JP2003142882A - Board conveyance device and board conveyance method in electronic part mounting line - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board conveyance device and a board conveyance method in an electronic part mounting line by which the board can be conveyed according to production form and the productivity be also improved. SOLUTION: This board conveyance device is used to convey a board 1 from the upstream side to downstream side in an electronic part mounting line where electronic part mounting devices are arranged in series. Bypass conveyor units BC1 and BC2 respectively provided with upper- and lower-stage conveyors for respectively conveying not-mounted boards and mounted boards specially are arranged above electronic part mounting devices M1 and M2, and a lifter conveyor L2 is provided to distribute the boards 1 to the electronic part mounting devices M1 and M2 and to the bypass conveyor units BC1 and BC2, respectively. Thus, the board 1 can be carried in/out in one electronic part mounting device regardless of the operation state of the other electronic part mounting devices, and it is conveyed corresponding to the production form selected in accordance with the kind of board, resulting in improving the productivity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board carrying device and a board carrying method for carrying a board in an electronic part mounting line for mounting electronic parts on the board.

[0002]

2. Description of the Related Art In electronic component mounting equipment for mounting electronic components on a board, a plurality of electronic component mounting apparatuses are generally arranged in series to form an electronic component mounting line in order to increase production capacity. In such a mounting line, the mounting work is performed on one board that is transported from the upstream side to the downstream side. The form of this mounting work may differ depending on various conditions such as the board type and the production quantity. Many.

That is, various forms such as a flow work method of sequentially mounting electronic components on one board by each mounting apparatus, an individual mounting method of completing mounting work on one board by one mounting apparatus, etc. Is selected. And, since the requirements for the board transfer mechanism that supplies the unmounted boards to each electronic component mounting apparatus and collects the mounted boards differ greatly depending on these production modes, high efficiency can be achieved while supporting various production modes. In order to realize a manufacturable electronic component mounting line, it is desirable that the board transfer mechanism of the electronic component mounting line be as flexible as possible.

[0004]

However, the conventional electronic component mounting line has not realized a substrate transfer mechanism that satisfies both conditions of supply of unmounted substrates and recovery of mounted substrates. For this reason, when performing mounting work for a wide variety of boards, the board transfer mode does not always match the production mode depending on the production mode, and as a result, the productivity decreases due to the waiting time in the board transfer operation. Was unavoidable.

Therefore, an object of the present invention is to provide a board carrying device and a board carrying method in an electronic component mounting line which can carry a board according to a production mode and improve productivity.

[0006]

According to a first aspect of the present invention, there is provided a board transfer device in an electronic component mounting line, wherein the board is upstream of the board in an electronic component mounting line in which a plurality of electronic component mounting apparatuses for mounting electronic components are arranged in series. Between the two electronic component mounting apparatuses, which is a substrate transporting apparatus for transporting the electronic component mounting apparatus from the second side to the downstream side, the substrate transporting section being arranged in the substrate transport direction corresponding to each of the electronic component mounting apparatuses. And a second transport unit that transports an unmounted substrate, wherein the substrate transport unit has a first transport unit that transports an unmounted substrate, and the substrate transport unit has a first transport unit that transports an unmounted substrate. , The unmounted substrate received from the upstream first transport unit is passed to either the downstream electronic component mounting apparatus or the first transport unit, and either the upstream second transport unit or the electronic component mounting apparatus From Passing only loaded-board taken downstream to the second conveyor section.

According to a second aspect of the present invention, there is provided a method of transporting a board in an electronic component mounting line, wherein a substrate is transported from an upstream side to a downstream side in an electronic component mounting line in which a plurality of electronic component mounting apparatuses for mounting electronic components on the substrate are arranged in series. A method of carrying a board, comprising: a first carrying section for carrying an unmounted board and a second carrying section arranged in a board carrying direction corresponding to each of the electronic component mounting apparatuses and carrying a mounted board. And an electronic component mounting apparatus on the downstream side, or an unmounted substrate which is arranged between at least two adjacent electronic component mounting apparatuses and which is received from the upstream first transport section. Substrate transfer device for transferring the mounted substrate to any one of the second transfer unit on the upstream side and the mounted substrate received from the second transfer unit on the upstream side or the electronic component mounting apparatus to the second transfer unit on the downstream side. Therefore, the board carrying step of carrying the board includes a board carry-in step of transferring the unmounted board received from the first carrying section on the upstream side to the electronic component mounting apparatus by the board allocating means, and the unloaded board During a component mounting process of mounting an electronic component on a mounting substrate, a mounted substrate receiving process of receiving a mounted substrate that has been mounted by the electronic component mounting device by a substrate allocating means, and a component mounting process of one electronic component mounting device. An unmounted board bypass step of transferring the unmounted board received from the first transfer section on the upstream side of the electronic component mounting apparatus to the downstream side by bypassing the electronic component mounting apparatus by the first transfer section; During the component mounting process in one electronic component mounting device, the electronic component mounting device upstream of the electronic component mounting device or the second transfer By the second transfer unit is already mounted substrate received from and a loaded-board bypass step of conveying to the downstream side by bypassing the electronic component mounting apparatus.

According to the present invention, during the component mounting process in one electronic component mounting apparatus, the unmounted substrate received from the first transport unit on the upstream side of the electronic component mounting apparatus is transferred to the electronic unit by the first transport unit. The electronic component mounting apparatus or the second electronic component mounting apparatus, which bypasses the component mounting apparatus and is transported to the downstream side, and which is upstream.
By mounting the mounted substrate received from the transport unit of the second transport unit on the downstream side by bypassing the electronic component mounting apparatus by the second transport unit, the operating state of the other electronic component mounting apparatus is set in one electronic component mounting apparatus. Carrying in substrates regardless of
It is possible to carry out the substrate, and it is possible to improve the productivity by carrying the substrate according to the production mode selected according to the substrate type.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a board distributing operation in the electronic component mounting line according to an embodiment of the present invention, FIGS. FIG. 6 is an explanatory diagram of a board transfer operation in the electronic component mounting line according to the embodiment of the present invention.

First, with reference to FIG. 1, an electronic component mounting line, an electronic component mounting apparatus and a substrate transfer apparatus which constitute the electronic component mounting line will be described. In FIG.
The electronic component mounting line includes three electronic component mounting apparatuses M1, M2, M3 and an electronic component mounting apparatus M1, which are arranged in series.
By bypass conveyor units BC1, BC2, BC3 arranged above M2, M3, and four lifter conveyor units L1, L2, L3, L4 arranged before and after these electronic component mounting devices and bypass conveyor units. It is configured. In this configuration, the bypass conveyor units BC1, BC2, BC3 and the lifter conveyor devices L1, L2, L3, L4 constitute a substrate transfer device that transfers a substrate on which electronic components are mounted from the upstream side to the downstream side.

Next, the electronic component mounting apparatus M1, M2, M3
The configuration of will be described. Electronic component mounting apparatus M1, M
2 and M3 perform the mounting operation on the board to be mounted 2
Two mounting parts (11, 12), (21, 22), (31,
32) are respectively arranged in series, and a board (an unmounted board) in a state where no electronic component is mounted is carried into each of these mounting parts, and after mounting is performed in each mounting part. It is equipped with mounting conveyors 13, 23, and 33 for carrying out substrates (mounted substrates). In each of the electronic component mounting apparatuses M1, M2, M3, electronic components are sequentially mounted by the two mounting portions on the board to be mounted,
As a result, the predetermined mounting work is completed and the mounted board is produced.

Bypass conveyor units BC1, BC
2 and BC3 are electronic component mounting apparatuses M1, M2, respectively.
It is a substrate transfer unit arranged in the substrate transfer direction corresponding to M3, and includes upper bypass conveyors B1U, B2U, B3U and lower bypass conveyors B1L, B2L, B3L each having a fixed height position.

Lower bypass conveyors B1L, B2L, B
3L is a dedicated conveyor (first transfer unit) for transferring an unmounted board on which electronic parts are not yet mounted, and upper bypass conveyors B1U, B2U, B3U transfer mounted boards on which electronic parts are mounted. It is a dedicated conveyor (second transport section) for Each of these bypass conveyors is provided with a sensor for detecting the board and a stopper for stopping the board, so that the board can be stopped at a predetermined board standby position and stocked on the bypass conveyor. ing.

Next, the lifter conveyor device will be described. The lifter conveyor device is an electronic component mounting device M1, M
2, M3 and bypass conveyor units BC1, BC
It serves as a board distribution means for carrying out a distribution operation for selectively transferring the board between the substrates 2 and BC3.

Of these lifter conveyor devices, the lifter conveyor device L1 located on the upstream side of the electronic component mounting device M1 is a substrate 1 (unmounted substrate) carried in from the upstream side.
Is provided with a lifter conveyor LC1 for delivering the sheet to the downstream side. The lifter conveyor LC1 can move up and down between the height level of the mounting conveyor 13 and the height level of the lower bypass conveyor B1L, and as shown in FIG.
The substrate 1 loaded onto the lifter conveyor LC1 from the upstream side
Can be distributed and delivered to the mounting conveyor 13 of the electronic component mounting apparatus M1 or the lower bypass conveyor B1L of the bypass conveyor unit BC1.

The lifter conveyor devices L2 and L3 have the same structure and are provided with lifter conveyors LC2 and LC3, respectively. In the following description, only the lifter conveyor device L2 will be described. The lifter conveyor LC2 is composed of an upper conveyor L2U and a lower conveyor L2L, and the upper conveyor L2U and the lower conveyor L2L can be integrally lifted and lowered.

When the lifter conveyor LC2 is raised, the upper conveyor L2U and the lower conveyor L2L are located at the same height level as the upper bypass conveyors B1U, B2U and the lower bypass conveyors B1L, B2L of the bypass conveyor units BC1, BC2, respectively. . Then, in this state, as shown in FIG. 2B, the mounted board 1 (mounted board) is received from the upstream upper bypass conveyor B1U and is transferred to the upper bypass conveyor B2U of the downstream bypass conveyor unit BC2. hand over.

Upstream side bypass conveyor unit BC1
Board 1 received from lower bypass conveyor B1L
As for (unmounted board), the lower bypass conveyor B2L on the downstream side is passed as it is on the lower conveyor L2L.
And the lower conveyor L2L that has received the substrate 1 is lowered to the height level of the mounting conveyor 23, and the mounting conveyor 23 of the electronic component mounting apparatus M2 on the downstream side.
The substrate 1 is distributed by selectively performing the substrate supply and transfer to the substrate.

Further, as shown in FIG. 2 (c), the upper conveyor L2U which has received the board 1 (mounted board) from the mounting conveyor 13 of the electronic component mounting apparatus M1 on the upstream side is lifted, and the bypass conveyor unit on the downstream side is raised. The substrate can be collected and conveyed to the upper bypass conveyor B2U of BC2.

Lifter conveyor device L4 located at the most downstream
Includes a lifter conveyor LC4 for carrying out the substrate 1 (mounted substrate) received from the upstream electronic component mounting apparatus M3 to the downstream side. The lifter conveyor LC4 is
It is possible to move up and down between the height level of the mounting conveyor 33 and the height level of the upper bypass conveyor B3U of the bypass conveyor unit BC3, and as shown in FIG. 2D, the mounting conveyor 33 or the upper bypass conveyor B3.
The substrate 1 received from any of U is carried out to the downstream side.

In the above arrangement of the lifter conveyor device,
Between two adjacent electronic component mounting apparatuses M1 and M2 and M
The lifter conveyor devices L2 and L3, which are arranged between the M2 and M3 and serve as board distribution means, transfer the unmounted board received from the lower bypass conveyor of the upstream bypass conveyor unit to the mounting conveyor of the downstream electronic component mounting apparatus or From either of the lower conveyors L2L and L3L (first board distribution unit) to be delivered to any of the lower bypass conveyors of the bypass conveyor unit, and the upper bypass conveyor of the upstream bypass conveyor unit or the mounting conveyor of the electronic component mounting apparatus. It is configured to include the upper mounted conveyors L2U and L3U (second substrate distributing section) that transfer the mounted board received to the upper conveyor of the bypass conveyor unit on the downstream side.

In the above structure, the bypass conveyor units BC1 and BC composed of upper and lower two-stage bypass conveyors are provided above the electronic component mounting apparatuses M1, M2 and M3.
Although the example in which 2 and BC3 are provided is shown, the bypass conveyors may be provided in two rows in parallel on the same plane. Further, the bypass conveyor may be divided and a plurality of conveyors may be connected in series so that a plurality of substrates can be stocked on each bypass conveyor.

Further, the lifter conveyor devices L2, L3 as the board distributing means are constituted by lower conveyors L2L, L3L dedicated to unmounted boards and upper conveyors L2U, L3U dedicated to mounted boards.
The unmounted board received from the lower bypass conveyor of the upstream bypass conveyor unit by a single conveyor is passed to either the mounting conveyor of the electronic component mounting device on the downstream side or the lower bypass conveyor of the bypass conveyor unit, and the upstream bypass. The mounted board received from either the upper bypass conveyor of the conveyor unit or the mounting conveyor of the electronic component mounting apparatus may be delivered to the upper conveyor of the downstream bypass conveyor unit.

The electronic component mounting line is constructed as described above, and a method of carrying the substrate in the electronic component mounting line will be described below with reference to FIGS.
3 to 6, subscripts a, b, c, d, ... Are added to the substrate 1 to be transported in the order of loading to the mounting line to distinguish the individual substrates, and no electronic components are mounted yet. In order to distinguish an unmounted board from a mounted board after mounting, the mounted board (including the board being mounted in the mounting portion in the drawing) is hatched.

First, in FIG. 3 (a), the unmounted substrate 1a is carried into the lifter conveyor LC1 from a printing device (not shown) on the upstream side. This substrate 1a passes through the lifter conveyor LC1 as it is, and as shown in FIG.
Transfer to the mounting conveyor 13 of the electronic component mounting apparatus M1 to reach the mounting unit 11. Then, the mounting unit 11 mounts the electronic component on the substrate 1a.

At this time, a new substrate 1b is carried into the lifter conveyor LC1 and the lifter conveyor LC1 on which the substrate 1b is placed rises. Then, as shown in FIG. 3C, the substrate 1b transfers to the lower bypass conveyor B1L and moves to the lower conveyor L2L of the lifter conveyor device L2. Then, as shown in FIG. 3D, a lifter conveyor LC2 in which the substrate 1b is placed on the lower conveyor L2L.
Is lowered, the board 1b is transferred from the lower conveyor L2L to the mounting conveyor 23 of the electronic component mounting apparatus M2, and the mounting section 21 is moved.
Move to. Then, in parallel with this operation, a new substrate 1c is carried into the lifter conveyor LC1.

Next, as shown in FIG. 4A, the substrate 1c
The lifter conveyor LC1 on which the
The lifter conveyor LC2 rises. In this state, the substrate 1c is the lower bypass conveyor B1L, the lower conveyor L
2L and the lower bypass conveyor B2L are sequentially moved to the downstream side, and as shown in FIG. 4B, the substrate 1c is moved to the lower conveyor L3L of the lifter conveyor device L3. Then, the lifter conveyor LC3 having the substrate 1c placed on the lower conveyor L3L is lowered.

At this time, the mounting section 11 of the electronic component mounting apparatus M1 completes mounting on the board 1a, and the board 1a moves to the mounting section 12. In addition, the lifter conveyor LC1
A new substrate 1d is loaded. And after this,
As shown in (c), the substrate 1d is a lifter conveyor LC1.
To the mounting unit 11. Also, lifter conveyor device L
In 3, the substrate 1c moves from the lower conveyor L3L to the mounting portion 31 of the electronic component mounting apparatus M3, and then the lifter conveyor LC3 moves up, and in the lifter conveyor apparatus L2, the lifter conveyor LC2 moves down.

Thereafter, as shown in FIG. 4D, a new substrate 1e is carried into the lifter conveyor LC1 and the substrate 1e
The lifter conveyor LC1 on which the
In the electronic component mounting apparatus M1, the substrate 1a that has been mounted by the mounting unit 12 is transferred to the upper conveyor L2U, and then the lifter conveyor LC2 having the substrate 1a mounted on the upper conveyor L2U rises.

Then, as shown in FIG. 5A, the substrate 1e
From lifter conveyor LC1 to lower bypass conveyor B1
While passing through L and moving to the downstream side, the substrate 1a moves from the upper conveyor L2U to the upper bypass conveyor B2U,
Pass B3U sequentially and move to the downstream side. In the electronic component mounting apparatus M2, the board 1b that has been mounted by the mounting unit 21 moves to the mounting unit 22.

Then, as shown in FIG. 5B, the substrate 1
e and the substrate 1a are transferred to the lower conveyor L2L and the lifter conveyor LC4, respectively, and then the lifter conveyor LC
2, LC4 goes down. Then, as shown in FIG. 5C, the substrate 1e moves from the lower conveyor L2L to the mounting portion 21 of the electronic component mounting apparatus M2, and the substrate 1a is carried out from the lifter conveyor LC4 to the downstream side. Further, at this time, a new substrate 1f is carried into the lifter conveyor LC1 and thereafter the lifter conveyor LC1 on which the substrate 1f is placed rises.

Thereafter, as shown in FIG. 5D, the substrate 1f
Is the lower bypass conveyor B1L, the lower conveyor L2L,
The lower bypass conveyor B2L is sequentially moved to the downstream side.
Then, the lifter conveyors LC1 and LC3 descend and the lifter conveyor LC4 rises, and in the electronic component mounting apparatus M3, the board 1c on which the mounting in the mounting unit 31 is completed.
Moves to the mounting unit 32.

Next, as shown in FIG. 6A, a new substrate 1g is carried into the lifter conveyor LC1 and after the substrate 1d is moved to the mounting portion 12 in the electronic component mounting apparatus M1, the substrate 1g is transferred to the lifter conveyor LC1. To mounting section 11
Move to. In the electronic component mounting apparatus M2, the mounting unit 2
Substrate 1b, which has been mounted in No. 2, is the upper conveyor L3
After moving to U, the lifter conveyor LC3 having the substrate 1b placed on the upper conveyor L3U moves up.

Then, as shown in FIG. 6B, the substrate 1b
Moves to the lifter conveyor LC4 after passing through the upper bypass conveyor B3U, and then the lifter conveyor LC4 on which the substrate 1b is placed descends. The substrate 1f moved to the downstream side is transferred to the lower conveyor L3L, and then the lifter conveyor LC3 in which the substrate 1f is placed on the lower conveyor L3L.
Goes down. Then, a new substrate 1h is carried into the lifter conveyor LC1, and then the lifter conveyor LC1 on which the substrate 1h is placed moves up.

Thereafter, as shown in FIG. 6C, the substrate 1b
Are carried out to the downstream side from the lifter conveyor LC4. Then, the substrate 1h is transferred to the lower conveyor L2L, and then the lifter conveyor LC2 is lowered, so that the substrate 1h shown in FIG.
As shown in FIG. 5, the electronic component mounting apparatus M2 is moved to the mounting section 21. Then, a new substrate 1 is attached to the lifter conveyor LC1.
i is carried in, and the same substrate transfer operation is repeated thereafter.

That is, in the above-described board transfer method, the unmounted board received from the lower bypass conveyor on the upstream side is delivered to the electronic component mounting apparatus by the upper conveyor of the lifter conveyor apparatus (board loading step), and the electronic component mounting apparatus is not yet loaded. Electronic components are mounted on the mounting board (component mounting process). Then, the mounted board, which has been mounted by the electronic component mounting apparatus, is received by the upper conveyor of the lifter conveyor apparatus on the downstream side (mounted board receiving step).

Then, during the component mounting process in which the mounting operation is performed by one electronic component mounting apparatus, the lower bypass conveyor of the bypass conveyor unit on the upstream side of the electronic component mounting apparatus passes through the upper conveyor of the lifter conveyor. The unmounted board received by is bypassed to the electronic component mounting apparatus by the lower bypass conveyor provided above the electronic component mounting apparatus and is conveyed to the downstream side (unmounted substrate bypass step).

Further, during the component mounting process in one electronic component mounting apparatus, the mounted substrate received from the electronic component mounting apparatus on the upstream side of the electronic component mounting apparatus or the upper bypass conveyor of the bypass conveyor unit is
Similarly, an upper bypass conveyor provided above the electronic component mounting apparatus bypasses the electronic component mounting apparatus and conveys it to the downstream side (mounted board bypass step).

As a result, in an electronic component mounting line constructed by arranging a plurality of electronic component mounting apparatuses in series,
Regardless of the operating state of one electronic component mounting device, it is possible to supply an unmounted substrate to an electronic component mounting device that requires a substrate, and to carry out a mounted substrate on which mounting has been completed. The device can be carried out to the downstream side regardless of the operating state of another electronic component mounting device.

In the board bypass process of the unmounted board and the mounted board, since the bypass paths of the mounted board and the unmounted board are completely separated from each other, the unmounted board and the mounting which have occurred in the conventional bypass conveyor are mounted. It is possible to prevent the complicatedness of the finished board, and to carry in the board at the necessary timing without any time lag in each electronic component mounting device.
It can be carried out.

Further, even if the electronic component mounting apparatus located in the middle of the mounting line is in a stopped state due to a setup change work or maintenance inspection for product type switching, other electronic components located upstream and downstream The mounting apparatus can continue the normal operation state without being affected by this stop.

As described above, in the electronic component mounting line in which a plurality of electronic component mounting apparatuses are arranged in series, the substrate transfer apparatus is configured as described above, so that the operating state of each electronic component mounting apparatus is always optimized. Therefore, it is possible to prevent the occurrence of dead time such as waiting time caused by the relation with other devices, and improve the operation rate of the electronic component mounting line.

Further, by adopting such a configuration, a flow work mode in which electronic components are sequentially mounted on one board by a plurality of electronic component mounting apparatuses, and mounting work on one board is performed by one electronic component. The individual mounting form completed by the mounting device can be selected according to the type of the substrate.

That is, when it is possible to distribute the mounting work on one board to a plurality of electronic component mounting devices while maintaining a good line balance, a flow work form by division of labor in the plurality of electronic component mounting devices is selected. On the contrary, if it is difficult to maintain the line balance, the individual mounting form is selected. As a result, various mounting forms can be selected according to the type of the board, and the occurrence of dead time in each electronic component mounting device can be eliminated as much as possible to improve the overall operation efficiency.

[0045]

According to the present invention, during the component mounting process in one electronic component mounting apparatus, the unmounted substrate received from the first transporting unit on the upstream side of the electronic component mounting apparatus is transferred by the first transporting unit. The electronic component mounting apparatus is bypassed to be transported to the downstream side, and the mounted board received from the upstream electronic component mounting apparatus or the second transport section is bypassed to the electronic component mounting apparatus by the second transport section. Since one electronic component mounting device can carry in and carry out the substrate regardless of the operating state of the other electronic component mounting device, the production form selected according to the substrate type can be achieved. It is possible to improve the productivity by carrying out a suitable substrate transfer.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a board distribution operation in the electronic component mounting line according to the embodiment of the present invention.

FIG. 3 is an explanatory diagram of a board transfer operation in the electronic component mounting line according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram of a board transfer operation in the electronic component mounting line according to the embodiment of the present invention.

FIG. 5 is an explanatory diagram of a board transfer operation in the electronic component mounting line according to the embodiment of the present invention.

FIG. 6 is an explanatory diagram of a board transfer operation in the electronic component mounting line according to the embodiment of the present invention.

[Explanation of symbols]

1, 1a, 1b, 1c ... Substrate M1, M2, M3 Electronic component mounting device 11,12,21,22,31,32 Mounting part 13,23,33 mounting conveyor L1, L2, L3, L4 lifter conveyor device LC1, LC2, LC3, LC4 lifter conveyor L2U, L3U upper conveyor L2L, L3L lower conveyor BC1, BC2, BC3 Bypass conveyor unit B1U, B2U, B3U Upper bypass conveyor B1L, B2L, B3L Lower bypass conveyor

Continued front page    (72) Inventor Wataru Hidese             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Yuji Ogata             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5E313 AA11 DD02 DD12 DD50 EE22                       FG01 FG02

Claims (2)

[Claims] 1. A substrate transfer device for transferring a substrate from an upstream side to a downstream side in an electronic component mounting line in which a plurality of electronic component mounting devices for mounting electronic components on a substrate are arranged in series. 2 which are adjacent to at least the substrate transfer section arranged in the substrate transfer direction corresponding to each of the
A circuit board allocating unit disposed between two electronic component mounting apparatuses, wherein the circuit board transfer section has a first transfer section for transferring the unmounted board and a second transfer section for transferring the mounted board. Then, the board allocating means transfers the unmounted board received from the upstream-side first transfer section to either the downstream-side electronic component mounting apparatus or the first transfer section, and the upstream-side second transfer section.
The board transfer device in the electronic component mounting line, wherein the mounted board received from either the transfer part or the electronic part mounting apparatus is transferred to the second transfer part on the downstream side. 2. A board transfer method for transferring a board from an upstream side to a downstream side in an electronic part mounting line in which a plurality of electronic part mounting apparatuses for mounting electronic parts on a board are arranged in series. A board transfer section having a first transfer section arranged in the board transfer direction for transferring an unmounted board and a second transfer section for transferring a mounted board, and at least two adjacent board transfer sections. The unmounted board that is arranged between the electronic component mounting apparatuses and received from the upstream first transport section is passed to either the downstream electronic component mounting apparatus or the first transport section, and the upstream second transport is performed. The board transfer step of transferring the board by the board transfer device including the board distributing means for transferring the mounted board received from either the mounting section or the electronic part mounting apparatus to the second transfer section on the downstream side. Dress A board loading step of delivering the unmounted board received from the upstream first transfer unit by the board allocating means, a component mounting step of mounting an electronic component on the unmounted board in the electronic component mounting apparatus, A mounted board receiving step of receiving a mounted board, which has been mounted by the component mounting apparatus, by a board allocating means, and a first transfer section on the upstream side of the electronic component mounting apparatus during the component mounting step of one electronic component mounting apparatus. A non-mounting board bypass step of transporting the unmounted board received from the first transport unit to the downstream side by bypassing the electronic component mounting apparatus, and mounting the electronic component during the component mounting step in one electronic component mounting apparatus The mounted substrate received from the electronic component mounting apparatus on the upstream side of the device or the second transfer unit is transferred by the second transfer unit. Substrate transfer method in an electronic component mounting line, characterized in that bypassing the component mounting apparatus and a loaded-board bypass step of conveying to the downstream side.