JP2003168803A5 - - Google Patents
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- Publication number
- JP2003168803A5 JP2003168803A5 JP2001368010A JP2001368010A JP2003168803A5 JP 2003168803 A5 JP2003168803 A5 JP 2003168803A5 JP 2001368010 A JP2001368010 A JP 2001368010A JP 2001368010 A JP2001368010 A JP 2001368010A JP 2003168803 A5 JP2003168803 A5 JP 2003168803A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- thin film
- film
- semiconductor
- film transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 14
- 239000004065 semiconductor Substances 0.000 claims 9
- 239000010409 thin film Substances 0.000 claims 9
- 238000009413 insulation Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001368010A JP4201239B2 (ja) | 2001-11-30 | 2001-11-30 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001368010A JP4201239B2 (ja) | 2001-11-30 | 2001-11-30 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003168803A JP2003168803A (ja) | 2003-06-13 |
| JP2003168803A5 true JP2003168803A5 (enExample) | 2005-07-07 |
| JP4201239B2 JP4201239B2 (ja) | 2008-12-24 |
Family
ID=19177665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001368010A Expired - Fee Related JP4201239B2 (ja) | 2001-11-30 | 2001-11-30 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4201239B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100666552B1 (ko) | 2004-06-30 | 2007-01-09 | 삼성에스디아이 주식회사 | 반도체 소자의 제조 방법 및 이 방법에 의하여 제조되는반도체 소자 |
| KR100666563B1 (ko) | 2004-07-05 | 2007-01-09 | 삼성에스디아이 주식회사 | 반도체 장치의 제조 방법 및 이 방법에 의하여 제조되는반도체 장치 |
| JP5054919B2 (ja) * | 2005-12-20 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
| FR2932005B1 (fr) * | 2008-06-02 | 2011-04-01 | Commissariat Energie Atomique | Circuit a transistor integres dans trois dimensions et ayant une tension de seuil vt ajustable dynamiquement |
| US20180061763A1 (en) * | 2016-08-24 | 2018-03-01 | Qualcomm Switch Corp. | Device performance improvement using backside metallization in a layer transfer process |
-
2001
- 2001-11-30 JP JP2001368010A patent/JP4201239B2/ja not_active Expired - Fee Related
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