JP2003114252A - Semiconductor inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor inspection device superior in reliability and inexpensively inspecting a semiconductor integrated circuit chip. SOLUTION: This semiconductor inspection device inspects a plurality of semiconductor integrated circuits 31 formed on a wafer 3. This semiconductor inspection device has at least a plurality of probe cards 1a and 1b, and a plurality of driving mechanisms 51a and 51b. These probe cards 1a and 1b inspect the semiconductor integrated circuits 13 in a state where the semiconductor integrated circuits 31 and a probe 13 are brought into electric contact with each other. The driving mechanisms 51a and 51b are arranged so as to correspond to the plurality of respective probe cards 1a and 1b, and independently move the plurality of probe cards 1a and 1b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device, and more particularly to a semiconductor inspection device for inspecting electrical characteristics of a semiconductor integrated circuit by bringing a probe into contact with the electrodes of the semiconductor integrated circuit.

[0002]

2. Description of the Related Art Conventionally, it has been widely performed to inspect electrical characteristics of a semiconductor integrated circuit formed on a wafer. At the time of inspection, a probe is brought into contact with the electrodes of the semiconductor integrated circuit, an inspection signal is applied from the measurement / inspection device, and an output signal corresponding thereto is detected. The conventional semiconductor inspection device inspects one semiconductor integrated circuit chip at a time.

The structure of a conventional probe head will be briefly described with reference to FIG. As shown in the figure, the probe head 1 is provided with a plurality of probes 13 at the center thereof. The probe 13 is usually composed of an elongated metal needle. The probes 13 are provided by the number of external terminals of the semiconductor integrated circuit chip, and are arranged at positions corresponding to the external terminals of the semiconductor integrated circuit chip. The probe 13 is directly connected to the measurement / inspection device by a signal line.

[0004]

In recent years, there has been a strong demand for measuring and inspecting a semiconductor integrated circuit chip incorporated in a mobile phone at low cost, centering on the chip. However, the conventional semiconductor inspection device inspects each semiconductor integrated circuit chip by using one probe head, which is inefficient and contributes to higher inspection cost.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor inspection apparatus for inspecting a semiconductor integrated circuit chip with excellent reliability, high throughput and low cost. And

[0006]

A semiconductor inspection device according to the present invention is a semiconductor inspection device for inspecting a plurality of semiconductor integrated circuits formed on a wafer, wherein the semiconductor integrated circuit and a probe are electrically connected to each other. A plurality of probe cards for inspecting the semiconductor integrated circuit in a state of being in contact with the semiconductor integrated circuit; and a plurality of drive mechanisms for moving the probe card so as to electrically contact the semiconductor integrated circuit and the probe, The drive mechanism is provided in correspondence with each of the plurality of probe cards and independently moves the plurality of probe cards. With such a configuration, since it is possible to simultaneously inspect a plurality of semiconductor integrated circuits using a plurality of probe cards, the inspection time can be shortened and the probe cards can be moved independently, so that the probes and the semiconductor integrated circuits can be moved independently. It is possible to increase the reliability of the contact and improve the inspection efficiency.

Here, the plurality of drive mechanisms may be capable of moving the probe card at least in a direction perpendicular to the main plane of the wafer. With such a configuration, the reliability of the contact between the probe and the semiconductor integrated circuit can be improved.

Further, the plurality of drive mechanisms may move the probe card so that the electrical contact between the probe of the probe card and the semiconductor integrated circuit is optimized in each of the plurality of probe cards. Good.

Further, a wafer holding body for holding the wafer and a drive mechanism for moving the wafer holding body in the horizontal direction of the main plane of the wafer may be provided.

Further, the plurality of drive mechanisms may be capable of moving the probe card in a direction parallel to and a direction perpendicular to the main plane of the wafer. With such a configuration, inspection efficiency can be improved.

When it is determined that the plurality of drive mechanisms are unsuccessful when inspecting an arbitrary semiconductor integrated circuit, the plurality of drive mechanisms are separated regardless of whether another probe card is being inspected. The probe card may be moved to start the inspection of the semiconductor integrated circuit. Thereby, the inspection efficiency can be further improved.

When the inspection of an arbitrary semiconductor integrated circuit is completed, the plurality of drive mechanisms start the inspection of the next semiconductor integrated circuit regardless of whether another probe card is being inspected. Therefore, it is preferable to move the probe card. Thereby, the inspection efficiency can be further improved.

Here, in the preferred embodiment, each of the plurality of probe cards is provided corresponding to one semiconductor integrated circuit.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The applicant of the present invention has applied for an invention related to the present invention prior to the present invention (Japanese Patent Application No.
1-190119). Since the related invention has not been disclosed yet, it does not constitute the prior art of the present invention, but for the understanding of the present invention, it will be briefly described with reference to FIGS. 8, 9 and 10.

FIG. 8 is a functional block diagram of a semiconductor inspection device according to the related invention. This semiconductor inspection device
It is composed of a probe card 1, a measurement / inspection device 2, a wafer holder 4, a drive mechanism 5, a drive mechanism 6 and a control device 7. The wafer 3 has a plurality of semiconductor integrated circuit chips to be inspected in this semiconductor inspection apparatus.

The probe card 1 electrically contacts the semiconductor integrated circuit chip on the wafer 3 with a probe. The measurement / inspection device 2 generates an inspection signal and outputs it to the probe card 1. Further, the measurement / inspection device 2 inputs the signal output from the semiconductor integrated circuit chip in response to the inspection input signal and performs the inspection. The inspection result is displayed on a display or printed by a printer, for example.

The measurement / inspection device 2 is controlled by the control device 7.
The drive mechanism 5 and the drive mechanism 6 are controlled. by this,
The probe card 1 and the wafer holder 4 are positioned. Here, the drive mechanism 5 can move the probe head 1 in the direction perpendicular to the main plane of the wafer 3 (Z direction). Further, the drive mechanism 6 can move the wafer holder 4 in the horizontal direction (XY direction) parallel to the main plane of the wafer 3.

The wafer holder 4 has a function of holding the wafer 3. The wafer holder 4 holds the wafer 3 by a suction mechanism, for example.

A plan view of the wafer 3 is shown in FIG. The wafer 3 has a large number of semiconductor integrated circuit chips 31.
Can be formed. For example, in the case of a 200 mm wafer, about 1000 semiconductor integrated circuit chips 31
In the case of a 300 mm wafer, about 2600
Individual semiconductor integrated circuit chips can be manufactured. Semiconductor integrated circuit chip 31 according to an embodiment of the present invention
Is a wafer level CSP (Chip Size Package), and is provided with an external terminal 32 composed of a plurality of ball-shaped solders. For example, 81 external terminals 32 are provided at 0.5 mm intervals. However, the semiconductor integrated circuit chip applied in the present invention is not limited to such a wafer level CSP, and the external terminal of the aluminum pad is 0.1.
It may be arranged at mm intervals. The type of the semiconductor integrated circuit chip 31 to be inspected is not particularly limited, but includes, for example, a wireless LAN chip, a GPS chip, and a Bluetooth chip.

FIG. 9 is a sectional view of the probe card 1 and the like. As shown in the figure, the module 12 is mounted on the upper surface of the probe head 11. A probe 13 is provided on the lower surface of the probe head 11. The probe 13 and the module 12 are electrically connected for each probe. The probe 13 is a wafer 3.
Since it is necessary to contact each of the external terminals 32 of
The same number as the external terminals 32 is provided. In this probe card 1, probes corresponding to a plurality of semiconductor integrated circuit chips are provided in a single probe card 1 so that a plurality of semiconductor integrated circuit chips can be inspected at the same time. Such a configuration of the probe card 1 may be called a multi-probe head. The probe card 1 has a single drive mechanism.

In the semiconductor inspection apparatus according to the related invention, since the probes are contacted with the terminals of a plurality of semiconductor integrated circuit chips at the same time, the number of contacts and the area are increased, so that there is a problem in contact reliability. Further, as the number of contacts increases, the load applied from one drive mechanism becomes excessive, which complicates and enlarges the structure of the semiconductor inspection apparatus itself.

Here, the following two points can be considered as factors that reduce the reliability of the contact.

(1) Variation in XYZ direction of probe (2) Variation in XYZ direction of contact portion on wafer

The factor (1) further includes variations in the length and shape of the probe itself, variations in the XYZ directions regarding the position where the probe is fixed to the probe head, variations in the inclination of the probe head, and the like. On the other hand, the factor (2) includes variations in the XYZ directions of the contact portion, wafer inclination, and the like. Especially, when the contact portion is a solder bump or a solder ball, the variation increases.

In a semiconductor inspection apparatus having a multi-probe head structure having such a single drive mechanism with such variations, the contact area and the number of contacts are limited due to the reliability of the contacts. At the same time, it may be difficult to measure.

On the other hand, the inspection time of the semiconductor integrated circuit chip may be different from each other, or the inspection may fail and the inspection time may be shorter than that of other semiconductor integrated circuit chips. In such a case, if a plurality of multi-probe heads having one drive mechanism are used for simultaneous inspection, even a probe card in contact with a semiconductor integrated circuit chip will not be inspected for some time, and the inspection efficiency will decrease. To do.

An object of the present invention is to solve the above-mentioned problems that occur in the semiconductor inspection apparatus according to the related invention and to provide a semiconductor inspection apparatus which is excellent in reliability and low in cost.

Embodiments of the present invention will be described below with reference to the drawings.

First Embodiment of the Invention 1 is a functional block diagram of a semiconductor inspection device according to a first embodiment of the invention. This semiconductor inspection device includes a probe card 1a, a probe card 1b, a measurement / inspection device 2, a wafer holder 4,
Z drive mechanism 51a, Z drive mechanism 51b, XY drive mechanism 6
1 and a control device 7. Wafer 3
This semiconductor inspection apparatus has a plurality of semiconductor integrated circuit chips 31 to be inspected.

Probe card 1a and probe card 1
In b, a probe is used to electrically contact the semiconductor integrated circuit chip on the wafer 3. In this embodiment, one probe card is provided corresponding to one semiconductor integrated circuit chip. That is, 1
Each probe card can test only one semiconductor integrated circuit chip at a time.

The measurement / inspection device 2 generates an inspection signal and outputs it to the probe card 1a and the probe card 1b. Further, the measurement / inspection device 2 inputs the signal output from the semiconductor integrated circuit chip 31 in response to the input signal for inspection and performs the inspection. The inspection result is displayed on a display or printed by a printer, for example.

The measurement / inspection device 2 is controlled by the control device 7.
Z drive mechanism 51a, Z drive mechanism 51b, XY drive mechanism 6
Control 1 As a result, the probe card 1a, the probe card 1b, and the wafer holder 4 are positioned. Here, the Z drive mechanism 51a can move the probe card 1a in the direction perpendicular to the main plane of the wafer 3 (Z direction). Further, the Z drive mechanism 51b can move the probe card 1b in the direction perpendicular to the main plane of the wafer 3 (Z direction). That is, the movement of the probe card 1a in the Z direction and the movement of the probe card 1b in the Z direction can be executed independently of each other.

Therefore, the movement in the Z direction can be controlled for each probe card. Therefore, since the contact can be controlled for each probe card, the movement in the Z direction can be finely controlled for each probe card so that an optimum contact is obtained according to various variations in the contact portion. In this way, it is possible to improve the reliability of the contact as a whole.

Further, in the semiconductor inspection apparatus according to the present embodiment, the number of contacts for one drive mechanism is reduced as compared with the case where a plurality of probe cards are driven by one drive mechanism. The load on one drive mechanism can be reduced, and the semiconductor inspection device can be downsized and simplified.

Further, the XY drive mechanism 61 can move the wafer holder 4 in the horizontal direction (XY direction) parallel to the main plane of the wafer 3.

The wafer holder 4 has a function of holding the wafer 3. The wafer holder 4 holds the wafer 3 by a suction mechanism, for example.

FIG. 2 shows a sectional view of the semiconductor inspection apparatus according to the first embodiment of the present invention. As shown in the figure, each of the probe card 1a and the probe card 1b is
Probe head 11, module 12 and probe 13
Is equipped with. The module 12 includes the probe head 11
It is mounted on the upper surface of. The module 12 includes a microprocessor, a memory, a signal processing LSI, a crystal oscillator, a filter, a balun, electronic components such as a directional coupler, and the like. The probe 13 projects from the lower surface of the probe head 11. And the probe 13
Are in contact with the upper surface of the wafer 3 placed on the wafer holder 4.

More specifically, the probe 13 is in electrical contact with the solder balls 32 provided on the pads 33 of the wafer 3, or the pads of the wafer 3, as shown in the enlarged view. 33 is in direct electrical contact. That is, they are in electrical contact. Therefore, the wafer 3 includes the pad 33 and the solder ball 3
2, the probe 13 is electrically connected to the probe 13, and the probe 13 is connected to the measurement / inspection device 2 via the module 12.

In particular, when the contact between the wafer 3 and the probe 13 is the solder ball 32 or the solder bump, X
Since the variation in the YZ direction is essentially large, providing the drive mechanism for each probe card as in the embodiment of the present invention has a great merit.

Second Embodiment of the Invention Subsequently, the configuration of the semiconductor inspection apparatus according to the second embodiment of the invention will be described with reference to FIGS. 3 and 4.

In this example, as shown in FIG. 3, an XYZ drive mechanism 53a is connected to the probe card 1a and an XYZ drive mechanism 53b is connected to the probe card 1b. The XYZ drive mechanism 53a executes movement of the probe card 1a in the X, Y, and Z directions. On the other hand, the XYZ drive mechanism 53b executes movement of the probe card 1b in the X, Y, and Z directions. That is, the X direction, the Y direction, and the Z direction of the probe card 1a.
The movement in the directions and the movements of the probe card 1b in the X, Y, and Z directions can be performed independently of each other. The rest of the configuration is the same as the configuration described in the first embodiment of the invention, and the description is omitted.

In this way, the probe card 3a and the probe card 3b can be independently controlled for movement in the X direction, the Y direction and the Z direction, so that the inspection fails and the inspection time is shorter than that of other semiconductor integrated circuit chips. If the inspection time of the semiconductor integrated circuit chip is different for each semiconductor integrated circuit chip, the probe card that has been measured and inspected will not be replaced by another probe card even if it has not been measured and inspected by another probe card. The measurement and inspection of the semiconductor integrated circuit chip can be started. As a result, the throughput of measurement and inspection can be improved.

Next, an example of processing of the semiconductor inspection apparatus according to the embodiment of the present invention will be described with reference to FIG. Figure 5
The processing when the inspection fails and the inspection time is shorter than that of other semiconductor integrated circuit chips will be described.

First, the control unit 7 controls the XYZ drive mechanism 53.
By controlling a and the XYZ drive mechanism 53b, the probe card 1a and the probe card 1b are arranged on the semiconductor integrated circuit chip 31 to be inspected (S101). Then, the probes 13 provided on the probe card 1a and the probe card 1b are brought into contact with the pads 31 or the solder balls 32 on the semiconductor integrated circuit chip 31,
The inspection is started (S102). In this example, one probe card inspects one semiconductor integrated circuit chip.

If it is determined that the semiconductor integrated circuit chip 31 to be inspected has failed the inspection in the stage before the final step of the inspection (S103), the semiconductor integrated circuit chip 31 that has failed the inspection is inspected. The probe card 1 that has been used is a semiconductor integrated circuit chip 31 that is another inspection target.
Move up (S104). The probe card 1 is provided with a semiconductor integrated circuit chip 31 that has been newly moved.
Start the inspection. That is, the probe card 1 on the side determined to have failed the inspection shifts to the inspection of another semiconductor circuit chip 31 even if the other probe card 1 is still executing the inspection.

On the other hand, if it is not judged that the inspection fails in the stage before the final step of the inspection, the inspection is finished as usual (S104), and the next semiconductor to be inspected is scheduled in advance. It moves onto the integrated circuit chip 31 (S105). Then, this semiconductor integrated circuit chip 3
The inspection of 1 is started.

The processing flow shown in FIG. 5 will be further described with reference to FIG. FIG. 6 shows how the two probe cards 1a and 1b perform inspection in time series. In the figure, the horizontal axis represents time t
Is. And A1, A2, A3, A4, A5, A6
Indicate semiconductor integrated circuit chips to be inspected.

First, at t = 0, the probe card 1
a starts the inspection of the semiconductor integrated circuit chip A1, and the probe card 1b starts the inspection of the semiconductor integrated circuit chip A2. In this example, it is assumed that both the semiconductor integrated circuit chip A1 and the semiconductor integrated circuit chip A2 have passed the inspection. Therefore, the inspection is completed at substantially the same time.

After that, the probe card 1a and the probe card 1b are moved to the next semiconductor integrated circuit chip A3 and semiconductor integrated circuit chip A4 to be inspected, and the inspection is started. In this example, it is assumed that the semiconductor integrated circuit chip A3 passed the inspection, but the semiconductor integrated circuit chip A4 failed the inspection. In this case, the probe card 1a is tested in the same manner as a normal test until the test of the semiconductor integrated circuit chip A3 is completed, but the probe card 1b fails the test of the semiconductor integrated circuit chip A4. The inspection is completed at the time t1 when it is determined that there is another semiconductor integrated circuit chip A5.
Moved up and started inspection. By controlling in this way, the inspection as a whole can be efficiently advanced, and the inspection time can be shortened.

Next, with reference to FIG. 7, a process when the inspection time of the semiconductor integrated circuit chip is different in each semiconductor integrated circuit chip will be described. In the example of FIG. 7, the semiconductor integrated circuit chips formed on the wafer 3 have different inspection times. It is conceivable that the cause of the different inspection time is that the trimming time may be different due to variations in analog circuits included in the semiconductor integrated circuit chip.

The probe card 1a sequentially inspects each of the semiconductor integrated circuit chips A1, A3, A6. On the other hand, the probe card 1b sequentially inspects each of the semiconductor integrated circuit chips A2, A4, A5, A7. As shown in the figure, even if the inspection time of each semiconductor integrated circuit chip is different, each inspection is independently executed without being affected by the inspection situation of other probe cards. . By controlling in this way, the inspection as a whole can be efficiently advanced, and the inspection time can be shortened.

In the semiconductor inspection apparatus according to the embodiment of the present invention, a plurality of probe cards can be used to inspect any semiconductor integrated circuit chip on the wafer. Therefore, the semiconductor integrated circuit chip located at the edge of the wafer can be inspected. When inspecting, it is possible to inspect more efficiently.

Other Embodiments. In the above example, the case of two probe cards has been described, but the present invention is not limited to this, and three or more arbitrary probe cards may be provided, and a drive mechanism may be provided for each probe card. . In particular, in order to increase the throughput of semiconductor inspection, it is better to provide more probe cards.

Further, in the above-mentioned example, an example of one semiconductor integrated circuit chip capable of simultaneously inspecting one probe card has been described, but the present invention is not limited to this, and it is possible to simultaneously inspect two or more semiconductor integrated circuit chips. May be.
Also in this case, the semiconductor inspection apparatus is provided with a plurality of probe cards, and the drive mechanism is provided for each probe card, which is the same as the above example.

It is desirable to control the inspection timing by the probe card based on the number of probe cards that simultaneously execute the inspection. By limiting the number of probe cards that perform an inspection at the same time,
This is because the contact weight can be limited to a certain value or less, and the entire device can be simplified.

[0056]

According to the present invention, it is possible to provide a semiconductor inspection device which is excellent in reliability and which inspects a semiconductor integrated circuit chip with high throughput and low cost.

[Brief description of drawings]

FIG. 1 is a functional block diagram of a semiconductor inspection device according to an embodiment of the present invention.

FIG. 2 is a sectional view of a semiconductor inspection device according to an embodiment of the present invention.

FIG. 3 is a functional block diagram of a semiconductor inspection device according to an embodiment of the present invention.

FIG. 4 is a sectional view of a semiconductor inspection device according to an embodiment of the present invention.

FIG. 5 is a flowchart showing a process of the semiconductor inspection device according to the embodiment of the present invention.

FIG. 6 is a diagram showing a process of the semiconductor inspection device according to the embodiment of the present invention.

FIG. 7 is a diagram showing a process of the semiconductor inspection device according to the embodiment of the present invention.

FIG. 8 is a functional block diagram of a semiconductor inspection device according to the previous example of the present invention.

FIG. 9 is a cross-sectional view of the semiconductor inspection device according to the previous example of the present invention.

FIG. 10 is a plan view of a wafer.

FIG. 11 is a diagram showing a configuration of a conventional probe head.

[Explanation of symbols]

1 Probe Card 2 Measurement / Inspection Device 3 Wafer 4 Wafer Holder 51 Z Drive Mechanism 53 XYZ
Drive mechanism 61 XY drive mechanism 7 Control device

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Claims (8)

[Claims] 1. A semiconductor inspection device for inspecting a plurality of semiconductor integrated circuits formed on a wafer, wherein the semiconductor integrated circuits are inspected in a state where the semiconductor integrated circuits and a probe are electrically contacted with each other. A plurality of probe cards; and a plurality of drive mechanisms that move the probe cards so that the semiconductor integrated circuits and the probes are brought into electrical contact, the plurality of drive mechanisms being provided for each of the plurality of probe cards. A semiconductor inspection device that is provided correspondingly and moves a plurality of probe cards independently. 2. The semiconductor inspection apparatus according to claim 1, wherein the plurality of drive mechanisms can move the probe card at least in a direction perpendicular to a main plane of the wafer. 3. The plurality of drive mechanisms move the probe card so that the electrical contact between the probe of the probe card and the semiconductor integrated circuit is optimized in each of the plurality of probe cards. The semiconductor inspection apparatus according to claim 2. 4. A wafer holding body for holding the wafer, and a drive mechanism for moving the wafer holding body in a horizontal direction of a main plane of the wafer. The semiconductor inspection device described. 5. The semiconductor inspection apparatus according to claim 1, wherein the plurality of driving mechanisms can move the probe card in a direction parallel to and a direction perpendicular to a main plane of the wafer. 6. The plurality of drive mechanisms, when it is judged as a failure when inspecting an arbitrary semiconductor integrated circuit, regardless of whether another probe card is inspected or not. 6. The semiconductor inspection apparatus according to claim 5, wherein the probe card is moved to start the inspection of another semiconductor integrated circuit. 7. When the inspection of an arbitrary semiconductor integrated circuit is completed, the plurality of drive mechanisms perform the inspection of the next semiconductor integrated circuit regardless of whether another probe card is being inspected. The semiconductor inspection apparatus according to claim 5, wherein the probe card is moved to start. 8. Each of the plurality of probe cards comprises:
8. The semiconductor inspection device according to claim 1, wherein the semiconductor inspection device is provided corresponding to one semiconductor integrated circuit.