JP2003133535A - Package for housing imaging element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that damage to a cover and a decrease in the reliability of hermetical sealing cannot be prevented effectively. SOLUTION: The package for housing an imaging element comprises an insulating base 1 having a recess 1a for mounting the imaging element 4 on an upper surface, and a transparent cover 2 connected to the upper surface of the base 1 so as to cover the recess 1a via a sealer 3. The cover 2 is formed of a plate material 2a made of glass, and an optical plate material 2b made of at least a single lithium niobate plate X which is adhered to the upper surface of the material 2a via a resin adhesive 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing an image pickup device for protecting a semiconductor device from mechanical shock or thermal shock from the outside or intrusion of moisture, and more particularly,
The present invention relates to a package for storing an image pickup device, which has a color image pickup device such as a CCD / CMOS image sensor exceeding 2 million pixels.

[0002]

2. Description of the Related Art In recent years, a camera including an image pickup device such as a CCD or CMOS has been rapidly reduced in size, thickness, and price, and along with this, optical functional parts such as a package for storing an image pickup element. The lightness, thinness, shortness and miniaturization or the reduction of parts are progressing.

Such an optical functional component generally has a lens made of a glass material or a plastic material for focusing an image and guiding it to an image pickup device, and a crystal having a birefringence effect or a phase effect for preventing an image moire. Optical low-pass filter consisting of, infrared cut filter containing metal complex to correct reddish color tone, lid made of borosilicate glass plate and aluminum oxide sintered body or aluminum nitride sintered body / mullite The image pickup device housing package is made of an electrically insulating material such as a sintered body or a silicon nitride sintered body, and is made of an insulating base having a recess for mounting a semiconductor element.

However, in such an optical functional component structure, it is difficult to reduce the thickness due to the restriction of the member thickness for obtaining individual characteristics, and as a result, the camera body cannot be downsized.

In order to solve such a problem, Japanese Patent Laid-Open Publication No.
In 2000-114502, a crystal having a function of an optical low-pass filter is used as a lid of a package for housing an image sensor, and an infrared shielding function is added by applying a dielectric multilayer film to the lid, It has been proposed to make the optical functional component thinner.

Further, it has been proposed to use lithium niobate, which has a larger birefringence than that of quartz, as a lid to further reduce the thickness of optical components.

[0007] According to this proposal, the lid body is provided with Ta ₂ 0 ₅ · TiO ₂ · on the entire surface of one side of the lithium niobate plate having a birefringence effect or a phase effect or in an effective area for image recognition.
_{Nb 2 0 5 · LaF 3 ·} La 2 O 3 · Ta 2 O 5 · ZrO 2 · Y
₂ O ₃ high refractive index thin film layer in which the refractive index is 1.7 or more dielectric such as _{SiO 2 · Al 2 O 3 ·} MgF 2 · Na 3 AlF 6 , etc. the refractive index of the is 1.6 or less dielectric low-refractive A dielectric multi-layered film formed by alternately laminating several tens of thin film layers
By using the D method, the sputtering method, the vacuum deposition method, or the like to form an adhesive film having an infrared shielding function, the space required to install the optical low-pass filter and the infrared cut filter can be reduced, This means that the camera can be made thinner.

The reason why the infrared ray cutting function is imparted by applying a multilayer film to the lithium niobate plate is as follows. Generally, the optical film thickness (λ / 4: λ is the design wavelength) is represented by the product (n × d) of the refractive index (n) of the material forming the thin film layer and the shape film thickness (d). Therefore, by appropriately selecting the material and shape film thickness of the thin film layer and stacking a plurality of thin film layers to control the transmission / reflection of light having a wavelength in a specific range, it is possible to impart an infrared cut function to the lithium niobate plate. is there. The lid made of a lithium niobate plate usually has one lithium niobate plate,
Alternatively, it is formed by laminating a plurality of lithium niobate plates having a birefringence effect or a phase effect.

[0009]

However, lithium niobate used as an optical low pass filter is
Compared with borosilicate glass that has been used as a conventional lid, it has a very small coefficient of thermal expansion and anisotropy in the direction of thermal expansion, and its material strength is very weak and brittle, and its birefringence is large. As a result, the thickness is very thin, about 1/6 of that of the conventionally used crystal, and with a lid larger than 15 mm square that covers a high pixel device that exceeds 2 million pixels, There is a problem that the lid is easily broken by the stress concentrated on the joint between the insulating base and the lid when it receives a mechanical shock or a thermal shock, and the hermetic sealing of the package is broken. Was.

Further, when the dielectric multilayer film is formed, for example, on the outer side of the lid, the dielectric multilayer film absorbs moisture in the air to deteriorate the infrared shielding function. When the dielectric multilayer film is formed on the inside of the lid, the dielectric multilayer film is separated from the lid due to thermal shock such as a temperature cycle and falls into the image recognition area of the image sensor, which hinders imaging. It had a problem that it caused it.

Further, when a translucent lid body made of a lithium niobate plate is bonded to an insulating substrate by using a conventional thermosetting resin having a high elastic modulus, the niobium is caused by stress when the thermosetting resin is cured. There is also a problem that the lithium oxide plate is broken and the hermetic sealing of the package is broken.

The present invention has been devised in view of the above problems of the prior art, and its purpose is to provide a highly reliable airtight seal against mechanical shock or thermal shock from the outside, and to provide an external environment. An object of the present invention is to provide a package for housing an image pickup device having functions of an optical low-pass filter and an infrared cut filter, which can obtain stable optical characteristics without being affected by the environment.

[0013]

The package for housing an image pickup device of the present invention includes an insulating base having a recess on the upper surface of which an image pickup device is mounted, and a sealant interposed so as to cover the recess on the upper surface of the insulating base. And a light-transmitting lid body bonded together, the light-transmitting lid body being made of a glass plate material and at least one lithium niobate plate bonded to the upper surface of the plate material with a resin adhesive. And an optical plate material composed of.

Further, the package for housing the image pickup device of the present invention has any one of the lithium niobate plates in the above structure.
It is characterized in that a dielectric multilayer film having an infrared shielding function is formed on the surface of one plate material side.

Further, in the package for housing the image pickup device of the present invention, in the above-mentioned constitution, the thickness of the resin adhesive is 1 to 30.
It is characterized by being μm.

Further, in the package for housing an image pickup device of the present invention, in the above structure, the sealant is made of thermosetting resin containing epoxy resin as a main component and organic material powder, and the elasticity of the sealant is high. The rate is 0.1 to 3 GPa.

According to the package for housing the image pickup device of the present invention, the translucent lid is formed of the plate material made of glass and the optical plate material made of at least one lithium niobate plate. Even if the translucent lid is bonded to the insulating base, the plate material made of glass applies the stress concentrated on the joint between the insulating base and the cover when it receives a mechanical shock or a thermal shock from the outside. It is well dispersed throughout the lithium niobate plate, and as a result, large stress is not concentrated on the lithium niobate plate and the lithium niobate plate is not easily broken, and a package with good hermetic sealing can be obtained. it can.

Further, according to the image pickup device housing package of the present invention, in the above structure, the dielectric multilayer film having the infrared shielding function is formed on the surface of any one of the lithium niobate plates on the plate material side. As a result, it becomes possible to protect the dielectric multilayer film whose optical characteristics are likely to change due to the absorption of water from the water in the air, and it is possible to provide a package for housing an image sensor having a stable infrared ray cutting function. Further, there is no possibility that the dielectric multilayer film is peeled off from the lid and dropped into the image recognition area of the image pickup element due to thermal shock such as a temperature cycle, which causes trouble in image pickup.

Further, according to the package for housing an image pickup device of the present invention, in the above structure, the thickness of the resin-based adhesive for joining the plate member made of glass and the optical plate member made by bonding the lithium niobate plates to the range of 1 to Since the thickness is 30 μm, the stress generated due to the difference in thermal expansion coefficient between the glass plate material and the lithium niobate plate can be satisfactorily relaxed, and as a result, the package is not subject to thermal shock during temperature cycle tests. Even if it does, the optical plate material is not destroyed, and the image pickup device housing package having a good infrared ray cut function that does not hinder the incidence of light on the image pickup device can be provided.

Further, according to the package for housing the image pickup device of the present invention, in the above-mentioned structure, a thermosetting resin having epoxy resin as a main component is mixed with organic material powder as a sealing agent, and the elastic modulus thereof is 0.1 to. Since the pressure is set to 3 GPa, the translucent lid is not destroyed by the stress when the thermosetting resin is cured, and the image pickup element housing package having excellent airtight reliability can be obtained.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a package for accommodating an image pickup device of the present invention will be described in detail with reference to the accompanying drawings. Figure 1
[Fig. 2] is a sectional view showing an example of an embodiment of a package for accommodating an image sensor of the present invention, and Fig. 2 is an enlarged sectional view of a main part thereof. In these figures, 1 is an insulating substrate, 2 is a translucent lid, 3 is a sealant, 4 is an image sensor, and mainly the insulating substrate 1, the translucent lid 2 and the sealant 3 are used. An image pickup device housing package of the present invention is configured. In addition, the translucent lid 2 includes a plate material 2a made of glass, and one lithium niobate plate X.
Alternatively, it is formed by joining optical plate materials 2b formed by bonding a plurality of lithium niobate plates X together.
Further, in the example of this figure, an example in which three lithium niobate plates X are bonded together is shown.

The insulating base 1 is provided with a recess 1a for mounting the image pickup device 4 on the upper surface thereof, and the image pickup device 4 is provided on the bottom surface of the recess 1a with an adhesive made of glass, resin, brazing material or the like. And glued and fixed.

The insulating substrate 1 is made of an inorganic insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a silicon carbide sintered body. , Organic resin such as epoxy resin, phenol resin, liquid crystal polymer, polyphenylene sulfide, for example, aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. A suitable organic binder, solvent, plasticizer, dispersant is added and mixed to make a sludge, and the sludge is made into a sheet by using the sheet forming method such as the well-known doctor blade method or calendar roll method. Obtain a green sheet (ceramic green sheet), and then punch appropriately into those ceramic green sheets. This laminating a plurality, it is manufactured by firing at a high temperature of about 1600 ° C. with applied. Alternatively, when it is made of an epoxy resin, it is generally manufactured by molding a resin compound filled with silica powder with an injection molding machine by heat of about 180 ° C. into an arbitrary mold shape and curing it. The size of the insulating substrate 1 is such that the diagonal length of the image pickup element 4 is 2 inches (in).
ch) The following items are used, so the length and width are 50m.
m or less.

A plurality of wiring conductors 5 are formed on the insulating substrate 1 from the bottom surface to the bottom surface of the concave portion 1a. The wiring element 5 is provided with a portion of the image sensor 4 at the bottom surface of the concave portion 1a. By electrically connecting each electrode through the bonding wire 6, and electrically connecting the portion leading to the lower surface to the wiring conductor (not shown) of the external electric circuit through a connecting member such as solder. The electrodes of the image pickup device 4 are electrically connected to the wiring conductors of the external electric circuit.

The wiring conductor 5 acts as a conductive path when electrically connecting each electrode of the image pickup device 4 to an external electric circuit,
For example, when the insulating substrate 1 is made of an aluminum oxide sintered body, a metal paste obtained by adding and mixing an appropriate organic solvent, solvent, plasticizer, etc. to high melting point metal powder such as tungsten, molybdenum, manganese, etc. The bottom surface of the concave portion 1a of the insulating substrate 1 is formed by applying a thick film technique such as a well-known screen printing method to a ceramic green sheet to be the insulating substrate 1 in advance by printing, and firing the ceramic green sheet simultaneously with the ceramic green sheet. To the lower surface, a predetermined pattern is deposited.

A transparent lid 2 is joined to the upper surface of the insulating substrate 1 with a sealant 3 interposed therebetween. Translucent lid 2
Is formed by bonding one plate of lithium niobate X or a plurality of plates of lithium niobate X to a plate member 2a made of glass, and bonding the optical plate member 2b to the inside of the package. It has a function of hermetically sealing and also has a function of an optical low-pass filter.

According to the package for accommodating the image pickup device of the present invention, the transparent lid 2 is formed by bonding one lithium niobate plate X or a plurality of lithium niobate plates X to the plate member 2a made of glass. Since the optical plate member 2b is made to be joined, even if the translucent lid 2 having a size exceeding 15 mm square is joined to the insulating substrate 1, it receives a mechanical shock or a thermal shock from the outside. Insulating substrate 1 and translucent lid 2
The glass favorably disperses the stress concentrated on the joint part with the lithium niobate plate X as a whole, and as a result, a large stress is not concentrated on the lithium niobate plate X and is not easily broken. Can be a good package.

Borosilicate glass is generally used as the glass forming the plate 2a, and the thickness thereof is 0.
It is 1 to 1.5 mm. When the thickness of the plate member 2a is less than 0.1 mm, the light-transmitting lid body 2 has a low strength, and there is a risk that the lid body is easily broken by a mechanical shock or a thermal shock from the outside. When the thickness exceeds 1.5 mm, the light transmittance tends to decrease, and the image quality tends to deteriorate. Therefore,
The plate material 2a preferably has a thickness of 0.1 to 1.5 mm.

Further, the lithium niobate plate X has a thickness of about 0.05 to 1 mm, and if it is less than 0.05 mm, it tends to be broken during polishing of the lithium niobate plate X, and 1 mm is less than 1 mm. If it exceeds, the thickness becomes thick, and it tends to be difficult to reduce the thickness of the package for housing the image sensor. Therefore, the thickness of the lithium niobate plate X is preferably in the range of 0.05 to 1 mm. The number of lithium niobate plates X can be any number, but if the number of lithium niobate plates X is increased, it becomes difficult to reduce the thickness and it is difficult to expect a significant improvement in the function of the optical low-pass filter. The number of lithium plates X is 1 to
Five is preferable.

The lithium niobate plate X is used as a birefringent plate or a phase plate depending on the cutting direction with respect to its crystal axis. However, the birefringent plate and the phase plate are appropriately selected in consideration of the optical characteristics of the translucent lid 2. May be used in combination.

The plate member 2a and the optical plate member 2b are bonded to each other by a resin adhesive 7 such as an epoxy resin or an acrylic resin.
Is preferably a UV curable resin and the plate member 2a and the optical plate member 2
It is carried out by applying or printing on the entire surface between b and b, and then bonding both together and curing the resin adhesive 7.

In the package for housing the image pickup device of the present invention, it is preferable that the thickness of the resin adhesive 7 is 1 to 30 μm. When the thickness of the resin adhesive 7 is less than 1 μm, or when a mechanical shock or a thermal shock is applied to the package from the outside, the resin adhesive 7 is made of borosilicate glass (coefficient of thermal expansion α≈6.0 to 7.0 × 10 ^{− 6} / ° C.) and lithium niobate (coefficient of thermal expansion in crystal direction α≈15.4 × 10 ⁻⁶ / ° C.) becomes difficult to relax, and there is a risk that the optical plate material 2b will be destroyed. , 30 μm, the resin adhesive 7 impedes the incidence of light on the image pickup element 4, and the image quality tends to deteriorate. Therefore, the thickness of the resin adhesive 7 is preferably in the range of 1 to 30 μm.

The lithium niobate plates X are attached to each other with a resin adhesive 7 such as an epoxy resin or an acrylic resin, and the thickness thereof is 1 to 1, as in the case of the adhesion between the plate 2a and the optical plate 2b. Adhesion may be performed within a range of 30 μm.

Further, in the package for accommodating the image pickup device of the present invention, the dielectric multilayer film 8 having the infrared shielding function on the surface of any one of the lithium niobate plates X on the side of the plate material 2a.
Is preferably formed.

As shown in the enlarged cross-sectional view of the main part of FIG. 2, such a dielectric multilayer film 8 has a low refractive index thin film layer 8a made of an insulating material having a refractive index of 1.6 or less and an insulating film having a refractive index of 1.7 or more. It is formed by alternately stacking a plurality of high refractive index thin film layers 8b made of a material, and reflects a component in a wavelength region of infrared rays from light passing through an image pickup lens (not shown), and is obtained by the image pickup device 4. The optical functional component can be made thin by having a function of enhancing the image quality of the image and by providing the translucent lid body 2 with an infrared ray cutting function.

Further, according to the package for accommodating the image pickup device of the present invention, the dielectric multilayer film 8 is provided between the lithium niobate plates X,
Alternatively, since it is sandwiched between the plate material 2a made of glass and the lithium niobate plate X, it becomes possible to protect the dielectric multilayer film 8 whose optical characteristics are likely to change due to absorption of water from water in the air, It is possible to provide a package for accommodating an image sensor having a stable infrared ray cutting function.
Further, the dielectric multilayer film 8 is formed on the surface of the lithium niobate plate X located on the outermost side of the translucent lid 2 on the plate material 2a side and kept away from the image pickup element 4, whereby the dielectric multilayer film 8 is formed.
Even when a film defect occurs during molding, the image sensor housing package having an infrared ray cutting function that is hard to exert the influence of the film defect on the image recognition of the image sensor 4 can be provided.

By setting the difference between the refractive index of the high refractive index thin film layer 8b and the refractive index of the low refractive index thin film layer 8a to be 0.1 or more, the high refractive index thin film layer 8b and the low refractive index thin film layer 8a are separated from each other. The amount of infrared rays reflected at the interface does not decrease, that is, the infrared ray cutting effect does not decrease, and as a result, it is possible to provide an image pickup device housing package having a good infrared ray cutting function. When the difference between the refractive index of the high refractive index thin film layer 8b and the refractive index of the low refractive index thin film layer 8a is less than 0.1, infrared rays are reflected at the interface between the high refractive index thin film layer 8b and the low refractive index thin film layer 8a. The amount tends to be extremely small, and it tends to be difficult to obtain a good infrared cut function. Therefore, the difference between the refractive index of the high refractive index thin film layer 8b and the low refractive index thin film layer 8a is preferably 0.1 or more, more preferably 0.5 or more.

The high-refractive-index thin film layer 8b and the low-refractive-index thin film layer 8a have a difference in refractive index of 0.1 or more from each other to obtain a good infrared ray cutting function, and the dielectric multilayer film 8
From the viewpoint of reducing the thickness of the above, it is preferable that the respective refractive indexes are 1.7 or more and 1.6 or less. This is because the optical film thickness (λ / 4: λ is the design wavelength) is the product (n) of the refractive index (n) of the material forming the thin film layer and the shape film thickness (d).
Since it is represented by xd), the high refractive index thin film layer 8b can be thinned by using a material having a large refractive index (n) when blocking infrared rays in a high frequency region,
Further, by setting the refractive index of the low refractive index thin film layer 8a to 1.6 or less, a sufficient difference in refractive index between the high refractive index thin film layer 8b and the low refractive index thin film layer 8a can be obtained to obtain a good infrared cut function. Because you can

[0039] As such a refractive index of 1.7 or more insulating materials, Ta ₂ 0 ₅ or _{TiO 2 · Nb 2 0 5 ·} La 2 O 3 · Z
rO ₂ · Y ₂ O ₃ or the like is used, and as the insulating material having a refractive index of 1.6 or less, SiO ₂ or Al ₂ O ₃ · LaF ₃ · MgF ₂ ·
Na ₃ AlF ₆ or the like is used. In addition, the high refractive index thin film layer 8
The range of the refractive index of b is usually 1.7 to 3.0, the range of the low refractive index thin film layer 8a is usually 1.2 to 1.6, and the insulating material for forming these has characteristics such as hardness of the thin film layer. It is selected in consideration of ease of formation, price, etc.

Although FIG. 1 shows an example in which the dielectric multilayer film 8 is formed on the entire surface of the lithium niobate plate X on the plate material 2b side, the dielectric multilayer film 8 is formed on the lithium niobate plate X.
It may be formed only on the light receiving region (the region corresponding to the opening of the recessed portion 1a) of the image sensor 4 on the plate material 2b side.

The dielectric multilayer film 8 including the low-refractive index thin film layer 8a and the high-refractive index thin film layer 8b is formed by a CVD method, a sputtering method, a vacuum deposition method, or the like. , SiO ₂ · Al ₂ O ₃ · Mg
An insulating material having a refractive index of 1.6 or less in F _2, etc., Ta ₂ 0 ₅ and Ti
O ₂ · Nb ₂ 0 refractive index, such as ₅ placed in installation crucible 1.7 or more insulating materials and to each the vacuum evaporation apparatus, and 250 in the vacuum evaporation apparatus in 1 × 10 ^-6 Pa vacuum degree of about After the temperature is set to 300 ° C., the low refractive index thin film layer 8a is first applied to the entire surface of one main surface of the lithium niobate plate X or to the area to be the light receiving area of the image pickup device 4 by masking, and thereafter. , A high-refractive-index thin film layer 8b and a low-refractive-index thin film layer 8a are sequentially and alternately deposited for a total of 10 to 100 layers.

The thickness of each of the low refractive index thin film layer 8a and the high refractive index thin film layer 8b is preferably 0.1λ to 0.5λ of the infrared wavelength λ (nm) to be blocked. The thickness of the low refractive index thin film layer 8a and the high refractive index thin film layer 8b is
If it is less than 0.1λ or exceeds 0.5λ, the refractive index (n)
The product (n × d) of the film thickness and the shape film thickness (d) is significantly different from the optical film thickness calculated by λ / 4, and the relationship between the optical characteristics of reflection and refraction is broken, and the specific wavelength is blocked. There is a tendency to lose control of transparency. Therefore, the thickness of the low-refractive-index thin film layer 8a and the high-refractive-index thin film layer 8b is 0.1λ of the infrared wavelength λ (nm) to be blocked.
It is preferable that the thickness is in the range of 0.5λ.

If the number of the low-refractive index thin film layers 8a and the high-refractive index thin film layers 8b is less than 10, it tends to be difficult to satisfactorily block the wavelength in the infrared region.
If the number of layers exceeds 0, the thermal shrinkage of the dielectric multilayer film 8 when cooling the transparent lid 2 to room temperature after vacuum-depositing the dielectric multilayer film 8 becomes large, and the lithium niobate plate X tends to be easily cracked. There is. Therefore, the number of layers of the low-refractive-index thin film layer 8a and the high-refractive-index thin film layer 8b is preferably in the range of 10 to 100, and blocks wavelengths in the infrared region better, and
From the viewpoint of reducing the thermal shrinkage of the dielectric multilayer film 8 when cooled to room temperature and making the lithium niobate plate X less likely to crack, the range of 30 to 45 layers is preferable.

Further, in the package for housing an image pickup device of the present invention, it is preferable that the low refractive index thin film layer 8a is formed of silicon dioxide and the high refractive index thin film layer 8b is formed of titanium dioxide. Since the vapor-deposited particles of titanium dioxide and silicon dioxide are fine and hard in particle size as compared with vapor-deposited particles of other insulating materials used for forming the thin film layers 8a and 8b, they are low in refractive index thin film layer 8a. And high refractive index thin film layer 8
An image sensor having the function of an infrared cut filter, which can control the film thickness of b with high accuracy and is less likely to be damaged when handling the lithium niobate plate X, and as a result, can favorably control the transmission / reflection of light of a specific wavelength. It can be a storage package.

Next, the sealant 3 for joining the insulating base 1 and the translucent lid body 2 has a modulus of elasticity of 0.1 by adding organic material powder to a thermosetting resin containing epoxy resin as a main component. ~ 3
It is important to use the value of GPa.

According to the package for housing the image pickup device of the present invention, the sealant 3 for joining the translucent lid body 2 and the insulating substrate 1 together.
Since the thermosetting resin containing an epoxy resin as a main component contains an organic material powder to have an elastic modulus of 0.1 to 3 GPa, the lithium niobate plate X is destroyed by the stress when the sealant 3 is cured. Therefore, it is possible to obtain a package for housing an image pickup element that is highly airtight and highly reliable. In addition, since the sealant 3 has an epoxy resin as a main component,
The thermosetting epoxy resin adhesive has a dense three-dimensional mesh structure and can firmly bond the insulating substrate 1 and the translucent lid body 2, and as a result, image pickup with higher airtightness and reliability It can be used as an element storage package.

The insulating base 1 and the translucent lid body 2 are bonded together at about 110.degree. C. after the translucent lid body 2 having the sealant 3 applied to the joint portion is superposed on the insulating base body 1. It is carried out by heating under pressure at the temperature of 60 to 90 minutes. From the viewpoint of reducing the residual stress at the time of joining, heating at a low temperature of about 110 ° C is preferable, but heating at a temperature of 90 to 250 ° C may be performed. The sealant 3 is generated not only when the insulating substrate 1 and the translucent lid 2 are bonded, but also when heat is applied during secondary mounting on the substrate thereafter, and further when the image sensor 4 is activated. It has a function of relieving stress between members generated by heat and effectively preventing the translucent lid body 2 from being broken.

Examples of the sealing agent 3 include bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, and special novolac type epoxy resin.・ Epoxy resin such as phenol derivative epoxy resin, biphenol skeleton epoxy resin, etc., with addition of curing agents such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, dicyandiamide Is formed by. 2
You may mix and use the epoxy resin of a kind or more.

As the organic material powder contained in the sealant 3, silicon rubber or silicon resin / LD whose elastic modulus is lower than that of a thermosetting resin containing epoxy resin as a main component.
Soft particles such as PE, HDPE, PMMA, cross-linked PMMA, polystyrene, cross-linked polystyrene, ethylene-acrylic copolymer, polyethyl methacrylate, butyl acrylate and urethane are preferable.

The sealing agent 3 has an elastic modulus of 0.1 GP.
When it is less than a, the encapsulant 3 is distorted when mechanical stress is applied to the translucent lid body 2, and it tends to be difficult to hold the translucent lid body 2 at a predetermined position. Also, the elastic modulus is 3G
If it exceeds Pa, the stress generated when a large impact such as a drop is applied to the package for housing the image sensor or the thermal stress due to the heat generation of the image sensor 4 cannot be absorbed, and the translucent lid body 2 is insulated by the insulating base body 1. There is a tendency that the light-transmitting lid 2 is easily broken. Therefore, the sealant 3 preferably has an elastic modulus in the range of 0.1 to 3 GPa.

The sealing agent 3 has a thickness of 1 after curing.
It is preferable to be in the range of up to 50 μm, and if it is less than 1 μm, stress relaxation tends to be ineffective.
When it exceeds, the moisture permeability of the sealant 3 increases, and the image pickup element 4 tends to be deteriorated by moisture. Therefore, the sealant 3 preferably has a thickness after curing in the range of 1 to 50 μm.

Thus, according to the image pickup device housing package of the present invention, the image pickup device 4 is provided on the bottom surface of the recess 1a of the insulating base 1.
Is bonded and fixed through an adhesive made of glass, resin, a brazing material, etc., and each electrode of the image pickup device 4 is connected to the wiring conductor 5 through a bonding wire 6, and thereafter, the insulating substrate 1 and the translucent lid are connected. Connect to the body 2 via the sealant 3,
The image pickup device 4 as a final product is completed by hermetically housing the image pickup device 4 inside a container formed of the insulating base 1 and the translucent lid 2.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the dielectric multilayer film 7
Is not limited to the infrared ray shielding film, and may be an antireflection film formed of a material such as magnesium fluoride.

[0054]

According to the package for housing the image pickup device of the present invention, the translucent lid and at least one plate member made of glass are used.
Since it is formed with an optical plate material consisting of one lithium niobate plate, even if a translucent lid with a size of more than 15 mm square is joined to the insulating base, it will not be affected by external mechanical or thermal shock. The plate material made of glass satisfactorily disperses the stress concentrated on the joint between the insulating substrate and the lid when the lithium niobate plate is concentrated. As a result, a large stress is concentrated on the lithium niobate plate. The plate is not easily broken, and the package can be hermetically sealed.

Further, according to the package for accommodating an image pickup device of the present invention, in the above structure, the dielectric multilayer film having the infrared shielding function is formed on the surface of any one of the lithium niobate plates on the plate material side. As a result, it becomes possible to protect the dielectric multilayer film whose optical characteristics are likely to change due to the absorption of water from the water in the air, and it is possible to provide a package for housing an image sensor having a stable infrared ray cutting function. Further, there is no possibility that the dielectric multilayer film is peeled off from the lid and dropped into the image recognition area of the image pickup element due to thermal shock such as a temperature cycle, which causes trouble in image pickup.

Further, according to the package for accommodating the image pickup device of the present invention, in the above structure, the thickness of the resin adhesive for joining the plate member made of glass and the optical plate member made by bonding the lithium niobate plates to each other is 1 to Since the thickness is 30 μm, the stress generated due to the difference in thermal expansion coefficient between the glass plate material and the lithium niobate plate can be satisfactorily relaxed, and as a result, the package is not subject to thermal shock during temperature cycle tests. Even if it does, the optical plate material is not destroyed, and the image pickup device housing package having a good infrared ray cut function that does not hinder the incidence of light on the image pickup device can be provided.

Further, according to the package for housing the image pickup device of the present invention, in the above structure, the thermosetting resin having epoxy resin as a main component is mixed with the organic material powder as the sealant, and the elastic modulus thereof is 0.1 to. Since the pressure is set to 3 GPa, the translucent lid is not destroyed by the stress when the thermosetting resin is cured, and the image pickup element housing package having excellent airtight reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a package for housing an image sensor according to the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part of FIG.

[Explanation of symbols]

1 ... Insulating substrate 1a ... Recess 2 ・ ・ ・ ・ ・ ・ Translucent lid 2a ... Plate material made of glass 2b ・ ・ ・ ・ ・ ・ Optical plate material 3 ・ ・ ・ ・ ・ ・ Sealant 4 ... Image sensor 7 ... Resin adhesive 8 ・ ・ ・ ・ ・ ・ Dielectric multilayer film 8a ... Low-refractive index thin film layer 8b ... High-refractive index thin film layer X ... Lithium niobate plate

Claims (4)

[Claims] 1. An insulating base having a recess on the upper surface of which an image pickup device is mounted, and a translucent lid joined to the upper surface of the insulating base via a sealant so as to cover the recess. The translucent lid is formed of a plate material made of glass and an optical plate material made of at least one lithium niobate plate adhered to the upper surface of the plate material with a resin adhesive. The package for storing the image sensor. 2. The optical plate member, wherein a dielectric multilayer film having an infrared shielding function is formed on a surface of any one of the lithium niobate plates facing the plate member. Image sensor package. 3. The thickness of the resin adhesive is 1 to 30 μm
The package for housing an image pickup device according to claim 1 or 2, wherein: 4. The encapsulant comprises a thermosetting resin containing an epoxy resin as a main component and an organic material powder contained therein, and has an elastic modulus of 0.1 to 3 GPa. The package for accommodating the image pickup device according to claim 3.