JP2003179040A - 熱処理装置 - Google Patents
熱処理装置Info
- Publication number
- JP2003179040A JP2003179040A JP2001375717A JP2001375717A JP2003179040A JP 2003179040 A JP2003179040 A JP 2003179040A JP 2001375717 A JP2001375717 A JP 2001375717A JP 2001375717 A JP2001375717 A JP 2001375717A JP 2003179040 A JP2003179040 A JP 2003179040A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- heating
- rotating
- heat treatment
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 140
- 238000007667 floating Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 53
- 238000012545 processing Methods 0.000 claims description 47
- 238000005339 levitation Methods 0.000 claims description 34
- 238000007664 blowing Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 6
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 5
- 239000010935 stainless steel Substances 0.000 abstract description 5
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 239000000696 magnetic material Substances 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000001939 inductive effect Effects 0.000 abstract 1
- 238000012546 transfer Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- 239000007789 gas Substances 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- 238000011282 treatment Methods 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 9
- 210000000078 claw Anatomy 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000005674 electromagnetic induction Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 102100021606 Ephrin type-A receptor 7 Human genes 0.000 description 1
- 101710116633 Ephrin type-A receptor 7 Proteins 0.000 description 1
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 1
- 101000836394 Homo sapiens Sestrin-1 Proteins 0.000 description 1
- 102100027288 Sestrin-1 Human genes 0.000 description 1
- PXAWCNYZAWMWIC-UHFFFAOYSA-N [Fe].[Nd] Chemical compound [Fe].[Nd] PXAWCNYZAWMWIC-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001375717A JP2003179040A (ja) | 2001-12-10 | 2001-12-10 | 熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001375717A JP2003179040A (ja) | 2001-12-10 | 2001-12-10 | 熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003179040A true JP2003179040A (ja) | 2003-06-27 |
| JP2003179040A5 JP2003179040A5 (cg-RX-API-DMAC7.html) | 2004-10-28 |
Family
ID=19184033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001375717A Pending JP2003179040A (ja) | 2001-12-10 | 2001-12-10 | 熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003179040A (cg-RX-API-DMAC7.html) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007507104A (ja) * | 2003-09-26 | 2007-03-22 | 東京エレクトロン株式会社 | 連絡空間を用いた効率的な温度制御のための方法と装置 |
| US8007591B2 (en) | 2004-01-30 | 2011-08-30 | Tokyo Electron Limited | Substrate holder having a fluid gap and method of fabricating the substrate holder |
| US8092602B2 (en) | 2002-11-29 | 2012-01-10 | Tokyo Electron Limited | Thermally zoned substrate holder assembly |
| WO2018069387A1 (de) * | 2016-10-11 | 2018-04-19 | Osram Opto Semiconductors Gmbh | Heizvorrichtung, verfahren und system zur herstellung von halbleiterchips im waferverbund |
| KR20190069595A (ko) * | 2016-11-09 | 2019-06-19 | 티이엘 에프에스아이, 인코포레이티드 | 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척 |
| US11458512B2 (en) | 2017-01-27 | 2022-10-04 | Tel Manufacturing And Engineering Of America, Inc. | Systems and methods for rotating and translating a substrate in a process chamber |
| US11476129B2 (en) | 2016-11-29 | 2022-10-18 | Tel Manufacturing And Engineering Of America, Inc. | Translating and rotating chuck for processing microelectronic substrates in a process chamber |
| US11545387B2 (en) | 2018-07-13 | 2023-01-03 | Tel Manufacturing And Engineering Of America, Inc. | Magnetic integrated lift pin system for a chemical processing chamber |
| CN117467962A (zh) * | 2023-12-28 | 2024-01-30 | 上海陛通半导体能源科技股份有限公司 | 薄膜沉积设备 |
-
2001
- 2001-12-10 JP JP2001375717A patent/JP2003179040A/ja active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8092602B2 (en) | 2002-11-29 | 2012-01-10 | Tokyo Electron Limited | Thermally zoned substrate holder assembly |
| US8927907B2 (en) | 2002-11-29 | 2015-01-06 | Tokyo Electron Limited | Thermally zoned substrate holder assembly |
| JP2007507104A (ja) * | 2003-09-26 | 2007-03-22 | 東京エレクトロン株式会社 | 連絡空間を用いた効率的な温度制御のための方法と装置 |
| US8007591B2 (en) | 2004-01-30 | 2011-08-30 | Tokyo Electron Limited | Substrate holder having a fluid gap and method of fabricating the substrate holder |
| US11574823B2 (en) | 2016-10-11 | 2023-02-07 | Osram Oled Gmbh | Heating apparatus, method and system for producing semiconductor chips in the wafer assembly |
| US11152231B2 (en) | 2016-10-11 | 2021-10-19 | Osram Oled Gmbh | Heating apparatus, method and system for producing semiconductor chips in the wafer assembly |
| WO2018069387A1 (de) * | 2016-10-11 | 2018-04-19 | Osram Opto Semiconductors Gmbh | Heizvorrichtung, verfahren und system zur herstellung von halbleiterchips im waferverbund |
| JP7297664B2 (ja) | 2016-11-09 | 2023-06-26 | ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド | プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック |
| JP2019537261A (ja) * | 2016-11-09 | 2019-12-19 | ティーイーエル エフエスアイ，インコーポレイティド | プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック |
| KR20190069595A (ko) * | 2016-11-09 | 2019-06-19 | 티이엘 에프에스아이, 인코포레이티드 | 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척 |
| JP2022168078A (ja) * | 2016-11-09 | 2022-11-04 | ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド | プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック |
| JP7405921B2 (ja) | 2016-11-09 | 2023-12-26 | ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド | プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック |
| KR102518220B1 (ko) * | 2016-11-09 | 2023-04-04 | 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. | 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척 |
| US11476129B2 (en) | 2016-11-29 | 2022-10-18 | Tel Manufacturing And Engineering Of America, Inc. | Translating and rotating chuck for processing microelectronic substrates in a process chamber |
| US11458512B2 (en) | 2017-01-27 | 2022-10-04 | Tel Manufacturing And Engineering Of America, Inc. | Systems and methods for rotating and translating a substrate in a process chamber |
| US11545387B2 (en) | 2018-07-13 | 2023-01-03 | Tel Manufacturing And Engineering Of America, Inc. | Magnetic integrated lift pin system for a chemical processing chamber |
| CN117467962A (zh) * | 2023-12-28 | 2024-01-30 | 上海陛通半导体能源科技股份有限公司 | 薄膜沉积设备 |
| CN117467962B (zh) * | 2023-12-28 | 2024-03-08 | 上海陛通半导体能源科技股份有限公司 | 薄膜沉积设备 |
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Legal Events
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| A977 | Report on retrieval |
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