JP2006201372A - Optical path conversion mirror, optical path conversion apparatus using the same, and method for manufacturing optical path conversion mirror - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical path conversion mirror capable of eliminating waste of an optical waveguide, an optical path conversion apparatus using the mirror, and a method for manufacturing the mirror. <P>SOLUTION: The optical path conversion mirror M, in which a metallic film 3 to be an optical reflection area is held between a first resin layer 1 and a second resin layer 2, is arranged on the optical axis of an optical waveguide 10 and near the outside of its one end face 10a to structure the optical path conversion apparatus. Both end faces 10a, 10b of the optical waveguide 10 are maintained at right angles to the optical axis of the optical waveguide 10, and not machined to be an inclined face (micro-mirror). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical path conversion mirror widely used in optical communication, optical information processing, and other general optics, an optical path conversion device using the mirror, and a method of manufacturing the optical path conversion mirror.

  An optical waveguide is incorporated in an optical device such as an optical waveguide device, an optical integrated circuit, or an optical wiring board, and is widely used in the fields of optical communication, optical information processing, and other general optics. Further, in the above optical device, for example, as shown in FIG. 11, in order to transmit the optical signal from the light emitting element 23 to the light receiving element 24 through the optical waveguide 50, the optical path is changed at the end of the optical waveguide 50. There are cases where a 90-degree conversion is performed. That is, by forming the one end face 50a in the optical axis direction of the optical waveguide 50 on an inclined surface (micromirror) inclined by 45 degrees with respect to the optical axis of the optical waveguide 50, the optical signal L from the light emitting element 23 is obtained. The light is reflected by the inclined surface (micromirror), guided to the core layer 52 of the optical waveguide 50, and transmitted to the light receiving element disposed on the optical axis of the optical waveguide 50 near the outside of the other end surface 50b. It has become. In FIG. 11, 51 is an under cladding layer, and 53 is an over cladding layer.

As a method of forming the inclined surface (micromirror), a method of cutting or cutting one end surface 50a of the optical waveguide 50 by dicing using a diamond blade (for example, see Patent Document 1), a method of cutting by a laser, or the like. Is adopted.
Japanese Patent Laid-Open No. 10-300961

  However, when the optical waveguide 50 is directly processed by dicing or the like, if the accuracy such as the angle of 45 degrees or the flatness of the inclined surface is insufficient, the optical path is not properly converted by 90 degrees, which hinders light transmission. Bring In such a case, the entire optical waveguide 50 becomes a defective product, and the optical waveguide 50 has to be discarded.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an optical path conversion mirror capable of eliminating waste of an optical waveguide, an optical path conversion device using the same, and a method of manufacturing the optical path conversion mirror.

  In order to achieve the above object, according to the present invention, a metal film that refracts and emits incident light by a predetermined angle is formed inside the resin, and at least a portion of the resin that transmits light is made of a light-transmitting resin. The optical path conversion mirror is a first gist.

  Further, the present invention includes a substrate, an optical waveguide fixed on the substrate, and the optical path conversion mirror, and one of the light incident part or the light output part of the optical path conversion mirror is a light in the optical waveguide. An optical path conversion device that is positioned on at least one end face in the axial direction and in which the end face of the optical waveguide on the side where the optical path conversion mirror is located is maintained in a state perpendicular to the optical axis of the optical waveguide The gist.

  Furthermore, the present invention provides a method for producing the optical path conversion mirror, wherein a step of forming a first resin layer made of a light-transmitting resin on the surface of the peeling plate, and a cross section V on the surface of the first resin layer. A step of forming a letter-shaped groove, a step of forming a metal film on the surface of the groove, a step of forming a second resin layer on the surface of the metal film, and the peeling plate as the first resin layer. And a step of separating the laminate composed of the first resin layer, the metal film, and the second resin layer along the longitudinal direction of the V-shaped groove, and forming the V-shaped metal film. The manufacturing method of the optical path conversion mirror provided with the process which makes one surface the light reflection surface in an optical path conversion mirror makes a 3rd summary.

  That is, since the optical path conversion mirror of the present invention is manufactured using a resin such as a light transmissive resin and a metal film, the cost required for the manufacturing can be reduced. For this reason, even if a defective product occurs in the optical path conversion mirror, an increase in cost can be suppressed. The optical path conversion device of the present invention can perform optical path conversion by positioning the optical path conversion mirror of the present invention on one end face of the optical waveguide. That is, the light emitted from one end face of the optical waveguide is incident from the light incident portion of the optical path conversion mirror and then reflected by the metal film surface to be refracted by a predetermined angle and emitted from the light output of the optical path conversion mirror. be able to. Or, conversely, after the light from the outside of the optical waveguide is incident from the light incident portion of the optical path conversion mirror and then reflected by the metal film surface, it is refracted by a predetermined angle to be emitted from the light output of the optical path conversion mirror. Then, it can be guided into the optical waveguide from one end face of the optical waveguide. As described above, in the present invention, since the optical path can be changed by the optical path conversion mirror, there is no need to process the optical waveguide into an inclined surface (micromirror), and the optical waveguide is defective due to failure of the processing or the like. There is nothing to do. Therefore, the cost can be reduced without wasting the optical waveguide.

  Since the optical path conversion mirror of the present invention has a metal film inside a resin such as a light transmissive resin, it can be manufactured at low cost. For this reason, even if a defective product occurs in the optical path conversion mirror, an increase in cost can be suppressed. Moreover, since the surface of the metal film serving as the light reflecting surface is protected by the light transmissive resin, the light reflecting performance can be maintained for a long period of time.

  The optical path conversion mirror includes a first resin layer made of a light-transmitting resin and a second resin layer made of a light-transmitting resin or a light-impermeable resin, and the second resin layer is flat on the surface thereof. And an inclined surface having an inclination angle of a predetermined angle with respect to the plane, and the metal film is formed on the surface of the second resin layer, and the surface of the second resin layer is interposed through the metal film. In the case where the first resin layer is laminated, the optical path conversion mirror can be manufactured more easily and can be manufactured at a lower cost. Furthermore, since the outer peripheral surface of the optical path conversion mirror can be formed flat by the first resin layer or the second resin layer, fixing of the optical path conversion mirror can be stabilized by fixing at the plane portion, and Picking up with a chip mounter can be facilitated.

  The optical path conversion device of the present invention can perform optical path conversion by positioning the optical path conversion mirror of the present invention on the end face of the optical waveguide. Further, the end face of the optical waveguide on the side where the optical path conversion mirror is located is maintained in a state perpendicular to the optical axis of the optical waveguide, and it is not necessary to process it into an inclined surface (micromirror). The optical waveguide is not made defective due to the failure. Therefore, the cost can be reduced without wasting the optical waveguide.

  Furthermore, in the method of manufacturing an optical path conversion mirror according to the present invention, after forming a groove having a V-shaped cross section on the surface of the first resin layer, a metal film is formed on the surface of the groove, and the surface of the metal film is By forming the two resin layers, an optical path conversion mirror having one surface of the metal film forming the V shape as a light reflecting surface can be manufactured at low cost.

  In particular, when the angle formed by the V-shape of the groove is set to 90 degrees, and the angle formed between each surface forming the V-shape and the plane on the surface of the first resin layer is set to 45 degrees, respectively. In this case, an optical path conversion mirror that can easily convert the optical path by 90 degrees can be manufactured.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 and FIG. 2 show an embodiment of the optical path conversion mirror of the present invention. As shown in FIG. 1 and FIG. 2, a side view of the optical path conversion mirror M is formed in a rectangular parallelepiped, and a metal film is formed between the first resin layer 1 and the second resin layer 2. 3 is comprised from the laminated body by which the whole is united.

  More specifically, the second resin layer (lower layer in FIG. 1) 2 has a lower surface formed on a flat surface 2d, and one side portion (left side portion in FIG. 1) is formed on a flat surface 2c parallel to the lower surface. The other side portion (the right side portion in FIG. 1) of the upper surface is formed as a convex portion formed of inclined surfaces 2a and 2b having an inverted V-shaped cross section. The metal film 3 is formed on the entire upper surface of the second resin layer 2 with a substantially uniform thickness along the shape of the upper surface. The surface (upper surface) of the metal film 3 has a function of reflecting light. In this embodiment, the surface (upper surface) of the metal film 3 is a flat surface 3c out of the two inclined surfaces 3a and 3b. An inclined surface 3a opposite to the portion (right side in FIG. 1) is a light reflecting surface for optical path conversion. Further, the first resin layer (upper layer in FIG. 1) 1 is formed on the surface of the metal film 3, and the shape of the first resin layer 1 is the surface shape of the metal film 3 (the second resin layer 2). The upper surface is formed on a plane 1a parallel to the lower surface of the second resin layer 2. As will be described later, the first resin layer 1 serves as an optical path, and thus is formed of a light transmissive resin.

In addition, the optical path conversion mirror M is positioned on one end surface of the optical waveguide in an optical device such as an optical waveguide device, an optical integrated circuit, or an optical wiring board, so that a part of the optical path conversion device (see FIG. 3) can be used. Eggplant. For this reason, the size of the optical path conversion mirror M depends on the size of the optical waveguide and the like, but is usually the vertical length (the length of the side facing the one end face of the optical waveguide) W (see FIG. 1). Is set in the range of 50 to 5000 μm, the lateral length S is set in the range of 50 to 500 μm, and the height H is set in the range of 50 to 200 μm. In addition, the thickness t ₁ (see FIG. 2) at the plane portion of the first resin layer 1 is usually set within a range of 50 to 200 μm, and the thickness t ₂ at the plane portion of the second resin layer ₂ is The height h of the convex portion, which is set in the range of 10 to 50 μm and is formed on the upper surface of the second resin layer 2 and formed of the inclined surfaces 2a and 2b having an inverted V-shaped cross section, It is set within the range of 50 to 150 μm. Further, an inclination angle of the inclined surface 2a on the upper surface of the second resin layer 2 (an angle formed with the flat surface 2c portion of the upper surface of the second resin layer 2) θ (FIG. 2) on which a light reflecting surface for optical path conversion is formed. Is set according to the angle of the optical path conversion and is set within a range of more than 0 degree and less than 90 degrees, but is usually set within a range of 35 to 55 degrees, preferably 40 to 50 degrees. In the case of 90 degrees, the inclination angle θ is set to 45 degrees.

  FIG. 3 shows an embodiment of the optical path changing device of the present invention in an optical device. This optical path changing device is obtained by positioning the optical path changing mirror M of the present invention on the one end face 10 a of the optical waveguide 10 in the optical device. That is, the optical path conversion device includes a substrate 21, an optical waveguide 10 fixed on the substrate 21, and the optical path conversion mirror M. The optical path conversion mirror M is formed on the surface of the metal film 3 ( The light reflecting surface (upper surface) (the inclined surface 3a on the right side of the two inclined surfaces 3a and 3b in FIG. 3) is outside the one end surface (left end surface in FIG. 3) 10a on the optical axis of the optical waveguide 10. It is fixed on the substrate 21 with an adhesive 22 in a state of being arranged in the vicinity. For example, as shown in FIG. 3, when the light emitting element 23 is disposed above the optical path conversion mirror M, the lower surface of the second resin layer 2 is opposed to the surface of the substrate 21 to form the light reflecting surface. The optical path conversion mirror M is fixed on the substrate 21 with the inclined surface 3a of the metal film 3 facing obliquely upward. Further, both end faces 10a and 10b of the optical waveguide 10 are maintained in a state perpendicular to the optical axis of the optical waveguide 10, and are not processed into inclined surfaces (micromirrors).

  In the optical path conversion device (see FIG. 3), the optical path conversion is performed as follows. That is, the optical signal L from the light emitting element 23 enters from the upper surface (light incident portion) of the first resin layer 1 of the optical path conversion mirror M, passes through the first resin layer 1, and then the light of the metal film 3. The light is reflected by the reflecting surface (inclined surface 3a) and emitted from the side surface (light emitting portion) of the first resin layer 1 of the optical path conversion mirror M. In this way, the emitted optical signal L is guided from the one end face 10a of the optical waveguide 10 into the core layer 12 of the optical waveguide 10, and is disposed on the optical axis of the optical waveguide 10 near the outside of the other end face 10b. It is transmitted to the light receiving element 24. Further, the positions of the light emitting element 23 and the light receiving element 24 may be interchanged to transmit the optical signal L in the opposite direction (in this case, the light incident portion in the optical path conversion mirror M is the side surface of the first resin layer 1). And the light emitting portion becomes the upper surface of the first resin layer 1). From the viewpoint of suppressing a decrease in light propagation efficiency, the light reflecting surface (inclined surface 3a) of the metal film 3 is preferably close to the one end surface 10a in the optical axis direction of the optical waveguide 10, and therefore, the optical path conversion mirror M The gap between the side surface (light emitting part or light incident part) of the optical waveguide 10 and the one end face 10a of the optical waveguide 10 is preferably as small as possible, more preferably they are in contact with each other. In FIG. 3, 11 is an under cladding layer, and 13 is an over cladding layer.

  As described above, in the optical path conversion device, when the optical path conversion mirror M of the present invention is used, it is not necessary to process the optical waveguide 10 into an inclined surface (micromirror), and the optical waveguide 10 becomes a defective product due to failure of the processing or the like. There is nothing to do. Therefore, the cost can be reduced without wasting the optical waveguide 10.

  In addition, in the optical path conversion mirror M of the present invention, the upper surface of the metal film 3 serving as the light reflecting surface is protected by the first resin layer 1 and the lower surface of the metal film 3 is also protected by the second resin layer 2. It is durable against deterioration and can maintain its light reflection performance over a long period of time. In particular, when the upper surface of the first resin layer 1 is formed on the flat surface 1a, pickup by a chip mounter is facilitated, and the productivity of the optical path conversion device is improved. Further, when the second resin layer 2 is formed, even if the metal film 3 is formed in an inclined shape, the lower surface of the second resin layer 2 is made flat 2d, so that the substrate 21 can be stably formed. Can be fixed.

  Next, materials for forming the first resin layer 1, the second resin layer 2, the metal film 3, and the like will be described.

  Examples of the light-transmitting resin that is a material for forming the first resin layer 1 include an epoxy resin and a polyimide resin. Moreover, although the said light transmissive resin is preferable also as a formation material of the 2nd resin layer 2, since the 2nd resin layer 2 does not become an optical path, the formation material may not be a light transmissive resin, For example, polycarbonate, poly (meth) acrylate, norbornene-based polymer, filler-filled epoxy resin and the like can be mentioned.

  Examples of the material for forming the metal film 3 include copper, nickel, gold, silver, and aluminum.

  Examples of the substrate to which the optical path conversion mirror M is fixed include a quartz substrate and a silicon substrate. Further, the adhesive 22 that bonds the optical path conversion mirror M onto the substrate 21 is not particularly limited, and examples thereof include silver paste, a photocurable resin, and a thermosetting resin. The thickness of the layer made of the adhesive 22 is not particularly limited, but is usually set within a range of 1 to 20 μm.

  Next, an embodiment of a method for producing the optical path conversion mirror M will be described.

First, as shown in FIG. 4, a light-transmitting resin, which is a material for forming the first resin layer 1, is applied to the surface of a peeling plate P ₁ made of a glass plate or the like, and then cured to cure the first resin layer 1. Form. Examples of the curing method include drying, ultraviolet curing, and heat curing according to the type of the light transmissive resin.

  Then, as shown in FIG. 5, a plurality of V-shaped grooves G having a V-shaped cross section are formed in parallel at a predetermined pitch on the surface of the first resin layer 1. Although this formation pitch depends on the dimension of the optical path conversion mirror M, it is usually set in the range of 50 to 5000 μm. The groove G is formed by dicing using a blade B having a predetermined edge angle, and the edge angle is an angle formed by a V-shape of the groove G.

  Next, as shown in FIG. 6, a metal film 3 is formed on the surface of the first resin layer 1 in which the groove G is formed by sputtering, plating, or the like. In addition, it is preferable that the surface of the first resin layer 1 is subjected to plasma treatment or the like prior to sputtering or the like so that the metal film 3 is firmly fixed to the surface of the first resin layer 1. The thickness of the metal film 3 is preferably 100 nm or more, more preferably in the range of 100 to 150 nm.

Then, as shown in FIG. 7, a material for forming the second resin layer 2 is applied to the surface of the metal film 3 and then cured to form the second resin layer 2. This curing is performed from the viewpoint of making the surface of the second resin layer 2 flat (in FIG. 2, the flat surface 2d of the lower surface of the second resin layer 2) from the top of the applied forming material (resin) to a flat plate P such as a glass plate. It is preferable that the flat plate P ₂ is peeled off after being cured while being pressed with ₂ . In the case of performing the curing in UV or the like, as the flat plate P _2, it is preferable to use a glass plate having a light transmitting property. Also, usually, the second resin layer 2 and the flat plate (glass plate or the like) P ₂ have a considerably weak adhesive force and are easily peeled off when immersed in water. It is preferable to use a flat plate P ₂ whose surface has been subjected to a release treatment.

Next, as shown in FIG. 8, after the surface of the second resin layer 2 is adhered to the weak adhesive sheet E, the peeling plate P ₁ is peeled from the first resin layer 1. The light transmitting resin (first resin layer 1) and the peeling plate (glass plate, etc.) P _1, the adhesive strength is quite weak, by immersion in water, but easily peeled, the peeling easily As described above, as the peeling plate P ₁ , a plate whose surface has been subjected to a release treatment may be used. In FIG. 8, F is a ring-shaped frame that supports the outer peripheral portion of the weak adhesive sheet E.

  Next, as shown in FIG. 9 (in FIG. 9, the one shown in FIG. 8 is shown upside down), the length of the groove G is between the adjacent grooves G. Dicing or the like along the direction cuts from the surface of the first resin layer 1 through the metal film 3 to the second resin layer 2 (part indicated by a broken line C in FIG. 9). Furthermore, in order to make the optical path conversion mirror M a predetermined dimension, dicing is performed in a direction perpendicular to the longitudinal direction of the groove G as necessary, and the metal film 3 is formed from the surface of the first resin layer 1. Then, the second resin layer 2 is cut. Thereby, a plurality of optical path conversion mirrors M adhered to the weak adhesive sheet can be obtained.

  Such a manufacturing method of the optical path conversion mirror M uses the resin and the metal as materials, so that the cost can be reduced. For this reason, even if a defective product occurs in the optical path conversion mirror M, an increase in cost can be suppressed.

  And when manufacturing an optical path changing device (refer to Drawing 3), each optical path changing mirror M obtained by making it above is picked up with a chip mounter, and it exfoliates from the above-mentioned weak adhesive sheet E, and FIG. As shown in FIG. 3, the optical path changing device is positioned and fixed at a predetermined position on the substrate 21 for manufacturing. Prior to this positioning, an adhesive 22 for fixing the optical path conversion mirror M at a predetermined position on the substrate 21 is applied.

  Note that the optical path conversion mirror M is not limited to that shown in FIG. 1, and may be one shown in FIGS. 10A to 10C, for example. That is, in FIG. 10A, the convex portion composed of the inclined surfaces 2a and 2b having a reverse V-shaped cross section in FIG. 2 is located at the center portion. Moreover, what is shown in FIG.10 (b) forms only one inclined surface 2a. Furthermore, what is shown in FIG. 10C is one in which one inclined surface 2a and a flat surface 2c continuous to the upper end edge of the inclined surface 2a are formed.

  In the optical path conversion device shown in FIG. 3, the optical path conversion mirror M is disposed only on the optical axis of the optical waveguide 10 in the vicinity of the outside of the one end face 10a. However, the optical path conversion mirror is also provided on the other end face 10b side of the optical waveguide 10. M may be arranged, and the optical path conversion may be performed also on the other end face portion. In the optical path conversion device shown in FIG. 3, the optical path conversion mirror M may be fixed with the left and right sides reversed in FIG. 3, and the opposite inclined surface 3b may be used as a light reflecting surface.

  The optical path conversion mirror M can also be manufactured by a manufacturing method other than the manufacturing method shown in FIGS. 4 to 9 (a manufacturing method in which the first resin layer 1, the metal layer 3, and the second resin layer 2 are stacked in this order). For example, after the second resin layer 2 is formed, a convex portion including inclined surfaces 2a and 2b having a reverse V-shaped cross section is formed on the surface of the second resin layer 2, and the metal film 3 is formed on the surface. Furthermore, even when the first resin layer 1 is formed on the surface, the optical path conversion mirror M can be manufactured.

  Next, examples will be described.

  The optical path conversion mirror was produced as follows.

On a quartz substrate [5 cm × 5 cm × 500 μm (thickness)], an ultraviolet curable epoxy resin [Epicoat 828 (manufactured by Japan Epoxy Resin Co., Ltd.) / Celoxide 2021 (manufactured by Daicel Chemical Industries) / SP-170 (manufactured by Asahi Denka Kogyo Co., Ltd.) = 50/50/4] is applied by spin coating, dried and exposed (3 J / cm ² ), and further cured by heating (150 ° C. × 30 minutes) to form a first resin layer (constant thickness) 60 μm) was formed.

  Next, the surface of the first resin layer was diced using a blade having a blade edge angle of 90 degrees to form a plurality of V-shaped strips having a depth of 60 μm at a pitch of 140 μm. At this time, the angle formed between each surface forming the V-shape and the plane on the surface of the first resin layer was set to 45 degrees.

  Next, the surface of the first resin layer in which the groove was formed was subjected to plasma treatment, and then a copper film having a thickness of 0.1 μm was formed on the surface of the first resin layer by sputtering.

Then, the same UV curable epoxy resin solution as that of the first resin layer is applied to the surface of the copper film by spin coating, and then dried, and the surface is pressed with a glass plate whose surface has been released. It was. In this state, exposure (3 J / cm ² ) was performed, followed by heating (150 ° C. × 30 minutes) to cure to form a second resin layer (thickness 20 μm at the plane portion). Thereafter, the glass plate was peeled off.

  Next, after the surface of the second resin layer was adhered to a weak adhesive sheet (Elep Holder UE-2000, manufactured by Nitto Denko Corporation), it was immersed in water, and the quartz substrate was peeled from the first resin layer.

  Next, by dicing the boundary line between the groove and the plane continuous to the groove along the longitudinal direction of the groove, the surface of the first resin layer is passed through the metal film, Cut to 2 resin layers. Further, dicing was also performed in a direction perpendicular to the longitudinal direction of the groove, and cutting was performed from the surface of the first resin layer to the second resin layer through the metal film. As a result, a plurality of optical path conversion mirrors adhered to the weak adhesive sheet could be obtained. The size of each optical path conversion mirror was 500 μm in length, 140 μm in width, and 80 μm in height.

  When one of the obtained optical path conversion mirrors was picked up and irradiated with laser light at an incident angle of 45 degrees to the inclined surface portion of the copper film, the optical path of the laser light was converted by 90 degrees.

  Further, a silicon substrate having a 3.5 mm long optical waveguide fixed thereon was prepared. Both end faces in the optical axis direction of the optical waveguide are formed at right angles to the optical axis, and the dimension of the core layer (made of polyimide resin) on both end faces is 50 μm × 50 μm. Then, on the silicon substrate, a silver paste was applied as an adhesive near the outside of one end face on the optical axis of the optical waveguide. The optical path conversion mirror picked up by the chip mounter and peeled from the weak adhesive sheet was positioned on the silver paste and then fixed by heating. At this time, the inclined surface portion of the copper film serving as the light reflecting surface was inclined obliquely upward, and the light reflecting surface side was directed to one end surface of the optical waveguide in the optical axis direction.

  Then, as shown in FIG. 3, an optical waveguide device was manufactured in which the light emitting element 23 was disposed above the optical path conversion mirror M, and the light receiving element 24 was disposed in the vicinity of the outside of the other end face 10 b on the optical axis of the optical waveguide 10. .

  Then, when light having a wavelength of 850 nm was emitted from the light emitting element 23 and transmitted to the light receiving element 24, the light propagation loss was 9 dB, and it was confirmed that the light was propagated well.

It is a perspective view which shows one Embodiment of the optical path conversion mirror of this invention. It is a side view which shows the said optical path conversion mirror. It is a side view which shows typically one embodiment of the optical path changing device of the present invention. It is explanatory drawing which shows typically one Embodiment of the manufacturing method of the optical path conversion mirror of this invention. It is explanatory drawing which shows typically the manufacturing method of the said optical path conversion mirror. It is explanatory drawing which shows typically the manufacturing method of the said optical path conversion mirror. It is explanatory drawing which shows typically the manufacturing method of the said optical path conversion mirror. It is explanatory drawing which shows typically the manufacturing method of the said optical path conversion mirror. It is explanatory drawing which shows typically the manufacturing method of the said optical path conversion mirror. (A)-(c) is a side view which shows the other form of the said optical path conversion mirror. It is a side view which shows the conventional optical path changing apparatus typically.

Explanation of symbols

M optical path conversion mirror 1 1st resin layer 2 2nd resin layer 3 Metal film 10 Optical waveguide 10a, 10b End surface

Claims (6)

  An optical path conversion mirror characterized in that a metal film that refracts and emits incident light by a predetermined angle is formed inside a resin, and at least a portion of the resin that transmits light is made of a light-transmitting resin.   The optical path conversion mirror includes a first resin layer made of a light-transmitting resin and a second resin layer made of a light-transmitting resin or a light-impermeable resin, and the second resin layer has a flat surface on its surface and this And the metal film is formed on the surface of the second resin layer, and the first resin is formed on the surface of the second resin layer via the metal film. The optical path conversion mirror according to claim 1, wherein the resin layer is laminated.   The optical path conversion mirror according to claim 2, wherein an angle formed by a plane and an inclined surface on the surface of the second resin layer is set to 35 to 55 degrees.   A substrate, an optical waveguide fixed on the substrate, and the optical path conversion mirror according to any one of claims 1 to 3, wherein one of the light incident part and the light emission part in the optical path conversion mirror Is positioned on at least one end surface of the optical waveguide in the optical axis direction, and the end surface of the optical waveguide on the side where the optical path conversion mirror is located is maintained in a state perpendicular to the optical axis of the optical waveguide. An optical path changing device characterized by that.   A method for producing the optical path conversion mirror according to claim 1 or 2, wherein a step of forming a first resin layer made of a light-transmitting resin on the surface of the peeling plate, and a cross section on the surface of the first resin layer The step of forming a V-shaped groove, the step of forming a metal film on the surface of the groove, the step of forming a second resin layer on the surface of the metal film, and the peeling plate as the first resin A step of peeling from the layer, and a laminate comprising the first resin layer, the metal film, and the second resin layer is cut along the longitudinal direction of the V-shaped groove to form the V-shape. And a step of forming one surface of the optical path conversion mirror as a light reflecting surface of the optical path conversion mirror.   The angle formed by the V shape of the groove is set to 90 degrees, and the angle formed between each surface forming the V shape and the plane of the surface of the first resin layer is set to 45 degrees. 5. A method for producing an optical path conversion mirror according to 5.

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