JP2003186420A5 - - Google Patents

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JP2003186420A5
JP2003186420A5 JP2001389671A JP2001389671A JP2003186420A5 JP 2003186420 A5 JP2003186420 A5 JP 2003186420A5 JP 2001389671 A JP2001389671 A JP 2001389671A JP 2001389671 A JP2001389671 A JP 2001389671A JP 2003186420 A5 JP2003186420 A5 JP 2003186420A5
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electro
optical device
partition wall
conductive portion
matrix substrate
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アクティブ素子を有する基体上に、絶縁性材料からなる隔壁により隔てられた複数の画素電極を備えたアクティブマトリクス基板であって、
前記隔壁上の前記画素電極とは絶縁された位置に導電材料が配置されていることを特徴とするアクティブマトリクス基板。
An active matrix substrate having a plurality of pixel electrodes separated by a partition made of an insulating material on a substrate having active elements,
An active matrix substrate, wherein a conductive material is disposed at a position insulated from the pixel electrode on the partition wall.
前記アクティブ素子が薄膜トランジスタであることを特徴とする請求項1記載のアクティブマトリクス基板。  2. The active matrix substrate according to claim 1, wherein the active element is a thin film transistor. 前記導電材料がストライプ状あるいは格子状に形成されてなることを特徴とする請求項1又は2記載のアクティブマトリクス基板。  The active matrix substrate according to claim 1, wherein the conductive material is formed in a stripe shape or a lattice shape. 前記隔壁の上面に凹部が形成され、この凹部内に前記導電材料が設けられていることを特徴とする請求項1〜3のいずれかに記載のアクティブマトリクス基板。  The active matrix substrate according to claim 1, wherein a concave portion is formed on an upper surface of the partition wall, and the conductive material is provided in the concave portion. アクティブ素子の上方に平坦化膜が形成され、前記平坦化膜上に複数の画素電極が配置されていることを特徴とするアクティブマトリクス基板。An active matrix substrate, wherein a planarizing film is formed above an active element, and a plurality of pixel electrodes are disposed on the planarizing film. 請求項5に記載のアクティブマトリクス基板において、前記複数の画素電極は、絶縁性材料からなる隔壁により隔てられていることを特徴とするアクティブマトリクス基板。6. The active matrix substrate according to claim 5, wherein the plurality of pixel electrodes are separated by a partition made of an insulating material. 請求項6に記載のアクティブマトリクス基板において、前記隔壁上に導電材料が配置されていることを特徴とするアクティブマトリクス基板。The active matrix substrate according to claim 6, wherein a conductive material is disposed on the partition wall. 請求項1〜7のいずれかに記載のアクティブマトリクス基板上に電気光学材料が配置されたことを特徴とする電気光学装置。  An electro-optical device, wherein an electro-optical material is disposed on the active matrix substrate according to claim 1. 請求項5乃至7のいずれかに記載のアクティブマトリクス基板上に有機エレクトロルミネッセンス材料を含む有機エレクトロルミネッセンス素子が配置され、前記有機エレクトロルミネッセンス素子の発した光が前記アクティブマトリクス基板とは反対側から取り出されることを特徴とする電気光学装置。8. An organic electroluminescent element including an organic electroluminescent material is disposed on the active matrix substrate according to claim 5, and light emitted from the organic electroluminescent element is extracted from a side opposite to the active matrix substrate. An electro-optical device. アクティブ素子を有する基体上に、絶縁性材料からなる隔壁により隔てられた複数の画素電極と、前記画素電極上に配置された発光層を含む積層体と、前記積層体上に配置された対向電極と、を備えた電気光学装置であって、
前記隔壁上には、前記画素電極とは絶縁された導電部が配置され、該導電部は前記対向電極と接続されていることを特徴とする電気光学装置。
A stacked body including a plurality of pixel electrodes separated by a partition made of an insulating material on a substrate having an active element, a light emitting layer disposed on the pixel electrode, and a counter electrode disposed on the stacked body An electro-optical device comprising:
An electro-optical device, wherein a conductive portion insulated from the pixel electrode is disposed on the partition, and the conductive portion is connected to the counter electrode.
前記アクティブ素子が薄膜トランジスタであることを特徴とする請求項10記載の電気光学装置。  The electro-optical device according to claim 10, wherein the active element is a thin film transistor. 前記導電部がストライプ状あるいは格子状に形成されてなることを特徴とする請求項10又は11記載の電気光学装置。  The electro-optical device according to claim 10, wherein the conductive portion is formed in a stripe shape or a lattice shape. 前記発光層は有機エレクトロルミネッセンス材料を含むことを特徴とする請求項10〜12のいずれかに記載の電気光学装置。  The electro-optical device according to claim 10, wherein the light emitting layer contains an organic electroluminescence material. 前記導電部の形成材料は、前記対向電極の形成材料より導電性が高い材料であることを特徴とする請求項10〜13のいずれかに記載の電気光学装置。  The electro-optical device according to claim 10, wherein a material for forming the conductive portion is a material having higher conductivity than a material for forming the counter electrode. 前記隔壁の上面に凹部が形成され、この凹部内に前記導電部が形成されてなることを特徴とする請求項10〜14のいずれかに記載の電気光学装置。  15. The electro-optical device according to claim 10, wherein a concave portion is formed on an upper surface of the partition wall, and the conductive portion is formed in the concave portion. 前記発光層の、前記画素電極と前記対向電極のうちの陽極として機能する電極側に、正孔注入層又は正孔輸送層が設けられてなることを特徴とする請求項10〜15のいずれかに記載の電気光学装置。  16. The hole injection layer or the hole transport layer is provided on the electrode side that functions as an anode of the pixel electrode and the counter electrode of the light emitting layer. The electro-optical device according to 1. 前記対向電極は、複数の材料を積層して形成されることを特徴とする請求項10〜16のいずれかに記載の電気光学装置。  The electro-optical device according to claim 10, wherein the counter electrode is formed by stacking a plurality of materials. 前記発光層からの光は対向電極側を経由して取り出されることを特徴とする請求項10〜17のいずれかに記載の電気光学装置。  The electro-optical device according to claim 10, wherein light from the light emitting layer is extracted via a counter electrode side. 前記画素電極がアクティブ素子上に配置されていることを特徴とする請求項18記載の電気光学装置。  The electro-optical device according to claim 18, wherein the pixel electrode is disposed on an active element. 前記アクティブ素子上に平坦化膜が形成され、この平坦化膜上に画素電極が配置されていることを特徴とする請求項19記載の電気光学装置。  20. The electro-optical device according to claim 19, wherein a planarizing film is formed on the active element, and a pixel electrode is disposed on the planarizing film. 前記平坦化膜内に形成された中継電極を備えることを特徴とする請求項20記載の電気光学装置。  21. The electro-optical device according to claim 20, further comprising a relay electrode formed in the planarizing film. 前記発光層からの光は画素電極側を経由して取り出されることを特徴とする請求項10〜20のいずれかに記載の電気光学装置。  21. The electro-optical device according to claim 10, wherein light from the light emitting layer is extracted via a pixel electrode side. 請求項10記載の電気光学装置を製造するに際し、
基体上に画素電極と画素間を隔てる隔壁と該隔壁上の導電部とを形成した後、前記隔壁により区画された領域に発光層を形成することを特徴とする電気光学装置の製造方法。
In manufacturing the electro-optical device according to claim 10,
A method of manufacturing an electro-optical device, comprising: forming a pixel electrode and a partition wall separating a pixel and a conductive portion on the partition wall on a substrate; and forming a light emitting layer in a region partitioned by the partition wall.
発光層の材料をインクジェット法で塗布することにより、前記発光層を形成することを特徴とする請求項22記載の電気光学装置の製造方法。  23. The method of manufacturing an electro-optical device according to claim 22, wherein the light emitting layer is formed by applying a material of the light emitting layer by an ink jet method. 前記隔壁の上面に凹部を形成し、この凹部内に導電部の材料をインクジェット法で塗布することにより、前記導電部を形成することを特徴とする請求項22又は23記載の電気光学装置の製造方法。  24. The electro-optical device manufacturing method according to claim 22, wherein a concave portion is formed on the upper surface of the partition wall, and the conductive portion is formed in the concave portion by applying a material of the conductive portion by an ink jet method. Method. 前記隔壁の上面を親液処理するとともに側面を撥液処理しておき、液状に調製した導電部の材料に前記隔壁の上面部を浸して該隔壁の上面に導電材料を付着させ、その後この導電材料を硬化させて導電部とすることを特徴とする請求項22又は23記載の電気光学装置の製造方法。  The upper surface of the partition wall is subjected to lyophilic treatment and the side surface is subjected to lyophobic treatment, and the upper surface portion of the partition wall is immersed in the material of the conductive portion prepared in a liquid state to adhere the conductive material to the upper surface of the partition wall. 24. The method of manufacturing an electro-optical device according to claim 22, wherein the material is cured to form a conductive portion. 隔壁と該隔壁上の導電部とを形成するに際して、隔壁形成材料を成膜し、次に該隔壁形成材料からなる膜の上に導電材料を成膜し、次いで該導電材料からなる膜をパターニングして導電部を形成し、その後得られた前記導電部をマスクにして前記隔壁形成材料からなる膜をパターニングし、隔壁を形成することを特徴とする請求項22又は23記載の電気光学装置の製造方法。  When forming the partition wall and the conductive portion on the partition wall, a partition wall forming material is formed, and then a conductive material is formed on the film made of the partition wall forming material, and then the film made of the conductive material is patterned. 24. The electro-optical device according to claim 22, wherein a conductive portion is formed, and a film made of the partition wall forming material is patterned using the obtained conductive portion as a mask to form a partition wall. Production method. 前記発光層となる位置に対して、前記画素電極と前記対向電極のうちの陽極として機能する電極側に、正孔注入層又は正孔輸送層の材料をインクジェット法で塗布することにより、正孔注入層又は正孔輸送層を形成することを特徴とする請求項22〜26のいずれかに記載の電気光学装置の製造方法。  By applying a material of a hole injection layer or a hole transport layer to the electrode functioning as an anode of the pixel electrode and the counter electrode with respect to the position to be the light emitting layer by an inkjet method, 27. The method of manufacturing an electro-optical device according to claim 22, wherein an injection layer or a hole transport layer is formed. 請求項8〜21のいずかに記載の電気光学装置、あるいは請求項22〜27のいずれかに記載の製造方法によって得られた電気光学装置を用いてなる電子機器。  An electronic apparatus using the electro-optical device according to any one of claims 8 to 21 or the electro-optical device obtained by the manufacturing method according to any one of claims 22 to 27. 前記電気光学装置の光出射側に反射防止フィルムが設けられていることを特徴とする請求項28記載の電子機器。  29. The electronic apparatus according to claim 28, wherein an antireflection film is provided on a light emitting side of the electro-optical device.
JP2001389671A 2001-12-21 2001-12-21 Active matrix substrate, electrooptic device, manufacturing method for electrooptic device, and electronic equipment Withdrawn JP2003186420A (en)

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Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4897491B2 (en) * 2003-11-21 2012-03-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Display panel
JP3994998B2 (en) * 2004-03-03 2007-10-24 セイコーエプソン株式会社 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE
JP4424078B2 (en) * 2004-06-07 2010-03-03 カシオ計算機株式会社 Display panel and manufacturing method thereof
JP4121514B2 (en) * 2004-07-22 2008-07-23 シャープ株式会社 ORGANIC LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME
JP4254675B2 (en) 2004-09-29 2009-04-15 カシオ計算機株式会社 Display panel
JP4517804B2 (en) * 2004-09-29 2010-08-04 カシオ計算機株式会社 Display panel
JP4265515B2 (en) * 2004-09-29 2009-05-20 カシオ計算機株式会社 Display panel
JP2006100727A (en) * 2004-09-30 2006-04-13 Casio Comput Co Ltd Display panel
JP4192879B2 (en) * 2004-09-30 2008-12-10 カシオ計算機株式会社 Display panel
JP4613637B2 (en) * 2005-02-23 2011-01-19 凸版印刷株式会社 Method for manufacturing organic electroluminescence element
JP4696616B2 (en) * 2005-03-17 2011-06-08 カシオ計算機株式会社 Display panel and manufacturing method thereof
JP4984415B2 (en) * 2005-03-30 2012-07-25 セイコーエプソン株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE
JP4899333B2 (en) * 2005-04-12 2012-03-21 セイコーエプソン株式会社 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
JP2006318910A (en) * 2005-05-11 2006-11-24 Lg Electronics Inc Electroluminescence display and its manufacturing method, and electroluminescence device and its manufacturing method
KR100686120B1 (en) 2005-05-17 2007-02-26 엘지전자 주식회사 Method for Fabricating Organic Electro-luminance Device
JP2007149577A (en) * 2005-11-30 2007-06-14 Alps Electric Co Ltd Light emitting device
JP2007149578A (en) * 2005-11-30 2007-06-14 Alps Electric Co Ltd Method of manufacturing light emitting device
JP2009064925A (en) * 2007-09-05 2009-03-26 Brother Ind Ltd Manufacturing method of thin-film transistor, and thin-film transistor manufactured by the same manufacturing method
JP5465009B2 (en) * 2007-10-30 2014-04-09 エルジー ディスプレイ カンパニー リミテッド Image display device manufacturing method and image display device
JP4893753B2 (en) * 2009-01-08 2012-03-07 カシオ計算機株式会社 Display panel
JP5212405B2 (en) * 2010-03-04 2013-06-19 カシオ計算機株式会社 Display panel
WO2012161113A1 (en) * 2011-05-20 2012-11-29 パナソニック株式会社 Organic electroluminescence element
CN107611280B (en) * 2017-09-20 2020-04-28 京东方科技集团股份有限公司 Organic light emitting diode substrate and method for manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541625B2 (en) * 1997-07-02 2004-07-14 セイコーエプソン株式会社 Display device and active matrix substrate
JP4013401B2 (en) * 1999-04-20 2007-11-28 セイコーエプソン株式会社 ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
JP2001100668A (en) * 1999-09-29 2001-04-13 Sanyo Electric Co Ltd Electroluminescence display device
JP3809758B2 (en) * 1999-10-28 2006-08-16 ソニー株式会社 Display device and manufacturing method of display device
JP3967081B2 (en) * 2000-02-03 2007-08-29 株式会社半導体エネルギー研究所 Light emitting device and manufacturing method thereof
TWI249363B (en) * 2000-02-25 2006-02-11 Seiko Epson Corp Organic electroluminescence device and manufacturing method therefor
JP4542659B2 (en) * 2000-03-07 2010-09-15 出光興産株式会社 Active drive type organic EL display device and manufacturing method thereof
JP2001264776A (en) * 2000-03-22 2001-09-26 Sharp Corp Liquid crystal display device and method of manufacturing the same

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