JP2003121466A - プローブユニットおよびその製造方法 - Google Patents
プローブユニットおよびその製造方法Info
- Publication number
- JP2003121466A JP2003121466A JP2001314049A JP2001314049A JP2003121466A JP 2003121466 A JP2003121466 A JP 2003121466A JP 2001314049 A JP2001314049 A JP 2001314049A JP 2001314049 A JP2001314049 A JP 2001314049A JP 2003121466 A JP2003121466 A JP 2003121466A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe pin
- bonding
- seed layer
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 105
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 28
- 150000002500 ions Chemical class 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 53
- 239000003513 alkali Substances 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 32
- 239000010949 copper Substances 0.000 description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000011651 chromium Substances 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000004380 ashing Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001314049A JP2003121466A (ja) | 2001-10-11 | 2001-10-11 | プローブユニットおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001314049A JP2003121466A (ja) | 2001-10-11 | 2001-10-11 | プローブユニットおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003121466A true JP2003121466A (ja) | 2003-04-23 |
| JP2003121466A5 JP2003121466A5 (enExample) | 2007-04-19 |
Family
ID=19132421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001314049A Pending JP2003121466A (ja) | 2001-10-11 | 2001-10-11 | プローブユニットおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003121466A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100654760B1 (ko) | 2004-10-13 | 2006-12-08 | 한국과학기술연구원 | 경사구조 프로브 팁을 이용한 반도체 검사장치 제조방법 |
| JP2007085877A (ja) * | 2005-09-22 | 2007-04-05 | Yamaha Corp | プローブユニット |
| US7218131B2 (en) | 2004-03-19 | 2007-05-15 | Renesas Technology Corp. | Inspection probe, method for preparing the same, and method for inspecting elements |
| WO2015008618A1 (ja) * | 2013-07-19 | 2015-01-22 | 株式会社村田製作所 | 空隙配置構造体及びその製造方法並びに測定用デバイス |
| JP2018054594A (ja) * | 2016-09-26 | 2018-04-05 | セイコーインスツル株式会社 | 接触式プローブ |
-
2001
- 2001-10-11 JP JP2001314049A patent/JP2003121466A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7218131B2 (en) | 2004-03-19 | 2007-05-15 | Renesas Technology Corp. | Inspection probe, method for preparing the same, and method for inspecting elements |
| KR100654760B1 (ko) | 2004-10-13 | 2006-12-08 | 한국과학기술연구원 | 경사구조 프로브 팁을 이용한 반도체 검사장치 제조방법 |
| JP2007085877A (ja) * | 2005-09-22 | 2007-04-05 | Yamaha Corp | プローブユニット |
| WO2015008618A1 (ja) * | 2013-07-19 | 2015-01-22 | 株式会社村田製作所 | 空隙配置構造体及びその製造方法並びに測定用デバイス |
| JP2018054594A (ja) * | 2016-09-26 | 2018-04-05 | セイコーインスツル株式会社 | 接触式プローブ |
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