JP2021097100A - Electronic device - Google Patents

Abstract

To provide an electronic device with which it is possible to connect the electrode of an electronic component to the electrode of a substrate with stable force while accommodating a difference in height of the electronic component, and to easily remove the electronic component from the substrate.SOLUTION: In an electronic device 1, a spring member 40 has at least three bent parts including a first bent part 43, a second bent part 44 and a third bent part 45 provided in succession between a first fixed part 41, a second fixed part 42. The third bent part is provided between the first and second bent parts, protruding from the first and second bent parts toward an electronic component 30 and contacting the electronic component, imparting an elastic restoration force to the electronic component in a direction leading toward a substrate 10. The first bent part protrudes, between the first fixed part and the third bent part, in a direction opposite the protruding direction of the third bent part and separates from the electronic component, and the second bent part protrudes, between the second fixed part and the third bent part, in a direction opposite the protruding direction of the third bent part and separates from the electronic component.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to electronic devices.

For example, as a structure in which a back electrode of an electronic component such as a semiconductor element is brought into contact with a front electrode of a base substrate to fix the electronic component to the substrate, a fixing structure using solder or screws is known. If the electronic components are fixed to the board using solder, it becomes difficult to remove the electronic components and the maintainability is poor. When screws are used, if the load applied to the electronic components varies depending on how the screws are tightened, stable contact between the electrodes becomes difficult. Further, in the fixed structure in which the electronic component is pressed from above with a heat sink or the like, a space is required above the electronic component, and it is difficult to cope with the difference in height of the electronic component.

Japanese Unexamined Patent Publication No. 63-28095 Japanese Unexamined Patent Publication No. 2009-27805

In the embodiment of the present invention, the electrodes of the electronic component can be connected to the electrodes of the substrate with a stable force while dealing with the difference in height of the electronic component, and the electronic component can be easily removed from the substrate. The purpose is to provide electronic devices.

According to an embodiment of the present invention, the electronic device has a substrate having a first electrode, a spring fixing member fixed on the substrate and having an opening, arranged in the opening, and connected to the first electrode. It includes an electronic component having a second electrode and a spring member. The spring member is continuous between the first fixing portion fixed to the spring fixing member, the second fixing portion fixed to the spring fixing member, and the first fixing portion and the second fixing portion. It has a first bent portion, a second bent portion, and at least three bent portions including a third bent portion. The third bent portion is provided between the first bent portion and the second bent portion, and projects from the first bent portion and the second bent portion toward the electronic component and comes into contact with the electronic component. , The elastic restoring force of the spring member is applied to the electronic component in the direction toward the substrate. The first bent portion protrudes between the first fixed portion and the third bent portion in a direction opposite to the protruding direction of the third bent portion and is separated from the electronic component. The second bent portion protrudes between the second fixed portion and the third bent portion in a direction opposite to the protruding direction of the third bent portion and is separated from the electronic component.

(A) is a schematic top view of the electronic device according to the embodiment of the present invention, and (b) is a schematic cross-sectional view of the electronic device according to the embodiment of the present invention. (A) and (b) are schematic cross-sectional views of the electronic device of the embodiment of the present invention. It is a schematic cross-sectional view of the electronic device of embodiment of this invention. (A) and (b) are schematic top views of the electronic device of the embodiment of the present invention. (A) to (c) are schematic top views of the electronic device of the embodiment of the present invention. It is a schematic cross-sectional view of the electronic device of embodiment of this invention. (A) and (b) are schematic cross-sectional views of the electronic device of the comparative example. (A) and (b) are schematic cross-sectional views of the electronic device of another comparative example.

Hereinafter, embodiments will be described with reference to the drawings as appropriate. For convenience of explanation, the scale of each drawing is not always accurate and may be indicated by a relative positional relationship or the like. The same or similar elements are designated by the same reference numerals.

FIG. 1A is a schematic top view of the electronic device 1 according to the embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view of the electronic device 1.

The electronic device 1 includes a substrate 10, a spring fixing member 20, an electronic component 30, and a spring member 40.

A plurality of first electrodes 11 are provided on the surface of the substrate 10. The plurality of first electrodes 11 are, for example, LGA (Land Grid Array) electrodes. Further, on the surface of the substrate 10, a wiring connected to the first electrode 11 is formed. FIG. 1B illustrates a leaf spring-shaped first electrode 11 having one end fixed to the surface of the substrate 10 and the other end floating from the surface of the substrate 10, but the first electrode 11 is a flat electrode. It may be.

The spring fixing member 20 is fixed on the surface of the substrate 10. For example, the spring fixing member 20 is fixed to the board 10 by tightening a screw from the back surface of the board 10 to the spring fixing member 20.

An opening 21 is formed in the spring fixing member 20. In the examples shown in FIGS. 1A and 1B, a plurality of openings 21 are formed in the spring fixing member 20. The electronic component 30 is arranged in the opening 21. The opening 21 penetrates the thickness direction of the spring fixing member 20, and the first electrode 11 is exposed to the opening 21 in a state before the electronic component 30 is arranged.

The electronic component 30 is, for example, a package component, and a plurality of second electrodes 31 are formed on the back surface of the electronic component 30. The electronic component 30 includes, for example, a semiconductor element. The pitches of the plurality of second electrodes 31 of the electronic component 30 correspond to the pitches of the plurality of first electrodes 11 of the substrate 10. The electronic component 30 may be a chip component.

One electronic component 30 is arranged in one opening 21. The second electrode 31 of the electronic component 30 arranged in the opening 21 is in contact with the first electrode 11 of the substrate 10.

The outer shape of the electronic component 30 is a quadrangle having four sides. The outer shape of the opening 21 formed in the spring fixing member 20 is also a quadrangle corresponding to the outer shape of the electronic component 30. A gap of, for example, about 0.1 mm is formed between the side surface of the electronic component 30 and the side wall of the opening 21. The side wall of the opening 21 regulates the rotation and movement of the electronic component 30 in a plane parallel to the surface of the substrate 10, and regulates the misalignment between the first electrode 11 and the second electrode 31.

The spring member 40 exerts an elastic restoring force due to deformation and displacement from the natural state. The electronic component 30 is pushed toward the surface of the substrate 10 by the elastic restoring force of the spring member 40 and is fixed to the substrate 10.

The spring member 40 is obtained by bending a wire rod or a plate material. The spring member 40 has a first fixing portion 41 and a second fixing portion 42. The first fixing portion 41 and the second fixing portion 42 are both ends of the spring member 40. The first fixing portion 41 and the second fixing portion 42 are fixed to the spring fixing member 20. For example, the first fixing portion 41 and the second fixing portion 42 are screwed to the upper surface of the spring fixing member 20. Alternatively, the first fixing portion 41 and the second fixing portion 42 may be hooked and fixed to the protrusion provided on the upper surface of the spring fixing member 20.

In the spring member 40, at least three bent portions (first bent portion 43, second bent portion 44, third bent portion 45) are continuously provided between the first fixed portion 41 and the second fixed portion 42. Has been done. The first bent portion 43, the second bent portion 44, and the third bent portion 45 are curved, for example.

The third bent portion 45 is provided between the first bent portion 43 and the second bent portion 44, projects from the first bent portion 43 and the second bent portion 44 toward the electronic component 30, and is an upper surface of the electronic component 30. Is in contact with.

The first bent portion 43 protrudes between the first fixed portion 41 and the third bent portion 45 in the direction opposite to the protruding direction of the third bent portion 45, and is separated from the electronic component 30. A space is formed between the first bent portion 43 and the electronic component 30.

The second bent portion 44 protrudes between the second fixed portion 42 and the third bent portion 45 in the direction opposite to the protruding direction of the third bent portion 45, and is separated from the electronic component 30. A space is formed between the second bent portion 44 and the electronic component 30.

In the natural state of the spring member 40, the third bent portion 45 is located at a height between the upper surface of the electronic component 30 arranged in the opening 21 and the surface of the substrate 10. Therefore, the third bent portion 45 in contact with the upper surface of the electronic component 30 gives the electronic component 30 an elastic restoring force of the spring member 40 in the direction toward the substrate 10. The electronic component 30 is sandwiched between the third bent portion 45 and the substrate 10, and is fixed to the substrate 10.

By fixing the electronic component 30 while being pushed against the substrate 10, a stable electrical connection between the second electrode 31 of the electronic component 30 and the first electrode 11 of the substrate 10 is maintained. The first electrode 11 and the second electrode 31 are not fixed by solder. The first electrode 11 and the second electrode 31 are in direct contact with each other. Alternatively, an anisotropic conductive member is provided between the first electrode 11 and the second electrode 31, and the first electrode 11 and the second electrode 31 are electrically connected to each other through the anisotropic conductive member.

Therefore, by removing the spring member 40 from the spring fixing member 20, the electronic component 30 can be removed from the substrate 10. This facilitates the replacement and repair of the electronic component 30.

The height of the electronic component 30 may be changed at the design stage, or the height of the electronic component 30 may vary in manufacturing. In the example shown in FIG. 1B, the height of the electronic component 30 on the right side is higher than the height of the electronic component 30 on the left side. For example, the upper surface of the electronic component 30 on the left side is lower than the upper surface of the spring fixing member 20, and the upper surface of the electronic component 30 on the right side is higher than the upper surface of the spring fixing member 20.

According to this embodiment, the common spring fixing member 20 and the spring member 40 having the same configuration can cope with the difference in height of the electronic component 30. Even if the height of the electronic component 30 changes, it is not necessary to change the design (size or shape) of the spring member 40 or the height of the spring fixing member 20.

Here, FIGS. 7A and 7B are schematic cross-sectional views of the electronic device of the comparative example.

The spring member 140 of the comparative example shown in FIG. 7A is between the first fixing portion 141 and the second fixing portion 142 fixed to the spring fixing member 20 and the first fixing portion 141 and the second fixing portion 142. It has a convex portion 145 that is provided in the above and is in contact with the upper surface of the electronic component 30.

The first fixed portion 141, the second fixed portion 142, and the convex portion 145 are continuous in a straight line, there is no bent portion between the first fixed portion 141 and the convex portion 145, and the second fixed portion 142 and the convex portion There is no bend between it and 145.

In the spring member 140 having such a configuration, when the height of the electronic component 30 is increased as shown in FIG. 7B, the corner of the electronic component 30 is between the first fixed portion 141 and the convex portion 145 and the second. It hits between the fixed portion 142 and the convex portion 145, and a load is applied to the spring member 140. Further, an upward force is applied to the spring member 140, and the force for pushing the electronic component 30 toward the substrate 10 becomes insufficient. In order to avoid this, the height of the spring fixing member 20 must be changed.

8 (a) and 8 (b) are schematic cross-sectional views of electronic devices of other comparative examples.

The spring member 150 of the comparative example shown in FIG. 8A is between the first fixing portion 151 and the second fixing portion 152 fixed to the spring fixing member 20 and the first fixing portion 151 and the second fixing portion 152. It has a convex portion 155 that is provided on the surface of the electronic component 30 and is in contact with the upper surface of the electronic component 30.

There is no bent portion between the first fixed portion 151 and the convex portion 155 that protrudes in the direction opposite to the protruding direction of the convex portion 155, and the convex portion 155 protrudes between the second fixed portion 152 and the convex portion 155. There are no bends that project in the opposite direction.

In the spring member 150 having such a configuration, when the height of the electronic component 30 is increased as shown in FIG. 8 (b), the corner of the electronic component 30 is between the first fixed portion 151 and the convex portion 155 and the second It hits between the fixed portion 152 and the convex portion 155, and a load is applied to the spring member 150. Further, an upward force is applied to the spring member 150, and the force for pushing the electronic component 30 toward the substrate 10 becomes insufficient. In order to avoid this, the height of the spring fixing member 20 must be changed.

On the other hand, according to the present embodiment, as shown in FIG. 1B, there is a third portion between the first fixing portion 41 of the spring member 40 and the third bending portion 45 in contact with the electronic component 30. A first bent portion 43 is provided in which the bent portion 45 projects in a direction opposite to the direction in which the electronic component 30 is pushed, and the third bent portion 45 is an electronic component between the second fixed portion 42 and the third bent portion 45. A second bent portion 44 is provided that protrudes in the direction opposite to the direction in which 30 is pushed.

A space is formed between the first fixed portion 41 and the third bent portion 45, and between the second fixed portion 42 and the third bent portion 45 to allow an increase in the height of the electronic component 30. The height of this space is set in anticipation of variations in the height of the electronic component 30 or design changes. As a result, even if the height of the electronic component 30 is increased, the corner of the electronic component 30 does not hit the spring member 40, and the spring member 40 can push the electronic component 30 toward the substrate 10 with sufficient force. The second electrode 31 of the electronic component 30 can be connected to the first electrode 11 of the substrate 10 with a stable force, and the reliability of the electronic device 1 can be improved.

The first bent portion 43, the second bent portion 44, and the third bent portion 45 of the spring member 40 are not limited to being curved, and may be bent as shown in FIG. 2A. In the drawings after FIG. 2A, the first electrode 11 of the substrate 10 and the second electrode 31 of the electronic component 30 are not shown.

Further, as shown in FIG. 2B, the third bent portion 45 has a portion extending (or spreading) along the upper surface of the electronic component 30, and the portion may be brought into contact with the electronic component 30. The third bent portion 45 pushes the electronic component 30 toward the substrate 10 while contacting the electronic component 30 over a wide area. It is possible to reduce the variation in contact resistance between the first electrode 11 and the second electrode 31 in a plane parallel to the surface of the substrate 10.

Further, as shown in FIG. 3, the spring member 40 has a plurality of third bending portions 45, and the electronic component 30 is pushed by an elastic restoring force in the direction from the plurality of third bending portions 45 toward the substrate 10. You may.

In the example shown in FIG. 3, two third bending portions 45 are provided, and a fourth bending portion 46 projecting in the direction opposite to the protruding direction of the third bending portion 45 is provided between the two third bending portions 45. It is provided. The number of the third bent portions 45 may be three or more. By pushing the electronic component 30 toward the substrate 10 with the plurality of bent portions 45, it is possible to reduce the variation in the contact resistance between the first electrode 11 and the second electrode 31 in a plane parallel to the surface of the substrate 10.

The number of electronic components 30 fixed to one substrate 10 is not limited to two, and one or three or more electronic components 30 may be fixed to one substrate 10.

In the examples shown in FIGS. 4A and 4B, a plurality of electronic components 30 are arranged along the first direction X. The spring fixing member 20 is formed with as many openings 21 as the number of electronic components 30, and one electronic component 30 is arranged in one opening 21. Further, one electronic component 30 is pushed toward the substrate 10 by one spring member 40.

In the example shown in FIG. 4B, the first fixing portion 41, the second fixing portion 42, the first bending portion 43, the second bending portion 44, and the third bending portion 45 of the spring member 40 are in the first direction X. It is continuously provided along. The second fixing portion 42 of one of the two spring members 40 adjacent to each other in the first direction X and the first fixing portion 41 of the other spring member 40 are adjacent to each other in the first direction X. ..

In the example shown in FIG. 4A, the first fixing portion 41, the second fixing portion 42, the first bending portion 43, the second bending portion 44, and the third bending portion 45 of the spring member 40 are in the first direction X. It is continuously provided along the direction inclined with respect to.

By arranging the spring member 40 as shown in FIG. 4A, the second fixing portion 42 of one of the two adjacent spring members 40 in the first direction X and the other spring member 40 are arranged. The first fixed portion 41 of the above can be overlapped with each other in the second direction Y orthogonal to the first direction X. As a result, in the configuration of FIG. 4A, the pitch of the first direction X is narrowed as compared with the configuration of FIG. 4B, and a plurality of electronic components 30 can be arranged in the first direction X.

In the example shown in FIG. 5A, a spring member 40 having a portion intersecting on the electronic component 30 is provided for one electronic component 30.

The third bent portion 45 in contact with the electronic component 30 can be provided, for example, at the intersection of the spring members 40. Alternatively, a plurality of third bent portions 45 may be provided at different positions, and the electronic component 30 may be pushed toward the substrate 10 by the plurality of third bent portions 45.

In the example shown in FIG. 5B, the spring member 40 has, for example, two portions 47, 48 extending in parallel on the electronic component 30, and the first fixing portion 41 and the first fixing portion 41 and the second portion are common to the two portions 47, 48. 2 Fixing portion 42 is provided. The spring member 40 shown in FIG. 5B is formed in a frame shape. Each of the portions 47 and 48 has, for example, two third bent portions 45, and for example, the four corners of the electronic component 30 are pushed toward the substrate 10 by the four third bent portions 45.

In the example shown in FIG. 5C, the width of the portion of the spring member 40 including the third bent portion 45 between the first fixed portion 41 and the second fixed portion 42 is the width of the first fixed portion 41 and the width of the first fixed portion 41. 2 It is wider than the width of the fixed portion 42. The wide third bent portion 45 pushes the electronic component 30 toward the substrate 10 while contacting the electronic component 30 over a wide area. It is possible to reduce the variation in contact resistance between the first electrode 11 and the second electrode 31 in a plane parallel to the surface of the substrate 10.

FIG. 6 is a schematic cross-sectional view showing still another configuration example of the spring member.

The spring member 50 shown in FIG. 6 has a first fixing portion 51 and a second fixing portion 52. The first fixing portion 51 and the second fixing portion 52 are both ends of the spring member 50. The first fixing portion 51 and the second fixing portion 52 are fixed to the spring fixing member 20. For example, the first fixing portion 51 and the second fixing portion 52 are screwed to the upper surface of the spring fixing member 20. Alternatively, the first fixing portion 51 and the second fixing portion 52 may be hooked and fixed to the protrusion provided on the upper surface of the spring fixing member 20.

In the spring member 50, a first bent portion 53, a second bent portion 54, and a convex portion 55 are continuously provided between the first fixed portion 51 and the second fixed portion 52.

The convex portion 55 is provided between the first bent portion 53 and the second bent portion 54, projects from the first bent portion 53 and the second bent portion 54 toward the electronic component 30, and comes into contact with the upper surface of the electronic component 30. ing.

The first bent portion 53 is bent so as to be separated from the electronic component 30 between the first fixed portion 51 and the convex portion 55. A space is formed between the first bent portion 53 and the electronic component 30.

The second bent portion 54 is bent so as to be separated from the electronic component 30 between the second fixed portion 52 and the convex portion 55. A space is formed between the second bent portion 54 and the electronic component 30.

In the natural state of the spring member 50, the convex portion 55 is located at a height between the upper surface of the electronic component 30 arranged in the opening 21 and the surface of the substrate 10. Therefore, the convex portion 55 in contact with the upper surface of the electronic component 30 gives the electronic component 30 an elastic restoring force of the spring member 50 in the direction toward the substrate 10. The electronic component 30 is sandwiched between the convex portion 55 and the substrate 10 and fixed to the substrate 10.

A space is formed between the first fixed portion 51 and the convex portion 55 and between the second fixed portion 52 and the convex portion 55 to allow an increase in the height of the electronic component 30. The height of this space is set in anticipation of variations in the height of the electronic component 30 or design changes. As a result, even if the height of the electronic component 30 is increased, the corner of the electronic component 30 does not hit the spring member 50, and the spring member 50 can push the electronic component 30 toward the substrate 10 with sufficient force. The second electrode 31 of the electronic component 30 can be connected to the first electrode 11 of the substrate 10 with a stable force, and the reliability of the electronic device can be improved.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

1 ... Electronic device, 10 ... Substrate, 11 ... First electrode, 20 ... Spring fixing member, 21 ... Opening, 30 ... Electronic component, 31 ... Second electrode, 40 ... Spring member, 41 ... First fixing part, 42 ... second fixed portion, 43 ... first bent portion, 44 ... second bent portion, 45 ... third bent portion, 46 ... fourth bent portion, 50 ... spring member, 51 ... first fixed portion, 52 ... second Fixed part, 53 ... 1st bent part, 54 ... 2nd bent part, 55 ... Convex part

Claims (7)

A substrate having a first electrode and
A spring fixing member fixed on the substrate and having an opening,
An electronic component arranged in the opening and having a second electrode connected to the first electrode, and
With spring members
With
The spring member
The first fixing portion fixed to the spring fixing member and
The second fixing portion fixed to the spring fixing member and
At least three bent portions including a first bent portion, a second bent portion, and a third bent portion provided continuously between the first fixed portion and the second fixed portion.
Have,
The third bent portion is provided between the first bent portion and the second bent portion, and projects from the first bent portion and the second bent portion toward the electronic component and comes into contact with the electronic component. , Applying an elastic restoring force of the spring member to the electronic component in the direction toward the substrate,
The first bent portion projects between the first fixed portion and the third bent portion in a direction opposite to the protruding direction of the third bent portion, and is separated from the electronic component.
The second bent portion is an electronic device that protrudes between the second fixed portion and the third bent portion in a direction opposite to the protruding direction of the third bent portion and is separated from the electronic component. A plurality of the electronic components are arranged along the first direction,
The first fixed portion, the second fixed portion, the first bent portion, the second bent portion, and the third bent portion of the spring member are continuous along a direction inclined with respect to the first direction. The electronic device according to claim 1. The electronic device according to claim 1 or 2, wherein the spring member having a portion intersecting the electronic component is provided for one electronic component. The electronic device according to any one of claims 1 to 3, wherein the electronic component receives the elastic restoring force from a plurality of the third bent portions in a direction toward the substrate. A substrate having a first electrode and
A spring fixing member fixed on the substrate and having an opening,
An electronic component arranged in the opening and having a second electrode connected to the first electrode, and
With spring members
With
The spring member
The first fixing portion fixed to the spring fixing member and
The second fixing portion fixed to the spring fixing member and
A convex portion provided between the first fixing portion and the second fixing portion and in contact with the electronic component,
A first bent portion provided between the first fixed portion and the convex portion and separated from the electronic component, and a first bent portion.
A second bent portion provided between the second fixed portion and the convex portion and separated from the electronic component, and a second bent portion.
Have,
The convex portion protrudes from the first bent portion and the second bent portion toward the electronic component, and gives an elastic restoring force of the spring member to the electronic component in a direction toward the substrate. .. A plurality of the electronic components are arranged along the first direction,
The first fixed portion, the second fixed portion, the first bent portion, the second bent portion, and the convex portion of the spring member are continuous along a direction inclined with respect to the first direction. The electronic device according to claim 5, which is provided. A second fixed portion of one of the two adjacent spring members in the first direction and the first fixed portion of the other spring member are orthogonal to the first direction. The electronic device according to claim 2 or 6, which overlaps in a direction.

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