JP3519710B2 - Cooling device and electronic device with built-in cooling device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling a heat generating part such as a semiconductor package and an electronic device such as a portable computer equipped with the cooling device.

[0002]

2. Description of the Related Art Recently, in the field of this kind of electronic equipment, the processing speed of electronic parts for processing various information such as characters, voices, images, etc., such as MPU (Micro Processing Unit), has been increased, Functionalization is being promoted. In such an electronic device, the power consumption of the MPU increases as the integration and performance of the MPU increase, and the amount of heat generated during operation tends to increase rapidly in proportion to this.

Therefore, when the MPU having a large heat generation amount is housed in the housing of the portable computer, it is necessary to enhance the heat dissipation of the MPU in the housing, and therefore a cooling device for forcibly cooling the MPU is required. It becomes an indispensable existence.

Conventionally, the cooling device has a heat sink, which is integrated with an electric fan unit. The heat sink integrally has a heat receiving portion, a fan mounting portion, and a heat exchange portion. The heat receiving portion is joined to an electronic component such as an MPU as a heat generating portion provided on the wiring board and is thermally connected to this electronic component. The heat exchange section is provided on the opposite side of the heat receiving section with the fan mounting section interposed therebetween. Further, in the cooling device, a heat pipe as a heat transfer means is provided with one end embedded in the heat receiving part and the other end connected to the heat exchange part.

As a result, the heat of the electronic component is diffused throughout the heat sink and is positively transferred from the heat receiving portion to the heat exchange portion by the heat pipe,
Air is blown from the fan of the fan unit to be dissipated from the heat exchange portion to the outside of the housing.

[0006]

In the cooling device having the above structure, the heat receiving portion, the fan mounting portion and the heat exchanging portion are integrally formed on the heat sink as described above. Therefore, in the cooling device, the fan unit, the heat receiving portion, and the heat exchanging portion do not have a degree of freedom.

On the other hand, the MPU mounted on the above-mentioned wiring board must be replaced with an MPU corresponding to the change of the ability or the improvement of the performance according to the customer's request. When replacing the MPU, if the cooling device has a configuration with no degree of freedom in the fan unit, the heat receiving part, and the heat exchanging part as described above, replace the MPU unless the entire cooling device is removed from the wiring board. I can't.

To remove the entire cooling device from the wiring board,
Since the equipment body containing the cooling device may have to be disassembled, not only a lot of man-hours are required for the replacement work of the MPU, but also the work cannot be easily performed.

Further, if the cooling device has a structure with no degree of freedom, when the mounting state of the electronic parts mounted on the wiring board, for example, the inclination or the height is not constant, the heat receiving part is mounted on the heat receiving part when mounting the cooling device. By applying a load and bending the heat pipe, the heat receiving portion must be brought into close contact with the electronic component.

However, in such a case, a large load is applied to the electronic component via the heat receiving portion, so that the load may exceed the withstand load specification of the electronic component or the heat pipe may be bent. If the amount is large, crushing may occur and the performance may be deteriorated.

It is an object of the present invention to provide a cooling device and an electronic device having the cooling device built therein so that the work can be performed easily and quickly when the heat generating part is replaced.

[0012]

According to the present invention, there is provided a heat receiving portion thermally connected to a heat generating portion, a heat transfer means having one end connected to the heat receiving portion so that heat can be transferred, and a heat transfer means of the heat transfer means. A heat exchanging unit provided at the other end for receiving the heat of the heat receiving unit transferred by the heat transferring unit, and a blower unit for cooling the heat exchanging unit and the heat exchanging unit are housed and the heat transferring unit is provided. of the heat receiving portion is an end portion provided having a support portion which rotatably supports, the heat-receiving portion; and a fan case which enables separable with respect to the heat generating portion, the support portion
Is formed on a side portion of the fan case, and is configured as the heat transfer means.
A through groove in which one end of the fan is inserted and supported;
A receiving groove that is provided inside and supports the end of the heat transfer means
The cooling device is characterized by comprising

Further, according to the present invention, a device main body provided with a wiring board on which electronic components are mounted, a heat receiving portion thermally connected to the electronic components, and one end portion of the heat receiving portion connected to the heat receiving portion so that heat can be transferred. The heat transfer means, the heat exchange part provided at the other end of the heat transfer means for receiving the heat of the heat receiving part transferred by the heat transfer means, and for cooling the heat exchange part and the heat exchange part. And a supporting portion that rotatably supports the end portion of the heat transfer means where the heat receiving portion is provided, and the heat receiving portion can be brought into contact with and separated from the heat generating portion. A fan case is provided, and the support portion is
One of the heat transfer means formed on the side of the fan case.
In the fan case and the through groove where the end is inserted and supported.
A receiving groove provided to support the end of the heat transfer means
It is in an electronic device characterized by being configured from .

According to this structure, the heat receiving portion is provided at one end,
The heat transfer means having the heat exchange portion at the other end is rotatable with respect to the fan case. Therefore, in the case of exchanging the heat generating part, the heat receiving part can be separated from the heat generating part by rotating the heat transfer means with the point supported by the fan case as a fulcrum. The heat generating part can be easily replaced.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

1 to 9 show an embodiment of the present invention. A portable computer 1 as an electronic device shown in FIGS. 1 and 2 has a device body 2. The device body 2 is formed in a box shape by a case 3 and a cover 4. A palm rest portion 5 is provided on the cover 4, and a keyboard attachment portion 6 is formed behind the palm rest portion 5. The keyboard 7 is attached to the keyboard mounting portion 6.
Has its front end engaged with the mounting portion 6, and its rear end is attached to the cover 4 by screws (not shown).

A liquid crystal display 12 (LCD) is attached to the rear end of the cover 4 by a pair of hinges 11 so as to be openable and closable. As shown in FIG. 2, a wiring board 13 is accommodated and arranged in the device body 2. The keyboard 7 and the liquid crystal display 1 are provided on the wiring board 13.
2 are electrically connected. As a result, desired information is displayed on the liquid crystal display 12 in synchronization with the operation of the keys of the keyboard 7.

As shown in FIGS. 2 and 3, the wiring board 1 is provided.
3, a socket 14 is provided, and an electronic component 15 such as an MPU that serves as a heat generating portion is mounted on the socket 14.
Since the electronic component 15 generates heat as it operates, it is forcibly cooled by the cooling device 21 mounted on the wiring board 13.

As shown in FIGS. 2 to 5, the cooling device 21 has a heat pipe 22 as a heat transfer means.
The heat pipe 22 has a first end portion 23a and a second end portion 23b, and a curved portion 23c is formed between these end portions, and the curved portion 23c allows the first end portion 23a and the first end portion 23a to be connected to each other. The second end 23b forms an angle of approximately 90 degrees.

The first end 23a of the heat pipe 22
A heat receiving portion 24 formed of a metal such as aluminum having a high heat conductivity in a rectangular plate shape is attached to the. As shown in FIGS. 5 and 7, a mounting groove 25 is formed in the central portion of one side surface of the heat receiving portion 24 in the predetermined direction so as to extend over the entire length in the direction intersecting with the predetermined direction. On both sides of the mounting groove 25, ridges 26 are formed over the entire length.

The heat pipe 2 is provided in the mounting groove 25.
The first end portion 23a of the second member 2 is fitted via a heat transfer sheet (not shown), and is fixedly connected by the crimped portion 26a obtained by partially crimping the ridge portion 26. The non-crimped portion of the ridge portion 26 has a height that projects slightly above the heat pipe 22 fitted in the mounting groove 25 as shown in FIG.

As shown in FIGS. 2 to 5, the heat receiving portion 2 is provided.
A spring member 28 is attached to one side surface of the plate 4. The spring member 28 has a rectangular base portion 31 and four leg portions 32 extending from the four corners of the base portion 31.

Each leg portion 32 is bent upward from a base end portion connected to the base portion 31 toward a tip end portion, and the tip end portion is bent into an L-shaped mounting portion 33. As shown in FIG. 5, the base 31 has a pair of first mounting holes 34 formed at both ends of the base 31 in a predetermined direction, and each leg 32 has a second mounting hole 35 formed therein. .

At the center of the base 31, the base 31
A linear contact portion 36 is formed on the lower surface side so as to project along the above predetermined direction. The cross-sectional shape of the contact portion 36 in the width direction is a curved surface such as a semicircular arc shape.

A pair of boss portions 38 each having a screw hole are projectingly provided on one side surface of the base portion 31, and the base portion 31 is screwed into the boss portion 38 through the pair of first mounting holes 34. The screw 37 is attached to one side surface of the heat receiving portion 24.

The first mounting hole 34 has a diameter larger than the outer dimension of the boss portion 38, and the head of the screw 37 has the first mounting hole 34.
It has a larger diameter than. Thereby, the base portion 3 of the spring member 28 attached to the heat receiving portion 24 by the screw 37.
1 is attached to the heat receiving portion 24 in a loose state, and when the base portion 31 is brought into pressure contact with the heat receiving portion 24 as described later, the base portion 31 of the spring member 28 is attached to the ridge portion 26 of the heat receiving portion 24. It is possible to swing about the contacting contact portion 36 as a fulcrum.

As shown in FIG. 2, FIG. 6 and FIG. 8, the leg portion 32 of the spring member 28 has the attachment portion 33 at the tip thereof in the stud 41 provided on the wiring board 13 and the second attachment hole 35. It is attached and fixed by a screw 42 through. The legs 32 are elastically deformed and attached to the wiring board 13. As a result, the contact portion 36 formed on the base portion 31 elastically presses the ridge portion 26 of the heat receiving portion 24, so that the other side surface of the heat receiving portion 24 is attached to the electronic component 15 mounted on the wiring board 13. It adheres via a heat transfer sheet (not shown).

Since the base portion 31 of the spring member 28 is attached to the heat receiving portion 24 in a loose state, the leg portion 32 is provided.
To the stud 41 with a screw 42, and the base 3
When the base 1 is brought into close contact with the heat receiving portion 24, the contact portion 36, which is a part of the base portion 31, comes into contact with the ridge portion 26 of the heat receiving portion 24. .

Therefore, since the spring member 28 can apply a pressing force to the central portion of the heat receiving portion 24 by the abutting portion 36 of the base portion 31, the pressing force is substantially evenly distributed over the entire heat receiving portion 24. That is, the heat receiving portion 24 is connected to the electronic component 15
The heat transfer effect can be enhanced because the heat transfer effect can be made uniform.

Moreover, since the pressing force of the spring member 28 is not directly applied to the first end portion 23a of the heat pipe 22, the first end portion 23a of the heat pipe 22 is fixed to the spring member 2 by the first end portion 23a.
It is prevented from being crushed by 8.

The second end 23b of the heat pipe 22
A heat exchange section 46 is provided in the. This heat exchange section 46
Is composed of a large number of fins 47 arranged at predetermined intervals, and the second part of the heat pipe 22 is provided at the center of the fins 47.
End portion 23b penetrates. As shown in FIGS. 5 and 9, the fin 47 has a side surface formed into a substantially parallelogram shape, and the corners thereof are curved.

The heat exchange section 46 is housed in the fan case 51 mounted on the device body 2. The fan case 51 includes a bottom wall 52a and a bottom wall 52a as shown in FIG.
A main body portion 52 having a side wall 52b standing upright on the periphery of 2a and having one side surface as an upper surface and one end portion opened, and the main body portion 5
2 and a lid 53 that closes the opening on one side surface.
A plurality of claws 54 are provided on the peripheral edge portion of the lid portion 53, and by bending the tip end portions of these claws 54 to engage with the outer surface of the bottom wall 52a which is the other side surface of the main body portion 52, Body part 5
2 and the lid 53 are integrated.

As shown in FIGS. 3 to 5, at one end of the fan case 51 in which the main body 52 and the lid 53 are integrated, an opening 55 is formed to open to the end surface and the lower surface. To be done. In the space inside the fan case 51, one end on the side of the opening 55 is formed in the first accommodating portion 56, and the other end is formed in the second accommodating portion 57.

The heat exchange portion 4 is provided in the first accommodating portion 56.
6 is housed with one side surface and a lower surface facing the opening 55, and a blower 58 as a blower unit integrally with the main body 52 of the fan case 51 has a rotation axis in the second storage 57. It is provided vertically on the plate surface of the bottom wall 5a of the portion 52. The opening 55 faces an exhaust port 59 (shown in FIG. 1) formed in the side wall of the case 3 of the device body 2.

The blower 58 rotates by being energized, introduces the outside air into the fan case 51 from the suction hole 61 formed in the lid portion 53, and blows it toward the heat exchange portion 46.

As a result, the first end portion 23a to the second end portion 23 of the heat pipe 22 are passed through the heat receiving portion 24.
The heat of the electronic component 15 transferred to b is discharged from the heat exchanging portion 46 to the outside of the device body 2 through the exhaust port 59.

The heat pipe 22 penetrates the side wall 52b of the main body 52 of the fan case 51. That is, in the portion of the side wall 52b that forms the first accommodating portion 56 that accommodates the heat exchanging portion 46, the lower end has an arcuate first supporting portion that rotatably supports the heat pipe 22. Through-groove 64 is formed, and a portion inside the second end portion 23b of the heat pipe 22 is rotatably supported by an arcuate portion at the lower end of the through-groove 64.

Further, the tip of the second end portion 23b of the heat pipe 22 projects from the heat exchanging portion 46, and the projecting portion is the second support provided in the first accommodating portion 56 of the fan case 51. It is rotatably supported by a receiving groove 65 as a part.

As a result, the heat pipe 22 is
It is possible to rotate the portion supported by the through groove 64 and the receiving groove 65 as a fulcrum from the fall position shown by the solid line in FIG. 9 to the standing position shown by the chain line.

The fins 47 of the heat exchange section 46 are formed in parallelograms whose corners are arcuate. Therefore, when the heat pipe 22 is rotated from the fallen state to the upright state, the fins 47 are changed from the state shown by the solid line in FIG. 9 to the state shown by the chain line, so that the heat exchange section 46 rotates the heat pipe 22. There is no hindrance.

The angle of rotation of the heat pipe 22 from the laid state to the standing direction is preferably 20 degrees or more, more preferably 30 degrees or more, further preferably 45 degrees or more. It is sufficient that the heat receiving part 24 can be raised so as not to interfere with the replacement work when the replacement of 15 is performed.

The heat pipe 22 has a first end 23a.
And the second end portion 23b and the second end portion 23b form an angle of about 90 degrees.
It is curvedly formed via 3c. Therefore, as compared with the case where the heat pipe 22 is substantially linear, the heat receiving portion 24 provided at the first end portion 23a of the heat pipe 22 and the heat exchange portion 46 provided at the second end portion 23b are accommodated. The distance from the fan case 51 can be shortened. That is, the cooling device 21 can be made compact.

As shown in FIG. 4, the fan case 51 has a plurality of mounting portions 67 having mounting holes 66 formed therein.
Is provided. The fan case 51 is shown in FIG.
As shown in FIG. 5, the stud 68 formed on the device body 2 is attached and fixed by a screw 69.

In the portable computer 1 having such a configuration, in order to incorporate the cooling device 21 into the device main body 51, first, the fan case 51 of the cooling device 21 is mounted via the mounting portion 67 provided on the main body 52 thereof. The stud 68 provided on the device main body 51 is attached and fixed by a screw 69.

Then, the first end 2 of the heat pipe 22 is
The heat receiving portion 24 provided on the wiring board 3 is made to face the electronic component 15 provided on the wiring board 13, and the leg portion 32 of the spring member 28 attached to the heat receiving portion 24 in a loose state is attached to the stud 41 of the wiring board 13. It is fixed with a screw 42. As a result, the cooling device 21 is mounted in the device body 2.

When the cooling device 21 is provided in the equipment main body 2, the mounting state such as the height and the inclination of the electronic component 15 previously mounted on the wiring board 13 may be different from the predetermined specifications.

In such a case, since the heat receiving portion 24 joined and fixed to the electronic component 15 is movable with respect to the fan case 51 together with the heat pipe 22, the electronic component 15
The electronic component 1 can be freely displaced according to changes in the mounting state of
5 can be closely attached.

That is, in the heat pipe 22, the second end portion 23b provided with the heat exchange portion 46 has the fan case 5
It is inserted into the through groove 64 formed in No. 1 and the end portion is rotatably supported by the receiving groove 65 formed in the fan case 51.

Therefore, the heat receiving portion 24 fixed to the heat pipe 22 is used together with the heat pipe 2 in the electronic component 1.
Since it is displaced according to the mounting state of No. 5, the heat receiving portion 24 can be brought into close contact with the electronic component 15 without giving a large stress to the electronic component 15 and the heat pipe 22 as in the conventional case.

As a result, it is possible not only to prevent the load-bearing strength of the electronic component 15 from being required more than necessary, but also to prevent the heat pipe 22 from being bent due to the stress and degrading its performance.

When it is necessary to replace the electronic component 15 with one having different specifications, first, the screw 42 fixing the leg portion 32 of the spring member 28 to the stat 41 of the wiring board 13 is removed. As a result, the pressure contact state of the heat receiving portion 24 to which the spring member 28 is attached with respect to the electronic component 15 is released, so that the heat pipe 22 and the heat pipe 22 together with the heat receiving portion 24 are in the laid position shown by solid lines in FIGS. To the standing position indicated by the chain line.

As a result, the heat receiving portion 24 can be retracted from above the electronic component 15, so that the electronic component 15 provided on the wiring board 13 can be removed and a new electronic component can be attached. That is, when the electronic component 15 is replaced, the heat receiving portion 24 of the cooling device 21 is connected to the electronic component 1
Since it is only necessary to press the spring member 28 into contact with the wiring member 5 and remove the spring member 28 from the wiring board 13, the replacement work can be performed easily and quickly.

The present invention is not limited to the above-mentioned one embodiment, and various modifications can be made without departing from the gist of the invention. For example, in the above-described embodiment, the heat receiving portion is pressed against the electronic component by using the spring member. However, even if the heat receiving portion is directly fixed to the wiring board with a screw, the screw can be removed. The heat receiving part can be retracted from above the electronic component by rotating the heat pipe.

Further, although the fins of the heat exchange section have a parallelogram shape so as not to interfere with the fan case, they may have an elliptical shape or a circular shape, and the point is to rotate the heat pipe. Any shape that does not interfere with

[0055]

As described above, according to the present invention, the heat transfer means having the heat receiving portion at one end and the heat exchange portion at the other end is rotatable with respect to the fan case. Therefore, when exchanging the heat generating part, the heat receiving part can be separated from the heat generating part by rotating the heat transfer means with the point supported by the fan case as a fulcrum. It can be easily replaced. That is, it becomes possible to easily and quickly replace the heat generating portion.

[Brief description of drawings]

FIG. 1 is a perspective view of a portable computer showing an embodiment of the present invention.

FIG. 2 is a perspective view showing the inside of a portion of the portable computer where the cooling device is provided.

FIG. 3 is a perspective view of a cooling device and a portion of a wiring board where electronic components are provided.

4A is a plan view of the cooling device, FIG. 4B is a side view, FIG.
(C) is a front view.

FIG. 5 is an exploded perspective view of the cooling device.

FIG. 6 is a cross-sectional view of a portion of a portable computer provided with a cooling device.

FIG. 7 is a side view showing a state where the heat receiving portion of the cooling device is pressed against the electronic component.

FIG. 8 is a cross-sectional view showing a state in which the heat receiving portion is joined to an electronic component and attached to a wiring board.

FIG. 9 is a cross-sectional view showing a heat exchange section housed in a fan case.

[Explanation of symbols]

13 ... Wiring board 15 ... Electronic parts (heat generating part) 21 ... Cooling device 22 ... Heat pipe (heat transfer means) 24 ... Heat receiving part 25 ... Mounting groove 26 ... Ridges 28 ... Spring member 46 ... Heat exchange section 51 ... Fan case 58 ... Blower (blower means) 64 ... Through groove (support portion) 65 ... Receiving groove (support portion)

─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-11-97873 (JP, A) JP-A-11-26970 (JP, A) JP-A-2000-2493 (JP, A) JP-A-10-107468 (JP, A) JP 10-79586 (JP, A) JP 2001-196773 (JP, A) JP 9-164316 (JP, A) Actually open 1-125992 (JP, U) Actually open Sho 64-48047 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 7/20

Claims (6)

(57) [Claims] 1. A heat receiving part thermally connected to a heat generating part, a heat transfer means having one end connected to the heat receiving part so that heat can be transferred, and a heat transfer means provided at the other end of the heat transfer means. A heat exchange section for receiving the heat of the heat receiving section transferred by the transfer section, and a blower section for cooling the heat exchange section and the heat exchange section are housed and the heat receiving section of the heat transfer section is provided. A fan case having a support portion for rotatably supporting an end portion and allowing the heat receiving portion to come into contact with and separate from the heat generating portion.
And the support portion is formed on a side portion of the fan case.
The through groove into which one end of the heat transfer means is inserted and supported;
The end portion of the heat transfer means provided inside the fan case is supported.
A cooling device comprising: a receiving groove that is provided. 2. The heat exchanging portion is set in a shape that does not interfere with the fan case when the heat transfer means is rotated about the supporting portion as a fulcrum. The cooling device according to item 1. 3. The heat transfer means is a heat pipe, and an attachment groove into which one end of the heat pipe enters and a ridge portion are formed on both sides of the attachment groove in the heat receiving portion. One end of the heat pipe is fixed to the heat receiving portion by caulking a part thereof, and the heat receiving portion is pressed by a spring member partly contacting the ridge portion to be closely attached to the heat generating portion. The cooling device according to claim 1. 4. The heat pipe has approximately 90 ends each having a heat receiving portion and another end having a heat exchange portion.
Claim, characterized in that it is bent to form a time 1
The cooling device described. 5. A device main body provided with a wiring board on which an electronic component is mounted, a heat receiving portion thermally connected to the electronic component, and a heat transfer member having one end thermally connected to the heat receiving portion. Means, a heat exchange portion provided at the other end of the heat transfer means for receiving the heat of the heat receiving portion transferred by the heat transfer means, and a blower means for cooling the heat exchange portion and the heat exchange portion. And a fan case that has a support portion that rotatably supports the end portion of the heat transfer means where the heat receiving portion is provided, and that allows the heat receiving portion to come into contact with and separate from the heat generating portion. The supporting portion is formed on a side portion of the fan case.
The through groove into which one end of the heat transfer means is inserted and supported;
The end portion of the heat transfer means provided inside the fan case is supported.
An electronic device comprising: a receiving groove that is provided. 6. An exhaust port is formed in the device body, and cooling air blown by the blower means is discharged from the exhaust port to the outside of the device body through the heat exchange section. The electronic device according to claim 5 .