JP2003152158A - 半導体素子を実装した電子部品及びその製造方法 - Google Patents

半導体素子を実装した電子部品及びその製造方法

Info

Publication number
JP2003152158A
JP2003152158A JP2001344147A JP2001344147A JP2003152158A JP 2003152158 A JP2003152158 A JP 2003152158A JP 2001344147 A JP2001344147 A JP 2001344147A JP 2001344147 A JP2001344147 A JP 2001344147A JP 2003152158 A JP2003152158 A JP 2003152158A
Authority
JP
Japan
Prior art keywords
semiconductor element
circuit surface
electronic component
protruding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001344147A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003152158A5 (enrdf_load_stackoverflow
Inventor
Kazuji Azuma
和司 東
Kazuya Atokawa
和也 後川
Kazuyuki Tomita
和之 冨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001344147A priority Critical patent/JP2003152158A/ja
Publication of JP2003152158A publication Critical patent/JP2003152158A/ja
Publication of JP2003152158A5 publication Critical patent/JP2003152158A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001344147A 2001-11-09 2001-11-09 半導体素子を実装した電子部品及びその製造方法 Withdrawn JP2003152158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001344147A JP2003152158A (ja) 2001-11-09 2001-11-09 半導体素子を実装した電子部品及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001344147A JP2003152158A (ja) 2001-11-09 2001-11-09 半導体素子を実装した電子部品及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003152158A true JP2003152158A (ja) 2003-05-23
JP2003152158A5 JP2003152158A5 (enrdf_load_stackoverflow) 2005-07-07

Family

ID=19157713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001344147A Withdrawn JP2003152158A (ja) 2001-11-09 2001-11-09 半導体素子を実装した電子部品及びその製造方法

Country Status (1)

Country Link
JP (1) JP2003152158A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015230990A (ja) * 2014-06-05 2015-12-21 株式会社日立製作所 パワー半導体装置および樹脂封止型モータ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015230990A (ja) * 2014-06-05 2015-12-21 株式会社日立製作所 パワー半導体装置および樹脂封止型モータ

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