JP2666077B2 - Substrate transfer device - Google Patents

Substrate transfer device

Info

Publication number
JP2666077B2
JP2666077B2 JP63296223A JP29622388A JP2666077B2 JP 2666077 B2 JP2666077 B2 JP 2666077B2 JP 63296223 A JP63296223 A JP 63296223A JP 29622388 A JP29622388 A JP 29622388A JP 2666077 B2 JP2666077 B2 JP 2666077B2
Authority
JP
Japan
Prior art keywords
rack
board
mounting
substrate
racks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63296223A
Other languages
Japanese (ja)
Other versions
JPH02143597A (en
Inventor
秀俊 佐々木
俊士 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63296223A priority Critical patent/JP2666077B2/en
Publication of JPH02143597A publication Critical patent/JPH02143597A/en
Application granted granted Critical
Publication of JP2666077B2 publication Critical patent/JP2666077B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、電子部品実装の分野における基板搬送装置
に関するものである。
Description: TECHNICAL FIELD The present invention relates to a substrate transfer device in the field of electronic component mounting.

(従来の技術及び発明が解決しようとする課題) 一般に基板搬送装置は、電子部品実装機と組み合わせ
て使用することにより、部品実装を自動的且つ連続的に
行うことができるようにするものである。
(Problems to be Solved by the Related Art and the Invention) In general, a board transfer device enables automatic and continuous component mounting by using it in combination with an electronic component mounter. .

この装置は、次の3種類に分類される。 This device is classified into the following three types.

(1)基板積み重ね供給装置のみのもの 部品の装着されていない基板を積み重ね、それらを一
枚ずつ実装機へ送り出す供給装置である。
(1) Only a substrate stack supply device This is a supply device for stacking substrates on which components are not mounted and sending them one by one to a mounting machine.

(2)収納装置を備えたもの この収納装置は、完成基板の収納だけを行う装置であ
る。
(2) Equipped with a storage device This storage device is a device that only stores completed substrates.

(3)バッファ型収納装置を備えたもの このバッファ型収納装置は、複数の実装機を連結して
使用する場合に、実装機間に組み込まれて使用されるも
ので、前工程の実装機で処理された基板が後工程の実装
機へ運ばれる前に一時的に基板を収納する装置である。
(3) Equipped with a buffer-type storage device This buffer-type storage device is used by being incorporated between mounting machines when a plurality of mounting machines are connected and used. This is a device that temporarily stores a processed substrate before it is carried to a mounting machine in a later process.

収納装置を備えた従来の基板バッファ装置の動作原理
を、第3図の概略図により説明する。基板バッファ装置
1は、実装機A,Bのバランス調整を行うためにこれらの
中間に位置し、実装機Aで実装された基板aは、バッフ
ァ装置1の基板ストッカー(ラック)Lに順次ストック
されていく()。そして、実装機Bの基板要求が来て
()初めて実装機Bに供給されていく()。
The operation principle of the conventional substrate buffer device provided with the storage device will be described with reference to the schematic diagram of FIG. The board buffer device 1 is located in the middle of these to adjust the balance of the mounting machines A and B, and the board a mounted by the mounting machine A is sequentially stocked in the board stocker (rack) L of the buffer machine 1. To go(). Then, the board is supplied to the mounting machine B for the first time when a board request from the mounting machine B comes ().

ここで、実装エラーや基板切れによる機械停止が生じ
た場合、次に示すような問題点が発生する。
Here, when the machine stops due to a mounting error or a cut-out of the board, the following problems occur.

(1)実装機Bに基板要求のない場合、Aを基板供給不
能にさせないために、満杯にストックされたラックを人
手により取り除き、空ラックをセットする必要があり、
本来の目的であるオペレータ人員の削減にならない。
(1) When there is no request for a board from the mounting machine B, it is necessary to manually remove the fully stocked rack and set an empty rack in order to prevent A from becoming unable to supply the board.
It does not reduce the number of operators, which is the original purpose.

(2)ラックの基板ストック枚数が40枚と少ないため、
後連結でのトラブル対応力が不足している。
(2) Since the number of boards in the rack is as small as 40,
The ability to respond to troubles in post-connection is insufficient.

(課題を解決するための手段) 本発明は、基板を複数枚収納可能なラックを所定位置
に保持し、基板に電子部品を実装する2台の実装機の間
に介在して、一方の実装機から基板をラック内へ収納
し、ラック内から他方の実装機へ基板を搬送する基板搬
送装置であって、複数個のラックを載置し、かつラック
の少なくとも1つを所定位置へ順次供給するため移送す
る搬入手段と、所定位置から搬出されるラックを複数個
載置し、かつラックを基板搬送装置外へ移送する搬出手
段を備えているものである。
(Means for Solving the Problems) According to the present invention, a rack capable of accommodating a plurality of substrates is held at a predetermined position, and one rack is interposed between two mounting machines for mounting electronic components on the substrates. A board transfer device that stores a board from a machine into a rack and transfers the board from the rack to another mounting machine, where a plurality of racks are placed and at least one of the racks is sequentially supplied to a predetermined position. And a carrying-out means for mounting a plurality of racks carried out from a predetermined position and transferring the racks out of the substrate carrying apparatus.

(作 用) 本発明は上記の構成により、後工程の実装機に基板要
求のない場合でも、前工程の実装機で搬送した基板をラ
ックに収納し、満杯になると搬出コンベア(搬出手
段),搬入コンベア(搬入手段)により各々ラックの搬
出,空ラックの搬入を行わせることができる。そのた
め、先の問題点(1)にある満杯にストックされたラッ
クを満杯ごとに人手により取り除き、空ラックをセット
する作業が無くなり、24時間稼動システムの実現に寄与
できる。また、搬出コンベアから満杯になったラックを
別ラインの実装機への供給を可能とするため、基板に対
応したプログラム実装,FMS対応の実現も図ることができ
る。
(Operation) According to the above configuration, even when there is no requirement for a board in a post-process mounting machine, the present invention stores the board conveyed by the mounting machine in the preceding process in a rack, and when the board becomes full, a conveyer (carry-out means), A carry-in conveyor (carry-in means) can carry out each rack and carry in an empty rack. For this reason, the rack (1) that has been fully stocked is manually removed every time the rack is full, and the work of setting an empty rack is eliminated, thereby contributing to the realization of a 24-hour operation system. In addition, since a full rack can be supplied from a carry-out conveyor to a mounting machine on another line, it is possible to implement a program corresponding to a board and realize FMS.

問題点(2)については、後工程実装機の基板要求と
同時に搬入コンベアにより引き続き基板の供給を行わせ
るため、ラックにストックされた枚数分だけ後工程に直
接流すことができる。
Regarding the problem (2), the board is continuously supplied by the carry-in conveyor simultaneously with the board request of the post-process mounting machine, so that the number of sheets stored in the rack can be directly flowed to the post-process.

(実施例) 以下に、本発明の基板搬送装置の一実施例を、図面を
参照しながら説明する。
(Embodiment) Hereinafter, an embodiment of the substrate transfer device of the present invention will be described with reference to the drawings.

第1図は本発明装置の概略図であり、同図(a)は実
装機を含む全体を上から見た図であるが、基板供給・収
納装置10は実装機A,Bの間に位置することは変わらない
が、ラックLが満杯になった時に自動的にラックを搬出
し、空ラックを供給できるようにラインに直角に搬入,
搬出コンベア11,12を取り付けてある。同図(b)はそ
れを側面から見た図である。
FIG. 1 is a schematic view of the apparatus of the present invention, and FIG. 1 (a) is a view of the whole including a mounting machine as viewed from above. The same operation is performed, but when the rack L is full, the rack is automatically unloaded and loaded at right angles to the line so that empty racks can be supplied.
The unloading conveyors 11 and 12 are attached. FIG. 2B is a view of the side view.

通常は、実装機A,Bのラインバランスを調整するため
に、実装機Aで実装完成させた基板を一時ストックし次
の実装機Bへ流すという→というコースを採ってい
たが、一時ストックが満杯になると実装機Aを供給不能
にさせてしまう。そうさせないために、人手によってラ
ックを交換するという作業を行っていたわけであるが、
本発明を採用することにより、第1図(b)に示すよう
にラックの交換を自動的に行うことができ(,)、
後工程がラックからの基板要求のない時にも、前工程を
止めることなしに運転させることができる。後工程の基
板要求が復帰後、満杯ラックは流れ()を行い、実装
機Bに再び基板が供給される。
Normally, in order to adjust the line balance of the mounting machines A and B, a course of temporarily storing the board completed by the mounting machine A and flowing it to the next mounting machine B was adopted. When it becomes full, the mounting machine A is made unsuppliable. In order to prevent this, we had to replace the rack manually.
By adopting the present invention, the rack can be automatically replaced as shown in FIG.
Even when the post-process does not require a board from the rack, the operation can be performed without stopping the pre-process. After the request for the substrate in the post-process returns, the full rack flows (), and the substrate is supplied to the mounting machine B again.

また、この装置は実装機AからFMS対応として別ライ
ンへ流すことも可能とする。
Also, this device can be flown from the mounting machine A to another line as FMS compatible.

次に、第2図にそのフローチャートを示す。まず初め
に、実装機Aで実装が完成された(S1)後に、Aから基
板取り出しの信号が入力されたかどうかの判断をする
(S2)。入力された時は、次にラックに基板が満杯にな
ったかどうかを判断し(S3)、まだストック可能な時は
そのまま基板が取り込まれ、満杯になった時はコンベア
回転を行い、ラックを交換した(S4)後に基板の収納を
行う(S5)。その後、実装機Bからの基板要求信号が入
力された時(S6)、基板を実装機Bへ送り出す(S7)。
信号がない場合は、再び前工程からの基板取り出し信号
の入力待ちを行う。
Next, FIG. 2 shows the flowchart. First, after the mounting is completed by the mounting machine A (S 1 ), it is determined whether or not a signal for taking out the substrate has been input from A (S 2 ). When the input is made, it is next determined whether or not the board is full in the rack (S 3 ). If the board is still available, the board is taken in as it is. If the board is full, the conveyor is rotated and the rack is rotated. was replaced (S 4) performs a receiving substrate after (S 5). Then, when the substrate request signal from the mounting machine B is input (S 6), feeding the substrate to the mounting unit B (S 7).
If there is no signal, the system waits again for the input of the substrate take-out signal from the previous process.

(発明の効果) 以上のように、本発明の基板搬送装置は、実装機間の
作業速度のバランスを調整するために、実装機間のバッ
ファ可能な基板枚数を自動的に変化させることができ、
24時間稼動システム及びFMS対応の実現を図ることがで
きる。
(Effect of the Invention) As described above, the substrate transfer apparatus of the present invention can automatically change the number of substrates that can be buffered between mounting machines in order to adjust the balance of the working speed between the mounting machines. ,
A 24-hour operation system and FMS support can be realized.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の一実施例を示す概略図、第2図は同実
施例のフローチャート、第3図は従来の基板搬送装置の
概略図である。 A,B……実装機、a……基板、L……基板ストッカー
(ラック)、10……基板供給,収納装置、11……搬入コ
ンベア、12……搬出コンベア。
FIG. 1 is a schematic view showing an embodiment of the present invention, FIG. 2 is a flowchart of the embodiment, and FIG. 3 is a schematic view of a conventional substrate transfer apparatus. A, B: mounting machine, a: substrate, L: substrate stocker (rack), 10: substrate supply / storage device, 11: carry-in conveyor, 12: carry-out conveyor.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】基板を複数枚収納可能なラックを所定位置
に保持し、基板に電子部品を実装する2台の実装機の間
に介在して、一方の実装機から基板を前記ラック内へ収
納し、前記ラック内から他方の実装機へ基板を搬送する
基板搬送装置であって、 複数個のラックを載置し、かつ前記ラックの少なくとも
1つを前記所定位置へ順次供給するため移送する搬入手
段と、前記所定位置から搬出されるラックを複数個載置
し、かつ前記ラックを当該基板搬送装置外へ移送する搬
出手段とを備え、前記所定位置において、前記ラックは
前記搬入手段から前記搬出手段へ相互に移動される構成
としたことを特徴とする基板搬送装置。
1. A rack capable of accommodating a plurality of substrates is held at a predetermined position, and is interposed between two mounting machines for mounting electronic components on the substrates, and a substrate is inserted into the rack from one of the mounting machines. A board transfer device for storing and transferring a board from inside the rack to another mounting machine, wherein a plurality of racks are placed and at least one of the racks is transferred to be sequentially supplied to the predetermined position. Carrying-in means, and carrying-out means for mounting a plurality of racks carried out from the predetermined position, and transferring the racks out of the substrate transfer device. A substrate transport device, wherein the substrate transport device is configured to be mutually moved to an unloading means.
JP63296223A 1988-11-25 1988-11-25 Substrate transfer device Expired - Fee Related JP2666077B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63296223A JP2666077B2 (en) 1988-11-25 1988-11-25 Substrate transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63296223A JP2666077B2 (en) 1988-11-25 1988-11-25 Substrate transfer device

Publications (2)

Publication Number Publication Date
JPH02143597A JPH02143597A (en) 1990-06-01
JP2666077B2 true JP2666077B2 (en) 1997-10-22

Family

ID=17830773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63296223A Expired - Fee Related JP2666077B2 (en) 1988-11-25 1988-11-25 Substrate transfer device

Country Status (1)

Country Link
JP (1) JP2666077B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586832A (en) * 1981-06-30 1983-01-14 Shinkawa Ltd Magazine conveyor
JPS63139811A (en) * 1986-11-29 1988-06-11 Toshiba Corp Manufacturing device for sheet

Also Published As

Publication number Publication date
JPH02143597A (en) 1990-06-01

Similar Documents

Publication Publication Date Title
JP3075305B2 (en) Assembly equipment
JP4342185B2 (en) Substrate carrying-in method and substrate production system in mounting line
JP2666077B2 (en) Substrate transfer device
JPH10190299A (en) Electronic-component mounting line and electronic-component mounting method
JP2642800B2 (en) Pallet knitting system
JP2571635Y2 (en) Tray parts supply device
JP2523760Y2 (en) Parts supply device
JP5615025B2 (en) Substrate production apparatus and substrate work apparatus
JP2870758B2 (en) Parts supply and transport system equipment
JP2520508Y2 (en) Parts aligner
JP3081019B2 (en) Injection control system
WO2023203610A1 (en) Substrate production system
JP3421966B2 (en) Component mounting method, multi-component mounting device, and mounting component sorting method
JP3081020B2 (en) Production control system
JPH0722780A (en) Mounting installation for printed circuit board
JPH03141697A (en) Tray automatic supplying apparatus
JP2003204193A (en) Apparatus and method for mounting electronic component
JPH06338698A (en) Packaging method by automatic packaging device for component group
JP2002246793A (en) Electronic component mounting apparatus and electronic component mounting method
JPH05104350A (en) Assembling unit
JPS6118605A (en) Conveying apparatus
JP3334228B2 (en) Substrate transfer method and substrate transfer device
JPH06177591A (en) Printed board installation machine
JP2507816B2 (en) Buffer device and printed board manufacturing device
JP2637228B2 (en) Picking work system

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees