JP2003151916A - レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 - Google Patents
レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法Info
- Publication number
- JP2003151916A JP2003151916A JP2002225628A JP2002225628A JP2003151916A JP 2003151916 A JP2003151916 A JP 2003151916A JP 2002225628 A JP2002225628 A JP 2002225628A JP 2002225628 A JP2002225628 A JP 2002225628A JP 2003151916 A JP2003151916 A JP 2003151916A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- irradiation
- substrate
- irradiation surface
- laser beams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 138
- 238000000034 method Methods 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims description 205
- 230000001678 irradiating effect Effects 0.000 claims description 43
- 230000003287 optical effect Effects 0.000 claims description 42
- 239000011521 glass Substances 0.000 claims description 14
- 239000010979 ruby Substances 0.000 claims description 7
- 229910001750 ruby Inorganic materials 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 27
- 238000009826 distribution Methods 0.000 abstract description 9
- 239000010408 film Substances 0.000 description 247
- 239000010410 layer Substances 0.000 description 104
- 239000012535 impurity Substances 0.000 description 39
- 239000013078 crystal Substances 0.000 description 36
- 239000000463 material Substances 0.000 description 32
- 239000003566 sealing material Substances 0.000 description 22
- 238000005530 etching Methods 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 239000004973 liquid crystal related substance Substances 0.000 description 18
- 230000006870 function Effects 0.000 description 16
- 239000011159 matrix material Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 239000011229 interlayer Substances 0.000 description 12
- 230000033001 locomotion Effects 0.000 description 11
- 238000002425 crystallisation Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000001133 acceleration Effects 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 238000000137 annealing Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000006911 nucleation Effects 0.000 description 6
- 238000010899 nucleation Methods 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 239000003870 refractory metal Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005984 hydrogenation reaction Methods 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000005499 laser crystallization Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- YLYPIBBGWLKELC-RMKNXTFCSA-N 2-[2-[(e)-2-[4-(dimethylamino)phenyl]ethenyl]-6-methylpyran-4-ylidene]propanedinitrile Chemical compound C1=CC(N(C)C)=CC=C1\C=C\C1=CC(=C(C#N)C#N)C=C(C)O1 YLYPIBBGWLKELC-RMKNXTFCSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 102100032566 Carbonic anhydrase-related protein 10 Human genes 0.000 description 1
- 102100032244 Dynein axonemal heavy chain 1 Human genes 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 101000867836 Homo sapiens Carbonic anhydrase-related protein 10 Proteins 0.000 description 1
- 101001016198 Homo sapiens Dynein axonemal heavy chain 1 Proteins 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002225628A JP2003151916A (ja) | 2001-08-03 | 2002-08-02 | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-237097 | 2001-08-03 | ||
| JP2001237097 | 2001-08-03 | ||
| JP2002225628A JP2003151916A (ja) | 2001-08-03 | 2002-08-02 | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009136617A Division JP5227900B2 (ja) | 2001-08-03 | 2009-06-05 | 半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003151916A true JP2003151916A (ja) | 2003-05-23 |
| JP2003151916A5 JP2003151916A5 (enExample) | 2008-09-04 |
Family
ID=26619970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002225628A Withdrawn JP2003151916A (ja) | 2001-08-03 | 2002-08-02 | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003151916A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007165716A (ja) * | 2005-12-15 | 2007-06-28 | Advanced Lcd Technologies Development Center Co Ltd | レーザー結晶化装置及び結晶化方法 |
| US7879700B2 (en) | 2003-02-25 | 2011-02-01 | Samsung Electronics Co., Ltd. | Crystallization apparatus and method of amorphous silicon |
| KR101521104B1 (ko) * | 2009-05-15 | 2015-05-20 | 주식회사 디엠에스 | 선택적 에미터 형성용 확산장치 |
| CN109891554A (zh) * | 2016-10-06 | 2019-06-14 | 株式会社日本制钢所 | 激光照射装置以及半导体器件制造方法 |
| CN114078978A (zh) * | 2020-12-18 | 2022-02-22 | 帝尔激光科技(无锡)有限公司 | 太阳能电池选择性发射极的制备方法和制备设备 |
| WO2022102538A1 (ja) * | 2020-11-11 | 2022-05-19 | 株式会社日本製鋼所 | レーザ照射装置、及び半導体装置の製造方法 |
| CN116230502A (zh) * | 2021-12-02 | 2023-06-06 | 细美事有限公司 | 用于处理基板的装置和用于处理基板的方法 |
-
2002
- 2002-08-02 JP JP2002225628A patent/JP2003151916A/ja not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7879700B2 (en) | 2003-02-25 | 2011-02-01 | Samsung Electronics Co., Ltd. | Crystallization apparatus and method of amorphous silicon |
| JP2007165716A (ja) * | 2005-12-15 | 2007-06-28 | Advanced Lcd Technologies Development Center Co Ltd | レーザー結晶化装置及び結晶化方法 |
| KR101521104B1 (ko) * | 2009-05-15 | 2015-05-20 | 주식회사 디엠에스 | 선택적 에미터 형성용 확산장치 |
| CN109891554A (zh) * | 2016-10-06 | 2019-06-14 | 株式会社日本制钢所 | 激光照射装置以及半导体器件制造方法 |
| US11676818B2 (en) | 2016-10-06 | 2023-06-13 | Jsw Aktina System Co., Ltd | Laser irradiation apparatus and method for manufacturing semiconductor device |
| CN109891554B (zh) * | 2016-10-06 | 2023-06-30 | Jsw阿克迪纳系统有限公司 | 激光照射装置以及半导体器件制造方法 |
| WO2022102538A1 (ja) * | 2020-11-11 | 2022-05-19 | 株式会社日本製鋼所 | レーザ照射装置、及び半導体装置の製造方法 |
| JP2022077121A (ja) * | 2020-11-11 | 2022-05-23 | Jswアクティナシステム株式会社 | レーザ照射装置、及び半導体装置の製造方法 |
| JP7579112B2 (ja) | 2020-11-11 | 2024-11-07 | Jswアクティナシステム株式会社 | レーザ照射装置、及び半導体装置の製造方法 |
| CN114078978A (zh) * | 2020-12-18 | 2022-02-22 | 帝尔激光科技(无锡)有限公司 | 太阳能电池选择性发射极的制备方法和制备设备 |
| CN116230502A (zh) * | 2021-12-02 | 2023-06-06 | 细美事有限公司 | 用于处理基板的装置和用于处理基板的方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5227900B2 (ja) | 半導体装置の作製方法 | |
| US7326630B2 (en) | Method of fabricating semiconductor device utilizing laser irradiation | |
| US7445974B2 (en) | Laser beam irradiating apparatus, laser beam irradiating method, and method of manufacturing a semiconductor device | |
| JP5078205B2 (ja) | レーザ照射装置 | |
| JP5205431B2 (ja) | レーザ照射装置 | |
| US7759181B2 (en) | Method of manufacturing a semiconductor device | |
| US7787187B2 (en) | Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device | |
| JP2003045820A (ja) | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 | |
| US7026227B2 (en) | Method of irradiating a laser beam, and method of fabricating semiconductor devices | |
| KR100871449B1 (ko) | 반도체장치 제작방법 | |
| JP4827305B2 (ja) | 半導体装置の作製方法 | |
| JP2003151916A (ja) | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 | |
| JP2002305208A (ja) | 半導体装置の作製方法 | |
| JP2002270510A (ja) | 半導体装置の作製方法 | |
| JP2002261013A (ja) | レーザ照射方法並びに半導体装置の作製方法 | |
| JP2003218058A (ja) | レーザ照射方法および半導体装置の作製方法 | |
| JP2003218056A (ja) | レーザ照射方法および半導体装置の作製方法 | |
| JP2002305148A (ja) | 半導体装置の作製方法 | |
| JP2002057344A (ja) | 半導体装置の作製方法 | |
| JP2002329668A (ja) | 半導体装置の作製方法 | |
| JP2003218055A (ja) | レーザ照射装置 | |
| JP4131792B2 (ja) | レーザ照射装置およびレーザ照射方法、並びに結晶性半導体膜の作製方法 | |
| JP2007129257A (ja) | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 | |
| JP2003218057A (ja) | レーザ照射装置 | |
| JP2003158089A (ja) | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050727 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060210 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080717 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090331 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090414 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090605 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090901 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20120229 |