JP3515552B2 - Cooling device and electronic device with built-in cooling device - Google Patents
Cooling device and electronic device with built-in cooling deviceInfo
- Publication number
- JP3515552B2 JP3515552B2 JP2001290246A JP2001290246A JP3515552B2 JP 3515552 B2 JP3515552 B2 JP 3515552B2 JP 2001290246 A JP2001290246 A JP 2001290246A JP 2001290246 A JP2001290246 A JP 2001290246A JP 3515552 B2 JP3515552 B2 JP 3515552B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cooling device
- transfer means
- heat transfer
- fan case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体パッケー
ジのような発熱部を冷却するための冷却装置及びこの冷
却装置を搭載したポータブルコンピュータなどの電子機
器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling a heat generating part such as a semiconductor package and an electronic device such as a portable computer equipped with the cooling device.
【０００２】[0002]
【従来の技術】近時、この種の電子機器の分野において
は、文字、音声、画像等の多様な情報を処理する電子部
品、たとえばＭＰＵ（Micro Processing Unit）の処理
速度の高速化や、多機能化の促進が進められている。こ
のような電子機器は、そのＭＰＵが高集積化や高性能化
に伴って消費電力が増大され、動作中の発熱量もこれに
比例して急速に増加する傾向にある。2. Description of the Related Art Recently, in the field of this kind of electronic equipment, the processing speed of electronic parts for processing various information such as characters, voices, images, etc., such as MPU (Micro Processing Unit), has been increased, Functionalization is being promoted. In such an electronic device, the power consumption of the MPU increases as the integration and performance of the MPU increase, and the amount of heat generated during operation tends to increase rapidly in proportion to this.
【０００３】そのため、発熱量の大きなＭＰＵをポータ
ブルコンピュータのハウジングに収容するに当たって
は、このハウジング内でのＭＰＵの放熱性を高める必要
があり、それ故、ＭＰＵを強制的に冷却する冷却装置が
必要不可欠な存在となる。Therefore, when the MPU having a large heat generation amount is housed in the housing of the portable computer, it is necessary to enhance the heat dissipation of the MPU in the housing, and therefore a cooling device for forcibly cooling the MPU is required. It becomes an indispensable existence.
【０００４】従来、上記冷却装置は、ヒートシンクを有
し、このヒートシンクは電動式のファンユニットと一体
化されている。このヒートシンクには受熱部、ファン取
付け部及び熱交換部を一体に有している。上記受熱部は
配線基板に設けられた発熱部としてのＭＰＵなどの電子
部品に接合され、この電子部品と熱的に接続される。上
記熱交換部は上記ファン取付け部を挟んで上記受熱部と
は反対側に設けられている。さらに、上記冷却装置に
は、熱移送手段としてのヒートパイプが一端部を上記受
熱部に埋め込み、他端部を上記熱交換部に接続して設け
られている。Conventionally, the cooling device has a heat sink, which is integrated with an electric fan unit. The heat sink integrally has a heat receiving portion, a fan mounting portion, and a heat exchange portion. The heat receiving portion is joined to an electronic component such as an MPU as a heat generating portion provided on the wiring board and is thermally connected to this electronic component. The heat exchange section is provided on the opposite side of the heat receiving section with the fan mounting section interposed therebetween. Further, in the cooling device, a heat pipe as a heat transfer means is provided with one end embedded in the heat receiving part and the other end connected to the heat exchange part.
【０００５】それによって、電子部品の熱は、上記ヒー
トシンク全体に拡散されるとともに、上記ヒートパイプ
によって上記受熱部から熱交換部へ積極的に移送され、
上記ファンユニットのファンからの送風によって熱交換
部からハウジングの外部に放散されるようになってい
る。As a result, the heat of the electronic component is diffused throughout the heat sink and is positively transferred from the heat receiving portion to the heat exchange portion by the heat pipe,
Air is blown from the fan of the fan unit to be dissipated from the heat exchange portion to the outside of the housing.
【０００６】[0006]
【発明が解決しようとする課題】上記構成の冷却装置
は、上述したように受熱部、ファン取付け部及び熱交換
部がヒートシンクに一体形成されていた。そのため、冷
却装置は、ファニュニット、受熱部及び熱交換部が自由
度のない構成となっているため、上記配線基板に実装さ
れる電子部品の実装状態、たとえば傾きや高さが一定で
ない場合、冷却装置を実装するに当たり、受熱部に荷重
をかけ、ヒートパイプを撓ませることで、上記電子部品
に受熱部を密着させるようにしていた。In the cooling device having the above structure, the heat receiving portion, the fan mounting portion and the heat exchanging portion are integrally formed on the heat sink as described above. Therefore, the cooling device has a structure in which the fan unit, the heat receiving unit, and the heat exchanging unit have no degree of freedom. Therefore, when the mounting state of the electronic component mounted on the wiring board, for example, the inclination or the height is not constant, When mounting the cooling device, a load is applied to the heat receiving portion and the heat pipe is bent to bring the heat receiving portion into close contact with the electronic component.
【０００７】しかしながら、そのようにすると、上記受
熱部を介して電子部品に大きな荷重がかかることになる
から、その荷重が電子部品の耐荷重スペックを超えてし
まうことがあったり、ヒートパイプの撓み量が大きくな
ると、潰れなどが生じて性能低下を招くこともある。However, in such a case, a large load is applied to the electronic component via the heat receiving portion, so that the load may exceed the withstand load specification of the electronic component or the heat pipe may be bent. If the amount is large, crushing may occur and the performance may be deteriorated.
【０００８】この発明は、発熱部の実装状態が一定でな
くても、その発熱部に応力が加わったり、熱移送手段に
撓みが生じることなく実装することができるようにした
冷却装置及びその冷却装置を内蔵した電子機器を提供す
ることにある。According to the present invention, even if the mounting state of the heat-generating portion is not constant, the heat-generating portion can be mounted without applying stress to the heat-generating portion and without bending of the heat transfer means, and a cooling device thereof. It is to provide an electronic device having a built-in device.
【０００９】[0009]
【課題を解決するための手段】この発明は、発熱部に熱
的に接続される受熱部と、この受熱部に一端部が伝熱可
能に接続される熱移送手段と、この熱移送手段の他端部
に設けられこの熱移送手段によって移送される上記受熱
部の熱を受ける熱交換部と、この熱交換部及び熱交換部
を冷却するための送風手段が収容され上記受熱部が上記
発熱部の実装状態に応じて変位可能となるよう上記熱移
送手段を支持するファンケースとを具備した冷却装置に
ある。According to the present invention, there is provided a heat receiving portion which is thermally connected to a heat generating portion, a heat transfer means whose one end is capable of transferring heat to the heat receiving portion, and a heat transfer means of the heat transfer means. A heat exchanging unit provided at the other end for receiving the heat of the heat receiving unit transferred by the heat transferring unit and a blowing unit for cooling the heat exchanging unit and the heat exchanging unit are housed, and the heat receiving unit generates the heat. And a fan case that supports the heat transfer means so that the heat transfer means can be displaced according to the mounting state of the unit.
【００１０】また、この発明は、電子部品が実装された
配線基板が設けられる機器本体と、上記電子部品に熱的
に接続される受熱部と、この受熱部に一端部が伝熱可能
に接続される熱移送手段と、この熱移送手段の他端部に
設けられこの熱移送手段によって移送される上記受熱部
の熱を受ける熱交換部と、この熱交換部及び熱交換部を
冷却するための送風手段が収容され上記受熱部が上記発
熱部の実装状態に応じて変位可能となるよう上記熱移送
手段が支持されるファンケースとを具備したことを特徴
とする電子機器にある。Further, according to the present invention, a device main body provided with a wiring board on which electronic parts are mounted, a heat receiving part thermally connected to the electronic parts, and one end of the heat receiving part connected to the heat receiving part so that heat can be transferred. The heat transfer means, the heat exchange part provided at the other end of the heat transfer means for receiving the heat of the heat receiving part transferred by the heat transfer means, and for cooling the heat exchange part and the heat exchange part. And a fan case in which the heat transfer unit is supported so that the heat receiving unit can be displaced according to the mounting state of the heat generating unit.
【００１１】このような構成によれば、一端に受熱部、
他端に熱交換部が設けられた熱移送手段はファンケース
に対して変位可能になっている。そのため、実装された
発熱部の高さや傾きが一定でなくても、その実装状態に
応じて受熱部を変位させることができるから、発熱部や
熱移送手段に応力を発生させることなく、上記受熱部を
発熱部に密着させることが可能となる。According to this structure, the heat receiving portion is provided at one end,
The heat transfer means having the heat exchange portion at the other end is displaceable with respect to the fan case. Therefore, even if the height and the inclination of the mounted heat generating portion are not constant, the heat receiving portion can be displaced according to the mounting state, so that the heat receiving portion can be generated without causing stress in the heat generating portion and the heat transfer means. It is possible to bring the part into close contact with the heat generating part.
【００１２】[0012]
【発明の実施の形態】以下、図面を参照しながらこの発
明の実施の形態を説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００１３】図１乃至図７はこの発明の一実施の形態を
示し、図１と図２に示す電子機器としてのポータブルコ
ンピュータ１は機器本体２を有する。この機器本体２は
ケース３とカバー４とによって箱型状に形成されてい
る。上記カバー４にはパームレスト部５が設けられ、こ
のパームレスト部５の後方にキーボード取付け部６が形
成されている。キーボード取付け部６にはキーボード７
が前端を取付け部６に係合させ、後端部を図示しないね
じによって上記カバー４に取付けられている。1 to 7 show an embodiment of the present invention. A portable computer 1 as an electronic device shown in FIGS. 1 and 2 has a device body 2. The device body 2 is formed in a box shape by a case 3 and a cover 4. A palm rest portion 5 is provided on the cover 4, and a keyboard attachment portion 6 is formed behind the palm rest portion 5. The keyboard 7 is attached to the keyboard mounting portion 6.
Has its front end engaged with the mounting portion 6, and its rear end is attached to the cover 4 by screws (not shown).
【００１４】上記カバー４の後端部には一対のヒンジ部
１１によって液晶ディスプレイ１２（ＬＣＤ）が開閉可
能に取付けられている。上記機器本体２内には図２に示
すように配線基板１３が収容配置されている。この配線
基板１３には上記キーボード７及び液晶ディスプレイ１
２が電気的に接続されている。それによって、キーボー
ド７のキーの操作に連動して所望の情報が上記液晶ディ
スプレイ１２に表示されるようになっている。A liquid crystal display 12 (LCD) is attached to the rear end of the cover 4 by a pair of hinges 11 so as to be openable and closable. As shown in FIG. 2, a wiring board 13 is accommodated and arranged in the device body 2. The keyboard 7 and the liquid crystal display 1 are provided on the wiring board 13.
2 are electrically connected. As a result, desired information is displayed on the liquid crystal display 12 in synchronization with the operation of the keys of the keyboard 7.
【００１５】図２と図３に示すように、上記配線基板１
３にはソケット１４が設けられ、このソケット１４には
発熱部となるＭＰＵなどの電子部品１５が実装される。
この電子部品１５は作動にともない発熱するため、上記
配線基板１３に実装される冷却装置２１によって強制的
に冷却される。As shown in FIGS. 2 and 3, the wiring board 1 is provided.
3, a socket 14 is provided, and an electronic component 15 such as an MPU that serves as a heat generating portion is mounted on the socket 14.
Since the electronic component 15 generates heat as it operates, it is forcibly cooled by the cooling device 21 mounted on the wiring board 13.
【００１６】図２乃至図５に示すように、上記冷却装置
２１は熱移送手段としてのヒートパイプ２２を有する。
このヒートパイプ２２は第１の端部２３ａと第２の端部
２３ｂとを有し、これら端部の間が湾曲部２３ｃとなっ
ていて、この湾曲部２３ｃにより第１の端部２３ａと第
２の端部２３ｂとはほぼ９０度の角度をなしている。As shown in FIGS. 2 to 5, the cooling device 21 has a heat pipe 22 as a heat transfer means.
The heat pipe 22 has a first end portion 23a and a second end portion 23b, and a curved portion 23c is formed between these end portions, and the curved portion 23c allows the first end portion 23a and the first end portion 23a to be connected to each other. The second end 23b forms an angle of approximately 90 degrees.
【００１７】上記ヒートパイプ２２の第１の端部２３ａ
には熱伝導率の高い金属である、アルミニウムなどによ
って矩形板状に形成された受熱部２４が取付けられてい
る。図５と図７に示すように、この受熱部２４の一側面
の所定方向の中央部には、その所定方向と交差する方向
の全長にわたる取付け溝２５が開口形成されている。こ
の取付け溝２５の両側には突条部２６が全長にわたって
形成されている。The first end 23a of the heat pipe 22
A heat receiving portion 24 formed of a metal such as aluminum having a high heat conductivity in a rectangular plate shape is attached to the. As shown in FIGS. 5 and 7, a mounting groove 25 is formed in the central portion of one side surface of the heat receiving portion 24 in the predetermined direction so as to extend over the entire length in the direction intersecting with the predetermined direction. On both sides of the mounting groove 25, ridges 26 are formed over the entire length.
【００１８】上記取付け溝２５には上記ヒートパイプ２
２の第１の端部２３ａが伝熱シート（図示せず）を介し
て嵌合され、上記突条部２６を部分的にカシメたカシメ
部２６ａによって固定的に結合されている。なお、突条
部２６のカシメられない部分は、図７に示すように取付
け溝２５に嵌合されたヒートパイプ２２よりもわずかに
上方へ突出する高さとなっている。The heat pipe 2 is provided in the mounting groove 25.
The first end portion 23a of the second member 2 is fitted via a heat transfer sheet (not shown), and is fixedly connected by the crimped portion 26a obtained by partially crimping the ridge portion 26. The non-crimped portion of the ridge 26 has a height that projects slightly above the heat pipe 22 fitted in the mounting groove 25 as shown in FIG. 7.
【００１９】図２乃至図５に示すように、上記受熱部２
４の一側面にはばね部材２８が取付けられる。上記ばね
部材２８は、矩形状の基部３１と、この基部３１の四隅
部から延出された４本の脚部３２とを有する。As shown in FIGS. 2 to 5, the heat receiving portion 2 is
A spring member 28 is attached to one side surface of the plate 4. The spring member 28 has a rectangular base portion 31 and four leg portions 32 extending from the four corners of the base portion 31.
【００２０】各脚部３２は基部３１に連設された基端部
から先端部に向かって上方に湾曲し、先端部はＬ字状の
取付け部３３に折曲されている。図５に示すように、上
記基部３１には一対の第１の取付け孔３４が基部３１の
所定方向の両端部に形成され、各脚部３２には第２の取
付け孔３５が形成されている。Each leg portion 32 is curved upward from a base end portion connected to the base portion 31 toward a tip end portion, and the tip end portion is bent into an L-shaped attachment portion 33. As shown in FIG. 5, the base 31 has a pair of first mounting holes 34 formed at both ends of the base 31 in a predetermined direction, and each leg 32 has a second mounting hole 35 formed therein. .
【００２１】上記基部３１の中央部には、この基部３１
の上記所定方向に沿って直線状の当接部３６が下面側に
突出形成されている。この当接部３６の幅方向の断面形
状はたとえば半円弧状などの曲面になっている。At the center of the base 31, the base 31
A linear contact portion 36 is formed on the lower surface side so as to project along the above predetermined direction. The cross-sectional shape of the contact portion 36 in the width direction is a curved surface such as a semicircular arc shape.
【００２２】上記基部３１の一側面にはねじ孔が形成さ
れた一対のボス部３８が突設され、上記基部３１は一対
の第１の取付け孔３４を介して上記ボス部３８に螺合さ
れるねじ３７により上記受熱部２４の一側面に取付けら
れる。A pair of boss portions 38 each having a screw hole are formed on one side surface of the base portion 31, and the base portion 31 is screwed into the boss portion 38 through the pair of first mounting holes 34. The screw 37 is attached to one side surface of the heat receiving portion 24.
【００２３】第１の取付け孔３４はボス部３８の外形寸
法よりも大径で、ねじ３７の頭部は第１の取付け孔３４
よりも大径になっている。それによって、ねじ３７によ
り上記受熱部２４に取付けられるばね部材２８の基部３
１は、上記受熱部２４に対してガタのある状態で取付け
られ、基部３１を受熱部２４に後述するごとく圧接させ
ると、上記ばね部材２８の基部３１は、受熱部２４の突
条部２６に接触する当接部３６を支点として揺動可能と
なっている。The first mounting hole 34 has a diameter larger than the outer dimension of the boss portion 38, and the head of the screw 37 has the first mounting hole 34.
It has a larger diameter than. Thereby, the base portion 3 of the spring member 28 attached to the heat receiving portion 24 by the screw 37.
1 is attached to the heat receiving portion 24 in a loose state, and when the base portion 31 is brought into pressure contact with the heat receiving portion 24 as described later, the base portion 31 of the spring member 28 is attached to the ridge portion 26 of the heat receiving portion 24. It is possible to swing about the contacting contact portion 36 as a fulcrum.
【００２４】図２や図６、図７に示すように、上記ばね
部材２８の脚部３２は、その先端の取付け部３３が上記
配線基板１３に設けられたスタッド４１に第２の取付け
孔３５を介してねじ４２により取付け固定される。脚部
３２は弾性的に変形させて配線基板１３に取付けられ
る。それによって、基部３１に形成された当接部３６は
受熱部２４の突条部２６を弾性的に押圧するから、上記
受熱部２４の他側面が上記配線基板１３に実装された電
子部品１５に伝熱シート（図示せず）を介して密着す
る。As shown in FIG. 2, FIG. 6 and FIG. 7, the leg portion 32 of the spring member 28 has a mounting portion 33 at the tip thereof in a stud 41 provided on the wiring board 13 and a second mounting hole 35. It is attached and fixed by a screw 42 through. The legs 32 are elastically deformed and attached to the wiring board 13. As a result, the contact portion 36 formed on the base portion 31 elastically presses the ridge portion 26 of the heat receiving portion 24, so that the other side surface of the heat receiving portion 24 is attached to the electronic component 15 mounted on the wiring board 13. It adheres via a heat transfer sheet (not shown).
【００２５】ばね部材２８の基部３１は受熱部２４に対
してガタのある状態で取付けられているため、脚部３２
をスタッド４１にねじ４２によって取付け、上記基部３
１を受熱部２４に密着させる際、基部３１はその一部分
である当接部３６が受熱部２４の突条部２６に接触する
から、その突条部２６を支点として揺動しながら固定さ
れる。Since the base portion 31 of the spring member 28 is attached to the heat receiving portion 24 in a loose state, the leg portion 32 is provided.
To the stud 41 with a screw 42, and the base 3
When the base 1 is brought into close contact with the heat receiving portion 24, the contact portion 36, which is a part of the base portion 31, comes into contact with the ridge portion 26 of the heat receiving portion 24. .
【００２６】そのため、ばね部材２８はその基部３１の
当接部３６により受熱部２４の中心部に押圧力を加える
ことができるから、その押圧力は受熱部２４の全体にほ
ぼ均一に分布する。つまり、受熱部２４を電子部品１５
に均一に密着させることができるから、伝熱効果を高め
ることができる。Therefore, since the spring member 28 can apply a pressing force to the central portion of the heat receiving portion 24 by the abutting portion 36 of the base portion 31, the pressing force is substantially evenly distributed over the entire heat receiving portion 24. That is, the heat receiving portion 24 is connected to the electronic component 15
The heat transfer effect can be enhanced because the heat transfer effect can be made uniform.
【００２７】しかも、ばね部材２８の押圧力はヒートパ
イプ２２の第１の端部２３ａに直接加わることがないか
ら、ヒートパイプ２２の第１の端部２３ａがばね部材２
８によって押し潰れるのが防止される。Moreover, since the pressing force of the spring member 28 is not directly applied to the first end portion 23a of the heat pipe 22, the first end portion 23a of the heat pipe 22 is pushed by the spring member 2.
It is prevented from being crushed by 8.
【００２８】上記ヒートパイプ２２の第２の端部２３ｂ
には熱交換部４６が設けられている。この熱交換部４６
は所定間隔で配置された多数のフィン４７からなり、こ
れらフィン４７の中心部に上記ヒートパイプ２２の第２
の端部２３ｂが貫通している。The second end 23b of the heat pipe 22
A heat exchange section 46 is provided in the. This heat exchange section 46
Is composed of a large number of fins 47 arranged at predetermined intervals, and the second part of the heat pipe 22 is provided at the center of the fins 47.
End portion 23b penetrates.
【００２９】上記熱交換部４６は上記機器本体２に実装
されるファンケース５１に収容される。このファンケー
ス５１は、図５に示すように底壁５２ａ及びこの底壁５
２ａの周縁に起立した側壁５２ｂを有し、上面となる一
側面及び一端部が開放した本体部５２と、この本体部５
２の一側面の開口部を閉塞する蓋体部５３とからなる。
蓋体部５３の周縁部には複数の爪５４が設けられ、これ
らの爪５４の先端部を折曲して上記本体部５２の他側面
となる底壁５２ａの外面に係合させることで、本体部５
２と蓋体部５３とが一体化される。The heat exchange section 46 is housed in the fan case 51 mounted on the device body 2. The fan case 51 includes a bottom wall 52a and a bottom wall 52a as shown in FIG.
A main body portion 52 having a side wall 52b standing upright on the periphery of 2a and having one side surface as an upper surface and one end portion opened, and the main body portion 5
2 and a lid 53 that closes the opening on one side surface.
A plurality of claws 54 are provided on the peripheral edge portion of the lid portion 53, and by bending the tip end portions of these claws 54 to engage with the outer surface of the bottom wall 52a which is the other side surface of the main body portion 52, Body part 5
2 and the lid 53 are integrated.
【００３０】図３乃至図５に示すように、本体部５２と
蓋体部５３とが一体化された上記ファンケース５１の一
端部には、その端面と下面とに開口する開口部５５が形
成される。ファンケース５１内の空間部は、上記開口部
５５側の一端部が第１の収容部５６に形成され、他端部
は第２の収容部５７に形成されている。As shown in FIGS. 3 to 5, at one end of the fan case 51 in which the main body 52 and the lid 53 are integrated, an opening 55 is formed which opens to the end face and the lower face. To be done. In the space inside the fan case 51, one end on the side of the opening 55 is formed in the first accommodating portion 56, and the other end is formed in the second accommodating portion 57.
【００３１】上記第１の収容部５６には上記熱交換部４
６が一側面及び下面を上記開口部５５に臨ませて収容さ
れ、上記第２の収容部５７には上記ファンケース５１の
本体部５２と一体的に送風手段としての送風機５８が回
転軸線を本体部５２の底壁５ａの板面に鉛直にして設け
られている。上記開口部５５は機器本体２のケース３の
側壁に形成された排気口５９（図１に示す）に対向して
いる。The heat exchange section 4 is provided in the first accommodating section 56.
6 is housed with one side surface and a lower surface facing the opening 55, and a blower 58 as a blower unit integrally with the main body 52 of the fan case 51 has a rotation axis in the second storage 57. It is provided vertically on the plate surface of the bottom wall 5a of the portion 52. The opening 55 faces an exhaust port 59 (shown in FIG. 1) formed in the side wall of the case 3 of the device body 2.
【００３２】上記送風機５８は通電されることで回転
し、上記蓋体部５３に形成された吸引孔６１からファン
ケース５１内に外気を導入し、上記熱交換部４６に向け
て送風する。The blower 58 rotates by being energized, introduces the outside air into the fan case 51 from the suction hole 61 formed in the lid 53, and blows it toward the heat exchange section 46.
【００３３】それによって、上記受熱部２４を介してヒ
ートパイプ２２の第１の端部２３ａから第２の端部２３
ｂに移送された電子部品１５の熱は上記熱交換部４６か
ら上記排気口５９を通じて上記機器本体２の外部に排出
されるようになっている。As a result, the first end portion 23a to the second end portion 23 of the heat pipe 22 are passed through the heat receiving portion 24.
The heat of the electronic component 15 transferred to b is discharged from the heat exchanging portion 46 to the outside of the device body 2 through the exhaust port 59.
【００３４】上記ヒートパイプ２２は上記ファンケース
５１の本体部５２の側壁５２ｂを貫通している。つま
り、上記側壁５２ｂの熱交換部４６が収容される第１の
収容部５６を形成する部分には、上記ヒートパイプ２２
の外形寸法に対して幅寸法及び高さ寸法が大きく設定さ
れた第１の支持部としての貫通溝６４が形成され、この
貫通溝６４の下端に上記ヒートパイプ２２の第２の端部
２３ｂよりも内方の個所が支持されている。つまり、ヒ
ートパイプ２２は、このヒートパイプ２２の外形寸法よ
りも幅及び高さ寸法が大きな貫通溝６４に支持されるこ
とで、これらの寸法差に応じて図４（ｃ）に矢印で示す
上下方向及び図４（ａ）に矢印で示す左右方向、つまり
３６０度方向に変位可能となっている。The heat pipe 22 penetrates the side wall 52b of the main body 52 of the fan case 51. That is, the heat pipe 22 is provided in a portion of the side wall 52b forming the first accommodating portion 56 in which the heat exchange portion 46 is accommodated.
A through groove 64 as a first supporting portion whose width and height dimensions are set larger than the outer dimensions of the heat pipe 22 is formed at the lower end of the through groove 64 from the second end portion 23b of the heat pipe 22. The inner part is also supported. That is, the heat pipe 22 is supported by the through-groove 64 having a width and height larger than the outer dimensions of the heat pipe 22, so that the heat pipe 22 moves up and down as indicated by an arrow in FIG. Direction and the left-right direction indicated by the arrow in FIG. 4A, that is, in the direction of 360 degrees.
【００３５】上記ヒートパイプ２２の第２の端部２３ｂ
の先端は上記熱交換部４６から突出し、その突出部は上
記ファンケース５１の第１の収容部５６に設けられた第
２の支持部としての受け溝６５に支持されている。この
受け溝６５は上記ヒートパイプ２２の端部をガタのある
状態で支持している。Second end 23b of the heat pipe 22
Of the heat exchange portion 46, and the projection portion is supported by a receiving groove 65 as a second support portion provided in the first accommodating portion 56 of the fan case 51. The receiving groove 65 supports the end portion of the heat pipe 22 in a loose state.
【００３６】それによっても、上記ヒートパイプ２２は
上記ファンケース５１に対して３６０度方向に変位可能
になっている。Also by this, the heat pipe 22 can be displaced in the direction of 360 degrees with respect to the fan case 51.
【００３７】さらに、上記第１の収容部５６の端面及び
下面が開放していること、及び上記熱交換部４６は上記
第１の収容部５６の上下、左右の寸法よりもわずかに小
さく形成されていることによって、上記熱交換部４６
は、上記ヒートパイプ２２が上記ファンケース５１に対
して３６０度方向のいずれかに動くときに、その動きを
邪魔することがないようになっている。Furthermore, the end surface and the lower surface of the first accommodating portion 56 are open, and the heat exchanging portion 46 is formed to be slightly smaller than the vertical and lateral dimensions of the first accommodating portion 56. The heat exchange section 46
When the heat pipe 22 moves in any direction of 360 degrees with respect to the fan case 51, it does not disturb the movement.
【００３８】上記ヒートパイプ２２は第１の端部２３ａ
と第２の端部２３ｂとがほぼ９０度をなすよう湾曲部２
３ｃを介して湾曲形成されている。そのため、ヒートパ
イプ２２がほぼ直線状の場合に比べてこのヒートパイプ
２２の第１の端部２３ａに設けられる受熱部２４と、第
２の端部２３ｂに設けられる熱交換部４６が収容された
ファンケース５１との距離を短くすることができる。つ
まり、冷却装置２１をコンパクトに構成することが可能
となる。The heat pipe 22 has a first end 23a.
And the second end portion 23b and the second end portion 23b form an angle of about 90 degrees.
It is curvedly formed via 3c. Therefore, as compared with the case where the heat pipe 22 is substantially linear, the heat receiving portion 24 provided at the first end portion 23a of the heat pipe 22 and the heat exchange portion 46 provided at the second end portion 23b are accommodated. The distance from the fan case 51 can be shortened. That is, the cooling device 21 can be made compact.
【００３９】なお、図４に示すように上記ファンケース
５１には取付け孔６６が形成された複数の取付け部６７
が設けられている。そして、ファンケース５１は、図６
に示すように機器本体２に形成されたスタッド６８にね
じ６９によって取付け固定される。As shown in FIG. 4, the fan case 51 has a plurality of mounting portions 67 having mounting holes 66 formed therein.
Is provided. The fan case 51 is shown in FIG.
As shown in FIG. 5, the stud 68 formed on the device body 2 is attached and fixed by a screw 69.
【００４０】このように構成されたポータブルコンピュ
ータ１において、冷却装置２１を機器本体５１に内蔵す
るには、まず、冷却装置２１のファンケース５１をその
本体部５２に設けられた取付け部６７を介して機器本体
２に設けられたスタッド６８にねじ６９によって取付け
固定する。In the portable computer 1 constructed as described above, in order to incorporate the cooling device 21 into the device main body 51, first, the fan case 51 of the cooling device 21 is mounted via the mounting portion 67 provided in the main body 52 thereof. The stud 68 provided on the device body 2 is attached and fixed by a screw 69.
【００４１】ついで、ヒートパイプ２２の第１の端部２
３ａに設けられた受熱部２４を配線基板１３に設けられ
た電子部品１５に対向させ、この受熱部２４に予めガタ
のある状態で取付けられたばね部材２８の脚部３２を配
線基板１３のスタッド４１にねじ４２によって固定す
る。それによって、冷却装置２１が機器本体５１内に実
装されることになる。Then, the first end 2 of the heat pipe 22 is
The heat receiving portion 24 provided on the wiring board 3 is made to face the electronic component 15 provided on the wiring board 13, and the leg portion 32 of the spring member 28 attached to the heat receiving portion 24 in a loose state is attached to the stud 41 of the wiring board 13. It is fixed with a screw 42. Thereby, the cooling device 21 is mounted in the device body 51.
【００４２】冷却装置２１を機器本体２内に設けるに際
し、配線基板１３に予め実装された電子部品１５の高さ
や傾きなどの実装状態が予め定められたスペックに対し
て異なることがある。When the cooling device 21 is provided in the device body 2, the mounting state such as the height and the inclination of the electronic component 15 previously mounted on the wiring board 13 may be different from the predetermined specifications.
【００４３】そのような場合、上記電子部品１５に接合
固定される受熱部２４は、ヒートパイプ２２とともにフ
ァンケース５１に対して可動であるから、電子部品１５
の実装状態の変化に応じて自由に変位させて電子部品１
５と密着させることができる。In such a case, since the heat receiving portion 24 joined and fixed to the electronic component 15 is movable with respect to the fan case 51 together with the heat pipe 22, the electronic component 15
The electronic component 1 can be freely displaced according to changes in the mounting state of
5 can be closely attached.
【００４４】つまり、上記ヒートパイプ２２は、熱交換
部４６が設けられた第２の端部２３ｂがファンケース５
１に形成された貫通溝６４にガタのある状態で挿通さ
れ、しかも末端部がファンケース５１内に形成された受
け溝６５にガタのある状態で支持されている。That is, in the heat pipe 22, the second end portion 23b provided with the heat exchange portion 46 has the fan case 5
It is inserted in the through groove 64 formed in No. 1 in a loose state, and the end portion is supported in a receiving groove 65 formed in the fan case 51 in a loose state.
【００４５】そのため、ヒートパイプ２２に固定された
上記受熱部２４は、ヒートパイプ２とともに電子部品１
５の実装状態に応じて３６０度方向のいずれの方向にも
自由に変位するから、従来のように電子部品１５やヒー
トパイプ２２に大きな応力を与えることなく、上記受熱
部２４を電子部品１５に密着させることができる。Therefore, the heat receiving portion 24 fixed to the heat pipe 22 is used together with the heat pipe 2 in the electronic component 1.
5 freely displaces in any direction of 360 degrees according to the mounting state of No. 5, so that the heat receiving portion 24 is attached to the electronic component 15 without giving a large stress to the electronic component 15 and the heat pipe 22 as in the conventional case. Can be closely attached.
【００４６】その結果、電子部品１５の耐荷重強度が必
要以上に要求されることが防止されるばかりか、ヒート
パイプ２２が応力により撓んで性能低下を招くというこ
とも防止される。As a result, it is possible not only to prevent the load-bearing strength of the electronic component 15 from being required more than necessary, but also to prevent the heat pipe 22 from being bent due to the stress and degrading its performance.
【００４７】なお、この発明は上記一実施の形態に限定
されるものでなく、発明の要旨を逸脱しない範囲で種々
変形可能である。たとえば、ヒートパイプの熱交換部が
設けられる第２の端部の末端を、ファンケース内に設け
られた受け溝にガタのある状態で支持するようにした
が、ヒートパイプの末端は上記受け溝によって支持しな
くてもよく、要はファンケースに対して変位可能な状態
が維持されるよう、ファンケース内に挿通されていれば
よい。The present invention is not limited to the above-mentioned one embodiment, and various modifications can be made without departing from the gist of the invention. For example, the end of the second end of the heat pipe where the heat exchange part is provided is supported in the receiving groove provided in the fan case in a loose state. Need not be supported by the fan case, as long as it is inserted in the fan case so as to maintain a state in which the fan case can be displaced.
【００４８】また、受熱部を配線基板に固定する手段は
ばね部材に限られず、上記受熱部を配線基板にねじによ
って直接固定するようにしても差し支えない。The means for fixing the heat receiving portion to the wiring board is not limited to the spring member, and the heat receiving portion may be directly fixed to the wiring board with screws.
【００４９】[0049]
【発明の効果】以上のようにこの発明によれば、一端に
受熱部、他端に熱交換部が設けられた熱移送手段はファ
ンケースに対して変位可能になっている。そのため、配
線基板に実装された発熱部の高さや傾きが一定でなくて
も、その実装状態に応じて受熱部を変位させることがで
きるから、発熱部や熱移送手段に応力を発生させること
なく、上記受熱部を発熱部に密着させることが可能とな
る。As described above, according to the present invention, the heat transfer means having the heat receiving portion at one end and the heat exchanging portion at the other end is displaceable with respect to the fan case. Therefore, even if the height and inclination of the heat generating portion mounted on the wiring board are not constant, the heat receiving portion can be displaced according to the mounting state, so that stress is not generated in the heat generating portion or the heat transfer means. The heat receiving part can be brought into close contact with the heat generating part.
【図１】この発明の一実施の形態を示すポータブルコン
ピュータの斜視図。FIG. 1 is a perspective view of a portable computer showing an embodiment of the present invention.
【図２】ポータブルコンピュータの冷却装置が設けられ
た部分の内部を示す斜視図。FIG. 2 is a perspective view showing the inside of a portion of the portable computer where the cooling device is provided.
【図３】冷却装置と配線基板の電子部品が設けられた部
分との斜視図。FIG. 3 is a perspective view of a cooling device and a portion of a wiring board where electronic components are provided.
【図４】（ａ）は冷却装置の平面図、（ｂ）は側面図、
（ｃ）は正面図。4A is a plan view of the cooling device, FIG. 4B is a side view, FIG.
(C) is a front view.
【図５】冷却装置の分解斜視図。FIG. 5 is an exploded perspective view of the cooling device.
【図６】ポータブルコンピュータの冷却装置が設けられ
た部分の断面図。FIG. 6 is a cross-sectional view of a portion of a portable computer provided with a cooling device.
【図７】受熱部を電子部品に接合させて配線基板に取付
けた状態の断面図。FIG. 7 is a cross-sectional view showing a state in which the heat receiving portion is joined to an electronic component and attached to a wiring board.
１３…配線基板 １５…電子部品（発熱部） ２１…冷却装置 ２２…ヒートパイプ（熱移送手段） ２４…受熱部 ２５…取付け溝 ２６…突条部 ２８…ばね部材 ４６…熱交換部 ５１…ファンケース ５８…送風機（送風手段） ６４…貫通溝（第１の支持部） ６５…受け溝（第２の支持部） 13 ... Wiring board 15 ... Electronic parts (heat generating part) 21 ... Cooling device 22 ... Heat pipe (heat transfer means) 24 ... Heat receiving part 25 ... Mounting groove 26 ... Ridges 28 ... Spring member 46 ... Heat exchange section 51 ... Fan case 58 ... Blower (blower means) 64 ... Through groove (first support portion) 65 ... Receiving groove (second support portion)
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 23/467 Ｈ０５Ｋ 7/20 Ｒ Ｈ０５Ｋ 7/20 Ｈ０１Ｌ 23/46 Ｂ Ｃ Ｇ０６Ｆ 1/00 ３６０Ｃ (56)参考文献 特開2000−154981（ＪＰ，Ａ) 特開 平１−255256（ＪＰ，Ａ) 特開 平６−159960（ＪＰ，Ａ) 特開 平10−107468（ＪＰ，Ａ) 特開2001−77255（ＪＰ，Ａ) 特開 平11−97873（ＪＰ，Ａ) 特開2001−237579（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) F28D 15/02 H01L 23/46 H01L 23/40 G06F 1/00 H05K 7/20 Continuation of front page (51) Int.Cl. 7 identification code FI H01L 23/467 H05K 7/20 R H05K 7/20 H01L 23/46 B C G06F 1/00 360C (56) Reference JP 2000-154981 ( JP, A) JP 1-255256 (JP, A) JP 6-159960 (JP, A) JP 10-107468 (JP, A) JP 2001-77255 (JP, A) JP JP 11-97873 (JP, A) JP 2001-237579 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) F28D 15/02 H01L 23/46 H01L 23/40 G06F 1/00 H05K 7/20
Claims (9)
と、 この熱移送手段の他端部に設けられこの熱移送手段によ
って移送される上記受熱部の熱を受ける熱交換部と、 この熱交換部及び熱交換部を冷却するための送風手段が
収容されるとともに上記受熱部が上記発熱部の実装状態
に応じて変位可能となるよう上記熱移送手段を支持する
ファンケースとを具備したことを特徴とする冷却装置。1. A heat receiving part thermally connected to a heat generating part, a heat transfer means having one end connected to the heat receiving part so that heat can be transferred, and a heat transfer means provided at the other end of the heat transfer means. A heat exchange unit that receives the heat of the heat receiving unit transferred by the transfer unit and a blower unit for cooling the heat exchange unit and the heat exchange unit are housed, and the heat receiving unit depends on the mounting state of the heat generating unit. And a fan case which supports the heat transfer means so that the heat transfer means can be displaced.
した本体部と、この本体部の開口面を覆う蓋体部とを有
し、 上記側壁には上記ヒートパイプの他端部を変位可能に支
持する第１の支持部が形成されていることを特徴とする
請求項１記載の冷却装置。2. The heat transfer means is a heat pipe, and the fan case has a side wall and a main body portion having one side surface opened, and a lid portion covering the opening surface of the main body portion. The cooling device according to claim 1, wherein a first support portion is formed to displaceably support the other end portion of the heat pipe.
記ヒートパイプの末端部を変位可能に支持する第２の支
持部が設けられていることを特徴とする請求項１記載の
冷却装置。3. The heat transfer means is a heat pipe, and a second support portion is provided inside the fan case to displaceably support an end portion of the heat pipe provided with the heat exchange portion. The cooling device according to claim 1, wherein the cooling device is provided.
じて上記熱移送手段とともに上記ファンケース内で可動
であることを特徴とする請求項１記載の冷却装置。4. The cooling device according to claim 1, wherein the heat exchanging portion is movable in the fan case together with the heat transfer means according to the displacement of the heat generating portion.
部が入り込む取付け溝及びこの取付け溝の両側に突条部
が形成され、この突条部の一部をカシメて上記受熱部に
上記ヒートパイプの一端部が固定され、 上記受熱部は上記突条部に一部を接触させたばね部材に
押圧されて上記発熱部に密着されることを特徴とする請
求項２記載の冷却装置。5. A mounting groove into which one end of the heat pipe is inserted, and ridges are formed on both sides of the mounting groove in the heat receiving portion. 3. The cooling device according to claim 2, wherein one end of the pipe is fixed, and the heat receiving portion is pressed by a spring member, a portion of which is in contact with the protruding portion, to be in close contact with the heat generating portion.
た受熱部と、他端部に設けられた熱交換部が収容される
上記ファンケースとの間隔を小さくするよう湾曲されて
いることを特徴とする請求項２記載の冷却装置。6. The heat pipe is curved so as to reduce a gap between a heat receiving portion provided at one end and a fan case accommodating a heat exchange portion provided at the other end. The cooling device according to claim 2, wherein the cooling device is a cooling device.
のなす角度がほぼ９０度となるよう円弧状に湾曲されて
いることを特徴とする請求項５記載の冷却装置。7. The cooling device according to claim 5, wherein the heat pipe is curved in an arc shape so that an angle formed by the one end and the other end is approximately 90 degrees.
れる機器本体と、 上記電子部品に熱的に接続される受熱部と、 この受熱部に一端部が伝熱可能に接続される熱移送手段
と、 この熱移送手段の他端部に設けられこの熱移送手段によ
って移送される上記受熱部の熱を受ける熱交換部と、 この熱交換部及び熱交換部を冷却するための送風手段が
収容され上記受熱部が上記発熱部の実装状態に応じて変
位可能となるよう上記熱移送手段が支持されるファンケ
ースとを具備したことを特徴とする電子機器。8. A device body provided with a wiring board on which an electronic component is mounted, a heat receiving portion thermally connected to the electronic component, and a heat transfer member having one end thermally connected to the heat receiving portion. Means, a heat exchange portion provided at the other end of the heat transfer means for receiving the heat of the heat receiving portion transferred by the heat transfer means, and a blower means for cooling the heat exchange portion and the heat exchange portion. An electronic device comprising: a fan case in which the heat transfer means is supported so that the heat receiving portion can be displaced according to a mounting state of the heat generating portion.
記送風手段によって送風される冷却風は上記熱交換部を
通って上記排気口から機器本体の外部に排出ることを特
徴とする請求項８記載の電子機器。9. The apparatus main body is formed with an exhaust port, and the cooling air blown by the blower means is discharged from the exhaust port to the outside of the device main body through the heat exchange section. Item 8. The electronic device according to item 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001290246A JP3515552B2 (en) | 2001-09-21 | 2001-09-21 | Cooling device and electronic device with built-in cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001290246A JP3515552B2 (en) | 2001-09-21 | 2001-09-21 | Cooling device and electronic device with built-in cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003097892A JP2003097892A (en) | 2003-04-03 |
| JP3515552B2 true JP3515552B2 (en) | 2004-04-05 |
Family
ID=19112588
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001290246A Expired - Fee Related JP3515552B2 (en) | 2001-09-21 | 2001-09-21 | Cooling device and electronic device with built-in cooling device |
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Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115097A (en) * | 2005-10-21 | 2007-05-10 | Toshiba Corp | Electronic equipment and substrate unit |
| JP4267629B2 (en) | 2006-01-31 | 2009-05-27 | 株式会社東芝 | Electronics |
| JP4909608B2 (en) * | 2006-02-28 | 2012-04-04 | 株式会社東芝 | Electronics |
| JP5078872B2 (en) * | 2006-03-02 | 2012-11-21 | 株式会社ソニー・コンピュータエンタテインメント | Heat sink with centrifugal fan |
| JP4532422B2 (en) * | 2006-03-02 | 2010-08-25 | 古河電気工業株式会社 | Heat sink with centrifugal fan |
| JP4171028B2 (en) * | 2006-04-11 | 2008-10-22 | 株式会社東芝 | Electronics |
| JP4734427B2 (en) * | 2009-01-14 | 2011-07-27 | 株式会社東芝 | Electronics |
| CN101841987A (en) * | 2009-03-21 | 2010-09-22 | 富准精密工业(深圳)有限公司 | Heat sink and fastener thereof |
| JP2011128708A (en) * | 2009-12-15 | 2011-06-30 | Toshiba Corp | Electronic apparatus |
| JP5002698B2 (en) * | 2010-11-05 | 2012-08-15 | 株式会社東芝 | Television receiver and electronic device |
| WO2012104891A1 (en) * | 2011-01-31 | 2012-08-09 | 三菱電機株式会社 | Air-conditioning device |
| JP5383740B2 (en) * | 2011-04-18 | 2014-01-08 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
| CN104253097B (en) * | 2013-06-27 | 2017-02-01 | 纬创资通股份有限公司 | Radiating device and radiating device manufacturing method by connecting injection members |
| US10670650B2 (en) * | 2017-09-28 | 2020-06-02 | Advantest Corporation | Device testing with heat pipe cooling assembly |
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2001
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