JP2003068908A - Package for image pickup element storage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a package for image pickup element storage can not be prevented from having its lid body broken or decreasing in the reliability of airtight sealing. SOLUTION: The package for image pickup element package comprises an insulating base body 1 which has a recessed part 1a where an image pickup element 4 is mounted on its top surface and a translucent lid body 2 which is joined with the top surface of the insulating base body 1 through a sealant 3 while covering the recessed part 1a; and the translucent lid body 2 comprises a plate material 2a made of glass and an optical plate material 2b which is bonded to the top surface of the plate material 2a through a resin-based adhesive 7 and formed of one to five pieces crystal plates X.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing an image pickup device for protecting a semiconductor device from mechanical shock or thermal shock from the outside or intrusion of moisture, and particularly to a CCD / CMOS image sensor or the like. The present invention relates to an image pickup device housing package having a color image pickup device with more than 10,000 pixels.

[0002]

2. Description of the Related Art In recent years, a camera including an image pickup device such as a CCD or CMOS has been rapidly reduced in size, thickness, and price, and along with this, optical functional parts such as a package for storing an image pickup element. The lightness, thinness, shortness and miniaturization or the reduction of parts are progressing.

Such an optical functional component generally has a lens made of a glass material or a plastic material for focusing an image and guiding it to an image pickup device, and a crystal having a birefringence effect or a phase effect for preventing an image moire. Optical low-pass filter consisting of, infrared cut filter containing metal complex to correct reddish color tone, lid made of borosilicate glass plate and aluminum oxide sintered body or aluminum nitride sintered body / mullite The image pickup device housing package is made of an electrically insulating material such as a sintered body or a silicon nitride sintered body, and is made of an insulating base having a recess for mounting a semiconductor element.

However, in such an optical functional component structure, it is difficult to reduce the thickness due to the restriction of the member thickness for obtaining individual characteristics, and as a result, the camera body cannot be downsized.

In order to solve such a problem, Japanese Patent Laid-Open Publication No.
In 2000-114502, a crystal having a function of an optical low-pass filter is used as a lid of a package for housing an image sensor, and an infrared shielding function is added by applying a dielectric multilayer film to the lid, It has been proposed to make the optical functional component thinner.

According to this proposal, the lid is provided on one side of the quartz plate having the birefringence effect or the phase effect, or on the effective area of image recognition, Ta ₂ 0 ₅ TiO ₂ Nb ₂ 0 ₅ L
SiO ₂ and a high refractive index thin film layer made of a dielectric material having a refractive index of 1.7 or more, such as aF ₃・ La ₂ O ₃・ Ta ₂ O ₅・ ZrO ₂・ Y ₂ O ₃
A dielectric multilayer film formed by alternately laminating dozens of low refractive index thin film layers made of a dielectric material having a refractive index of 1.6 or less such as Al ₂ O ₃ .MgF ₂ .Na ₃ AlF ₆ is formed by, for example, the CVD method.・ By using the sputtering method or vacuum deposition method to deposit and form an infrared shielding function, the space required to install the optical low pass filter and infrared cut filter can be reduced, and the camera It is possible to reduce the thickness.

The reason why the infrared ray cutting function is imparted by applying a multilayer film to the quartz plate is as follows. Generally, the optical film thickness (λ / 4: λ is the design wavelength) is represented by the product (n × d) of the refractive index (n) of the material forming the thin film layer and the shape film thickness (d). Therefore, by appropriately selecting the material and shape film thickness of the thin film layer and stacking a plurality of thin film layers to control transmission / reflection of light having a wavelength in a specific range, the infrared ray cutting function is given to the quartz plate. In addition, a lid made of a crystal plate usually has a crystal plate of 1
It is formed by laminating a plurality of crystal plates having a birefringence effect or a phase effect.

[0008]

However, quartz, which is generally used as an optical low-pass filter, has the following disadvantages in comparison with borosilicate glass which has been conventionally used as a lid.
Since the coefficient of thermal expansion is extremely small and anisotropic in the direction of thermal expansion, and the material strength is very weak and brittle, 200
With a lid larger than 15 mm square that covers a high-pixel device with more than 10,000 pixels, the stress concentrated on the joint between the insulating base and the lid when an external mechanical or thermal shock is applied. As a result, the lid body is easily broken, and the airtight sealing of the package is broken.

Further, when the dielectric multilayer film is formed on the outside of the lid, for example, the dielectric multilayer film absorbs moisture in the air to deteriorate its infrared shielding function. When the dielectric multilayer film is formed on the inside of the lid, the dielectric multilayer film is separated from the lid due to thermal shock such as a temperature cycle and falls into the image recognition area of the image sensor, which hinders imaging. It had a problem that it caused it.

Further, when a translucent lid body using a crystal plate is bonded to an insulating substrate by using a conventional thermosetting resin having a high elastic modulus, the crystal plate is deformed by the stress when the thermosetting resin is cured. There is also a problem that the package is destroyed and the hermetic sealing of the package is broken.

The present invention has been devised in view of the above problems of the prior art, and its purpose is to provide a highly reliable airtight seal against mechanical shock and thermal shock from the outside, and to provide an external environment. An object of the present invention is to provide a package for housing an image pickup device having functions of an optical low-pass filter and an infrared cut filter, which can obtain stable optical characteristics without being affected by the environment.

[0012]

The package for housing an image pickup device of the present invention includes an insulating base having a recess on the upper surface of which an image pickup device is mounted, and a sealant interposed so as to cover the recess on the upper surface of the insulating base. The translucent lid is composed of a glass plate and 1 to 5 crystal plates bonded to the upper surface of the plate with a resin adhesive. And an optical plate material.

Further, the image pickup element housing package of the present invention is characterized in that, in the above-mentioned structure, a dielectric multilayer film having an infrared shielding function is formed on a surface of any one of the crystal plates on the plate material side. To do.

Furthermore, in the package for housing the image pickup device of the present invention, in the above structure, the thickness of the resin adhesive is 1 to 30.
It is characterized by being μm.

Further, in the package for housing an image pickup device of the present invention, in the above construction, the sealant is made of a thermosetting resin containing an epoxy resin as a main component and an organic material powder, and has an elastic modulus of 0.1 to 10. It is characterized by being 3 GPa.

According to the package for housing the image pickup device of the present invention, since the translucent lid is formed by joining the plate member made of glass to the optical plate member made of 1 to 5 quartz plates, a 15 mm square Even if a translucent lid with a size larger than the above is joined to the insulating base, the stress concentrated on the joint between the insulating base and the lid when the glass receives a mechanical shock or a thermal shock from the outside It is well dispersed over the entire plate material, and no large stress is concentrated and applied to the quartz plate.
Good airtight sealing that the lid is not easily broken,
In addition, the package can have a function of an optical low pass filter.

Further, according to the package for housing an image pickup device of the present invention, in the above structure, since a dielectric multilayer film having an infrared shielding function is formed on the surface of any one of the crystal plates on the plate material side, the moisture content is reduced. It becomes possible to protect the dielectric multi-layered film whose optical characteristics are easily changed by the absorption of the above from moisture in the air, and it is possible to provide an image pickup device housing package having a stable infrared ray cutting function. Further, there is no possibility that the dielectric multilayer film is peeled off from the lid and dropped into the image recognition area of the image pickup element due to thermal shock such as a temperature cycle, which causes trouble in image pickup.

Further, according to the package for housing the image pickup device of the present invention, in the above structure, the thickness of the resin adhesive for joining the plate member made of glass and the optical plate member made by bonding the quartz plate is 1 to 30 μm. Therefore, the stress generated due to the difference in thermal expansion coefficient between the glass plate and the quartz plate can be relaxed well, and as a result, even if the package is subjected to thermal shock in a temperature cycle test, etc. It is possible to obtain a package for housing an image sensor, which does not break the plate material and has a good infrared ray cut function that does not hinder the incidence of light on the image sensor.

Further, according to the package for housing the image pickup device of the present invention, in the above structure, the thermosetting resin having epoxy resin as a main component is made to contain the organic material powder as the sealant, and the elastic modulus is 0.1 to. Since the pressure is set to 3 GPa, the translucent lid is not destroyed by the stress when the thermosetting resin is cured, and the image pickup element housing package having excellent airtight reliability can be obtained.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a package for housing an image pickup device of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an example of an embodiment of a package for housing an image pickup device of the present invention, and FIG. 2 is an enlarged sectional view of an essential part thereof. In these figures, 1 is an insulating substrate, 2 is a translucent lid, 3 is a sealant, 4 is an image sensor, and mainly the insulating substrate 1, the translucent lid 2 and the sealant 3 are used. An image pickup device housing package of the present invention is configured. It should be noted that the translucent lid body 2 is provided on the plate member 2a made of glass one or
It is formed by joining optical plate materials 2b formed by bonding five crystal plates X together. Further, the example of this figure shows an example in which three crystal plates X are bonded together.

The insulating base 1 is provided with a recess 1a for mounting the image pickup device 4 on the upper surface thereof, and the image pickup device 4 is provided on the bottom surface of the recess 1a with an adhesive made of glass, resin, brazing material or the like. And glued and fixed.

The insulating substrate 1 is made of an inorganic insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a silicon carbide sintered body. , Organic resin such as epoxy resin, phenol resin, liquid crystal polymer, polyphenylene sulfide, for example, aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. A suitable organic binder, solvent, plasticizer, dispersant is added and mixed to make a sludge, and the sludge is made into a sheet by using the sheet forming method such as the well-known doctor blade method or calendar roll method. Obtain a green sheet (ceramic green sheet), and then punch appropriately into those ceramic green sheets. This laminating a plurality, it is manufactured by firing at a high temperature of about 1600 ° C. with applied. Alternatively, when it is made of an epoxy resin, it is generally manufactured by molding a resin compound filled with silica powder with an injection molding machine by heat of about 180 ° C. into an arbitrary mold shape and curing it. The size of the insulating substrate 1 is such that the diagonal length of the image pickup element 4 is 2 inches (in).
ch) The following items are used, so the length and width are 50m.
m or less.

A plurality of wiring conductors 5 are formed on the insulating substrate 1 from the bottom surface to the bottom surface of the concave portion 1a. The wiring element 5 is provided with a portion of the image sensor 4 at the bottom surface of the concave portion 1a. The respective electrodes are electrically connected through the bonding wires 6, and the portion leading to the lower surface is electrically connected to an external electric circuit (not shown) through a connecting member such as solder, thereby obtaining an image sensor. Each of the electrodes 4 is electrically connected to the wiring conductor of the external electric circuit.

The wiring conductor 5 acts as a conductive path when electrically connecting each electrode of the image pickup device 4 to an external electric circuit,
For example, when the insulating substrate 1 is made of an aluminum oxide sintered body, a metal paste obtained by adding and mixing an appropriate organic solvent, solvent, plasticizer, etc. to high melting point metal powder such as tungsten, molybdenum, manganese, etc. The bottom surface of the concave portion 1a of the insulating substrate 1 is formed by applying a thick film technique such as a well-known screen printing method to a ceramic green sheet to be the insulating substrate 1 in advance by printing, and firing the ceramic green sheet simultaneously with the ceramic green sheet. To the lower surface, a predetermined pattern is deposited.

A transparent lid 2 is joined to the upper surface of the insulating substrate 1 with a sealant 3 interposed therebetween. Translucent lid 2
Is formed by joining one or 2 to 5 crystal plates X to the plate member 2a made of glass and joining the optical plate member 2b, and the function of hermetically sealing the image sensor 4 inside the package. And has the function of an optical low-pass filter.

According to the package for accommodating the image pickup element of the present invention, the optical plate member 2b is formed by laminating the transparent cover 2 to the plate member 2a made of glass and one or 2 to 5 crystal plates X.
Since it is formed by bonding, even if the translucent lid body 2 having a size exceeding 15 mm square is bonded to the insulating base body 1, insulation when receiving a mechanical shock or a thermal shock from the outside The stress concentrated on the joint between the base 1 and the translucent lid 2 is well dispersed over the entire plate material 2a made of glass, and no large stress is concentrated on the quartz plate X, resulting in It is possible to make the translucent lid 2 have a good airtight seal without being easily broken and have an optical low-pass filter function.

Borosilicate glass is generally used as the glass forming the plate 2a, and the thickness thereof is 0.
It is 1 to 1.5 mm. When the thickness of the plate member 2a is less than 0.1 mm, the light-transmitting lid body 2 has a low strength, and there is a risk that the lid body is easily broken by a mechanical shock or a thermal shock from the outside. When the thickness exceeds 1.5 mm, the light transmittance tends to decrease, and the image quality tends to deteriorate. Therefore,
The plate material 2a preferably has a thickness of 0.1 to 1.5 mm.

The crystal plate X has a thickness of 0.2 to 2 m.
If the thickness is about m and less than 0.2 mm, the quartz plate X tends to be easily broken during polishing, and if the thickness exceeds 2 mm, the thickness becomes large, and the package for housing the image sensor should be thin. Tends to be difficult. Therefore, the thickness of the crystal plate X is preferably in the range of 0.2 to 2 mm. It should be noted that six or more crystal plates X may be bonded together,
The number of the crystal plates X to be bonded is preferably 1 to 5 because it is difficult to make the device thinner when the number of the plates is increased and it is difficult to expect a great improvement in the function of the optical low-pass filter.

The crystal plate X is used as a birefringent plate or a phase plate depending on the cutting direction with respect to its crystal axis, but the birefringent plate and the phase plate are appropriately combined in consideration of the optical characteristics of the translucent lid 2. You can use it.

The plate member 2a and the optical plate member 2b are bonded to each other by a resin adhesive 7 such as an epoxy resin or an acrylic resin.
Is preferably a UV curable resin and the plate member 2a and the optical plate member 2
It is carried out by applying or printing on the entire surface between b and b, and then bonding both together and curing the resin adhesive 7.

In the package for housing the image pickup device of the present invention, it is preferable that the thickness of the resin adhesive 7 is 1 to 30 μm. When the thickness of the resin adhesive 7 is less than 1 μm, or when a mechanical shock or a thermal shock is applied to the package from the outside, the resin adhesive 7 is made of borosilicate glass (coefficient of thermal expansion α≈6.0 to 7.0 × 10 ^{− 6} / ℃) and quartz (coefficient of thermal expansion α
It is difficult to reduce the difference in thermal expansion coefficient ( ^≈0.5 × 10 ⁻⁶ / ° C.), and there is a risk that the optical plate material 2b will be destroyed. Further, if it exceeds 30 μm, the resin adhesive 7 causes the imaging element 4 There is a tendency that the incidence of light on the image is blocked and the image quality is deteriorated. Therefore, the thickness of the resin adhesive 7 is 1
It is preferably in the range of -30 μm.

The crystal plates X are attached to each other by using a resin adhesive 7 such as an epoxy resin or an acrylic resin and having a thickness of 1 to 30 μm as in the case of adhering the plate member 2a and the optical plate member 2b. The area may be adhered.

Further, in the package for accommodating the image pickup device of the present invention, it is preferable to form the dielectric multilayer film 8 having an infrared shielding function on the surface of any one of the crystal plates X on the plate material 2a side.

As shown in the enlarged sectional view of the essential part of FIG. 2, such a dielectric multilayer film 8 has a low refractive index thin film layer 8a made of an insulating material having a refractive index of 1.6 or less and an insulating film having a refractive index of 1.7 or more. It is formed by alternately stacking a plurality of high refractive index thin film layers 8b made of a material, and reflects a component in a wavelength region of infrared rays from light passing through an image pickup lens (not shown), and is obtained by the image pickup device 4. The optical functional component can be made thin by having a function of enhancing the image quality of the image and by providing the translucent lid body 2 with an infrared ray cutting function.

Further, according to the package for accommodating the image pickup device of the present invention, since the dielectric multilayer film 8 is sandwiched between the crystal plates X or between the plate material 2a made of glass and the crystal plate X, the moisture content of It becomes possible to protect the dielectric multilayer film 8 whose optical characteristics are easily changed by absorption from moisture in the air,
It is possible to provide a package for accommodating an image sensor having a stable infrared ray cutting function. Further, the dielectric multilayer film 8 is provided on the outermost side of the translucent lid body 2 as the plate material 2a of the crystal plate X.
By forming it on the side surface and keeping it away from the image sensor 4,
Even when a film defect occurs during the molding of the dielectric multilayer film 8, the image sensor housing package having an infrared ray cutting function that is difficult to give the image recognition of the image sensor 4 due to the film defect can be provided.

By setting the difference between the refractive index of the high refractive index thin film layer 8b and the refractive index of the low refractive index thin film layer 8a to be 0.1 or more, the high refractive index thin film layer 8b and the low refractive index thin film layer 8a are separated from each other. The amount of infrared rays reflected at the interface does not decrease, that is, the infrared ray cutting effect does not decrease, and as a result, it is possible to provide an image pickup device housing package having a good infrared ray cutting function. When the difference between the refractive index of the high refractive index thin film layer 8b and the refractive index of the low refractive index thin film layer 8a is less than 0.1, infrared rays are reflected at the interface between the high refractive index thin film layer 8b and the low refractive index thin film layer 8a. The amount tends to be extremely small, and it tends to be difficult to obtain a good infrared cut function. Therefore, the difference between the refractive index of the high refractive index thin film layer 8b and the low refractive index thin film layer 8a is preferably 0.1 or more, more preferably 0.5 or more.

The high-refractive-index thin film layer 8b and the low-refractive-index thin film layer 8a have a difference in refractive index of 0.1 or more from each other to obtain a good infrared ray cutting function, and the dielectric multilayer film 8
From the viewpoint of reducing the thickness of the above, it is preferable that the respective refractive indexes are 1.7 or more and 1.6 or less. This is because the optical film thickness (λ / 4: λ is the design wavelength) is the product (n) of the refractive index (n) of the material forming the thin film layer and the shape film thickness (d).
Since it is represented by xd), the high refractive index thin film layer 8b can be thinned by using a material having a large refractive index (n) when blocking infrared rays in a high frequency region,
Further, by setting the refractive index of the low refractive index thin film layer 8a to 1.6 or less, a sufficient difference in refractive index between the high refractive index thin film layer 8b and the low refractive index thin film layer 8a can be obtained to obtain a good infrared cut function. Because you can

[0039] As such a refractive index of 1.7 or more insulating materials, Ta ₂ 0 ₅ or _{TiO 2 · Nb 2 0 5 ·} La 2 O 3 · Z
rO ₂ · Y ₂ O ₃ or the like is used, and as the insulating material having a refractive index of 1.6 or less, SiO ₂ or Al ₂ O ₃ · LaF ₃ · MgF ₂ ·
Na ₃ AlF ₆ or the like is used. In addition, the high refractive index thin film layer 8
The range of the refractive index of b is usually 1.7 to 3.0, the range of the low refractive index thin film layer 8a is usually 1.2 to 1.6, and the insulating material for forming these has characteristics such as hardness of the thin film layer. It is selected in consideration of ease of formation, price, etc.

Although FIG. 1 shows an example in which the dielectric multilayer film 8 is formed on the entire surface of the crystal plate X on the side of the plate material 2b, the dielectric multilayer film 8 is formed on the plate material 2b of the crystal plate X. It may be formed only on the light receiving region of the image pickup device 4 (the region corresponding to the opening of the recess 1a).

The dielectric multilayer film 8 including the low-refractive index thin film layer 8a and the high-refractive index thin film layer 8b is formed by a CVD method, a sputtering method, a vacuum deposition method, or the like. , SiO ₂ · Al ₂ O ₃ · Mg
An insulating material having a refractive index of 1.6 or less in F _2, etc., Ta ₂ 0 ₅ and Ti
O ₂ · Nb ₂ 0 refractive index, such as ₅ placed in installation crucible 1.7 or more insulating materials and to each the vacuum evaporation apparatus, and 250 in the vacuum evaporation apparatus in 1 × 10 ^-6 Pa vacuum degree of about After the temperature is set to 300 ° C., the low refractive index thin film layer 8a is first deposited on the entire one main surface of the crystal plate X or on the area to be the light receiving area of the image sensor 4 by masking, and then the high refractive index thin film layer 8a is formed. The refractive index thin film layers 8b and the low refractive index thin film layers 8a are sequentially and alternately summed.
It is formed by depositing 10 to 100 layers.

The thickness of each of the low refractive index thin film layer 8a and the high refractive index thin film layer 8b is preferably 0.1λ to 0.5λ of the infrared wavelength λ (nm) to be blocked. The thickness of the low refractive index thin film layer 8a and the high refractive index thin film layer 8b is
If it is less than 0.1λ or exceeds 0.5λ, the refractive index (n)
The product (n × d) of the film thickness and the shape film thickness (d) is significantly different from the optical film thickness calculated by λ / 4, and the relationship between the optical characteristics of reflection and refraction is broken, and the specific wavelength is blocked. There is a tendency to lose control of transparency. Therefore, the thickness of the low-refractive-index thin film layer 8a and the high-refractive-index thin film layer 8b is 0.1λ of the infrared wavelength λ (nm) to be blocked.
It is preferable that the thickness is in the range of 0.5λ.

If the number of the low-refractive index thin film layers 8a and the high-refractive index thin film layers 8b is less than 10, it tends to be difficult to satisfactorily block the wavelength in the infrared region.
If the number of layers exceeds 0, the thermal shrinkage of the dielectric multilayer film 8 during cooling the transparent lid 2 to room temperature after vacuum deposition of the dielectric multilayer film 8 becomes large, and the quartz plate X tends to be easily cracked. .
Therefore, the number of layers of the low-refractive index thin film layer 8a and the high-refractive index thin film layer 8b is preferably in the range of 10 to 100 layers, which blocks the wavelength in the infrared region better and cools down to room temperature. From the viewpoint of reducing the thermal contraction of the film 8 and making the quartz plate X difficult to crack, the range of 30 to 45 layers is preferable.

Further, in the package for housing an image pickup device of the present invention, it is preferable that the low refractive index thin film layer 8a is formed of silicon dioxide and the high refractive index thin film layer 8b is formed of titanium dioxide. Since the vapor-deposited particles of titanium dioxide and silicon dioxide are fine and hard in particle size as compared with vapor-deposited particles of other insulating materials used for forming the thin film layers 8a and 8b, they are low in refractive index thin film layer 8a. And high refractive index thin film layer 8
The film thickness of b can be controlled with high accuracy, and it is hard to be damaged when handling the crystal plate X. As a result,
It is possible to provide an image pickup device housing package having the function of an infrared cut filter capable of favorably controlling transmission / reflection of light of a specific wavelength.

Next, the sealant 3 for joining the insulating base 1 and the translucent lid body 2 has a modulus of elasticity of 0.1 by adding organic material powder to a thermosetting resin containing epoxy resin as a main component. ~ 3
It is important to use the value of GPa.

According to the package for housing the image pickup device of the present invention, the sealant 3 for joining the translucent lid body 2 and the insulating substrate 1 together.
Since the thermosetting resin containing epoxy resin as the main component contains the organic material powder to have the elastic modulus of 0.1 to 3 GPa, the crystal plate X is destroyed by the stress when the sealant 3 is cured. Therefore, it is possible to provide a package for housing an image pickup element having excellent airtightness and reliability. Further, since the sealant 3 has an epoxy resin as a main component, the thermosetting epoxy resin adhesive has a dense three-dimensional network structure and the insulating substrate 1
And the translucent lid body 2 can be joined firmly, and as a result, an image pickup element housing package having higher airtightness and reliability can be obtained.

The insulating base 1 and the translucent lid body 2 are bonded together at about 110.degree. C. after the translucent lid body 2 having the sealant 3 applied to the joint portion is superposed on the insulating base body 1. It is carried out by heating under pressure at the temperature of 60 to 90 minutes. From the viewpoint of reducing the residual stress at the time of joining, heating at a low temperature of about 110 ° C is preferable, but heating at a temperature of 90 to 250 ° C may be performed. The sealant 3 is generated not only when the insulating substrate 1 and the translucent lid 2 are bonded, but also when heat is applied during secondary mounting on the substrate thereafter, and further when the image sensor 4 is activated. It has a function of relieving stress between members generated by heat and effectively preventing the translucent lid body 2 from being broken.

Examples of the sealing agent 3 include bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, and special novolac type epoxy resin.・ Epoxy resin such as phenol derivative epoxy resin, biphenol skeleton epoxy resin, etc., with addition of curing agents such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, dicyandiamide Is formed by. 2
You may mix and use the epoxy resin of a kind or more.

As the organic material powder contained in the sealant 3, silicon rubber or silicon resin / LD whose elastic modulus is lower than that of a thermosetting resin containing epoxy resin as a main component.
Soft particles such as PE, HDPE, PMMA, cross-linked PMMA, polystyrene, cross-linked polystyrene, ethylene-acrylic copolymer, polyethyl methacrylate, butyl acrylate and urethane are preferable.

The sealing agent 3 has an elastic modulus of 0.1 GP.
When it is less than a, the encapsulant 3 is distorted when mechanical stress is applied to the translucent lid body 2, and it tends to be difficult to hold the translucent lid body 2 at a predetermined position. Also, the elastic modulus is 3G
If it exceeds Pa, the stress generated when a large impact such as a drop is applied to the package for housing the image sensor or the thermal stress due to the heat generation of the image sensor 4 cannot be absorbed, and the translucent lid body 2 is insulated by the insulating base body 1. There is a tendency that the light-transmitting lid 2 is easily broken. Therefore, the sealant 3 preferably has an elastic modulus in the range of 0.1 to 3 GPa.

The sealing agent 3 has a thickness of 1 after curing.
It is preferable to be in the range of up to 50 μm, and if it is less than 1 μm, stress relaxation tends to be ineffective.
When it exceeds, the moisture permeability of the sealant 3 increases, and the image pickup element 4 tends to be deteriorated by moisture. Therefore, the sealant 3 preferably has a thickness after curing in the range of 1 to 50 μm.

Thus, according to the image pickup device housing package of the present invention, the image pickup device 4 is provided on the bottom surface of the recess 1a of the insulating base 1.
Is bonded and fixed through an adhesive made of glass, resin, a brazing material, etc., and each electrode of the image pickup device 4 is connected to the wiring conductor 5 through a bonding wire 6, and thereafter, the insulating substrate 1 and the translucent lid are connected. Connect to the body 2 via the sealant 3,
The image pickup device 4 as a final product is completed by hermetically housing the image pickup device 4 inside a container formed of the insulating base 1 and the translucent lid 2.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the dielectric multilayer film 7
Is not limited to the infrared ray shielding film, and may be an antireflection film formed of a material such as magnesium fluoride.

[0054]

According to the package for housing an image pickup device of the present invention, the translucent lid body is formed by joining the plate member made of glass to the optical plate member made of 1 to 5 quartz plates. Even if a translucent lid with a size of more than 15 mm square is joined to the insulating base, the stress concentrated on the joint between the insulating base and the lid when external mechanical or thermal shock is applied. It is well dispersed throughout the plate made of glass, and no large stress is concentrated and applied to the quartz plate.
Good airtight sealing that the lid is not easily broken,
In addition, the package can have a function of an optical low pass filter.

Further, according to the package for accommodating the image pickup device of the present invention, in the above structure, since the dielectric multilayer film having the infrared shielding function is formed on the surface of any one of the crystal plates on the plate material side, the moisture content is reduced. It becomes possible to protect the dielectric multi-layered film whose optical characteristics are easily changed by the absorption of the above from moisture in the air, and it is possible to provide an image pickup device housing package having a stable infrared ray cutting function. Further, there is no possibility that the dielectric multilayer film is peeled off from the lid and dropped into the image recognition area of the image pickup element due to thermal shock such as a temperature cycle, which causes trouble in image pickup.

Further, according to the package for housing the image pickup device of the present invention, in the above-mentioned structure, the thickness of the resin adhesive for joining the plate member made of glass and the optical plate member made by bonding the quartz plate is 1 to 30 μm. Therefore, the stress generated due to the difference in thermal expansion coefficient between the glass plate and the quartz plate can be relaxed well, and as a result, even if the package is subjected to thermal shock in a temperature cycle test, etc. It is possible to obtain a package for housing an image sensor, which does not break the plate material and has a good infrared ray cut function that does not hinder the incidence of light on the image sensor.

Further, according to the package for housing the image pickup device of the present invention, in the above structure, the thermosetting resin having epoxy resin as a main component is mixed with the organic material powder as the sealant, and the elastic modulus thereof is 0.1 to. Since the pressure is set to 3 GPa, the translucent lid is not destroyed by the stress when the thermosetting resin is cured, and the image pickup element housing package having excellent airtight reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a package for housing an image sensor according to the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part of FIG.

[Explanation of symbols]

1 ... Insulating substrate 1a ... Recess 2 ・ ・ ・ ・ ・ ・ Translucent lid 2a ... Plate material made of glass 2b ・ ・ ・ ・ ・ ・ Optical plate material 3 ・ ・ ・ ・ ・ ・ Sealant 4 ... Image sensor 7 ... Resin adhesive 8 ・ ・ ・ ・ ・ ・ Dielectric multilayer film 8a ... Low-refractive index thin film layer 8b ... High-refractive index thin film layer X ・ ・ ・ ・ ・ ・ Crystal plate

Claims (4)

[Claims] 1. An insulating base having a recess on the upper surface of which an image pickup device is mounted, and a translucent lid joined to the upper surface of the insulating base via a sealant so as to cover the recess. The translucent lid is composed of a plate material made of glass, and an optical plate material made of 1 to 5 crystal plates, which is adhered to the upper surface of the plate material with a resin adhesive. Storage package. 2. The image pickup device according to claim 1, wherein the optical plate member has a dielectric multilayer film having an infrared shielding function formed on a surface of any one of the quartz plates on the plate member side. Device storage package. 3. The thickness of the resin adhesive is 1 to 30 μm
The package for housing an image pickup device according to claim 1 or 2, wherein: 4. The encapsulant comprises a thermosetting resin containing an epoxy resin as a main component and an organic material powder contained therein, and has an elastic modulus of 0.1 to 3 GPa. The package for accommodating the image pickup device according to claim 3.