1 after curing.
0 is desirably ^-5 (1 / ℃). This is because when using the optical fiber array, it is possible to prevent the positional deviation of the optical fiber core wire due to thermal expansion or the like. In addition, the epoxy-based ultraviolet curable resin composition preferably has a curing shrinkage rate of 3 to 9%. This is because it is possible to prevent the positional deviation from occurring in the optical fiber core wire when the above ultraviolet curable resin composition is cured.

Furthermore, when an acrylate-based UV curable resin composition is used as an adhesive for fixing the optical fiber core wire and the cover resin layer to the cover resin layer holding portion, the acrylate-based UV curable resin composition is Similar to the epoxy-based ultraviolet curable resin composition described above, it is desirable that the thermal expansion coefficient after curing is 3 × 10 ^{−5 to} 11 × 10 ⁻⁵ (1 / ° C.), and the curing shrinkage rate is 3 to. 9% is desirable.

The optical fiber array 400 shown in FIG.
In the above, four optical fiber core wires are fixed to the groove on the substrate, but the number of optical fiber core wires fixed to the groove in the optical fiber array of the second invention is not limited to four. Alternatively, the number may be three or less, or may be five or more.

Also in the optical fiber array according to the second aspect of the present invention, it is desirable that a lid is attached to at least a part of the substrate via an adhesive layer so as to cover the optical fiber core wire. It is desirable that the shape is such that a concave portion for accommodating a part of the optical fiber core wire is formed. Further, as the material of the lid portion, the same material as the lid portion attached to the optical fiber array of the first aspect of the present invention can be cited. The adhesive layer is preferably formed by curing the same resin composition as the ultraviolet curable adhesive that fixes the optical fiber core wire in the groove of the substrate.

Further, in the case where a lid portion having a recessed portion for accommodating a part of the optical fiber core wire fixed in the groove as the lid portion is attached, a gap between the recessed portion formed in the lid portion and the optical fiber core wire is attached. It is desirable that the resin is filled with a cured product of an epoxy-based ultraviolet curable resin composition. Also,
The size of the lid portion may be a size that covers only the region where the groove of the substrate is formed, or a size that covers the entire surface of the substrate. Furthermore, a lid having a size that covers only the region where the groove is formed and a lid that covers only the coating resin layer holding portion may be separately mounted on the substrate.

In the optical fiber array 400, like the optical fiber array of the first aspect of the present invention, one optical fiber ribbon from which the coating resin layer at one end is removed is fixed to the substrate, The optical fiber ribbon forming the optical fiber array of the present invention may also be a laminated optical fiber ribbon in which a plurality of optical fiber ribbons are stacked. Further, also in the second aspect of the present invention, a plurality of single-core optical fibers arranged in parallel may be used instead of the optical fiber ribbon as described above.

Further, as a method of manufacturing the optical fiber array of the second present invention having such a constitution, in the step (3) of the method of manufacturing the optical fiber array of the first present invention, the optical fiber is Other than using the above-mentioned epoxy-based UV-curable resin composition for fixing the core wire and the above-mentioned acrylate- or silicone-based UV-curable resin composition for fixing the coating resin layer, A method similar to the method of manufacturing the optical fiber array of the present invention can be used.

Further, also in the optical fiber array of the second present invention, like the optical fiber array of the first present invention,
When the lid is attached to at least a part of the substrate via the adhesive layer so as to cover the optical fiber core wire, the cross-sectional shape of the adhesive layer in the direction perpendicular to the axis of the optical fiber core wire is the substrate. It is desirable that it is flared toward the outer edge of the. The second optical fiber array having an adhesive layer whose cross-sectional shape is a divergent shape toward the outer edge of the substrate, the optical fiber core wire and the coating resin layer by different ultraviolet curable adhesive respectively. The fixed point is
In addition to the optical fiber array of the first aspect of the present invention, other than that, the structure of the optical fiber array, members constituting the optical fiber array, etc. are adhesives whose cross-sectional shape is divergent toward the outer edge of the substrate. Since it is similar to the first optical fiber array having layers, description thereof will be omitted here.

[0175]

The optical fiber array of the present invention will be described in more detail below.

(Example 1) A. Fabrication of an optical fiber ribbon from which a part of the coating resin layer has been removed Optical fiber core wires 115 having a diameter of 250 μm are arranged in parallel at a clad interval of 250 μm and made of an acrylate-based ultraviolet curable resin around the optical fiber core wires An optical fiber ribbon (manufactured by Sumitomo Electric Industries, Ltd.) coated with a coating resin layer (primary coating layer 113 and secondary coating layer 114) is prepared, and 5 to 50 mm from one end of the optical fiber ribbon.
The coating resin layer (primary coating layer and secondary coating layer) at that portion was peeled off using a coating resin layer peeling device (stripper) (see FIG. 8A).

B. Manufacture of Lid Section A substrate made of quartz glass is subjected to a cutting process using a diamond cutter to form a concave section 161 for accommodating a part of the exposed optical fiber core wire in a batch, thereby forming a lid section 160. (See FIG. 9 (a)). The recess has a rectangular cross section.

C. Fabrication of Optical Fiber Array (1) Starting from a silicon substrate 151 having a thickness of 0.7 mm, the surface of which has been subjected to polishing treatment, as a starting material.
A mask layer 152 was formed on 51 by the following method (see FIG. 4A). That is, first, the silicon substrate 1
51 in the thermal oxidation furnace with a thickness of 0.04 μm SiO 2
₂ film 152a is formed, and then a Si ₃ N ₄ film 15 having a thickness of 0.1 μm is formed on the SiO ₂ film by using the low pressure CVD method.
By forming 2b, the SiO ₂ film 152a and Si
_A mask layer 152 composed of two layers including the ₃ N ₄ film 152b was formed.

(2) Next, a thickness of 25 is formed on the mask layer 52.
A resin layer for resist 154 was formed by attaching a resin film for resist having a thickness of μm (see FIG. 4B).

(3) Next, the resist resin layer 154 is formed.
Place a mask with a groove pattern drawn on it, 800m
It is exposed to J / cm ² and then developed with an acrylic solution to form an etching resist 15 on the mask layer.
5 was formed (see FIG. 4 (c)).

(4) Next, the etching resist 15 is formed.
5 Remove the mask layer exposed in the non-formed area by the following method
Then, a mask 156 exposing a part of the substrate 151 is formed.
(See FIG. 4 (d)). That is, first, the exposed S
i_ThreeN_FourDry etching of the film using oxygen plasma
SiO by removing by treatment_TwoExpose the membrane,
Furthermore, this SiO _TwoThe film uses an HF-based etchant
Removed by wet etching process, silicon substrate
Exposed.

(5) Next, the etching resist was peeled off using a 10% by weight NaOH solution (FIG. 4 (e)).
reference). As a result, on the silicon substrate 151, only the mask 156 having the opening corresponding to the portion where the groove is formed is formed.

(6) Next, the silicon substrate 151 on which the mask 156 is formed is subjected to KOH concentration of 25% by weight and liquid temperature of 7
8 ° C. etching solution (KOH: 100 g, H ₂ O: 30
0 g) to form eight V-grooves having a depth of 90 μm (see FIG. 4 (f)). Then, the substrate 151
A coating resin layer holding portion 158 (see FIG. 8A) for fixing the optical fiber core wire and the coating resin layer to the upper part was formed by performing a cutting process using a diamond cutter. Here, the covering resin layer holding portion is formed such that the boundary between the portion where the covering resin layer is fixed and the groove forming surface on the substrate has an inclined surface that descends toward the portion where the covering resin layer is fixed. did. Further, although only four grooves are formed on the substrate shown in FIG. 8, this figure is a schematic view, and in fact, as described above, eight grooves were formed on the substrate.

(7) Next, the exposed portion of the optical fiber core wire 115 of the optical fiber ribbon 110A produced in the above A is placed in the V groove 157 (see FIGS. 8A and 8B),
Further, the lid 160 manufactured in the above B was placed on the substrate 151, and the lid 160 was lightly pressed by a jig (see FIG. 9A). While maintaining that state, the groove 15
7 and the optical fiber core wire 115, and the lid portion 16
0 and the optical fiber core wire 115 have a viscosity of 1600 m.
An ultraviolet curable resin composition of Pa · s (UV-3000 manufactured by Daikin Industries, Ltd.) was poured. Also here
The ultraviolet curable resin composition for fixing the optical fiber core wire was also poured into the coating resin layer holding portion 158.

Next, the ultraviolet curable resin composition was semi-cured by irradiating it with 7 J / cm ² of ultraviolet rays for 20 minutes using a high pressure mercury lamp. Further, the ultraviolet curable resin composition (UV-) is formed so as to cover the coating resin layer placed on the coating resin layer holding portion.
3000) was applied. After that, the jig holding the lid 160 was removed, and the ultraviolet curable resin composition was irradiated with ultraviolet rays of 25 J / cm ² for 40 minutes using a high pressure mercury lamp to completely remove the ultraviolet curable resin composition. Then, the optical fiber core wire and the coating resin layer were fixed (see FIG. 9B).

(8) Next, the coating resin layer 114 that was not housed and fixed in the substrate at one end of the optical fiber ribbon 110A.
a and the optical fiber core wire covered with this coating resin layer are cut and removed by a diamond cutter, and further polishing treatment is performed so that the end surface of the optical fiber core wire and the side surface of the substrate and the lid are aligned, The array 101 was manufactured (see FIG. 2A). In the polishing process, the end faces of the optical fiber core, the substrate and the lid are 8
I went to have a slope of °.

Example 2 In the step (7) of Example 1, a viscosity of 1600 was used to fix the optical fiber core wire.
An ultraviolet curable resin composition having a viscosity of 10000 mPa · s (UV, manufactured by Daikin Industries, Ltd., UV, used to fix the coating resin layer is used by using an ultraviolet curable resin composition having a mPa · s (UV-3000, manufactured by Daikin Industries, Ltd.). -3000 to inorganic particles,
An optical fiber array was produced in the same manner as in Example 1 except that a resin composition whose viscosity was adjusted by blending any one of resin particles and metal particles was used.

(Example 3) In the step B of Example 1 (preparation of the lid), borosilicate glass (Pyrex (R)) was used.
A concave portion 171 for accommodating a part of the exposed optical fiber core wires having different depths by performing a cutting process using a diamond cutter on the substrate made of
A lid 170 having a recess 172 for accommodating the optical fiber ribbon together with the coating resin layer is produced (see FIG. 10A), and the lid 170 is removed in the step (7) of Example 1C. An optical fiber array 102 was manufactured in the same manner as in Example 1 except that it was attached to the substrate (see FIG. 10B). In addition, in FIG. 10, the ultraviolet curable adhesive is omitted.

(Example 4) A. Fabrication of laminated optical fiber ribbon from which a part of the coating resin layer has been removed
Optical fiber ribbons (manufactured by Sumitomo Electric Industries, Ltd.) that are arranged in parallel at 0 μm and have a coating resin layer (primary coating layer and secondary coating layer) made of an acrylate-based ultraviolet curable resin around the optical fiber core wire. 2) was prepared, and each of the optical fiber ribbons was subjected to the following processing (i) and (ii).

(I) First, the coating resin layer (primary coating layer and secondary coating layer) in the portion from one end of the optical fiber core wire to 30 mm is peeled off using a coating resin layer peeling device (stripper), The fiber core wire was exposed.

(Ii) 5 to 5 from one end of the optical fiber core wire
The coating resin layer (primary coating layer and secondary coating layer) at the portion at 0 mm was peeled off using a coating resin layer peeling device (stripper) to expose the optical fiber core wire.

(2) Next, the first optical fiber ribbon 330 treated with the above (i) was stacked on the second optical fiber ribbon 340 treated with the above (ii).
Furthermore, the exposed portion 335 of the optical fiber core wires of both
a and 345a have the same height, a part of each optical fiber core wire is bent to form a laminated optical fiber ribbon 30.
It was set to 0 (refer to FIG. 6).

In this step, when stacking the first optical fiber ribbon 330 on the second optical fiber ribbon 340, after bending a part of the optical fiber core wire, the optical fiber core wires 335 and 345 of both optical fiber core wires are bent. Were alternately stacked at equal intervals. Further, in this step, the first optical fiber ribbon 33 is placed on the second optical fiber ribbon 340.
Before stacking 0, the second optical fiber ribbon 3
An uncured adhesive (not shown) is applied to a part of the upper surface of the secondary coating resin 40, and the first optical fiber ribbon 330 is placed on the second optical fiber ribbon 340 via the adhesive.
Were stacked, and then the adhesive was cured to fix them.

B. Fabrication of lid part The lid part was prepared in the same manner as in B of Example 1 except that the size of the recessed part was set such that a part of the exposed optical fiber core wire of the laminated optical fiber ribbon could be accommodated together. Was formed.

C. Fabrication of optical fiber array (1) V was applied to the substrate in the same manner as in steps (1) to (6) of C of Example 1 except that the number of grooves to be formed was 16.
A groove was formed, and further, a coating resin layer holding portion for fixing the optical fiber core wire and the coating resin layer was formed on a part of the substrate by cutting using a diamond cutter.

(2) Next, the exposed optical fiber core wire of the laminated optical fiber ribbon produced in A above is placed in the V groove, and the lid portion produced in B above is placed on the substrate. Then, the lid was lightly pressed by the jig. While maintaining that state, the viscosity of 1600 mPa · s in the gap between the groove and the optical fiber core wire and the gap between the lid portion and the optical fiber core wire.
UV curable resin composition of s (manufactured by Daikin Industries, Ltd., UV
-3000). Further, here, the ultraviolet curable resin composition for fixing the optical fiber core wire was also poured into the coating resin layer holding portion 158.

Next, the above ultraviolet curable resin composition was irradiated with ultraviolet rays of 7 J / cm ² for 20 minutes using a high pressure mercury lamp to semi-cure the ultraviolet curable resin composition. Further, the ultraviolet curable resin composition (UV-) is formed so as to cover the coating resin layer placed on the coating resin layer holding portion.
3000) was applied. Thereafter, the jig holding the lid was removed, and the ultraviolet curable resin composition was irradiated with ultraviolet rays of 25 J / cm ² for 40 minutes using a high pressure mercury lamp to completely remove the ultraviolet curable resin composition. Then, each of the optical fiber core wire and the coating resin layer was fixed.

(3) Next, the coated resin layer which was not housed and fixed in the substrate at one end of the laminated optical fiber ribbon and the optical fiber core wire covered with this coated resin layer were cut and removed by a diamond cutter, Further, polishing treatment was performed so that the end face of the optical fiber and the side faces of the substrate and the lid portion were aligned with each other to manufacture an optical fiber array. The polishing process was performed so that the end faces of the optical fiber core, the substrate and the lid portion were inclined by 8 ° with respect to the bottom face of the substrate.

(Example 5) In the step (7) of Example 1, a viscosity of 480 m was applied in order to fix the optical fiber core wire.
Using an epoxy-based UV-curable resin composition (UV-3100, manufactured by Daikin Industries, Ltd.) of Pa · s to fix the coating resin layer, an acrylate-based UV-curable resin composition of viscosity 1600 mPa · s ( U made by Daikin Industries, Ltd.
V-3000) was used to manufacture an optical fiber array in the same manner as in Example 1.

Example 6 In the step (7) of Example 1, a viscosity of 480 m was applied to fix the optical fiber core wire.
Using an epoxy-based UV-curable resin composition (UV-3100 manufactured by Daikin Industries, Ltd.) of Pa · s to fix the coating resin layer, an acrylate-based UV-curable resin composition of viscosity 7000 mPa · s ( U made by Daikin Industries, Ltd.
An optical fiber array was manufactured in the same manner as in Example 1 except that V-3000 was used as a resin composition whose viscosity was adjusted by blending any one of inorganic particles, resin particles and metal particles. .

With respect to the optical fiber arrays obtained in Examples 1 to 6, a detector is placed on the end face of the optical fiber core on the optical fiber array side, and light is introduced from the other end face of the optical fiber core by using a light emitting element. The storage accuracy of the optical fiber core wire was evaluated by calculating the deviation from the design of the storage position of the optical fiber core wire from the detected position of the light. After pressing the optical fiber array from above with a pressing force of 20 Pa for 20 minutes, the accommodating accuracy of the optical fiber core wire was measured in the same manner as above.

As a result, in the optical fiber arrays of Examples 1 to 6, the deviation from the design of the storage position of the optical fiber core wire is 5% or less both before and after pressing, and the optical fiber core wire is highly accurately predetermined. It was stored in the position. Furthermore, eight or 16 optical fiber arrays of Examples 1 to 6 are used.
When the coupling loss was measured by connecting to a light receiving device provided with individual light receiving elements, the coupling loss was low, and the quality required as a product was sufficiently satisfied.

Further, when the optical fiber array was disassembled after the measurement of the accommodating accuracy and the coupling loss, the adhesive was surely filled in the gap between the groove and the optical fiber core wire.

[0204]

As described above, the optical fiber arrays according to the first and second aspects of the present invention have the above-mentioned structure, so that the epoxy-based or acrylate-based ultraviolet curable resin is formed in the groove formed in the substrate. The optical fiber core wire is securely fixed through the cured product of the composition, and when connecting the optical fiber array to an optical element, or when a force is externally applied to the optical fiber array, the optical fiber core wire It is possible to accurately transmit an optical signal without causing a positional deviation.

Further, in the optical fiber array of the second aspect of the present invention, the optical fiber core wire is fixed by using a cured product of an epoxy type ultraviolet curable resin composition having a relatively large Young's modulus and a relatively hardness. The positional deviation of the optical fiber core is less likely to occur, and the coating resin layer is fixed by using a cured product of a relatively soft acrylate-based or silicone-based UV-curable resin composition having a relatively small Young's modulus. Therefore, the coating resin layer portion can be deformed to some extent according to the shape of the portion to which the optical fiber array is attached. In this way, if the coating resin layer portion can be deformed to some extent according to the shape of the portion to which the optical fiber array is attached, for example, the optical fiber core wire on the side opposite to the side housed in the groove of the substrate, and the print The optical fiber core wire is not cracked or cracked even during connection work with a substrate or the like.

[Brief description of drawings]

FIG. 1 (a) is a partial perspective view schematically showing an example of an optical fiber array of the first present invention, and FIG. 1 (b) is
It is the sectional view on the AA line of (a), (c) is B of (a).
-It is a line B section.

FIG. 2 (a) is a partial perspective view schematically showing an example of the optical fiber array of the first aspect of the present invention to which a lid is attached, and FIG. 2 (b) is a lid attached to the optical fiber array. It is a perspective view which shows only, (c) is the AA sectional view taken on the line of (a), (d) is the BB sectional view taken on the line of (a).

FIG. 3 is a partial perspective view schematically showing an example of an optical fiber array of the first invention using a laminated optical fiber ribbon.

4A to 4F are cross-sectional views showing an example of a method for forming a groove in a substrate.

FIG. 5A is a front view schematically showing an example of a method for peeling a coating resin layer of an optical fiber ribbon, and FIG.
Is a side view thereof.

FIG. 6 is a partial perspective view schematically showing an embodiment of a laminated optical fiber ribbon.

FIG. 7 (a) is a partial perspective view schematically showing an example of the optical fiber array of the second aspect of the present invention, and FIG. 7 (b) is a perspective view showing only a lid part attached to the optical fiber array. Yes, (c) is a sectional view taken along line AA of (a).

8A and 8B are perspective views schematically showing a part of the manufacturing process of the optical fiber array of the present invention.

9A and 9B are perspective views schematically showing a part of the manufacturing process of the optical fiber array of the present invention.

10A and 10B are perspective views schematically showing a part of the manufacturing process of the optical fiber array of the present invention.

FIG. 11A is an example of the optical fiber array of the first present invention having an adhesive layer in which the cross-sectional shape in the direction perpendicular to the axis of the optical fiber core is divergent toward the outer edge of the substrate. It is a partial perspective view which shows typically, (b) is
It is the sectional view on the AA line of (a), (c) is B of (a).
It is a -B line sectional view.

FIG. 12 is an optical fiber array according to a first aspect of the present invention, which has an adhesive layer in which a cross-sectional shape in a direction perpendicular to an axis of an optical fiber core is divergent toward an outer edge portion of a substrate. It is sectional drawing which shows typically an example of the shape of the cross section of the constituting lid part.

[Explanation of symbols]

115, 235, 245, 415, 1115 Optical fiber core wires 151, 251, 451, 1151 Substrate 157, 257, 457, 1157 Grooves 160, 1160 Lid 100, 200, 400, 1100 Optical fiber array 110, 410, 1110 Optical fiber Ribbon 210 laminated optical fiber ribbon

Claims (9)

[Claims] 1. A substrate having a plurality of grooves and a coating resin layer holding portion formed on its upper surface, and an optical fiber ribbon in which a plurality of optical fiber core wires are arranged in parallel and a coating resin layer is formed around the optical fiber ribbon. In the optical fiber array consisting of, the optical fiber core wire is fixed to the groove via an adhesive, and the optical fiber core wire and the coating resin layer are fixed to the covering resin layer holding portion via an adhesive. And the adhesive is
An optical fiber array comprising a cured product of an epoxy-based or acrylate-based UV-curable resin composition. 2. The viscosity of the ultraviolet curable resin composition is
The optical fiber array according to claim 1, which has a viscosity of 200 to 2000 mPa · s. 3. The ultraviolet curable resin composition for fixing the optical fiber core wire has a viscosity of 200 to 2000 mPa · s.
The optical fiber array according to claim 1, wherein the ultraviolet curable resin composition for fixing the coating resin layer has a viscosity of 5,000 to 30,000 mPa · s. 4. A substrate having a plurality of grooves and a coating resin layer holding portion formed on its upper surface, and an optical fiber ribbon in which a plurality of optical fiber core wires are arranged in parallel and a coating resin layer is formed around the substrate. In the optical fiber array consisting of, the optical fiber core wire is fixed to the groove via an adhesive, and the optical fiber core wire and the coating resin layer are fixed to the covering resin layer holding portion via an adhesive. The adhesive for fixing the optical fiber core wire is a cured product of an epoxy-based ultraviolet curable resin composition, and the adhesive for fixing the coating resin layer is an acrylate-based or silicone-based ultraviolet curable resin composition. An optical fiber array characterized by being a cured product. 5. The viscosity of each of the epoxy-based UV-curable resin composition and the acrylate-based or silicone-based UV-curable resin composition is 200 to 20.
The optical fiber array according to claim 4, which is 00 mPa · s. 6. The epoxy-based UV-curable resin composition has a viscosity of 200 to 2000 mPas, and the acrylate-based UV-curable resin composition has a viscosity of 5 to 5.
3,000 to 30,000 mPa · s, or the viscosity of the silicone-based ultraviolet curable resin composition is 50
The optical fiber array according to claim 4, wherein the optical fiber array has a range of 0 to 50000 mPa · s. 7. The optical fiber array according to claim 1, wherein a lid is attached to at least a part of the substrate via an adhesive layer so as to cover the optical fiber core wire. 8. The optical fiber array according to claim 7, wherein the adhesive layer has a cross-sectional shape in a direction perpendicular to the axis of the optical fiber core, which is divergent toward the outer edge of the substrate. 9. The optical fiber array according to claim 7, wherein the shape of the lid is a shape in which a concave portion for accommodating a part of the optical fiber core wire is formed.