JP2003101269A - Electronic appliance - Google Patents

Electronic appliance

Info

Publication number
JP2003101269A
JP2003101269A JP2001292868A JP2001292868A JP2003101269A JP 2003101269 A JP2003101269 A JP 2003101269A JP 2001292868 A JP2001292868 A JP 2001292868A JP 2001292868 A JP2001292868 A JP 2001292868A JP 2003101269 A JP2003101269 A JP 2003101269A
Authority
JP
Japan
Prior art keywords
receiving member
circuit board
heat receiving
heat
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001292868A
Other languages
Japanese (ja)
Other versions
JP3579384B2 (en
Inventor
Takeshi Hongo
武司 本郷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2001292868A priority Critical patent/JP3579384B2/en
Publication of JP2003101269A publication Critical patent/JP2003101269A/en
Application granted granted Critical
Publication of JP3579384B2 publication Critical patent/JP3579384B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure excellent in improvement for assembling workability and cost reduction, capable of excellently cooling an electronic component without damaging it even when an error is generated in a mounting dimension of the electronic component. SOLUTION: A heat receiving member 30 to which heat of a CPU 20 mounted on a circuit board 10 is transmitted is loaded, and the heat receiving member 30 is pressed by a holding member 40 having a spring property. Projections 33a and 33b are formed on an upper surface of the heat transmitting member 30, and the projections 33a and 33b are inserted to holes 46a and 46b formed on the holding member 40.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、ＣＰＵ等の電子部
品の冷却モジュールを有する電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a cooling module for electronic parts such as a CPU.

【０００２】[0002]

【従来の技術】近年電子機器に搭載されるＣＰＵは、動
作クロック周波数が向上し、ますます高速、高性能にな
ってきており、発熱量もますます大きいものとなってき
ており、ＣＰＵの性能を維持する為にはＣＰＵを冷却す
ることが必要となっている。冷却方法として、ヒートシ
ンク等の放熱部材をＣＰＵ上面に接続することで、ＣＰ
Ｕからの熱を放熱する方法が取られている。2. Description of the Related Art In recent years, CPUs installed in electronic devices have improved operating clock frequency, are becoming faster and more efficient, and are generating more and more heat. In order to maintain the above, it is necessary to cool the CPU. As a cooling method, by connecting a heat dissipation member such as a heat sink to the upper surface of the CPU, the CP
The method of radiating the heat from U is taken.

【０００３】従来のコンピュータ等の電子機器は、筐体
に回路基板が内蔵され、この基板上にＣＰＵが実装され
ている。ＣＰＵの底面には複数の電極がマトリックス状
に形成されており、回路基板にＣＰＵの電極が半田付け
等により接続されている。ＣＰＵの上方にはＣＰＵによ
り発熱される熱を放熱する為のヒートシンクが伝熱性の
良好な伝熱シート等を介して実装されている。ヒートシ
ンクはアルミ等の熱伝導性の良好な材料により形成さ
れ、回路基板にヒートシンクを固定する為の支持部を一
体形成している。ヒートシンクの支持部がネジを介して
回路基板に固定されることで、ＣＰＵは回路基板とヒー
トシンクとの間に挟まれるように実装される。In a conventional electronic device such as a computer, a circuit board is built in a housing, and a CPU is mounted on the board. A plurality of electrodes are formed in a matrix on the bottom surface of the CPU, and the electrodes of the CPU are connected to the circuit board by soldering or the like. A heat sink for dissipating heat generated by the CPU is mounted above the CPU via a heat transfer sheet or the like having a good heat transfer property. The heat sink is made of a material having a good thermal conductivity such as aluminum, and a support portion for fixing the heat sink is integrally formed on the circuit board. By fixing the support portion of the heat sink to the circuit board via the screw, the CPU is mounted so as to be sandwiched between the circuit board and the heat sink.

【０００４】上述したような従来の冷却モジュールにお
いては、ヒートシンクはネジにより筐体、あるいは回路
基板等にネジ止され、そのネジ止に係る力がそのままＣ
ＰＵに加わるような構造となっている。また、ＣＰＵの
寸法誤差、ＣＰＵの電極、例えば、半田バンプ、半田ボ
ール等の寸法誤差による実装高さによるバラツキ、ヒー
トシンクの製造公差等のさまざまな寸法誤差を押えなが
ら、さらに、ＣＰＵとヒートシンクの確実な熱接続を確
保する為に、ＣＰＵには非常に大きな加重が加わってい
る。In the conventional cooling module as described above, the heat sink is screwed to the housing, the circuit board or the like by screws, and the force related to the screwing is C as it is.
It has a structure that joins the PU. Further, while suppressing various dimensional errors such as the dimensional error of the CPU, the variation in the mounting height due to the dimensional error of the electrodes of the CPU such as solder bumps and solder balls, and the manufacturing tolerance of the heat sink, the reliability of the CPU and the heat sink is further improved. A great deal of weight is applied to the CPU to ensure proper thermal connection.

【０００５】さらに、近年のコンピュータ等の電子機器
はユーザーの使用目的、好みに合わせた仕様に応じて作
り分ける手法を取り入れたり、ユーザーが自由に仕様を
変更することが可能となってきている。例えば、ＣＰＵ
に関しては、動作クロック周波数の異なるものを容易に
取り替え可能なことが要求される。その為に、回路基板
にＣＰＵ実装用のソケットを実装し、このソケットにＣ
ＰＵを着脱可能に実装する方法が主流となってきてい
る。ソケットはマトリックス状に配置された複数の半田
ボールや、半田バンプ等により回路基板に半田付け実装
される。更にＣＰＵは着脱を容易にする為にＰＧＡ（Ｐ
ＩＮ ＧＲＩＤ ＡＲＲＡＹ）タイプのものが採用されて
いる。このタイプのＣＰＵは、ＣＰＵの電極として複数
のピンがマトリックス状にＣＰＵ下面に配置されてお
り、ソケットにＣＰＵのそれぞれのピンを差込実装する
方式となっている。このようなＣＰＵ実装方法によりユ
ーザーの要求を満たすことが可能となっている。Further, in recent years, electronic devices such as computers have been able to adopt a method of making them differently according to the purpose of use and preferences of the user, or the user can freely change the specifications. For example, CPU
With regard to (2), it is required that those having different operation clock frequencies can be easily replaced. Therefore, a socket for CPU mounting is mounted on the circuit board, and C is mounted on this socket.
A method of removably mounting a PU has become mainstream. The socket is soldered and mounted on the circuit board by a plurality of solder balls arranged in a matrix, solder bumps, and the like. Furthermore, the CPU has a PGA (P
IN GRID ARRAY) type is adopted. In this type of CPU, a plurality of pins as electrodes of the CPU are arranged in a matrix on the lower surface of the CPU, and each pin of the CPU is inserted and mounted in a socket. With such a CPU mounting method, it is possible to meet the user's request.

【０００６】上記したソケットは通常リフロー半田付け
されている。リフロー半田付けとはまず回路基板上の部
品を実装する為の電極パッド上に半田ペーストを塗布
し、次に高温のリフロー炉の中を通すことで半田ペース
トを溶融させ半田付けさせるものである。また回路基板
は両面に表面実装されており、回路基板表面へ部品（ソ
ケット等）をリフロー半田付けし、次に回路基板の裏面
に他の部品をリフロー半田付けする２ステップのリフロ
ー半田付けにより回路基板両面への部品実装が行われ
る。通常回路基板は、実装する面を上面にしてリフロー
炉内に入れられるThe above-mentioned socket is usually reflow-soldered. Reflow soldering is a method in which a solder paste is first applied onto an electrode pad for mounting a component on a circuit board, and then the solder paste is melted and soldered by passing through a high temperature reflow furnace. In addition, the circuit board is surface-mounted on both sides, and parts (sockets, etc.) are reflow-soldered on the surface of the circuit board, and then other parts are reflow-soldered on the back surface of the circuit board by two-step reflow soldering. Components are mounted on both sides of the board. Normally, the circuit board is placed in the reflow oven with the mounting surface facing up.

【０００７】この際、表面へのリフロー半田付けにより
ソケットが正常に実装されているにも関わらず、裏面へ
のリフロー半田付けの際、回路基板をリフロー炉内に入
れた際、表面（リフロー炉内では下面）に実装されてい
る部品を接続している半田が再度溶融される。この半田
が溶融している状態において、ソケットの自重により、
ソケットが回路基板から離れる方向に傾いたり等してし
まう。At this time, even though the socket is normally mounted by reflow soldering on the front surface, when the circuit board is put in the reflow furnace during reflow soldering on the back surface, the surface (reflow furnace Inside, the solder connecting the components mounted on the bottom surface is melted again. In the state where this solder is melted, due to the weight of the socket,
The socket may tilt away from the circuit board.

【０００８】ソケットの実装において、電極の半田付け
等の品質によるソケットの実装高さ、傾きに大きくバラ
ツキが出てくる。さらにはＣＰＵのピンのソケットへの
差込具合や、ＣＰＵの寸法誤差、ソケットの寸法誤差に
より、ＣＰＵ実装後の回路基板面からＣＰＵ上面までの
高さ寸法はかなりのバラツキが出てきてしまう。In mounting the socket, the mounting height and inclination of the socket greatly vary depending on the quality of soldering the electrodes. Furthermore, the height dimension from the surface of the circuit board after mounting the CPU to the top surface of the CPU varies considerably depending on how the pins of the CPU are inserted into the socket, the dimension error of the CPU, and the dimension error of the socket.

【０００９】このような実装方法を取っているＣＰＵに
上述したようなヒートシンクを接続し、回路基板にネジ
止めすると、ヒートシンクを止めるネジ固定力がそのま
まＣＰＵあるいはソケットに加わってしまう。従って、
ＣＰＵやソケットに許容量以上の加重が加わわると、Ｃ
ＰＵ、ソケットそれぞれの電極の亀裂、破損、回路破壊
等、回路モジュールに悪影響を及ぼすという問題を誘発
してしまう。When the heat sink as described above is connected to the CPU adopting such a mounting method and screwed to the circuit board, the screw fixing force for stopping the heat sink is directly applied to the CPU or the socket. Therefore,
If the CPU or socket is loaded with more than the allowable amount, C
This causes a problem that a circuit module is adversely affected, such as cracks, breakage, and circuit breakage of electrodes of the PU and the socket.

【００１０】このような問題点を解決する例として例え
ば、特開２００１−１１０９６７号公報「電子素子の放
熱構造」がある。特開２００１−１１０９６７号公報に
開示されている電子素子の冷却構造は、基板に実装され
た電子素子に伝熱ブロックを接触させ、電熱ブロックか
らヒートパイプを介して熱拡散板に熱拡散する冷却構造
において、伝熱ブロックの基板への実装に際し、ブロッ
クの４角に設けられている固定用のネジとブロックとの
間にコイルスプリングをそれぞれ介在させる構造が開示
されている。このような構造で電子素子の高さ寸法の誤
差を吸収する方法を提案している。As an example of solving such a problem, there is Japanese Patent Application Laid-Open No. 2001-110967, "heat dissipation structure of electronic element". A cooling structure for an electronic element disclosed in Japanese Patent Laid-Open No. 2001-110967 is a cooling method in which a heat transfer block is brought into contact with an electronic element mounted on a substrate, and heat is diffused from an electric heating block to a heat diffusion plate via a heat pipe. In the structure, when mounting the heat transfer block on the substrate, a structure in which coil springs are respectively interposed between fixing screws provided at four corners of the block and the block is disclosed. With such a structure, a method of absorbing an error in the height dimension of the electronic device is proposed.

【００１１】しかしながら、特開２００１−１１０９６
７号公報に開示の構成では部品点数の増加につながり、
組立て性、コストの面で余り好ましくない。However, Japanese Patent Laid-Open No. 2001-11096
The configuration disclosed in Japanese Patent No. 7 leads to an increase in the number of parts,
Not very preferable in terms of assemblability and cost.

【００１２】[0012]

【発明が解決しようとする課題】本発明は上記のような
点に鑑みてなされたもので、電子部品や電子部品の実装
寸法に誤差が生じたとしても、電子部品を破損させるこ
となく良好に冷却することができ、組立て性の向上、コ
スト削減に良的な電子機器を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above points. Even if an error occurs in the electronic component or the mounting dimension of the electronic component, the electronic component can be satisfactorily maintained without being damaged. It is an object of the present invention to provide a good electronic device that can be cooled, has improved assemblability, and can reduce costs.

【００１３】[0013]

【課題を解決するための手段】上記目的を達成するため
に、請求項１に係る電子機器は、本体と、本体に内蔵さ
れ、電子部品が実装された回路基板と、電子部品に熱的
に接続されるととともに、電子部品に熱的に接続する面
とは反対面に形成される突起を有する受熱部材と、受熱
部材を挟むように電子部品と対向して回路基板に実装さ
れるとともに、受熱部材に当接する押え部と、回路基板
に実装された時突起が挿入される孔とを有する保持部材
と、を具備する事を特徴とする。In order to achieve the above object, an electronic device according to a first aspect of the present invention includes a main body, a circuit board built in the main body, on which electronic components are mounted, and the electronic components are thermally Along with being connected, a heat receiving member having a projection formed on the surface opposite to the surface thermally connected to the electronic component, and being mounted on the circuit board facing the electronic component so as to sandwich the heat receiving member, The present invention is characterized by including a holding member having a holding portion that abuts against the heat receiving member and a hole into which the protrusion is inserted when mounted on the circuit board.

【００１４】請求項４に係る電子機器は、本体と、本体
に内蔵され、電子部品が実装された回路基板と、電子部
品に熱的に接続され電子部品の熱が伝熱されるととも
に、電子部品に熱的に接続する面とは反対面に形成され
る突起を有する受熱部材と、受熱部材を挟むように電子
部品と対向して回路基板に実装されるとともに、受熱部
材に当接する押え部と、回路基板に実装された時突起が
挿入される孔とを有し、電子部品と押え部との間で受熱
部材の所定量の移動を許容する保持部材と、を具備する
事を特徴とする。According to a fourth aspect of the present invention, there is provided an electronic device, a main body, a circuit board which is built in the main body, and on which electronic components are mounted, and which is thermally connected to the electronic components to transfer the heat of the electronic components and also to the electronic components. A heat receiving member having a protrusion formed on a surface opposite to a surface thermally connected to the heat receiving member, and a pressing portion that is mounted on the circuit board so as to face the electronic component so as to sandwich the heat receiving member, and abuts on the heat receiving member. A holding member having a hole into which the protrusion is inserted when mounted on the circuit board, and allowing a predetermined amount of movement of the heat receiving member between the electronic component and the holding portion. .

【００１５】請求項１０に係る電子機器は、本体と、本
体に内蔵され、電子部品が実装された回路基板と、電子
部品に熱的に接続され電子部品の熱が伝熱されるととも
に、電子部品に熱的に接続する面とは反対面に形成され
る突起を有する受熱部材と、受熱部材を挟むように電子
部品と対向して配置され、略四角状に形成され受熱部材
に当接する押え部と、押え部の４角よりそれぞれ延出す
るバネ部と、バネ部から回路基板方向に延びるとともに
回路基板に固定される脚部と、回路基板に実装された時
突起が挿入される孔とを有し、電子部品と押え部との間
で受熱部材の所定量の移動を許容する保持部材と、を具
備する事を特徴とする。According to a tenth aspect of the present invention, an electronic device has a main body, a circuit board built in the main body, on which electronic components are mounted, and the electronic components are thermally connected to transfer the heat of the electronic components, And a heat receiving member having a protrusion formed on a surface opposite to a surface thermally connected to the electronic component, and a pressing portion which is arranged to face the electronic component so as to sandwich the heat receiving member and which is formed in a substantially square shape and abuts on the heat receiving member. A spring portion extending from each of the four corners of the holding portion, a leg portion extending from the spring portion in the circuit board direction and fixed to the circuit board, and a hole into which a protrusion is inserted when mounted on the circuit board. And a holding member that allows a predetermined amount of movement of the heat receiving member between the electronic component and the pressing portion.

【００１６】このような構成により、電子部品の実装高
さ寸法の誤差や傾きが生じた場合でも、ネジ固定されな
い受熱部材およびバネ性を持つ保持部材の関係により、
寸法誤差や傾きを吸収することができ、電子部品に許容
量以上の加重が加わることがなく、また、電子部品の電
極の亀裂、破損、回路破壊等、回路モジュールへの影響
を最小限に押えることが可能となる。With such a configuration, even if an error or inclination of the mounting height of the electronic component occurs, the relationship between the heat receiving member that is not fixed by the screw and the holding member that has the spring property is
Dimensional errors and tilts can be absorbed, the electronic components are not overloaded, and the effects on the circuit module such as cracks, damages, and circuit destruction of the electrodes of the electronic components can be minimized. It becomes possible.

【００１７】[0017]

【発明の実施の形態】以下ノート型コンピュータ等の電
子機器に適用した本発明に係る実施の形態を、図面を参
照して説明する。図１は電子機器の斜視図である。コン
ピュータ１は本体４を有している。本体４は上ケース２
および下ケース３を有している。本体４の上面にはキー
ボード５が配置されている。本体４の後部にはヒンジ部
６が設けられており、このヒンジ部６を介して表示部７
が本体４に対して回動可能に接続されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention applied to an electronic device such as a notebook computer will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic device. The computer 1 has a main body 4. The body 4 is the upper case 2
And a lower case 3. A keyboard 5 is arranged on the upper surface of the main body 4. A hinge portion 6 is provided on the rear portion of the main body 4, and the display portion 7 is provided through the hinge portion 6.
Is rotatably connected to the body 4.

【００１８】図２は冷却構造の分解斜視図である。図３
は冷却構造の斜視図である。図２に示すように、下ケー
ス３には複数のボス３ａ，３ｂ，３ｃ，３ｄ（３ｄは図
示せず）が設けられている。下ケース３および上ケース
２の内面はシールドメッキされており本体ＧＮＤとして
機能する。これらボス３ａ，３ｂ，３ｃ，３ｄの上には
回路基板１０が実装される。回路基板１０にはネジ孔１
２ａ，１２ｂ，１２ｃ，１２ｄ（１２ｄは図示せず）が
設けられ、これらネジ孔１２ａ，１２ｂ，１２ｃ，１２
ｄの周りには回路基板１０のＧＮＤ層に電気的に接続さ
れているパッド１１ａ，１１ｂ，１１ｃ，１１ｄ（１１
ｄは図示せず）が形成されている。回路基板１０はボス
１４ａ，１４ｂ，１４ｃ，１４ｄにそれぞれ設けられた
ネジ部１６ａ，１６ｂ，１６ｃ，１６ｄにより、ネジ孔
１２ａ，１２ｂ，１２ｃ，１２ｄを介してボス３ａ，３
ｂ，３ｃ，３ｄに固定される。このとき回路基板１０の
ＧＮＤパターンはパッド１１ａ，１１ｂ，１１ｃ，１１
ｄ、ネジ部１６ａ，１６ｂ，１６ｃ，１６ｄおよびボス
３ａ，３ｂ，３ｃ，３ｄを介して本体４のＧＮＤに電気
的に接続されることになる。また、ボス１４ａ，１４
ｂ，１４ｃ，１４ｄはネジ孔１５ａ，ｂ，ｃ，ｄ（１５
ｄは図示せず）を有している。FIG. 2 is an exploded perspective view of the cooling structure. Figure 3
FIG. 4 is a perspective view of a cooling structure. As shown in FIG. 2, the lower case 3 is provided with a plurality of bosses 3a, 3b, 3c, 3d (3d is not shown). The inner surfaces of the lower case 3 and the upper case 2 are shield-plated and function as the main body GND. The circuit board 10 is mounted on the bosses 3a, 3b, 3c, 3d. Screw holes 1 on the circuit board 10
2a, 12b, 12c, 12d (12d is not shown) are provided, and these screw holes 12a, 12b, 12c, 12 are provided.
Pads 11a, 11b, 11c and 11d (11 which are electrically connected to the GND layer of the circuit board 10 are provided around d.
d is not shown). The circuit board 10 has screw portions 16a, 16b, 16c, 16d provided on the bosses 14a, 14b, 14c, 14d, respectively, and is screwed through the screw holes 12a, 12b, 12c, 12d to the bosses 3a, 3d.
It is fixed to b, 3c and 3d. At this time, the GND pattern of the circuit board 10 is the pads 11a, 11b, 11c, 11
d, the screw portions 16a, 16b, 16c, 16d and the bosses 3a, 3b, 3c, 3d, and are electrically connected to the GND of the main body 4. Also, the bosses 14a, 14
b, 14c, 14d are screw holes 15a, b, c, d (15
d is not shown).

【００１９】回路基板１０の上面にはマトリックス状に
複数の電極パッド１３が形成されている。この電極パッ
ド１３上にはソケット１７が実装される。ソケット１７
は上面にＣＰＵを実装する為にマトリックス状に複数の
電極端子１７ａが配置されている。ソケット１７の下面
にはマトリックス状に複数の半田ボール（図示せず）が
設けられており、リフロー半田付けにより半田付けされ
る。ネジ孔１２ａ，１２ｂ，１２ｃ，１２ｄおよびボス
１４ａ，１４ｂ，１４ｃ，１４ｄは電極パッド１３の４
角に隣接して配置されている。A plurality of electrode pads 13 are formed in a matrix on the upper surface of the circuit board 10. The socket 17 is mounted on the electrode pad 13. Socket 17
Has a plurality of electrode terminals 17a arranged in a matrix for mounting the CPU on the upper surface. A plurality of solder balls (not shown) are provided in a matrix on the lower surface of the socket 17, and are soldered by reflow soldering. The screw holes 12a, 12b, 12c, 12d and the bosses 14a, 14b, 14c, 14d are formed on the electrode pad 13 at four positions.
It is located adjacent to the corner.

【００２０】ＣＰＵ２０は基台２０ａとこの基台２０ａ
の上面に配置される素子２１と基台２０ａの下面にマト
リックス状に配置される複数のピン２３を有している。
素子２１とピン２３とは基台２０ａ内部を介して電気的
に接続されている。ＣＰＵ２０のピン２３はソケット１
７の電極端子１７ａに挿入され、図示しないソケットの
固定手段により容易にピン２３が電極端子１７ａから抜
けないように固定される。また図示しない固定手段をロ
ック解除することでピン２３は電極端子１７ａから容易
に抜くことが可能であり、ＣＰＵを容易に変更すること
も可能である。The CPU 20 includes a base 20a and the base 20a.
It has the element 21 arranged on the upper surface and the plurality of pins 23 arranged in a matrix on the lower surface of the base 20a.
The element 21 and the pin 23 are electrically connected via the inside of the base 20a. Pin 23 of CPU 20 is socket 1
7 is inserted into the electrode terminal 17a, and the pin 23 is easily fixed by a socket fixing means (not shown) so as not to come off from the electrode terminal 17a. The pin 23 can be easily pulled out from the electrode terminal 17a by unlocking the fixing means (not shown), and the CPU can be easily changed.

【００２１】ＣＰＵ２０の素子２１の上面には熱伝導部
材として熱伝導グリース２２が塗布される。熱伝導グリ
ース２２は熱伝導性の良好な材料を含有しており、ＣＰ
Ｕ２０および素子２１が発熱する熱が良好にグリース２
２に伝熱される。なお、グリースの代わりに熱伝導性パ
ッド等を使用してもよい。Thermal conductive grease 22 is applied as a thermal conductive member on the upper surface of the element 21 of the CPU 20. The thermal conductive grease 22 contains a material having good thermal conductivity,
The heat generated by the U20 and the element 21 is good and the grease 2 is good.
Heat is transferred to 2. A heat conductive pad or the like may be used instead of the grease.

【００２２】ＣＰＵ２０の上面にはアルミダイキャスト
製の受熱部材３０が搭載される。受熱部材３０はＣＰＵ
２０の基台２０ａと略同じ面積を有しており四角形状に
形成されている。受熱部材３０はＣＰＵ２０の上面に搭
載される際、ＣＰＵ２０の素子２１と受熱部材３０の下
面との間には伝熱グリース２２が充填されることとな
り、ＣＰＵ２０が発熱する熱は伝熱グリース２２を介し
て受熱部材３０に伝熱される。受熱部材３０の上面中央
にはヒートパイプ５０を接続する為の溝３２ａが形成さ
れている。ヒートパイプ５０は溝３２ａに接続された
後、圧着等により接続固定されている。図３に示すよう
に、ヒートパイプ５０は、受熱部材３０に伝熱された熱
をファンユニット（冷却ユニット）６０に伝熱する為に
機能する。受熱部材３０の上面には溝３２ａを挟んで一
対の突起（）３３ａ，３３ｂが一体形成されている。突
起３３ａ，３３ｂはボス状に形成されており、上部にネ
ジ孔３４ａ，３４ｂがそれぞれ形成されている。受熱部
材３０は単にＣＰＵ２０の上面に搭載されるのみで、回
路基板１０およびＣＰＵ２０にネジ固定等はされていな
い。A heat receiving member 30 made of aluminum die cast is mounted on the upper surface of the CPU 20. The heat receiving member 30 is a CPU
It has substantially the same area as the base 20a of 20 and is formed in a square shape. When the heat receiving member 30 is mounted on the upper surface of the CPU 20, the heat transfer grease 22 is filled between the element 21 of the CPU 20 and the lower surface of the heat receiving member 30, and the heat generated by the CPU 20 is transferred to the heat transfer grease 22. The heat is transferred to the heat receiving member 30 via the heat receiving member 30. A groove 32 a for connecting the heat pipe 50 is formed in the center of the upper surface of the heat receiving member 30. The heat pipe 50 is connected and fixed by pressure bonding or the like after being connected to the groove 32a. As shown in FIG. 3, the heat pipe 50 functions to transfer the heat transferred to the heat receiving member 30 to the fan unit (cooling unit) 60. A pair of protrusions () 33a and 33b are integrally formed on the upper surface of the heat receiving member 30 with the groove 32a interposed therebetween. The protrusions 33a and 33b are formed in a boss shape, and screw holes 34a and 34b are formed in the upper portions thereof, respectively. The heat receiving member 30 is simply mounted on the upper surface of the CPU 20, and is not screwed to the circuit board 10 and the CPU 20.

【００２３】受熱部材３０の上面には保持部材４０が搭
載される。保持部材４０は略四角形状の押え部４１を有
している。押え部４１の４角からはそれぞれバネ部（連
結部）４２ａ，４２ｂ，４２ｃ，４２ｄが上方に折れ曲
るように延出し、さらに下方に脚部４９ａ，４９ｂ，４
９ｃ，４９ｄ（４９ｃは図示せず）を形成するように延
出している。バネ部４２ａ，４２ｂ，４２ｃ，４２ｄの
先端にはそれぞれ固定部４３ａ，３ｂ，３ｃ，３ｄ（４
３ｃは図示せず）が設けられる。固定部４３ａ，３ｂ，
３ｃ，３ｄにはそれぞれネジ孔４４ａ，４４ｂ，４４
ｃ，４４ｄ（４４ｃは図示せず）が設けられている。押
え部４１の対向する２辺からは保持片４５ａ，４５ｂが
形成されている。保持片４５ａ，４５ｂそれぞれには孔
４６ａ，４６ｂが形成されている。保持部材４０はステ
ンレスや鉄等の部材にて薄く形成されており、保持部材
４０全体に亘ってバネ性を有している。A holding member 40 is mounted on the upper surface of the heat receiving member 30. The holding member 40 has a substantially rectangular holding portion 41. Spring portions (coupling portions) 42a, 42b, 42c and 42d extend from the four corners of the holding portion 41 so as to be bent upward, and leg portions 49a, 49b and 4 are further lowered.
It extends so as to form 9c and 49d (49c is not shown). At the tips of the spring portions 42a, 42b, 42c, 42d, fixing portions 43a, 3b, 3c, 3d (4
3c is provided (not shown). Fixing parts 43a, 3b,
3c and 3d have screw holes 44a, 44b and 44, respectively.
c and 44d (44c is not shown) are provided. Holding pieces 45a and 45b are formed from two opposite sides of the pressing portion 41. Holes 46a and 46b are formed in the holding pieces 45a and 45b, respectively. The holding member 40 is thinly formed of a member such as stainless steel or iron, and has a spring property over the entire holding member 40.

【００２４】図４は図３におけるＡ−Ａ’線に沿う断面
を示す図である。図５は図３におけるＢ−Ｂ’に沿う断
面を示す図である。図３乃至図５に示すように、保持部
材４０の固定部４３ａ，４３ｂ，４３ｃ，４３ｄはネジ
孔４４ａ，４４ｂ，４４ｃ，４４ｄおよびネジ４８ａ，
４８ｂ，４８ｃ，４８ｄを介して、ボス１４ａ，１４
ｂ，１４ｃ，１４ｄに固定される。FIG. 4 is a view showing a cross section taken along the line AA 'in FIG. FIG. 5 is a view showing a cross section taken along the line BB ′ in FIG. As shown in FIGS. 3 to 5, the fixing portions 43a, 43b, 43c, 43d of the holding member 40 have screw holes 44a, 44b, 44c, 44d and screws 48a,
Bosses 14a, 14 via 48b, 48c, 48d
It is fixed to b, 14c and 14d.

【００２５】保持部材４０が回路基板上に実装されると
押え部４１は受熱部材３０を上から押えるように実装さ
れる。このとき、バネ部４２ａ，４２ｂ，４２ｃ，４２
ｄおよび脚部４９ａ，４９ｂ，４９ｃ，４９ｄはＣＰＵ
２０および受熱部材３０からは離間している。すなわ
ち、押え部４１の下面のみが受熱部材３０および受熱部
材３０に圧着固定されているヒートパイプ５０に当接し
ている。When the holding member 40 is mounted on the circuit board, the pressing portion 41 is mounted so as to press the heat receiving member 30 from above. At this time, the spring portions 42a, 42b, 42c, 42
d and legs 49a, 49b, 49c, 49d are CPUs
It is separated from 20 and the heat receiving member 30. That is, only the lower surface of the pressing portion 41 is in contact with the heat receiving member 30 and the heat pipe 50 fixed to the heat receiving member 30 by pressure bonding.

【００２６】保持部材４０が受熱部材３０の上面に搭載
された際、受熱部材３０上面に形成されている突起３３
ａ，３３ｂは保持部材４０に形成されている孔４６ａ，
４６ｂにそれぞれ挿入される。孔４６ａ，４６ｂは突起
４５ａ，４５ｂの径よりも大きく形成されている。従っ
て、突起３３ａ，３３ｂは孔４６ａ，４６ｂに問題なく
挿入され、さらに突起３３ａ，３３ｂと孔４６ａ，４６
ｂとの間は、受熱部材３０の水平方向への移動は若干の
自由度を持たせだけの間隙となっている。さらに突起３
３ａ，３３ｂの上面は押え部４１の上面よりも突出して
いる。ネジ４７ａ，４７ｂは単に突起３３ａ，３３ｂの
上面にネジ止めされるのみで押え部４１を固定するもの
ではない。また、ネジ４７ａ，４７ｂの頭部は孔４６
ａ，４６ｂよりも大きな径で形成されている。従って、
突起３３ａ，３３ｂはネジ４７ａ，４７ｂの頭部により
押え部４１の孔４６ａ，４６ｂから抜けることはない。When the holding member 40 is mounted on the upper surface of the heat receiving member 30, the projection 33 formed on the upper surface of the heat receiving member 30.
a and 33b are holes 46a formed in the holding member 40,
46b, respectively. The holes 46a and 46b are formed larger than the diameters of the protrusions 45a and 45b. Therefore, the protrusions 33a and 33b can be inserted into the holes 46a and 46b without any problem, and the protrusions 33a and 33b and the holes 46a and 46b can be inserted.
Between b and b, there is a gap that allows the heat receiving member 30 to move in the horizontal direction with some degree of freedom. Further protrusion 3
The upper surfaces of 3a and 33b project more than the upper surface of the pressing portion 41. The screws 47a and 47b are merely screwed to the upper surfaces of the protrusions 33a and 33b and do not fix the holding portion 41. Further, the heads of the screws 47a and 47b have holes 46.
It is formed with a diameter larger than a and 46b. Therefore,
The protrusions 33a and 33b are not removed from the holes 46a and 46b of the holding portion 41 by the heads of the screws 47a and 47b.

【００２７】図８は、図３におけるＣ−Ｃ’線に沿う断
面を示す図である。図３および図８に示すように、受熱
部材３０に固定されているヒートパイプ５０は延長部５
１および５２を介してファンユニット６０に挿入され
る。ファンユニット６０はアルミダイキャストにより形
成され、内部に空気が流れるダクト（図示せず）を持っ
たハウジング６３を有している。ハウジング６３は一端
６３ａの上面に空気流入口６４ａを有している。ハウジ
ング６３の固定部６５ａ，６５ｂ，６５ｃ，６５ｄはネ
ジ６７ａ，ｂ，ｃ，ｄにより回路基板１０に固定され
る。ハウジング６３には空気流入口６４ａに対向してフ
ァン６２が内蔵されている。ハウジング６３の他端６３
ｂには空気排出口６４ｂが形成されている。ファン６２
の回転により空気流入口６４ａより流入された空気は内
部のダクトを通り、空気排出口６４ｂに吐き出される。
ファンユニット６０に挿入されたヒートパイプ５０の端
部５３は空気排出口６４ｂに位置している。ヒートパイ
プ５０の端部５３には複数のフィン７０が固定されてお
り、フィン７０は空気排出口６４ｂに位置している。FIG. 8 is a view showing a cross section taken along the line CC 'in FIG. As shown in FIGS. 3 and 8, the heat pipe 50 fixed to the heat receiving member 30 has the extension 5
It is inserted into the fan unit 60 via 1 and 52. The fan unit 60 is formed by aluminum die casting and has a housing 63 having a duct (not shown) through which air flows. The housing 63 has an air inlet 64a on the upper surface of one end 63a. The fixed portions 65a, 65b, 65c, 65d of the housing 63 are fixed to the circuit board 10 by screws 67a, b, c, d. A fan 62 is built in the housing 63 so as to face the air inlet 64a. The other end 63 of the housing 63
An air discharge port 64b is formed at b. Fan 62
The air that has flowed in through the air inlet 64a due to the rotation of 1 passes through the internal duct and is discharged to the air outlet 64b.
The end portion 53 of the heat pipe 50 inserted in the fan unit 60 is located at the air discharge port 64b. A plurality of fins 70 are fixed to the end portion 53 of the heat pipe 50, and the fins 70 are located at the air exhaust port 64b.

【００２８】ＣＰＵ２０の熱は受熱部材３０を介してヒ
ートパイプ５０に伝熱される。ヒートパイプ５０に伝わ
った熱は延長部５１，５２を介して端部５３に伝わる。
端部５３に伝わった熱はフィン７０に伝わる。空気排出
口６４ｂに位置するフィン７０はファン６２により取り
込まれた空気により冷却される。このような構成により
効果的な冷却モジュールを提供することが可能となる。The heat of the CPU 20 is transferred to the heat pipe 50 via the heat receiving member 30. The heat transmitted to the heat pipe 50 is transmitted to the end portion 53 via the extension portions 51 and 52.
The heat transferred to the end portion 53 is transferred to the fin 70. The fins 70 located at the air outlet 64b are cooled by the air taken in by the fan 62. With such a configuration, it is possible to provide an effective cooling module.

【００２９】次にＣＰＵ２０の実装高さ寸法の誤差、バ
ラツキが生じた場合の保持部材４０と受熱部材３０、Ｃ
ＰＵ２０およびソケット１７との関係について説明す
る。Next, the holding member 40 and the heat receiving members 30, C when the mounting height dimension of the CPU 20 has an error or variation.
The relationship between the PU 20 and the socket 17 will be described.

【００３０】図６はＣＰＵ実装に傾きが生じた場合の図
３におけるＢ−Ｂ’線に沿う断面を示す図である。ＣＰ
Ｕ２０およびソケット１７に傾きが生じる理由について
は先述している為、説明を省略する。FIG. 6 is a view showing a cross section taken along the line BB ′ in FIG. 3 when the CPU mounting is tilted. CP
The reason why the U20 and the socket 17 are tilted has been described above, and the description thereof will be omitted.

【００３１】ソケット１７の実装、ＣＰＵ２０の実装に
起因してもし、ソケット１７もしくはＣＰＵ２０が回路
基板１０の上面に対してＸ度の角度を持って実装された
としても、受熱部材３０もＸ度に傾く。すなわち、図６
中、ＣＰＵ２０およびソケット１７の右側部が回路基板
１０の上面から上方に持ちあがった状態に傾いた場合、
受熱部材３０もＣＰＵ２０、ソケット１７と同様に傾
く。このとき、突起３３ａ，３３ｂは孔４６ａ，４６ｂ
の中で、孔４６ａ，４６ｂの径方向あるいは上下方向に
任意に移動される。Due to the mounting of the socket 17 and the CPU 20, even if the socket 17 or the CPU 20 is mounted at an angle of X degrees with respect to the upper surface of the circuit board 10, the heat receiving member 30 is also mounted at X degrees. Lean. That is, FIG.
When the right side of the CPU 20 and the socket 17 is tilted upward from the upper surface of the circuit board 10,
The heat receiving member 30 also tilts like the CPU 20 and the socket 17. At this time, the protrusions 33a and 33b are formed in the holes 46a and 46b.
Inside, the holes 46a and 46b are arbitrarily moved in the radial direction or the vertical direction.

【００３２】すなわち、回路基板１０に固定されている
保持部材４０の押え部４１による押え力が加わったとし
ても、ソケット１７、ＣＰＵ２０の傾きを受熱部材３０
の突起３３ａ，３３ｂと押え部４１の孔４６ａ，４６ｂ
との関係により吸収されることとなる。さらに保持部材
４０はバネ性を持って形成されている為、押え部４１が
ある程度の受熱部材３０の傾きに対して上下に押される
ことで吸収することができる。このような保持部材４０
の撓み状態を図７に示す。図７はＣＰＵ実装高さ寸法に
誤差が生じた場合の図３におけるＡ−Ａ’線に沿う断面
を示す図である。That is, even if the pressing force of the pressing portion 41 of the holding member 40 fixed to the circuit board 10 is applied, the inclination of the socket 17 and the CPU 20 is not applied to the heat receiving member 30.
Protrusions 33a, 33b and holes 46a, 46b of the holding portion 41
Will be absorbed by the relationship with. Further, since the holding member 40 is formed with a spring property, the holding portion 41 can be absorbed by being pushed up and down with respect to the inclination of the heat receiving member 30 to some extent. Such a holding member 40
FIG. 7 shows the flexed state of No. FIG. 7 is a view showing a cross section taken along line AA ′ in FIG. 3 when an error occurs in the CPU mounting height dimension.

【００３３】保持部材４０の押え部４１が受熱部材３０
およびヒートパイプ５０により下方より押圧されると、
押え部４１は上方に持ちあがり、この押え部４１の持ち
あがりをバネ部４２ａ，４２ｂ，４２ｃ，４２ｄおよび
脚部４９ａ，４９ｂ，４９ｃ，４９ｄが上下左右に撓む
ことで吸収することができる。このとき、固定部４３
ａ，３ｂ，３ｃ，３ｄはネジ４８ａ，４８ｂ，４８ｃ，
４８ｄにより固定されており、また保持部材４０はバネ
性を有している為、バネ部４２ａ，４２ｂ，４２ｃ，４
２ｄおよび脚部４９ａ，４９ｂ，４９ｃ，４９ｄの復帰
力により押え部４１は受熱部材３０方向へ付勢される。
この付勢力により受熱部材３０のＣＰＵ２０への密着を
維持するように機能し、ＣＰＵ２０からの受熱部材３０
への伝熱機能を維持する。The holding portion 41 of the holding member 40 has the heat receiving member 30.
And when pressed from below by the heat pipe 50,
The holding portion 41 is lifted upward, and the holding of the holding portion 41 can be absorbed by bending the spring portions 42a, 42b, 42c, 42d and the leg portions 49a, 49b, 49c, 49d vertically and horizontally. At this time, the fixed portion 43
a, 3b, 3c, 3d are screws 48a, 48b, 48c,
Since the holding member 40 is fixed by 48d and the holding member 40 has a spring property, the spring portions 42a, 42b, 42c, 4
The pressing portion 41 is urged toward the heat receiving member 30 by the restoring force of 2d and the leg portions 49a, 49b, 49c, 49d.
This urging force functions to maintain the heat receiving member 30 in close contact with the CPU 20, and the heat receiving member 30 from the CPU 20 is maintained.
Maintains heat transfer function to.

【００３４】以上のような構成により、ＣＰＵやソケッ
トの実装高さ寸法の誤差や傾きが生じた場合でも、ネジ
固定されない受熱部材およびバネ性を持つ保持部材の関
係により、寸法誤差や傾きを吸収することができ、ＣＰ
Ｕやソケットに許容量以上の加重が加わることがなく、
また、ＣＰＵ、ソケットそれぞれの電極の亀裂、破損、
回路破壊等、回路モジュールへの影響を最小限に押える
ことが可能となる。With the above-described structure, even if the mounting height of the CPU or the socket has an error or inclination, the dimensional error or inclination is absorbed by the relationship between the heat-receiving member that is not fixed by the screw and the holding member having a spring property. Can, CP
U or socket is not overloaded,
Also, the electrodes of the CPU and socket are cracked, damaged,
It is possible to minimize the influence on the circuit module such as circuit breakage.

【００３５】なお、本実施の形態では保持部材に脚部を
構成するようにしているが、単なる板状にし、ボスを介
して回路基板に保持するようにしてもよい。In this embodiment, the legs are formed in the holding member. However, the legs may be formed in a simple plate shape and held on the circuit board via bosses.

【００３６】また、受熱部材の突起を中央に一つのみ設
けるようにしてもよい。この場合、受熱部材の移動量を
大きくすることが可能となり、ＣＰＵ等の実装高さ寸法
誤差、傾きの許容量を大きくすることが可能となる。Further, only one protrusion of the heat receiving member may be provided in the center. In this case, it is possible to increase the movement amount of the heat receiving member, and it is possible to increase the mounting height dimension error of the CPU or the like and the allowable amount of inclination.

【００３７】本発明ではその主旨を逸脱しない範囲であ
れば、上記の実施形態に限定されるものではない。本実
施の形態ではノート型コンピュータに適用したが、デス
クトップ型のコンピュータに適用してもよい。The present invention is not limited to the above embodiment as long as it does not depart from the spirit of the invention. Although this embodiment is applied to a notebook computer, it may be applied to a desktop computer.

【００３８】[0038]

【発明の効果】以上詳述した発明によれば、電子部品や
電子部品の実装寸法に誤差が生じたとしても、電子部品
の電極破損等を極力減少させる事が無く、組立て性の向
上、コスト削減に良的な電子機器を提供することを目的
とする。According to the invention described in detail above, even if an error occurs in the electronic component or the mounting dimension of the electronic component, the damage to the electrode of the electronic component is not reduced as much as possible, the assemblability is improved, and the cost is improved. The purpose is to provide a good electronic device for reduction.

【図面の簡単な説明】[Brief description of drawings]

【図１】電子機器の斜視図。FIG. 1 is a perspective view of an electronic device.

【図２】冷却構造の分解斜視図。FIG. 2 is an exploded perspective view of a cooling structure.

【図３】冷却構造の斜視図。FIG. 3 is a perspective view of a cooling structure.

【図４】図３におけるＡ−Ａ’線に沿う断面を示す図。FIG. 4 is a diagram showing a cross section taken along line A-A ′ in FIG.

【図５】図３におけるＢ−Ｂ’線に沿う断面を示す図。5 is a view showing a cross section taken along line B-B ′ in FIG.

【図６】ＣＰＵ実装に傾きが生じた場合の図３における
Ｂ−Ｂ’線に沿う断面を示す図。FIG. 6 is a view showing a cross section taken along line BB ′ in FIG. 3 when the CPU mounting is tilted.

【図７】ＣＰＵ実装高さ寸法に誤差が生じた場合の図３
におけるＡ−Ａ’線に沿う断面を示す図。FIG. 7 is a diagram when an error occurs in the CPU mounting height dimension.
The figure which shows the cross section which follows the AA 'line in FIG.

【図８】図３における断面Ｃ−Ｃを示す断面図。8 is a cross-sectional view showing a cross section CC in FIG.

【符号の説明】[Explanation of symbols]

１…コンピュータ ２…上ケース ３…下ケース ４…本体 ５…キーボード ６…ヒンジ部 ７…表示部 １０…回路基板 １７…ソケット ２０…ＣＰＵ ２１…素子 ２２…グリース ３０…受熱部材 ３３ａ，３３ｂ…突起 ４０…保持部材 ４１…押え部 ４２ａ，４２ｂ，４２ｃ，４２ｄ…バネ部 ４７ａ，４７ｂ、４８ａ，４８ｂ，４８ｃ，４８ｄ…ネ
ジ ４９ａ，４９ｂ，４９ｃ，４９ｄ…脚部 ５０…ヒートパイプDESCRIPTION OF SYMBOLS 1 ... Computer 2 ... Upper case 3 ... Lower case 4 ... Main body 5 ... Keyboard 6 ... Hinge part 7 ... Display part 10 ... Circuit board 17 ... Socket 20 ... CPU 21 ... Element 22 ... Grease 30 ... Heat receiving member 33a, 33b ... Protrusion 40 ... Holding member 41 ... Holding part 42a, 42b, 42c, 42d ... Spring part 47a, 47b, 48a, 48b, 48c, 48d ... Screw 49a, 49b, 49c, 49d ... Leg part 50 ... Heat pipe

Claims (10)

【特許請求の範囲】[Claims] 【請求項１】 本体と、 上記本体に内蔵され、電子部品が実装された回路基板
と、 上記電子部品に熱的に接続されるととともに、上記電子
部品に熱的に接続する面とは反対面に形成される突起を
有する受熱部材と、 上記受熱部材を挟むように上記電子部品と対向して上記
回路基板に実装されるとともに、上記受熱部材に当接す
る押え部と、上記回路基板に実装された時上記突起が挿
入される孔とを有する保持部材と、 を具備する事を特徴とする電子機器。1. A body, a circuit board built in the body, on which electronic components are mounted, and a surface that is thermally connected to the electronic component and that is thermally connected to the electronic component. A heat receiving member having a protrusion formed on a surface thereof, a mounting portion which is mounted on the circuit board so as to face the electronic component so as to sandwich the heat receiving member, and which is abutting against the heat receiving member, and mounted on the circuit board. And a holding member having a hole into which the protrusion is inserted when the electronic device is pressed. 【請求項２】 上記保持部材は、上記回路基板に固定さ
れる脚部と上記押え部と上記脚部とを連結する連結部と
を有し、少なくとも上記連結部はバネ性を有している事
を特徴とする請求項１記載の電子機器。2. The holding member has a leg portion fixed to the circuit board, a connecting portion connecting the pressing portion and the leg portion, and at least the connecting portion has a spring property. The electronic device according to claim 1, characterized in that. 【請求項３】 上記突起が上記孔に挿入された後、上記
突起上部に固定されるネジを有し、このネジの頭部の径
は上記孔の径よりも大きい事を特徴とする請求項２記載
の電子機器。3. The projection has a screw fixed to the upper portion of the projection after being inserted into the hole, and the diameter of the head of the screw is larger than the diameter of the hole. The electronic device according to 2. 【請求項４】 本体と、 上記本体に内蔵され、電子部品が実装された回路基板
と、 上記電子部品に熱的に接続され上記電子部品の熱が伝熱
されるとともに、上記電子部品に熱的に接続する面とは
反対面に形成される突起を有する受熱部材と、 上記受熱部材を挟むように上記電子部品と対向して上記
回路基板に実装されるとともに、上記受熱部材に当接す
る押え部と、上記回路基板に実装された時上記突起が挿
入される孔とを有し、上記電子部品と上記押え部との間
で上記受熱部材の所定量の移動を許容する保持部材と、 を具備する事を特徴とする電子機器。4. A main body, a circuit board built in the main body, on which electronic components are mounted, thermally connected to the electronic components to transfer heat of the electronic components, and to the electronic components. A heat receiving member having a protrusion formed on a surface opposite to a surface connected to the heat receiving member, and a holding portion that is mounted on the circuit board so as to face the electronic component so as to sandwich the heat receiving member, and abuts on the heat receiving member. And a holding member having a hole into which the protrusion is inserted when mounted on the circuit board, and allowing a predetermined amount of movement of the heat receiving member between the electronic component and the pressing portion. An electronic device characterized by doing. 【請求項５】 上記保持部材は、上記回路基板に固定さ
れる脚部と上記押え部と上記脚部とを連結する連結部と
を有し、少なくとも上記連結部はバネ性を有している事
を特徴とする請求項４記載の電子機器。5. The holding member has a leg portion fixed to the circuit board, a connecting portion connecting the pressing portion and the leg portion, and at least the connecting portion has a spring property. The electronic device according to claim 4, wherein 【請求項６】 上記突起が上記孔に挿入された後、上記
突起上部に固定されるネジを有し、このネジの頭部の径
は上記孔の径よりも大きい事を特徴とする請求項５記載
の電子機器。6. The screw has a screw fixed to an upper portion of the protrusion after the protrusion is inserted into the hole, and a diameter of a head portion of the screw is larger than a diameter of the hole. The electronic device according to item 5. 【請求項７】 上記回路基板に搭載される冷却ユニット
と、一端が上記受熱部材に保持され他端が上記冷却ユニ
ットに保持されるヒートパイプとを有する請求項１乃至
６の何れかに記載の電子機器。7. A cooling unit mounted on the circuit board, and a heat pipe having one end held by the heat receiving member and the other end held by the cooling unit. Electronics. 【請求項８】 上記冷却ユニットは空気流入口と、空気
排出口と、上記冷却ユニット内において上記空気流入口
と対向して配置されるファンとを有し、上記ヒートパイ
プの他端は上記空気排出口に隣接して配置されている事
を特徴とする請求項７記載の電子機器。8. The cooling unit has an air inlet, an air outlet, and a fan disposed inside the cooling unit so as to face the air inlet, and the other end of the heat pipe is provided with the air. The electronic device according to claim 7, wherein the electronic device is arranged adjacent to the discharge port. 【請求項９】 上記ヒートパイプの他端には複数のフィ
ンが設けられる事を特徴とする請求項８記載の電子機
器。9. The electronic device according to claim 8, wherein a plurality of fins are provided at the other end of the heat pipe. 【請求項１０】 本体と、 上記本体に内蔵され、電子部品が実装された回路基板
と、 上記電子部品に熱的に接続され上記電子部品の熱が伝熱
されるとともに、上記電子部品に熱的に接続する面とは
反対面に形成される突起を有する受熱部材と、 上記受熱部材を挟むように上記電子部品と対向して配置
され、略四角状に形成され上記受熱部材に当接する押え
部と、上記押え部の４角よりそれぞれ延出するバネ部
と、上記バネ部から上記回路基板方向に延びるとともに
上記回路基板に固定される脚部と、上記回路基板に実装
された時上記突起が挿入される孔とを有し、上記電子部
品と上記押え部との間で上記受熱部材の所定量の移動を
許容する保持部材と、 を具備する事を特徴とする電子機器。10. A main body, a circuit board built in the main body, on which electronic components are mounted, thermally connected to the electronic components to transfer the heat of the electronic components, and to the electronic components. A heat receiving member having a protrusion formed on a surface opposite to a surface connected to the heat receiving member, and a pressing portion that is arranged to face the electronic component so as to sandwich the heat receiving member, is formed in a substantially square shape, and abuts on the heat receiving member. A spring portion extending from each of the four corners of the holding portion; a leg portion extending from the spring portion in the direction of the circuit board and fixed to the circuit board; and a protrusion when mounted on the circuit board. An electronic device comprising: a holding member having a hole to be inserted therein and allowing a predetermined amount of movement of the heat receiving member between the electronic component and the pressing portion.
JP2001292868A 2001-09-26 2001-09-26 Electronics Expired - Fee Related JP3579384B2 (en)

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