JP2003197590A - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法Info
- Publication number
- JP2003197590A JP2003197590A JP2001390135A JP2001390135A JP2003197590A JP 2003197590 A JP2003197590 A JP 2003197590A JP 2001390135 A JP2001390135 A JP 2001390135A JP 2001390135 A JP2001390135 A JP 2001390135A JP 2003197590 A JP2003197590 A JP 2003197590A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- nozzle
- wafer
- vapor
- pure water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Landscapes
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001390135A JP2003197590A (ja) | 2001-12-21 | 2001-12-21 | 基板処理装置および基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001390135A JP2003197590A (ja) | 2001-12-21 | 2001-12-21 | 基板処理装置および基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003197590A true JP2003197590A (ja) | 2003-07-11 |
| JP2003197590A5 JP2003197590A5 (enExample) | 2005-05-19 |
Family
ID=27598152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001390135A Abandoned JP2003197590A (ja) | 2001-12-21 | 2001-12-21 | 基板処理装置および基板処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003197590A (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005086181A (ja) * | 2003-09-11 | 2005-03-31 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| WO2006041077A1 (ja) | 2004-10-12 | 2006-04-20 | Tokyo Electron Limited | 基板処理方法および基板処理装置 |
| JP2007173308A (ja) * | 2005-12-19 | 2007-07-05 | Tokyo Electron Ltd | 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
| KR100776282B1 (ko) | 2006-06-22 | 2007-11-13 | 세메스 주식회사 | 매엽식 기판 처리 장치 및 방법 |
| US7806989B2 (en) | 2005-06-23 | 2010-10-05 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| JP2011014935A (ja) * | 2010-10-18 | 2011-01-20 | Tokyo Electron Ltd | 基板洗浄装置及び基板洗浄方法。 |
| US7927429B2 (en) | 2003-11-18 | 2011-04-19 | Tokyo Electron Limited | Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium |
| JP2011135002A (ja) * | 2009-12-25 | 2011-07-07 | Tokyo Electron Ltd | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
| US8043469B2 (en) | 2006-10-06 | 2011-10-25 | Tokyo Electron Limited | Substrate processing method, substrate processing apparatus, and storage medium |
| KR20110139645A (ko) | 2010-06-23 | 2011-12-29 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치 |
| JP2012119522A (ja) * | 2010-12-01 | 2012-06-21 | Sumitomo Electric Ind Ltd | 回折格子を有する半導体レーザ素子の製造方法 |
| US8906165B2 (en) | 2010-06-17 | 2014-12-09 | Tokyo Electron Limited | Substrate processing method, storage medium storing computer program for performing substrate processing method, and substrate processing apparatus |
-
2001
- 2001-12-21 JP JP2001390135A patent/JP2003197590A/ja not_active Abandoned
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005086181A (ja) * | 2003-09-11 | 2005-03-31 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| US8113221B2 (en) | 2003-11-18 | 2012-02-14 | Tokyo Electron Limited | Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium |
| US7927429B2 (en) | 2003-11-18 | 2011-04-19 | Tokyo Electron Limited | Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium |
| JPWO2006041077A1 (ja) * | 2004-10-12 | 2008-05-15 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| WO2006041077A1 (ja) | 2004-10-12 | 2006-04-20 | Tokyo Electron Limited | 基板処理方法および基板処理装置 |
| KR100766844B1 (ko) * | 2004-10-12 | 2007-10-17 | 동경 엘렉트론 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
| EP1801860A4 (en) * | 2004-10-12 | 2009-08-12 | Tokyo Electron Ltd | METHOD AND DEVICE FOR SUBSTRATE PROCESSING |
| JP2010045389A (ja) * | 2004-10-12 | 2010-02-25 | Tokyo Electron Ltd | 基板処理方法および基板処理装置 |
| US8794250B2 (en) | 2004-10-12 | 2014-08-05 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| US8337659B2 (en) | 2004-10-12 | 2012-12-25 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| US7806989B2 (en) | 2005-06-23 | 2010-10-05 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| US8137478B2 (en) | 2005-06-23 | 2012-03-20 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| JP2007173308A (ja) * | 2005-12-19 | 2007-07-05 | Tokyo Electron Ltd | 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
| KR100776282B1 (ko) | 2006-06-22 | 2007-11-13 | 세메스 주식회사 | 매엽식 기판 처리 장치 및 방법 |
| US8043469B2 (en) | 2006-10-06 | 2011-10-25 | Tokyo Electron Limited | Substrate processing method, substrate processing apparatus, and storage medium |
| JP2011135002A (ja) * | 2009-12-25 | 2011-07-07 | Tokyo Electron Ltd | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
| US8906165B2 (en) | 2010-06-17 | 2014-12-09 | Tokyo Electron Limited | Substrate processing method, storage medium storing computer program for performing substrate processing method, and substrate processing apparatus |
| KR20110139645A (ko) | 2010-06-23 | 2011-12-29 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치 |
| US8545640B2 (en) | 2010-06-23 | 2013-10-01 | Tokyo Electron Limited | Substrate processing method, storage medium storing computer program for performing substrate processing method, and substrate processing apparatus |
| JP2011014935A (ja) * | 2010-10-18 | 2011-01-20 | Tokyo Electron Ltd | 基板洗浄装置及び基板洗浄方法。 |
| JP2012119522A (ja) * | 2010-12-01 | 2012-06-21 | Sumitomo Electric Ind Ltd | 回折格子を有する半導体レーザ素子の製造方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040712 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040712 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20070116 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070319 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070417 |
|
| A762 | Written abandonment of application |
Effective date: 20090521 Free format text: JAPANESE INTERMEDIATE CODE: A762 |