JP2003188307A - 電力増幅モジュール及び電力増幅モジュール用基板 - Google Patents

電力増幅モジュール及び電力増幅モジュール用基板

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Publication number
JP2003188307A
JP2003188307A JP2001386807A JP2001386807A JP2003188307A JP 2003188307 A JP2003188307 A JP 2003188307A JP 2001386807 A JP2001386807 A JP 2001386807A JP 2001386807 A JP2001386807 A JP 2001386807A JP 2003188307 A JP2003188307 A JP 2003188307A
Authority
JP
Japan
Prior art keywords
power amplification
amplification module
substrate
layer
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001386807A
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English (en)
Japanese (ja)
Other versions
JP2003188307A5 (enExample
Inventor
Shinichi Tsuchiya
慎一 土屋
Masashi Takahara
誠志 高原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2001386807A priority Critical patent/JP2003188307A/ja
Publication of JP2003188307A publication Critical patent/JP2003188307A/ja
Publication of JP2003188307A5 publication Critical patent/JP2003188307A5/ja
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2001386807A 2001-12-19 2001-12-19 電力増幅モジュール及び電力増幅モジュール用基板 Pending JP2003188307A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001386807A JP2003188307A (ja) 2001-12-19 2001-12-19 電力増幅モジュール及び電力増幅モジュール用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001386807A JP2003188307A (ja) 2001-12-19 2001-12-19 電力増幅モジュール及び電力増幅モジュール用基板

Publications (2)

Publication Number Publication Date
JP2003188307A true JP2003188307A (ja) 2003-07-04
JP2003188307A5 JP2003188307A5 (enExample) 2004-09-16

Family

ID=27595827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001386807A Pending JP2003188307A (ja) 2001-12-19 2001-12-19 電力増幅モジュール及び電力増幅モジュール用基板

Country Status (1)

Country Link
JP (1) JP2003188307A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157441A (ja) * 2012-01-30 2013-08-15 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
KR20200041951A (ko) * 2017-09-14 2020-04-22 노스롭 그루먼 시스템즈 코포레이션 다중 접지 평면 열 싱크
US11004763B2 (en) 2018-12-20 2021-05-11 Northrop Grumman Systems Corporation Superconducting device with multiple thermal sinks
US11522118B2 (en) 2020-01-09 2022-12-06 Northrop Grumman Systems Corporation Superconductor structure with normal metal connection to a resistor and method of making the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157441A (ja) * 2012-01-30 2013-08-15 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
KR20200041951A (ko) * 2017-09-14 2020-04-22 노스롭 그루먼 시스템즈 코포레이션 다중 접지 평면 열 싱크
KR102294538B1 (ko) * 2017-09-14 2021-08-30 노스롭 그루먼 시스템즈 코포레이션 다중 접지 평면 열 싱크
US11004763B2 (en) 2018-12-20 2021-05-11 Northrop Grumman Systems Corporation Superconducting device with multiple thermal sinks
US12027437B2 (en) 2018-12-20 2024-07-02 Northrop Grumman Systems Corporation Superconducting device having a plurality of thermal sink layers and a plurality of ground planes
US12394688B2 (en) 2018-12-20 2025-08-19 Northrop Grumman Systems Corporation Superconducting device including set of circuits having different operational temperature requirements with multiple thermal sinks and multiple ground planes
US11522118B2 (en) 2020-01-09 2022-12-06 Northrop Grumman Systems Corporation Superconductor structure with normal metal connection to a resistor and method of making the same

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