JP2003157975A - El laminate dielectric structure and forming method of the same, and laser pattern drawing method, and display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a dielectric layer of an electroluminescence laminate. SOLUTION: The dielectric layer as a thick film layer is made of ceramic material which has a dielectric strength of about 1.0×10<6> V/m, and such a dielectric constant that the ratio of dielectric constant of a dielectric material to that of a phosphor is larger than 50:1. The dielectric layer has such a thickness that the ratio of the thickness of the dielectric layer to that of the phosphor layer approximately ranges from 20:1 to 500:1. The dielectric layer is compatible with the phosphor later, and has a surface contiguous to the phosphor layer which is smooth enough for uniformly emitting light by a prescribed excitation voltage as a whole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescent laminate and a method for manufacturing an electroluminescent laminate. The invention also relates to an electroluminescent display panel that provides an electrical connection from the electroluminescent laminate to a voltage drive circuit. The invention further relates to a laser for engraving a pattern on a flat laminate. The pattern is, for example, an address line of a transparent electrode of an electroluminescent laminate.

[0002]

BACKGROUND OF THE INVENTION Electroluminescence (EL) is the emission of light from a phosphor by the application of an electric field.
The electroluminescent device is useful as a lamp or display. Recently, electroluminescent devices have been used in flat panel display devices. The device has a predetermined characteristic shape or individually addressable pixels in a rectangular matrix.

Pioneering research on electroluminescence is
It was done at GTE Sylvania. An alternating voltage is supplied to the powder or scattering type EL device. In this element,
A light emitting phosphor powder is embedded in an organic adhesive, which is deposited on a glass substrate and covered by a transparent electrode. These powder or scattering type EL devices generally have low luminance and have a drawback that they prevent wide range applications.

Thin film electroluminescence (TFEL)
The device was developed in the 1950s. The basic structure of an AC thin film EL laminate is well known, for example Tornq
vist, R.A. O. Written by "Thin-Film Ele"
ctroluminescent Display
s ", Society for Information
nDisplay, 1989, International
al Symposium Seminar Lect
ure Notes and U.S. Pat. No. 4,857,802. The fluorescent layers are sandwiched between pairs of electrodes and are separated from the electrodes by insulating / dielectric layers, respectively. Most commonly, the fluorescent material is ZnS with Mn as activator (dopant). ZnS: MnTFEL emits yellow light. Other color phosphors have been developed.

The film of a conventional TFEL laminate is deposited on a substrate, usually glass. The film deposition is carried out by substantially known thin film techniques, such as electron beam vacuum evaporation or sputtering. Recently, it is performed by atomic film epitaxy (ALE). The total TFEL laminate thickness is on the order of only 1 or 2 microns.

Various insulating / dielectric materials are known and are used as described in detail below to separate and electrically insulate the fluorescent layer from the electrodes.

Each of the two electrodes differs depending on whether it is on the "back" or "front" side (in the viewing direction) of the device. A reflective material such as aluminum is typically used for the back electrode. A relatively thin and optically transparent indium tin oxide (ITO) is typically used for the front electrode. When applied to a lamp, the two electrodes take the form of a continuous film whereby the entire phosphor layer is exposed to an electric field between the electrodes. In a typical display application, the front and back electrodes are appropriately patterned with conductive address lines that define the row and column electrodes. Pixels are defined where the row and column electrodes overlap.
Various electronic display elements are known which address individual pixels by simultaneously applying a voltage to one row electrode and one column electrode.

Although simple in concept, there are many practical difficulties in developing thin film electroluminescent devices. The first difficulty is that the device is formed from individual laminates deposited by thin film technology. This is because thin film technology is time consuming and costly. Very small defects in the film can also cause failures. Second, these thin film devices are typically operated at relatively high voltages (e.g., peak-peak 300-450V). In fact, this voltage exceeds the breakdown voltage of the phosphor layer, making it conductive and operating. Thin film dielectric layers on either side of the phosphor layer are required to limit or prevent conduction between the electrodes. The application of a large electric field causes a dielectric breakdown between the electrodes and causes a device failure.

The present invention is particularly directed to blocking discharges through the insulating / dielectric layers and phosphor layers of electroluminescent devices. In order for the electroluminescent device to operate properly, it is necessary that the electrodes (address lines) be insulated from the fluorescent layer. This is done by the insulating / dielectric layer. Insulating / dielectric layers are typically provided on both sides of the phosphor layer and are formed from alumina, yttria, silicon dioxide, silicon nitride or other dielectric materials. During operation of the device, electrons from the interface between the insulating layer and the fluorescent layer are
This is accelerated by the electric field so that it passes through the fluorescent layer,
It collides with the dopant atoms in the fluorescent layer and emits light as a result of the collision process. In the conventional TFEL element, in order to ensure that the electric field strength passing through the phosphor is sufficiently high,
The thickness of the dielectric layer is usually thinner than or similar to the fluorescent layer. If the dielectric layer is too thick, most of the voltage applied between the address lines will pass through the dielectric layer rather than the fluorescent layer.

It is important that the dielectric layer is compatible with the fluorescent layer. By "compatible" is meant herein, and in the claims, that a first good injection interface is formed. That is, the source of "hot" electrons is at the fluorescent interface, which can be promoted and tunneled into the fluorescent conduction band to initiate conduction and light emission in the fluorescent layer upon application of an electric field. Second, in the compatible sense, it means that the dielectric material must be chemically stable so that it does not react with the adjacent layers (ie phosphor and electrodes).

In a typical TFEL, in order to obtain sufficient light emission, the applied voltage is very close to the voltage at which dielectric breakdown occurs. Therefore, manufacturing control regarding the thickness and quality of the dielectric layer and the fluorescent layer must be strictly performed to prevent dielectric breakdown. On the contrary, this requirement makes it difficult to obtain a high yield.

A typical TFEL structure is formed from the front side (in the viewing direction) to the back side. The thin film is continuously deposited on a suitable substrate. Glass substrates are used to obtain transparency. The transparent front electrode (ITO address line) is deposited on the glass substrate by sputtering to a thickness of about 0.2 micron. The substrate dielectric-phosphor-dielectric layer is usually deposited by sputtering or vacuum evaporation. The thickness of the fluorescent layer is typically about 0.5 micron. The thickness of the dielectric layer is typically about 0.4 micron. The phosphor layer is usually annealed after deposition at about 450 ° C. for efficiency. A back electrode is then added, typically in the form of 0.1 micron thick aluminum address lines. The finished TEFL laminate is encapsulated to protect it from external moisture. Epoxy sheet cover glass or silicone oil capsules are used. Since the initial substrate used for deposits is typically glass, the materials and deposition techniques used in TEFL laminate construction are not capable of high temperature processing.

The high electric field strengths used to operate TFEL devices place strict requirements on the dielectric layers. High dielectric strength is required to avoid dielectric breakdown. A dielectric material having a high dielectric constant is advantageous for obtaining luminous efficiency at a driving voltage as low as possible. However, attempts to use high dielectric constant materials have not yielded satisfactory results.

In order to lower the driving voltage of the TFEL element,
The insulating layer is made of a high dielectric constant material such as SrTiO ₃ or PbTi.
It is formed of O ₃ and BaTa ₂ O ₃ . This is described in US Pat. No. 4,857,802. However, these materials do not show good low dielectric breakdown strength. U.S. Pat. No. 4,857,802 describes forming a dielectric layer by a thin film deposition technique to obtain increased planar orientation (111) from a perovskite crystal structure. In the same specification, high dielectric strength (about 8
× 10 ⁵ to about 1.0 × 10 ⁶ V / cm) is SrTiO ₃ ,
It is described that it is obtained by using a dielectric layer using PbTiO ₃ , BaTa ₂ O _{3 and} having a thickness of about 0.5 micron. They all have a high dielectric constant and a perovskite crystal structure. This device is complex and difficult to control with thin film deposition techniques on the dielectric layer.

A TFEL device using a thin ceramic insulating layer and a thin film electroluminescent material has also been developed (MIATA, T. et al., SID 91 Dig.
est, pp 70-73 and pp 286-289). This element is formed from a BaTiO ₃ ceramic sheet. The sheet is formed by casting fine BaTiO ₃ powder on a disk (20 mm diameter) and using a conventional cold press method. The disc is fired in air at 1300 ° C. Next, it is ground into a sheet having a thickness of about 0.2 mm. The emissive layer is deposited in a thin film on the sheet using chemical vacuum deposition or RF magnetron sputtering. Appropriate electrode layers are then deposited using thin film technology on either side of the structure. Although this device exhibits the desired characteristics, it is not preferred to manufacture commercial TFEL devices from solid ceramic sheets. Polishing a large ceramic sheet to a constant thickness of 0.2 mm is not economically feasible.

It is also known to use multiple insulating / dielectric layers on both sides of the phosphor layer. For example, US Pat.
No. 9 discloses a TFEL in which an EL phosphor layer is sandwiched between insulating stack pairs. In this case, one or both of the insulating deposits is silicon oxynitride (Si
ON) and a second relatively thick layer of barium tantalate (BTO). The first SiON layer exhibits a high insulating property, and the second BTO layer has a high dielectric constant. Overall, this structure is characterized by the high brightness of the phosphor layer at conventional voltages. However, the insulating layer is deposited by RF sputtering, which is a disadvantage for the previously described thin film technology.

There is a need for TFEL devices that are advantageous to manufacture and have higher brightness and lower operating voltage than conventional TFEL devices. This requires obtaining a dielectric layer that has a dielectric strength higher than the electric field strength required to drive the device.

Fabrication of electrode patterns in transparent conductive materials such as indium tin oxide often involves extensive and expensive masking, photolithographic and chemical etching processes. Lasers have been proposed for drawing on such transparent conductive materials. Carbon dioxide, argon and YAG lasers are commonly used. Such lasers produce light in the visible and infrared regions of the electromagnetic spectrum (typically 400 nm and above). However, the use of such long wavelength light to scribe electrode patterns is problematic, especially when the transparent conductive material is deposited in another transparent layer. Conventional TF
In EL displays, a transparent electrode material, typically indium tin oxide (ITO), is deposited on the transparent display before the other layers of the EL laminate are deposited. Insulating or semiconducting materials do not strongly absorb light at wavelengths longer than the energy of the electronic bandgap in the material. For optically transparent materials, the wavelength corresponding to the bandgap is shorter than the wavelength for visible light. Therefore, the transparent electrode material does not absorb much laser light. This is due to the long wavelength of light and the thin layer thickness, which makes it difficult to use the laser energy to ablate electrode address lines directly.

US Pat. No. 4,292,092 and US Pat. No. 4,667,058 describe a process for depositing a transparent electrode pattern on another transparent layer in a solar cell. These patent specifications disclose patterning electrodes using a pulsed YAG laser. However, the wavelength of the YAG laser is too long to be sufficiently absorbed by the transparent layer. To compensate for the low absorption, a high peak power laser is used to thermally vaporize the transparent electrode. Neodymium YAG laser is 4
˜5 W, pulse rate of 36 kHz, scan rate of 20 cm / s. In the embodiment described in the patent specification, IT
The O layer is thus deposited on the glass. However, the scribed lines are described as having incomplete removal of ITO, with the glass having a depth of up to several hundred angstroms in the melted location. Residual ITO must be removed by a subsequent etching step.

Another means of forming the electrode pattern on the transparent electrode material is to use an excimer laser. This laser produces light of a relatively short wavelength in the ultraviolet region of the electromagnetic spectrum. At this wavelength the laser energy can be absorbed by the transparent electrode material. Lasers of this nature include liquid crystal displays (US Pat. No. 4,980,366 and US Pat. No. 4,927,493), photovoltaic cells (US Pat. No. 4,783,421 and US Pat. No. 4,854,974) and integrated circuits (US Pat. It is known to form a conductive pattern with respect to Japanese Patent No. 5109149). August 2, 1990
WO 90/0970 published on the 3rd describes a process of scribing an electrode dot matrix pattern on a transparent conductor on a transparent substrate by an excimer laser.

The excimer laser emits light of a wavelength short enough to be absorbed by the transparent electrode and can be patterned by directly removing the electrode. However, such lasers are relatively expensive and the scribing process must be carefully controlled not to melt or remove the underlying display glass. Moreover, such processes can result in excessive or incomplete removal of transparent electrode material. For example WO90 / 0
970 states that if only a portion of the material to be removed is removed, the remaining portion can be removed by chemical or plasma etching.

Another problem with scribing transparent electrode material on a transparent substrate is described in US Pat. No. 4,937,129. It is described that a diffusion barrier layer is provided at the interface to avoid diffusion or cross-contamination between layers.

Another patent specification describes surface treating a transparent electrode material to enhance absorption of laser light. For example, U.S. Pat. No. 4,909,895 describes the oxidation of a metal film surface to make it relatively insensitive to laser light.
U.S. Pat. No. 4,568,409 describes coating a transparent layer to be removed with a dye so that laser light is selectively absorbed where removal is desired.

Control circuits have been developed to drive EL displays. Basically, this circuit converts serial video data into parallel data and supplies voltages to the rows and columns of the display. Row and column driver elements (chips) as described above are available.

Asymmetric drive and symmetric drive technologies are used in EL display technology. In the asymmetric drive method, the EL panel is provided with drive pulses by simultaneously applying a negative subthreshold voltage to one column. During the scan time of each column, a positive voltage pulse is applied to the selected row (ie the row that should emit light) and a zero voltage is applied to the non-selected row (ie the row that should not emit light). At the intersection of the selected row and column, a voltage equal to the sum of the sub-threshold column voltage and the positive pulse voltage of the row is supplied through the pixel, causing light emission. After all columns of the panel have been addressed, a positive polarity refresh pulse is applied to all columns simultaneously and all rows are held at 0V.

In the symmetrical driving method, the refresh pulse is omitted. Instead, a set of drive pulses of opposite polarity is applied to the panel. To keep the panel active, the columns are scanned in even and odd frames with pulses of alternating polarity. The alternating polarities cause a net zero charge on every display pixel.

High voltage driver devices (chips) such as those described above are available in both asymmetric and symmetric drive technologies.

Elements for alternating drive circuits and EL displays are known and have been developed. For example, K.
Shoji et al., Bidirectional Pus
h-Pull Symmetric Driving
Method of TFEL Display, Spr
inger Proceedings in Phys
ics, Vol. 38,1989,324, and Su.
Totten et al., Recent Development
s and Trends in Thin-Film
Electroluminescent Displ
y Drivers, Springer Procee
ings in Physics, Vol. 38,1
989, 318, and Bolger et al., A Sec.
ondGeneration Chip Set fo
r Driving EL Panels, SID, 1
See 985, 229.

The above driving method is called a multiplex (passive) matrix addressing method. In theory, other driving methods, such as active matrix addressing, can also be used for EL displays. But these have not yet been developed. Such an alternating drive method should be seen within the meaning of the phrase voltage drive circuit used herein.

In conventional EL displays, one means of connecting the row and column address lines to the drive circuitry was to connect the display address lines with polymerized strips containing a very large number of metal sheets in close proximity. Pressure is applied between the contact row and the contact row connected to the driver element of the drive circuit. The drive circuit is arranged on a separate circuit board (see US Pat. No. 4,508,990). Polymerized strips are layered elastomeric elements (LEE), known under the trade names STAX and ZEBRA. LEE consists of alternating layers of conductive and non-conductive elastomeric materials.
Polymerized strips avoid the laborious connection work of connecting hundreds of individual wires to contacts using solder or welding. However, this interconnection technique is impractical and does not work well at high temperatures that cause the polymeric material to creep.

Another means commonly used for connecting the row and column address lines to the liquid crystal display (LCD) drive circuit, namely the use of chip-on-glass technology (COG), is also considered for electroluminescence. To be The driving elements (chips) to which the address lines must be connected are arranged around the periphery of the display. L
In the case of a CD, the address lines deposited on the backside of the display glass extend from the active area of the display. Therefore, the address lines terminate in contact pads arranged in the pattern so that the chip can be bonded thereto. Wire bonding requires attaching the chip to the display glass and connecting fine gold wires individually to the output pads of the chip and the corresponding contact pads of the address lines.

The advantage of COG technology is that the number of contacts between the display glass and the drive circuit can be significantly reduced. This is because there are far more contacts between the driver chip and the address lines. Typically 20 to 30 connections are between the driver chip and the rest of the drive circuit, but 2000 between the address lines.
There is also a connection.

A major drawback of COG technology is the difficulty of wire bonding the driver chip to the thin film pads of the address lines. Therefore, the manufacturing yield is poor. Another drawback is the need for space around the display to mount the driver chip. Therefore, the size of the display is increased and it is not possible to combine multiple display modules into an array to form a large display.

Through-hole technology for direct circuit connection is well known in the semiconductor art (eg, US Pat. No. 36).
41390). US Pat. No. 4,710,395
From U.S. Pat. No. 6,096,099, a method and a device for through-hole substrate printing with controlled vacuum are known. However, as far as the inventor knows, through-hole printing is
It cannot be successfully applied to EL displays.

In US Pat. No. 3,504,214,
The segment storage format of EL elements is described. Here, the pixels are turned on by light to form the photoelectric layer, which in turn makes the fluorescent layer conductive. The complexity of through-hole conductors is described. This specification suggests that normal through hole connections do not work in high resolution TFEL displays. This is because the conductive material reacts with the phosphor, which reduces the performance of the display.

[0036]

SUMMARY OF THE INVENTION An object of the present invention is to provide an electroluminescent device which has high luminous efficiency, is easy to manufacture and is simple.

[0037]

According to the present invention, the flat layer has a dielectric strength of about 1.0 × 10 ⁶ V / m or more and a ratio of the dielectric constant of the dielectric material to the dielectric constant of the phosphor. About 50:
The dielectric layer is formed of a ceramic material having a dielectric constant of 1 or more, and the dielectric layer has a thickness ratio of the dielectric layer to the fluorescent layer of about 20: 1.
To 500: 1, the dielectric layer has a surface adjacent to the phosphor layer, the surface being compatible with and sufficiently smooth with the phosphor layer, the phosphor layer having a predetermined excitation voltage. The solution is an EL laminate dielectric layer structure having a dielectric layer that is generally configured to emit light uniformly below.

SUMMARY OF THE INVENTION Electroluminescent layers have different dielectric constants.
The potential difference between the layers of the laminate is distributed in each layer in proportion to the thickness of each layer and in inverse proportion to the relative dielectric constant of the material.
For example, if one layer has twice the thickness and dielectric constant of another layer, the voltage will be evenly distributed between these two layers.
The present invention takes advantage of this property to combine a thick dielectric layer with a high dielectric constant with a thin fluorescent layer with a much lower dielectric constant. In this way, there can be sufficient voltage across the phosphor layer across the phosphor layer, provided that the dielectric layer has a sufficiently high permittivity, before the conduction by the phosphor layer begins. The present invention provides EL laminates with new and improved dielectric layers and methods of making the same. The dielectric layer is formed as a thick film from the following ceramic materials.

-Dielectric strength is about 1.0 x 10 ⁶ V / m or more.

[0040] - dielectric constant of the dielectric material (k ₂₎ and the dielectric constant of the phosphor layer (k ₁₎ ratio of about 50: 1 or higher is (preferably 100: 1 or higher).

The ratio of the thickness of the dielectric layer (d ₂ ) to the thickness of the fluorescent layer (d ₁ ) is in the range of about 20: 1 to 500: 1 (preferably 40: 1 to 300: 1). ).

The surface adjacent to the phosphor layer is compatible and sufficiently smooth with the phosphor layer, and the phosphor layer generally emits uniformly at a given excitation voltage.

The laminate comprising the dielectric layer of the present invention is most preferably a laminate in which the fluorescent layer is a thin film layer. A typical thin film fluorescent layer is formed from ZnS: Mn to a thickness of about 0.2 to 2.0 microns, typically about 0.5 microns. ZnS: Mn material has a dielectric constant of about 5-10. . Based on this most favorable phosphor layer (see guidelines above) in theoretical calculations, the dielectric layers of the present invention preferably have a dielectric constant of 500 or higher, most preferably about 1000 or higher. Also, the thickness is in the range of about 10 to 300 microns, preferably in the range of 20 to 150 microns. Ferroelectric materials are advantageous for obtaining a high dielectric constant.
Most advantageously they have a perovskite crystal structure. For example, the material is PbNbO ₃ , BaTiO ₃ , SrT
It contains iO ₃ and PbTiO ₃ .

The dielectric layer of the present invention is formed into a laminate,
It is configured from front to back. Therefore, the back electrode is deposited on the substrate, most preferably a ceramic such as alumina. It can withstand much higher temperatures during manufacture than glass substrates (glass substrates are used from front to back of the TFEL structure for front side transparency). The next dielectric layer of the present invention is deposited on the back electrode by thick film technology. It is fired at high temperature, but it can withstand the substrate and back electrode. The use of thick film technology and high temperature firing is important to the overall properties of the dielectric layer. The result is a dense layer with a high degree of crystallinity, which improves the overall dielectric constant and the dielectric strength of the layer.

In practice, the inventor finds it difficult to manufacture the desired surface (ie, compatible and smooth) of the dielectric adjacent the phosphor layer using currently available ceramic materials. Therefore, in a preferred embodiment of the invention, the dielectric layer is formed as two layers, the first dielectric layer being formed on the back electrode, which preferably has a high dielectric strength,
It is set to the above dielectric constant value. The second dielectric layer will be the surface adjacent the phosphor layer as described above.

In a preferred embodiment of the present invention, the first dielectric layer is deposited by thick film technology (preferably screen printing), followed by high temperature firing (preferably at a temperature below the melting point of all underlying layers). , Preferably below 1000 ° C.). Ferroelectric ceramics, preferably pastes containing perovskite crystal structures, are advantageous materials if the paste composition allows firing at high firing temperatures. The second dielectric layer is preferably deposited by the sol-gel technique and then high temperature fired to obtain a smooth surface. The material used for the second layer preferably has a high dielectric constant (preferably 20 or more, more preferably 100 or more),
More than 2 microns thick (preferably 2 to 10 microns)
Is. Ferroelectric ceramics with a perovskite crystal structure are most advantageous.

The present invention comprises a first dielectric layer screen printed from lead niobate to a thickness of 30 microns and a second dielectric layer spin deposited from lead zirconate titanate as a sol to a thickness of 2 to 3 microns. Indicated by the dielectric layer. The sol-gel layer was also demonstrated by dipping to form multiple layers with a total thickness of 6 to 10 microns.
Lead zirconate lanthanate titanate was also shown as a sol-gel layer.

The use of two layers of dielectric is not essential but advantageous. The first dielectric layer is formed as a thick film with the required high dielectric strength and high dielectric constant, whereas the second layer has no such limitation. If the second layer has the desired compatible and smooth surface, it can be formed from many different materials than used in the first layer as a thin film. Much work has been done on altering the properties of the dielectric-fluorescent interface of EL laminates, such as improving chemical stability or injection. Materials or deposition techniques that include these improvements can be used with the first and / or second dielectric layers of the present invention. For example, by modifying the surface of the second layer in the choice of material or deposition technique used in the first or second layer,
Alternatively, it can be used by applying a third thin film layer on top of the first or second layer.

The laminates produced according to the invention exhibit good luminous efficiency at low operating voltages without breakdown. Thick film and sol-gel deposition techniques that are advantageous for dielectric layers are generally simple and not expensive compared to the thin film techniques described above. Another advantage of the dielectric layer of the present invention is that the laminate incorporating the layer does not require a separate dielectric layer between the fluorescent layer and the second electrode. However, such additional dielectric layers may be included if desired.

The invention therefore applies a dielectric layer in an electroluminescent laminate of the type which comprises a sandwiched phosphor layer between a front electrode and a back electrode. The back electrode is formed on the substrate and the fluorescent layer is separated from the back electrode by a dielectric layer. The dielectric layer has a flat layer formed of a ceramic material. The dielectric strength of this ceramic material is about 1.0 × 10 ⁶ V / m or more, the dielectric constant, which is the ratio of k ₂ / k ₁ , is 50: 1 or more, and the dielectric layer has the ratio of d ₂ : d ₁ . Is 20: 1 to 500: 1
Has a thickness such that In addition, the dielectric layer is compatible with and has a sufficiently smooth surface adjacent to the fluorescent layer, which generally emits uniformly at a given excitation voltage.

The invention also relates to a method of manufacturing an electroluminescent laminate of the type comprising a sandwiched fluorescent layer between a front electrode and a back electrode. The back electrode is formed on the substrate and the fluorescent layer is separated from the back electrode by a dielectric layer. The method of the present invention is
The back electrode is deposited by thick film technology and then the ceramic material is fired. The ceramic material has a dielectric constant with a k ₂ / k ₁ ratio of about 50: 1 or greater, and has a dielectric constant of about 1.0 × 10 ^6.
A dielectric layer having a dielectric strength of V / m or more and a thickness having a ratio of d ₂ / d ₁ in the range of about 20: 1 to 500: 1 is formed. The dielectric layer forms a surface adjacent to the fluorescent layer. This surface is compatible with the phosphor layer and is sufficiently smooth that it generally emits uniformly under a given excitation voltage.

The present invention also relates to a process for laser scribing a pattern into a flat laminate having at least one upper layer and at least one lower layer. This process irradiates a focused laser beam to the upper layer side of the laminate, the laser beam having a wavelength such that it is substantially not absorbed by the upper layer but absorbed by the lower layer. At least a portion of the lower layer is removed directly and the upper layer is indirectly removed over its thickness.

In the context of an EL laminate, the upper layer is the transparent conductive material and the emitter, the lower layer is one or more of the dielectric layers, and the pattern is the electrode pattern of the address lines arranged in parallel. .

The following definitions apply throughout the specification and claims.

Absorption occurs in the material when, for example, the promotion of electrons through the bandgap for the material causes the amount of radiant energy to match an allowed transition to a higher energy state in the material.

Direct removal of material by the laser beam occurs when the main cause of removal is decomposition and / or by absorption of the radiant energy of the laser beam by the material.

Indirect removal of material with a laser beam
It occurs when the main cause of removal is evaporation by heat generation in the material and when it is transported from an adjacent material that absorbs the radiant energy of the laser beam.

The present invention relates to an electroluminescent display panel for making electrical connection from a flat electroluminescent laminate to the output side of one or more voltage driven elements of a drive circuit using a through hole connector. The display panel is: -an electroluminescent laminate formed on the backside of the substrate and having a front and rear set of tolerance address lines of a known type; -a plurality of throughs formed on the substrate adjacent to the ends of the address lines. And a conductive path forming means for electrically connecting each address line to the voltage driving element of the driving circuit to each end of the address line through each of the through holes of the substrate.

Advantageously, the electroluminescent laminate of the display panel comprises the thick film dielectric layer of the invention. This dielectric layer allows the laminate to be formed from the rear substrate to the front side (in the viewing direction), which also
The through-hole connector and the thick film circuit pattern for connecting the voltage driving element and the address line can be formed by the alternating combination of the circuit manufacturing step and the manufacturing step for electroluminescence.

Such steps cannot simply be realized in a conventional electroluminescent laminate structure. This is because the layers are deposited on the front display glass, which cannot withstand the temperatures at which the thick film conductive paste is fired.

According to the present invention, the voltage driving element or the entire driving circuit is formed on the back surface of the rear substrate. The use of through hole connectors provides a more direct and reliable interconnection between the address lines and the drive circuitry. No inactive perimeter around the display panel is needed (as was required in the prior art). This allows large displays to be combined from individual display panels without creating dark boundaries between modules.

[0062]

1 and 2 show an EL laminate 10 according to the invention with two dielectric layers combined. The laminate 10 is formed on the substrate 12 from the back side. The back electrode layer 14 is formed on the substrate 12. As shown in the drawing, for display applications, the back electrode 14 comprises a row of electrically conductive address lines centered on the substrate 12 and spaced from the substrate edge. An electrical contact tab 16 projects from the electrode 14. A first thick dielectric layer 18 is formed on the back electrode 14, followed by a thinner second dielectric layer 20. Furthermore, the second dielectric layer 20
A phosphorescent layer 22 is formed thereon, followed by a transparent front electrode layer 24. Although the front electrode layer 24 is depicted as a solid in the drawing, for practical display applications, this electrode layer is composed of rows of address lines arranged perpendicular to the address lines of the back electrode 14. . The laminate 10 is encapsulated by a permeable sealing layer 26 to prevent moisture ingress. An electrical contact 28 is provided on the second electrode 24.

The EL laminate 10 is operated by connecting an AC power source to the electrode contacts 16, 28. The EL laminate according to the present invention has the most uses in displays, but has uses as lamps or displays.

Those skilled in the art will appreciate that the laminate 10 may be provided with additional intermediate layers without departing from the scope of the present invention.

The method according to the invention for forming a double dielectric layer in one EL laminate will now be described, together with advantageous materials and process steps.

The laminate 10 is formed from the back surface to the front surface (display surface). Laminate 10 is a suitable substrate 12
Formed on. Substrate 12 is preferably ceramic, which is capable of withstanding the high sintering temperatures used in the dielectric layer (typically 1000 ° C). The most advantageous is alumina.

A first back electrode 14 is deposited on the substrate 12. Many techniques and materials are known for wiring thin columns of address lines. Advantageously, the conductive metal address lines are made of Ag, which can be washed off in the areas where the paste is to be printed, using Ag.
Screen printed with / Pt alloy paste. The paste is then dried and fired. Alternatively, the back electrode 14 is made of another precious metal such as gold, or chrome,
It can also be formed of other metals such as tungsten, molybdenum, tantalum or alloys of these metals.

The first dielectric layer 18 is deposited on the back electrode by well known thick film techniques. The first dielectric layer 18 is preferably made of a ferroelectric material, most preferably one having a perovskite crystal structure, in order to produce a higher dielectric constant than that of the phosphorous layer 22. This material is one that has a minimum dielectric constant of 500 over the appropriate operating temperature for the laminate, typically over 20 ° C to 100 ° C. Even more advantageously, the dielectric constant of the first dielectric layer material is 1000 or higher. Illustrative materials for the first dielectric layer 18 are PbnbO ₃ , Batio ₃ , SrTiO ₃
And PbTiO ₃ , of which PbNBO ₃ is particularly preferred.

Those skilled in the art will understand when choosing a ceramic material (ie, an electrically insulating member having a melting point high enough to provide another layer of the laminate) for the first dielectric layer 18. As such, materials known to have high dielectric constant and high dielectric strength are selected. These are intrinsic properties of the material, but values are generally defined for bulk materials that exist in a dense, transparent shape. These characteristics can be varied depending on the deposit technology used. With respect to the dielectric constant of the material, thick film deposition techniques and subsequent high temperature sintering (in the range of about 1 micron to about 2 microns) are used to ensure that the dielectric constant does not drop significantly below that of the starting material. 3.) Large particle size and high transparency in a dense structure are generally maintained. Similarly, high dielectric strength is obtained by using thick film deposition techniques. However, the dielectric strength of the layers should ultimately be measured by applying an operating voltage to the finished laminate.

The thick film deposition technique is conventionally known as described above. In such a technique, the dielectric material has a desired thickness in a generally uniform range of back electrode 14.
Deposited on. Thick film deposition technology
It is often used in the manufacture of electronic circuits on ceramic substrates. Screen printing is the most preferred technique. Commercially available dielectric pastes can be used with the recommended sintering steps performed by the paste manufacturer. The paste is
It should be selected or formed to allow high temperature sintering, which is typically about 1000 ° C. However, other techniques can achieve similar results. An alternative thick film technique is to use the dielectric as a "green tape" so that it can be wired onto the back electrode 14. This green tape has a polymeric matrix of dielectric powder that can be burned during the subsequent sintering process.
Prior to sintering, the tape was flexible and the electrode layer 14
It can be laid flat on top and pressed. One possible advantage of green tape on screen-printed dielectric is that it can be somewhat compacted with fewer holes when burned. Currently, green tape dielectrics are not readily available. The dielectric thick film paste can also be spread flat on the back electrode layer 14 and applied, or it can be applied with a doctor blade. Additional, more complex techniques such as electrostatic deposition of the dielectric powder and subsequent sintering, which occurs immediately before the powder loses its electrostatic charge, may be used concomitantly.

As shown, the first dielectric layer 18
Is preferably screen printed with a paste. In order to achieve low porosity, high crystallinity and minimal disintegration, depositing multiple layers and subsequent sintering at high temperature is advantageous. The sintering temperature depends on the particular material used, but should not exceed the temperature that the back electrode 14 or substrate 12 can withstand. A temperature of 1000 ° C. is typically the maximum for most electrode materials. The thickness of the first dielectric layer 18 depends on the dielectric constant of this layer and the phosphor layer 2
2 and the dielectric constant and thickness of the second dielectric layer 20. Generally, the thickness of the first dielectric layer 18 is 10-3.
It is in the range of 00 microns, preferably in the range of 20 to 150 microns, more preferably in the range of 30 to 100 microns.

Generally, the thickness and dielectric constant of the dielectric layer are determined.
The criterion for setting is that the proper dielectric strength is generated at the minimum operating voltage.
It is supposed to be calculated as if it were squeezed. These criteria are
They are interrelated as described below. About phosphorescent layer
Typical thickness range between 0.2 and 2.0 microns (d
₁ ), And a dielectric constant between about 5 and 10 for this phosphorescent layer.
Range of (k₁ ), And about 10 for the dielectric layer⁶ ~
10⁷ If the range of dielectric strength of V / m is set, the
Typical thickness for the electrode layer (d₂ ) And permittivity (K ₂ )of
The following formulas and calculations can be applied to determine the values.
When trying to change the above typical range with meaning
In the formula of these equations, without departing from the scope of the present invention,
And calculation d₂ And k₂ For determining the value of
Can be used as a line.

The voltage V applied to the double layer with one uniform dielectric layer and one uniform non-conducting phosphorescent layer sandwiched between two conductive electrodes is defined by equation 1. V = E ₂ * d ₂ + E ₁ * d ₁ (1) In this case, E 2 is the electric field strength in the dielectric layer, E 1 is the electric field strength in the phosphor layer, d ₂ is the thickness of the dielectric layer, and d ₁ is the phosphor layer. Is the thickness.

In these calculations, the electric field direction is perpendicular to the intervening region between the phosphorescent layer and the dielectric layer. Formula 1
Applies as long as a voltage lower than the threshold voltage is applied. At this threshold voltage, the electric field strength in the phosphorescent layer is high enough that the phosphorescent layer begins to electrically break down and the device begins to emit light.

According to electromagnetic theory, 2 having different dielectric constants
The component of the electric displacement (electric flux density) D perpendicular to the intervening region between the two insulating materials is continuous over the intervening region. This electrical displacement component in a material is defined as the product of the dielectric constant and the electric field component in the same direction. From this relationship, 2
Equation 2 is derived for the intervening region in the multilayer structure: k ₂ * E ₂ = k ₁ * E ₁ (2) where k ₂ is the dielectric constant of the dielectric material and k ₁ is the dielectric constant of the phosphorescent material. Is.

Equations 1 and 2 can be combined to obtain Equation 3: V = (k ₁ * d ₂ / k ₂ + d ₁ ) * E ₁ (3) In order to minimize the threshold voltage, Equation 3 It is necessary to reduce the first term of (1) in practical use. In order to maximize the light emitted by the phosphorescent layer, the second term is dictated by the requirement for the choice of phosphorescent layer thickness. When determining these numerical values, the first term is selected to be one tenth the size of the second term. By substituting this condition into Equation 3, Equation 4 is obtained: d ₂ / k ₂ = 0.1 * d ₁ / k ₁ (4) According to Equation 4, the thickness of the dielectric layer and its dielectric The ratio with the rate is obtained. This thickness is uniquely determined by the requirement that the dielectric strength of the insulating layer be sufficient to hold the entire applied voltage when the phosphorescent layer conducts above a threshold voltage. The thickness is calculated using Equation 5: d ₂ = V / S (5) where S is the dielectric strength of the dielectric material.

By using the above equations and appropriate values for d ₁ , k ₁ and S, the dielectric layer thickness and permittivity ranges set forth in the present specification and claims are obtained.

As mentioned above, the first dielectric layer 18 has a sufficiently smooth surface adjacent to the phosphorescent layer (ie the subsequently deposited phosphorescent layer emits light uniformly throughout the given excitation voltage). The second dielectric layer 20 is not necessary if it has a sufficiently smooth surface to be compatible with) and is compatible with this phosphorescent layer 22. Generally, it is sufficient if the surface relief does not vary by more than about 0.5 microns over about 1000 microns (which is approximately equal to one pixel width). It is even more preferable if the surface undulations are 0.1 to 0.2 micron in this interval. If the first dielectric layer 18 has a sufficiently smooth surface, but does not have the desired compatibility with the phosphorescent layer 22, then another layer of material (preferably a dielectric Layers, but need not be) may be added, for example by thin film technology.

If a second dielectric layer 20 is required, this layer is created on top of the first dielectric layer. Second dielectric layer 20
May have a dielectric constant less than that of the first dielectric layer 18, and is typically produced as a thinner layer (preferably greater than 2 microns and more preferably 2-10 microns). . The desired thickness of the second dielectric layer is generally a function of smoothness, ie this layer can be as thin as possible if a smooth surface is obtained. To obtain a smooth surface, the sol-gel deposition technique is preferably used, followed by sintering at high temperature. The sol-gel deposition technique is well known in the art, for example "Fundamental Pr
inciples of Sol Gel Technology ", RW Jones The
See Institute of Metals, 1989. In general, the sol-gel process allows the materials to be mixed at the molecular level in the sol while still retaining the solvent and before being taken out of solution as a colloidal gel or polymerized polymer network. Removal of the solvent leaves a high level of dense porosity solids. Thus, the value of surface free energy is increased and the solids can be sintered and enriched at lower temperatures than is done using most other techniques.

The sol-gel material is deposited on the first dielectric layer 18 to obtain a smooth surface. This sol-gel process makes it possible to fill the pores on the sintered thick film layer in addition to producing a smooth surface. Most preferred is spin deposition or dipping. These are techniques that have been used in the semiconductor industry for many years, mainly in the photolithographic process. In the case of spin deposition, the sol material is dropped onto the first dielectric layer 18 which spins at high speed-typically thousands of revolutions per minute. If desired, the sol can be deposited in several stages. The thickness of layer 20 is controlled by changing the viscosity of the sol-gel and by changing the spin rate. After spinning, a thin layer of moist sol-gel is produced on the surface. The sol-gel layer 20 is sintered at a temperature typically below 1000 ° C. to produce a ceramic surface. The sol can also be deposited by dipping. The surface to be coated is dipped into the sol and then withdrawn at a constant rate-usually very slowly. The layer thickness is controlled by varying the viscosity of the sol and the withdrawal rate. In addition, the sol may be screen printed or spray coated, but controlling the layer thickness with these techniques is relatively difficult.

The material used for the second dielectric layer 20 is preferably a ferroelectric ceramic material, which preferably has a perovskite crystal structure in order to produce a high dielectric constant. Advantageously, this dielectric constant is in order to avoid voltage fluctuations in the two dielectric layers 18, 20
It is similar to the dielectric constant of the first dielectric layer. Although,
In the thinner layers used in the second dielectric 20, the permittivity can be used as low as about 20, but is preferably greater than 100. Illustrative materials include zirconate-lead titanate (PZT), lanthanum-
Included are zirconate-lead titanate (PLZT), and Sr, Pb and Ba titanates used in the first dielectric layer 18, with PZT and PLZT being most preferred.

To produce a smooth ceramic surface suitable for deposition of the next layer, PZT or PLZ
T is advantageously deposited as a sol-gel by spin deposition followed by sintering at temperatures below about 600 ° C.

The next layer to be deposited is typically the phosphorescent layer 22, but as mentioned above, for the purpose of further improving the intervening region with the phosphorescent layer, a second dielectric layer within the framework of the present invention. It is also possible to provide another layer on the layer 20.
For example, a thin film layer of a material known to have good injectability and compatibility can be used.

The phosphorescent layer 22 is deposited by a well-known thin film deposition technique such as vacuum deposition by an electron beam evaporator or sputtering. The preferred phosphorescent material is ZnS: Mn, although other phosphors that emit light of different colors are known. Phosphorescent layer 22 typically has a thickness of about 0.5 microns and a dielectric constant of about 5-10.

A separate transparent dielectric layer above phosphorescent layer 22 is not required, but may be provided if desired.

The front electrode layer 24 is deposited directly on the phosphorescent layer 22 (another dielectric layer if present). This front electrode is transparent and is advantageously of the indium tin oxide (IT) known in thin film deposition techniques such as vacuum deposition in electron beam evaporators.
O).

The laminate 10 is typically annealed and then sealed with a sealing layer 26 such as glass.

An advantageous laminate with typical thickness values according to the invention is as follows from back to front: substrate layer alumina back electrode Ag / Pt address line 10 micron first dielectric layer niobate. Lead 30 micron Second dielectric layer Zirconic acid-lead titanate 2 micron Phosphorescent layer ZnS: Mn 0.5 micron Front electrode ITO 0.1 micron Seal layer Glass 10-20 micron For large EL displays, the layer thickness is Can be changed. For example, the thickness of the sol-gel layer is typically increased by about 6-10 microns to obtain the desired smoothness. Similarly, the thickness of the ITO layer can be increased to 0.3 microns for large displays.

According to the invention, the connection between the front and rear address lines of the electroluminescent laminate and the voltage drive circuit is preferably made by penetrating through holes in the rear substrate. Most preferably, the EL laminate has the thick dielectric layer of the present invention-although this is not required.

The voltage drive circuit has voltage drive components (typically referred to as high voltage drive chips). The output of this component is connected to the individual row and column address lines of the back and front electrodes to selectively excite the pixels in response to the video input signal. Voltage drive circuits and components are generally known in the art. To illustrate the present invention, through-hole connections are provided for known packaged high voltage drive chips, which are well known in the art for reflow soldering techniques on a back substrate. Surface mounted High voltage drive chips of this type are known as conventional symmetric pulse drive and asymmetric pulse drive.

However, as will be appreciated by those skilled in the art, the special driver circuit or driver components can be modified and thus of course provided for the pattern of through holes and for connecting to the driver circuit. It may affect the circuit pattern. The present invention, by way of example, allows the entire driver circuit or only a portion thereof to be mounted on the rear substrate. For example, instead of using high voltage packaged chips, bare silicon dies (chips) can be used on the substrate using conventional die attach methods, and conventional wire bonding techniques can be used to drive the chips onto the substrate. Can be connected to a circuit. In this case, the driver chip occupies a small area on the substrate, and the entire driver circuit can be arranged on the substrate. As a result, the ultra-thin display panel can be interfaced directly to the video signal and directly to the DC power source. Such displays are useful in ultra-thin portable products that require displays. Of course, the ability to mount the driver circuit on the back side of the board is applicable to any size display, and for relatively large displays, provides more space to place the drive circuit directly on the back side of the board. be able to.

The circuit connection state of the present invention is shown in FIGS. As mentioned above, special through holes and circuit patterns are provided for mounting the high voltage driver chip 30 on the opposite side of the back substrate for purposes of illustration. Special chip selection is Supertex HV702
2PJ is for connection to the column address line 14, and Supertex HV8308PJ and HV8408PJ (Supertex, Inc., Sunnyvale, Calif.) Are for connection to the row address line 24. The latter two chips differ in that one lead pattern is a mirror image of the other lead pattern.

Referring to the drawing, the EL laminate 10 is
Advantageously (though not necessarily), it consists of the two-layer dielectric layers 18, 20 of the invention, and thus is constructed from the rear substrate 12 towards the front-side. . The rear substrate 12 is perforated with through holes 32, the pattern of which is such that the substrate 12 and the through holes 32 are closest to both ends of the address lines 14, 24 (formed later). Has been done. Alternatively, additional through holes can be provided in a predetermined spaced relationship along the address line. This is useful for making a connection to the high resistance front ITO address line. The pattern of FIG. 4 is for connection to the EL laminate 10 on the rectangular substrate 12, where the rectangular substrate 12 is provided with column address lines (rear electrodes) 14 along a relatively long dimension and row address lines. The (front electrode) 24 is provided along a relatively short dimension.

The through holes 32 are preferably formed by laser. The holes 32 are typically spread out on one side due to the nature of the laser drilling process,
The side surface is selected to be the back surface or the opposite surface to facilitate passing the conductive material through the hole.

The substrate 12 used in the EL laminate should be such that it can reduce the temperatures encountered in subsequent processing steps. Typically, the substrates used are sufficient to firmly support the laminate, and temperatures above 850 ° C. to withstand subsequent firing sintering for thin film paste and sol-gel materials. It is stable against. Therefore, the substrate should be opaque to the laser light, so that the through holes 32 can be formed by laser drilling. Finally, the substrate should provide good adhesion of the thin film paste used in subsequent steps. Crystalline ceramic materials and non-conductive glassy materials are used. Alumina is particularly advantageous.

The circuit pattern 34 of the conductive material is printed on the rear surface of the substrate 12 in the pattern shown in FIG. In this step, the conductive material is drawn through the through hole 32, as described above. The circuit pattern 34 on the rear side of the substrate 12 includes a rear connector pad 36 around each through hole 32, a chip connector pad 38 for outputting a high-voltage driver chip (not shown), and a drive circuit (illustrated). Connector pad (not labeled) for connecting to the rest of the connector (not shown), and electrical leads (not labeled) between the multiple connector pads as shown.

The conductive material is preferably a conductive thin film paste applied by screen printing.

A vacuum is applied on the front side of the substrate 12 to form a conductive path through each through hole 32, while a circuit 34 is printed on the back side. This is advantageously achieved by placing the substrate 12 on a vacuum table with a master plate, the master plate having holes drilled in the pattern of FIG. 4 between the substrate 12 and the vacuum. is doing. Each hole on the master plate
Aligned and somewhat larger than the holes in substrate 12. No vacuum is applied until the circuit is printed to ensure that the vacuum is applied uniformly. The vacuum is continued until conductive material is drawn through to the front side of the substrate. At that point, a small amount of conductive material is drawn through to the front side of the substrate 12 to cover the through hole wall. The thin film paste is then fired according to known procedures.

Following this step, the circuit pad reinforcement pattern 42 is advantageously (but not necessarily) printed as shown in FIG. The printing and firing steps are followed, as is the conductive material.

Column address line 14 and connector pad 40
a, 40b are then formed on the front side of the substrate 12, preferably by screen printing a thin film conductive paste such as a silver / platinum paste. The address line pattern is shown in FIG.
2 along the longitudinal direction and has a row that ends at the front (row) connector pad 40a. During this same step, the front (row) connector pads 40b are provided to finally connect the row address lines to the drive circuit through the through holes 32. The conductive paste is advantageously
As described above, it is pulled out through the through hole 32, at which time a vacuum is applied from the rear circuit side of the substrate.

The means for forming the conductive paths through the through holes 32 is described in detail above because it is formed from a thin film conductive paste, which is electroplated as is known in the art. Formed like through-holes or such that the through-holes are formed by non-electrical plating, thus providing an electroplated material that is properly attached to the substrate, and subsequent layers are provided. Attached to the plate conductor.

The thin-film dielectric layer 18 of the present invention is then advantageously formed and fired as described above.

The rear circuit surface of the substrate is then advantageously sealed with a rear sealant 44, in which case the connector pads are attached to the high-voltage driver chip by screen printing, for example with a thin glass paste. And connector pins 45 are left exposed for mounting to the rest of the driver circuit (not shown). The sealing pattern is shown in FIG.

The EL laminate is then complemented by sol-gel layer 20, phosphor layer 22 and front row address lines 24. The pattern for the front row address lines 24 is shown in FIG. It consists of parallel rows across the thickness of the substrate 12 that terminate near the front (row) connector pads 40. If desired, electrical interconnections 46 between row address lines 24 and front (row) connector pads 40 are provided for reliable electrical connection purposes.
These are advantageously formed by printing a conductive material such as silver through a shadow mask in the pattern shown in FIG.

The above-mentioned front sealing layer 26 is provided for the purpose of preventing moisture permeation.

According to the invention, the front ITO address lines 24 of the EL laminate 10 are preferably formed by laser writing. This laser writing technique is shown in connection with the advantageous EL laminate 10 of the present invention. However, it should be understood that laser writing techniques have more widespread application when patterning planar laminates having upper and lower layers. In this regard,
The ITO and phosphor layers 24, 22 have upper layers that do not substantially absorb the laser light. Further, the thick film rounded niobium dielectric layer 18 and the rounded zirconate titanate sol-gel layer 20 have lower layers that do not absorb laser light.
Another typical material is Sn as a transparent (translucent) conductor.
It contains O ₂ and In ₂ O ₃ .

Usually, in the concept of the present invention, the upper layer is a material that transmits visible light and the lower layer is a material that does not transmit visible light. Therefore, the lower material is directly perforated and the upper layer is indirectly perforated. In this case, a laser beam having a wavelength in the visible region or in the infrared region of the electromagnetic spectrum is used for drilling. This laser drilling method is widely used in semiconductors, liquid crystal displays, solar cells and EL displays.

For the purpose of controlling the accuracy and resolution of the laser writing (depth and width of the incisions) and for avoiding explosive delamination of the layers and for minimizing interdiffusion between the layers. At that, certain properties of the material and the layer thickness should be adhered to.

The following relationship holds for the two-layer laminate:

[0110] However _{α u T u> α o T} o, α u = absorption coefficient of the lower layer, α _o = absorption coefficient of the upper layer, T _u = thickness of the lower layer, T _o = the upper layer thickness Now, it is more advantageous if the product α _u T _u is significantly larger than the product α _o T _o .

When a plurality of upper transparent layers and / or a plurality of opaque layers are provided, the product α _u for each layer
The sum of T _u should be greater than the sum of the products α _o T _o for each layer, ie Σ _i α _ui T _ui > Σ _i α _oi T _{oi when the} above function is maintained According to the steps of the invention, only a portion of the lower layer should be drilled directly, without cutting through its entire thickness, and indirectly through the entire thickness of the upper layer. Should be.

Explosive delamination may occur if heat or vapor pressure is formed in the lower layer before the upper layer can soften and / or vaporize due to indirect perforations. . Therefore, the material in the upper layer is
It should melt and vaporize at a lower temperature than the temperature at which the material in the lower layer melts and vaporizes.

It is advantageous to make the thermal conductivity of the material in the lower layer smaller than that of the material in the upper layer, for the purpose of improving the high-resolution cutting performance. The thermal conductivity of both layers is chosen such that no significant heat is dissipated from the area being drilled during this area being exposed to the laser light.

In order to avoid interdiffusion of substances between the layers, the diffusion time for this process should be longer than the time that the area to be perforated is exposed to the laser beam.

The above properties are known for materials,
It is possible to inform in advance which material is suitable for the laser writing process of the present invention.

Laser scoring resolution, explosive delamination and interdiffusion are also affected by laser beam energy and scanning speed. However, when the above relationships are observed, these other laser conditions are usually maintained and these other laser conditions are controlled and achieved to achieve the desired results of direct and indirect drilling. Changes are possible.

Laser beams providing a laser beam having a wavelength in the visible or infrared region are known. Carbon dioxide laser, argon laser and YAG laser are examples thereof. All lasers have wavelengths greater than 400 nm. Pulsed or continuous wave lasers can be used. The latter is advantageous for producing sharp, high resolution incisions. The laser beam is focused by a suitable lens arrangement. The purpose is to ensure sufficient local density for complete removal of the upper layer.
Usually, the energy density of the laser beam is set so that the groove to be cut is sufficiently larger than the thickness of the upper transparent layer. When the transparent layer contains electrode address lines,
This ensures that the address lines are clearly defined and electrically isolated.

Writing is performed by moving a laser beam with respect to the material to be written. More advantageously, this is done by placing the material to be written on an xy coordinate table which is movable relative to the laser beam.

For writing the address lines, a table movable in the x-direction (ie perpendicular to the address lines to be written) is advantageous, and the laser beam is movable in the y-direction, ie along the address lines. .

Materials that are vaporized or decomposed during laser writing can be removed from the material to be written by a vacuum provided near the laser beam.

An advantageous EL laminate 10, according to the invention,
A thin layer 24 of indium tin oxide is deposited on the phosphorus layer 22 by known methods. A vacuum deposition method for depositing ITO or a method for depositing ITO is described in US Pat.
It is shown in 568578 and 4849252. It is also possible to use tin oxide doped with a material other than ITO, for example with fluorine. An optically transparent dielectric layer can be provided between the ITO and the phosphor layers 24,22. A preferred sol-gel layer 20 of PZT and a thick film dielectric layer of dull niobium are provided below the phosphorus layer. The EL laminate 10 is formed in the reverse sequence of the conventional TFEL device, as described above. This leaves, as is conventional, an ITO layer 24 and a phosphor layer 22 suitable for laser writing according to the invention as an upper transparent layer above the lower opaque dielectric layers 18, 20.

The individual row address lines 24 are laser programmed as described above. The laser beam is the sol-gel layer 20.
Of the ITO and phosphorus layers 24, 2 by directly removing at least a portion of the
2 is indirectly removed over their thickness. This leaves a reliable insulating gap between adjacent address lines.

The row address line 24 is connected to the drive circuit described above. Specifically, with the advantageous through-hole connections described above, the electrical interconnect 46 (prior to laser writing) ultimately deposits the address lines by depositing silver in the pattern shown in FIG. It is formed at a position overlapping a part of the ITO layer.

The address lines are then written as described above.

The completed EL laminate can be sealed, as described above, by spraying a protective polymer seal on the front visible surface or by adhering a glass plate to the front surface.

The use of indirect perforations for writing transparent conductor material provides several advantages. Significantly lower energy connected wave lasers that deliver light in the visible region can be used rather than UV pulsed lasers with high instantaneous power. Not only does this laser reduce cost, it also produces smoother lines on the cuts that have been removed. This is extremely important for high resolution EL displays. Direct perforation of transparent material requires significantly higher instantaneous laser energy to deliver the energy required for perforation in a time short enough to prevent heat from spreading from the area where perforation occurs. In an attempt in the prior art to directly perforate a transparent conductor provided on a transparent substrate, only a small fraction of the laser energy is directly supplied by the transparent conductor material; the majority of the light is transparent to both. Pass through a layer. In many cases, indirect perforations minimize interdiffusion problems between layers. This is because the heat for vaporizing the transparent layer is generated from the bottom of the transparent layer. This facilitates external removal of the material to be perforated, rather than diffusion of the material into the underlying layer. This is important for maintaining the quality of the dielectric and phosphor layers in EL displays.

The invention is further illustrated by the following modified examples.

Example 1 This example is a thick film layer of barium titanate (Miya).
It is shown that the simple printing of materials used as ceramic sheets in Ta et al.) is subject to electrical breakdown under conditions.

The single-pixel electroluminescent element is a Coors ceramic (Grand Juncti).
on, Colorado, U .; S. It was formed on an alumina substrate (5 cm square, thickness 0.1 cm) obtained from A). A back electrode layer is abutted on the substrate centrally and away from the edges. The material used is a silver / platinum conductor. It is conventionally printed as an address line in electronics. For details, see Cermalloy #
C4747 (Cermalloy, Conshohoc)
(available from Ken, Pa) was screen printed as a thick film paste with a 320 mesh stainless steel screen and coated with a photosensitizer. The photosensitizer was irradiated with UV light through a photomask. Its purpose is to expose areas of the sensitizer retained for printing. The unexposed sensitizer was dissolved in water and removed. The paste is printed through the screen at this point. The remaining sensitizer was then further cured by additional light irradiation. The printed paste is dried in an oven at 150 ° C for a few minutes and then B with a temperature profile recommended by this pastemaker.
Heated in air in a TU model TFF142-790A24 belt furnace. The maximum process temperature was 850 ° C. The resulting thickness of the heated electrode conductor layer was about 9 microns.

The dielectric layer is formed on this electrode layer as follows. Barium titanate (ESL # 4520
-ElEctroscience Laborator
ies, King of Prussia, Penns
available from ylvania, dielectric constant 2500-30
00) is printed in a square pattern through a 200 mesh screen. As a result, everything was covered except for the electrical contact pads in the electrode lines. The printed dielectric paste was heated in air in a BTU furnace with a temperature profile recommended by the manufacturer (maximum temperature 900-1000 ° C). The thickness of the resulting heated dielectric is in the range 12-15 microns. The second and third layers of dielectric were then printed and heated in the same manner on the first layer. The combined thickness of the three printed and sintered dielectric layers is 40-5.
It is 0 micron.

A phosphorus layer was deposited directly onto the dielectric layer by known thin film techniques. Specifically, a 0.5 micron thick layer of copper sulfide doped with 1 mole percent of manganese was used as a UHV Instruments Mo
Deposited onto the dielectric layer using a del 6000 electron beam evaporator. These layers are heated under vacuum in a vapor deposition apparatus and maintained at a temperature of 150 ° C. during vapor deposition for approximately 2 minutes.

A phosphorus layer is coated with a 0.5 micron layer of transparent electrical conductor of indium tin oxide. This layer is deposited by known thin film deposition techniques,
In particular, it is deposited under vacuum at 400 ° C. using an electron beam evaporator.

The laminate is then placed in air for 15 minutes, 45
Treated at 0 ° C. for the purpose of annealing the phosphorous indium oxide conductor layer. An indium braze contact is provided on the ITO layer. This element is a silicone sealant (Silico
ne Resin Clear Lacqver, ca
t. # 419. M. G. Sealed by Chemicals).

The device is tested by applying a DC voltage between the two electrodes. It is observed whether this device fails under the application of a voltage that causes an electrical breakdown of the dielectric layer in the region in the immediate vicinity of the contact to indium tin oxide.

It is presumed that this device failure occurred because the dielectric layer did not form the smooth surface required for the phosphorus layer. Small cracks may be observed on the surface. However, this may also be due to the presence of disturbing materials in the commercially available dielectric paste. As such, barium titanate is not an indicator that it cannot be used as the single or first dielectric layer according to the present invention.

Example 2 This example shows a screen-printed dielectric consisting of a paste containing rounded niobate-this material is known to have a higher dielectric constant and lower sintering temperature than barium titanate. It is shown that the body layer gives a suitable dielectric constant but does not emit light.

The device has the same structure as in the first embodiment. However, niobate dielectric paste, Cermal
It has a dielectric layer composed of loy # IP9333 (dielectric constant about 3500, thickness the same as in Example 1).
The device, when tested, did not exhibit dielectric breakdown when a DC voltage of 400V was applied. However, no light was emitted even when an AC voltage was applied.

The fact that no light is emitted is due to a compatibility problem in connection with the phosphorus layer. This should not be an indicator that the round niobate salt cannot be used as the single or first dielectric layer according to the present invention.

This embodiment consists of 2 according to the invention.
The layer dielectric is shown. A first dielectric layer of rounded niobate (as in the second embodiment) and a second dielectric layer of rounded zirconate. The desired luminescence was achieved.

The same device as in Example 2 is constructed. However, there is the additional step of depositing a layer of dull zirconate (PZT) using a sol-gel process onto the printed and heated dielectric layer before the phosphorus layer is deposited. The sol was prepared as follows. Acetic acid is dehydrated at 105 ° C for 5 minutes. Twelve grams of acetic acid rounds were melted into 7 ml of 80 ° dehydrated acid for the purpose of forming a colorless solution. The solution was cooled and 5.54 g of zirconium propoxylate was mixed into the solution in order to form a blue-yellow solution. The solution was left at 60 ° -80 ° for 5 minutes, after which 2.18 g titanium isopropoxylated was added with stirring. The resulting solution remains. It was stirred in an ultrasonic bath to ensure that the solute melted. Then 1.75 ml of ethylene glycol, propanol,
A 4: 2: 1 solution of water was added in order to form a stable sol. More ethylene glycol was added prior to coating to adjust the viscosity to the desired value for spin coating or dipping. The prepared dielectric layer was spin coated or sol-dipped. For spin coating, the sol was dripping onto the first dielectric layer rotating in the horizontal plane at 3000 rpm. In the case of dipping, a higher viscosity sol was used. The substrate was lifted from the sol at a rate of 5 cm / min for the dipping process. The resulting coated assembly is then loaded with PZT sol.
Was heated in air in a furnace for 30 minutes at a temperature of 600 ° C. The thickness of the PZT layer was about 2-3 microns. It was observed that the surface of the PZT layer was significantly smoother than the surface of the screen printed and sintered first dielectric layer.

Following the deposition of the PZT layer, the phosphorus layer and the transparent layer are deposited as in Example 1.

The finished laminate was produced with emission-voltage characteristics similar to or better than those reported by Miyata et al. The threshold voltage for minimum brightness for the display was 110V.
The luminous intensity at 50 V above the threshold (ie 160 V, 60 Hz) was 57 foot lambert.

In this example, changes in the thickness of the dielectric layer affect the operating voltage and the brightness of the display.

The display was constructed as in Example 3. The difference was that only two screen printed dielectric layers were deposited instead of three. The thickness of the first dielectric layer was correspondingly reduced to 25-30 microns.

The threshold voltage for minimum brightness was expected to be 70 V (110 candles in Example 3) from theoretical considerations. Luminance at 50V above the threshold was also reduced to 35 foot lambs (57 candle light foot lams, Example 3).

Example 5 In this example, a drive circuit using a through hole is used.
1 illustrates an advantageous embodiment for connecting the row and row address lines of a laminate.

The addressable EL display is
It is constructed using the same sequence of layer deposition shown in Example 3. The substrate was 0.025 inch thick rectangular alumina. This alumina is Coors Cerami with dimensions of inches long and 2 inches wide.
cs (Grand Junction, Colora
do, U. S. Obtained from A). The substrate was drilled with 0.006 inch diameter through holes using the carbon dioxide laser in the pattern shown in FIG. The substrate is to ensure that all holes are clear,
Was inspected. The holes were found to be about 0.008 inch in diameter on the side facing the laser and about 0.006 inch on the opposite side. The side with the larger hole is
It was chosen on the backside of the substrate for the purpose of facilitating the insertion of a conductive material into the through hole.

Following this, the circuit pattern shown in FIG. 5 was printed with a 325 mesh stainless steel stainless steel screen using Cermalloy # 4740 silver platinum paste. During this printing process, the substrate is aligned with a master plate having 0.040 inch holes drilled in the same pattern as shown in FIG. 4 and further pulling out a conductive pace through through holes in the substrate. Therefore, a vacuum is applied under the master plate (that is, to the entire surface when viewed from the paper side of the substrate). This step formed the circuit pattern of FIG. 5 with conductive paths through each of the through holes in the substrate.
For the purpose of ensuring uniformity in the application of vacuum, the vacuum is
It is added only after the board is printed. This part ensures that the through holes are filled.

Subsequent to printing, the substrate was placed on a BTU model T with a temperature profile advanced by the paste manufacturer.
Heated in FF142-790A24. The maximum temperature was 850 ° C.

Following this step, the circuit reinforcing pattern shown in FIG. 7 is printed to heat the circuit backside of the substrate (using the same Cermalloy conductive paste). This step causes the circuit pattern to become thicker in certain areas where electrical connections are to be made substantially.

Column address lines and front row and column connector pads were then screen printed onto the front side of the substrate. The lines extended the length of the substrate to the row connector pads shown in FIG. The row connector pads shown in Figure 5 are printed in this same step. The column address lines and connector pads use the same printing and heating conditions and the same conductive paste (Ce
rmalloy # 4740). The substrate was positioned on the same master plate by the through holes of Figure 4, and a vacuum was applied from below to pull the conductive paste through the through holes to the back side of the substrate. The thickness of the heated electrode layer was about 8 micrometers. 52 address lines were formed per inch, and the total number of address lines was 68. This part was inspected to ensure that the through holes were filled.

Three-layer dielectric paste (Cermallo
y # IP9333) was printed and heated as shown in Example 3 for the purpose of forming a dielectric layer about 50 micrometers thick.

Next, the circuit back side of the substrate was sealed. Thick film glass paste (Heraeus IP9028, Her
aeus-Cermalloy, Conshohoc
en, manufactured by Pa) is 25 in the pattern shown in FIG.
Screen printed using a 0 mesh screen. Connector pads for connecting to the high voltage drive chip and to other drive circuits were not covered. The glass seal layer was then heated in the BTU belt furnace at temperatures up to 700 ° C. using the temperature profile recommended by the manufacturer.

During the aforementioned heating, the substrate was supported on a ceramic material member in order to avoid contact between the printed material on the circuit side and the belt of the furnace.

The sol-gel layer is formed substantially by immersion as described in Example 3. Three or four sol-gel layers are typically used. For example, one from a mix having a viscosity of approximately 100 cP as measured by a falling ball viscometer.
Used with a pooling rate of 0-25 sec / in. Between the dipping layers the sol-gel is dried at 110 ° C. for 10 minutes. The vacuum chuck is run over the active area of the laminate and the sol-gel is rinsed off the remaining area. The layer is then sintered in a belt furnace at about 660 ° C for 25 minutes. This achieves a total sol-gel thickness of between 3 and 10 μm. It is doped with 1% manganese 0.5-1.0
This is followed by the phosphorescent layer of Example 3 where μm thick zinc sulphide was used.

The rows of address lines are indium-tin-oxide deposited as previously described in Example 3 (pattern shown in FIG. 9). There are about 52 address line rows per inch, for a total of 256 rows. The spacing between lines is 0.001 inch and the line width is 0.019 inch (cent
er to center).

As in the pattern shown in FIG. 10, silver is deposited on the substrate through the shadow mask and through the hole conductors to form the electrical connections of the rows of address lines to the row connector pads.

The visible surface of the laminate is sealed with a silicone sealant. The silicone sealant is sprayed over the entire front surface of the display. This sealant has M.I. G. A chemical silicone resin clear lacquer, Cat # 419 is used.

The entire display is constructed by crossing a pair of column and row pads on a circuit provided on the rear side of the substrate at 60 Hz1.
It is tested by connection with a pulse generator which supplies a 60 V square wave signal. Each pixel of the display is based on individual illumination and has the same consistent intensity as measured in Example 3 when energized. The functionally impaired pixel is found out of all 17408 pixels.

Example 6 In this example, the indium-based EL laminate of the present invention was used.
An advantageous embodiment of a laser in which the tin-oxide-address lines are scribed is shown.

The addressable matrix display is constructed on a ceramic substrate used in the following process. This ceramic substrate has a thickness of 0.0
It is a 25 inch, 6 inch long, 2 inch wide rectangular alumina body, with Coors Ceramics (Grand)
Junction, Colorado, U.S.A. S. A)
Obtained from A hole having a diameter of 0.006 inches is formed in this substrate by using a carbon dioxide laser. This pattern is shown in FIG. Some of them are inspected to ensure that all these holes are penetrated.

Following this step, the circuit pattern shown in FIG. 5 is printed by a 325 mesh stainless steel screen (this screen is Cermal.
Loy (Conshohocken Pnnsylva
nia, U.S.A. S. A) # 4740 silver platinum paste is used). During the printing process, the substrates are arranged on the master plate. The master plate has 0.04 inch holes punched in the same pattern as the substrate to facilitate the supply of vacuum to the substrate holes during printing. The vacuum absorbs the paste through the holes to facilitate the formation of conductive paths through the ceramic substrate after some sintering. A portion of this is sintered in air in a BTU model TFF142-790A24 belt furnace with temperature data recommended by the paste manufacturer, a maximum temperature of 850 ° C. Following this step, the circuit reinforcement pattern shown in FIG. 7 is printed and sintered to the circuit side behind the substrate (again using the same "Cellmaloy" conductive paste described above). This step yields a relatively thick circuit pattern in the reliable area where electrical connections are subsequently made.

Following this, the set of address line columns and connector pads are printed on the visible front side of the substrate. These lines extend along the entire length of the board to the connector pads (FIG. 6). Rows of connector pads are formed in this step (FIG. 6). The address line row and column connector pad row are formed from the same silver-platinum paste used in the same printed and sintered state. The substrate is located on the same master plate with through holes in FIG. The vacuum is supplied from below to push the conductive paste toward the rear side of the substrate through the through hole. The thickness of the sintered electrode layer is about 8 μm. There are 52 address lines per inch, and the total number of address lines is 68.

Lead-niobate dielectric paste (Cerma
The next three layers of ILOY # IP9333) are then printed and sintered to the top of the address line row at the temperature conditions recommended by the manufacturer in belt fernance (maximum temperature 850 ° C.). The combined thickness of the dielectric layer is 50 μm.

Subsequent to this step, the circuit side behind the substrate is sealed according to the fifth embodiment whose pattern is shown in FIG.

A layer of lead zirconate titanate (PZT) 3-10 μm thick is then deposited on the lead niobate dielectric paste to form a smooth surface. The soaked sol-gel technique used according to Example 5 is used. The thin film phosphorescent layer is deposited by well-known evaporation using an electromagnetic beam. 1% of phosphorescent layer
It is zinc sulphate doped with manganese.
It is deposited over a thickness of between 0.5 and 1 μm.

The next step is to deposit a 300 nm thick layer of indium tin oxide (ITO) on top of the phosphor layer used for electromagnetic beam evaporation in the known manner.

This ITO layer is a 2watt CW of an argon ion laser which is inverted to a wavelength of 514.5nm.
(Continuous Wavelength) is used to pattern 256 address lines. The EL laminate is mounted on a movable X-axis table. This X-axis table moves the laminate perpendicular to the line being scribed by the laser beam. The laser beam is moved in the Y direction to scribe the line. The laser beam is focused on a 12 macrometer spot and the laser power is adjusted as follows. That is, the indium tin oxide and the underlying phosphorescent layer and about 10% of the underlying combined dielectric layer are arranged to be removed at the scanned location of the laser beam (about 1.8 W). . The scanning speed is about 100 mm / sec and 5 to provide the address lines with a depth of 6-8 μm or 3-4 μm with a gap of about 40 μm or 25 μm, respectively.
It is controlled to 00 mm / sec. The distance between the address lines (for example, between the line centers) is about 500 μm. Vacuum near the substrate stops evaporation and removal of material. In the pattern of the transparent electrode, the removal is completely performed at one time as shown in FIG. There are about 50 rows of address lines per inch on all displays, for a total of 256 columns.

Before the ITO column lines are scribed, the silver internal connections between the front (row) connector pads and the first ITO address lines pass through the shadow mask as shown in the pattern diagram of FIG. Screen printed from silver.

After laser scribing, the front view side of all displays is sprayed with a protective polymer coating (MG Chemical Silicon Lysine Clear Lacquer, cat # 419).

The display is then tested with the voltage across the selected pixel, supplied by connection with a pulsed power supply. This pulse power supply unit has 160
A pulse voltage of V is supplied at a repetition frequency of 64 Hz.
Each pixel is reliably illuminated with a light intensity corresponding to the single pixel device of the previous embodiment.

The address lines of the preferred embodiment basically provide something more sophisticated than that obtained by the photolithographic format.

IT is a typical example of a device that can be actually used.
The width of the O address line is 180 to 205 μm, and the gap between the lines is 65 to 80 μm. Starting from the above, according to the invention, a gap of 25 μm and 40 μm is produced depending on the scanning speed of the laser. Such a high solution allows for a relatively high ratio of active areas to the overall display. This is because a relatively wide ITO address line can be used with a relatively small gap.

Example 7 This example is represented by two layers dielectrically constructed according to the present invention. However, in this example, the first dielectric layer is formed from a paste having a higher dielectric constant than the paste used in Examples 3 and 4 above.

This device is constructed starting from example 3 above, however, the first dielectric layer is formed from a lead niobate paste. This paste is obtained as a high capacitance paste K from an electrochemical experiment using number 4210. About 1 for sintered paste
It has a dielectric constant of 0000. The first dielectric layer has a thickness of about 50μ. A thickness of about 5μ is applied to the sol-gel layer of PTZ as described in Example 3.

This device works with a threshold voltage of 91V and a luminous intensity of 50 foot Lamberts at 150V for minimum brightness.

Example 8 This example is represented by two dielectrically constructed layers.
In this case, the first dielectric layer is formed of lead niobate paste and the second dielectric layer is formed of lead lanthanum zirconate titanate paste (PLZT). This P
LZT has a dielectric constant of about 1000. This PLZ
In T, the mass ratio of zirconium: titanium: lanthanum is 52:32:16.

The device constructed as starting from Example 3 has a sol-gel layer produced as follows.

120 g of lead acetate with a purity of 99.5% are dissolved in 50 ml of glacial acetic acid. The solution is heated to 90 ° C. It is then held at this temperature for 2 minutes before being cooled to 70 ° C. Then add 55.4 grams of zirconium propoxede and heat the solution to 80 ° C.,
Hold at this temperature for 1 minute. After cooling to 70 ° C., 21.8 grams of titanium isopropoxide is added. Next, 11.4 grams of lanthanum nitrate is dissolved in 20 ml of glacial acetic acid and added to the solution. Finally, 10 ml of ethylene glycol, 5 ml of propane-2ol, 2.5 ml of demineralized water are added respectively in order to stabilize the solution and adjust the viscosity to a suitable value.

The PLZT sol-gel layer is used for the initial dielectric layer formed by dipping by means similar to that described in Example 3 above. The immersed part is PLZT
Sintered at 600 ° C. to convert to a second layer for. Four layers of PLZT are used by continuous dipping and sintering as described above to create a sufficiently smooth surface for the attachment of the phosphorescent layer. A total thickness of 5μ is obtained.

This device works with a threshold voltage of 75V and a luminous intensity of 37 foot Lamberts at 150V.

All the statements mentioned thus far are indicative of the special skill level of the skill type involved in the present invention. All statements are embodied with the same extent of reference as each individual statement is provided in detail and individually as referred to herein by reference.

The technical terms and expressions used herein are used as terms of description and not of limitation. Nor is it emphasized to the extent that it corresponds to the features shown and described above with respect to the use of such terminology and expressions. It is to be mentioned that the scope of the invention is defined and limited in the claims.

[0184]

The present invention provides improved electroluminescent laminate dielectric layer structures and methods of making the dielectric layer structures.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a laminated structure including two dielectric layers of the present invention.

2 is a plan view of the laminated structure of FIG. 1. FIG.

FIG. 3 is a cross-sectional view of a laminated structure cut along a row electrode showing an advantageous embodiment of connecting the column electrode address lines and the row electrode address lines with a voltage driving component of a voltage driving circuit.

FIG. 4 is a plan view of a rear substrate provided with an advantageous pattern of through holes for electrically connecting the address lines and the voltage-driven components of the driving circuit.

FIG. 5 is a plan view of an advantageous drive circuit pattern printed on the back side of the back substrate.

FIG. 6 is a plan view of column electrodes and row paths printed on the front side of the back substrate.

7 is a plan view of a circuit path reinforcing pattern advantageously printed on the drive circuit pattern of FIG.

FIG. 8 is a plan view of a sealing glass pattern advantageously printed on the drive circuit pattern and the circuit path reinforcing pattern of FIGS. 5 and 7;

FIG. 9 is a plan view of a row electrode line pattern.

10 is a plan view of an electrical connection printed between the row line of FIG. 9 and the row path of FIG.

[Explanation of symbols]

10 Dielectric layer structure 12 substrates 14 Back electrode 18 First dielectric layer 20 Second dielectric layer 22 Phosphorescent layer 24 Front electrode 26 Seal layer

Continued front page    (72) Inventor James Alexander Robert             Styles             Alberta Edmonton, Canada             12719-39 Avenue (No street number) (72) Inventor Ken Cock Who             Alberta Edmonton, Canada             10032−113 Street 10 (72) Inventor Philip Bailey             Alberta Edmonton, Canada             10011−89 Avenue 102 F-term (reference) 3K007 AB03 AB18 CA02 CC00 EC00                       EC03 FA01 GA00                 5G435 AA03 AA17 BB05 EE36 EE38                       EE41 KK05 KK09

Claims (44)

[Claims] 1. A method of forming an electroluminescent display panel electrically connected from an EL laminate to a voltage driving circuit, the EL laminate being sandwiched between a set of front and back sets of intersecting address lines. A backside address line, the backside address line being formed on a substrate having sufficient rigidity to support the laminate, the phosphorescent layer being formed from the backside address line by one or more dielectric layers. And a method of forming an electroluminescent display panel, optionally separated from the front address lines, comprising: (a) an address having sufficient rigidity to support the EL laminate and subsequently formed. Forming the substrate having a plurality of through holes patterned so as to be located near the end of the line A floor, and (b) forming a conductive path through each of the through holes in the substrate for electrically connecting each subsequently formed address line to the voltage driving circuit, and (c) on the substrate. Forming spaced back address lines, forming each back address line having one end terminating adjacent a through hole and electrically connected to said conductive path; and (d) said back address. Forming a dielectric layer on the line by sintering, (e) forming a phosphorescent layer on the dielectric layer, and (f) optionally forming a transparent dielectric layer on the phosphorescent layer. (G) forming a spaced front address line on the underlay phosphor or transparent dielectric layer, one end of which terminates adjacent to the through hole and is electrically connected to the conductive path. Address line shape And a step of: 2. The voltage driving circuit has a voltage driving component, and in the step (b), the voltage driving component is provided in a circuit pattern on the back surface of the substrate, and the output side of the component has each through-hole. The method of claim 1, wherein the circuit pattern is printed on the backside of the substrate in a pattern such that it is connected to the front and back address lines by conductive paths through the holes. 3. In step (b), a conductive material is deposited in each of the through holes to form a front connector path and a back connector path on each side of the substrate, the back connector path providing a back address line. Connected to a voltage driven component through a printed back circuit pattern, and in steps (c) and (g),
One end of the front and back address lines covers the front connector track, or additional conductive material is deposited between the front connector track and one end of the front and back address tracks. Item 2. The method according to Item 2. 4. The method of claim 3, wherein the substrate and the backside address line are made of a material that can withstand a temperature of about 850 ° C. 5. The method of claim 4, wherein the substrate is opaque and the through holes are formed by laser. 6. The method of claim 5, wherein the substrate is alumina. 7. The substrate is generally rectangular and the through holes are formed around the substrate adjacent to at least a front address line end and a back address line end that are subsequently formed on at least two sides of the substrate. The method of claim 4, wherein: 8. The method of claim 7, wherein the conductive material used in steps (b) and (c) is a fired thick film paste. 9. The conductive path, the backside circuit pattern, and the conductive material in the front and back connector tracks are calcined silver / platinum paste, used to connect the front side address lines to the front side connector tracks. 9. The method of claim 8 wherein said conductive material is silver. 10. In step (b), a conductor path through each of the through holes is formed from a thick film conductive paste printed with a circuit pattern on the backside of the substrate, the front connector path and the backside on both sides of the board. The backside connector track is electrically connected to the voltage drive circuit, and the front side connector track is formed in step (c), which is drawn through through holes in the substrate to form a connector track and fired. 3. The method of claim 2, further comprising electrically connecting the front address line to the front address line having a second conductive material in step (g). 11. The method of claim 10, wherein the substrate and the backside address line are formed of a material capable of withstanding a temperature of about 850 ° C. 12. The substrate is generally rectangular and the through holes are formed around the substrate adjacent the front address line end and the back address line end on at least two sides of the substrate. Claim 11 characterized by
The method described. 13. The thick film paste in steps (b) and (c) is a fired silver-platinum paste and the second conductive material in step (g) is silver. The method according to claim 12, wherein 14. The dielectric layer in step (d) is formed by depositing a ceramic material on the back electrode by a thick film technique, followed by sintering to a thickness of about 1.
A dielectric strength S greater than 0 × 10 ⁶ V / m, a permittivity such that the ratio of the permittivity of the dielectric material to the permittivity of the phosphor is greater than about 50: 1, and the formula d ₂ = V / A dielectric layer is formed having a thickness defined by S and having a thickness sufficient to prevent dielectric breakdown during operation, where d ₂ is the thickness of the dielectric layer, V is the maximum applied voltage, and said dielectric layer is The phosphorescent layer forms a surface adjacent to the phosphorescent layer that is sufficiently smooth to emit light uniformly at a predetermined excitation voltage, and the dielectric layer is in contact with the phosphorescent layer or with the phosphorescent layer. 11. The method of claim 10, wherein the layer separated from and in contact with the phosphorescent layer by at least one additional layer in contact is compatible with the phosphorescent layer. 15. The dielectric strength and permittivity of claim 104, wherein the dielectric layer is formed as at least two layers, the first dielectric layer is deposited on the back electrode by thick film technology and subsequently sintered. Has a value of where dielectric strength is first
Dielectric strength of the dielectric layer and the second dielectric layer of
105. The second dielectric layer has a surface deposited by sol-gel technology on the first dielectric layer and subsequently sintered, and has a surface proximate to the phosphorescent layer of claim 104.
105. The method of claim 104, wherein said dielectric layer and said second dielectric layer have the combined thickness of claim 14. 16. The first dielectric layer and the second dielectric layer are made of a ferroelectric ceramic material having a perovskite crystal structure, and the first dielectric layer is at least one.
16. The method of claim 15 having a dielectric constant of 000 and the second dielectric layer having a dielectric constant of at least 100 and a thickness of about 2-10 microns. 17. The first dielectric layer is produced by screen printing and sintering of a thick film dielectric paste, and the second dielectric layer is produced by a sol-gel technique followed by sintering. The method according to claim 16, wherein: 18. The first dielectric layer comprises lead niobate and the second dielectric layer comprises zirconate-lead titanate or lanthanate-zirconate-lead titanate. 17. The method according to 17. 19. A phosphorescent layer sandwiched between a front set and a back set of intersecting address lines, the backside address lines formed on a backside substrate, and one or two phosphorescent layers. In the method of producing an electroluminescent laminate of the type described above which is separated from the backside address line and optionally from the front side address line by (a) having sufficient rigidity to support said laminate. Forming a backside address line on the substrate, (b) forming a dielectric layer on the backside address line, (c) forming a phosphorescent layer on the dielectric layer, and (d) on the phosphorescent layer as required. By forming a transparent dielectric layer on the underlay layer and depositing a layer of the transparent conductive member on the underlay layer, the front address line is formed on the underlay phosphorescent layer or the transparent dielectric layer. The address lines are drawn by applying a focused laser beam along the area of the transparent conductive member between the address lines to be formed, and a part of the underlay dielectric layer is directly removed by the laser beam. And the laser beam is transparent such that the overlay phosphorescent layer and optionally the transparent dielectric layer and the transparent conductive member are indirectly removed over their entire thickness in the region between the address lines. A method of producing an electroluminescent laminate, characterized in that it has a wavelength that is not substantially absorbed by the conductive member, the transparent dielectric layer and the phosphorescent layer, but is absorbed by the underlay dielectric layer. 20. The method of claim 19, wherein the laser beam has a wavelength greater than about 400 nm. 21. The composition and thickness of said layers are Σ _i α _di T _di > Σ _i α _ti T _ti , where α _d is the absorptance of the underlay dielectric layer and α _t is the transmissivity. 21. The method of claim 20, wherein the absorptivity of the layer, T _d is the thickness of the underlay dielectric layer, and T _t is the thickness of the transparent layer. 22. The method of claim 21, wherein the transparent conductive member is indium tin oxide. 23. The dielectric layer underlaying the phosphorescent layer comprises:
It has a dielectric strength S greater than about 1.0 × 10 ⁶ V / m and a dielectric constant such that the ratio of the dielectric constant of the dielectric material to the dielectric constant of the phosphor is greater than about 50: 1. A flat layer of ceramic material bonded together, said dielectric layer having a thickness sufficient to prevent dielectric breakdown during operation as defined by the formula d ₂ = V / S, where , D ₂ is the thickness of the dielectric layer, V is the maximum applied voltage, and the dielectric layer is smooth enough to cause the phosphorescent layer to emit light uniformly at a predetermined excitation voltage. Forming an adjacent surface, wherein the dielectric layer is separated from and in contact with the phosphorescent layer by at least one additional layer in contact with the phosphor layer or in contact with the phosphor layer. 23. The layer of claim 22 which is compatible with the phosphorescent layer. How to list. 24. The dielectric layer comprises at least two layers, a first dielectric layer formed on the back electrode and having a thickness of about 500.
120. A second dielectric layer having a greater dielectric constant than is produced on the first dielectric layer and having a surface adjacent to the phosphorescent layer of claim 119, wherein the first dielectric layer and characterized in that said second dielectric layer has 10 to 300 thickness d ₂ in the range of microns combined, where S is the dielectric strength of the combination of the first and second dielectric layers Claim 2
3. The method described in 3. 25. The first dielectric layer and the second dielectric layer are made of a ferroelectric ceramic material having a perovskite crystal structure, and the first dielectric layer is at least 10.
00 and the second dielectric layer has a dielectric constant of at least 1
25. The method of claim 24 having a dielectric constant of 00 and a thickness of about 2-10 microns. 26. The first dielectric layer is produced by screen printing and sintering a thick film dielectric paste, and the second dielectric layer is produced by a sol-gel technique followed by sintering. The method according to claim 25. 27. The first dielectric layer comprises lead niobate and the second dielectric layer comprises zirconate-lead titanate or lanthanate-zirconate-lead titanate. 26. The method described in 26. 28. In an electroluminescent laminate, a back substrate, a back set of address lines arranged on the back substrate in parallel and spaced apart from each other, a dielectric layer on the back address line, and a dielectric layer on the dielectric layer. A phosphorescent layer, a transmissive dielectric layer optionally provided on the phosphorescent layer, and a translucent set on the front surface of the address line that is spaced parallel to each other on the phosphorescent layer. , The front address line intersects the back address line so that pixels are formed at the intersections, and the front address line is separated by a groove drawn by a laser, the groove being an underlay phosphorescence. An electroluminescent laminate characterized by extending through the layer to the underlay dielectric layer without penetrating it. 29. The dielectric layer on the backside address line has a dielectric strength S greater than about 1.0 × 10 ⁶ V / m.
And the ratio of the dielectric constant of the dielectric material to that of the phosphor is about 5
Having a flat layer of a sintered ceramic material, such as having a dielectric constant greater than 0: 1, said dielectric layer being defined by the formula d ₂ = V / S It has a thickness sufficient to prevent dielectric breakdown, where d ₂ is the thickness of the dielectric layer, V is the maximum applied voltage, and the dielectric layer is such that the phosphorescent layer is totally over a given excitation voltage. A surface adjacent to the phosphorescent layer that is sufficiently smooth to emit light uniformly to at least one of the dielectric layer in contact with or in contact with the phosphorescent layer. 29. The laminate of claim 28, wherein the layer separated from the phosphorescent layer by an additional layer and in contact with the phosphorescent layer is compatible with the phosphorescent layer. 30. The dielectric layer comprises at least two layers, a first dielectric layer formed on the back electrode and having a thickness of about 500.
126. A second dielectric layer having a higher dielectric constant than is produced on the first dielectric layer and having a surface adjacent to the phosphorescent layer of claim 125. characterized in that said second dielectric layer has 10 to 300 thickness d ₂ in the range of microns combined, where S is the dielectric strength of the combination of the first and second dielectric layers Claim 2
9. The laminate according to item 9. 31. The first dielectric layer and the second dielectric layer are made of a ferroelectric ceramic material having a perovskite crystal structure, and the first dielectric layer is at least 10%.
00 and the second dielectric layer has a dielectric constant of at least 1
31. The laminate of claim 30 having a dielectric constant of 00 and a thickness of about 2-10 microns. 32. The first dielectric layer is produced by screen printing and sintering of a thick film dielectric paste, and the second dielectric layer is produced by a sol-gel technique followed by sintering. The laminate according to claim 31, wherein: 33. The first dielectric layer comprises lead niobate and the second dielectric layer comprises zirconate-lead titanate or lanthanate-zirconate-lead titanate. 32. The laminate according to 32. 34. The laminate of claim 33, wherein the second dielectric layer is in contact with and compatible with the phosphorescent layer. 35. A method of laser patterning a flat laminate having at least one overlay layer and at least one underlay layer, wherein a focused laser beam is directed to an area of the laminate overlay layer of the pattern to be removed. Applied to the laser beam such that at least a portion of the underlay layer is directly removed while the overlay layer is indirectly removed over its thickness in the area of the pattern to be removed. , Having a wavelength that is not substantially absorbed by the overlay layer but is absorbed by the underlay layer. 36. The overlay layer is transparent to visible light, the underlay layer is non-transparent to visible light, and the wavelength of the laser beam is in the visible or infrared region of the electromagnetic spectrum. Claim 3 characterized by
The method according to 5. 37. The composition and thickness of said layer is Σ _i α _ui T _ui > Σ _i α _oi T _oi , where α _u is the absorptance of the underlay layer and α _o is the overlay layer. 36. The method of claim 35, wherein the absorptance, T _u is the underlay layer thickness and T _o is the overlay layer thickness. 38. The method of claim 37, wherein the layer is configured such that the overlay layer is vaporized at a lower temperature than the underlay layer. 39. The method of claim 38, wherein the layer is configured such that the overlay layer has a higher thermal conductivity than the underlay layer. 40. The method according to claim 35, wherein the overlay layer is a transparent conductive member, and an electrode pattern is drawn on the member. 41. The method of claim 40, wherein the electrode pattern is formed by moving one or both of the laminate and the laser beam relative to each other. 42. The laminate is an electroluminescent laminate having a phosphorescent layer sandwiched between a front set and a back set of intersecting address lines, the back address lines being formed on a back substrate. And the phosphorescent layer is separated from the backside address line by one or more dielectric layers, the overlay layer includes a frontside address line made of a transparent conductive member and a phosphorescent layer, and the underlay layer is 42. The method of claim 41, comprising one or more dielectric layers, wherein the electrode pattern comprises a plurality of address lines of a transparent conductive member spaced parallel to one another. 43. The method of claim 42, wherein a portion of the dielectric layer is directly removed, and the phosphor and the transparent conductive member are indirectly removed over their entire thickness. . 44. The method of claim 43, wherein the transparent conductive member is indium tin oxide.