JP2003187966A - Light-emitting device - Google Patents
Light-emitting deviceInfo
- Publication number
- JP2003187966A JP2003187966A JP2001387100A JP2001387100A JP2003187966A JP 2003187966 A JP2003187966 A JP 2003187966A JP 2001387100 A JP2001387100 A JP 2001387100A JP 2001387100 A JP2001387100 A JP 2001387100A JP 2003187966 A JP2003187966 A JP 2003187966A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- light emitting
- substrate
- film
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 239000010408 film Substances 0.000 claims description 147
- 239000010409 thin film Substances 0.000 claims description 50
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 21
- 239000007789 gas Substances 0.000 description 16
- 230000005525 hole transport Effects 0.000 description 13
- 239000011159 matrix material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 229920002379 silicone rubber Polymers 0.000 description 11
- 239000004945 silicone rubber Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光装置に関する
ものであり、特に、有機発光層を有する発光装置の封止
の技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly to a technique for sealing a light emitting device having an organic light emitting layer.
【０００２】[0002]
【従来の技術】近年、発光装置として、電極間に配置さ
れた有機薄膜を有し、該電極間に電圧を印加することに
よって有機薄膜を発光させる発光装置が注目されてい
る。図１６の符号１０１に、従来の有機発光層を用いた
発光装置を示す。2. Description of the Related Art In recent years, as a light emitting device, a light emitting device having an organic thin film disposed between electrodes and emitting light from the organic thin film by applying a voltage between the electrodes has attracted attention. Reference numeral 101 in FIG. 16 shows a light emitting device using a conventional organic light emitting layer.
【０００３】この発光装置１０１は、基板１１１と、基
板１１１上に配置された有機ＥＬ素子１０５とを有して
いる。この有機ＥＬ素子１０５は、アノード電極１１４
と、少なくとも一部がアノード電極１１４上に配置され
た有機薄膜１１６と、少なくとも一部が有機薄膜１１６
上に配置されたカソード電極１１９とを有しており、有
機薄膜１１６はカソード電極１１９とアノード電極１１
４とで上下から挟まれている。The light emitting device 101 has a substrate 111 and an organic EL element 105 arranged on the substrate 111. This organic EL element 105 has an anode electrode 114.
An organic thin film 116 having at least a part disposed on the anode electrode 114, and at least a part of the organic thin film 116.
The organic thin film 116 has a cathode electrode 119 and an anode electrode 119 disposed on the cathode electrode 119.
It is sandwiched between 4 and above.
【０００４】有機薄膜１１６はアノード電極１１４表面
に密着配置されたホール輸送層１１７と、ホール輸送層
１１７の表面に配置され、カソード電極１１９に密着さ
れた電子輸送層１１８とを有しており、アノード電極１
１４が正に、カソード電極１１９が負になる電圧が印加
されると、ホール輸送層１１７で正の電荷を持つホール
が生成されると同時に電子輸送層１１８に電子が注入さ
れ、ホール輸送層１１７と電子輸送層１１８との界面で
ホールと電子が結合して光が発生する。基板１１１とア
ノード電極１１４とは透明であり、発生した光はアノー
ド電極１１４とその下方の基板１１１とを透過し、発光
装置１１０の外部へ放射される。The organic thin film 116 has a hole transport layer 117 closely attached to the surface of the anode electrode 114, and an electron transport layer 118 placed on the surface of the hole transport layer 117 and closely attached to the cathode electrode 119. Anode electrode 1
When a voltage is applied such that 14 is positive and the cathode electrode 119 is negative, holes having a positive charge are generated in the hole transport layer 117, and at the same time, electrons are injected into the electron transport layer 118 and the hole transport layer 117. At the interface between and the electron transport layer 118, holes and electrons combine to generate light. The substrate 111 and the anode electrode 114 are transparent, and the generated light passes through the anode electrode 114 and the substrate 111 below the anode electrode 114 and is emitted to the outside of the light emitting device 110.
【０００５】有機薄膜１１６が大気中の水や酸素等と接
触すると酸化、分解などの劣化が起こりやすいので、発
光装置１１０には容器状の封止缶１２５が設けられてお
り、その封止缶１２５により有機ＥＬ素子１０５が封止
されている。When the organic thin film 116 comes into contact with water, oxygen, etc. in the atmosphere, deterioration such as oxidation and decomposition is likely to occur. Therefore, the light emitting device 110 is provided with a container-shaped sealing can 125. The organic EL element 105 is sealed by 125.
【０００６】有機ＥＬ素子１０５は平面形状が矩形にさ
れ、その四辺の縁近くの部分には、光硬化性接着剤１２
６が配置されている。この光硬化性接着剤１２６はリン
グ状になっており、容器状の封止缶１０６の縁部分が光
硬化性接着剤１２６に押しつけられ、その状態で光硬化
性接着剤１２６に紫外線が照射され、封止缶１０６が有
機ＥＬ素子１０５に固定されており、容器状の封止缶１
０６の内部に、有機ＥＬ素子１０５が封入されている。The organic EL element 105 has a rectangular planar shape, and the photo-curable adhesive 12 is applied to the portions near the edges of the four sides.
6 are arranged. The photocurable adhesive 126 has a ring shape, and the edge portion of the container-shaped sealing can 106 is pressed against the photocurable adhesive 126, and in this state, the photocurable adhesive 126 is irradiated with ultraviolet rays. , The sealing can 106 is fixed to the organic EL element 105, and the container-shaped sealing can 1
An organic EL element 105 is enclosed inside 06.
【０００７】しかしながら、封止は樹脂から成る光硬化
性接着剤１２６によって行われるため、大気中に存在す
る水蒸気が光硬化性接着剤１２６を透過し(透湿)、封止
缶１２５内に侵入しやすい。However, since the sealing is performed by the photo-curable adhesive 126 made of resin, the water vapor existing in the atmosphere passes through the photo-curable adhesive 126 (moisture permeability) and enters the sealing can 125. It's easy to do.
【０００８】また、電極１１４、１１９の一部はともに
封止膜１２５の外へ突き出されており、封止膜１２５と
電極１１４、１１９との界面、電極１１４、１１９と基
板１１１との界面等から大気中の水分や酸素が有機薄膜
１１６へと侵入する。封止缶１２５内に一旦水蒸気が侵
入すると、有機薄膜１１６が酸化されたり分解されたり
してしまい、有機薄膜表示装置１０２の寿命が短くな
る。仮に光硬化性接着剤１２５を厚く塗り固め、透湿を
防止しようとしても、水蒸気に対する樹脂のバリア性は
極めて低いため、透湿の問題は解決できない。Further, both of the electrodes 114 and 119 are projected to the outside of the sealing film 125, and the interface between the sealing film 125 and the electrodes 114 and 119, the interface between the electrodes 114 and 119 and the substrate 111, etc. The moisture and oxygen in the atmosphere penetrate into the organic thin film 116 from. Once water vapor enters the sealing can 125, the organic thin film 116 is oxidized or decomposed, and the life of the organic thin film display device 102 is shortened. Even if the photo-curable adhesive 125 is thickly coated and hardened to prevent moisture permeation, the moisture barrier problem cannot be solved because the barrier property of the resin against water vapor is extremely low.
【０００９】[0009]
【発明が解決しようとする課題】本発明は上記従来技術
の不都合を解決するために創作されたものであり、その
目的は、長寿命で放熱性が良好な有機薄膜表示装置を提
供することにある。SUMMARY OF THE INVENTION The present invention was created in order to solve the above-mentioned disadvantages of the prior art, and an object thereof is to provide an organic thin film display device having a long life and good heat dissipation. is there.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に、請求項１記載の発明は、第１の電極と、前記第１の
電極と対向配置され、前記第１の電極と絶縁された第２
の電極と、前記第１の電極と前記第２の電極との間に配
置された有機薄膜とを備えた有機発光素子が、基板の第
一の表面である素子形成面に配置され、前記第１の電極
と前記第２の電極との間に電圧が印加されると、前記有
機薄膜が発光するように構成された発光装置であって、
少なくとも前記基板の素子形成面側に吹き付けられた有
機樹脂で構成され、前記有機発光素子を被覆する第１の
封止膜を有する。請求項２記載の発明は、請求項１記載
の発光装置であって、有機樹脂からなり、前記基板の側
面に配置され、前記基板の側面を被覆する第２の封止膜
を有する。請求項３記載の発明は、請求項１又は請求項
２のいずれか１項記載の発光装置であって、有機樹脂か
らなり、前記基板の、前記有機発光素子が配置された第
一の表面と反対側の面である発光面に配置され、該発光
面を被覆する第３の封止膜を有する。請求項４記載の発
明は、請求項２又は３のいずれか１項記載の発光装置で
あって、前記第２の封止膜又は第３の封止膜のいずれか
一方又は両方とも、有機樹脂が吹き付けられることで形
成されている。請求項５記載の発明は、請求項１乃至４
のいずれか１項記載の発光装置であって、前記有機樹脂
は、透明な樹脂である。In order to solve the above-mentioned problems, the invention according to claim 1 is arranged so as to be opposed to a first electrode and to be insulated from the first electrode. Second
And an organic thin film provided between the first electrode and the second electrode, the organic light emitting device being arranged on a device forming surface which is a first surface of a substrate, A light emitting device configured such that the organic thin film emits light when a voltage is applied between the first electrode and the second electrode,
At least the first sealing film made of an organic resin sprayed on the element formation surface side of the substrate and covering the organic light emitting element is provided. The invention according to claim 2 is the light-emitting device according to claim 1, which has a second sealing film made of an organic resin, disposed on a side surface of the substrate, and covering the side surface of the substrate. The invention according to claim 3 is the light-emitting device according to any one of claims 1 and 2, wherein the substrate is made of an organic resin, and the first surface of the substrate on which the organic light-emitting element is arranged is It has a 3rd sealing film arrange | positioned at the light emitting surface which is an opposite surface, and covers this light emitting surface. The invention according to claim 4 is the light-emitting device according to any one of claims 2 and 3, wherein either or both of the second sealing film and the third sealing film are organic resins. Is formed by being sprayed. The invention according to claim 5 is the invention according to claims 1 to 4.
The light emitting device according to claim 1, wherein the organic resin is a transparent resin.
【００１１】本発明の発光装置によれば、基板の一表面
である素子形成面側に有機発光素子を配置し、素子形成
面側に吹き付けられた有機樹脂で第１の封止膜を形成
し、その第１の封止膜で有機発光素子を被覆している。
吹き付けで形成されることにより、第１の封止膜の膜厚
は厚くなり、しかも第１の封止膜と基板の素子形成面や
有機発光素子の表面との密着性は高いので、第１の封止
膜を介して水分やガスが有機発光素子内部に侵入するこ
とはなく、また、第１の封止膜と基板の素子形成面又は
有機発光素子との間の界面からも水分やガスが有機発光
素子内部に侵入することはほとんどないので、発光装置
の寿命が長くなる。According to the light emitting device of the present invention, the organic light emitting element is arranged on the element forming surface side which is one surface of the substrate, and the first sealing film is formed by the organic resin sprayed on the element forming surface side. , The organic light emitting element is covered with the first sealing film.
By being formed by spraying, the film thickness of the first sealing film becomes thicker, and moreover, the adhesion between the first sealing film and the element formation surface of the substrate or the surface of the organic light emitting element is high. Moisture or gas does not enter the inside of the organic light-emitting element through the sealing film of, and moisture or gas also comes from the interface between the first sealing film and the element formation surface of the substrate or the organic light-emitting element. Rarely intrudes into the organic light emitting element, so that the life of the light emitting device is extended.
【００１２】有機樹脂からなる厚い封止膜を形成する方
法としては、本発明のように有機樹脂を吹き付けて厚い
封止膜を形成する方法以外に、例えば有機樹脂等からな
る厚い樹脂フィルムを有機発光素子の表面に貼付し、有
機発光素子を被覆する方法が考えられるが、有機発光素
子や基板の素子形成面には凹凸があるので、その表面に
厚い樹脂フィルムを貼り付けると、樹脂フィルムと基板
の素子形成面や有機発光素子の表面との間に隙間ができ
てしまい、その隙間から空気が有機発光素子内部へと侵
入してしまい、封止膜としては不適切である。As a method of forming a thick sealing film made of an organic resin, in addition to the method of spraying an organic resin to form a thick sealing film as in the present invention, for example, a thick resin film made of an organic resin is used as an organic material. A method of sticking to the surface of the light emitting element and covering the organic light emitting element can be considered, but since the element forming surface of the organic light emitting element or the substrate has irregularities, if a thick resin film is stuck on the surface, it becomes a resin film. A gap is formed between the element formation surface of the substrate and the surface of the organic light emitting element, and air enters the inside of the organic light emitting element through the gap, which is not suitable as a sealing film.
【００１３】基板の素子形成面や有機発光素子の表面と
の間に隙間ができないようにするには、貼付する樹脂フ
ィルムの膜厚を薄くすればよいが、膜厚が薄いと、樹脂
フィルム自体を水分やガスが透過するので、やはり封止
膜として用いることはできない。これに対し、吹き付け
で封止膜を成膜した場合には、その膜厚を数mm程度にし
ても、かかる隙間ができずに密着性が良好なので、厚い
封止膜を成膜するには、本発明のように有機樹脂を吹き
付ける必要がある。In order to prevent a gap from being formed between the element formation surface of the substrate and the surface of the organic light emitting element, the resin film to be stuck may be thinned. Since water and gas permeate through, it cannot be used as a sealing film. On the other hand, when the sealing film is formed by spraying, even if the film thickness is about several mm, there is no gap and the adhesion is good, so it is necessary to form a thick sealing film. It is necessary to spray the organic resin as in the present invention.
【００１４】なお、本発明において、基板の側面に有機
樹脂からなる第２の封止膜を形成し、有機発光素子の配
置された側と反対側の面に有機樹脂からなる第３の封止
膜を形成してもよい。このように構成すると、第１、第
２、第３の封止膜により、基板と有機発光素子の全部が
被覆されるので、有機発光素子の配置された側の表面の
みが第１の封止膜によって被覆された装置よりも有機発
光素子内部に水分やガスが侵入しにくくなり、寿命が長
くなる。In the present invention, a second sealing film made of an organic resin is formed on the side surface of the substrate, and a third sealing film made of an organic resin is formed on the surface opposite to the side where the organic light emitting element is arranged. A film may be formed. According to this structure, the first, second, and third sealing films cover the entire substrate and the organic light emitting device, so that only the surface where the organic light emitting device is arranged has the first sealing film. Moisture and gas are less likely to enter the inside of the organic light emitting device than in a device covered with a film, and the life is extended.
【００１５】[0015]
【発明の実施の形態】以下で図面を参照し、本発明の一
実施形態の発光装置を説明する。最初に、本発明の一実
施形態の発光装置の製造方法について説明する。まず、
図１に示すガラス等の透明な基板１１を用意する。この
基板１１を図示しないスパッタ装置内に搬入し、その基
板１１の表面に、ＩＴＯ(Indium tin oxide)薄膜を成膜
した後エッチングしてパターニングし、図２に示すよう
にＩＴＯ薄膜からなる矩形のアノード電極１４を、基板
１１表面に形成する。DETAILED DESCRIPTION OF THE INVENTION A light emitting device according to an embodiment of the present invention will be described below with reference to the drawings. First, a method for manufacturing a light emitting device according to an embodiment of the present invention will be described. First,
A transparent substrate 11 such as glass shown in FIG. 1 is prepared. This substrate 11 is loaded into a sputtering device (not shown), and an ITO (Indium tin oxide) thin film is formed on the surface of the substrate 11 and then etched and patterned to form a rectangular ITO thin film as shown in FIG. The anode electrode 14 is formed on the surface of the substrate 11.
【００１６】次いで、基板１１を真空蒸着装置内へと搬
入し、有機材料を蒸着法で基板１１の表面とアノード電
極１４の表面とに成膜した後にエッチングでパターニン
グし、図３に示すようにアノード電極１４の表面に、有
機材料からなるホール輸送層１７を、平面形状が矩形に
なるように形成する。次に、ホール輸送層１７とは異な
る有機材料を基板１１とアノード電極１４とホール輸送
層１７の各表面に蒸着して電子輸送層１８を成膜した
後、電子輸送層１８とホール輸送層１７とをエッチング
でパターニングし、電子輸送層１８とホール輸送層１７
との平面形状が同じ矩形になるようにする。Next, the substrate 11 is carried into a vacuum vapor deposition apparatus, an organic material is deposited on the surface of the substrate 11 and the surface of the anode electrode 14 by a vapor deposition method, and then patterned by etching, as shown in FIG. A hole transport layer 17 made of an organic material is formed on the surface of the anode electrode 14 so that the planar shape is rectangular. Next, an organic material different from that of the hole transport layer 17 is deposited on each surface of the substrate 11, the anode electrode 14, and the hole transport layer 17 to form the electron transport layer 18, and then the electron transport layer 18 and the hole transport layer 17 are formed. And are patterned by etching to form an electron transport layer 18 and a hole transport layer 17
Make the plane shapes of and the same rectangle.
【００１７】次いで、基板１１、アノード電極１４、電
子輸送層１８の各表面に蒸着法でアルミニウム等の金属
膜を成膜した後、エッチングして平面形状が矩形になる
ようにパターニングし、図４に示すように、電子輸送層
１８の表面から基板１１の表面に亘って金属膜からなる
カソード電極１９を形成する。Next, a metal film of aluminum or the like is formed on each surface of the substrate 11, the anode electrode 14, and the electron transport layer 18 by a vapor deposition method, and then etched and patterned to have a rectangular planar shape. As shown in, the cathode electrode 19 made of a metal film is formed from the surface of the electron transport layer 18 to the surface of the substrate 11.
【００１８】すると、基板１１の表面に、アノード電極
１４、電子輸送層１８、カソード電極１９及びカソード
電極１９からなる有機発光素子５が形成される。電子輸
送層１８とホール輸送層１７との縁はアノード電極１４
の縁よりも外側に位置しており、電子輸送層１８の上に
形成されたカソード電極１９は、アノード電極１４とは
直接接触しないようになっている。Then, the organic light emitting device 5 including the anode electrode 14, the electron transport layer 18, the cathode electrode 19 and the cathode electrode 19 is formed on the surface of the substrate 11. The edge between the electron transport layer 18 and the hole transport layer 17 is the anode electrode 14.
The cathode electrode 19 formed on the outer side of the edge of the electron transport layer 18 and formed on the electron transport layer 18 does not come into direct contact with the anode electrode 14.
【００１９】次いで、図５に示すようにアルミニウム等
の金属からなる棒状の引出電極２１、２２の一端をそれ
ぞれアノード電極１４とカソード電極１９上に固定し、
鉛直に配置する。各引出電極２１、２２の長さはともに
有機発光素子５の高さよりも高くされており、各引出電
極２１、２２の各上端部は、ともに有機発光素子５の上
端部よりも上方に位置している。Next, as shown in FIG. 5, one ends of rod-shaped extraction electrodes 21 and 22 made of metal such as aluminum are fixed on the anode electrode 14 and the cathode electrode 19, respectively.
Place vertically. The lengths of the extraction electrodes 21 and 22 are both made higher than the height of the organic light emitting element 5, and the upper ends of the extraction electrodes 21 and 22 are both located above the upper end of the organic light emitting element 5. ing.
【００２０】次に、各引出電極２１、２２の上端部を図
示しない支持具で把持し、図６に示すように、表面に有
機発光素子５が配置された基板１１を、後述するノズル
が配置された図示しない処理室内に搬入する。これらの
ノズル２３ａ、２３ｂは図示しない材料供給系にそれぞ
れ接続され、各材料供給系を動作させると、有機樹脂を
各ノズル２３ａ、２３ｂの射出口からそれぞれ射出する
ことができるようになっている。各ノズル２３ａ、２３
ｂの射出口は互いに向き合った状態で上下に配置されて
おり、引出電極２１、２２の上端部を把持して、搬入さ
れた基板１１を、各ノズル２３ａ、２３ｂの射出口の間
に水平に配置した状態で材料供給系を動作させると、各
ノズル２３ａ、２３ｂから、基板１１の有機発光素子５
が配置された側の面(以下で素子形成面と称する。)と、
その反対側の面(以下で発光面と称する。)とにそれぞれ
異なる有機樹脂が吹き付けられる。ここでは、基板１１
の素子形成面と、発光面とに、それぞれシリコーンゴム
と、紫外線吸収剤の粒子が分散されたシリコーンゴムと
が吹き付けられている。ここでは紫外線吸収剤の粒子と
して酸化チタンの粒子を用いている。Next, the upper ends of the respective extraction electrodes 21 and 22 are held by a supporting member (not shown), and as shown in FIG. 6, the substrate 11 having the organic light emitting element 5 arranged on the surface thereof is arranged with nozzles to be described later. It is carried into the processing chamber (not shown). These nozzles 23a and 23b are respectively connected to a material supply system (not shown), and when each material supply system is operated, organic resin can be injected from the injection ports of the nozzles 23a and 23b, respectively. Each nozzle 23a, 23
The ejection openings of b are arranged vertically so as to face each other, and hold the upper ends of the extraction electrodes 21 and 22 so that the loaded substrate 11 is horizontally positioned between the ejection openings of the nozzles 23a and 23b. When the material supply system is operated in the arranged state, the organic light emitting element 5 on the substrate 11 is discharged from the nozzles 23a and 23b.
A surface on which is arranged (hereinafter referred to as an element formation surface),
Different organic resins are sprayed on the opposite surface (hereinafter referred to as the light emitting surface). Here, the substrate 11
The silicone rubber and the silicone rubber in which the particles of the ultraviolet absorber are dispersed are sprayed on the element forming surface and the light emitting surface, respectively. Here, particles of titanium oxide are used as particles of the ultraviolet absorber.
【００２１】すると、吹き付けられたシリコーンゴム
と、紫外線吸収剤の粒子が分散されたシリコーンゴムが
固化することにより、図７に示すように、基板１１の素
子形成面及び有機発光素子５と、基板１１の発光面とに
それぞれ第１、第２の封止膜３０ａ、３０ｂが形成さ
れ、基板１１の素子形成面と有機発光素子５が第１の封
止膜３０ａにより被覆され、第２の封止膜３０ｂにより
基板１１の発光面が被覆される。第１、第２の封止膜３
０ａ、３０ｂはともにシリコーンゴムで構成され、基板
１１の発光面側に配置された第２の封止膜３０ｂ中に
は、紫外線吸収剤の粒子が分散されている。Then, the sprayed silicone rubber and the silicone rubber in which the particles of the ultraviolet absorber are dispersed are solidified, and as shown in FIG. 7, the element forming surface of the substrate 11 and the organic light emitting element 5, and the substrate. First and second sealing films 30a and 30b are formed on the light emitting surface of 11, respectively, and the element formation surface of the substrate 11 and the organic light emitting element 5 are covered with the first sealing film 30a, and the second sealing film is formed. The light emitting surface of the substrate 11 is covered with the stop film 30b. First and second sealing films 3
Both 0a and 30b are made of silicone rubber, and ultraviolet absorber particles are dispersed in the second sealing film 30b arranged on the light emitting surface side of the substrate 11.
【００２２】次に、図８に示すように基板１１を、二本
のノズル２３ｃ、２３ｄが水平に配置された図示しない
処理室内に搬入する。これらのノズル２３ｃ、２３ｄ
は、図６で説明した各ノズル２３ａ、２３ｂと同様、材
料供給系に接続され、各ノズル２３ｃ、２３ｄはそれぞ
れの射出口が互いに対向して水平方向を向いており、搬
入された基板１１を、各ノズル２３ｃ、２３ｄの射出口
の間に水平配置した状態で材料供給系を動作させると、
有機樹脂が基板１１の側面へと射出される。この有機樹
脂は、図６で説明し、有機発光素子５が配置された側に
ある上方のノズル２３ａから射出される樹脂と同じく、
シリコーンゴムである。Next, as shown in FIG. 8, the substrate 11 is carried into a processing chamber (not shown) in which the two nozzles 23c and 23d are horizontally arranged. These nozzles 23c, 23d
Is connected to the material supply system like each of the nozzles 23a and 23b described in FIG. 6, each of the nozzles 23c and 23d has its ejection ports facing each other in the horizontal direction, and the loaded substrate 11 is When the material supply system is operated in a state in which it is horizontally arranged between the ejection openings of the nozzles 23c and 23d,
Organic resin is injected onto the side surface of the substrate 11. This organic resin is the same as the resin injected from the upper nozzle 23a on the side where the organic light emitting element 5 is arranged, as described in FIG.
Silicone rubber.
【００２３】こうして、液状の有機樹脂を各ノズル２３
ｃ、２３ｄの各射出口から基板１１の側面へと射出しな
がら、基板１１を水平面内で回転させると、基板１１の
全部の側面にシリコーンゴムが吹き付けられる。その結
果、図９に示すように吹き付けられたシリコーンゴムが
固化し、シリコーンゴムから成る第３の封止膜３０ｃが
形成され、基板１１の側面が第３の封止膜３０ｃで被覆
される。以上の工程を経て、図９に示す有機発光装置１
が完成する。Thus, the liquid organic resin is applied to each nozzle 23.
When the substrate 11 is rotated in a horizontal plane while being ejected from the ejection openings of c and 23d to the side face of the substrate 11, the silicone rubber is sprayed on all the side faces of the substrate 11. As a result, as shown in FIG. 9, the sprayed silicone rubber is solidified to form a third sealing film 30c made of silicone rubber, and the side surface of the substrate 11 is covered with the third sealing film 30c. Through the above steps, the organic light emitting device 1 shown in FIG.
Is completed.
【００２４】この有機発光装置１では、上述したように
各引出電極２１、２２の各上端部は有機発光素子５の上
端部より上方に位置しており、有機発光素子５が第１の
封止膜３０ａで被覆されても、各引出電極２１、２２の
各上端部は第１の封止膜３０ａ内に埋没せず、第１の封
止膜３０ａの表面から突出している。突出した各引出電
極２１、２２の上端部を図示しない電源にそれぞれ接続
し、電源を起動して、アノード電極１４に正電圧を、カ
ソード電極１９に負電圧をそれぞれ印加すると、アノー
ド電極１４とカソード電極１９とに挟まれた部分では、
ホール輸送層１７で正の電荷を持つホールが生成される
と同時に電子輸送層１８に電子が注入され、ホール輸送
層１７と電子輸送層１８との界面でホールと電子が結合
して光が発生する。基板１１とアノード電極１４と第２
の封止膜３０ｂは透明であり、発生した光はアノード電
極１４とその下方の基板１１及び第２の封止膜３０ｂを
透過し、発光装置１の外部へと放出される。アノード電
極１４は基板のほぼ全面に矩形状に配置され、ホール輸
送層１７、電子輸送層１８及びカソード電極１９はアノ
ード電極１４のほぼ全部に配置されているので、基板１
１のほぼ全面から光が放出される。In the organic light emitting device 1, the upper ends of the extraction electrodes 21 and 22 are located above the upper end of the organic light emitting element 5 as described above, and the organic light emitting element 5 is the first sealing member. Even if covered with the film 30a, the respective upper end portions of the extraction electrodes 21 and 22 are not buried in the first sealing film 30a but project from the surface of the first sealing film 30a. By connecting the upper ends of the projecting extraction electrodes 21 and 22 to a power source (not shown) respectively, and starting the power source to apply a positive voltage to the anode electrode 14 and a negative voltage to the cathode electrode 19, respectively, the anode electrode 14 and the cathode In the part sandwiched between the electrode 19 and
At the same time that holes having a positive charge are generated in the hole transport layer 17, electrons are injected into the electron transport layer 18, and at the interface between the hole transport layer 17 and the electron transport layer 18, the holes and electrons are combined to generate light. To do. Substrate 11, anode 14 and second
The sealing film 30b is transparent, and the generated light passes through the anode electrode 14, the substrate 11 therebelow and the second sealing film 30b, and is emitted to the outside of the light emitting device 1. The anode electrode 14 is arranged in a rectangular shape on almost the entire surface of the substrate, and the hole transport layer 17, the electron transport layer 18, and the cathode electrode 19 are arranged on almost all of the anode electrode 14, so that the substrate 1
Light is emitted from almost the entire surface of 1.
【００２５】本発明の有機発光装置１によれば、基板１
１の素子形成面に配置された有機発光素子５が、第１の
封止膜３０ａで被覆され、また、基板１１の発光面及び
側面はそれぞれ第２、第３の封止膜３０ｂ、３０ｃで被
覆されており、基板１１と有機発光素子５とは、全て厚
い第１、第２、第３の封止膜３０ａ、３０ｂ、３０ｃの
内部に封入されているので、第１、第２、第３の封止膜
３０ａ、３０ｂ、３０ｃを介して水分やガス等がほとん
ど有機発光素子５へと侵入しない。また、第１の封止膜
３０ａからは、金属製の引出電極２２、２３の先端部が
露出しており、引出電極２２、２３と第１の封止膜３０
ａとの間の界面から水分やガスが侵入する可能性もあり
うるが、金属とシリコーンゴムとの密着性は高いので、
各引出電極２２、２３と第１の封止膜３０ａとの間から
は水分やガス等は侵入しにくい。このように、有機発光
素子５の内部には、水分やガスがほとんど侵入しないの
で、従来に比して有機発光素子５の寿命は長くなる。実
測によると、本発明の有機薄膜表示装置１では、有機発
光素子５への酸素の透過度が１０-6ｃｃ／ｍ2／ｄａｙ
以下であり、水蒸気の透過度が１０-6ｇ／ｍ2／ｄａｙ
以下になった。According to the organic light emitting device 1 of the present invention, the substrate 1
The organic light emitting element 5 arranged on the first element forming surface is covered with the first sealing film 30a, and the light emitting surface and the side surface of the substrate 11 are formed with the second and third sealing films 30b and 30c, respectively. Since the substrate 11 and the organic light emitting element 5 are covered, and are all enclosed in the thick first, second, and third sealing films 30a, 30b, and 30c, the first, second, and third sealing films 30a, 30b, and 30c are enclosed. Almost no moisture, gas, or the like enters the organic light emitting element 5 through the sealing films 30a, 30b, and 30c of No. 3. Further, the tip portions of the metal extraction electrodes 22 and 23 are exposed from the first sealing film 30a, and the extraction electrodes 22 and 23 and the first sealing film 30 are exposed.
Although water or gas may enter from the interface between a and a, since the adhesion between the metal and the silicone rubber is high,
It is difficult for moisture, gas, and the like to enter from between the extraction electrodes 22 and 23 and the first sealing film 30a. As described above, almost no moisture or gas enters the inside of the organic light emitting element 5, so that the life of the organic light emitting element 5 is longer than that of the conventional one. According to actual measurement, in the organic thin film display device 1 of the present invention, the transmittance of oxygen to the organic light emitting element 5 is 10 −6 cc / m 2 / day.
The water vapor permeability is 10 -6 g / m 2 / day or less.
It became below.
【００２６】また、有機発光装置１によれば、上述した
ように、基板１１の発光面に配置された第２の封止膜３
０ｂは、有機発光素子５が発した光を透過するために、
透明な膜で構成されており、透明な第２の封止膜３０ｂ
から、その上方の透明な基板１１、アノード電極１４を
通って紫外線が有機発光素子５へと達してしまうと、紫
外線により有機発光素子５が劣化し、有機発光装置の寿
命が短くなってしまうが、上述したように第２の封止膜
３０ｂの内部には、紫外線吸収剤の粒子が分散されてい
る。Further, according to the organic light emitting device 1, as described above, the second sealing film 3 disposed on the light emitting surface of the substrate 11 is used.
0b is for transmitting the light emitted from the organic light emitting element 5,
The transparent second sealing film 30b, which is made of a transparent film
Therefore, if the ultraviolet light reaches the organic light emitting element 5 through the transparent substrate 11 and the anode electrode 14 above it, the organic light emitting element 5 is deteriorated by the ultraviolet light and the life of the organic light emitting device is shortened. As described above, the particles of the ultraviolet absorber are dispersed inside the second sealing film 30b.
【００２７】このため、透明な第２の封止膜３０ｂに紫
外線が入射しても、入射した紫外線はそのほとんどが封
止膜中の紫外線吸収剤の粒子で吸収されるので、入射し
た紫外線が有機薄膜まで到達することはほとんどない。
従って、紫外線により有機薄膜が劣化し、発光装置の寿
命が短くなることはない。Therefore, even if ultraviolet rays are incident on the transparent second sealing film 30b, most of the incident ultraviolet rays are absorbed by the particles of the ultraviolet absorber in the sealing film. It rarely reaches organic thin films.
Therefore, the organic thin film is not deteriorated by the ultraviolet rays and the life of the light emitting device is not shortened.
【００２８】また、上述した実施形態では、第１、第
２、第３の封止膜３０ａ、３０ｂ、３０ｃを形成する際
に、液状の有機樹脂を吹き付けることで形成している。
液状の有機樹脂を吹き付けることで成膜すると、第１、
第２、第３の封止膜３０ａ、３０ｂ、３０ｃの膜厚を厚
くすることができ、水分やガスがこれらの封止膜３０
ａ、３０ｂ、３０ｃを透過しにくくなり、しかも、封止
膜３０ａ、３０ｂ、３０ｃと、基板１１又は有機発光素
子５との間の密着性は高いので、その間から有機発光素
子５の内部へと水分やガスが侵入しにくくなる。In addition, in the above-described embodiment, when the first, second and third sealing films 30a, 30b and 30c are formed, a liquid organic resin is sprayed to form them.
When a film is formed by spraying a liquid organic resin, the first,
The film thickness of the second and third sealing films 30a, 30b, 30c can be increased, and the sealing film 30 containing moisture or gas can be used.
a, 30b, 30c are less likely to permeate, and the adhesiveness between the sealing films 30a, 30b, 30c and the substrate 11 or the organic light-emitting element 5 is high, so that the inside of the organic light-emitting element 5 is extended between them. It becomes difficult for moisture and gas to enter.
【００２９】なお、上述した実施形態では、基板１１の
発光面に配置された第２の封止膜３０ｂのみを第１、第
３の封止膜３０ａ、３０ｃと異なる材料としているが、
本発明はこれに限られるものではなく、例えば、図１０
に示す有機発光装置２のように、有機発光素子５と、基
板１１の素子形成面、側面及び発光面との全部を、同じ
有機樹脂で構成された封止膜３０で封入してもよい。こ
の場合には、有機発光素子５で発せられた光を透過させ
るため、封止膜３０を透明な有機樹脂で構成する必要が
ある。In the above embodiment, only the second sealing film 30b arranged on the light emitting surface of the substrate 11 is made of a material different from that of the first and third sealing films 30a and 30c.
The present invention is not limited to this. For example, FIG.
As in the organic light emitting device 2 shown in FIG. 2, the organic light emitting element 5, the element forming surface, the side surface, and the light emitting surface of the substrate 11 may be all enclosed by the sealing film 30 made of the same organic resin. In this case, since the light emitted from the organic light emitting element 5 is transmitted, the sealing film 30 needs to be made of a transparent organic resin.
【００３０】また、上述した実施形態では、液状の有機
樹脂を吹き付けて厚い封止膜を成膜しているが、本発明
はこれに限られるものではなく、少なくとも有機発光素
子５が配置された側の基板１１の表面が、有機樹脂が吹
き付けられて形成された厚い封止膜で被覆されていれば
よく、他の部分すなわち、基板１１の側面や、有機発光
素子５が配置された側と反対側の面は、厚い封止膜で被
覆する必要はなく、例えば図１１に示すように、有機発
光素子５が配置された側と反対側の基板１１の表面に
は、樹脂製の透明なフィルムを貼付して封止膜３５と
し、その封止膜３５と、基板の側面に配置された第３の
封止膜３０ｃとを密着させて封止してもよい。この場合
に、貼付された封止膜３５を、第１、第３の封止膜３０
ａ、３０ｃと同じ材料にしておけば、封止膜３５と、第
３の封止膜３０ｃとの間の密着性が高くなるので、水分
やガスが侵入しにくくなる。また、フィルム状の封止膜
３５は透明にする必要があるが、酸化チタン等の紫外線
吸収剤が分散されていれば、フィルムを介して紫外線が
有機薄膜に達することはない。In the above-described embodiment, the liquid organic resin is sprayed to form the thick sealing film. However, the present invention is not limited to this, and at least the organic light emitting element 5 is arranged. It suffices that the surface of the side substrate 11 is covered with a thick sealing film formed by spraying an organic resin, and other portions, that is, the side surface of the substrate 11 and the side on which the organic light emitting element 5 is arranged. The surface on the opposite side does not need to be covered with a thick sealing film. For example, as shown in FIG. 11, the surface of the substrate 11 on the side opposite to the side on which the organic light emitting element 5 is arranged is made of a transparent resin. A film may be attached to form the sealing film 35, and the sealing film 35 and the third sealing film 30c arranged on the side surface of the substrate may be adhered and sealed. In this case, the attached sealing film 35 is replaced with the first and third sealing films 30.
If the same material as a and 30c is used, the adhesiveness between the sealing film 35 and the third sealing film 30c becomes high, so that it becomes difficult for moisture and gas to enter. Further, the film-shaped sealing film 35 needs to be transparent, but if an ultraviolet absorber such as titanium oxide is dispersed, ultraviolet rays will not reach the organic thin film through the film.
【００３１】また、少なくとも有機発光素子５が配置さ
れた側の基板１１の一表面が、有機樹脂が吹き付けられ
ることで形成された厚い膜で構成されていればよく、例
えば図１２に示すように、有機発光素子５が配置された
側と反対側の基板１１の表面には、封止膜を配置せず
に、基板１１が露出するように構成してもよい。このよ
うに構成すると、基板１１が露出しているので、基板１
１が例えば樹脂フィルム等で構成された場合に基板１１
を通して水分やガスが有機発光素子５へと侵入すること
があるので、樹脂フィルム等のように、水分やガスを非
常に透過しやすいもので基板を構成した場合には、基板
１１及び有機発光素子５の両方を、有機樹脂からなる封
止膜で被覆することが好ましい。Further, at least one surface of the substrate 11 on the side where the organic light emitting element 5 is arranged may be formed of a thick film formed by spraying an organic resin. For example, as shown in FIG. The substrate 11 may be exposed without providing a sealing film on the surface of the substrate 11 on the side opposite to the side on which the organic light emitting element 5 is disposed. With this structure, since the substrate 11 is exposed, the substrate 1
Substrate 11 when 1 is composed of, for example, a resin film
Since moisture and gas may enter the organic light emitting element 5 through the substrate, when the substrate is made of a material such as a resin film that is highly permeable to moisture and gas, the substrate 11 and the organic light emitting element 5 Both 5 are preferably covered with a sealing film made of an organic resin.
【００３２】また、有機樹脂としてシリコーンゴムを用
いているが、本発明の有機樹脂はこれに限られるもので
はなく、例えば天然ゴム、フッ素ゴム等、ガス透過性の
低いゴム類等を用いてもよい。Although silicone rubber is used as the organic resin, the organic resin of the present invention is not limited to this. For example, natural rubber, fluororubber, or other rubber having low gas permeability may be used. Good.
【００３３】また、紫外線吸収剤として酸化チタンを用
いているが、紫外線吸収剤はこれに限られるものではな
く、例えばＩＴＯの粉末などのように紫外線を良く吸収
する透明な微粒子等を用いてもよい。Although titanium oxide is used as the ultraviolet absorber, the ultraviolet absorber is not limited to this, and transparent fine particles which absorb ultraviolet rays well, such as ITO powder, may be used. Good.
【００３４】また、上述した実施形態では、有機発光素
子として、その全面が発光し、照明器具等に用いられる
発光装置について説明したが、本発明の有機発光素子は
これに限られるものではなく、一部を選択的に発光させ
ることで画像表示が可能な表示装置にも適用可能であ
る。Further, in the above-described embodiment, the light emitting device which emits light over the entire surface and is used for a lighting fixture or the like is described as the organic light emitting element, but the organic light emitting element of the present invention is not limited to this. The present invention can also be applied to a display device capable of displaying an image by selectively causing a part to emit light.
【００３５】図１２の符号６に、その表示装置を示す。
この表示装置６は、ガラス基板１１の一表面に設けられ
たパッシブマトリクス型の有機ＥＬ素子８がガラス基板
１１の一表面に配置され、基板１１及び有機ＥＬ素子８
が、有機樹脂からなる封止膜３０内に封入されて成る。Reference numeral 6 in FIG. 12 shows the display device.
In this display device 6, a passive matrix type organic EL element 8 provided on one surface of a glass substrate 11 is arranged on one surface of the glass substrate 11, and the substrate 11 and the organic EL element 8 are provided.
Are sealed in a sealing film 30 made of an organic resin.
【００３６】有機ＥＬ素子８は、ガラス基板１１上に形
成されたアノード電極膜５２と、アノード電極膜５２上
に配置された発光性有機薄膜５５ａと、該発光性有機薄
膜５５ａ上に配置されたカソード電極膜５６ａとを有し
ている。The organic EL element 8 is composed of the anode electrode film 52 formed on the glass substrate 11, the light-emitting organic thin film 55a arranged on the anode electrode film 52, and the light-emitting organic thin film 55a. It has a cathode electrode film 56a.
【００３７】アノード電極膜５２は、ＩＴＯ薄膜によっ
て構成されており、そのＩＴＯ薄膜がパターニングさ
れ、互いに絶縁された複数本数の直線状の配線に成形さ
れている。各アノード電極膜５２は、互いに平行に所定
間隔で配置されている。The anode electrode film 52 is composed of an ITO thin film, and the ITO thin film is patterned and formed into a plurality of linear wirings insulated from each other. The anode electrode films 52 are arranged in parallel with each other at a predetermined interval.
【００３８】また、発光性有機薄膜５５ａとカソード電
極膜５６ａとは、それぞれ有機ＥＬ薄膜と金属薄膜とで
構成されており、絶縁物５３上に形成されたリブ５４に
よって、それぞれ複数本数の直線状の配線に分離されて
いる。アノード電極膜５２と、発光性有機薄膜５５ａ及
びカソード電極膜５６ａとは、互いに垂直な方向に延設
されている。The light-emitting organic thin film 55a and the cathode electrode film 56a are composed of an organic EL thin film and a metal thin film, respectively. The ribs 54 formed on the insulator 53 form a plurality of linear films. The wiring is separated. The anode electrode film 52, the light-emitting organic thin film 55a, and the cathode electrode film 56a extend in directions perpendicular to each other.
【００３９】符号５５ｂ、５６ｂは、それぞれリブ５４
上に成膜された部分の有機ＥＬ薄膜と金属薄膜であり、
リブ５４の段差により、発光性有機薄膜５５ａ同士の
間、及びカソード電極膜５６ａ同士の間を分離させてい
る部分であるが、有機ＥＬ素子８の動作には寄与しな
い。Reference numerals 55b and 56b denote ribs 54, respectively.
It is the organic EL thin film and the metal thin film of the part formed above,
Although it is a portion that separates the light emitting organic thin films 55a and the cathode electrode films 56a by the step of the rib 54, it does not contribute to the operation of the organic EL element 8.
【００４０】各アノード電極膜５２と各カソード電極膜
５６ａには、それぞれ金属からなる棒状の引出電極５
７、５８の一端が固定されており、各引出電極５７、５
８の他端は、封止膜３０の表面から突出している。図１
２には、アノード電極膜５２とカソード電極膜５６ａに
それぞれ接続される引出電極５７、５８は一本ずつしか
図示していないが、実際には、アノード電極膜５２とカ
ソード電極膜５６ａとそれぞれ同数の引出電極５７、５
８が封止膜３０の表面から突出しており、各引出電極５
７、５８のうちから、一本ずつ、又は一方を１本、他方
を複数本選択して、アノード電極膜１２とカソード電極
膜１６ａとを１本ずつ、又は一方を１本、他方を複数本
数選択し、選択したアノード電極膜１２とカソード電極
膜１６ａに、それぞれ正電圧と負電圧を印加すると、選
択したアノード電極膜１２及びカソード電極膜１６ａと
が交差する部分に位置する発光性有機薄膜１５ａが発光
し、透明なアノード電極膜１２、基板１１及び封止膜３
０を通過した光が、封止膜３０の外部へと放出される。Each of the anode electrode films 52 and each of the cathode electrode films 56a has a rod-shaped extraction electrode 5 made of a metal.
One end of 7, 58 is fixed, and each extraction electrode 57, 5
The other end of 8 projects from the surface of the sealing film 30. Figure 1
In FIG. 2, only one extraction electrode 57 and 58 is connected to the anode electrode film 52 and the cathode electrode film 56a, respectively, but in reality, the same number as the anode electrode film 52 and the cathode electrode film 56a are provided. Extraction electrodes 57, 5
8 protrudes from the surface of the sealing film 30, and each extraction electrode 5
One from each of 7, 58, one of them and a plurality of the other are selected, one each of the anode electrode film 12 and the cathode electrode film 16a, or one of the anode electrode films 16 and the plurality of the other When a positive voltage and a negative voltage are applied to the selected anode electrode film 12 and the cathode electrode film 16a, respectively, the luminescent organic thin film 15a located at the intersection of the selected anode electrode film 12 and the cathode electrode film 16a. Emits light, and the transparent anode electrode film 12, substrate 11 and sealing film 3
The light passing through 0 is emitted to the outside of the sealing film 30.
【００４１】このとき、選択したアノード電極膜１２と
カソード電極膜１６ａ以外のアノード電極膜１２とカソ
ード電極膜１６ａには電圧が印加されないため、選択し
たアノード電極膜１２とカソード電極膜１６ａとの間に
位置する発光性有機薄膜１５ａ以外の部分に位置する発
光性有機薄膜１５ａは発光しない。At this time, no voltage is applied to the anode electrode film 12 and the cathode electrode film 16a other than the selected anode electrode film 12 and the cathode electrode film 16a. The light-emitting organic thin film 15a located in a portion other than the light-emitting organic thin film 15a located in the area does not emit light.
【００４２】上述した表示装置６は、パッシブマトリク
ス型の有機ＥＬ素子８が厚い封止膜３０の内部に封入さ
れて成り、水分やガスが有機ＥＬ素子８へほとんど侵入
しないので、その寿命が長くなる。The display device 6 described above is formed by encapsulating the passive matrix type organic EL element 8 inside the thick sealing film 30, and since moisture and gas hardly penetrate into the organic EL element 8, the life thereof is long. Become.
【００４３】また、有機発光素子として、いわゆるアク
ティブマトリクス型の有機ＥＬ素子を封止膜の内部に封
入してもよい。図１４は、そのアクティブマトリクス型
の有機ＥＬ素子２８の模式図を示している。As an organic light emitting element, a so-called active matrix type organic EL element may be enclosed inside the sealing film. FIG. 14 shows a schematic diagram of the active matrix type organic EL element 28.
【００４４】図１４中符号６１は、長方形形状の透明な
ガラス基板から成る基板を示している。この基板６１の
表面には、矩形状のアノード電極６４が複数設けられて
おり、各アノード電極６４は、行列状に配置されてい
る。Reference numeral 61 in FIG. 14 indicates a substrate made of a rectangular transparent glass substrate. A plurality of rectangular anode electrodes 64 are provided on the surface of the substrate 61, and the anode electrodes 64 are arranged in a matrix.
【００４５】アノード電極６４の間には、導電材料から
なる電源線６６ａが一本ずつ延設されており、その結
果、複数の電源線６６ａが配置されている。各電源線６
６ａは同じ方向に配置されている。アノード電極６４の
間には、各電源線６６ａと垂直な方向に、導電材料から
なる制御線６６ｂが一本ずつ延設されており、その結
果、複数の制御線６６ｂが配置されている。各電源線６
６ａと各制御線６６ｂは互いに絶縁され、ともにアノー
ド電極６４を横切らないようになっている。Power supply lines 66a made of a conductive material are provided between the anode electrodes 64 one by one, and as a result, a plurality of power supply lines 66a are arranged. Each power line 6
6a are arranged in the same direction. Between the anode electrodes 64, one control line 66b made of a conductive material is extended in a direction perpendicular to each power supply line 66a, and as a result, a plurality of control lines 66b are arranged. Each power line 6
6a and each control line 66b are insulated from each other so that they do not cross the anode electrode 64.
【００４６】各アノード電極６４の近傍には、低温ポリ
シリコンＴＦＴからなる選択トランジスタ１２が、アノ
ード電極６４の一個につき一個ずつ配置されている。各
選択トランジスタ６２のドレイン端子は、電源線６６ａ
に接続され、ソース端子は、アノード電極１４に接続さ
れ、ゲート端子は制御線６６ｂに接続されている。電源
線６６ａ、制御線６６ｂには図示しない制御回路が接続
されている。In the vicinity of each anode electrode 64, one selection transistor 12 made of a low temperature polysilicon TFT is arranged for each anode electrode 64. The drain terminal of each selection transistor 62 has a power supply line 66a.
, The source terminal is connected to the anode electrode 14, and the gate terminal is connected to the control line 66b. A control circuit (not shown) is connected to the power supply line 66a and the control line 66b.
【００４７】この制御回路が、各制御線６６ｂのうち任
意の一本の制御線６６ｂを選択し、各電源線６６ａのう
ち任意の一本の電源線６６ａを選択すると、一個の選択
トランジスタ６２が選択されるようになっている。選択
トランジスタ６２が選択されると、その選択トランジス
タ６２のソース端子に接続されたアノード電極６４と電
源線６６ａとが接続され、そのアノード電極６４に、電
源線６６ａの電圧が印加されるように構成されている。When the control circuit selects any one control line 66b among the control lines 66b and selects any one power supply line 66a among the power supply lines 66a, one selection transistor 62 is selected. It is supposed to be selected. When the selection transistor 62 is selected, the anode electrode 64 connected to the source terminal of the selection transistor 62 is connected to the power supply line 66a, and the voltage of the power supply line 66a is applied to the anode electrode 64. Has been done.
【００４８】各アノード電極６４の上には、有機ＥＬ薄
膜６５が配置されている。この有機ＥＬ薄膜６５はＲ
(赤)、Ｇ(緑)、Ｂ(青)の三種類があり、この三種類のう
ちいずれか一種類が、一個のアノード電極６４上に配置
されている。An organic EL thin film 65 is arranged on each anode electrode 64. This organic EL thin film 65 is R
There are three types of (red), G (green), and B (blue), and any one of these three types is arranged on one anode electrode 64.
【００４９】各有機ＥＬ薄膜６５上には、カソード電極
膜６８が密着して配置されている。このカソード電極膜
６８は、全部の画素の有機ＥＬ薄膜６５を覆っている。
カソード電極膜６８の、有機ＥＬ薄膜６５に密着した部
分であるカソード電極６８は、上述したアノード電極６
４及び有機ＥＬ薄膜６５とともに、本発明の画素７３を
構成している。ある画素７３の選択トランジスタ６２が
選択されて、アノード電極６４に電源線６６ａの電圧が
印加されると、アノード電極６４とカソード電極６８と
の間に電圧が印加され、その画素７３の有機ＥＬ薄膜６
５に電流が流れ、有機ＥＬ薄膜６５が発光するようにな
っている。On each organic EL thin film 65, a cathode electrode film 68 is arranged in close contact. The cathode electrode film 68 covers the organic EL thin films 65 of all the pixels.
The cathode electrode 68, which is the portion of the cathode electrode film 68 that is in close contact with the organic EL thin film 65, is the anode electrode 6 described above.
4 and the organic EL thin film 65 constitute the pixel 73 of the present invention. When the selection transistor 62 of a pixel 73 is selected and the voltage of the power supply line 66a is applied to the anode electrode 64, the voltage is applied between the anode electrode 64 and the cathode electrode 68, and the organic EL thin film of the pixel 73 is applied. 6
An electric current flows through the organic EL thin film 65 and the organic EL thin film 65 emits light.
【００５０】上述したアノード電極６４は透光性を有す
る導電膜で構成されており、有機ＥＬ薄膜１５が発光す
ると、その光はアノード電極６４と、その下方の基板６
１とを透過して基板６１の裏面側に達する。ここではア
ノード電極６４として、ＩＴＯ薄膜が用いられている。The above-mentioned anode electrode 64 is composed of a light-transmitting conductive film, and when the organic EL thin film 15 emits light, the light is emitted from the anode electrode 64 and the substrate 6 below it.
1 to reach the back side of the substrate 61. Here, an ITO thin film is used as the anode electrode 64.
【００５１】図１５(ａ)、(ｂ)に、図１４で説明した有
機ＥＬ素子２８を有する表示装置９の断面図の一例を示
す。なお、図１５(ａ)、(ｂ)は、図１４のＡ−Ａ線断面
図とＢ−Ｂ線断面図とにそれぞれ対応している。FIGS. 15A and 15B show an example of a sectional view of the display device 9 having the organic EL element 28 described in FIG. Note that FIGS. 15A and 15B correspond to the sectional view taken along the line AA and the sectional view taken along the line BB of FIG. 14, respectively.
【００５２】上述した各画素７３は図１５(ａ)、(ｂ)に
示す絶縁材６３で互いに分離されている。上述した各電
源線６６ａ及び各制御線６６ｂは、図１５(ａ)、(ｂ)に
示すように絶縁材１３の下方に配置されており、絶縁材
１３の形成された部分では、絶縁材６３によって電源線
１６ａ及び制御線１６ｂとカソード電極膜６８とが絶縁
されるようになっている。The above-mentioned pixels 73 are separated from each other by the insulating material 63 shown in FIGS. 15 (a) and 15 (b). The power supply lines 66a and the control lines 66b described above are arranged below the insulating material 13 as shown in FIGS. 15 (a) and 15 (b), and the insulating material 63 is provided in the portion where the insulating material 13 is formed. The power supply line 16a, the control line 16b, and the cathode electrode film 68 are thereby insulated from each other.
【００５３】上述した構成の、アクティブマトリクス型
の有機ＥＬ素子２８は、図１５(ａ)、(ｂ)に示すよう
に、有機樹脂が吹き付けられて形成された封止膜３０に
よって全部が被覆されている。As shown in FIGS. 15A and 15B, the active matrix type organic EL element 28 having the above-mentioned structure is entirely covered with the sealing film 30 formed by spraying the organic resin. ing.
【００５４】各電源線６６ａと各制御線６６ｂの上に
は、それぞれ金属からなる棒状の引出電極７７、７８の
一端が固定されており、各引出電極７７、７８の他端
は、封止膜３０の表面から突出している。図１２には、
アノード電極膜６２とカソード電極膜６６ａにそれぞれ
接続される引出電極７７、７８は一本ずつしか図示して
いないが、実際には、アノード電極膜６２とカソード電
極膜６６ａとそれぞれ同数の引出電極７７、７８の端部
が封止膜３０の表面から突出している。One end of each rod-shaped extraction electrode 77, 78 made of metal is fixed on each power supply line 66a and each control line 66b. The other end of each extraction electrode 77, 78 is a sealing film. It projects from the surface of 30. In FIG.
Although only one extraction electrode 77 and 78 is connected to the anode electrode film 62 and the cathode electrode film 66a, respectively, in actuality, the same number of extraction electrodes 77 as the anode electrode film 62 and the cathode electrode film 66a, respectively. , 78 project from the surface of the sealing film 30.
【００５５】突出した各引出電極７７、７８のそれぞれ
の端部は、上述した図示しない制御回路に接続されてお
り、制御回路を動作させると、上述したように、特定の
画素の選択トランジスタ６２が選択され、その画素にお
ける有機ＥＬ薄膜６５が発光する。The respective ends of the projecting extraction electrodes 77, 78 are connected to the control circuit (not shown) described above. When the control circuit is operated, the selection transistor 62 of a specific pixel is operated as described above. The organic EL thin film 65 in the selected pixel emits light.
【００５６】かかる構成の表示装置９では、アクティブ
マトリクス型の有機ＥＬ素子２８が厚い封止膜３０の内
部に封入されているので、水分やガスが有機ＥＬ素子２
８へほとんど侵入しなくなり、その寿命が長くなる。In the display device 9 having such a configuration, since the active matrix type organic EL element 28 is enclosed inside the thick sealing film 30, moisture and gas are not contained in the organic EL element 2.
It hardly penetrates into 8, and its life is extended.
【００５７】[0057]
【発明の効果】本発明によって、酸素、水分に対して高
い封止能カを発揮し、かつ、放熱性が良好な有機ＥＬ素
子を得ることができる。According to the present invention, it is possible to obtain an organic EL element which exhibits a high sealing ability against oxygen and moisture and has a good heat dissipation property.
【図１】本発明の一実施形態に係る発光装置の製造方法
を説明する第１の断面図FIG. 1 is a first sectional view illustrating a method for manufacturing a light emitting device according to an embodiment of the present invention.
【図２】本発明の一実施形態に係る発光装置の製造方法
を説明する第２の断面図FIG. 2 is a second cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図３】本発明の一実施形態に係る発光装置の製造方法
を説明する第３の断面図FIG. 3 is a third cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図４】本発明の一実施形態に係る発光装置の製造方法
を説明する第４の断面図FIG. 4 is a fourth cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図５】本発明の一実施形態に係る発光装置の製造方法
を説明する第５の断面図FIG. 5 is a fifth cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図６】本発明の一実施形態に係る発光装置の製造方法
を説明する第６の断面図FIG. 6 is a sixth cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図７】本発明の一実施形態に係る発光装置の製造方法
を説明する第７の断面図FIG. 7 is a seventh cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図８】本発明の一実施形態に係る発光装置の製造方法
を説明する第８の断面図FIG. 8 is an eighth cross-sectional view illustrating the method of manufacturing the light emitting device according to the embodiment of the invention.
【図９】本発明の一実施形態に係る発光装置を説明する
断面図FIG. 9 is a sectional view illustrating a light emitting device according to an embodiment of the present invention.
【図１０】本発明の他の実施形態に係る発光装置を説明
する断面図FIG. 10 is a sectional view illustrating a light emitting device according to another embodiment of the present invention.
【図１１】発光面を樹脂フィルムで被覆した本発明の実
施形態に係る発光装置を説明する断面図FIG. 11 is a sectional view illustrating a light emitting device according to an embodiment of the present invention in which a light emitting surface is covered with a resin film.
【図１２】発光面の基板を露出させた本発明の実施形態
に係る発光装置を説明する断面図FIG. 12 is a sectional view illustrating a light emitting device according to an embodiment of the present invention in which a substrate of a light emitting surface is exposed.
【図１３】本発明のパッシブマトリクス型の表示装置を
説明する断面図FIG. 13 is a cross-sectional view illustrating a passive matrix display device of the present invention.
【図１４】本発明のアクティブマトリクス型の表示装置
を模式的に説明する図FIG. 14 is a diagram schematically illustrating an active matrix display device of the present invention.
【図１５】(ａ)：本発明のアクティブマトリクス型の表
示装置を説明する第１の断面図
(ｂ)：本発明のアクティブマトリクス型の表示装置を説
明する第２の断面図15A is a first cross-sectional view illustrating an active matrix display device of the present invention, and FIG. 15B is a second cross-sectional view illustrating an active matrix display device of the present invention.
【図１６】従来の発光装置を説明する断面図FIG. 16 is a cross-sectional view illustrating a conventional light emitting device.
１１……基板 １２……アノード電極膜(第１の電極) １８……カソード電極(第２の電極) ２３……画素 ３０ａ……第１の封止膜 ３０ｂ……第２の封止膜 ３０ｃ……第３の封止膜 11 ... Board 12 ... Anode electrode film (first electrode) 18 ... Cathode electrode (second electrode) 23 ... Pixel 30a ... first sealing film 30b ... second sealing film 30c ... third sealing film
【手続補正書】[Procedure amendment]
【提出日】平成１４年１月８日（２００２．１．８）[Submission date] January 8, 2002 (2002.1.8)
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３９[Correction target item name] 0039
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３９】符号５５ｂ、５６ｂは、それぞれ構造絶縁
体５４上に成膜された部分の有機ＥＬ薄膜と金属薄膜で
あり、構造絶縁体５４の段差により、発光性有機薄膜５
５ａ同士の間、及びカソード電極膜５６ａ同士の間を分
離させている部分であるが、有機ＥＬ素子８の動作には
寄与しない。Reference numerals 55b and 56b are the organic EL thin film and the metal thin film, respectively, which are formed on the structural insulator 54, and the light emitting organic thin film 5 is formed by the step of the structural insulator 54.
Although it is a portion separating the 5a and the cathode electrode films 56a from each other, it does not contribute to the operation of the organic EL element 8.
Claims (5)
された第２の電極と、 前記第１の電極と前記第２の電極との間に配置された有
機薄膜とを備えた有機発光素子が、基板の第一の表面で
ある素子形成面に配置され、 前記第１の電極と前記第２の電極との間に電圧が印加さ
れると、前記有機薄膜が発光するように構成された発光
装置であって、 少なくとも前記基板の素子形成面側に吹き付けられた有
機樹脂で構成され、前記有機発光素子を被覆する第１の
封止膜を有する発光装置。1. A first electrode, a second electrode which is arranged so as to face the first electrode and is insulated from the first electrode, and between the first electrode and the second electrode. An organic light emitting device having an organic thin film disposed on a substrate is disposed on a device forming surface which is a first surface of a substrate, and a voltage is applied between the first electrode and the second electrode. And a light emitting device configured such that the organic thin film emits light, the first sealing film including an organic resin sprayed on at least the element formation surface side of the substrate and covering the organic light emitting element. A light emitting device having.
され、前記基板の側面を被覆する第２の封止膜を有する
請求項１記載の発光装置。2. The light emitting device according to claim 1, further comprising a second sealing film which is made of an organic resin and which is disposed on a side surface of the substrate and covers a side surface of the substrate.
発光素子が配置された一表面と反対側の面である発光面
に配置され、該発光面を被覆する第３の封止膜を有する
請求項１又は請求項２のいずれか１項記載の発光装置。3. A third sealing film, which is made of an organic resin, is disposed on a light emitting surface of the substrate opposite to the one surface on which the organic light emitting element is disposed, and covers the light emitting surface. The light-emitting device according to claim 1, which has either one of claims 1 and 2.
れか一方又は両方とも、有機樹脂が吹き付けられること
で形成された請求項２又は３のいずれか１項記載の発光
装置。4. The light emission according to claim 2, wherein either or both of the second sealing film and the third sealing film are formed by spraying an organic resin. apparatus.
１乃至４のいずれか１項記載の発光装置。5. The light emitting device according to claim 1, wherein the organic resin is a transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001387100A JP4034561B2 (en) | 2001-12-20 | 2001-12-20 | Method for manufacturing light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001387100A JP4034561B2 (en) | 2001-12-20 | 2001-12-20 | Method for manufacturing light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003187966A true JP2003187966A (en) | 2003-07-04 |
| JP4034561B2 JP4034561B2 (en) | 2008-01-16 |
Family
ID=27596032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001387100A Expired - Fee Related JP4034561B2 (en) | 2001-12-20 | 2001-12-20 | Method for manufacturing light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4034561B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006022273A2 (en) * | 2004-08-24 | 2006-03-02 | Tohoku Device Co Ltd | Organic el element, organic el element protection film and method for manufacturing the organic el element protection film |
| JP2011175753A (en) * | 2010-02-23 | 2011-09-08 | Dainippon Printing Co Ltd | Organic el element panel and method of manufacturing the same |
| US8242688B2 (en) | 2010-04-13 | 2012-08-14 | Samsung Mobile Display Co., Ltd. | Organic light emitting display including magnetic substance dispersed in filler and method of manufacturing the same |
| JP2013504851A (en) * | 2009-09-11 | 2013-02-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | OLED device with protective cover |
| JP2014175603A (en) * | 2013-03-12 | 2014-09-22 | Mitsubishi Chemicals Corp | Surface emitting module |
| JP2015007292A (en) * | 2008-05-07 | 2015-01-15 | ザ、トラスティーズ オブ プリンストン ユニバーシティ | Hybrid layers for use in coatings on electronic devices or other articles |
-
2001
- 2001-12-20 JP JP2001387100A patent/JP4034561B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006022273A2 (en) * | 2004-08-24 | 2006-03-02 | Tohoku Device Co Ltd | Organic el element, organic el element protection film and method for manufacturing the organic el element protection film |
| WO2006022273A3 (en) * | 2004-08-24 | 2006-04-20 | Tohoku Device Co Ltd | Organic el element, organic el element protection film and method for manufacturing the organic el element protection film |
| JP2015007292A (en) * | 2008-05-07 | 2015-01-15 | ザ、トラスティーズ オブ プリンストン ユニバーシティ | Hybrid layers for use in coatings on electronic devices or other articles |
| US9882167B2 (en) | 2008-05-07 | 2018-01-30 | The Trustees Of Princeton University | Hybrid layers for use in coatings on electronic devices or other articles |
| JP2013504851A (en) * | 2009-09-11 | 2013-02-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | OLED device with protective cover |
| JP2011175753A (en) * | 2010-02-23 | 2011-09-08 | Dainippon Printing Co Ltd | Organic el element panel and method of manufacturing the same |
| US8242688B2 (en) | 2010-04-13 | 2012-08-14 | Samsung Mobile Display Co., Ltd. | Organic light emitting display including magnetic substance dispersed in filler and method of manufacturing the same |
| JP2014175603A (en) * | 2013-03-12 | 2014-09-22 | Mitsubishi Chemicals Corp | Surface emitting module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4034561B2 (en) | 2008-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI223572B (en) | Display apparatus and manufacturing method thereof | |
| US7663314B2 (en) | Organic electroluminescence display panel and method for sealing the same | |
| US10347862B2 (en) | EL display device and method for manufacturing EL display device | |
| US7495390B2 (en) | Electro-luminescence device with improved thermal conductivity | |
| WO2006064715A1 (en) | Display device and display device manufacturing method | |
| KR20190071795A (en) | OLED substrate and manufacturing method thereof | |
| JP3705190B2 (en) | Manufacturing method of display device | |
| TWI489625B (en) | Organic light-emitting display panel and method for manufacturing the same | |
| JP2001035654A (en) | Display panel and its manufacture | |
| JP2003187966A (en) | Light-emitting device | |
| KR100648167B1 (en) | Organic light emitting device panel | |
| JP2003272830A (en) | Electric element sealing method, package, and display element | |
| KR20030068654A (en) | Method for manufacturing Organic Electro Luminescent Display Device with both sides light emitting | |
| US20160343971A1 (en) | Light-emitting device and method of producing a light-emitting device | |
| KR100417921B1 (en) | Canless Organic Electro Luminescence Display | |
| JP2004022511A (en) | Organic el panel and manufacturing method of the same | |
| JP2006172940A (en) | Display and its manufacturing method | |
| JP2002008855A (en) | Organic el panel | |
| JP2003187969A (en) | Manufacturing method of display device | |
| JP2003178885A (en) | Organic el display equipment | |
| JP7118100B2 (en) | Light-emitting device and method for manufacturing light-emitting device | |
| JP2004079231A (en) | Sealing method of organic el element and sealing device | |
| WO2015145966A1 (en) | Organic el display panel, organic el display panel production method and organic el element sealing method | |
| JP3653942B2 (en) | Organic light emitting device and method for manufacturing the same | |
| KR100692049B1 (en) | Apparatus and method for fabricating organic electro luminescence display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040810 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070126 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070206 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20070330 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070330 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071023 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071025 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101102 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4034561 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101102 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131102 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |