JP2003124660A - Cooling device for electronic instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device, cooling optimally without affecting heat to each other in a cooling structure having at least two heat generating elements. SOLUTION: The cooling device for electronic instruments is provided in up-and-down with a lower print plate 10 and an upper print plate 11, on which at least a first heat generating element 12 and a second heat generating element 13 are mounted. One part of a frame 14, having an excellent heat conductivity, is arranged on the upper surface side of the first heat generating element 12 mounted on the upper surface side of the lower print plate 10 to dissipate heat from the first heat generating element 12 through the frame 14. Non-mounting surface of one side mounting structure is arranged on one part of the frame 14. The second heat generating element 13 is mounted on the mounting surface side of the upper surface of the upper print plate 11 while the plate 15, excellent in the heat conductivity, is arranged on the upper surface side of the second heat generating element 13 to dissipate heat from the second heat generating element 13 through the plate 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electronic device capable of suitably cooling a heat generating element such as a CPU unit or a card-shaped electronic component mounted inside various electronic devices.

[0002]

2. Description of the Related Art Generally, a CPU unit, a card-shaped electronic component, or the like is mounted on a mounting substrate by plugging the card-shaped electronic component into a socket fixed on the mounting substrate. It is performed by radiating heat from a radiator formed of a metal material.

FIG. 4 illustrates a cooling device for electronic equipment based on the prior art. In the illustrated electronic device, there are two large heating elements 12, 13. First heating element 1
Reference numeral 2 denotes, for example, a CPU unit, which is mounted on the upper surface side of the lower PT plate 10 connected to the connector 20. The second heating element 13 is, for example, a VGA (video graphic adapter), and is placed on the lower surface side of the upper PT plate 11. Conventionally, as described above, in order to dissipate heat from the heating elements, the heating elements 12 and 13 are attached to the upper surface side of the lower PT plate 10 and the lower surface side of the upper PT plate 11, respectively, and the frame 14 is heated by the two heating elements 12 and 13. The upper and lower heat generating elements 1 are configured to be sandwiched from above and below by this frame 14.
It was performed by radiating the heat from 2 and 13 in common. The arrows in the illustrated frame 14 indicate the flow of heat radiation. Electronic devices can be further attached to the lower surface side of the lower PT plate and the upper surface side of the upper PT plate.

However, such a heat dissipation structure has a problem in that heat from the upper and lower two heat generating elements 12 and 13 affects each other in one frame 14 and a sufficient heat dissipation effect cannot be obtained.

In addition, although this type of electronic equipment is required to be reduced in height by reducing its height depending on the application, the configuration shown in FIG. 4 is disadvantageous for achieving a reduction in thickness.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above problems, and in a cooling structure having at least two heating elements such as a CPU unit or a card-shaped electronic component, the height of the equipment is suppressed. While aiming to make it thinner
Further, even when the space for mounting the fins and the fan for heat dissipation cannot be secured, the object is to suitably cool the heat from the two heating elements without affecting each other.

[0007]

In a cooling device for electronic equipment of the present invention, a lower printed board and an upper printed board on which at least two first and second heating elements are mounted are mounted vertically. First mounted on the upper surface side of the lower printed board
A part of a frame made of a material having good thermal conductivity is arranged on the upper surface side of the heat generating element, and heat is radiated from the first heat generating element through the frame.
This lower printed circuit board can have a double-sided mounting configuration. The upper printed board has a single-sided mounting structure that is mounted only on the upper surface side, and the non-mounted surface of the upper printed board is arranged on a part of the frame. The second heating element is mounted on the mounting surface side of the upper surface of the upper printed board, and a plate made of a material having good thermal conductivity is arranged on the upper surface side of the second heating element to dispose the second heating element. Heat is dissipated from the second heating element via the plate.

As the first heating element, it is desirable to dispose an element having a larger heat radiation amount than the second heating element. For example, the first heating element is a CPU unit,
The second heating element is the video graphic adapter.

A heat radiating sheet may be arranged between the upper surface side of the first heating element and the frame, and between the upper surface side of the second heating element and the plate. Radiating fins are provided on the upper surface of the frame, and forced cooling can be performed using a fan through air holes provided in the plate.

[0010]

1 is a sectional view of an electronic device to which the present invention can be applied. On the upper surface of the lower PT board (print board) 10 inserted into the connector 20 in the figure, an electronic element including the first heating element 12 (not shown except the heating element 12) such as a CPU unit is mounted. A part of the frame 14 is fixed to the upper surface of the first heating element 12 via the heat dissipation sheet 24, and the upper PT plate 11 is further fixed to the upper part of the frame 14 by a suitable means such as a screw. The upper PT plate 11 is mounted on one side, and the non-mounting surface is placed directly on the frame 14 only through an insulating sheet for preventing an electrical short circuit. It is possible to reduce the size. As the heat dissipation sheets 24 and 25, elastic heat transfer rubber known per se can be used. The lower PT plate 10 has a double-sided mounting configuration,
An electronic element (not shown) can also be mounted on the lower surface side.

The upper PT plate 11 and the lower PT plate 10 are electrically connected via a stacking connector 21.
The upper PT plate 11 has an electronic element including a second heating element 13 such as a VGA (video graphic adapter) only on its upper surface (illustration other than the heating element 13 is omitted).
Can be implemented. The plate 15 is fixed to the frame 14 together with the upper PT plate 11 by screws, for example, on the upper surface of the second heating element 13 via the heat dissipation sheet 25.

These heating elements 12 and 13 have the above-mentioned C
It is a card processor (card-shaped electronic component) formed by housing a PU unit, VGA, or an arithmetic unit and its peripheral circuits in a case. These are mounted by plugging in a socket fixed on the PT board.

The heat radiation from the first heating element 12 attached to the lower PT plate 10 flows through the heat radiation sheet 24 into the frame 14 formed of a material having good thermal conductivity such as aluminum, and is naturally cooled. is doing. As described above, the frame 14 includes the lower PT plate 10 and the upper PT.
For the purpose of fixing the plate 11 and improving the heat dissipation efficiency, the contact area with the air is increased to have a shape suitable for natural cooling. Further, it is also possible to attach a radiation fin to the upper surface of the frame 14. In the illustrated structure, the heat flowing into the frame 14 is applied to the lower PT plate 10
It is only by the 1st heat generating element 12 attached to.

FIG. 2 shows the upper PT plate 11 and the plate 15
It is a perspective view which shows the electronic device shown in FIG. 1 in the state which removed. In FIG. 2, the frame 14 has a lower PT plate 1
It is shown that it has a surface located on it so as to cover 0, and extends from there to the top of the electronic device (frame shown on the upper left side of FIG. 1) for heat dissipation. Further, in the front side of FIG. 2, it is shown that there is no frame above the lower PT plate and the lower stacking connector is arranged there. This lower stacking connector, when the upper PT plate is placed,
Connected with the upper stacking connector.

The heat radiation from the second heating element 13 attached to the upper PT plate is as shown in FIG.
Via 5, it flows into a plate 15, which can be made of, for example, aluminum and is naturally cooled. The cooling capacity of the frame 14 is better than that of the plate 15
Since the cooling capacity is larger than that of the first heating element, it is desirable to dispose the first heating element having a large heat generation amount such as the CPU unit described above.

As described above, since the frame 14, which is the heat radiation path from the first heating element 12, and the plate 15, which is the heat radiation path from the second heating element, are completely separated so as not to come into contact with each other, they are mutually separated. It is possible to cool well without being affected by heat.

Also, as shown in FIG.
By providing air holes and forcibly cooling with a fan or the like, the heat radiation effect can be further improved. FIG. 3 is a perspective view showing an external appearance in a completed state in which the upper PT plate 11 and the plate 15 are attached to the electronic device shown in FIG. FIG. 3 shows that the plate is provided with a step portion and the air hole is provided therein.

[0018]

According to the present invention, in a cooling structure having at least two heating elements such as a CPU unit or a card-shaped electronic component, the first heating element is configured to radiate heat through a frame, Since the heat is radiated from the second heat generating element through the plate, it is possible to suitably cool the heat without mutual influence of the heat.

Further, according to the present invention, the upper printed board has a single-sided mounting structure, and the non-mounting surface thereof is arranged on the frame, so that the overall height can be suppressed.

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic device to which the present invention can be applied.

[Fig. 2] With the upper PT plate and plate removed,
It is a perspective view which shows the electronic device shown in FIG.

FIG. 3 is a perspective view showing a state in which an upper PT plate and a plate are attached to the electronic device shown in FIG.

FIG. 4 illustrates a cooling device for electronic equipment according to the prior art.

[Explanation of symbols]

10 Lower PT plate 11 Upper PT plate 12 First heating element 13 Second heating element 14 frames 15 plates 20 connectors 21 Stacking connector 24 Heat dissipation sheet 25 Heat dissipation sheet

Claims (6)

[Claims] 1. A cooling device for an electronic device, in which a lower printed board and an upper printed board on which at least two first and second heating elements are respectively mounted are vertically mounted, and mounted on an upper surface side of the lower printed board. A part of a frame made of a material having good thermal conductivity is arranged on the upper surface side of the first heating element, and heat is radiated from the first heating element through the frame. The upper printed board has a single-sided mounting structure that is mounted only on the upper surface side, the non-mounted surface of the upper printed board is arranged on a part of the frame, and the upper printed board is mounted on the mounting surface side of the upper surface. The second heating element is mounted, and a plate made of a material having good thermal conductivity is arranged on the upper surface side of the second heating element to dissipate heat from the second heating element. Configured to do via A cooling device for electronic equipment characterized by the following. 2. The electronic device cooling apparatus according to claim 1, wherein the lower printed board has a double-sided mounting configuration. 3. The cooling device for an electronic device according to claim 1, wherein the first heating element has a larger heat radiation amount than the second heating element. 4. The cooling device for electronic equipment according to claim 1, wherein the first heating element is a CPU unit, and the second heating element is a video graphic adapter. 5. A heat dissipation sheet is arranged between the upper surface side of the first heating element and a part of the frame, and between the upper surface side of the second heating element and the plate, respectively. The cooling device for an electronic device according to claim 1. 6. The cooling device for an electronic device according to claim 1, further comprising a heat radiation fin on an upper surface of the frame, and forced cooling using a fan through air holes provided in the plate.